High-density high-efficiency high-power solid-state componentTechnical Field
The invention relates to the technical field of electric communication, in particular to a high-density high-efficiency high-power solid-state component.
Background
Most of the current high-power solid-state component designs adopt a power synthesis technology, and the traditional high-power solid-state component designs generally have the following defects:
1. a plurality of power channels are generally adopted to directly synthesize on a microstrip line or spatially synthesize after microstrip to waveguide, but when the microstrip line is involved in a synthesis network, the synthesis schemes introduce extra insertion loss, and the amplitude consistency and the phase consistency among the channels are deteriorated, so that the synthesis efficiency of a high-power solid-state component is reduced;
2. the multiple power channels are generally distributed in the same cavity or designed back to back, so that the isolation between the power channels and the power synthesis stages are poor, the product performance is unstable and is easy to self-excite, and the assembly flow of the product is complex, the debugging difficulty is high, and the mass production is not facilitated;
3. in order to protect the final power amplifier of each channel from being damaged due to load traction, an isolator is respectively added at the rear part of the final power amplifier of each channel, the isolator is usually a surface mount device such as a microstrip isolator, a MEMS isolator and the like, the insertion loss, the isolation degree and other indexes of the isolator are poor in k frequency bands, and the problem of the amplitude inconsistency and the phase inconsistency of each channel can be caused by respectively adding the isolator after the final power amplifier, so that the synthesis efficiency of the component is further deteriorated;
4. the design is usually separated from the primary power circuit and is independent, namely the high-power solid-state component and the primary power circuit are mutually independent, thus increasing the volume, the weight and the complexity of interconnection between products of the system, and bringing a series of problems of connector interconnection, a complex cable network, voltage drop amount, reliability and the like;
5. because of complex synthetic network, control signals, secondary power supply and other factors, the heat flow channel below the power channel shell is generally destroyed in structural design, so that the actual thermal resistance of the power amplifier chip is increased, the heat dissipation of the high-power solid-state component is not facilitated, the key power chip of the high-power solid-state component is burnt in a special application environment, and the reliability of the high-power solid-state component is reduced.
Disclosure of Invention
The invention provides a high-density high-efficiency high-power solid-state component, which aims to solve the problems of low synthesis efficiency, high debugging difficulty and poor reliability of the existing solid-state component, and adopts a power synthesis scheme of a waveguide coaxial probe structure, so that a passive circuit of the whole component is of a waveguide structure, namely a waveguide power divider, a one-to-four power distribution network, a four-in-one power synthesis network, a waveguide isolator and a waveguide switch at an input end, and the deterioration of the power synthesis efficiency due to microstrip lines is avoided; compared with the traditional high-power assembly, the invention modularizes the power synthesis channels, improves the isolation degree and amplitude consistency among the channels, is beneficial to mass production and debugging of products, further reduces the development cost of the assembly and brings considerable economic benefit; the invention designs the power circuit and the primary power circuit integrally, and carries out innovative heat dissipation design and structural design aiming at a key heat source, thereby realizing high integration and high-efficiency heat dissipation of the high-power solid-state component; finally, the invention adopts the design scheme of main and standby cold backup, thereby effectively improving the redundancy and reliability of the high-power solid-state component.
The invention provides a high-density high-efficiency high-power solid-state component, which comprises a high-power component, wherein the high-power component is used for synthesizing multi-channel power of radio frequency signals and outputting high-power signals;
the high-power assembly comprises a power distribution network, a first waveguide coaxial probe structure, a power amplification module, a second waveguide coaxial probe structure and a power synthesis network which are sequentially connected, wherein the power distribution network and the power synthesis network are both passive waveguide structures;
the first waveguide coaxial probe structure and the second waveguide coaxial probe structure are waveguide coaxial probes, the first waveguide coaxial probe structure comprises a first waveguide structure and a T-shaped glass bead needle which partially stretches into a cavity of the first waveguide structure, and the diameter of one end of the T-shaped glass bead needle is larger than that of the other end of the T-shaped glass bead needle;
the T-shaped glass bead needle is connected with the power amplifying module.
The invention relates to a high-density high-efficiency high-power solid-state component, which is characterized in that a first waveguide structure comprises a first waveguide structure body and a square groove arranged in the center of the broadside of the first waveguide structure body, wherein the square groove and the small diameter of a T-shaped glass bead needle form an air coaxial structure;
the first waveguide structure is matched with the broadband by adjusting the length and the diameter of the T-shaped glass bead needle;
the second waveguide coaxial probe structure is configured in the same manner as the first waveguide coaxial probe structure.
The high-density high-efficiency high-power solid-state assembly comprises at least two power amplification assemblies which are arranged in parallel, wherein one end of each power amplification assembly is connected with a first waveguide coaxial probe structure, the other end of each power amplification assembly is connected with a second waveguide coaxial probe structure, and each power amplification module is sealed.
According to the high-density high-efficiency high-power solid-state component, the number of the power amplifier components corresponds to the number of the first waveguide structures in a preferred mode, and each power amplifier component is packaged independently;
the radio frequency input port and the radio frequency output port of the power amplifier assembly are both positioned in the horizontal direction of the power amplifier assembly and are collinear, a video connector used for providing positive and negative power supplies, control signals and ground signals is arranged below the power amplifier assembly, the video connector is sealed with a shell of the power amplifier assembly through welding, a video connector terminal inside the power amplifier assembly is connected with a printed board through gold wire bonding, the video connector terminal outside the power amplifier assembly is welded with the shell of the power amplifier assembly, and the shell of the power amplifier assembly is connected with a cover plate through welding.
The invention relates to a high-density high-efficiency high-power solid-state component, which is characterized in that a power distribution network comprises at least two power distribution waveguides and a power distribution bridge connected with the power distribution waveguides, wherein the power distribution bridge is an E-shaped waveguide bridge, one power distribution bridge connects the two power distribution waveguides into a one-to-two power distribution network in a cascading manner, and a first waveguide structure is connected with the power distribution waveguides;
the power synthesis network comprises at least two power synthesis waveguides, a power synthesis bridge connected with the power synthesis waveguides and an isolation end power load arranged at the tail end of the power synthesis bridge, the power synthesis bridge is an E-shaped waveguide bridge, one power synthesis bridge reversely cascades the two power synthesis waveguides into two power distribution networks and one power distribution network, and a waveguide structure in the coaxial probe structure of the second waveguide is connected with the power synthesis waveguide;
the isolated end of the power distribution bridge is also provided with an isolated end power load.
The high-density high-efficiency high-power solid-state component provided by the invention also comprises a waveguide isolator which is electrically connected with the output end of the power synthesis network, wherein the waveguide isolator is used for keeping the loss and amplitude consistency of each channel.
The high-density high-efficiency high-power solid-state component provided by the invention also comprises a high-power component shell, and the high-power component is packaged independently through the high-power component shell. The high-density high-efficiency high-power solid-state component is characterized in that a high-power component shell comprises a power circuit cavity, a shell layer and a power cavity which are sequentially arranged from top to bottom, and the power cavity is arranged on the back surface of the high-power component shell;
the high-power assembly further comprises a primary power circuit which is arranged in the power cavity and used for providing power and control signals for the power amplification module;
the power distribution network, the first waveguide coaxial probe structure, the power amplification module, the second waveguide coaxial probe structure and the power synthesis network are arranged in the power circuit cavity;
the primary power supply circuit comprises a primary power supply circuit left and a primary power supply circuit right, wherein the primary power supply circuit left and the primary power supply circuit right respectively provide power and control signals for the power amplification module, and the primary power supply circuit left and the primary power supply circuit right are identical in circuit;
the shell layer is provided with an L-shaped blind hole for connecting the power amplification module and the primary power supply circuit, and the L-shaped blind hole starts from a non-heat source of the power amplification module, extends vertically downwards to the shell layer and then extends from the horizontal direction to the power supply cavity to be connected with the primary power supply circuit.
According to the high-density high-efficiency high-power solid-state component, as an optimal mode, the number of the high-power components is 2, and the two high-power components are mutually cold-backed up;
the solid-state component also comprises a power divider electrically connected with the input ends of the two parallel high-power components and electrically connected with the output ends of the two high-power components, the power divider is of a waveguide T-shaped junction structure, and the waveguide switch is a switch of either type.
The high-density high-efficiency high-power solid-state component is characterized in that a power distribution network is a one-to-four network, a power amplification module comprises four power amplification components, and a power synthesis network is a four-in-one network.
The technical scheme of the invention is as follows: the technical scheme of realizing multi-channel power synthesis by adopting a waveguide coaxial probe structure is that space synthesis of four power channels is realized in a standard waveguide cavity, and a novel waveguide coaxial probe is used for replacing the traditional microstrip synthesis scheme, so that insertion loss of a microstrip line in power synthesis is avoided; the design scheme of modularization of the plurality of power channels is adopted, the plurality of power channels are designed into a common power module, so that the single power module is convenient to debug and screen, the high isolation among the channels is realized, and the mass production and the debugging of the power modules are ensured; the two-stage 3dB waveguide bridge cascade is adopted to realize a power distribution network and a power synthesis network with low insertion loss and high amplitude phase consistency, so that insertion loss introduced before and after power synthesis and amplitude phase inconsistency among channels are reduced; by adopting the scheme of multiplexing and then total port isolation, the problems of insertion loss and amplitude-phase inconsistency caused by the separate isolation of each power channel are avoided, and the high isolation performance of the waveguide isolator is utilized to ensure that the high-power solid-state component is not influenced by load traction; the integrated design scheme of the power circuit and the primary power circuit is adopted, and the innovative heat dissipation design and structural design are carried out aiming at a key heat source, so that the high integration and high-efficiency heat dissipation of the high-power solid-state component are realized; by adopting the design scheme of main and standby cold backup, two independent high-power components are connected in parallel and work in a time-sharing mode, and the channel selection of the main and standby high-power components is realized by combining the power divider at the input end and the waveguide switch at the output end, so that the redundancy and reliability of the device are improved. The specific solution scheme is as follows:
(1) The invention adopts the waveguide coaxial probe structure to realize multi-channel power synthesis, integrates the waveguide, the waveguide coaxial probe structure and the power module, replaces the traditional microstrip synthesis by utilizing the novel waveguide coaxial probe structure, and realizes compact design and high-efficiency synthesis of the k-frequency band high-power solid-state component; the waveguide is a standard waveguide BJ220; the coaxial probe is a novel T-shaped glass bead, and the diameter of the T-shaped glass bead needle is firstly thick and then thin; the wall thickness of the waveguide wall between the T-shaped glass bead needle and the waveguide cavity is 0.5mm, a square groove is formed in the center of the wide edge of the waveguide, 50 omega air is coaxial between the square groove and the small diameter of the T-shaped glass bead needle, and the wide-band matching of k frequency bands is realized by adjusting the length and the diameter of the large diameter and the small diameter of the T-shaped glass bead needle; the power synthesis scheme of the waveguide coaxial probe adopted by the invention has good standing wave and insertion loss in the whole k frequency bands, the problem of inconsistent amplitude phase among channels caused by standing wave difference is avoided, and the low insertion loss ensures the efficient synthesis of the waveguide coaxial probe.
(2) The invention adopts a modularized design scheme of a plurality of power channels, and designs the plurality of power channels as a common power module; the radio frequency input and output ports of the power module are all made of novel T-shaped glass beads, the glass beads and the module shell are welded, and a T-shaped glass bead needle is arranged outside the power module and extends into the waveguide cavity to form a waveguide coaxial probe; the radio frequency input and output ports of the power module are positioned in the horizontal direction of the power module and are collinear, and a video connector is arranged below the power module and used for providing positive and negative power supplies, control signals and ground signals; the video connector and the power module shell are arranged in a welding mode, the video connector has sealing property, a video connector terminal inside the module and the printed board are connected in a gold wire bonding mode, and a video connector terminal outside the module is in a welding mode; the shell and the cover plate of the power module are welded, so that the power module has airtight property; the power channel modularization design scheme adopted by the invention can ensure the amplitude-phase consistency among the power channels through later-stage debugging, has the characteristics of air tightness and high isolation among the channels, and is suitable for mass production of power modules.
(3) The invention adopts two-stage 3dB waveguide bridge cascade to realize a power distribution network and a power synthesis network with low insertion loss and high amplitude phase consistency; by utilizing the characteristics of low insertion loss and high amplitude consistency of the 3dB waveguide bridge, the first-stage waveguide bridge realizes one-to-two power distribution and two-in-one power synthesis, and the second-stage waveguide bridge realizes one-to-four power distribution and four-in-one power synthesis; the input port of the one-to-four power distribution network is a standard waveguide port, and the output port and the T-shaped glass beads form a waveguide coaxial probe; the input port of the four-in-one power synthesis network and the T-shaped glass beads form a waveguide coaxial probe, and the output port is a standard waveguide port; the invention adopts two-stage waveguide bridge cascade to realize one-to-four power distribution and four-in-one power synthesis, has the performance of low insertion loss and high-amplitude consistency among four channels, and provides a passive basis for high-efficiency power synthesis.
(4) The invention adopts a scheme of multiplexing and total port isolation, and comprises a one-to-four power distribution network, a power module, a four-in-one power synthesis network, a waveguide coaxial probe structure and a waveguide isolator; the waveguide coaxial probe structure adopted by the invention can provide good standing wave conditions in the whole k frequency band, so that the output power of the power amplifier of each branch is maximized, and the high-amplitude consistency of a four-in-one power distribution network and a four-in-one power synthesis network is combined, so that the waveguide coaxial probe structure has higher space synthesis efficiency; compared with the conventional isolators, such as microstrip isolators and MEMS isolators, the waveguide isolator has very excellent insertion loss, isolation and power resistance indexes, can reduce the power loss after power synthesis, and can ensure that the power assembly is not influenced by output load traction.
(5) The invention adopts the design scheme of integrating the power circuit and the primary power circuit, and carries out innovative heat dissipation design and structural design aiming at a key heat source, thereby realizing high integration and high-efficiency heat dissipation of the high-power solid-state component; the high-power assembly is divided into three layers in the height direction, namely a power circuit layer, an assembly shell and a primary power supply layer, wherein cavities are dug on the front side and the back side of the assembly shell by the power circuit and the primary power supply circuit, and the power circuit and the primary power supply circuit are embedded into the assembly shell for installation; the integrated design of the power circuit and the primary power circuit is realized by integrating the power circuit and the primary power circuit in the height direction, so that the integration level of the high-power component is improved; in order to solve the contradiction between high-power component heat dissipation and cable network interconnection caused by high integration level, the invention designs a structure slotting form of punching an L-shaped blind hole on a component shell, namely, slotting downwards from the height direction to the middle of the shell structure at a non-heat source position of a power circuit layer, and slotting into a power cavity in the horizontal direction, so that the wire interconnection of a power circuit and a primary power circuit is realized, the heat dissipation surface below a key heat source is not damaged, and the heat dissipation capacity of the high-power component is effectively improved.
(6) The invention adopts the design scheme that two independent high-power components are connected in parallel and combined with a power divider at the input end and a switch at the output end to realize that the two high-power components are mutually cold-backed up; the power divider at the input end adopts a waveguide T-shaped junction structure to realize one-to-two power distribution, and the two-to-one switch is a waveguide switch with low insertion loss and high reliability, so that the redundancy and reliability of the high-power solid-state component are effectively improved.
The principle of the scheme is as follows: the high-power solid-state component adopts a design scheme of main and standby cold backup and mainly comprises a one-to-two power divider at an input end, two high-power components connected in parallel and a waveguide switch; the two parallel high-power components are completely consistent in interior and are composed of a one-to-four power distribution network, a waveguide coaxial probe structure, a power module, a four-in-one power synthesis network, an isolator and a primary power supply circuit. The high-power solid-state component divides the power of a radio frequency input signal into two paths after passing through a one-to-two power divider at an input end, the two paths of the power are respectively sent to two parallel high-power components, a one-to-four power distribution network in the high-power components divides the power of 1 path of the radio frequency signal into 4 paths of radio frequency signals with equal amplitude and 90 DEG phase difference, the radio frequency signals are sent to 4 power modules after passing through a waveguide coaxial probe structure, the power modules amplify the radio frequency signals, the radio frequency signals are spatially synthesized in a waveguide through the waveguide coaxial probe structure and a four-in-one power synthesis network, the synthesized high-power signals enter a two-to-one waveguide switch after passing through a waveguide isolator, and the waveguide switch is used for switching and outputting the synthesized high-power signals; the primary power supply circuit transforms a +42V voltage signal into +5V, -5V and +20V voltages, and the +5V, -5V and +20V voltages are provided for 4 power modules after passing through a voltage distribution network.
The invention has the following advantages:
the invention adopts the power synthesis scheme of the waveguide coaxial probe structure, so that the passive circuit of the whole assembly is of a waveguide structure, namely, the waveguide power divider, the one-to-four power distribution network, the four-in-one power synthesis network, the waveguide isolator and the waveguide switch at the input end are all of a waveguide structure, thereby avoiding the deterioration of the power synthesis efficiency due to the microstrip line; compared with the traditional high-power assembly, the invention modularizes the power synthesis channels, improves the isolation degree and amplitude consistency among the channels, is beneficial to mass production and debugging of products, further reduces the development cost of the assembly and brings considerable economic benefit; the invention designs the power circuit and the primary power circuit integrally, and carries out innovative heat dissipation design and structural design aiming at a key heat source, thereby realizing high integration and high-efficiency heat dissipation of the high-power solid-state component; finally, the invention adopts the design scheme of main and standby cold backup, thereby effectively improving the redundancy and reliability of the high-power solid-state component.
Drawings
FIG. 1 is a schematic block diagram of a high density, high efficiency, high power solid state module;
FIG. 2a is a one-to-four power distribution network layout of a high density, high efficiency, high power solid state component;
FIG. 2b is a high density, high efficiency, high power solid state component quarter power distribution network layout;
FIG. 3 is an assembly diagram of a high density, high efficiency, high power solid state assembly power module and waveguide coaxial probe;
FIG. 4a is a front assembly view of a high-power solid state component with high density, high efficiency and high power;
FIG. 4b is a backside assembly view of a high-power solid state component with high density, high efficiency and high power;
FIG. 5 is an assembly drawing of a high-power solid state component with high density, high efficiency and high power.
Reference numerals:
1. a high power component; 11. a power distribution network; 111. a power distribution waveguide; 112. a power distribution bridge; 12. a first waveguide coaxial probe structure; 121. a first waveguide structure; 1211. a first waveguide structure body; 1212. a square groove; 122. t-shaped glass bead needle; 13. a power amplification module; 14. a second waveguide coaxial probe structure; 15. a power combining network; 151. a power combining waveguide; 152. a power combining bridge; 153. isolating the end power load; 16. a waveguide isolator; 17. a high power component housing; 171. an L-shaped blind hole; 18. a primary power supply circuit; 181. the primary power supply circuit is left; 182. the right side of the primary power supply circuit; 2. a power divider; 3. waveguide switch.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Example 1
As shown in fig. 1 to 5, a high-density high-efficiency high-power solid-state component comprises a high-power component 1, wherein the high-power component 1 is used for synthesizing radio frequency signals by multi-channel power and outputting high-power signals;
the high-power assembly 1 comprises a power distribution network 11, a first waveguide coaxial probe structure 12, a power amplification module 13, a second waveguide coaxial probe structure 14, a power synthesis network 15, a waveguide isolator 16 electrically connected with the output end of the power synthesis network 15, a high-power assembly shell 17 and a primary power circuit 18 arranged in a power cavity of the high-power assembly shell 17 and used for providing power and control signals for the power amplification module 13, wherein the power distribution network 11 and the power synthesis network 15 are of passive waveguide structures;
the power distribution network 11 comprises at least two power distribution waveguides 111 and a power distribution bridge 112 connected to the power distribution waveguides 111, the power distribution bridge 112 is an E-shaped waveguide bridge, one power distribution bridge 112 connects the two power distribution waveguides 111 in cascade into a split-two power distribution network, and the first waveguide structure 121 is connected to the power distribution waveguides 111;
the first waveguide coaxial probe structure 12 and the second waveguide coaxial probe structure 14 are waveguide coaxial probes, the first waveguide coaxial probe structure 12 comprises a first waveguide structure 121 and a T-shaped glass bead needle 122 which partially stretches into a cavity of the first waveguide structure 121, and one end diameter of the T-shaped glass bead needle 122 is larger than the other end diameter;
the T-shaped glass bead needle 122 is connected with the power amplification module 13;
the first waveguide structure 121 comprises a first waveguide structure body 1211 and a square groove 1212 arranged in the center of the wide edge of the first waveguide structure body 1211, wherein the square groove 1212 and the small diameter of the T-shaped glass bead needle 122 form an air coaxial;
matching the first waveguide structure 121 with the broadband by adjusting the length and diameter of the T-shaped bead needle 122;
the second waveguide coaxial probe structure 14 is configured in the same manner as the first waveguide coaxial probe structure 12;
the power amplification modules 13 comprise at least two power amplification components 131 which are arranged in parallel, one end of each power amplification component 131 is connected with the first waveguide coaxial probe structure 12, the other end of each power amplification component is connected with the second waveguide coaxial probe structure 14, and each power amplification module 13 is sealed;
the number of the power amplifier components 131 corresponds to that of the first waveguide structures 121, and each power amplifier component 131 is packaged independently;
the radio frequency input port and the radio frequency output port of the power amplifier assembly 131 are both positioned in the horizontal direction of the power amplifier assembly 131 and are collinear, a video connector for providing positive and negative power supplies, control signals and ground signals is arranged below the power amplifier assembly 131, the video connector is sealed with the shell of the power amplifier assembly 131 through welding, a video connector terminal inside the power amplifier assembly 131 is connected with a printed board through gold wire bonding, a video connector terminal outside the power amplifier assembly 131 is welded with the shell of the power amplifier assembly 131, and the shell of the power amplifier assembly 131 is connected with a cover plate through welding;
the power synthesis network 15 includes at least two power synthesis waveguides 151, a power synthesis bridge 152 connected to the power synthesis waveguides 151, and an isolation end power load 153 disposed at the end of the power synthesis bridge 152, where the power synthesis bridge 152 is an E-shaped waveguide bridge, and one power synthesis bridge 152 reversely cascades the two power synthesis waveguides 151 into two and one power distribution network, and the waveguide structure in the second waveguide coaxial probe structure 14 is connected to the power synthesis waveguides 151, and the isolation end of the power distribution bridge 112 is also provided with the isolation end power load 153;
the isolator 16 is used to maintain loss and amplitude consistency for each channel;
the high-power assembly 1 is individually packaged by a high-power assembly shell 17;
the high-power assembly shell 17 comprises a power circuit cavity, a shell layer and a power cavity which are sequentially arranged from top to bottom, and the power cavity is arranged on the back surface of the high-power assembly shell 17;
the power distribution network 11, the first waveguide coaxial probe structure 12, the power amplification module 13, the second waveguide coaxial probe structure 14 and the power combining network 15 are arranged in the power circuit cavity;
the primary power supply circuit 18 comprises a primary power supply circuit left 181 and a primary power supply circuit right 182, the primary power supply circuit left 181 and the primary power supply circuit right 182 respectively provide power and control signals for the power amplification module 13, and the primary power supply circuit left 181 and the primary power supply circuit right 182 are the same in circuit;
the shell layer is provided with an L-shaped blind hole 171 for connecting the power amplification module 13 and the primary power supply circuit 18, and the L-shaped blind hole 171 starts from a non-heat source of the power amplification module 13, extends vertically downwards to the shell layer, extends from the horizontal direction to the power supply cavity and is connected with the primary power supply circuit 18;
the number of the high-power components 1 is 2, and the two high-power components 1 are mutually cold-backed up;
the solid-state component further comprises a power divider 2 electrically connected with the input ends of the two high-power components 1 arranged in parallel and a power divider 3 electrically connected with the output ends of the two high-power components 1, wherein the power divider 2 is of a waveguide T-shaped junction structure, and the waveguide switch 3 is a switch selected from two;
the power distribution network 11 is a divide-by-four network, the power amplification module 13 includes four power amplification components 131, and the power synthesis network 15 is a four-in-one network.
Example 2
The whole machine of the invention is shown in fig. 1, which is a schematic block diagram of the whole machine of the invention, and consists of a power divider 2, a one-to-four power distribution network 11, waveguide coaxial probe structures 12 and 14 and a power module 13 (the inside of the invention respectively comprises 4 power amplifier components 131, a four-in-one power synthesis network 15, a waveguide isolator 16, a waveguide switch 3 and a primary power supply circuit 18; except the power divider 2 and the waveguide switch 3 at the input end, the contents in fig. 1 are up and down symmetrical, namely main and standby high-power components respectively, and the two components are mutually cold backed up.
For convenience of explanation, the data stream signal of input 23GHz is exemplified in detail, and since the manner of processing the signal inside the main and standby high-power components is completely consistent, only the signal stream of the upper part in fig. 1 will be described later; firstly, a radio frequency small signal RFin with the frequency of 23GHz and the power of 5dBm enters a power divider 2 at an input end, and the power divider 2 divides the radio frequency signal power into 2 paths and respectively enters a main power component and a standby power component; after a 23GHz radio frequency small signal enters a four-in-one power distribution network 11, the signal power is divided into 4 paths of radio frequency signals with constant amplitude and 90 DEG phase difference, the 4 paths of radio frequency small signals are sent to a power module 13 through a waveguide coaxial probe structure 12, the power module 13 amplifies the 4 paths of radio frequency small signals into 4 paths of high-power signals with 40.2dBm output power, the 4 paths of high-power signals are spatially synthesized in a four-in-one power synthesis network 15 after passing through the waveguide coaxial probe structure 14, the high-power signals with 46dBm output power are synthesized, and the high-power signals are isolated in the direction of a waveguide isolator 16 and enter a waveguide switch 3 for main and standby radio frequency signal selection RFout; the primary power circuit 18 inputs the primary voltage +42v and the control signal TTLin, and after level conversion and control signal distribution, provides power and control signals of +5v, -5v, +20v and TTL to the power amplifier assembly 131, respectively.
As shown in fig. 2, the layout of the one-to-four power distribution network 11 and the four-in-one power synthesis network 15 of the present invention is shown; the one-to-four power distribution network 11 in fig. 2a and the four-in-one power synthesis network 15 in fig. 2b are both implemented by using a standard waveguide BJ220 111, the size of the standard waveguide BJ220 111 is 10.668mm by 4.318mm, the 3-order 3dB waveguide bridge 112 is formed by using an E-surface form, the 18 in fig. 2a and 2b is the isolated end power load of the 3-order 3dB waveguide bridge 112, and the two-stage 3-order 3dB waveguide bridge 112 is cascaded or reversely cascaded to form the one-to-four power distribution network 11 and the four-in-one power synthesis network 15; 1212 in fig. 2a, 2b is a square slot of 1.06mm open at the center of the waveguide broadside.
Referring to fig. 3, an assembly diagram of a power module and a waveguide coaxial probe according to the present invention includes a quarter-power distribution network 11, a waveguide coaxial probe structure 12, a power module 13, a waveguide coaxial probe structure 14, and a four-in-one power combining network 15; the power module 13 internally comprises 4 independent and completely consistent power amplifier components 131, the input end and the output end of the power amplifier components 131 adopt novel T-shaped glass beads 122, the T-shaped glass beads 122 and a groove 1212 above the waveguide wall of the standard waveguide BJ220 121 form an air coaxial, and then the air coaxial is stretched into the standard waveguide BJ220 121 to form a waveguide coaxial probe structure 12, and the T-shaped glass beads 122 are positioned in the center of the wide edge of the standard waveguide BJ220 121; a video connector is arranged below the power amplifier assemblies 131 and is connected with a primary power circuit, and power and control signals of +5V, -5V, +20V and TTL are provided for each power amplifier assembly 131; the 4 power amplifier components 131 are respectively embedded into the high-power component shell 17 and are mutually independent in space, so that the space isolation of the 4 power amplifier components 131 is ensured.
FIG. 4 is an assembly drawing of the high power assembly of the present invention; fig. 4a is a front side of a high power component, which is a power circuit, comprising a quarter-power distribution network 11, a waveguide coaxial probe structure 12, a power module 13, a waveguide coaxial probe structure 14, and a four-in-one power combining network 15; fig. 4b shows the back of the high-power module, which is a primary power circuit 18, comprising a primary power left 181 and a primary power right 182, wherein the circuits inside the primary power left 181 and the primary power right 182 are completely identical, the primary power left 181 provides power and control signals for the two power amplifier modules 131 below the power module 13, and the primary power right 182 provides power and control signals for the two power amplifier modules 131 above the power module 13. The power circuit and the primary power circuit of the high-power assembly are designed integrally by means of cavity digging, dislocation and the like on the high-power assembly shell 17.
In order to solve the contradiction between high-power component heat dissipation and cable network interconnection caused by high integration level, the invention designs a structure slotting form of punching L-shaped blind holes 171 on a high-power component shell 17, and 4L-shaped blind holes 171 are shared, so that the connection between 4 power amplifier components 131 and a primary power circuit is realized; the L-shaped blind holes 171 are dug downwards from the height direction at the non-heat source position of the power module 13 (the solid line part of 171) to the middle of the structure of the high-power assembly shell 17, and then dug the grooves into the primary power supply cavity (the dotted line part of 171) from the horizontal direction, so that the heat radiating surface below the key heat source of the power module 13 is not damaged, and the heat radiating capability of the high-power assembly is effectively improved.
Referring to fig. 5, an assembly diagram of the high-power solid-state component of the present invention is shown, and the assembly diagram is composed of a power divider 2, a high-power component main unit, a high-power component standby unit and a waveguide switch 3 at an input end; the power divider 2 at the input end is a pure passive waveguide device, and basically does not have faults in the use process; the waveguide switch 3 is a high-grade product selected by a nine-hospital 773, and the non-fault switching times are more than hundred thousand times; and two independent high-power components are connected in parallel, so that the redundancy and reliability of the high-power solid-state components are effectively improved.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.