CN115863191A

Movatterモバイル変換

Info

Publication number: CN115863191A
Application number: CN202211567321.0A
Authority: CN
Inventors: 程志远; 韩留军; 王仕权; 严晓洁; 孙炜
Original assignee: Wuxi Hope Microelectronics Co ltd
Current assignee: Wuxi Hope Microelectronics Co ltd
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2023-03-28
Anticipated expiration: 2042-12-07
Also published as: CN115863191B

Abstract

本发明关于基于手动楔形键合机的多线型切换引线键合方法，涉及电子封装技术领域。该方法包括：将与第一类线型芯片对应的第一引线输入多线型手动楔形键合机；执行键合程序，以进行第一类线型芯片的键合；响应于第一类线型芯片的键合完成；将与第二类线型芯片对应的引线输入多线型手动楔形键合机；执行键合程序，以进行第二类线型芯片的键合；将第二引线抽出多线型手动楔形键合机。应用多线型手动楔形键合机，并配置对应的键合程序，在对于不同种类的线型芯片进行键合的过程当中，实现使用单台机器，对于多类型线型芯片进行键合的过程。该过程使用单一设备满足了多类型的线型芯片制作工艺要求，降低了生产成本，提高了键合工艺的工作效率。

The invention relates to a multi-line switching wire bonding method based on a manual wedge bonding machine, and relates to the technical field of electronic packaging. The method includes: inputting the first wire corresponding to the first type of wire chip into a multi-wire manual wedge bonding machine; executing a bonding program to bond the first type of wire type chip; responding to the first type of wire The bonding of the type chip is completed; the lead corresponding to the second type of linear chip is input into the multi-line manual wedge bonding machine; the bonding program is executed to bond the second type of linear chip; the second lead is drawn out Multi-line manual wedge bonder. Apply a multi-line manual wedge bonder and configure the corresponding bonding program. In the process of bonding different types of linear chips, realize the process of using a single machine to bond multiple types of linear chips. . The process uses a single device to meet the manufacturing process requirements of multiple types of linear chips, reduces the production cost, and improves the working efficiency of the bonding process.

Description

Translated fromChinese

基于手动楔形键合机的多线型切换引线键合方法A wire bonding method based on a manual wedge bonder for switching wires

技术领域technical field

本发明涉及电子封装技术领域，特别涉及基于手动楔形键合机的多线型切换引线键合方法。The invention relates to the technical field of electronic packaging, in particular to a multi-line switching wire bonding method based on a manual wedge bonding machine.

背景技术Background technique

引线键合是采用金属细丝、带实现裸芯片与电子封装I/O座垫或电路基板上外露焊区互连的技术，是电子封装领域的重要工艺手段。随着电子封装技术的高速发展，高密度封装已成为市场主流，多功能多品种的裸芯片被研发应用在各类领域。裸芯片封装离不开引线键合，楔形键合机通过加热、加压、加超声等方式，利用高温扩散、塑性摩擦形变实现键合；因其间距更小，弧度低，弧长可控，有利于实现射频指标，在微波多芯片模块领域中应用广泛。经过多年的发展，引线键合工艺（键合工艺）已较为成熟。Wire bonding is a technology that uses metal filaments and ribbons to realize the interconnection between bare chips and electronic packaging I/O pads or exposed solder areas on circuit substrates. It is an important process in the field of electronic packaging. With the rapid development of electronic packaging technology, high-density packaging has become the mainstream of the market, and multi-functional and multi-variety bare chips have been developed and applied in various fields. Bare chip packaging is inseparable from wire bonding. Wedge bonding machines use high-temperature diffusion and plastic friction deformation to achieve bonding through heating, pressure, and ultrasound; because of its smaller spacing, low arc, and controllable arc length, It is beneficial to realize the radio frequency index and is widely used in the field of microwave multi-chip modules. After years of development, the wire bonding process (bonding process) has become relatively mature.

相关技术中，在多芯片模块封装时，大量的裸芯片一同键合，每种芯片在键合前都需要试验确定参数，部分芯片由于焊盘差异需要采用不同线型的引线，由于线型切换占用时间较长，为了保证连续生产，现行方法有两个：其一配备多台键合机，每种键合机仅键合一种线型；其二采用单台键合机键合完一类线型芯片再停线，线型切换后键合另一类线型芯片。In related technologies, when packaging multi-chip modules, a large number of bare chips are bonded together. Each chip needs to be tested to determine parameters before bonding. Some chips need to use different wire types due to differences in pads. Due to wire type switching It takes a long time. In order to ensure continuous production, there are two current methods: one is equipped with multiple bonding machines, and each bonding machine only bonds one type of wire; the other is to use a single bonding machine to complete a bond. The wire-like chip is then stopped, and another type of wire-type chip is bonded after the wire type is switched.

然而，若使用相关技术当中的方法，在配备多台键合机的情况下，工艺流程成本较高，若使用单台键合机，工艺流程耗时较长，因此，应用键合机进行引线键合的工艺流程生产成本较高，且生产效率较低。However, if the method in the related art is used, the cost of the process flow is high when multiple bonding machines are equipped, and the process process takes a long time if a single bonding machine is used. Therefore, the bonding machine is used for wire bonding. The bonding process has higher production costs and lower production efficiency.

发明内容Contents of the invention

本发明的目的在于克服已有技术中存在的不足，从而降低应用键合机进行引线键合的工艺流程成本，提高工艺流程的效率，该技术方案应用于多线型手动楔形键合机中，该多线型手动楔形键合机包括兼容劈刀、第一线夹、第二线夹、第一供线夹具、第二供线夹具以及供线定位轴；The purpose of the present invention is to overcome the deficiencies in the prior art, thereby reducing the process flow cost of wire bonding using a bonding machine and improving the efficiency of the process flow. This technical solution is applied to a multi-line manual wedge bonder. The multi-wire manual wedge bonding machine includes a compatible riving knife, a first wire clamp, a second wire clamp, a first wire supply clamp, a second wire supply clamp and a wire supply positioning shaft;

兼容劈刀位于多线型手动楔形键合机的底部；Compatible riving knife is located on the bottom of the multi-wire manual wedge bonder;

第一线夹与第一供线夹具对应，以执行第一键合流程，第一键合流程与45°键合对应；The first wire clamp corresponds to the first wire supply fixture to perform the first bonding process, and the first bonding process corresponds to 45° bonding;

第二线夹与第二供线夹具对应，以执行第二键合流程，第二键合流程与90°键合对应；The second wire clamp corresponds to the second wire supply fixture to perform the second bonding process, and the second bonding process corresponds to 90° bonding;

手动楔形键合机内置有键合程序；The manual wedge bonding machine has a built-in bonding program;

一种基于手动楔形键合机的多线型切换引线键合方法包括：A manual wedge bonder based multi-wire switching wire bonding method includes:

将与第一类线型芯片对应的第一引线输入多线型手动楔形键合机，并控制第一引线通过第一供线夹具、第一线夹以及兼容劈刀；Inputting the first wire corresponding to the first type of wire type chip into the multi-wire manual wedge bonding machine, and controlling the first wire to pass through the first wire supply fixture, the first wire clamp and the compatible riving knife;

执行键合程序，以进行第一类线型芯片的键合；Executing a bonding program to bond the first type of linear chip;

响应于第一类线型芯片的键合完成；将第一引线抽出多线型手动楔形键合机；Responsive to completion of bonding of the first type of wire chip; extracting the first lead out of the multi-wire manual wedge bonder;

将与第二类线型芯片对应的引线输入多线型手动楔形键合机，并控制第二引线通过第二供线夹具、第二线夹以及兼容劈刀；Input the wires corresponding to the second type of wire chips into the multi-wire manual wedge bonding machine, and control the second wires to pass through the second wire supply fixture, the second wire clamp and the compatible riving knife;

执行键合程序，以进行第二类线型芯片的键合；Executing a bonding program to bond the second type of wire chip;

响应于第二类线型芯片的键合完成，将第二引线抽出多线型手动楔形键合机。In response to completion of bonding of the second type of wire die, the second wire is drawn out of the multi-wire manual wedge bonder.

在一个可选的实施例中，响应于第二类线型芯片的键合完成，将第二引线抽出多线型手动楔形键合机之后，包括：In an optional embodiment, after the second wire is pulled out of the multi-wire manual wedge bonding machine in response to the completion of the bonding of the second type of wire chip, the process includes:

将与第三芯片类型对应的第三引线输入多线型手动键合机，并控制第三引线通过第一供线夹具、第一线夹以及第一劈刀；Inputting the third wire corresponding to the third chip type into the multi-wire manual bonding machine, and controlling the third wire to pass through the first wire supply fixture, the first wire clamp and the first rivet;

执行键合程序，以进行第三类线型芯片的键合；Executing a bonding program to bond the third type of wire chip;

响应于第三类线型芯片的键合完成，将第三引线抽出多线型手动楔形键合机。In response to the completion of the bonding of the third type of wire chip, the third wire is drawn out of the multi-wire manual wedge bonder.

在一个可选的实施例中，第一引线、第二引线以及第三引线的线型相邻。In an optional embodiment, the lines of the first lead, the second lead and the third lead are adjacent to each other.

在一个可选的实施例中，供线定位轴的材质为黄铜。In an optional embodiment, the wire supply positioning shaft is made of brass.

在一个可选的实施例中，多线型手动楔形键合机还包括第一悬臂以及第二悬臂；In an optional embodiment, the multi-line manual wedge bonding machine further includes a first cantilever and a second cantilever;

第一供线夹具通过第一悬臂与供线定位轴固定连接；The first wire supply fixture is fixedly connected to the wire supply positioning shaft through the first cantilever;

第二供线夹具通过第二悬臂与供线定位轴固定连接。The second wire supply fixture is fixedly connected with the wire supply positioning shaft through the second cantilever.

在一个可选的实施例中，键合程序中包括至少两个键合子程序；In an optional embodiment, the bonding program includes at least two bonding subroutines;

至少两个键合子程序中，第一键合子程序与第一线型芯片的键合过程对应，第二键合子程序与第二线型芯片的键合过程对应。Among the at least two bonding subroutines, the first bonding subroutine corresponds to the bonding process of the first wire-type chip, and the second bonding subroutine corresponds to the bonding process of the second wire-type chip.

本发明提供的技术方案带来的有益效果至少包括：The beneficial effects brought by the technical solution provided by the present invention at least include:

应用多线型手动楔形键合机，并配置对应的键合程序，在对于不同种类的线型芯片进行键合的过程当中，通过以不同的方式进行引线的接入，并对应引线的接入方式，执行不同键合程序的设置，以实现使用单台机器，对于多类型线型芯片进行键合的过程。该过程使用单一设备满足了多类型的线型芯片制作工艺要求，降低了生产成本，提高了键合工艺的工作效率。Apply a multi-line manual wedge bonder and configure the corresponding bonding program. In the process of bonding different types of linear chips, the lead wires are connected in different ways, and the corresponding lead wires are connected. In this way, different bonding programs are set up to realize the process of bonding multiple types of linear chips with a single machine. The process uses a single device to meet the manufacturing process requirements of multiple types of linear chips, reduces the production cost, and improves the working efficiency of the bonding process.

附图说明Description of drawings

为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

图1示出了本申请一个示例性实施例提供的一种多线型手动楔形键合机的结构示意图。Fig. 1 shows a schematic structural diagram of a multi-line manual wedge bonding machine provided by an exemplary embodiment of the present application.

图2示出了本申请一个示例性实施例提供的一种悬臂、供线夹具以及贡献定位轴的特写示意图。Fig. 2 shows a close-up schematic diagram of a cantilever, a wire supply clamp and a contribution positioning shaft provided by an exemplary embodiment of the present application.

图3示出了本申请一个示例性实施例提供的一种基于手动楔形键合机的多线型切换引线键合方法的流程示意图。Fig. 3 shows a schematic flow chart of a multi-line switching wire bonding method based on a manual wedge bonder provided by an exemplary embodiment of the present application.

具体实施方式Detailed ways

为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步地详细描述。In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

本申请所述的基于手动楔形键合机的多线型切换引线键合方法，需要结合多线型手动楔形键合机执行，图1示出了本申请一个示例性实施例提供的一种多线型手动楔形键合机的结构示意图。请参考图1，该多线型手动楔形键合机包括兼容劈刀101、第一线夹102、第二线夹103、第一供线夹具104、第二供线夹具105以及供线定位轴106。第一线夹与第一供线夹具对应，以执行第一键合流程，第一键合流程与45°键合对应。第二线夹与第二供线夹具对应，以执行第二键合流程，第二键合流程与90°键合对应。The multi-line type switching wire bonding method based on a manual wedge bonder described in this application needs to be implemented in combination with a multi-line type manual wedge bonder. Figure 1 shows a multi-line type provided by an exemplary embodiment of this application Schematic diagram of the linear manual wedge bonder. Please refer to FIG. 1, the multi-wire manual wedge bonding machine includes acompatible riving knife 101, afirst wire clamp 102, asecond wire clamp 103, a firstwire supply clamp 104, a secondwire supply clamp 105 and a wiresupply positioning shaft 106 . The first wire clamp corresponds to the first wire supply fixture to perform the first bonding process, and the first bonding process corresponds to 45° bonding. The second wire clamp corresponds to the second wire supply fixture to perform a second bonding process, and the second bonding process corresponds to 90° bonding.

在本申请实施例中，第一线夹以及第二线夹均位于兼容劈刀附近。本申请实施例所述的第一键合流程为45°键合流程，本申请实施例所述的第二键合流程为90°键合流程，因此，第一线夹、第一供线夹具以及兼容劈刀结合，用于执行45°键合流程，第二线夹，第二供线夹具以及兼容劈刀结合，用于执行90°键合流程。本申请实施例中，兼容劈刀能够剪切至少两种不同类型的引线。In the embodiment of the present application, both the first wire clip and the second wire clip are located near the compatible riving knife. The first bonding process described in the embodiment of the present application is a 45° bonding process, and the second bonding process described in the embodiment of the present application is a 90° bonding process. Therefore, the first wire clamp and the first wire supply fixture As well as a capillary compatible bond for performing 45° bonding processes, a second wire clamp, a second wire supply fixture and compatible caping tool bond for performing 90° bonding processes. In the embodiment of the present application, the compatible rivet can cut at least two different types of leads.

在本申请实施例中，供线定位轴的材质为黄铜，该供线定位轴用于对两个供线夹进行定位。在一个示例中，供线定位轴上方设置有凹槽，第一供线夹具以及第二供线夹具的下方设置有凸起，通过凹槽与凸起的匹配，实现供线夹具与供线定位轴的匹配连接。In the embodiment of the present application, the wire supply positioning shaft is made of brass, and the wire supply positioning shaft is used to position the two wire supply clamps. In one example, a groove is provided above the wire supply positioning shaft, and a protrusion is provided below the first wire supply clamp and the second wire supply clamp, and the positioning of the wire supply clamp and the wire supply is realized through the matching of the groove and the protrusion. Shaft mating connection.

在一个可选的实施例中，请参考图2，多线型手动楔形键合机还包括第一悬臂107以及第二悬臂108。第一供线夹具通过第一悬臂与供线定位轴固定连接；第二供线夹具通过第二悬臂与供线定位轴固定连接。In an optional embodiment, please refer to FIG. 2 , the multi-line manual wedge bonding machine further includes afirst cantilever 107 and asecond cantilever 108 . The first wire supply clamp is fixedly connected to the wire supply positioning shaft through the first cantilever; the second wire supply clamp is fixedly connected to the wire supply positioning shaft through the second cantilever.

需要说明的是，本申请所述的多线型手动楔形键合机实现为半自动化键合机，其中搭载有键合程序，该键合程序能够实现线型芯片键合工艺流程的部分工序。在本申请实施例中，键合程序能够在多线型手动楔形键合机制备完成后，通过烧录的方式进行录入，之后在多线型手动楔形键合机的使用过程中，当装置启动后，即可执行对应的键合程序。It should be noted that the multi-line manual wedge bonder described in this application is implemented as a semi-automatic bonder, which is equipped with a bonding program that can realize part of the process of the linear chip bonding process. In the embodiment of this application, the bonding program can be entered by burning after the preparation of the multi-line manual wedge bonder is completed, and then during the use of the multi-line manual wedge bonder, when the device starts After that, the corresponding bonding program can be executed.

结合上述说明，图3示出了本申请一个示例性实施例提供的一种基于手动楔形键合机的多线型切换引线键合方法的流程示意图，该方法包括：In combination with the above description, FIG. 3 shows a schematic flow chart of a multi-line type switching wire bonding method based on a manual wedge bonder provided by an exemplary embodiment of the present application. The method includes:

步骤301，将与第一类线型芯片对应的第一引线输入多线型手动楔形键合机，并控制第一引线通过第一供线夹具、第一线夹以及兼容劈刀。Step 301 , input the first wire corresponding to the first type of wire chip into the multi-wire manual wedge bonder, and control the first wire to pass through the first wire supply fixture, the first wire clamp and the compatible riving knife.

该过程即用于执行与45°键合的工序，此时，引线穿过第一供线夹具、第一线夹以及兼容劈刀，可选地，兼容劈刀中具有一个与第一引线对应的刀口。在一个示例中，第一引线的直径为18μm。This process is used to perform the process of bonding with 45°. At this time, the lead wire passes through the first wire supply fixture, the first wire clamp and the compatible riving knife. Optionally, there is a compatible riving knife corresponding to the first lead wire. knife edge. In one example, the diameter of the first lead is 18 μm.

步骤302，执行键合程序，以进行第一类线型芯片的键合。Instep 302, a bonding program is executed to bond the first type of wire chips.

该过程即为第一类线型芯片的键合过程。This process is the bonding process of the first type of linear chip.

步骤303，响应于第一类线型芯片的键合完成；将第一引线抽出多线型手动楔形键合机。Step 303, in response to the completion of the bonding of the first type of wire chip; pulling the first wire out of the multi-wire manual wedge bonding machine.

在本申请实施例中，第一类线型芯片键合完成后，工作人员执行手动工序，将第一引线抽出。In the embodiment of the present application, after the first type of wire-type chip bonding is completed, the staff performs a manual process to pull out the first lead.

步骤304，将与第二类线型芯片对应的引线输入多线型手动楔形键合机，并控制第二引线通过第二供线夹具、第二线夹以及兼容劈刀。Step 304 , input the wires corresponding to the second type of wire chips into the multi-wire manual wedge bonding machine, and control the second wires to pass through the second wire supply fixture, the second wire clamp and the compatible riving knife.

步骤305，执行键合程序，以进行第二类线型芯片的键合。Step 305 , executing a bonding program to bond the second type of wire chips.

该过程即用于执行与90°键合的工序，此时，引线穿过第二供线夹具、第二线夹以及兼容劈刀，可选地，兼容劈刀中具有一个与第二引线对应的刀口。在一个示例中，第二引线的直径为20μm。This process is used to carry out the operation of bonding with 90°. At this time, the lead wire passes through the second wire supply fixture, the second wire clamp and the compatible rivet. Optionally, there is a corresponding rivet in the compatible rivet. blade. In one example, the diameter of the second lead is 20 μm.

步骤306，响应于第二类线型芯片的键合完成，将第二引线抽出多线型手动楔形键合机。Step 306 , in response to the completion of the bonding of the second type of wire chip, the second wire is pulled out of the multi-wire manual wedge bonding machine.

可选地，在将第二引线抽出多线型手动楔形键合机后，还可以将与第三芯片类型对应的第三引线输入多线型手动键合机，并控制第三引线通过第一供线夹具、第一线夹以及第一劈刀，之后，执行键合程序，以进行第三类线型芯片的键合。并在键合结束后，响应于第三类线型芯片的键合完成，将第三引线抽出多线型手动楔形键合机。也即，多线型手动楔形键合机能够根据用户引入的不同引线和不同的键合模式，对于不同种类的线型芯片执行键合工序。在一个示例中，第三类线型芯片所对应的第三引线的直径为25μm。Optionally, after the second lead is extracted from the multi-wire manual wedge bonding machine, the third lead corresponding to the third chip type can also be input into the multi-wire manual bonder, and the third lead is controlled to pass through the first The wire clamp, the first wire clamp and the first capping knife are supplied, and then the bonding program is executed to bond the third type wire chip. And after the bonding is completed, in response to the completion of the bonding of the third type of wire chip, the third lead is pulled out of the multi-wire manual wedge bonding machine. That is, the multi-wire manual wedge bonder can perform bonding processes for different types of wire chips according to different wires and different bonding modes introduced by the user. In one example, the diameter of the third lead corresponding to the third type of wire chip is 25 μm.

需要说明的是，键合程序中包括至少两个键合子程序。至少两个键合子程序中，第一键合子程序与第一线型芯片的键合过程对应，第二键合子程序与第二线型芯片的键合过程对应。对应上述具有对于第三线型芯片的键合需求，键合程序中应对应进行多类型子程序的配置。It should be noted that the bonding program includes at least two bonding subroutines. Among the at least two bonding subroutines, the first bonding subroutine corresponds to the bonding process of the first wire-type chip, and the second bonding subroutine corresponds to the bonding process of the second wire-type chip. Corresponding to the above-mentioned bonding requirements for the third linear chip, the bonding program should be configured with multiple types of subroutines.

综上所述，本申请实施例提供的方法，应用多线型手动楔形键合机，并配置对应的键合程序，在对于不同种类的线型芯片进行键合的过程当中，通过以不同的方式进行引线的接入，并对应引线的接入方式，执行不同键合程序的设置，以实现使用单台机器，对于多类型线型芯片进行键合的过程。该过程使用单一设备满足了多类型的线型芯片制作工艺要求，降低了生产成本，提高了键合工艺的工作效率。To sum up, the method provided by the embodiment of this application uses a multi-line manual wedge bonder and configures a corresponding bonding program. In the process of bonding different types of line chips, different According to the access mode of the lead wire, different bonding procedures are set according to the access method of the lead wire, so as to realize the process of bonding multiple types of linear chips with a single machine. The process uses a single device to meet the manufacturing process requirements of multiple types of linear chips, reduces the production cost, and improves the working efficiency of the bonding process.

上述仅为本发明的可选实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above are only optional embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention Inside.