Semiconductor laser with adjustable monitoring current and packaging methodTechnical Field
The invention relates to a semiconductor laser with adjustable monitoring current and a packaging method, and belongs to the technical field of semiconductor laser packaging.
Background
Compared with lasers in other forms such as solid, gas and liquid, the semiconductor laser has rapid technical development since birth, and gradually enters into daily life of people in various fields such as process processing, communication interconnection, sensing measurement, consumption entertainment and the like by virtue of the advantages of small volume, high efficiency, simple structure, good reliability and the like. In many application scenes, the semiconductor laser is required to work for a long time and output light power is stable, so that the light output power of the semiconductor laser is required to be monitored, and long-term continuous stable output of the semiconductor laser is ensured.
In order to cooperate with the semiconductor laser driving circuit, the magnitude of the monitoring current under the rated power needs to be limited, if the monitoring current is higher, the monitoring current can impact the semiconductor laser driving circuit to damage the semiconductor laser, and if the monitoring current is lower, the monitoring current can not be used, and the change of the light output power of the semiconductor laser can not be monitored.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the semiconductor laser with the adjustable monitoring current, the PD chip is arranged in the semiconductor laser, the back cavity surface of the laser chip is received by the PD chip to leak light, the monitoring current is generated by sensitization, the change of the light-emitting power of the semiconductor laser is confirmed according to the monitoring current, the monitoring current can be adjusted, and the normal use of the semiconductor laser is ensured while the monitoring effect is ensured.
The invention also provides a packaging method of the semiconductor laser with the adjustable monitoring current.
The technical scheme of the invention is as follows:
The utility model provides a monitor current adjustable semiconductor laser, includes laser instrument and PD chip, is provided with the PD chip in the laser instrument, receives laser instrument chip back cavity face light leak through the PD chip, sensitization produces monitor current.
Preferably, the laser comprises a tube seat, a laser chip and a transitional heat sink, a tube tongue is arranged on the tube seat, the transitional heat sink is arranged on the tube tongue, the laser chip is sintered on the transitional heat sink, the light emitting surface of the laser chip faces upwards, the rear cavity faces downwards, a PD chip is arranged on the tube seat at the lower side of the laser chip, and the PD chip and the laser chip are connected with a driving circuit through gold wires in an external mode. The monitoring current information of the PD chip is received through an external driving circuit.
Further preferably, an adjusting cap is arranged on the tube seat, light leakage of the rear cavity surface of the laser chip is shielded by the adjusting cap, so that the light leakage area received by the PD chip is adjusted, and the monitoring current is adjusted.
Preferably, the adjusting cap comprises a cap body and a shielding sheet, the cap body is an annular cylinder, the shielding sheet is arranged on the cap body, and the cap body is sleeved on the pipe tongue.
Further preferably, the pipe seat on the opposite side of the pipe tongue is provided with an arc-shaped positioning protrusion, and the cap body is positioned through the pipe tongue and the arc-shaped positioning protrusion, so that the cap body is prevented from shaking.
Preferably, 2 grooves are formed in the cap body, and when the cap is used, the 2 grooves are always located between 3 notches in the tube seat, and interference between the shielding sheet and the laser chip, the transitional heat sink or the gold wire is avoided by limiting the cap body.
Preferably, the shielding sheet is an arc-shaped sheet or a conical sheet. The light leakage of the rear cavity surface of the laser chip is shielded by the shielding sheet.
Preferably, the cap height is less than the laser chip height, such that the shutter blade is between the laser chip and the PD chip.
The packaging method of the semiconductor laser with the adjustable monitoring current comprises the following operation steps:
(1) Placing an adjusting cap on the pipe tongue, and connecting the semiconductor laser with a driving circuit;
(2) The adjusting cap is rotated, the light leakage shielding area of the shielding sheet on the rear cavity surface of the laser chip is adjusted, the shielding area is increased, the light leakage of the rear cavity surface of the laser chip received by the PD chip is reduced, the monitoring current is reduced, the shielding area is reduced, the light leakage of the rear cavity surface of the laser chip received by the PD chip is increased, and the monitoring current is increased;
(3) After adjusting the monitoring current to a set value, fixing the adjusting cap on the tube seat through energy storage welding or laser welding to complete packaging.
The invention has the beneficial effects that:
1. According to the invention, the PD chip is arranged in the semiconductor laser, the PD chip is used for receiving light leakage of the rear cavity surface of the laser chip, the monitoring current is generated by sensitization, the change of the light-emitting power of the semiconductor laser is confirmed according to the monitoring current, the monitoring current can be regulated, and the normal use of the semiconductor laser is ensured while the monitoring effect is ensured.
2. According to the invention, the monitoring current is adjusted by the adjusting cap, so that the difference of the monitoring currents of the semiconductor lasers is reduced, and the parameter consistency is improved.
3. The invention has simple structure and low cost, and can be rapidly popularized and applied to production.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of PD chip installation of the present invention;
FIG. 3 is a schematic view of the structure of the adjusting cap of the present invention;
FIG. 4 is a diagram of the installation process of the present invention;
FIG. 5 is a schematic view of the shading of the adjustment cap of the present invention;
FIG. 6 is a schematic view of the adjustment cap of the present invention rotated;
The LED light source comprises a laser, an adjusting cap, a tube seat, a laser chip, a transitional heat sink, a PD chip, a gold wire, a tube tongue, an arc-shaped positioning protrusion, a groove, a shielding sheet, a cap body, a notch, a light leakage and a light leakage.
Detailed Description
The invention will now be further illustrated by way of example, but not by way of limitation, with reference to the accompanying drawings.
Example 1:
As shown in fig. 1-6, the embodiment provides a semiconductor laser with adjustable monitoring current, which comprises a laser 1 and a PD chip 6, wherein the PD chip 6 is arranged in the laser 1, and the PD chip is used for receiving light leakage from the rear cavity surface of the laser chip, and generating the monitoring current by sensitization.
The laser 1 comprises a tube seat 3, a laser chip 4 and a transition heat sink 5, a tube tongue 8 is arranged on the tube seat 3, the transition heat sink 5 is arranged on the tube tongue 8, the laser chip 4 is sintered on the transition heat sink 5, the light emitting surface of the laser chip 4 faces upwards, the rear cavity faces downwards, a PD chip 6 is arranged on the tube seat 3 at the lower side of the laser chip 4, and the PD chip 6 and the laser chip 4 are all externally connected with a driving circuit through gold wires 7. The monitoring current information of the PD chip is received through an external driving circuit.
The adjusting cap 2 is arranged on the tube seat 3, and light leakage of the rear cavity surface of the laser chip is shielded by the adjusting cap 2, so that the area of the light leakage 14 received by the PD chip is adjusted, and the monitoring current is adjusted.
The adjusting cap 2 comprises a cap body 12 and a shielding sheet 11, wherein the cap body 12 is an annular cylinder, the shielding sheet 11 is arranged on the cap body 12, and the cap body is sleeved on the pipe tongue.
The shielding sheet 11 is an arc-shaped sheet. The light leakage of the rear cavity surface of the laser chip is shielded by the shielding sheet.
The packaging method of the semiconductor laser with the adjustable monitoring current comprises the following operation steps:
(1) Placing an adjusting cap on the pipe tongue, and connecting the semiconductor laser with a driving circuit;
(2) The adjusting cap is rotated, the light leakage shielding area of the shielding sheet on the rear cavity surface of the laser chip is adjusted, the shielding area is increased, the light leakage of the rear cavity surface of the laser chip received by the PD chip is reduced, the monitoring current is reduced, the shielding area is reduced, the light leakage of the rear cavity surface of the laser chip received by the PD chip is increased, and the monitoring current is increased;
(3) After adjusting the monitoring current to a set value, fixing the adjusting cap on the tube seat through energy storage welding or laser welding to complete packaging.
Example 2:
The semiconductor laser with adjustable monitoring current has the structure as in the embodiment 1, and is characterized in that an arc-shaped positioning protrusion 9 is arranged on a tube seat 3 at the opposite side of a tube tongue 8, and a cap body 12 is positioned through the tube tongue 8 and the arc-shaped positioning protrusion 9, so that the cap body is prevented from shaking.
Example 3:
The semiconductor laser with the adjustable monitoring current is structurally characterized in that 2 grooves 10 are formed in a cap body 12, and when the semiconductor laser is used, the 2 grooves 10 are always located between 3 notches 13 in a tube seat 3, and interference between a shielding sheet and a laser chip, a transitional heat sink or gold wires is avoided by limiting the cap body.
Example 4:
A semiconductor laser with an adjustable monitor current is structured as described in embodiment 1, except that the shielding sheet 11 is a tapered sheet. The light leakage of the rear cavity surface of the laser chip is shielded by the shielding sheet.
The cap 12 is smaller than the laser chip 4 in height so that the shutter is between the laser chip and the PD chip.