CN115792549A - Thermal resistance test system and test method - Google Patents
Thermal resistance test system and test methodDownload PDFInfo
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Abstract
Description
Translated fromChinese技术领域technical field
本发明涉及芯片领域，具体地涉及一种热阻的测试系统与测试方法。The invention relates to the field of chips, in particular to a thermal resistance testing system and testing method.
背景技术Background technique
芯片热阻(Rja)是指芯片的热源结(junction)到周围冷却空气(ambient)的总热阻。芯片热阻乘以其发热量，即获得器件温升。随着安全芯片向系统化、小型化发展，热流密度不断增加，引起温升，从而导致芯片各项功能下降。由此，通过芯片热阻这一参数对安全芯片的散热能力的评估也越来越重要。Chip thermal resistance (Rja) refers to the total thermal resistance from the heat source junction (junction) of the chip to the surrounding cooling air (ambient). The thermal resistance of the chip is multiplied by its calorific value to obtain the temperature rise of the device. With the development of security chips towards systematization and miniaturization, the heat flux density continues to increase, causing temperature rise, which leads to the decline of various functions of the chip. Therefore, it is more and more important to evaluate the heat dissipation capability of the security chip through the parameter of chip thermal resistance.
目前，安全芯片的热阻的测试方法主要有以下两种。At present, there are mainly two methods for testing the thermal resistance of the security chip as follows.
1、根据芯片封装形式仿真得到热阻。以球状引脚栅格阵列(BGA)封装形式芯片为例，芯片由环氧塑封料(EMC)、晶圆、内部焊球、底部填充胶、封装基板和外部焊球等构成，可根据各部分材料的热模型综合仿真得热阻Rja。然而，上述方法是预估评估方法，仿真采用的环境与实际应用环境存在一定误差。例如，芯片一般焊接在印制电路板(PCB)上，热阻受PCB材质和叠层影响，产生误差。1. According to the simulation of the chip package form, the thermal resistance is obtained. Taking ball grid array (BGA) package chip as an example, the chip is composed of epoxy molding compound (EMC), wafer, internal solder balls, underfill glue, packaging substrate and external solder balls, etc. The thermal resistance Rja is obtained through comprehensive simulation of the thermal model of the material. However, the above method is an estimation and evaluation method, and there is a certain error between the environment used in the simulation and the actual application environment. For example, chips are generally soldered on a printed circuit board (PCB), and the thermal resistance is affected by the PCB material and stacking layers, resulting in errors.
2、使用专业仪器T3STER测量，利用芯片体二极管，测量体二极管的温度/电压(K系数)，对芯片施加热电流源，动态电压测试得到多组二极管电压，与K系数拟合得到芯片结温，减去环境温度得到温升，除以功耗得到热阻。这种方法使用了专业仪器进行测量，测试成本高。2. Use a professional instrument T3STER to measure, use the chip body diode to measure the temperature/voltage (K coefficient) of the body diode, apply a thermal current source to the chip, and obtain multiple sets of diode voltages through dynamic voltage testing, and get the chip junction temperature by fitting with the K coefficient , minus the ambient temperature to get the temperature rise, divided by the power dissipation to get the thermal resistance. This method uses professional instruments for measurement, and the test cost is high.
发明内容Contents of the invention
本发明的目的是提供一种热阻的测试系统与测试方法，其可利用多个功耗模式下的安全芯片内部的温度告警模块告警时的环境温度值及相应的芯片实际功耗，简单且有效地确定安全芯片的平均热阻，并且，该测试系统的成本较低。The purpose of the present invention is to provide a thermal resistance test system and test method, which can use the ambient temperature value and the corresponding chip actual power consumption when the temperature alarm module inside the safety chip in multiple power consumption modes is alarmed, simple and convenient. The average thermal resistance of the security chip is effectively determined, and the cost of the test system is low.
为了实现上述目的，本发明第一方面提供一种热阻的测试系统，所述测试系统包括：可控恒温箱，用于提供多个功耗模式下的安全芯片工作的环境温度；温度采集模块，用于调控所述可控恒温箱提供的环境温度，并采集所述多个功耗模式下的所述安全芯片的温度告警模块发出告警时的多个最低环境温度；示波器，用于采集所述多个最低环境温度下的所述安全芯片的多个实际功耗；以及热阻确定模块，用于根据所述多个最低环境温度和所述多个实际功耗，确定所述安全芯片的平均热阻。In order to achieve the above object, the first aspect of the present invention provides a thermal resistance test system, the test system includes: a controllable thermostat box, used to provide the ambient temperature of the safety chip in multiple power consumption modes; a temperature acquisition module , for regulating the ambient temperature provided by the controllable thermostat, and collecting multiple minimum ambient temperatures when the temperature alarm module of the safety chip in the multiple power consumption modes sends out an alarm; the oscilloscope is used for collecting all A plurality of actual power consumptions of the security chip at the plurality of minimum ambient temperatures; and a thermal resistance determining module, configured to determine the plurality of actual power consumptions of the security chip according to the plurality of minimum ambient temperatures and the plurality of actual power consumptions average thermal resistance.
优选地，所述多个功耗模式包括以下各项中的至少两者：低功耗模式、中度功耗模式、高功耗模式及特高功耗模式。Preferably, the plurality of power consumption modes include at least two of the following: a low power consumption mode, a medium power consumption mode, a high power consumption mode and an extremely high power consumption mode.
优选地，所述温度采集模块包括：第一调控单元，用于在所述多个功耗模式中的任一功耗模式下的所述温度告警模块未发出告警的情况下，控制升高所述可控恒温箱提供的环境温度；以及第一采集单元，用于将所述任一功耗模式下的所述温度告警模块首次发出告警时的环境温度确定为所述任一功耗模式下的所述温度告警模块发出告警时的最低环境温度。Preferably, the temperature acquisition module includes: a first regulation unit, configured to control the temperature increase by the The ambient temperature provided by the controllable incubator; and a first acquisition unit, configured to determine the ambient temperature when the temperature alarm module in any power consumption mode sends out an alarm for the first time as being in any power consumption mode The minimum ambient temperature when the temperature alarm module sends out an alarm.
优选地，所述控制升高所述可控恒温箱提供的环境温度包括：以第一温变速率控制升高所述可控恒温箱提供的环境温度。Preferably, the controlling to increase the ambient temperature provided by the controllable thermostat includes: controlling to increase the ambient temperature provided by the controllable thermostat at a first temperature change rate.
优选地，所述温度采集模块包括：第二调控单元，用于在所述多个功耗模式中的任一功耗模式下的所述温度告警模块发出告警的情况下，控制降低所述可控恒温箱提供的环境温度；以及第二采集单元，用于将所述任一功耗模式下的所述温度告警模块最后发出告警时的环境温度确定为所述任一功耗模式下的所述温度告警模块发出告警时的最低环境温度。Preferably, the temperature acquisition module includes: a second regulating unit, configured to control to reduce the possible The ambient temperature provided by the thermostat box; and the second acquisition unit is used to determine the ambient temperature when the temperature alarm module in any power consumption mode finally issued an alarm as the temperature in any power consumption mode. The minimum ambient temperature when the above-mentioned temperature alarm module sends out an alarm.
优选地，所述控制降低所述可控恒温箱提供的环境温度包括：以第二温变速率控制降低所述可控恒温箱提供的环境温度。Preferably, the controlling to reduce the ambient temperature provided by the controllable thermostat includes: controlling to reduce the ambient temperature provided by the controllable thermostat at a second temperature change rate.
优选地，在所述多个功耗模式包括低功耗模式、中度功耗模式、高功耗模式及特高功耗模式的情况下，所述热阻确定模块包括：第一热阻确定单元，用于根据与所述低功耗模式相对应的最低环境温度与实际功耗及与所述中度功耗模式相对应的最低环境温度与实际功耗，确定所述安全芯片的第一热阻；第二热阻确定单元，用于根据与所述中度功耗模式相对应的最低环境温度与实际功耗及与所述高功耗模式相对应的最低环境温度与实际功耗，确定所述安全芯片的第二热阻；第三热阻确定单元，用于根据与所述高功耗模式相对应的最低环境温度与实际功耗及与所述特高功耗模式相对应的最低环境温度与实际功耗，确定所述安全芯片的第三热阻；以及平均热阻确定单元，用于根据所述第一热阻、所述第二热阻及所述第三热阻，确定所述安全芯片的平均热阻。Preferably, when the plurality of power consumption modes include low power consumption mode, medium power consumption mode, high power consumption mode and ultra-high power consumption mode, the thermal resistance determination module includes: a first thermal resistance determination A unit, configured to determine the first value of the security chip according to the lowest ambient temperature and actual power consumption corresponding to the low power consumption mode and the lowest ambient temperature and actual power consumption corresponding to the medium power consumption mode thermal resistance; a second thermal resistance determination unit, configured to use the lowest ambient temperature and actual power consumption corresponding to the moderate power consumption mode and the lowest ambient temperature and actual power consumption corresponding to the high power consumption mode, Determine the second thermal resistance of the security chip; the third thermal resistance determination unit is used to determine the minimum ambient temperature corresponding to the high power consumption mode and the actual power consumption and the temperature corresponding to the ultra-high power consumption mode a minimum ambient temperature and actual power consumption, determining a third thermal resistance of the security chip; and an average thermal resistance determining unit, configured to, according to the first thermal resistance, the second thermal resistance, and the third thermal resistance, The average thermal resistance of the security chip is determined.
优选地，所述温度采集模块为第一逻辑电路。Preferably, the temperature acquisition module is a first logic circuit.
优选地，所述热阻确定模块为第二逻辑电路。Preferably, the thermal resistance determining module is a second logic circuit.
通过上述技术方案，本发明创造性地通过可控恒温箱提供多个功耗模式下的安全芯片工作的环境温度；然后通过温度采集模块调控所述可控恒温箱提供的环境温度，并采集所述多个功耗模式下的所述安全芯片的温度告警模块发出告警时的多个最低环境温度；接着通过示波器采集所述多个最低环境温度下的所述安全芯片的多个实际功耗；最后通过热阻确定模块根据所述多个最低环境温度和所述多个实际功耗，确定所述安全芯片的平均热阻，由此，本发明可利用多个功耗模式下的安全芯片内部的温度告警模块告警时的环境温度值及相应的芯片实际功耗，简单且有效地确定安全芯片的平均热阻，并且，该测试系统的成本较低。Through the above technical solution, the present invention creatively provides the ambient temperature for the safety chip to work in multiple power consumption modes through the controllable thermostat; then regulates the ambient temperature provided by the controllable thermostat through the temperature acquisition module, and collects the Multiple minimum ambient temperatures when the temperature alarm module of the safety chip in multiple power consumption modes sends out an alarm; then collect multiple actual power consumptions of the security chip under the multiple minimum ambient temperatures through an oscilloscope; finally The average thermal resistance of the security chip is determined by the thermal resistance determination module according to the plurality of minimum ambient temperatures and the plurality of actual power consumption, thus, the present invention can utilize the internal thermal resistance of the security chip in multiple power consumption modes The ambient temperature value and the corresponding chip actual power consumption when the temperature alarm module alarms can simply and effectively determine the average thermal resistance of the security chip, and the cost of the test system is low.
本发明第二方面提供一种热阻的测试方法，所述测试方法可包括：通过可控恒温箱提供多个功耗模式下的安全芯片工作的环境温度；通过温度采集模块调控所述可控恒温箱提供的环境温度，并采集所述多个功耗模式下的所述安全芯片的温度告警模块发出告警时的多个最低环境温度；通过示波器采集所述多个最低环境温度下的所述安全芯片的多个实际功耗；以及通过热阻确定模块根据所述多个最低环境温度和所述多个实际功耗，确定所述安全芯片的平均热阻。The second aspect of the present invention provides a thermal resistance test method, the test method may include: providing the ambient temperature of the safety chip in multiple power consumption modes through a controllable thermostat; The ambient temperature provided by the incubator, and collect multiple minimum ambient temperatures when the temperature alarm module of the safety chip in the multiple power consumption modes sends out an alarm; collect the multiple minimum ambient temperatures under the multiple minimum ambient temperatures through an oscilloscope. A plurality of actual power consumptions of the security chip; and determining an average thermal resistance of the security chip according to the plurality of minimum ambient temperatures and the plurality of actual power consumptions through a thermal resistance determination module.
有关本发明提供的热阻的测试方法的具体细节及益处可参阅上述针对热阻的测试系统的描述，于此不再赘述。For the specific details and benefits of the thermal resistance testing method provided by the present invention, please refer to the above-mentioned description of the thermal resistance testing system, which will not be repeated here.
本发明的其它特征和优点将在随后的具体实施方式部分予以详细说明。Other features and advantages of the present invention will be described in detail in the detailed description that follows.
附图说明Description of drawings
附图是用来提供对本发明实施例的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明实施例，但并不构成对本发明实施例的限制。在附图中：The accompanying drawings are used to provide a further understanding of the embodiments of the present invention, and constitute a part of the specification, and are used together with the following specific embodiments to explain the embodiments of the present invention, but do not constitute limitations to the embodiments of the present invention. In the attached picture:
图1是本发明一实施例提供的热阻的测试系统的结构示意图；以及Fig. 1 is a schematic structural view of a thermal resistance test system provided by an embodiment of the present invention; and
图2是本发明一实施例提供的可控恒温箱的结构示意图；以及Fig. 2 is a schematic structural view of a controllable thermostat provided by an embodiment of the present invention; and
图3是本发明一实施例提供的热阻的测试方法的流程图。FIG. 3 is a flowchart of a thermal resistance testing method provided by an embodiment of the present invention.
具体实施方式Detailed ways
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
考虑到现有的芯片热阻的测试方法产生的误差大，或者需要采用成本高的专业仪器进行测试，本发明提出了一种成本低、简便且精确度高的测试方法。Considering that the existing chip thermal resistance testing method produces large errors, or needs to use high-cost professional instruments for testing, the present invention proposes a low-cost, simple and high-precision testing method.
具体地，本发明各个实施例仅需要配置可控恒温箱、示波器、温度采集模块(例如，逻辑电路)及热阻确定模块(例如，逻辑电路)这四个常见的实验室仪器或电路，并结合安全芯片内部的温度告警模块，来测试不同功耗模式下的温度告警模块告警时的最低环境温度及芯片实际功耗；然后根据测试得到的多组最低环境温度及芯片实际功耗，确定芯片的平均功耗。Specifically, each embodiment of the present invention only needs to configure four common laboratory instruments or circuits, a controllable incubator, an oscilloscope, a temperature acquisition module (for example, a logic circuit) and a thermal resistance determination module (for example, a logic circuit), and Combine the temperature alarm module inside the security chip to test the minimum ambient temperature and the actual power consumption of the chip when the temperature alarm module is in different power consumption modes; average power consumption.
图1是本发明一实施例提供的热阻的测试系统的结构示意图。如图1所示，所述测试系统包括：可控恒温箱10，用于提供多个功耗模式下的安全芯片工作的环境温度；温度采集模块20，用于调控所述可控恒温箱提供的环境温度，并采集所述多个功耗模式下的所述安全芯片的温度告警模块发出告警时的多个最低环境温度；示波器30，用于采集所述多个最低环境温度下的所述安全芯片的多个实际功耗；以及热阻确定模块40，用于根据所述多个最低环境温度和所述多个实际功耗，确定所述安全芯片的平均热阻。FIG. 1 is a schematic structural diagram of a thermal resistance testing system provided by an embodiment of the present invention. As shown in Figure 1, the test system includes: a
其中，所述温度采集模块20可为第一逻辑电路。Wherein, the
其中，所述热阻确定模块40可为第二逻辑电路。Wherein, the thermal
其中，所述多个功耗模式可包括以下各项中的至少两者：低功耗模式、中度功耗模式、高功耗模式及特高功耗模式。Wherein, the plurality of power consumption modes may include at least two of the following items: low power consumption mode, medium power consumption mode, high power consumption mode and extremely high power consumption mode.
安全芯片在所述低功耗模式、所述中度功耗模式、所述高功耗模式及所述特高功耗模式下的实际功耗逐渐增大。当然，具体功耗模式的数量可根据芯片的功耗而定，功耗较大的芯片可设置更多的模式，由此可在安全芯片的更多功耗区间内计算芯片散热的热阻，并求平均，以使计算结果更为准确。The actual power consumption of the security chip in the low power consumption mode, the medium power consumption mode, the high power consumption mode and the super high power consumption mode gradually increases. Of course, the number of specific power consumption modes can be determined according to the power consumption of the chip. Chips with higher power consumption can set more modes, so that the thermal resistance of the chip heat dissipation can be calculated in more power consumption ranges of the security chip. And take the average to make the calculation result more accurate.
测试前，将安全芯片1固定在印制电路板(PCB)2上，并接通电源(VCC)和地(GND)，然后，将其置于可控恒温箱10中，如图2所示。Before the test, the
在一实施例中，所述温度采集模块20可包括：第一调控单元，用于在所述多个功耗模式中的任一功耗模式下的所述温度告警模块未发出告警的情况下，控制升高所述可控恒温箱提供的环境温度；以及第一采集单元，用于将所述任一功耗模式下的所述温度告警模块首次发出告警时的环境温度确定为所述任一功耗模式下的所述温度告警模块发出告警时的最低环境温度。In an embodiment, the
具体地，所述控制升高所述可控恒温箱提供的环境温度可包括：以第一温变速率控制升高所述可控恒温箱提供的环境温度。Specifically, the controlling to increase the ambient temperature provided by the controllable thermostat may include: controlling to increase the ambient temperature provided by the controllable thermostat at a first temperature change rate.
例如，可通过以下步骤1-2测量模式1(例如，低功耗模式)下的芯片的温度告警模块发出告警时的最低环境温度。For example, the minimum ambient temperature when the temperature alarm module of the chip in mode 1 (eg, low power consumption mode) issues an alarm can be measured through the following steps 1-2.
步骤1：将安全芯片1设置工作在模式1(例如，低功耗模式)下，设置可控恒温箱10的温度为初始值(如50℃)。待温度稳定，启动芯片的温度告警模块进行检测。Step 1: Set the
步骤2：若温度告警模块未发出告警(即未触发结温上限告警)，则按照0.5℃/分钟的温变速率缓慢提高可控恒温箱10的工作温度，直至芯片的温度告警模块告警，记录首次告警时的环境温度TDH1(即模式1下的最低环境温度)，记录芯片的各电源的电压和电流，以得到实际功耗P1。Step 2: If the temperature alarm module does not issue an alarm (that is, the junction temperature upper limit alarm is not triggered), slowly increase the operating temperature of the
在一实施例中，所述温度采集模块20可包括：第二调控单元，用于在所述多个功耗模式中的任一功耗模式下的所述温度告警模块发出告警的情况下，控制降低所述可控恒温箱提供的环境温度；以及第二采集单元，用于将所述任一功耗模式下的所述温度告警模块最后发出告警时的环境温度确定为所述任一功耗模式下的所述温度告警模块发出告警时的最低环境温度。In an embodiment, the
具体地，所述控制降低所述可控恒温箱提供的环境温度可包括：以第二温变速率控制降低所述可控恒温箱提供的环境温度。Specifically, the controlling to reduce the ambient temperature provided by the controllable thermostat may include: controlling to reduce the ambient temperature provided by the controllable thermostat at a second temperature change rate.
例如，可通过以下步骤1-2测量模式1(例如，低功耗模式)下的芯片的温度告警模块发出告警时的最低环境温度。For example, the minimum ambient temperature when the temperature alarm module of the chip in mode 1 (eg, low power consumption mode) issues an alarm can be measured through the following steps 1-2.
步骤1：将安全芯片1设置工作在模式1(例如，低功耗模式)下，设置可控恒温箱10的温度为初始值(如50℃)。待温度稳定，启动芯片的温度告警模块进行检测。Step 1: Set the
步骤2：若温度告警模块发出告警(即触发结温上限告警)，则按照0.5℃/分钟的温变速率缓慢降低可控恒温箱10的工作温度，直至芯片的温度告警模块不再告警，记录最后告警时的环境温度TDH1(即模式1下的最低环境温度)，记录芯片的各电源的电压和电流，以得到实际功耗P1。Step 2: If the temperature alarm module issues an alarm (i.e. triggers an upper junction temperature alarm), then slowly lower the operating temperature of the
可通过与上述类似的过程测量模式2(例如，中度功耗模式)下的芯片的温度告警模块发出告警时的最低环境温度TDH2及芯片的实际功耗P2。The minimum ambient temperature TDH2 and the actual power consumption P2 of the chip when the temperature alarm module of the chip in mode 2 (eg, medium power consumption mode) sends out an alarm can be measured through a process similar to the above.
可通过与上述类似的过程测量模式3(例如，高功耗模式)下的芯片的温度告警模块发出告警时的最低环境温度TDH3及芯片的实际功耗P3。The minimum ambient temperature TDH3 and the actual power consumption P3 of the chip when the temperature alarm module of the chip in mode 3 (for example, high power consumption mode) issues an alarm can be measured through a process similar to the above.
可通过与上述类似的过程测量模式4(例如，特高功耗模式)下的芯片的温度告警模块发出告警时的最低环境温度TDH4及芯片的实际功耗P4。The lowest ambient temperature TDH4 and the actual power consumption P4 of the chip when the temperature alarm module of the chip in mode 4 (for example, ultra-high power consumption mode) sends out an alarm can be measured through a process similar to the above.
在所述多个功耗模式包括低功耗模式、中度功耗模式、高功耗模式及特高功耗模式的情况下，所述热阻确定模块可包括：第一热阻确定单元，用于根据与所述低功耗模式相对应的最低环境温度与实际功耗及与所述中度功耗模式相对应的最低环境温度与实际功耗，确定所述安全芯片的第一热阻；第二热阻确定单元，用于根据与所述中度功耗模式相对应的最低环境温度与实际功耗及与所述高功耗模式相对应的最低环境温度与实际功耗，确定所述安全芯片的第二热阻；第三热阻确定单元，用于根据与所述高功耗模式相对应的最低环境温度与实际功耗及与所述特高功耗模式相对应的最低环境温度与实际功耗，确定所述安全芯片的第三热阻；以及平均热阻确定单元，用于根据所述第一热阻、所述第二热阻及所述第三热阻，确定所述安全芯片的平均热阻。When the plurality of power consumption modes include a low power consumption mode, a moderate power consumption mode, a high power consumption mode, and an extra high power consumption mode, the thermal resistance determination module may include: a first thermal resistance determination unit, For determining the first thermal resistance of the security chip according to the lowest ambient temperature and actual power consumption corresponding to the low power consumption mode and the lowest ambient temperature and actual power consumption corresponding to the medium power consumption mode The second thermal resistance determination unit is used to determine the minimum ambient temperature and actual power consumption corresponding to the moderate power consumption mode and the minimum ambient temperature and actual power consumption corresponding to the high power consumption mode. The second thermal resistance of the security chip; the third thermal resistance determination unit, used for according to the minimum ambient temperature corresponding to the high power consumption mode and the actual power consumption and the minimum environment corresponding to the ultra-high power consumption mode temperature and actual power consumption to determine a third thermal resistance of the security chip; and an average thermal resistance determination unit configured to determine the third thermal resistance according to the first thermal resistance, the second thermal resistance, and the third thermal resistance The average thermal resistance of the above security chip.
例如，首先，根据与所述低功耗模式相对应的最低环境温度TDH1与实际功耗P1、与所述中度功耗模式相对应的最低环境温度TDH2与实际功耗P2及下式，确定所述安全芯片的第一热阻Rja1，For example, first, according to the lowest ambient temperature TDH1 corresponding to the low power consumption mode and the actual power consumption P1, the lowest ambient temperature TDH2 corresponding to the medium power consumption mode and the actual power consumption P2, and the following formula, determine The first thermal resistance Rja1 of the security chip,
Rja1＝(TDH2-TDH1)/(P2-P1)。Rja1=(TDH2-TDH1)/(P2-P1).
其次，根据与所述中度功耗模式相对应的最低环境温度TDH2与实际功耗P2、与所述高功耗模式相对应的最低环境温度TDH3与实际功耗P3及下式，确定所述安全芯片的第二热阻Rja2，Secondly, according to the lowest ambient temperature TDH2 corresponding to the moderate power consumption mode and the actual power consumption P2, the lowest ambient temperature TDH3 corresponding to the high power consumption mode and the actual power consumption P3 and the following formula, determine the The second thermal resistance Rja2 of the security chip,
Rja2＝(TDH3-TDH2)/(P3-P2)。Rja2=(TDH3-TDH2)/(P3-P2).
接着，根据与所述高功耗模式相对应的最低环境温度TDH3与实际功耗P3、与所述特高功耗模式相对应的最低环境温度TDH4与实际功耗P4及下式，确定所述安全芯片的第三热阻Rja3，Next, according to the lowest ambient temperature TDH3 corresponding to the high power consumption mode and the actual power consumption P3, the lowest ambient temperature TDH4 corresponding to the ultra-high power consumption mode and the actual power consumption P4, and the following formula, determine the The third thermal resistance Rja3 of the security chip,
Rja3＝(TDH4-TDH3)/(P4-P3)。Rja3=(TDH4-TDH3)/(P4-P3).
最后，根据所述第一热阻Rja1、所述第二热阻Rja2、所述第三热阻Rja3及下式，确定所述安全芯片的平均热阻Rja，Finally, according to the first thermal resistance Rja1, the second thermal resistance Rja2, the third thermal resistance Rja3 and the following formula, determine the average thermal resistance Rja of the security chip,
Rja＝(Rja1+Rja2+Rja3)/3。Rja=(Rja1+Rja2+Rja3)/3.
当然，上述前三步骤也可同时执行。另外，对于芯片的功耗较大的情况，芯片可根据功耗设置更多种功耗模式，然后参照上文描述的过程类似地执行，以确定芯片的温度告警模块告警时的最低环境温度TDHn及芯片的实际功耗Pn，并参照上述四个公式类似地计算芯片的平均热阻。Of course, the first three steps above can also be executed simultaneously. In addition, for the case where the power consumption of the chip is large, the chip can set more power consumption modes according to the power consumption, and then perform similarly with reference to the process described above to determine the minimum ambient temperature TDHn when the chip's temperature alarm module alarms And the actual power consumption Pn of the chip, and similarly calculate the average thermal resistance of the chip with reference to the above four formulas.
具体而言，可根据以下步骤1-9确定芯片的平均热阻。Specifically, the average thermal resistance of the chip can be determined according to the following steps 1-9.
步骤1：将安全芯片1固定在印制电路板(PCB)2上，并接通电源(VCC)和地(GND)，然后，将其置于可控恒温箱10中，如图2所示。Step 1: Fix the
步骤2：将安全芯片1设置工作在模式1(例如，低功耗模式)下，设置可控恒温箱10的温度为初始值(如50℃)。Step 2: Set the
步骤3：待温度稳定，启动安全芯片1的温度告警模块进行检测。Step 3: After the temperature is stable, start the temperature alarm module of the
步骤4-1：若温度告警模块未发出告警(即未触发结温上限告警)，则按照0.5℃/分钟的温变速率缓慢提高可控恒温箱10的工作温度，直至芯片温度告警模块告警，记录首次告警时的环境温度TDH1(即模式1下的最低环境温度)，记录安全芯片的各电源的电压和电流，以得到实际功耗P1。Step 4-1: If the temperature alarm module does not issue an alarm (that is, the junction temperature upper limit alarm is not triggered), slowly increase the operating temperature of the
步骤4-2：若温度告警模块发出告警(即触发结温上限告警)，则按照0.5℃/分钟的温变速率缓慢降低可控恒温箱10的工作温度，直至芯片的温度告警模块不再告警，记录最后告警时的环境温度TDH1(即模式1下的最低环境温度)，记录安全芯片的各电源的电压和电流，以得到实际功耗P1。Step 4-2: If the temperature alarm module issues an alarm (that is, triggers an upper junction temperature alarm), then slowly lower the operating temperature of the
需要注意的是，可执行步骤4-1与步骤4-2中的任一者。It should be noted that any one of step 4-1 and step 4-2 may be performed.
步骤5：将安全芯片1设置工作在模式2(例如，中度功耗模式)下，设置可控恒温箱10的温度为初始值(如50℃)，并参照步骤4-1或4-2执行，以记录芯片的温度告警模块告警时的环境温度TDH2(即模式2下的最低环境温度)，记录芯片的各电源的电压和电流，以得到实际功耗P2。Step 5: Set the
步骤6：将安全芯片1设置工作在模式3(例如，高功耗模式)下，设置可控恒温箱10的温度为初始值(如50℃)，并参照步骤4-1或4-2执行，以记录芯片的温度告警模块告警时的环境温度TDH3(即模式3下的最低环境温度)，记录芯片的各电源的电压和电流，以得到实际功耗P3。Step 6: Set the
步骤7：将安全芯片1设置工作在模式4(例如，特高功耗模式)下，设置可控恒温箱10的温度为初始值(如50℃)，并参照步骤4-1或4-2执行，以记录芯片的温度告警模块告警时的环境温度TDH4(即模式4下的最低环境温度)，记录芯片的各电源的电压和电流，以得到实际功耗P4。Step 7: Set the
步骤8：按照以下三个公式推导出芯片三组热阻值。Step 8: According to the following three formulas, deduce the three sets of thermal resistance values of the chip.
Rja1＝(TDH2-TDH1)/(P2-P1)；Rja1=(TDH2-TDH1)/(P2-P1);
Rja2＝(TDH3-TDH2)/(P3-P2)；以及Rja2=(TDH3-TDH2)/(P3-P2); and
Rja3＝(TDH4-TDH3)/(P4-P3)。Rja3=(TDH4-TDH3)/(P4-P3).
步骤9：确定安全芯片1的平均热阻Rja＝(Rja1+Rja2+Rja3)/3。Step 9: Determine the average thermal resistance Rja=(Rja1+Rja2+Rja3)/3 of the
本实施例利用了安全芯片的温度告警模块的告警功能，设置四种功耗模式，采集温度告警模块产生告警时的最低环境温度值；利用这四种功耗模式对应的实际功耗和对应环境温度值，计算得到芯片的平均热阻值。由于设置了四种模式，故可便于在三种功耗区间内计算芯片散热的热阻，并求平均，以使计算结果更为准确。This embodiment utilizes the alarm function of the temperature alarm module of the security chip, sets four power consumption modes, and collects the minimum ambient temperature value when the temperature alarm module generates an alarm; utilizes the actual power consumption corresponding to these four power consumption modes and the corresponding environment The temperature value is calculated to obtain the average thermal resistance value of the chip. Since four modes are set, it is convenient to calculate the heat dissipation thermal resistance of the chip in the three power consumption ranges and average them to make the calculation results more accurate.
需要注意的是，安全芯片通常不包括传感器和AD采样器，故无法通过直接测试方式获取安全芯片的热阻。It should be noted that the security chip usually does not include sensors and AD samplers, so the thermal resistance of the security chip cannot be obtained through direct testing.
综上所述，本发明创造性地通过可控恒温箱提供多个功耗模式下的安全芯片工作的环境温度；然后通过温度采集模块调控所述可控恒温箱提供的环境温度，并采集所述多个功耗模式下的所述安全芯片的温度告警模块发出告警时的多个最低环境温度；接着通过示波器采集所述多个最低环境温度下的所述安全芯片的多个实际功耗；最后通过热阻确定模块根据所述多个最低环境温度和所述多个实际功耗，确定所述安全芯片的平均热阻，由此，本发明可利用多个功耗模式下的安全芯片内部的温度告警模块告警时的环境温度值及相应的芯片实际功耗，简单且有效地确定安全芯片的平均热阻，并且，该测试系统的成本较低。To sum up, the present invention creatively provides the ambient temperature for the safety chip to work in multiple power consumption modes through the controllable thermostat; then regulates the ambient temperature provided by the controllable thermostat through the temperature acquisition module, and collects the Multiple minimum ambient temperatures when the temperature alarm module of the safety chip in multiple power consumption modes sends out an alarm; then collect multiple actual power consumptions of the security chip under the multiple minimum ambient temperatures through an oscilloscope; finally The average thermal resistance of the security chip is determined by the thermal resistance determination module according to the plurality of minimum ambient temperatures and the plurality of actual power consumption, thus, the present invention can utilize the internal thermal resistance of the security chip in multiple power consumption modes The ambient temperature value and the corresponding chip actual power consumption when the temperature alarm module alarms can simply and effectively determine the average thermal resistance of the security chip, and the cost of the test system is low.
图3是本发明一实施例提供的热阻的测试方法的流程图。如图3所示，所述测试方法可包括：步骤S301，通过可控恒温箱提供多个功耗模式下的安全芯片工作的环境温度；步骤S302，通过温度采集模块调控所述可控恒温箱提供的环境温度，并采集所述多个功耗模式下的所述安全芯片的温度告警模块发出告警时的多个最低环境温度；步骤S303，通过示波器采集所述多个最低环境温度下的所述安全芯片的多个实际功耗；以及步骤S304，通过热阻确定模块根据所述多个最低环境温度和所述多个实际功耗，确定所述安全芯片的平均热阻。FIG. 3 is a flowchart of a thermal resistance testing method provided by an embodiment of the present invention. As shown in Figure 3, the test method may include: step S301, providing the ambient temperature of the safety chip in multiple power consumption modes through a controllable thermostat; step S302, regulating the controllable thermostat through a temperature acquisition module Provide the ambient temperature, and collect multiple minimum ambient temperatures when the temperature alarm module of the safety chip in the multiple power consumption modes sends out an alarm; Step S303, collect all the minimum ambient temperatures under the multiple minimum ambient temperatures through an oscilloscope. multiple actual power consumptions of the security chip; and step S304, determine the average thermal resistance of the security chip according to the multiple minimum ambient temperatures and the multiple actual power consumptions through the thermal resistance determining module.
有关本发明提供的热阻的测试方法的具体细节及益处可参阅上述针对热阻的测试系统的描述，于此不再赘述。For the specific details and benefits of the thermal resistance testing method provided by the present invention, please refer to the above-mentioned description of the thermal resistance testing system, which will not be repeated here.
以上结合附图详细描述了本发明的优选实施方式，但是，本发明并不限于上述实施方式中的具体细节，在本发明的技术构思范围内，可以对本发明的技术方案进行多种简单变型，这些简单变型均属于本发明的保护范围。The preferred embodiment of the present invention has been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the specific details of the above embodiment, within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, These simple modifications all belong to the protection scope of the present invention.
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本发明对各种可能的组合方式不再另行说明。In addition, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way if there is no contradiction. The combination method will not be described separately.
本领域技术人员可以理解实现上述实施例方法中的全部或部分步骤是可以通过程序来指令相关的硬件来完成，该程序存储在一个存储介质中，包括若干指令用以使得单片机、芯片或处理器(processor)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。Those skilled in the art can understand that all or part of the steps in the method of the above-mentioned embodiments can be completed by instructing the relevant hardware through a program. (processor) executes all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program codes. .
此外，本发明的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明的思想，其同样应当视为本发明所公开的内容。In addition, various combinations of different embodiments of the present invention can also be combined arbitrarily, as long as they do not violate the idea of the present invention, they should also be regarded as the disclosed content of the present invention.
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