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CN116115906A - Communication method of electric stimulator and electric stimulator - Google Patents

Communication method of electric stimulator and electric stimulator
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CN116115906A
CN116115906ACN202310115736.2ACN202310115736ACN116115906ACN 116115906 ACN116115906 ACN 116115906ACN 202310115736 ACN202310115736 ACN 202310115736ACN 116115906 ACN116115906 ACN 116115906A
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李青夏
田洪君
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Intellimicro Medical Co ltd
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Abstract

The invention discloses a communication method of an electric stimulator and the electric stimulator, wherein the electric stimulator comprises an implantable power supply unit, a first chip and a second chip, the first chip and the second chip are electrically connected with the implantable power supply unit through a plurality of wires, the first chip is connected with a first sub-electrode, and the second chip is connected with a second sub-electrode; the communication method comprises the following steps: the implantable power supply unit sends a command to the first chip or the second chip, wherein the command comprises an address identification code so as to determine a chip responding to the command; only one of the first chip and the second chip responds to the command within the same period of time. According to the communication method of the electric stimulator, the same implanted power supply unit can realize signal transmission with the first sub-electrode or the second sub-electrode, the communication mode is simple and efficient, the communication method is particularly suitable for high-density electrodes, and the stimulation precision is high.

Description

Translated fromChinese
电刺激器的通信方法和电刺激器Communication method of electrical stimulator and electrical stimulator

技术领域technical field

本发明涉及植入式医疗器械技术领域,尤其是涉及一种电刺激器的通信方法和电刺激器。The invention relates to the technical field of implantable medical devices, in particular to a communication method of an electric stimulator and the electric stimulator.

背景技术Background technique

脑深部电刺激器(DBS,Deep Brain Stimulation)可以有效治疗运动障碍类疾病,也可以用于精神疾病的治疗,例如可用于帕金森病、癫痫、抑郁、成瘾性疾病等的治疗。Deep Brain Stimulation (DBS, Deep Brain Stimulation) can effectively treat movement disorders, and can also be used for the treatment of mental diseases, such as Parkinson's disease, epilepsy, depression, and addictive diseases.

脑深部电刺激器的电极是脑深部电刺激器中的重要组成部分,电极一般通过导线与植入式供电单元电连接,然而,对于高密度DBS电极而言,其电极刺激端(电极部)上的刺激位点的数量一般多于导线的数量,如何实现植入式供电单元与电极刺激端之间的通信,是本领域技术人员需要解决的难题。The electrodes of the deep brain electrical stimulator are an important part of the deep brain electrical stimulator. The electrodes are generally electrically connected to the implanted power supply unit through wires. However, for high-density DBS electrodes, the electrode stimulation end (electrode part) The number of stimulation sites on the electrode is generally more than the number of wires. How to realize the communication between the implantable power supply unit and the electrode stimulation terminal is a difficult problem to be solved by those skilled in the art.

发明内容Contents of the invention

本发明旨在至少解决现有技术中存在的技术问题之一。为此,本发明的一个目的在于提出一种电刺激器的通信方法,植入式供电单元与第一子电极或第二子电极之间的信号传输简单高效。The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present invention is to provide a communication method for an electrical stimulator, and the signal transmission between the implanted power supply unit and the first sub-electrode or the second sub-electrode is simple and efficient.

本发明的另一个目的在于提出一种采用上述通信方法的电刺激器。Another object of the present invention is to provide an electrical stimulator using the above communication method.

根据本发明第一方面实施例的电刺激器的通信方法,所述电刺激器包括植入式供电单元、第一芯片和第二芯片,所述第一芯片和第二芯片通过多个导线与所述植入式供电单元电连接,所述第一芯片连接第一子电极,所述第二芯片连接第二子电极;According to the communication method of the electric stimulator according to the embodiment of the first aspect of the present invention, the electric stimulator includes an implantable power supply unit, a first chip and a second chip, and the first chip and the second chip communicate with each other through a plurality of wires. The implantable power supply unit is electrically connected, the first chip is connected to the first sub-electrode, and the second chip is connected to the second sub-electrode;

所述通信方法包括以下步骤:The communication method includes the following steps:

所述植入式供电单元向所述第一芯片或所述第二芯片发送命令,所述命令中包括地址识识码,以确定对所述命令作出应答的芯片;The implantable power supply unit sends a command to the first chip or the second chip, and the command includes an address identification code to determine the chip that responds to the command;

同一时段内,仅所述第一芯片和所述第二芯片中的其中一个对所述命令作出应答。During the same time period, only one of the first chip and the second chip responds to the command.

根据本发明第一方面实施例的电刺激器的通信方法,可以快速区分对命令作出应答的第一芯片和第二芯片,从而方便了植入式供电单元与第一子电极和第二子电极的通讯。此外,可以使同一植入式供电单元的命令准确地传输至对应的第一子电极或第二子电极处,本发明通信方式简单高效,尤其适用于高密度电极,刺激精度较高。According to the communication method of the electrical stimulator of the embodiment of the first aspect of the present invention, the first chip and the second chip that respond to the command can be quickly distinguished, thereby facilitating the communication between the implanted power supply unit and the first sub-electrode and the second sub-electrode communication. In addition, commands from the same implanted power supply unit can be accurately transmitted to the corresponding first sub-electrode or second sub-electrode. The communication method of the present invention is simple and efficient, especially suitable for high-density electrodes, and has high stimulation accuracy.

根据本发明的一些实施例,所述植入式供电单元与第一芯片及第二芯片之间的通信方式为串行通信。According to some embodiments of the present invention, the communication mode between the implantable power supply unit and the first chip and the second chip is serial communication.

根据本发明的一些实施例,所述植入式供电单元与第一芯片及第二芯片之间的通讯协议为I2C、SMBus、RS232或RS485。According to some embodiments of the present invention, the communication protocol between the implantable power supply unit and the first chip and the second chip is I2 C, SMBus, RS232 or RS485.

根据本发明的一些实施例,所述通信方法包括:According to some embodiments of the present invention, the communication method includes:

所述植入式供电单元向所述第一芯片和所述第二芯片发送命令,形成信号下行;The implantable power supply unit sends commands to the first chip and the second chip to form a downlink signal;

同一时段内,仅所述第一芯片或所述第二芯片中的其中一个对所述命令作出应答,形成信号上行;In the same period of time, only one of the first chip or the second chip responds to the command, forming an upstream signal;

所述信号上行的通路和所述信号下行的通路上分别增加电平转换器。A level shifter is respectively added to the upstream path of the signal and the downstream path of the signal.

根据本发明的一些实施例,所述导线包括至少四根引线,至少四根所述引线包括两根电源线和两根数据线。According to some embodiments of the present invention, the wires include at least four lead wires, and the at least four lead wires include two power lines and two data lines.

根据本发明的一些实施例,所述数据线上的电压是对称的交流电。According to some embodiments of the present invention, the voltage on the data line is a symmetrical alternating current.

根据本发明第二方面实施例的电刺激器,所述电刺激器工作时执行根据上述第一方面实施例所述的电刺激器的通信方法。According to the electrical stimulator of the embodiment of the second aspect of the present invention, the electrical stimulator implements the communication method of the electrical stimulator according to the embodiment of the first aspect when working.

根据本发明的一些实施例,所述导线通过连接器连接第一芯片和第二芯片,所述连接器上开设有适于导线嵌入的理线槽以及沿厚度方向延伸的导电销,所述导电销同时连接位于其上方的第一芯片和位于其下方的第二芯片。According to some embodiments of the present invention, the wire is connected to the first chip and the second chip through a connector, and the connector is provided with a wire management groove suitable for embedding the wire and a conductive pin extending along the thickness direction, and the conductive pin The pins simultaneously connect the first chip above it and the second chip below it.

根据本发明的一些实施例,所述第一子电极和所述第二子电极卷曲并贴附于电极支撑柱上以形成电极部。According to some embodiments of the present invention, the first sub-electrode and the second sub-electrode are crimped and attached to an electrode support column to form an electrode part.

根据本发明的一些实施例,所述电刺激器具体为脑深部电刺激器。According to some embodiments of the present invention, the electrical stimulator is specifically a deep brain electrical stimulator.

本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

附图说明Description of drawings

本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and understandable from the description of the embodiments in conjunction with the following drawings, wherein:

图1是根据本发明实施例的电极结构的示意图;1 is a schematic diagram of an electrode structure according to an embodiment of the present invention;

图2是根据本发明实施例的电极结构的分解图;2 is an exploded view of an electrode structure according to an embodiment of the present invention;

图3是图2中圈示的D区域的放大图;Figure 3 is an enlarged view of the area D circled in Figure 2;

图4是图2中圈示的E区域的放大图;Figure 4 is an enlarged view of the area E circled in Figure 2;

图5是图2中圈示的F区域的放大图;Figure 5 is an enlarged view of the F area circled in Figure 2;

图6是根据本发明实施例的连接器的示意图;6 is a schematic diagram of a connector according to an embodiment of the present invention;

图7是根据本发明实施例的另一个角度的连接器的示意图;7 is a schematic diagram of a connector at another angle according to an embodiment of the present invention;

图8是根据本发明实施例的电极结构的俯视图;8 is a top view of an electrode structure according to an embodiment of the present invention;

图9是图8中圈示的G区域的示意图;Fig. 9 is a schematic diagram of the G area circled in Fig. 8;

图10是根据本发明实施例的另一个角度的电极结构的示意图;10 is a schematic diagram of an electrode structure from another angle according to an embodiment of the present invention;

图11是图10中圈示的H区域的示意图;Figure 11 is a schematic diagram of the H area circled in Figure 10;

图12是根据本发明实施例的电刺激器的通信方法的流程图;Fig. 12 is a flowchart of a communication method of an electrical stimulator according to an embodiment of the present invention;

图13是根据本发明实施例的电刺激器的通信方法的信号传输的流程图。Fig. 13 is a flow chart of signal transmission in the communication method of the electrical stimulator according to the embodiment of the present invention.

附图标记:Reference signs:

100、电极结构;100. Electrode structure;

200、连接器;200, connector;

201、第一段;2012、导针定位孔;201. The first paragraph; 2012. Guide pin positioning hole;

202、第二段;2021、台阶结构;2023、通孔;205、导针;202, second section; 2021, step structure; 2023, through hole; 205, guide pin;

1a、电极部;1、电极支撑柱;11、第一子支撑段;1a, the electrode part; 1, the electrode support column; 11, the first sub-support section;

12、第二子支撑段;121、定位孔;12. The second sub-support section; 121. Positioning holes;

13、凹槽;14、限位孔;13. Groove; 14. Limit hole;

21、第一子电极;22、第二子电极;21. The first sub-electrode; 22. The second sub-electrode;

23、连接线缆;24、折边;3、注胶件;23. Connecting cables; 24. Hemming; 3. Plastic injection parts;

4、套管;5、导线;4. Casing; 5. Conductor;

6、第一芯片;7、第二芯片;6. The first chip; 7. The second chip;

81、理线槽;82、导电销。81, cable management trough; 82, conductive pin.

具体实施方式Detailed ways

下面详细描述本发明的实施例,参考附图描述的实施例是示例性的,下面参考图1-图11描述根据本发明第一方面实施例的电刺激器的通信方法。The embodiments of the present invention are described in detail below, and the embodiments described with reference to the accompanying drawings are exemplary, and the communication method of the electrical stimulator according to the embodiment of the first aspect of the present invention is described below with reference to FIGS. 1-11 .

电刺激器(图未示出)包括植入式供电单元(图未示出)、第一芯片6和第二芯片7,第一芯片6和第二芯片7通过多个导线5与植入式供电单元电连接,第一芯片6连接第一子电极21,第二芯片7连接第二子电极22。例如,第一子电极21和第二子电极22为高密度柔性电极2,第一子电极21和第二子电极22上均设置有多个刺激位点(图未示出)。在本发明的描述中,“多个”的含义是两个或两个以上。第一芯片6和第二芯片7可以为ASIC(专用集成电路)芯片。第一子电极21和第二子电极22上优选设置数十、数百甚至更多刺激位点,从而能形成相对于现有技术更高密度的柔性电极。第一子电极21和第二子电极22优选通过MEMS工艺制造形成带状结构,且最终形成所需电极尺寸(如标准DBS电极尺寸)。此外,植入式供电单元可以设置电源,也可以采用外部件并通过无线射频方式供电,并能作为主控装置使用。The electrical stimulator (not shown) includes an implanted power supply unit (not shown), afirst chip 6 and asecond chip 7, and thefirst chip 6 and thesecond chip 7 communicate with the implanted device through a plurality ofwires 5. The power supply unit is electrically connected, thefirst chip 6 is connected to thefirst sub-electrode 21 , and thesecond chip 7 is connected to thesecond sub-electrode 22 . For example, thefirst sub-electrode 21 and the second sub-electrode 22 are high-density flexible electrodes 2 , and a plurality of stimulation sites (not shown) are provided on thefirst sub-electrode 21 and thesecond sub-electrode 22 . In the description of the present invention, "plurality" means two or more. Thefirst chip 6 and thesecond chip 7 may be ASIC (Application Specific Integrated Circuit) chips. Tens, hundreds or even more stimulation sites are preferably set on thefirst sub-electrode 21 and thesecond sub-electrode 22, so as to form a flexible electrode with a higher density than the prior art. Thefirst sub-electrode 21 and the second sub-electrode 22 are preferably manufactured by MEMS technology to form a strip structure, and finally form a required electrode size (such as a standard DBS electrode size). In addition, the implantable power supply unit can be provided with a power supply, can also use external components and supply power through wireless radio frequency, and can be used as a main control device.

由此,第一子电极21和第二子电极22的多个刺激位点可以通过第一芯片6、第二芯片7和导线5与植入式供电单元通讯。以上刺激位点还能用作记录位点使用,此外还可以在各子电极上额外设置记录位点,均涵盖在本发明的技术方案内。Thus, multiple stimulation sites of thefirst sub-electrode 21 and the second sub-electrode 22 can communicate with the implanted power supply unit through thefirst chip 6 , thesecond chip 7 and thewire 5 . The above stimulation sites can also be used as recording sites, and additional recording sites can also be set on each sub-electrode, all of which are covered by the technical solution of the present invention.

此外,与传统的电极结构100相比,第一子电极21和第二子电极22的刺激位点较多,触点面积较小,不易刺激不必要的区域,从而可以减少使用电刺激器的副作用。另外,采用柔性电极2,可以实现定向刺激、分区刺激以及多靶点刺激,从而大幅提高了电刺激器的刺激精度,降低了对电极植入精度的依赖性,减少了电刺激产生的并发症,进而可以确保治疗效果,实现精准治疗。例如,配合记录电极使用,可精准采集脑神经活动信号,为临床医生提供客观参数,可实现个性化闭环控制治疗。In addition, compared with thetraditional electrode structure 100, thefirst sub-electrode 21 and the second sub-electrode 22 have more stimulation sites, the contact area is smaller, and it is not easy to stimulate unnecessary areas, thereby reducing the need for using an electric stimulator. side effect. In addition, the use of flexible electrodes 2 can realize directional stimulation, partition stimulation and multi-target stimulation, thereby greatly improving the stimulation accuracy of the electrical stimulator, reducing the dependence on the accuracy of electrode implantation, and reducing complications caused by electrical stimulation , so as to ensure the therapeutic effect and realize precise treatment. For example, when used with recording electrodes, it can accurately collect brain nerve activity signals, provide clinicians with objective parameters, and realize personalized closed-loop control treatment.

如图1、图2和图12所示,根据本发明第一方面实施例的电刺激器的通信方法,包括以下步骤:As shown in Figure 1, Figure 2 and Figure 12, the communication method of the electrical stimulator according to the embodiment of the first aspect of the present invention includes the following steps:

植入式供电单元向第一芯片6或第二芯片7发送命令,命令中包括地址识别码,以确定对命令作出应答的芯片;The implantable power supply unit sends a command to thefirst chip 6 or thesecond chip 7, and the command includes an address identification code to determine the chip that responds to the command;

同一时段内,仅第一芯片6和第二芯片7中的其中一个对命令作出应答。During the same period, only one of thefirst chip 6 and thesecond chip 7 responds to the command.

由此,通过地址识别码,可以区分对命令作出应答的第一芯片6和第二芯片7,从而方便植入式供电单元与第一子电极21和第二子电极22的通讯。此外,通过使第一芯片6和第二芯片7中的其中一个对命令作出应答,可以使植入式供电单元的命令准确地传输至对应的第一子电极21或第二子电极22处,提高了电刺激器的信号传输的准确度,进而提高了电刺激器的刺激精度。Therefore, through the address identification code, thefirst chip 6 and thesecond chip 7 that respond to the command can be distinguished, thereby facilitating the communication between the implantable power supply unit and thefirst sub-electrode 21 and thesecond sub-electrode 22 . In addition, by making one of thefirst chip 6 and thesecond chip 7 respond to the command, the command of the implantable power supply unit can be accurately transmitted to the corresponding first sub-electrode 21 or second sub-electrode 22, The accuracy of signal transmission of the electrical stimulator is improved, thereby improving the stimulation precision of the electrical stimulator.

根据本发明第一方面实施例的电刺激器的通信方法,可以使同一植入式供电单元的命令准确地传输至对应的第一子电极21或第二子电极22处,通信方式简单高效,尤其适用于高密度电极,刺激精度较高。According to the communication method of the electrical stimulator of the embodiment of the first aspect of the present invention, the command of the same implantable power supply unit can be accurately transmitted to the corresponding first sub-electrode 21 or second sub-electrode 22, and the communication method is simple and efficient. It is especially suitable for high-density electrodes with high stimulation accuracy.

根据本发明的一些实施例,植入式供电单元与第一芯片6及第二芯片7之间的通信方式为串行通信。由此,有利于植入式供电单元与第一芯片6及第二芯片7之间的信号传输,并且传输线少,可以使电刺激器的尺寸较小,组装工艺简单,成本低。According to some embodiments of the present invention, the communication mode between the implantable power supply unit and thefirst chip 6 and thesecond chip 7 is serial communication. Thus, it is beneficial to the signal transmission between the implanted power supply unit and thefirst chip 6 and thesecond chip 7, and there are fewer transmission lines, which can make the size of the electric stimulator smaller, the assembly process is simple, and the cost is low.

可选地,植入式供电单元与第一芯片6及第二芯片7之间的通讯协议为I2C、SMBus、RS232或RS485等。由此,通过采用上述的通讯协议,有利于植入式供电单元与第一芯片6和第二芯片7之间的信号顺利地传输,有利于电刺激器的正常使用。Optionally, the communication protocol between the implantable power supply unit and thefirst chip 6 and thesecond chip 7 is I2 C, SMBus, RS232 or RS485 and so on. Therefore, by adopting the above-mentioned communication protocol, it is beneficial to the smooth transmission of signals between the implantable power supply unit and thefirst chip 6 and thesecond chip 7, which is beneficial to the normal use of the electric stimulator.

根据本发明的一些实施例,结合图13,植入式供电单元向第一芯片6或第二芯片7发送命令,形成信号下行;According to some embodiments of the present invention, referring to FIG. 13 , the implantable power supply unit sends a command to thefirst chip 6 or thesecond chip 7 to form a signal downlink;

同一时段内,仅第一芯片6和第二芯片7中的其中一个对命令作出应答,形成信号上行;In the same period of time, only one of thefirst chip 6 and thesecond chip 7 responds to the command, forming an upstream signal;

信号上行的通路和信号下行的通路上分别增加电平转换器。Level converters are respectively added to the signal upstream path and the signal downstream path.

当电刺激器植入人体组织时,第一芯片6或第二芯片7接收到植入式供电单元的命令后,输出命令至第一子电极21或第二子电极22,从而植入式供电单元可以发送定向电刺激至相应功能区,达到精准治疗的效果。此外,在信号上行的通路和信号下行的通路分别增加电平转换器,实现对信号的电平转换,以便于系统开发,可以用于帕金森、肌张力障碍、震颤和冻结步态等运动障碍,另外也能作为药物成瘾、抑郁症的替代治疗方案。When the electric stimulator is implanted in human tissue, after receiving the command of the implanted power supply unit, thefirst chip 6 or thesecond chip 7 outputs the command to the first sub-electrode 21 or thesecond sub-electrode 22, so that the implanted power supply The unit can send directional electrical stimulation to the corresponding functional area to achieve the effect of precise treatment. In addition, level converters are added to the signal upstream path and the signal downstream path to realize the level conversion of the signal, so as to facilitate system development, and can be used for Parkinson's, dystonia, tremor and frozen gait and other movement disorders , In addition, it can also be used as an alternative treatment plan for drug addiction and depression.

可选地,导线5包括至少四根引线,四根引线包括两根电源线和两根数据线。如此设置,数据线可以用于命令信号的传输,电源线用于能量信号的传输,从而保证了导线5的正常使用,同时引线数量较少,可以减小导线5的尺寸。本发明实施例的电源线以对称的交流电形式存在。Optionally, thewire 5 includes at least four lead wires, and the four lead wires include two power lines and two data lines. In this way, the data line can be used for the transmission of command signals, and the power line can be used for the transmission of energy signals, thereby ensuring the normal use of thewire 5 , while the number of lead wires is small, which can reduce the size of thewire 5 . The power line of the embodiment of the present invention exists in the form of symmetrical alternating current.

根据本发明的一些实施例,数据线上的电压是对称的交流电。由此,信号传输较为稳定,有利于数据线的信号传输,同时可降低直流泄露风险,提高安全性。According to some embodiments of the present invention, the voltage on the data line is a symmetrical alternating current. Therefore, the signal transmission is relatively stable, which is beneficial to the signal transmission of the data line, and at the same time can reduce the risk of DC leakage and improve safety.

根据本发明第二方面实施例的电刺激器,电刺激器工作时执行根据上述第一方面实施例的电刺激器的通信方法。According to the electrical stimulator of the embodiment of the second aspect of the present invention, when the electrical stimulator is working, the communication method of the electrical stimulator according to the embodiment of the first aspect above is executed.

根据本发明实施例的电刺激器,采用上述的电刺激器的通讯方法,可以快速准确地将植入式供电单元的命令例如电刺激传输至第一电极或第二电极,也可以及时地收到第一芯片6或第二芯片7的信号反馈,从而实现电极结构100与植入式供电单元的有效连接,并且可以保证对单个电极进行刺激波形控制,从而提高刺激方向的精确控制,实现更优的刺激效果。According to the electric stimulator of the embodiment of the present invention, the above-mentioned communication method of the electric stimulator can be used to quickly and accurately transmit the command of the implanted power supply unit, such as electric stimulation, to the first electrode or the second electrode, and can also receive the order in time. The signal feedback to thefirst chip 6 or thesecond chip 7, so as to realize the effective connection between theelectrode structure 100 and the implanted power supply unit, and can ensure the stimulation waveform control of a single electrode, thereby improving the precise control of the stimulation direction and realizing more Excellent stimulating effect.

根据本发明的一些实施例,参照图2、图6和图7,导线5通过连接器200连接第一芯片6和第二芯片7,连接器200上开设有适于导线5嵌入的理线槽81以及沿厚度方向延伸的导电销82,导电销82同时连接位于其上方的第一芯片6和位于其下方的第二芯片7。According to some embodiments of the present invention, with reference to Fig. 2, Fig. 6 and Fig. 7, thewire 5 is connected to thefirst chip 6 and thesecond chip 7 through theconnector 200, and theconnector 200 is provided with a wire management slot suitable for the insertion of thewire 5. 81 and aconductive pin 82 extending along the thickness direction, theconductive pin 82 simultaneously connects thefirst chip 6 above it and thesecond chip 7 below it.

例如,在图6和图7的示例中,连接器200的上表面和下表面均形成有理线槽81。由此,理线槽81对导线5具有支撑作用和固定作用,从而有利于导线5与第一芯片6和第二芯片7的连接,连接稳定。此外,电刺激器的第一芯片6位于连接器200的上方,电刺激器的第二芯片7位于连接器200的下方,第一芯片6和第二芯片7可以通过导电销82电连接。For example, in the example of FIG. 6 and FIG. 7 , the upper surface and the lower surface of theconnector 200 are both formed with acable management groove 81 . Thus, thewire management groove 81 has a supporting and fixing function for thewire 5, thereby facilitating the connection of thewire 5 with thefirst chip 6 and thesecond chip 7, and the connection is stable. In addition, thefirst chip 6 of the electrical stimulator is located above theconnector 200 , and thesecond chip 7 of the electrical stimulator is located below theconnector 200 , and thefirst chip 6 and thesecond chip 7 can be electrically connected byconductive pins 82 .

根据本发明的一些实施例,第一子电极21和第二子电极22卷曲并贴附于电极支撑柱1上以形成电极部。第一子电极21和第二子电极22的结构大致相同,第一子电极21和第二子电极22均沿电极支撑柱1的周向卷曲并贴附于电极支撑柱1的外周侧,第一子电极21和第二子电极22的长边均沿电极支撑柱1的轴向设置。例如,在图2的示例中,第一子电极21、第二子电极22和电极支撑柱1均沿轴向(即左右方向,例如,图2中箭头A所指的方向)延伸,第一子电极21和第二子电极22沿电极支撑柱11的周向排布。如此设置,电极支撑柱1对第一子电极21和第二子电极22具有支撑作用。此外,第一子电极21和第二子电极22的结构简单,生产难度较小,方便了第一子电极21和第二子电极22的生产加工,并且有利于电极部的装配。According to some embodiments of the present invention, thefirst sub-electrode 21 and the second sub-electrode 22 are rolled and attached to the electrode support column 1 to form an electrode part. The structure of thefirst sub-electrode 21 and thesecond sub-electrode 22 is substantially the same, and thefirst sub-electrode 21 and the second sub-electrode 22 are both curled along the circumferential direction of the electrode support column 1 and attached to the outer peripheral side of the electrode support column 1. The long sides of thefirst sub-electrode 21 and the second sub-electrode 22 are arranged along the axial direction of the electrode support column 1 . For example, in the example of FIG. 2, thefirst sub-electrode 21, thesecond sub-electrode 22, and the electrode support column 1 all extend along the axial direction (ie, the left-right direction, for example, the direction indicated by arrow A in FIG. 2 ), the first The sub-electrodes 21 and the second sub-electrodes 22 are arranged along the circumferential direction of theelectrode support column 11 . In this way, the electrode support column 1 has a supporting effect on thefirst sub-electrode 21 and thesecond sub-electrode 22 . In addition, the structure of thefirst sub-electrode 21 and thesecond sub-electrode 22 is simple, and the production difficulty is relatively small, which facilitates the production and processing of thefirst sub-electrode 21 and thesecond sub-electrode 22 , and facilitates the assembly of the electrode part.

根据本发明的一些实施例,电刺激器可以为脑深部电刺激器(图未示出),还可以为脊髓刺激器或其它可能电刺激器。According to some embodiments of the present invention, the electrical stimulator may be a deep brain electrical stimulator (not shown in the figure), and may also be a spinal cord stimulator or other possible electrical stimulators.

参照图2,第一子电极21和第二子电极22上均设置有连接多个刺激位点的连接线缆23,连接线缆23适于与电刺激器的植入式供电单元电连接。具体地,连接线缆23的一端与多个刺激位点电连接,连接线缆23的另一端与植入式供电单元电连接。由此,第一子电极21和第二子电极22的多个刺激位点可以通过连接线缆23与植入式供电单元电连接,有利于植入式供电单元与柔性电极之间的信号传输。Referring to FIG. 2 , thefirst sub-electrode 21 and the second sub-electrode 22 are each provided with aconnection cable 23 connecting multiple stimulation sites, and theconnection cable 23 is suitable for electrical connection with the implanted power supply unit of the electrical stimulator. Specifically, one end of theconnection cable 23 is electrically connected to a plurality of stimulation sites, and the other end of theconnection cable 23 is electrically connected to the implantable power supply unit. Thus, the multiple stimulation sites of thefirst sub-electrode 21 and the second sub-electrode 22 can be electrically connected to the implanted power supply unit through theconnection cable 23, which facilitates the signal transmission between the implanted power supply unit and the flexible electrode .

根据本发明的一些实施例,参照图2,电极支撑柱1包括相互固定连接的第一子支撑段11和第二子支撑段12,例如,第一子支撑段11和第二子支撑段12的结构可以大致相同。第一子电极21固定在第一子支撑段11上,第二子电极22固定在第二子支撑段12上。如此设置,提高了第一子电极21和第二子电极22的使用稳定性。此外,第一子支撑段11和第二子支撑段12的结构简单,生产加工较为方便。According to some embodiments of the present invention, referring to FIG. 2 , the electrode support column 1 includes a firstsub-support section 11 and a secondsub-support section 12 fixedly connected to each other, for example, the firstsub-support section 11 and the secondsub-support section 12 The structure can be roughly the same. Thefirst sub-electrode 21 is fixed on the firstsub-support section 11 , and thesecond sub-electrode 22 is fixed on the secondsub-support section 12 . With such an arrangement, the use stability of thefirst sub-electrode 21 and thesecond sub-electrode 22 is improved. In addition, the structure of the firstsub-support section 11 and the secondsub-support section 12 is simple, and the production and processing are relatively convenient.

可选地,参照图2-图4,第一子支撑段11和第二子支撑段12上形成有至少一个定位孔121,电极结构100进一步包括至少一个定位件(例如销钉),定位件配合在第一子支撑段11和第二子支撑段12上的定位孔121内,以使第一子支撑段11和第二子支撑段12连接成一体。由此,第一子支撑段11和第二子支撑段12之间的装配操作简单,连接牢固,使用寿命长。Optionally, referring to FIGS. 2-4 , at least onepositioning hole 121 is formed on the firstsub-support section 11 and the secondsub-support section 12, and theelectrode structure 100 further includes at least one positioning member (such as a pin), and the positioning member fits In the positioning holes 121 on the firstsub-support section 11 and the secondsub-support section 12 , the firstsub-support section 11 and the secondsub-support section 12 are connected into one body. Therefore, the assembly operation between the firstsub-support section 11 and the secondsub-support section 12 is simple, the connection is firm, and the service life is long.

进一步地,结合图2-图4,第一子支撑段11和第二子支撑段12上均形成有凹槽13,第一子电极21和第二子电极22的长边两侧(例如,图2中箭头B所指的方向)分别设有折边24,折边24固定于对应的凹槽13内。如此设置,方便了第一子电极21和第一子支撑段11、以及第二子电极22和第二子支撑段12的装配,且装配可靠,有利于第一子电极21和第二子电极22长期稳定地使用。而且,凹槽13的侧壁对折边24具有限位作用,进一步地提高了第一子电极21、第二子电极22和电极支撑柱1的连接稳定性。Further, with reference to FIGS. 2-4 ,grooves 13 are formed on the firstsub-support section 11 and the secondsub-support section 12, and both sides of the long sides of thefirst sub-electrode 21 and the second sub-electrode 22 (for example, In the direction indicated by the arrow B in FIG. 2 ), foldededges 24 are respectively provided, and the foldededges 24 are fixed in thecorresponding grooves 13 . Such setting facilitates the assembly of thefirst sub-electrode 21 and the firstsub-supporting section 11, as well as thesecond sub-electrode 22 and the secondsub-supporting section 12, and the assembly is reliable, which is beneficial to thefirst sub-electrode 21 and the second sub-electrode 22 for long-term and stable use. Moreover, the sidewall of thegroove 13 has a limiting effect on the foldededge 24 , which further improves the connection stability between thefirst sub-electrode 21 , thesecond sub-electrode 22 and the electrode support column 1 .

根据本发明的一些实施例,参照图2和图3,电极支撑柱1的端部设置有限位孔14,电极结构100进一步包括注胶件3,电极支撑柱1的端部和第一子电极21和第二子电极22的对应端部通过注胶件3固定连接,注胶件3的一部分填充在限位孔14内。由此,注胶件3可以实现对第一子电极21和第二子电极22与电极支撑柱1的可靠固定。According to some embodiments of the present invention, referring to FIG. 2 and FIG. 3 , the end of the electrode support column 1 is provided with a limitinghole 14, and theelectrode structure 100 further includes aglue injection part 3, the end of the electrode support column 1 and thefirst sub-electrode 21 and the corresponding ends of the second sub-electrode 22 are fixedly connected through theglue injection part 3 , and a part of theglue injection part 3 is filled in the limitinghole 14 . Thus, theglue injection part 3 can realize reliable fixing of thefirst sub-electrode 21 and thesecond sub-electrode 22 and the electrode support column 1 .

可选地,结合图2和图3,沿电极支撑柱1的轴向远离注胶件3的方向,限位孔14的横截面积逐渐增大。由此,注胶件3的填充在限位孔14内的部分不易从限位孔14内脱落。Optionally, referring to FIG. 2 and FIG. 3 , the cross-sectional area of the limitinghole 14 gradually increases along the direction in which the electrode support column 1 is axially away from theinjection part 3 . Thus, the part of theinjection part 3 filled in the limitinghole 14 is not easy to fall off from the limitinghole 14 .

根据本发明的一些实施例,电极部1a还包括带状结构的第三子电极(图未示出),第一子电极21、第二子电极22和第三子电极卷曲并贴附于电极支撑柱1的外周侧。例如,第一子电极21、第二子电极22和第三子电极沿电极支撑柱1的外周排布。需要说明的是,第一子电极21和第二子电极22可以根据使用需求设置多个子电极,以更好地满足实际应用。According to some embodiments of the present invention, the electrode part 1a also includes a third sub-electrode (not shown in the figure) in a strip structure, and thefirst sub-electrode 21, thesecond sub-electrode 22 and the third sub-electrode are crimped and attached to the electrode The outer peripheral side of the support column 1. For example, thefirst sub-electrode 21 , thesecond sub-electrode 22 and the third sub-electrode are arranged along the periphery of the electrode support column 1 . It should be noted that, thefirst sub-electrode 21 and the second sub-electrode 22 can be provided with a plurality of sub-electrodes according to usage requirements, so as to better meet practical applications.

进一步地,参照图2,电极结构100包括套管4,套管4套设在连接线缆23外,多个导线5集成于套管4内。如此设置,如此设置,可以提高各部件之间的连接稳定性。Further, referring to FIG. 2 , theelectrode structure 100 includes asleeve 4 , which is sleeved outside theconnection cable 23 , and a plurality ofwires 5 are integrated in thesleeve 4 . Setting in this way can improve the connection stability between the components.

可选地,结合图2,多个导线5沿套管4的轴向螺旋延伸且并紧。由此,节约了导线5在套管4的内部占用的空间,从而使电极结构100制作得更加精巧。Optionally, referring to FIG. 2 , a plurality ofwires 5 extend helically along the axial direction of thesleeve 4 and are tightened together. As a result, the space occupied by thewire 5 inside thecasing 4 is saved, so that theelectrode structure 100 can be manufactured more delicately.

例如,图2中示出了五个导线5,五个导线5可以分别为时钟引线、中断引线、数据引线、电源引线和接地引线,以满足电极结构100的正常使用。For example, fivewires 5 are shown in FIG. 2 , and the fivewires 5 may be clock wires, interrupt wires, data wires, power wires and ground wires respectively, so as to meet the normal use of theelectrode structure 100 .

进一步地,如图5、图6、图7和图11所示,连接器200包括轴向(例如,图2中箭头A所指的方向)设置的第一段201和第二段202,第一段201和第二段202之间形成台阶结构2021,第一段201的厚度大于第二段202的厚度,第一段201上开设有理线槽81,第二段202上设置有导电销82。Further, as shown in FIG. 5, FIG. 6, FIG. 7 and FIG. 11, theconnector 200 includes afirst segment 201 and asecond segment 202 arranged axially (for example, in the direction indicated by arrow A in FIG. Astep structure 2021 is formed between thefirst section 201 and thesecond section 202, the thickness of thefirst section 201 is greater than the thickness of thesecond section 202, thefirst section 201 is provided with awire management groove 81, and thesecond section 202 is provided with aconductive pin 82 .

例如,在图6和图7的示例中,第一段201的上表面和下表面均形成有理线槽81,多个导线5的一端可以分别伸入多个理线槽81内。而且,多个导线5可以通过连接器200的导电销82与第一芯片6和第二芯片7实现电连接,连接方便。For example, in the example shown in FIG. 6 and FIG. 7 , the upper surface and the lower surface of thefirst segment 201 are both formed withwire management grooves 81 , and one ends of the plurality ofwires 5 can respectively extend into the plurality ofwire management grooves 81 . Moreover, the plurality ofwires 5 can be electrically connected to thefirst chip 6 and thesecond chip 7 through theconductive pin 82 of theconnector 200 , and the connection is convenient.

根据本发明的一些实施例,参照图6-图9,理线槽81延伸至第二段202上,且理线槽81的邻近导电销82一端的宽度大于理线槽81的其它部分的宽度,该宽度较大的部分便于导线5端部的弯折,导线5的端部可以位于导电销82和理线槽81的侧壁之间,方便装配及限位,并能保证连接稳定性。According to some embodiments of the present invention, with reference to FIGS. 6-9 , thewire management groove 81 extends to thesecond section 202, and the width of the end of thewire management groove 81 adjacent to theconductive pin 82 is greater than the width of other parts of thewire management groove 81 , the wider part is convenient for bending the end of thewire 5, and the end of thewire 5 can be located between theconductive pin 82 and the side wall of thewire management groove 81, which is convenient for assembly and positioning, and can ensure connection stability.

可选地,结合图2、图5-图7,第二段202上设置有多个通孔2023,多个导电销82分立设置并分别插入通孔2023内。例如,通孔2023可以沿厚度方向贯穿第二段202,且与理线槽81连通。由此,方便了导电销82的安装及固定。Optionally, referring to FIG. 2 and FIG. 5-FIG. 7 , a plurality of throughholes 2023 are disposed on thesecond segment 202 , and a plurality ofconductive pins 82 are separately disposed and inserted into the throughholes 2023 respectively. For example, the throughhole 2023 may pass through thesecond section 202 along the thickness direction, and communicate with thecable management slot 81 . Thus, the installation and fixing of theconductive pin 82 is facilitated.

根据本发明的一些实施例,参照图6、图10和图11,第一段201的远离第二段202的端部形成有导针定位孔2012。例如,在图6和图11的示例中,导针定位孔2012沿第一段201的中心轴线延伸。当植入手术时,导针205可以从第一段201的远离第二段202的端部伸入导针定位孔2012内,进而可以顺利地将电极结构100推入至植入位置。According to some embodiments of the present invention, referring to FIG. 6 , FIG. 10 and FIG. 11 , a guideneedle positioning hole 2012 is formed at the end of thefirst segment 201 away from thesecond segment 202 . For example, in the examples of FIGS. 6 and 11 , the guidepin positioning hole 2012 extends along the central axis of thefirst section 201 . During implantation, theguide pin 205 can be inserted into the guidepin positioning hole 2012 from the end of thefirst segment 201 far away from thesecond segment 202 , so as to smoothly push theelectrode structure 100 to the implantation position.

进一步地,在第一段201上侧表面设置有两个理线槽81或三个理线槽81,其余理线槽81设置于第一段201下侧表面,但不限于此。例如,在图2、图6和图7的示例中,第一段201的上侧表面上形成有两个理线槽81,两个理线槽81沿连接器200的宽度方向(例如,图2中箭头B所指的方向)间隔设置,第一段201的下侧表面上形成有三个理线槽81。由此,连接器200上的多个理线槽81布局合理,从而有利于五个导线5与对应的导电销82的连接。Further, two or threewire management grooves 81 are provided on the upper surface of thefirst section 201 , and the remainingwire management grooves 81 are provided on the lower surface of thefirst section 201 , but not limited thereto. For example, in the example of Fig. 2, Fig. 6 and Fig. 7, the upper side surface of thefirst segment 201 is formed with twowire management grooves 81, and the twowire management grooves 81 are along the width direction of the connector 200 (for example, Fig. 2 in the direction indicated by the arrow B) at intervals, and threecable management grooves 81 are formed on the lower surface of thefirst section 201. Therefore, the layout of the plurality ofwire management slots 81 on theconnector 200 is reasonable, which facilitates the connection of the fivewires 5 to the corresponding conductive pins 82 .

根据本发明实施例的电刺激器例如脑深部电刺激器和电极结构100的其他构成以及操作对于本领域普通技术人员而言都是已知的,这里不再详细描述。Other configurations and operations of an electrical stimulator such as a deep brain electrical stimulator and theelectrode structure 100 according to an embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

在本发明的描述中,需要理解的是,术语“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”、“内”、“外”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In describing the present invention, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", "axial", "radial", and "circumferential" are based on the orientation or positional relationship shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

尽管已经示出和描述了本发明的实施例,本领域的普通技术人员可以理解:在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

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Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20080255647A1 (en)*2004-12-222008-10-16Marc JensenImplantable Addressable Segmented Electrodes
CN102282661A (en)*2009-01-272011-12-14松下电工株式会社 Method for mounting semiconductor chip, semiconductor device obtained by the method, method for connecting semiconductor chip, three-dimensional structure with wiring on its surface, and method for manufacturing the same
US20120126427A1 (en)*2010-11-182012-05-24Sae Magnetics (H.K.) Ltd.Memory device, laminated semiconductor substrate and method of manufacturing the same
CN105355615A (en)*2015-11-022016-02-24上海芯敏微系统技术有限公司On-chip wire direct lead-out structure of chip and making method thereof
CN113713259A (en)*2021-11-022021-11-30上海神奕医疗科技有限公司Implanted electrode and implanted electrical stimulation system
CN115054265A (en)*2022-06-172022-09-16中国科学院脑科学与智能技术卓越创新中心Flexible electrode assembly for bonding with SEEG electrode and method for manufacturing same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20080255647A1 (en)*2004-12-222008-10-16Marc JensenImplantable Addressable Segmented Electrodes
CN102282661A (en)*2009-01-272011-12-14松下电工株式会社 Method for mounting semiconductor chip, semiconductor device obtained by the method, method for connecting semiconductor chip, three-dimensional structure with wiring on its surface, and method for manufacturing the same
US20120126427A1 (en)*2010-11-182012-05-24Sae Magnetics (H.K.) Ltd.Memory device, laminated semiconductor substrate and method of manufacturing the same
CN105355615A (en)*2015-11-022016-02-24上海芯敏微系统技术有限公司On-chip wire direct lead-out structure of chip and making method thereof
CN113713259A (en)*2021-11-022021-11-30上海神奕医疗科技有限公司Implanted electrode and implanted electrical stimulation system
CN115054265A (en)*2022-06-172022-09-16中国科学院脑科学与智能技术卓越创新中心Flexible electrode assembly for bonding with SEEG electrode and method for manufacturing same

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