







技术领域technical field
本申请属于金属激光表面处理领域,具体地说,尤其涉及一种多点式输出激光光源。The application belongs to the field of metal laser surface treatment, and in particular relates to a multi-point output laser light source.
背景技术Background technique
现有的激光光源多采用简单的光学结构,无需实现光斑的调节,即其通过半导体激光器直接输出单个光斑进行激光照射,以实现对金属器件的加热或者使其表面匀化。Existing laser light sources mostly adopt simple optical structures, without adjusting the spot, that is, they directly output a single spot through the semiconductor laser for laser irradiation, so as to heat the metal device or homogenize its surface.
由于采用单个光斑输出激光,一次只能对单个金属器件进行表面加热处理,无法实现一次多个的金属器件的同时加热。如果需要对多个金属器件进行加热处理,则需要采用多次加热或多个半导体激光器进行加热。采用一个半导体激光器进行多次表面加热处理,会耗费大量的时间;而采用多个半导体激光器进行同时加热的表面处理,则无疑会增加加工成本,且同时需要较多的人工进行操作或购置额外的控制设备进行控制处理,也会增加人工成本或采购成本。Since a single spot is used to output laser light, only a single metal device can be heated on the surface at a time, and simultaneous heating of multiple metal devices cannot be realized. If multiple metal devices need to be heated, multiple heating or multiple semiconductor lasers must be used for heating. Using one semiconductor laser for multiple surface heating treatments will take a lot of time; while using multiple semiconductor lasers for simultaneous heating surface treatment will undoubtedly increase the processing cost, and at the same time require more manual operations or purchase additional Controlling equipment for control processing will also increase labor costs or procurement costs.
同时,采用单光斑表面加热处理,无法精确控制每个金属器件的受热时间,无法保证金属器件处理效果的一致。At the same time, the single-spot surface heating treatment cannot accurately control the heating time of each metal device, and cannot guarantee the consistency of the metal device treatment effect.
发明内容Contents of the invention
本申请的目的在于提供一种多点式输出激光光源,其能够实现采用同一半导体激光器同时实现对多个金属器件的表面加热处理,确保金属器件处理效果的一致性,降低加工成本。The purpose of this application is to provide a multi-point output laser light source, which can realize the surface heating treatment of multiple metal devices at the same time by using the same semiconductor laser, ensure the consistency of the treatment effect of the metal devices, and reduce the processing cost.
为达到上述目的,本申请是通过以下技术方案实现的:In order to achieve the above object, the application is achieved through the following technical solutions:
本申请中所述的一种多点式输出激光光源,包括多单管半导体激光器,多单管半导体激光器所发射的激光依次经过蜂窝式透镜阵列I、蜂窝式透镜阵列II、聚焦透镜到达工作平台,其中所述蜂窝式透镜阵列I、蜂窝式透镜阵列II均为N×M阵列透镜,M和N均为正整数。A multi-point output laser light source described in this application includes multiple single-tube semiconductor lasers, and the laser light emitted by the multiple single-tube semiconductor lasers sequentially passes through the honeycomb lens array I, the honeycomb lens array II, and the focusing lens to reach the working platform , wherein the honeycomb lens array I and the honeycomb lens array II are both N×M array lenses, and M and N are both positive integers.
作为本申请优选的技术方案之一,所述蜂窝式透镜阵列II与聚焦透镜之间还设置有至少一个的辅助光学器件。As one of the preferred technical solutions of the present application, at least one auxiliary optical device is provided between the honeycomb lens array II and the focusing lens.
作为本申请优选的技术方案之一,所述辅助光学器件为两个调光镜,调光镜为平凹柱透镜。As one of the preferred technical solutions of the present application, the auxiliary optical device is two light-adjustable mirrors, and the light-adjustable mirrors are plano-concave cylindrical lenses.
作为本申请优选的技术方案之一,所述蜂窝式透镜阵列I为5×5透镜阵列,其中单元透镜边长0.9mm,厚度1mm,曲率6.2。As one of the preferred technical solutions of the present application, the cellular lens array I is a 5×5 lens array, in which the unit lens has a side length of 0.9 mm, a thickness of 1 mm, and a curvature of 6.2.
作为本申请优选的技术方案之一,所述蜂窝式透镜阵列II为为5×5透镜阵列,其中单元透镜边长0.9mm,厚度1mm,曲率6.2,所述蜂窝式透镜阵列II的单元透镜边长相等。As one of the preferred technical solutions of the present application, the honeycomb lens array II is a 5×5 lens array, in which the side length of the unit lens is 0.9mm, the thickness is 1mm, and the curvature is 6.2. The unit lens side of the honeycomb lens array II equal in length.
与现有技术相比,本申请的有益效果是:Compared with prior art, the beneficial effect of the present application is:
1、本申请可实现N×M阵列激光光斑的输出,并且光斑水平间距a和垂直间距b可进行设定,具有较高的灵活性,可适应不同尺寸形状的金属器件表面加工。1. This application can realize the output of N×M array laser spots, and the horizontal spacing a and vertical spacing b of the spots can be set, which has high flexibility and can adapt to the surface processing of metal devices of different sizes and shapes.
2、本申请中所述的N×M阵列激光光斑为同步输出,无需对每个激光光斑进行工作时间控制,对金属器件每个部位的工作时间均为相同,可保证每个位置点同时开始加热,并同步终止加热,保证受热面积和受热时间相同,提高金属器件表面加工的一致性。同时本申请在实现多点加热的同时,降低了多个金属器件的表面处理时间,提高处理效率,同时也能够降低所需的激光发射器的数量和人工数量、设备采购成本。2. The N×M array laser spots described in this application are output synchronously, and there is no need to control the working time of each laser spot. The working time of each part of the metal device is the same, which can ensure that each position point starts at the same time Heating, and synchronous termination of heating, to ensure the same heating area and heating time, improve the consistency of surface processing of metal devices. At the same time, the application realizes multi-point heating, reduces the surface treatment time of multiple metal devices, improves the treatment efficiency, and can also reduce the number of required laser emitters, the number of labor, and the cost of equipment procurement.
3、本申请采用的蜂窝式透镜阵列具有一定的分光特性,导致初设激光强弱部分可以相互补充,能够保证出射激光光斑具有一定的均匀性。3. The honeycomb lens array used in this application has a certain spectroscopic characteristic, so that the strength and weakness of the initially set laser can complement each other, which can ensure a certain uniformity of the outgoing laser spot.
附图说明Description of drawings
图1是实施例1水平方向上的结构示意图。FIG. 1 is a schematic structural view of Embodiment 1 in the horizontal direction.
图2是实施例1垂直方向上的结构示意图。FIG. 2 is a schematic structural view of Embodiment 1 in the vertical direction.
图3是蜂窝式透镜阵列I、蜂窝式透镜阵列II的结构示意图。FIG. 3 is a structural schematic diagram of the honeycomb lens array I and the honeycomb lens array II.
图4是激光经过蜂窝式透镜阵列I、蜂窝式透镜阵列II及聚焦透镜4时的激光路径。FIG. 4 is a laser path when the laser passes through the honeycomb lens array I, the honeycomb lens array II and the focusing
图5是图4中A位置处的光斑分布图。FIG. 5 is a light spot distribution diagram at position A in FIG. 4 .
图6是图4中B位置处的光斑分布图。FIG. 6 is a light spot distribution diagram at position B in FIG. 4 .
图7是图4中A位置处的光斑分布距离说明图。FIG. 7 is an explanatory diagram of the spot distribution distance at position A in FIG. 4 .
图8是本申请实施例2的结构示意图。Fig. 8 is a schematic structural diagram of Embodiment 2 of the present application.
图中:1、多单管半导体激光器;2、蜂窝式透镜阵列I;3、蜂窝式透镜阵列II;4、聚焦透镜;5、工作平台;6、调光镜。In the figure: 1. Multiple single-tube semiconductor lasers; 2. Honeycomb lens array I; 3. Honeycomb lens array II; 4. Focusing lens; 5. Working platform; 6. Dimming mirror.
具体实施方式Detailed ways
下面结合附图及实施例对本申请所述的技术方案作进一步地描述说明。需要说明的是,在下述段落可能涉及的方位名词,包括但不限于“上、下、左、右、前、后”等,其所依据的方位均为对应的说明书附图中所展示的视觉方位,其不应当也不该被视为是对本技术方案保护范围的限定,其目的仅为方便本领域的技术人员更好地理解说明书中所述的技术方案。The technical solutions described in the present application will be further described below in conjunction with the drawings and embodiments. It should be noted that the orientation nouns that may be involved in the following paragraphs, including but not limited to "up, down, left, right, front, back", etc., are based on the visual orientation shown in the corresponding drawings. The orientation should not and should not be considered as limiting the protection scope of the technical solution, and its purpose is only to facilitate those skilled in the art to better understand the technical solution described in the specification.
在下述段落的描述中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”等类似表述应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以依据具体情况结合本领域的公知常识、设计规范、标准文献等理解上述术语在本发明中的具体含义。In the descriptions of the following paragraphs, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" and other similar expressions should be interpreted in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention based on specific situations and in combination with common knowledge, design specifications, standard documents, etc. in the art.
实施例1Example 1
参见图1至图7,一种多点式输出激光光源,包括多单管半导体激光器1,多单管半导体激光器1所发射的激光依次经过蜂窝式透镜阵列I2、蜂窝式透镜阵列II3、聚焦透镜4后到达工作平台5,其中所述的蜂窝式透镜阵列I2、蜂窝式透镜阵列II3均采用N×M透镜阵列,N、M均为正整数。当蜂窝式透镜阵列I2、蜂窝式透镜阵列II3均选择为5×5阵列时,蜂窝式透镜阵列I2可选择的透镜边长L为0.9mm,透镜厚度H为1mm,透镜曲率R为6.2。所述蜂窝式透镜阵列II3的参数与蜂窝式透镜阵列I2一致,且所述蜂窝式透镜阵列II3的单元透镜边长相等。Referring to Figures 1 to 7, a multi-point output laser light source includes multiple single-tube semiconductor lasers 1, and the laser light emitted by multiple single-tube semiconductor lasers 1 sequentially passes through the honeycomb lens array I2, the honeycomb lens array II3, and the focusing
当多单管半导体激光器1所发射的激光束经过蜂窝式透镜阵列I2时,在水平方向上被分为5束激光路径,在垂直方向上被分为3束激光路径,上述被分出来的激光路径在经过聚焦透镜4后会被聚焦透镜4改变出射激光光斑之间的间距,最终出射激光光斑作用于工作平台5上的金属器件。When the laser beam emitted by the multi-single-tube semiconductor laser 1 passes through the honeycomb lens array I2, it is divided into 5 laser beam paths in the horizontal direction and 3 laser beam paths in the vertical direction. After the path passes through the focusing
参见图4、图7,其所展示的光斑分布,其水平方向间距为a,垂直方向间距为b。影响水平方向间距a、垂直方向间距的因素主要有三个,分别为蜂窝式透镜阵列单元透镜的边长、聚焦透镜4、工作平台5。具体来讲,蜂窝式透镜阵列单元透镜的边长增大时,出射光斑间距增大;采用不同曲率的聚焦透镜4也可以达到改变出射光斑间距的目的;通过调节工作平台5的距离远近可以达到改变出射光斑的间距。Referring to FIG. 4 and FIG. 7 , the spot distribution shown therein has a horizontal spacing of a and a vertical spacing of b. There are three main factors affecting the distance a in the horizontal direction and the distance in the vertical direction, namely the side length of the unit lens of the honeycomb lens array, the focusing
实施例2Example 2
作为本申请的另一实施例,一种多点式输出激光光源,可以在蜂窝式透镜阵列II3和聚焦透镜4之间的光路上增加辅助光学器件,辅助光学器件可选择为两个调光镜6,调光镜6为平凹柱透镜,可以分别对水平方向光斑的间距a和垂直方向上光斑的间距b进行调节。As another embodiment of the present application, a multi-point output laser light source can add auxiliary optical devices on the optical path between the honeycomb lens array II3 and the focusing
参见实施例1和实施例2,当工作平台5位于激光路径的水平方向焦点位置处时,即在图4所展示的B位置时,出射激光光斑为1×M阵列,当处于非焦点位置处时,例如在图4中所展示的A位置时,根据输入激光光斑的尺寸、蜂窝式透镜阵列的尺寸,可实现出射激光光斑最大N×M阵列,其中N、M均为正整数。Referring to Embodiment 1 and Embodiment 2, when the working platform 5 is located at the focus position in the horizontal direction of the laser path, that is, at position B shown in FIG. 4 , the outgoing laser spot is a 1×M array. When, for example, in the position A shown in Figure 4, according to the size of the input laser spot and the size of the honeycomb lens array, the largest N×M array of outgoing laser spots can be realized, where N and M are both positive integers.
当选择实施例1中所展示的5×5阵列的蜂窝式透镜阵列时,可同时对10mm×5mm×10mm金属部件进行表面加热处理,且同时加工的数量为7个,最终得到的加工金属部件表面处理具有较好的一致性。When the honeycomb lens array of the 5 × 5 array shown in Example 1 is selected, the surface heat treatment can be carried out to the 10mm × 5mm × 10mm metal parts at the same time, and the number of simultaneous processing is 7, and the final processed metal parts The surface treatment has a good consistency.
所属技术领域的技术人员可根据实际需要选择合适的蜂窝式透镜阵列参数,例如单元透镜边长L、厚度H和曲率R,本申请的原理不仅适用于mm级别的光斑输出,而且通过增大蜂窝式透镜阵列参数,可实现m级别甚至更大尺寸的光斑输出。Those skilled in the art can select appropriate honeycomb lens array parameters according to actual needs, such as unit lens side length L, thickness H and curvature R. The principle of this application is not only applicable to mm-level spot output, but also by increasing the The lens array parameters can achieve m-level or even larger-sized spot output.
最后,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。Finally, although this description is described according to implementation modes, not each implementation mode only includes an independent technical solution. This description in the description is only for the sake of clarity. The technical solutions in the examples can also be properly combined to form other implementations that can be understood by those skilled in the art.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310389244.2ACN116352272A (en) | 2023-04-13 | 2023-04-13 | Multi-point output laser light source |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310389244.2ACN116352272A (en) | 2023-04-13 | 2023-04-13 | Multi-point output laser light source |
| Publication Number | Publication Date |
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| CN116352272Atrue CN116352272A (en) | 2023-06-30 |
| Application Number | Title | Priority Date | Filing Date |
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| CN202310389244.2APendingCN116352272A (en) | 2023-04-13 | 2023-04-13 | Multi-point output laser light source |
| Country | Link |
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| CN (1) | CN116352272A (en) |
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| CN203012192U (en)* | 2012-12-24 | 2013-06-19 | 温州泛波激光有限公司 | Optical system and laser cladding equipment |
| CN203149208U (en)* | 2012-12-30 | 2013-08-21 | 北京工业大学 | Shaping and beam equalizing device of excimer laser |
| CN209387387U (en)* | 2018-11-13 | 2019-09-13 | 中国科学院上海硅酸盐研究所 | Array sample heating laser light source unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203012192U (en)* | 2012-12-24 | 2013-06-19 | 温州泛波激光有限公司 | Optical system and laser cladding equipment |
| CN203149208U (en)* | 2012-12-30 | 2013-08-21 | 北京工业大学 | Shaping and beam equalizing device of excimer laser |
| CN209387387U (en)* | 2018-11-13 | 2019-09-13 | 中国科学院上海硅酸盐研究所 | Array sample heating laser light source unit |
| JPWO2021117286A1 (en)* | 2019-12-09 | 2021-06-17 | ||
| CN114509880A (en)* | 2022-04-20 | 2022-05-17 | 杭州灵西机器人智能科技有限公司 | 3D structured light generating device based on light source array |
| CN115673545A (en)* | 2022-11-15 | 2023-02-03 | 深圳市星汉激光科技股份有限公司 | Semiconductor laser welding device |
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