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CN115347015B - Light-emitting element and display device - Google Patents

Light-emitting element and display device

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Publication number
CN115347015B
CN115347015BCN202211042259.3ACN202211042259ACN115347015BCN 115347015 BCN115347015 BCN 115347015BCN 202211042259 ACN202211042259 ACN 202211042259ACN 115347015 BCN115347015 BCN 115347015B
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China
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light
layer
emitting element
sub
metal
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CN115347015A (en
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王倩
李伟
孟宪芹
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Abstract

The invention discloses a light-emitting element and a display device, wherein a metal reflecting structure is arranged between a retaining wall structure and a light-emitting unit, and because the side wall (reflecting surface) of a first hollow structure of the metal reflecting structure is obliquely arranged relative to the light-emitting surface of the light-emitting unit, when divergent light rays emitted by the light-emitting unit are incident to the side wall (reflecting surface) of the first hollow structure, the side wall (reflecting surface) of the first hollow structure can enable more light rays to be emitted to a quantum dot color conversion film, so that the light utilization rate is greatly improved, and the light-emitting element with high light efficiency is obtained.

Description

Light-emitting element and display device
Technical Field
The present invention relates to the field of display technologies, and in particular, to a light emitting device and a display device.
Background
The luminescence spectrum of the Quantum Dot (QD) material has very narrow half-peak width, so the QD has potential application value in the photoluminescence display and electroluminescence display fields, and the QD has the advantages of good luminous efficacy, high luminous efficacy, low luminous efficacy, and low luminous efficacyLED (display of quantum dot and inorganic light emitting diode technology combined) is a typical representation of QD material photoluminescence display, but currently common QDsThe light emitting efficiency of the LED device is low.
Disclosure of Invention
The embodiment of the invention provides a light-emitting element and a display device, which are used for improving the light-emitting efficiency of the light-emitting element.
An embodiment of the present invention provides a light emitting element including:
a substrate base;
a plurality of light emitting units located on the substrate base plate;
the metal reflecting structure is positioned at one side of the light-emitting unit, which is far away from the substrate, and is provided with a plurality of first hollow structures, the orthographic projection of the light-emitting unit on the substrate is positioned in the orthographic projection range of the first hollow structure on the substrate, and the side wall of the first hollow structure is obliquely arranged relative to the light-emitting surface of the light-emitting unit;
The retaining wall structure is positioned at one side of the metal reflecting structure, which is away from the substrate, and is provided with a plurality of sub-pixel openings, the first hollowed-out structures are in one-to-one correspondence with the sub-pixel openings, and the orthographic projection of the first hollowed-out structures on the substrate is positioned in the orthographic projection range of the sub-pixel openings on the substrate;
And the quantum dot color conversion films are arranged in at least part of the sub-pixel openings.
Optionally, in the light emitting element provided by the embodiment of the present invention, the light emitting element further includes a connection layer located between the metal reflection structure and the retaining wall structure, and the connection layer fills the first hollow structure.
Optionally, in the light emitting element provided in the embodiment of the present invention, the metal reflection structure includes a plurality of reflection portions that are independently disposed around each of the light emitting units, the reflection portions have the first hollowed-out structure, and the connection layer further fills a gap between adjacent reflection portions.
Alternatively, in the light emitting element provided by the embodiment of the invention, the reflecting portion includes a body and a reflecting layer located between the body and the connection layer, the material of the body includes a resin, and the material of the reflecting layer includes ITO/Ag/ITO.
Optionally, in the light emitting element provided in the embodiment of the present invention, a cross-sectional shape of the body along a thickness direction of the substrate is a triangle, and an inner angle of the triangle pointing to the light emitting unit is an acute angle.
Optionally, in the light emitting element provided in the embodiment of the present invention, a sum of angles of the internal angle and an emission angle of the light emitting unit is less than 90 °.
Optionally, in the light emitting element provided by the embodiment of the invention, the light emitting element further includes a metal wire grid polarizer located at a side of the plurality of quantum dot color conversion films, which is away from the substrate, the metal wire grid polarizer includes a cover plate and a metal wire grid located at a side of the cover plate, which is away from the substrate, and the metal wire grid includes a plurality of metal wires arranged in parallel and at intervals.
Optionally, in the light emitting element provided by the embodiment of the present invention, the period of the metal wire grid is less than or equal to 120nm, the height of the metal wire is greater than or equal to 140nm, and the duty ratio of the metal wire grid is 0.35-0.5.
Optionally, in the light emitting element provided by the embodiment of the invention, the light emitting element further includes a metal bonding layer located between the connection layer and the retaining wall structure, wherein the metal bonding layer has a plurality of second hollow structures and metal bonding portions located between adjacent second hollow structures, and orthographic projection of the metal bonding portions on the substrate coincides with orthographic projection of the retaining wall structure on the substrate.
Alternatively, in the light emitting element provided In the embodiment of the present invention, the metal bonding portion includes a first Cu layer, an In layer, and a second Cu layer that are stacked.
Optionally, in the light emitting element provided by the embodiment of the present invention, the thicknesses of the first Cu layer and the second Cu layer are the same, and a ratio of the thickness of the first Cu layer to the thickness of the In layer is greater than 1.2:1.
Optionally, in the light emitting device provided by the embodiment of the present invention, the light emitting device further includes a flat layer filling the second hollow structure.
Optionally, in the light emitting element provided by the embodiment of the present invention, the light emitting element further includes a quantum dot packaging layer located between the metal bonding layer and the retaining wall structure, and the quantum dot packaging layer orthographically projects on the substrate to cover the substrate.
Optionally, in the light emitting element provided in the embodiment of the present invention, a material of the wall structure is a reflective material.
Optionally, in the light emitting element provided by the embodiment of the present invention, the light emitting color of the light emitting unit is blue, the sub-pixel opening includes a first sub-pixel opening, a second sub-pixel opening, and a third sub-pixel opening, the first sub-pixel opening is provided with the red quantum dot color conversion film, the second sub-pixel opening is provided with the green quantum dot color conversion film, and the third sub-pixel opening is filled with a resin material, and the resin material is provided with scattering particles therein.
Optionally, in the light emitting element provided by the embodiment of the present invention, the light emitting element further includes a light shielding layer and a color film layer located between the retaining wall structure and the cover plate, the light shielding layer has a plurality of through holes corresponding to the sub-pixel openings one by one, the color film layer includes a plurality of color resistors, and the color resistors and the quantum dot color conversion film are corresponding one by one and are located in the through holes respectively.
Optionally, in the light emitting element provided in the embodiment of the present invention, the light emitting unit includes a Mini LED or a Micro LED.
Correspondingly, the embodiment of the invention also provides a display device which comprises the light-emitting element provided by the embodiment of the invention.
The embodiment of the invention has the following beneficial effects:
according to the light-emitting element and the display device provided by the embodiment of the invention, the metal reflection structure is arranged between the retaining wall structure and the light-emitting unit, and the side wall (reflection surface) of the first hollow structure of the metal reflection structure is obliquely arranged relative to the light-emitting surface of the light-emitting unit, so that when divergent light rays emitted by the light-emitting unit are incident on the side wall (reflection surface) of the first hollow structure, more light rays can be emitted to the quantum dot color conversion film by the side wall (reflection surface) of the first hollow structure, the light utilization rate is greatly improved, and the light-emitting element with high light efficiency is obtained.
Drawings
Fig. 1 is a schematic structural diagram of a light emitting device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another light emitting device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another light emitting device according to an embodiment of the present invention;
FIG. 4 is a partial schematic view of the structure of FIG. 2;
FIG. 5 is a schematic diagram of several reflection paths of light emitted by a light emitting unit and incident on a metal wire grid polarizer;
FIG. 6A is a schematic diagram of transmission-type metal wire grid polarization;
FIG. 6B is a schematic plan view of a WGP;
fig. 6C is a reflection path A1 of the TE wave;
FIGS. 6D and 6E are top views of two reflected light;
FIG. 7A is a schematic plan view of the reflection path A2 in FIG. 5;
FIG. 7B is a top view of the reflected light;
FIG. 8 is a schematic plan view of three sub-pixel openings corresponding to FIGS. 1, 2 and 3;
FIG. 9 is a schematic diagram of a repeating arrangement of a plurality of the structures shown in FIG. 8;
fig. 10A and 10B are schematic views of luminance transitions corresponding to film thickness variations of red quantum dot color conversion films and green quantum dot color conversion films, respectively;
FIG. 11A is a schematic diagram of the structure of the metal Wire Grid Polarizer (WGP) of FIGS. 1-3;
FIG. 11B is a graph of the extinction ratio versus wavelength for WGPs for different wire-gate periods;
FIG. 11C is a graph showing the relationship between the WGP duty cycle, extinction ratio, and TM polarization transmittance;
FIG. 11D is a graph showing the relationship between groove depth, transmittance, extinction ratio for WGP;
FIG. 11E is a schematic diagram of the wire grid period and height of the metal wires of a metal wire grid versus the degree of polarization of a metal wire grid polarizer;
FIG. 12 is a schematic diagram of the relationship between the WGP duty cycle and the transmittance and polarization degree;
Fig. 13 is a schematic structural view of fabricating a metal reflective structure, a connection layer, and a light emitting unit on a sapphire substrate;
fig. 14A to 14M are schematic structural diagrams of a method for manufacturing a light emitting device according to an embodiment of the present invention after each step is performed;
fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. And embodiments of the disclosure and features of embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of the terms "comprising" or "includes" and the like in this disclosure is intended to cover an element or article listed after that term and equivalents thereof without precluding other elements or articles. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "inner", "outer", "upper", "lower", etc. are used merely to denote relative positional relationships, which may also change accordingly when the absolute position of the object to be described changes.
It should be noted that the dimensions and shapes of the various figures in the drawings do not reflect true proportions, and are intended to illustrate the present disclosure only. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
An embodiment of the present invention provides a light emitting element, as shown in fig. 1, including:
A substrate 1;
a plurality of light emitting units 2 on the substrate 1;
The metal reflection structure 3 is positioned at one side of the light-emitting unit 2, which is far away from the substrate 1, and the metal reflection structure 3 is provided with a plurality of first hollowed-out structures 301, the orthographic projection of the light-emitting unit 2 on the substrate 1 is positioned in the orthographic projection range of the first hollowed-out structures 301 on the substrate 1, and the side wall 31 (reflection surface) of the first hollowed-out structures 301 is obliquely arranged relative to the light-emitting surface 21 of the light-emitting unit 2;
The retaining wall structure 4 is positioned at one side of the metal reflecting structure 3, which is away from the substrate 1, the retaining wall structure 4 is provided with a plurality of sub-pixel openings (41, 42 and 43), the first hollowed-out structures 301 are in one-to-one correspondence with the sub-pixel openings (41, 42 and 43), and the orthographic projection of the first hollowed-out structures 301 on the substrate 1 is positioned in the orthographic projection range of the corresponding sub-pixel openings (41, 42 and 43) on the substrate 1;
a plurality of quantum dot color conversion films 5, wherein the quantum dot color conversion films 5 are disposed within at least part of the sub-pixel openings (e.g., 41 and 42).
According to the light-emitting element provided by the embodiment of the invention, the metal reflection structure is arranged between the retaining wall structure and the light-emitting unit, and the side wall (reflection surface) of the first hollow structure of the metal reflection structure is obliquely arranged relative to the light-emitting surface of the light-emitting unit, so that when divergent light rays emitted by the light-emitting unit are incident to the side wall (reflection surface) of the first hollow structure, more light rays can be emitted to the quantum dot color conversion film by the side wall (reflection surface) of the first hollow structure, the light utilization rate is greatly improved, and the light-emitting element with high light efficiency is obtained.
In a specific implementation, in the light emitting device provided by the embodiment of the present invention, as shown in fig. 1, the light emitting device further includes a connection layer 6 located between the metal reflective structure 3 and the retaining wall structure 4, where the connection layer 6 fills the first hollow structure 301. Specifically, the material of the connection layer 6 may be GaN.
In a specific implementation, in the light emitting element provided in the embodiment of the present invention, as shown in fig. 1, the metal reflective structure 3 may include a plurality of reflective portions 32 that are independently disposed around each light emitting unit 2, where the reflective portions 32 have a first hollowed-out structure 301, and the connection layer 6 further fills gaps between adjacent reflective portions 32, so as to ensure flatness of subsequent film layers.
In particular, in the light emitting element provided in the embodiment of the present invention, as shown in fig. 1, the entire reflecting portion 32 may be made of a reflective metal material, such as Ag, al, mo, or the like.
In particular, in the light emitting device provided in the embodiment of the present invention, as shown in fig. 2, the reflective portion 32 may include a body 321 and a reflective layer 322 located between the body 321 and the connection layer 6, the material of the body 321 may include a resin, and the material of the reflective layer 322 may be ITO/Ag/ITO, ITO/Al/ITO, ITO/Mo/ITO, or the like.
In a specific implementation, in the light emitting device provided in the embodiment of the present invention, as shown in fig. 2, the cross-sectional shape of the body 321 along the thickness direction of the substrate 1 may be a triangle, where the inner angle β pointing to the light emitting unit 2 is an acute angle, so as to ensure that the reflecting layer 322 is an inclined plane, so that the light emitted by the light emitting unit 2 is reflected to the quantum dot color conversion film 5 when entering the reflecting layer 322, thereby improving the light utilization rate.
Note that fig. 2 of the embodiment of the present invention is an example in which the cross-sectional shape of the body 321 along the thickness direction of the substrate 1 is triangular, and of course, the present invention is not limited thereto, and it is only necessary to ensure that the reflective layer 322 is disposed obliquely with respect to the light emitting surface of the light emitting unit 2.
In a specific implementation, in the light emitting element provided in the embodiment of the present invention, as shown in fig. 1 and fig. 2, the metal reflection structure 3 is exemplified by including a plurality of reflection portions 32 that are independently disposed around each light emitting unit 2, and of course, the metal reflection structure 3 may also be a grid-like structure, and as shown in fig. 3, the first hollow structure 301 is a mesh of the grid-like structure, and a side wall (reflection surface) of the mesh is disposed obliquely with respect to the light emitting surface of the light emitting unit 2.
It should be noted that, the metal reflective structure 3 in fig. 3 may be made of a reflective metal material, or may be a body made of a resin material, where the body has a first hollow structure, and then a reflective layer is formed on a sidewall of the first hollow structure of the body.
In a specific implementation, in the light emitting element provided in the embodiment of the present invention, as shown in fig. 1,2 and 3, the light emitting element further includes a metal wire grid polarizer 7 (Wire Grip Polarizer, WGP) located on a side of the plurality of quantum dot color conversion films 5 facing away from the substrate 1, where the metal wire grid polarizer 7 includes a cover plate 71 and a metal wire grid 72 located on a side of the cover plate 71 facing away from the substrate 1, and the metal wire grid 72 includes a plurality of metal wires 721 arranged in parallel and spaced apart. Specifically, when the light emitted from the light emitting unit 2 is incident on the wire grid polarizer 7, the incident light can be decomposed into light having a vibration direction parallel to the transmission direction (TM light perpendicular to the wire) and light having a vibration direction perpendicular to the transmission direction (TE light parallel to the wire), the TM wave exits, and the TE wave is reflected below the cover plate 71. For example, the TE wave is reflected to the inclined plane of the quantum dot color conversion film 5 or the metal reflection structure 3 to become secondary excitation light, so that the light utilization rate is greatly improved, and high light efficiency is obtained.
Specifically, the cover plate 71 may be a glass substrate.
In a specific implementation, in the light emitting element provided by the embodiment of the present invention, as shown in fig. 1,2 and 3, the light emitting element further includes a metal bonding layer 8 located between the connection layer 6 and the retaining wall structure 4, where the metal bonding layer 8 has a plurality of second hollow structures 801 and metal bonding portions 81 located between adjacent second hollow structures 801, and an orthographic projection of the metal bonding portions 81 on the substrate 1 coincides with an orthographic projection of the retaining wall structure 4 on the substrate 1. Specifically, the metal bonding layer 8 serves as a reflecting layer, for example, when the light reflected from the metal wire grid polarizer 7 is incident on the metal bonding layer 8, the metal bonding layer 8 can reflect the light to the quantum dot color conversion film 5 for excitation, so that more excitation light is further obtained, and the luminous efficiency is improved.
In particular, in the light emitting element provided In the embodiment of the present invention, as shown In fig. 1, 2 and 3, the metal bonding portion 81 may include a first Cu layer 811, an In layer 812 and a second Cu layer 813 that are stacked. Specifically, the first Cu layer 811 and the second Cu layer 813 mainly function to reflect and connect upper and lower film layers, and the In layer 812 mainly functions to connect the first Cu layer 811 and the second Cu layer 813.
In a specific implementation, in the light emitting device provided In the embodiment of the present invention, as shown In fig. 1, 2 and 3, the thicknesses of the first Cu layer 811 and the second Cu layer 813 may be the same, and the ratio of the thickness of the first Cu layer 811 to the thickness of the In layer 812 may be greater than 1.2:1, so that the first Cu layer 811 and the second Cu layer 813 have larger reflection surfaces, and the light utilization efficiency is further improved.
In a specific implementation, in the light emitting device provided in the embodiment of the present invention, as shown in fig. 1, 2 and 3, the light emitting device further includes a flat layer 9 filled with the second hollow structure 801, where the thickness of the flat layer 9 is the same as that of the metal bonding portion 81, and the material of the flat layer 9 may be resin.
In a specific implementation, in the light emitting element provided by the embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the light emitting element further includes a quantum dot packaging layer 10 located between the metal bonding layer 8 and the retaining wall structure 4, where the quantum dot packaging layer 10 is projected on the substrate 1 to cover the substrate 1, and the quantum dot packaging layer 10 is used to block external water vapor, and protect the quantum dot material in the quantum dot color conversion film 5 from contacting with water, oxygen, and so on, so as to improve stability and lifetime of the device. Specifically, the material of the quantum dot encapsulation layer 10 may be SiON.
In practical implementation, in the light emitting device provided in the embodiment of the present invention, as shown in fig. 2 and 4, fig. 4 is a schematic partial structure diagram of fig. 2, and the sum of the angle of the internal angle β and the light emitting angle α of the light emitting unit 2 is smaller than 90 °. Specifically, the light emitting angle α of the light emitting unit 2 refers to an angle between the light emitted by the light emitting unit 2 and the normal L perpendicular to the light emitting unit 2, and at this time, the light emitted by the light emitting unit 2 and larger than the angle α is reflected by the reflecting layer 322 and can enter the quantum dot color conversion film 5 for excitation, so as to obtain more excitation light.
As shown in fig. 4, the area of the light emitting unit 2 is S1, the area of the quantum dot color conversion film 5 is S2, the angular spectrum of the light emitting angle α of the light emitting unit 2 is from-90 ° to +90°, and how much angle of light enters the quantum dot color conversion film 5 is determined according to the area of the light emitting unit 2 being S1 and the area of the quantum dot color conversion film 5 being S2, and the height (e.g., 10.32 μm) of the intermediate film layers (the connection layer 6, the flat layer 9, and the quantum dot encapsulation layer 10). In the metal bonding layer 8, for example, the thickness of the first Cu layer and the second Cu layer is 2 μm, the thickness of the In layer is 1.32 μm, that is, the thickness of the metal bonding layer 8 is 5.32 μm, the thickness of the connection layer 6 is 4 μm, the thickness of the quantum dot encapsulation layer 10 is 1 μm, and the thickness of the planarization layer 9 and the thickness of the metal bonding layer 8 are the same. When s2=50 μm×50 μm, s1=20 μm×20 μm, the light emission angle α= ±56.3° incident on the quantum dot color conversion film 5 is as large as possible, so that more light emitted from the light emitting unit 2 enters the quantum dot color conversion film 5, and the light utilization efficiency is improved.
In practical implementation, in the light emitting element provided in the embodiment of the present invention, as shown in fig. 2 and 4, since the cross-sectional shape of the body 321 of the reflecting portion 32 along the thickness direction of the substrate 1 is a triangle, the internal angle β pointing to the light emitting unit 2 in the triangle is an acute angle, and the sum of the angle β and the angle α of the light emitting unit 2 is smaller than 90 °, it is assumed that the light emitting angle α=56.3°, that is, β <90 ° - α is required, at this time, the light emitted by the light emitting unit 2 and larger than the angle α is reflected by the reflecting layer 322, and can enter the quantum dot color conversion film 5 to be excited, so as to obtain much excitation light.
In a specific implementation, in the light emitting element provided in the embodiment of the present invention, as shown in fig. 1, 2 and 3, the material of the retaining wall structure 4 may be a reflective material. Therefore, when the light emitted by the light emitting unit 2 is incident to the retaining wall structure 4, the light can be reflected back, on one hand, the light can be prevented from penetrating through the retaining wall structure 4 and entering the adjacent sub-pixel openings, so that the problem of light crosstalk is further avoided, and on the other hand, the light incident to the retaining wall structure 4 can be reflected back, and the effect of enhancing the light emission can be realized on the basis of avoiding the light crosstalk.
Alternatively, the material of the retaining wall structure 4 may be KW-8826 (high acid value resin) which may have a reflectivity of 56% for 550nm light.
As shown in fig. 5, fig. 5 illustrates several possible reflection paths of the light emitted by the light emitting unit 2 and incident to the metal wire grid polarizer 7 by taking one light emitting unit 2 in the structure shown in fig. 1 as an example, TM waves are emitted, the TE waves may be reflected to the quantum dot color conversion film 5, the inclined plane of the metal reflecting structure 3 or the first Cu layer and the second Cu layer of the metal bonding layer 8, and become secondary excitation light, so that the light utilization rate is greatly improved, and high light efficiency is obtained, wherein the path A1 is that the TE waves are reflected to the quantum dots in the quantum dot color conversion film 5 and then excite the quantum dots again to emit light, the path A2 is that the TE waves are reflected to the Cu layer of the metal bonding layer 8 and then reflected to the retaining wall structure 4, the incident light is reflected to the quantum dot color conversion film 5 again to excite the quantum dots to emit light, the path A3 is reflected to the inclined plane of the retaining wall structure 3, and the light utilization rate of the metal reflecting structure 3 is greatly improved, and the light utilization rate of the three-level quantum dots is greatly improved due to the fact that the light is reflected to the three-level quantum dot color conversion film is excited again arranged, so that the light can be more excited by the quantum dots of the light reflection film. Therefore, the embodiment of the invention can obtain the light-emitting element with high light efficiency through the mutual matching of the metal wire grid polarizer 7, the inclined plane of the metal reflecting structure 3 and the metal bonding layer 8.
In the following, the recycling of light is described in detail by the reflection path A1 shown in fig. 5, as shown in fig. 6A-6C, fig. 6A is a transmission metal wire grid polarization schematic diagram, fig. 6B is a plan schematic diagram of WGP, fig. 6C is a reflection path A1 of TE wave, it can be seen that the polarization direction is perpendicular to the plane of the paper (TE wave) and encounters a quantum dot in the quantum dot color conversion film (for example, light propagates downwards and other directions downwards), because the reflection surface is a sphere, the polarization state of the reflected light is no longer perpendicular to the plane of the paper, but forms an included angle with the plane of the paper, a component exists in the TM wave direction, and when the WGP is encountered, as shown in fig. 6D and 6E, fig. 6D and 6E are top views of two reflected lights, only TE waves in abcd are still polarized states of TE wave in four directions, and the polarization states of the light emitted in other directions are all changed, for example, fig. 6D is TE wave reflected and incident to the WGP is 30 ° emitted in D direction, and the original TE wave is assumed to be 1, and the new light is emitted in the direction of TE wave 30 ° s1=0.866, The tm wave direction component is cos60 °1=0.5, Where 0.5 component of light passing through the WGP can be emitted, FIG. 6E shows that the light incident on the WGP after reflection of TE wave is emitted at 45 deg. from d direction, assuming that the original TE wave is 1, the new emitted light has a cos45 deg. component in TE wave direction1=0.707, The tm wave direction component is cos45 °1=0.707, At which point there is a component ray of 0.707 that can exit through the WGP.
In the following, the recycling of light by the reflection path A2 shown in fig. 5 will be described in detail, and as shown in fig. 5, 7A and 7B, fig. 7A is a schematic plan view of the reflection path A2 in fig. 5, it can be seen that only the polarization states of light emitted in four directions abcd are TE waves, the polarization states of light emitted in other directions are changed, if the TE waves are reflected and then incident into WGP, the light is emitted in the d direction θ°, and if the original TE wave is 1, the new emitted light is in the TE wave direction with the component cos θ°The 1, TM wave direction component is sin theta DEG1, At this time, there is a component light ray of sin θ° passing through the WGP.
Note that, the reflection path A3 in fig. 5 is similar to the reflection path A2, and will not be described in detail.
Therefore, the light-emitting element provided by the embodiment of the invention can obtain a light-emitting element with high light efficiency through the mutual matching of the metal wire grid polarizer 7, the inclined plane of the metal reflecting structure 3 and the metal bonding layer 8.
In particular, in the light emitting element provided in the embodiment of the present invention, as shown in fig. 1,2 and 3, the light emitting color of the light emitting unit 2 may be blue, that is, the light emitting unit 2 is a blue light source, and blue light is used as excitation light, so that the excitation effect is better, where the sub-pixel openings include a first sub-pixel opening 41, a second sub-pixel opening 42 and a third sub-pixel opening 43, where the first sub-pixel opening 41 is provided with a red quantum dot color conversion film 5 (R-QD), the second sub-pixel opening 42 is provided with a green quantum dot color conversion film 5 (G-QD), the third sub-pixel opening 43 is filled with a resin material 11, and the resin material 11 has scattering particles (not shown). Specifically, the third sub-pixel opening 43 may directly emit blue light as a blue sub-pixel, the red quantum dots in the red quantum dot color conversion film 5 (R-QD) in the first sub-pixel opening 41 may convert blue light into red light after being excited by blue light and become red sub-pixels, the green quantum dots in the green quantum dot color conversion film 5 (G-QD) in the second sub-pixel opening 42 may convert blue light into green light after being excited by blue light and become green sub-pixels, wherein the red quantum dot color conversion film 5 (R-QD), the green quantum dot color conversion film 5 (G-QD) and the resin material 11 may be sequentially arranged to form three primary sub-pixels, and the three primary sub-pixels form pixel units and are circularly and repeatedly arranged to form a matrix distribution so as to realize a color display function.
Specifically, in the third sub-pixel opening 43, by doping the scattering particles in the resin material 11, and then filling up the depressions of the third sub-pixel opening 43 with the resin material 11 doped with the scattering particles, and the scattering particles can enhance the light-emitting effect and increase the light emission viewing angle. Alternatively, the material of the scattering particles may be TiO2.
In particular, in the light emitting device provided in the embodiment of the present invention, as shown in fig. 1, 2 and 3, the light emitting device further includes a light shielding layer 12 and a color film layer 13 between the retaining wall structure 4 and the cover plate 71, the light shielding layer 12 has a plurality of through holes corresponding to the sub-pixel openings (41, 42 and 43) one by one, and the color film layer 13 includes a plurality of color resists (R-CF, G-CF and B-CF), where the color resists (R-CF, G-CF and B-CF) correspond to the quantum dot color conversion films 5 one by one and are located in the through holes respectively. For example, the red quantum dot color conversion film (R-QD) corresponds to the red color group (R-CF), the green quantum dot color conversion film (G-QD) corresponds to the green color group (G-CF), and the third sub-pixel opening 23 (filled with a resin material) corresponds to the blue color group (B-CF). The color resistor can play a role in filtering, so that light with higher color purity is emitted from each sub-pixel opening, and the display effect is improved.
Specifically, the substrate in the embodiment of the present invention may be a driving back plate, and when the light emitting unit 2 emits light, a driving current is input to the light emitting unit 2 through the driving back plate, and the specific light emitting principle is the same as that of the prior art, and will not be described in detail herein.
Alternatively, the light emitting unit may be a Micro LED, and the pixel resolution of the light emitting element may be improved due to the small size of the Micro LED. In particular, micro LEDs are typically less than 100 μm in size. Of course, the light emitting unit may be any other light emitting unit such as Mini LED, which is not limited in the present invention. Specifically, when the light emitting unit is a Mini LED, the size of the Mini LED is 100 μm to 200 μm.
In specific implementation, the light-emitting element provided by the embodiment of the invention can be used as a backlight source of a display device, for example, as a backlight source of a liquid crystal display device, so that the light-emitting efficiency can be improved, and the power consumption can be reduced.
As shown in fig. 8, fig. 8 is a schematic plan view of three sub-pixel openings corresponding to fig. 1, fig. 2 and fig. 3, where the structure shown in fig. 8 may be used as a repeated light emitting unit, when the light emitting element provided in the embodiment of the present invention is used as a backlight source of a display device, the structure of the backlight source is shown in fig. 9, and fig. 9 is a repeated arrangement of a plurality of structures shown in fig. 8, and when the light emitting element provided in the embodiment of the present invention is directly used as a pixel structure of the display device to display, the structure shown in fig. 8 is used as a pixel unit (that is, includes R, G, B sub-pixels).
In order to obtain the maximum luminance conversion ratio to further increase the light emission efficiency of the light emitting element, as shown in fig. 10A and 10B, fig. 10A and 10B are luminance conversion diagrams corresponding to the film thickness variation of the red quantum dot color conversion film and the green quantum dot color conversion film, respectively, and it is found that the maximum luminance conversion ratio can be obtained when the film thicknesses of the red quantum dot color conversion film and the green quantum dot color conversion film both reach 20 μm. Therefore, the film thickness of the red quantum dot color conversion film and the green quantum dot color conversion film in the embodiment of the present invention is preferably more than 20 μm.
Specifically, as shown in fig. 11A, fig. 11A is a schematic structural diagram of the metal wire grid polarizer 7 (WGP) in fig. 1-3, the wire grid period d of the metal wire grid 72 is in the range of 0-400 nm, the width a of the metal wire 721 is in the range of 0-200 nm, the height H of the metal wire 721 is greater than 100nm, the duty ratio a/d of the metal wire grid 72 is in the range of 0-0.5, the extinction ratio of the metal wire grid 72 is the ratio of the transmittance of TM wave to TE wave (TTM/TTE), the height H of the metal wire 721 has an influence on the extinction ratio, and the extinction ratio is higher as the H value is larger. As shown in fig. 11B to 11E, the influence of each parameter in the metal wire grid polarizer 7 on the performance of the light emitting element is analyzed, as shown in fig. 11B, the extinction ratio increases with the decrease of the period D in the visible light band, as shown in fig. 11C, the transmittance of TM wave decreases with the increase of the duty ratio a/D, and the extinction ratio increases, so that the duty ratio needs to be determined as required for the fixed wire grid period D, as shown in fig. 11D, the TM transmittance increases after decreasing and the overall decrease trend, and the TE wave transmittance decreases sharply, so that the extinction ratio increases sharply, as shown in fig. 11E, fig. 11E is a schematic diagram of the relationship between the wire grid period D of the metal wire grid and the height H of the metal wire 721 and the polarization PE ((TTM-TTE)/(TTM+TTE)) of the metal wire grid polarizer 7, as shown in fig. 11C, the PE increases with the decrease of the duty cycle D, the PE increases with the increase of the height H of the metal wire grid 721, so that the metal wire grid polarizer 7 can increase as required, and the overall utilization of the WGP is guaranteed, and the total transmittance of the wire grid p is considered to be equal to or more than 120nm when the total polarization ratio of the wire grid p is equal to or less than or equal to the maximum. For example, when d=120 nm, pe=99.94% to 99.96%, t=36 to 40%. In order to further increase the transmittance, the duty ratio a/d of WGP is required to be reduced, as shown in fig. 12, when a/d=55/121 nm, pe=99.94%, t=36 to 40%. Therefore, in the light emitting device provided in the embodiment of the present invention, as shown in fig. 11A, the wire grid period d of the metal wire grid polarizer 7 is less than or equal to 120nm, the height of the metal wire 721 is greater than or equal to 140nm, and the duty ratio of the metal wire grid polarizer 7 is 0.35 to 0.5.
Specifically, the material of the metal wires 721 of the metal wire grid polarizer 7 may be Al, ag, au, cu, gr, preferably, the material of the metal wires 721 is Al, and when the metal wire grid is made of Al, the TM transmittance is high and the extinction ratio is high.
Referring to fig. 1 for example, a specific structure of a light emitting unit 2 provided in an embodiment of the present invention is illustrated in fig. 13, fig. 13 is a schematic structural diagram of a metal reflective structure 3, a connection layer 6 and the light emitting unit 2 fabricated on a sapphire substrate 100, the light emitting unit 2 includes a quantum well layer 201, a P-type semiconductor layer 202, a P-electrode 203 (e.g. ITO), an N-electrode 204 (e.g. metal material), a P-type pad 205 and an N-type pad 206, wherein the P-type pad 205 is electrically connected to the P-electrode 203 through a via penetrating through an insulating layer 207, and the N-type pad 206 is electrically connected to the N-electrode 204 through a via penetrating through the insulating layer 207.
The following describes in detail a method for manufacturing a light emitting element according to an embodiment of the present invention, taking the light emitting element shown in fig. 1 as an example:
(1) Forming a light shielding layer 12 and a color film layer 13 (R-CF, B-CF, G-CF) on a glass substrate 71', as shown in FIG. 14A;
(2) Forming a retaining wall structure 4 on the basis of fig. 14A, the retaining wall structure having a plurality of sub-pixel openings (41, 42, 43), as shown in fig. 14B;
(3) The quantum dot color conversion film 5 (R-QD, G-QD) and the resin material 11 are formed in each sub-pixel opening (41, 42, 43) of fig. 14B, as shown in fig. 14C.
(4) Forming a quantum dot encapsulation layer 10 on the basis of fig. 14C, as shown in fig. 14D;
(5) The metal reflective structure 3 and the connection layer 6 are formed on the sapphire substrate 100 as shown in fig. 14E, the metal reflective structure 3 may be formed by a step exposure process, and GaN is coated once after each step exposure process to form the connection layer 6;
(6) Forming the light emitting unit 2 on the basis of fig. 14E as shown in fig. 14F, the specific structure of the light emitting unit 2 being shown in fig. 13;
(7) In fig. 14F, an adhesive layer 200, a release layer 300, and a temporary carrier 400 are sequentially formed on a side of the light emitting unit 2 facing away from the sapphire substrate 100, as shown in fig. 14G;
(8) The sapphire substrate 100 in fig. 14G is peeled off as shown in fig. 14H;
(9) The metal bonding layer 8 and the planarization layer 9 are formed on the basis of fig. 14H, as shown in fig. 14I.
(10) Binding the structural pairs shown in fig. 14D and 14I, as shown in fig. 14J;
(11) As shown in fig. 14K, the adhesive layer 200, the release layer 300, and the temporary carrier 400 in fig. 14J are removed, as shown in fig. 14L;
(12) Thinning the glass substrate 71' in fig. 14L with HF acid to form a cap plate 71, and forming a metal wire grid 72 on the cap plate 71, as shown in fig. 14M;
(13) The light emitting unit 2 in fig. 14M is bound with the substrate base plate 1 (driving back plate), as shown in fig. 1.
In summary, the light-emitting element shown in fig. 1 provided by the embodiment of the present invention can be prepared through the steps (1) - (13).
Based on the same inventive concept, the embodiment of the present invention also provides a display device, including any one of the light emitting elements provided by the embodiment of the present invention. The display device can be any product or component with display function such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device will be understood by those skilled in the art, and are not described herein in detail, nor should they be considered as limiting the invention. The implementation of the display device can be referred to the above embodiments of the light emitting element, and the repetition is not repeated.
In a specific implementation, when the display device provided by the embodiment of the present invention is an OLED display device, the light emitting element provided by the embodiment of the present invention may be used as a pixel unit of the OLED display device to emit light.
In a specific implementation, when the display device provided by the embodiment of the invention is an LCD display device, as shown in fig. 15, fig. 15 is a schematic structural diagram of the LCD display device, where the display device includes a liquid crystal display panel and the light emitting element provided by the embodiment of the invention, the liquid crystal display panel includes an array substrate 110 and a color film substrate 120 that are disposed opposite to each other, a liquid crystal layer (not shown) between the array substrate 110 and the color film substrate 120, a first polarizer 130 on a side of the array substrate 110 facing away from the color film substrate 120, and a second polarizer 140 on a side of the color film substrate 120 facing away from the array substrate 110, and the light emitting element 150 provided by the embodiment of the invention is located on a side of the first polarizer 130 facing away from the second polarizer 140, and further includes a diffusion film 160 located between the first polarizer 130 and the light emitting element 150, and a backlight encapsulation layer 170 located between the diffusion film 160 and the light emitting element 150, where an optical distance OD between the diffusion film 160 and the encapsulation layer 170 is 0.2-0.5mm.
Specifically, the light emitting element 150 is assembled with the LCD display panel through the optical distance OD and the diffusion film 160, and the optical distance OD provides a uniform light path to achieve the uniformity requirement, and may also be achieved through the diffusion film 160 (or the optical distance+the diffusion film together).
The display device provided by the embodiment of the invention can be a head-mounted display such as an AR/VR (active matrix/virtual reality) and has high requirement on pixel resolution, and the light emitting element provided by the embodiment of the invention can be in one-to-many correspondence with the pixel units in the LCD display panel, for example, one repeated light emitting unit in FIG. 8 can correspond to nine pixel units (R, G, B) in the display panel.
According to the light-emitting element and the display device provided by the embodiment of the invention, the metal reflection structure is arranged between the retaining wall structure and the light-emitting unit, and the side wall (reflection surface) of the first hollow structure of the metal reflection structure is obliquely arranged relative to the light-emitting surface of the light-emitting unit, so that when divergent light rays emitted by the light-emitting unit are incident on the side wall (reflection surface) of the first hollow structure, more light rays can be emitted to the quantum dot color conversion film by the side wall (reflection surface) of the first hollow structure, the light utilization rate is greatly improved, and the light-emitting element with high light efficiency is obtained.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (17)

Translated fromChinese
1.一种发光元件,其特征在于,包括:1. A light-emitting element, comprising:衬底基板;substrate;多个发光单元,位于所述衬底基板上;A plurality of light-emitting units are located on the base substrate;金属反射结构,位于所述发光单元背离所述衬底基板的一侧;所述金属反射结构具有多个第一镂空结构,所述发光单元在所述衬底基板上的正投影位于所述第一镂空结构在所述衬底基板上的正投影范围内,所述第一镂空结构的侧壁相对于所述发光单元的发光面倾斜设置;a metal reflective structure located on a side of the light-emitting unit facing away from the base substrate; the metal reflective structure having a plurality of first hollow structures, the orthographic projection of the light-emitting unit on the base substrate being located within the orthographic projection range of the first hollow structures on the base substrate, and sidewalls of the first hollow structures being arranged obliquely relative to the light-emitting surface of the light-emitting unit;挡墙结构,位于所述金属反射结构背离所述衬底基板的一侧;所述挡墙结构具有多个子像素开口,所述第一镂空结构与所述子像素开口一一对应,且所述第一镂空结构在所述衬底基板上的正投影位于所述子像素开口在所述衬底基板上的正投影范围内;a retaining wall structure located on a side of the metal reflective structure facing away from the base substrate; the retaining wall structure having a plurality of sub-pixel openings, the first hollow structures corresponding one-to-one to the sub-pixel openings, and an orthographic projection of the first hollow structure on the base substrate being located within the orthographic projection range of the sub-pixel openings on the base substrate;多个量子点色转换膜,其中至少部分所述子像素开口内设置有所述量子点色转换膜;a plurality of quantum dot color conversion films, wherein the quantum dot color conversion films are disposed in at least a portion of the sub-pixel openings;连接层,位于所述金属反射结构和所述挡墙结构之间,所述连接层填充所述第一镂空结构;a connecting layer, located between the metal reflective structure and the retaining wall structure, the connecting layer filling the first hollow structure;金属键合层,位于所述连接层和所述挡墙结构之间;所述金属键合层具有多个第二镂空结构以及位于相邻所述第二镂空结构之间的金属键合部,所述第一镂空结构和所述第二镂空结构相对设置。A metal bonding layer is located between the connecting layer and the retaining wall structure; the metal bonding layer has a plurality of second hollow structures and metal bonding parts located between adjacent second hollow structures, and the first hollow structures and the second hollow structures are arranged opposite to each other.2.如权利要求1所述的发光元件,其特征在于,所述金属反射结构包括围绕各所述发光单元四周独立设置的多个反射部,所述反射部具有所述第一镂空结构,所述连接层还填充相邻所述反射部之间的间隙。2. The light-emitting element according to claim 1, wherein the metal reflective structure comprises a plurality of reflective portions independently arranged around each of the light-emitting units, the reflective portions have the first hollow structure, and the connecting layer further fills gaps between adjacent reflective portions.3.如权利要求2所述的发光元件,其特征在于,所述反射部包括本体以及位于所述本体和所述连接层之间的反射层,所述本体的材料包括树脂,所述反射层的材料包括ITO/Ag/ITO。3 . The light-emitting element according to claim 2 , wherein the reflective portion comprises a body and a reflective layer located between the body and the connecting layer, the body is made of resin, and the reflective layer is made of ITO/Ag/ITO.4.如权利要求3所述的发光元件,其特征在于,所述本体沿所述衬底基板厚度方向的截面形状为三角形,所述三角形中指向所述发光单元的内角为锐角。4 . The light-emitting element according to claim 3 , wherein a cross-sectional shape of the body along the thickness direction of the base substrate is a triangle, and an inner angle of the triangle pointing to the light-emitting unit is an acute angle.5.如权利要求4所述的发光元件,其特征在于,所述内角与所述发光单元的发光角的角度之和小于90°。5 . The light-emitting element according to claim 4 , wherein the sum of the inner angle and the light-emitting angle of the light-emitting unit is less than 90°.6.如权利要求1-5任一项所述的发光元件,其特征在于,还包括位于所述多个量子点色转换膜背离所述衬底基板一侧的金属线栅偏振片,所述金属线栅偏振片包括盖板以及位于所述盖板背离所述衬底基板一侧的金属线栅;所述金属线栅包括平行间隔排列的多条金属线。6. The light-emitting element according to any one of claims 1 to 5, further comprising a metal wire grid polarizer located on the side of the multiple quantum dot color conversion films facing away from the base substrate, the metal wire grid polarizer comprising a cover plate and a metal wire grid located on the side of the cover plate facing away from the base substrate; the metal wire grid comprises a plurality of metal wires arranged in parallel and spaced apart.7.如权利要求6所述的发光元件,其特征在于,所述金属线栅的周期小于或等于120nm,所述金属线的高度大于或等于140nm,所述金属线栅的占空比为0.35~0.5。7 . The light-emitting element according to claim 6 , wherein a period of the metal wire grid is less than or equal to 120 nm, a height of the metal wire is greater than or equal to 140 nm, and a duty cycle of the metal wire grid is 0.35-0.5.8.如权利要求1-5任一项所述的发光元件,其特征在于,所述金属键合部在所述衬底基板上的正投影与所述挡墙结构在所述衬底基板上的正投影重合。8 . The light-emitting element according to claim 1 , wherein an orthographic projection of the metal bonding portion on the base substrate coincides with an orthographic projection of the retaining wall structure on the base substrate.9.如权利要求8所述的发光元件,其特征在于,所述金属键合部包括层叠设置的第一Cu层、In层和第二Cu层。9 . The light-emitting element according to claim 8 , wherein the metal bonding portion comprises a first Cu layer, an In layer, and a second Cu layer stacked together.10.如权利要求9所述的发光元件,其特征在于,所述第一Cu层和所述第二Cu层的厚度相同,所述第一Cu层的厚度与所述In层的厚度之比大于1.2:1。10 . The light-emitting element according to claim 9 , wherein the first Cu layer and the second Cu layer have the same thickness, and a ratio of the thickness of the first Cu layer to the thickness of the In layer is greater than 1.2:1.11.如权利要求8所述的发光元件,其特征在于,还包括填充所述第二镂空结构的平坦层。The light-emitting element according to claim 8 , further comprising a planar layer filling the second hollow structure.12.如权利要求11所述的发光元件,其特征在于,还包括位于所述金属键合层和所述挡墙结构之间的量子点封装层,所述量子点封装层在所述衬底基板上正投影覆盖所述衬底基板。12 . The light-emitting element according to claim 11 , further comprising a quantum dot encapsulation layer located between the metal bonding layer and the retaining wall structure, wherein the quantum dot encapsulation layer covers the base substrate in an orthographic projection on the base substrate.13.如权利要求1-5任一项所述的发光元件,其特征在于,所述挡墙结构的材料为反射性材料。13 . The light-emitting element according to claim 1 , wherein the retaining wall structure is made of a reflective material.14.如权利要求1-5任一项所述的发光元件,其特征在于,所述发光单元的发光颜色为蓝色,所述子像素开口包括第一子像素开口、第二子像素开口和第三子像素开口,所述第一子像素开口内设置红色所述量子点色转换膜,所述第二子像素开口内设置绿色所述量子点色转换膜,所述第三子像素开口内填充树脂材料,所述树脂材料内具有散射粒子。14. The light-emitting element according to any one of claims 1 to 5, characterized in that the light-emitting color of the light-emitting unit is blue, the sub-pixel openings include a first sub-pixel opening, a second sub-pixel opening, and a third sub-pixel opening, the red quantum dot color conversion film is arranged in the first sub-pixel opening, the green quantum dot color conversion film is arranged in the second sub-pixel opening, and the third sub-pixel opening is filled with a resin material, and the resin material contains scattering particles.15.如权利要求6所述的发光元件,其特征在于,还包括位于所述挡墙结构和所述盖板之间的遮光层和彩膜层,所述遮光层具有与所述子像素开口一一对应的多个通孔,所述彩膜层包括多个色阻,所述色阻与所述量子点色转换膜一一对应且分别位于各所述通孔内。15. The light-emitting element according to claim 6 is characterized in that it further includes a light-shielding layer and a color filter layer located between the retaining wall structure and the cover plate, the light-shielding layer has a plurality of through holes corresponding one-to-one to the sub-pixel openings, and the color filter layer includes a plurality of color resists, and the color resists correspond one-to-one to the quantum dot color conversion film and are respectively located in each of the through holes.16.如权利要求1-5任一项所述的发光元件,其特征在于,所述发光单元包括Mini LED或Micro LED。16 . The light-emitting element according to claim 1 , wherein the light-emitting unit comprises a Mini LED or a Micro LED.17.一种显示装置,其特征在于,包括如权利要求1-16任一项所述的发光元件。17. A display device, comprising the light-emitting element according to any one of claims 1 to 16.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN113488498A (en)*2021-06-302021-10-08上海天马微电子有限公司Display panel, preparation method thereof and display device
CN114326206A (en)*2021-11-152022-04-12友达光电股份有限公司Display device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
KR102569350B1 (en)*2018-01-092023-08-23삼성디스플레이 주식회사Display device and mehtod for manufacturing the display device
CN110137201B (en)*2019-05-242021-06-25厦门乾照光电股份有限公司 A display lamp bead device, integrated diode chip and preparation method
CN210323692U (en)*2019-06-112020-04-14北海惠科光电技术有限公司Array substrate and display panel
CN112216774A (en)*2019-07-112021-01-12成都辰显光电有限公司Color conversion assembly, display panel and manufacturing method
TWI858136B (en)*2020-09-182024-10-11許華珍A display device
CN113571626B (en)*2021-07-162023-08-11上海天马微电子有限公司 A display panel and a display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN113488498A (en)*2021-06-302021-10-08上海天马微电子有限公司Display panel, preparation method thereof and display device
CN114326206A (en)*2021-11-152022-04-12友达光电股份有限公司Display device

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