Device and method for horizontally electroplating copperTechnical Field
The invention belongs to the technical field of PCB electroplating, and particularly relates to a device and a method for horizontal copper electroplating.
Background
At present, in the horizontal copper electroplating process of a PCB, oxygen bubbles are generated at an electroplating anode, the generated oxygen bubbles can influence the subsequent copper deposition reaction, so that electroplating cavities are generated, and meanwhile, the problem of poor electroplating uniformity is solved due to the influence of the size of an object to be electroplated.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides a device and a method for horizontally electroplating copper, which can avoid generating electroplating cavities in the process of horizontally electroplating copper, and meanwhile, the electroplating uniformity of an object to be electroplated is not influenced by the size, so that an electroplated copper layer with good uniformity can be formed.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, there is provided an apparatus for horizontally plating copper, comprising: a plurality of electroplating tanks, which are used for the object to be plated as an electroplating cathode to enter each electroplating tank in sequence under the traction of a driving device so as to complete the electroplating operation; a plurality of electroplating anodes are arranged in each electroplating bath, and an ionic membrane capable of preventing bubbles from passing through is arranged between the object to be plated and the electroplating anode; in each electroplating bath, the object to be plated is parallel to the electroplating anode, and the ion membrane has a set inclination angle relative to the electroplating anode; and the inclination directions of the ion membranes in at least one electroplating tank in the plurality of electroplating tanks are opposite to those of the ion membranes in the rest electroplating tanks.
Further, the electroplating anode is provided with two groups, the two groups of the electroplating anode are oppositely arranged, two groups of the ion membranes which are oppositely arranged are arranged between the two groups of the electroplating anode, the inclination directions of the two groups of the ion membranes are opposite, an electroplating channel capable of containing an object to be plated is formed between the two groups of the ion membranes, the object to be plated serving as an electroplating cathode is positioned in the electroplating channel during electroplating, and the two groups of the ion membranes are symmetrical relative to the object to be plated.
Further, a group of oblique jet flow assemblies are respectively arranged between the object to be plated and each group of ion membranes.
Further, the inclination directions of the ion membranes in the two adjacent electroplating tanks are the same or opposite.
Further, the inclination angles of the ion membranes in the two adjacent electroplating tanks are the same or different.
Further, the plating anode is an insoluble anode, including but not limited to titanium steel.
Further, the inclination angle is 5-30 degrees.
Further, the isolating film is inclined in a linear type or inclined in a unidirectional bending type.
Further, the isolation membrane is a molecular sieve membrane.
In a second aspect, a method for horizontally electroplating copper is provided, in which a driving device carries an object to be electroplated into each electroplating tank in the horizontal copper electroplating device according to the first aspect in sequence, so as to complete electroplating operation.
Compared with the prior art, the invention has the beneficial effects that: the ion membrane capable of preventing bubbles from passing through is arranged between the object to be plated and the electroplating anode, so that the oxygen bubbles are discharged faster, the influence of bubbles on deposited copper can be avoided in the horizontal copper electroplating process, and electroplating hollows are further avoided.
Drawings
FIG. 1 is a schematic top view of an apparatus for horizontal copper electroplating according to an embodiment of the present invention;
FIG. 2 is a schematic view showing the structure of the plating tank at the first position according to the embodiment of the invention;
FIG. 3 is a schematic view showing the structure of the plating tank at the second position according to the embodiment of the invention;
FIG. 4 is a schematic diagram showing a second embodiment of a horizontal copper electroplating apparatus according to the present invention;
in the figure: 1. a PCB board; 2. plating bath; 3. electroplating an anode; 4. an ionic membrane; 5. a diagonal jet assembly; 6. and (5) air bubbles.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
Embodiment one:
an apparatus for horizontally plating copper, comprising: a plurality of electroplating tanks, which are used for the object to be plated as an electroplating cathode to enter each electroplating tank in sequence under the traction of a driving device so as to complete the electroplating operation; a plurality of electroplating anodes are arranged in each electroplating bath, and an ionic membrane capable of preventing bubbles from passing through is arranged between the object to be plated and the electroplating anode; in each electroplating bath, an object to be plated is parallel to an electroplating anode, and a set inclination angle is formed between the ion membrane and the electroplating anode; and the inclination directions of the ion membranes in at least one electroplating tank in the plurality of electroplating tanks are opposite to those of the ion membranes in the rest electroplating tanks.
In this embodiment, the horizontal electroplating of the PCB board is taken as an example, as shown in fig. 1 to 4, the object to be plated is a PCB board 1, and the PCB board 1 as an electroplating cathode sequentially enters each electroplating tank 2 under the traction of the driving device to complete the electroplating operation.
In this embodiment, the two sets of electroplating anodes 3 are disposed oppositely, two sets of ion membranes 4 are disposed between the two sets of electroplating anodes 3, the inclination directions of the two sets of ion membranes 4 are opposite, an electroplating channel capable of accommodating the PCB board 1 is formed between the two sets of ion membranes 4, during electroplating, the PCB board 1 serving as an electroplating cathode is located in the electroplating channel, and the two sets of ion membranes 4 are symmetrical with respect to the PCB board 1.
As shown in fig. 2, the first plating anode 3 and the upper part thereof are provided with at least one ion film 4 with a certain inclination angle, the second plating anode 3 and the lower part thereof are provided with at least one ion film 4 with another opposite inclination angle, the PCB board 1 is positioned between the two ion films 4 with different inclination angles in the process of drawing the PCB board 1 to horizontally drive in a plating channel by a driving device, wherein the first plating anode 3 and the upper part thereof are provided with at least one ion film 4 with a certain inclination angle, the ion film 4 with an opposite inclination angle is placed below the PCB board 1, a deposition solution for electrolysis of the first plating anode 3, bubbles 6 generated in the plating process can be isolated by the ion film 4 with an inclination angle, the bubbles 6 can be carried out to the higher side by buoyancy through the ion film 4 with an inclination angle, the interference of the bubbles 6 on a power line and an electrolytic solution can be effectively stopped in the plating deposition process, the second plating anode 3 and the ion film 4 with an opposite inclination angle below the second plating anode are mainly arranged symmetrically to the first ion film 4 with an inclination angle, and the purpose of forming a good copper plating layer on the PCB board is formed by the design of the inclination angle, and the plating layer is well deposited on the opposite sides of the PCB board. Fig. 3 differs from fig. 2 only in that the direction of inclination of the ion membrane 4 is different, so that the direction of overflow of the bubbles 6 is changed.
In this embodiment, the plating anode is an insoluble anode, such as titanium steel. The ion membrane may be a molecular sieve membrane or other barrier membrane that isolates air bubbles.
In the embodiment, the method can be used in horizontal pulse copper electroplating equipment, so that objects to be plated with different sizes can be electrodeposited to obtain a copper plating layer with good uniformity and no holes; the ion membrane with the inclined angle is designed in a linear inclined mode or a unidirectional bending inclined mode, so that bubbles can be naturally and upwards brought out by buoyancy under the action of the height pressure difference of electrolyte, and the electroplating uniformity is improved; wherein the tilt angle of the ion membrane with a tilt angle can be designed to be different from the tilt angle of the ion membrane with another opposite tilt angle; the ion film with the inclined angle and the ion film with the other opposite inclined angle can be arranged in an asymmetric number in the horizontal travelling direction, as shown in the top view of fig. 4, so that the uniformity during electroplating can be improved; the drainage component can be placed at two sides between the electroplating anode and the ion membrane, wherein the drainage component can comprise one end of airflow blowout and the other end of airflow suction component, so that bubbles can be more effectively and uniformly taken out, and the electroplating uniformity is improved. Wherein, the drainage component can be designed into an inclined jet flow form which is equal to or similar to the inclination angle of the ion membrane, so that bubbles can be more effectively and uniformly carried out, and the electroplating uniformity is improved. Through the inclined design, the inclined angle designs of different positions are simultaneously made, so that pressure difference or air flow mode is caused, air bubbles are brought to the other end of the ion membrane, the air bubbles generated by the insoluble anode do not influence the electroplating flow field and deposition, and an electroplated copper layer with good uniformity is formed.
In this embodiment, a set of oblique jet assemblies is respectively disposed between the object to be plated (PCB board 1) and each set of ion films.
The tilt directions of the ion membranes in adjacent two plating baths (e.g., the plating bath at the first position and the plating bath at the second position in fig. 4) are the same or opposite (e.g., the tilt directions of the ion membranes in fig. 2 or fig. 3).
The tilt angles of the ion membranes in adjacent plating baths (e.g., plating bath at the first location and plating bath at the second location in fig. 4) are the same or different.
In this embodiment, the inclination angle set between the ion membrane and the electroplating anode is preferably 5 ° to 30 °.
Embodiment two:
based on the apparatus for horizontal copper electroplating according to the first embodiment, the present embodiment provides a method for horizontal copper electroplating, in which the driving device carries the object to be plated into each plating tank in the apparatus for horizontal copper electroplating according to the first embodiment in sequence, so as to complete the plating operation.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present invention, and such modifications and variations should also be regarded as being within the scope of the invention.