CN114752894A - Deposition source baffle mechanism and coating equipment with same - Google Patents

Abstract

The application relates to a deposition source baffle mechanism and have this deposition source baffle mechanism's coating equipment, wherein deposition source baffle mechanism includes rotating barrier, driving piece and runner assembly, the driving piece is connected runner assembly just can drive the runner assembly is rotatory, the runner assembly sets up along the first direction and connects rotating barrier, rotating barrier rotates and can drive rotating barrier is rotatory at the rotation plane, the first direction perpendicular to the rotation plane. According to the scheme, the rotating axis of the rotating assembly is vertically arranged relative to the side wall of the vacuum cavity, the rotating assembly drives the rotating baffle to rotate on the plane vertical to the rotating assembly, so that the rotating baffle rotates in the rotating plane parallel to the side wall of the vacuum cavity, the rotating baffle can occupy less space inside the vacuum cavity in the rotating process, and the utilization rate of the space inside the vacuum cavity of the coating equipment is improved.

Description

Deposition source baffle mechanism and coating equipment with same

Technical Field

The application relates to the technical field of coating equipment, in particular to a deposition source baffle mechanism and coating equipment with the same.

Background

In PVD (physical vapor deposition) vacuum coating equipment, due to the requirements of the processing technology, the vacuum coating equipment sometimes needs to be equipped with several different types of deposition sources, such as: the arc evaporation source, the magnetron target or the ion source, or the magnetron targets for different targets are configured on one device. In such a production situation, since magnetron targets of different targets, or arc evaporation sources, magnetron targets, and ion sources cannot be operated simultaneously, and in order to prevent the respective targets from being contaminated, it is necessary to provide a displaceable shielding device in front of the different deposition sources.

In the existing film plating equipment, a deposition source baffle mechanism adopts a door type baffle, and a driving cylinder drives the door type baffle to push the door type baffle away from a film plating machine table so as to carry out film plating. The space inside the cavity that the gate-type baffle took has reduced the space utilization of coating film board.

Disclosure of Invention

Therefore, a deposition source baffle mechanism and a coating device with the deposition source baffle mechanism are needed to be provided, and the problem that the space utilization rate of a coating machine table in the prior art is low is solved.

In a first aspect, the application provides a deposition source baffle mechanism, including rotating baffle, driving piece and runner assembly, the driving piece is connected the runner assembly just can drive the runner assembly is rotatory, the axis of rotation of runner assembly sets up along the first direction, the runner assembly connects rotating baffle just can drive rotating baffle is at the rotation of rotation plane, the first direction perpendicular to the rotation plane.

When the deposition source baffle mechanism is applied, the rotating axis of the rotating assembly is vertically arranged relative to the side wall of the vacuum cavity, and the rotating assembly drives the rotating baffle to rotate on a plane vertical to the rotating assembly, so that the rotating baffle rotates in a rotating plane parallel to the side wall of the vacuum cavity, the rotating baffle can occupy less space inside the vacuum cavity in the rotating process, and the utilization rate of the space inside the vacuum cavity of the coating equipment is improved.

The technical scheme of the application is further explained as follows:

in any embodiment, the rotating baffle comprises a first baffle and a second baffle. The first baffle and the second baffle correspond to the deposition source anode and the deposition source cathode respectively, compared with a rotary baffle which can shield the deposition source anode and the deposition source cathode simultaneously, the first baffle and the second baffle can shield the deposition source anode and the deposition source cathode respectively and accurately, and the single rotary baffle which can shield the deposition source anode and the deposition source cathode simultaneously needs a relatively large volume, so that the processing and the adjustment are not convenient.

In any embodiment, the rotating assembly includes a first rotating shaft and a second rotating shaft, and the first rotating shaft and the second rotating shaft are respectively connected to the first baffle and the second baffle. The first baffle and the second baffle are connected through the first rotating shaft and the second rotating shaft respectively, so that the first baffle and the second baffle can be controlled to rotate respectively, or the rotating paths of the first baffle and the second baffle can be designed conveniently when the first baffle and the second baffle rotate synchronously.

In any embodiment, the rotating assembly further comprises a linkage member, and the linkage member connects the first rotating shaft and the second rotating shaft, so that the first rotating shaft and the second rotating shaft rotate synchronously. The first rotating shaft and the second rotating shaft synchronously rotate through the linkage piece, so that the first rotating shaft and the second rotating shaft are driven to synchronously rotate through the driving piece, the structure is simplified, and the first baffle and the second baffle are conveniently controlled.

In any embodiment, the linkage piece and the first rotating shaft and the linkage piece and the second rotating shaft are in meshing transmission.

In any embodiment, the first rotating shaft and the second rotating shaft are both rotary bearing blocks.

In any embodiment, the deposition source baffle mechanism further comprises an adapter flange, and the first rotating shaft and the second rotating shaft both penetrate through the adapter flange.

In any embodiment, in the first direction, the first baffle and the second baffle are arranged in a staggered manner, and the first baffle and the second baffle do not interfere with each other when rotating. Through setting up first baffle and second baffle are crisscross, and first baffle and second baffle mutually noninterfere when the rotation plane rotates, can reduce the shared area of first baffle and second baffle in the rotation plane, so that deposit source baffle mechanism can adapt to less installation space, and be convenient for realize first baffle and second baffle synchronous revolution through first pivot and second pivot, and then provide the basis for the convenient operation of deposit source baffle mechanism.

In any embodiment, in the first direction, the gap between the first baffle and the adaptor flange and the gap between the second baffle and the adaptor flange are not greater than 10 mm. The gaps among the first baffle, the second baffle and the adapter flange are limited to be not more than 10mm, so that the space of the rotary baffle in the vacuum cavity can be further limited, the space utilization rate of the vacuum cavity is improved, and the rotary baffle is closer to the adapter flange, so that sputtering particles can be reduced to enter the deposition source cathode and the deposition source anode to a greater extent, the deposition source cathode and the deposition source anode can be better protected, the stability of equipment is improved, and the maintenance period of the deposition source is prolonged.

In a second aspect, the present application further provides a film plating apparatus, which includes a vacuum chamber, a deposition source, and a deposition source baffle mechanism as described in any of the above embodiments, where the rotation baffle rotates in a rotation plane to shield the deposition source.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the application, and the description of the exemplary embodiments of the application are intended to be illustrative of the application and are not intended to limit the application.

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a top view of a deposition source baffle mechanism according to an embodiment of the present application;

FIG. 2 is a front view of the first deposition source baffle mechanism of FIG. 1;

fig. 3 is a front view of the deposition source shutter mechanism of fig. 1.

Description of reference numerals:

100. a deposition source baffle mechanism; 110. rotating the baffle; 111. a first baffle plate; 112. a second baffle; 120. a drive member; 130. a rotating assembly; 131. a first rotating shaft; 132. a second rotating shaft; 133. a linkage member; 140. a transfer flange;

200. a vacuum chamber; 310. a deposition source anode; 320. a deposition source cathode.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the embodiments disclosed below.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the term "and/or" is only one kind of association relation describing an association object, and means that three relations may exist, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Preferred embodiments of the present application will be described below with reference to the accompanying drawings.

Referring to fig. 1, one embodiment of the present application shows a coating apparatus including avacuum chamber 200, a deposition source, and a depositionsource blocking mechanism 100, wherein the depositionsource blocking mechanism 100 is used for blocking the deposition source. The deposition source may include two emission sources, i.e., adeposition source anode 310 and adeposition source cathode 320, as shown in fig. 2, when the deposition source is shielded by the depositionsource baffle mechanism 100, both thedeposition source anode 310 and thedeposition source cathode 320 are shielded by the depositionsource baffle mechanism 100 to prevent the deposition source target from being contaminated.

As shown in fig. 1, a depositionsource shutter mechanism 100, which is illustrated for one embodiment of the present application, includes arotating shutter 110, a drivingmember 120, and arotating assembly 130. The drivingmember 120 is connected to therotating assembly 130 and can drive the rotatingassembly 130 to rotate, a rotating axis of therotating assembly 130 is disposed along a first direction and connected to therotating baffle 110, the rotatingassembly 130 can drive therotating baffle 110 to rotate in a rotating plane, and the first direction is perpendicular to the rotating plane.

As shown in fig. 1, the drivingmember 120 is located outside thevacuum chamber 200, therotating barrier 110 is located inside thevacuum chamber 200, one end of the rotatingmember 130 is connected to the drivingmember 120, and the other end extends to the inside of thevacuum chamber 200 along the first direction and is connected to therotating barrier 110, so that the rotating member transmits power to the drivingmember 120 and therotating barrier 110. Therefore, when the drivingmember 120 drives the rotating member to rotate, the rotating member can drive therotating baffle 110 to rotate.

In the embodiment shown in fig. 1 and 2, the rotatingassembly 130 has its axis of rotation disposed in a first direction and the rotating assembly is disposed perpendicularly with respect to therotating assembly 130. As shown in fig. 2, the first direction is preferably consistent with the arrangement direction of thedeposition source cathode 320 and thedeposition source anode 310, so that when therotating baffle 110 rotates in the rotating plane, therotating baffle 110 is perpendicular to the arrangement direction of thedeposition source anode 310 and thedeposition source cathode 320, and the opening end faces of therotating baffle 110, thedeposition source anode 310 and thedeposition source cathode 320 are parallel, so that therotating baffle 110 has a better shielding effect on the deposition source.

The drivingmember 120 is used to provide power for the rotation of therotary damper 110, and may be a heat engine, an electric motor, a cylinder, etc., and in the embodiment shown in fig. 1, the drivingmember 120 is a cylinder.

According to the scheme, the rotatingassembly 130 drives therotating baffle 110 to rotate on the plane perpendicular to therotating assembly 130, so that therotating baffle 110 rotates in the rotating plane parallel to the side wall of thevacuum chamber 200, therotating baffle 110 occupies less space inside thevacuum chamber 200 in the rotating process, and the utilization rate of the space inside thevacuum chamber 200 of the coating equipment is improved.

Referring to fig. 1 to 3, according to some embodiments of the present application, therotating shutter plate 110 may optionally include afirst shutter plate 111 and asecond shutter plate 112, and thefirst shutter plate 111 and thesecond shutter plate 112 correspond to thedeposition source anode 310 and thedeposition source cathode 320, respectively.

In other embodiments, the number of the rotatingbaffles 110 may be one, and one baffle may shield both thedeposition source anode 310 and thedeposition source cathode 320.

By the first andsecond baffles 111 and 112 corresponding to thedeposition source anode 310 and thedeposition source cathode 320, respectively, the first andsecond baffles 111 and 112 can accurately shield thedeposition source anode 310 and thedeposition source cathode 320, respectively, compared to arotating baffle 110 shielding thedeposition source anode 310 and thedeposition source cathode 320 at the same time, and the singlerotating baffle 110 shielding thedeposition source anode 310 and thedeposition source cathode 320 at the same time requires a relatively large volume, which is inconvenient to process and adjust.

Referring to fig. 1 to 3, according to some embodiments of the present application, the rotatingassembly 130 optionally includes a firstrotating shaft 131 and a secondrotating shaft 132, and the firstrotating shaft 131 and the secondrotating shaft 132 are respectively connected to thefirst baffle 111 and thesecond baffle 112.

First pivot 131 is connectedfirst baffle 111, andfirst pivot 131 rotates and can drivefirst baffle 111 and rotate, andsecond pivot 132 is connectedsecond baffle 112, andsecond pivot 132 rotates and can drivesecond baffle 112 and rotate. The firstrotating shaft 131 and the secondrotating shaft 132 are respectively connected with thefirst baffle 111 and thesecond baffle 112, so that thefirst baffle 111 and thesecond baffle 112 can be controlled to rotate respectively, or the rotating paths of thefirst baffle 111 and thesecond baffle 112 can be designed conveniently when thefirst baffle 111 and thesecond baffle 112 rotate synchronously.

In other embodiments, the rotatingassembly 130 may also include only one rotating shaft, and thefirst baffle 111 and thesecond baffle 112 are both connected to the rotating shaft, and the rotating shaft rotates to drive thefirst baffle 111 and thesecond baffle 112 simultaneously, at this time, from the initial position to when thefirst baffle 111 and thesecond baffle 112 respectively shield thedeposition source anode 310 and thedeposition source cathode 320, thefirst baffle 111 and thesecond baffle 112 rotate in the same direction by the same angle, so that the rotating shaft only needs to rotate by a set angle from the initial position to when thefirst baffle 111 and thesecond baffle 112 respectively shield thedeposition source anode 310 and thedeposition source cathode 320.

Referring to fig. 2 and 3, according to some embodiments of the present disclosure, optionally, when thedeposition source anode 310 and thedeposition source cathode 320 are respectively shielded by thefirst baffle 111 and thesecond baffle 112 from the initial position, the firstrotating shaft 131 and the secondrotating shaft 132 rotate in the same direction by the same angle, so that the firstrotating shaft 131 and the secondrotating shaft 132 rotate synchronously, and thefirst baffle 111 and thesecond baffle 112 can rotate from the initial position to respectively shield thedeposition source anode 310 and thedeposition source cathode 320, thereby facilitating adjustment.

Referring to fig. 1 to 3, according to some embodiments of the present application, the rotatingassembly 130 further optionally includes alink 133, and thelink 133 connects the firstrotating shaft 131 and the secondrotating shaft 132, so that the firstrotating shaft 131 and the secondrotating shaft 132 rotate synchronously.

Thelink 133 is used for synchronously rotating the firstrotating shaft 131 and the secondrotating shaft 132, so as to drive the firstrotating shaft 131 and the secondrotating shaft 132 to synchronously rotate through one drivingpart 120, thereby simplifying the structure and facilitating the control of thefirst baffle plate 111 and thesecond baffle plate 112.

Referring to fig. 1, according to some embodiments of the present disclosure, thelink 133 and the firstrotating shaft 131, and thelink 133 and the secondrotating shaft 132 are selectively driven in a meshing manner. In other embodiments, thelinkage 133 and the firstrotating shaft 131, and thelinkage 133 and the secondrotating shaft 132 may also be in friction transmission.

Referring to FIG. 1, according to some embodiments of the present application, thelinkage 133 is optionally a belt. In other embodiments, thelinkage 133 and the firstrotating shaft 131, and thelinkage 133 and the secondrotating shaft 132 may also be a gear transmission, a chain transmission, or the like.

Referring to fig. 1, according to some embodiments of the present application, optionally, the firstrotating shaft 131 and the secondrotating shaft 132 are both rotating bearing blocks. The rotating bearing seat comprises an outer ring and an inner ring which are in relative rotation fit, the outer ring is fixedly connected with theadapter flange 140, and the inner ring is connected with the drivingpart 120 and thefirst baffle 111 or thesecond baffle 112, so that when the firstrotating shaft 131 and the secondrotating shaft 132 drive thefirst baffle 111 and thesecond baffle 112 to rotate, the side walls of theadapter flange 140 and thevacuum cavity 200 are not influenced, and further the influence on the vacuum degree in thevacuum cavity 200 when the firstrotating shaft 131 and the secondrotating shaft 132 drive thefirst baffle 111 and thesecond baffle 112 to rotate is avoided.

Referring to fig. 1, according to some embodiments of the present disclosure, the depositionsource baffle mechanism 100 may further include anadapter flange 140, and the firstrotating shaft 131 and the secondrotating shaft 132 may extend through theadapter flange 140.

As shown in fig. 1, theadaptor flange 140 is disposed on a sidewall of thevacuum chamber 200, the drivingmember 120 is disposed outside thevacuum chamber 200, therotation baffle 110 is disposed inside thevacuum chamber 200, theadaptor flange 140 communicates with the inside and the outside of thevacuum chamber 200, one end of the firstrotating shaft 131 and one end of the secondrotating shaft 132 are connected to the drivingmember 120, and the other end passes through theadaptor flange 140 to connect therotation baffle 110 disposed inside thevacuum chamber 200.

In order to prevent the depositionsource blocking mechanism 100 from affecting the degree of vacuum in thevacuum chamber 200, it is preferable that theadaptor flange 140 is sealed from the sidewall of thevacuum chamber 200, and theadaptor flange 140 is sealed from the firstrotating shaft 131, and theadaptor flange 140 is sealed from the secondrotating shaft 132.

The mounting of the depositionsource barrier mechanism 100 to the sidewall of thevacuum chamber 200 and the sealing are facilitated by the provision of theadaptor flange 140, and the connection between the rotation barrier inside thevacuum chamber 200 and the drivingmember 120 outside thevacuum chamber 200 is accomplished by the penetration of the first and secondrotating shafts 131 and 132 through theadaptor flange 140.

Referring to fig. 1, according to some embodiments of the present application, optionally, in the first direction, thefirst barrier 111 and thesecond barrier 112 are disposed in a staggered manner, and thefirst barrier 111 and thesecond barrier 112 do not interfere with each other when rotating.

Thefirst baffle 111 and thesecond baffle 112 are disposed alternately in the first direction, i.e., one of thefirst baffle 111 and thesecond baffle 112 is closer to theadaptor flange 140 than the other of thefirst baffle 111 and thesecond baffle 112. In the embodiment shown in fig. 1, thefirst baffle 111 is closer to theadaptor flange 140 than thesecond baffle 112, and in other embodiments, thesecond baffle 112 may be closer to theadaptor flange 140 than thefirst baffle 111.

Through setting upfirst baffle 111 andsecond baffle 112 crisscross, andfirst baffle 111 andsecond baffle 112 mutually noninterfere when rotatory plane rotates atfirst baffle 111 andsecond baffle 112, can reduce the area thatfirst baffle 111 andsecond baffle 112 were shared at the rotation plane, so thatsource baffle mechanism 100 can adapt to less installation space, and be convenient for realizefirst baffle 111 andsecond baffle 112 synchronous revolution throughfirst pivot 131 andsecond pivot 132, and then provide the basis forsource baffle mechanism 100's convenient operation.

According to some embodiments of the present application, optionally, in the first direction, the gap between thefirst baffle 111 and theadaptor flange 140 and the gap between thesecond baffle 112 and theadaptor flange 140 are not greater than 10 mm.

The gap between thefirst baffle 111 and theadapter flange 140 refers to a gap between a side of thefirst baffle 111 facing theadapter flange 140 and a side of theadapter flange 140 facing thevacuum chamber 200, and accordingly, the gap between thesecond baffle 112 and theadapter flange 140 refers to a gap between a side of thesecond baffle 112 facing theadapter flange 140 and a side of theadapter flange 140 facing thevacuum chamber 200.

In the first direction, when thefirst baffle 111 and thesecond baffle 112 are flush, the gap between thefirst baffle 111 and theadaptor flange 140 and the gap between thesecond baffle 112 and theadaptor flange 140 are equal. At this time, the gap between thefirst baffle 111 and theadaptor flange 140 and the gap between thesecond baffle 112 and theadaptor flange 140 are not greater than 10 mm.

In the first direction, when thefirst barrier 111 and thesecond barrier 112 are arranged in a staggered manner, the gap between the barrier, which is farther from theadaptor flange 140, of thefirst barrier 111 and thesecond barrier 112 and theadaptor flange 140 is not greater than 10 mm. In the embodiment shown in fig. 1, thefirst baffle 111 is closer to theadapter flange 140 than thesecond baffle 112, the gap between thesecond baffle 112 and theadapter flange 140 is not greater than 10mm, thefirst baffle 111 is between thesecond baffle 112 and theadapter flange 140, and thefirst baffle 111 and thesecond baffle 112 do not interfere with each other when rotating. In other embodiments, when thesecond baffle 112 is closer to theadaptor flange 140 than thefirst baffle 111, the gap between thefirst baffle 111 and theadaptor flange 140 is not greater than 10mm, thesecond baffle 112 is interposed between thefirst baffle 111 and theadaptor flange 140, and thefirst baffle 111 and thesecond baffle 112 do not interfere with each other when rotating.

Preferably, thefirst baffle 111 is closer to theadapter flange 140 than thesecond baffle 112, the gap between thesecond baffle 112 and theadapter flange 140 is 10mm, thefirst baffle 111 is between thesecond baffle 112 and theadapter flange 140, and the gap between thefirst baffle 111 and theadapter flange 140 is 5 mm.

By limiting the gap between thefirst baffle 111 and thesecond baffle 112 and theadaptor flange 140 to be not more than 10mm, on one hand, the space of therotating baffle 110 in thevacuum chamber 200 can be further limited, and the space utilization rate of thevacuum chamber 200 is improved, and on the other hand, therotating baffle 110 is closer to theadaptor flange 140, so that sputtering particles can be reduced to a greater extent from entering thedeposition source cathode 320 and thedeposition source anode 310, thedeposition source cathode 320 and thedeposition source anode 310 can be better protected, the stability of the equipment is improved, and the maintenance period of the deposition source is prolonged.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; these modifications and substitutions do not cause the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present application, and are intended to be covered by the claims and the specification of the present application. In particular, the features mentioned in the embodiments can be combined in any manner, as long as no structural conflict exists. This application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.

Claims (10)

1. The deposition source baffle mechanism is characterized by comprising a rotating baffle (110), a driving part (120) and a rotating assembly (130), wherein the driving part (120) is connected with the rotating assembly (130) and can drive the rotating assembly (130) to rotate, the rotating axis of the rotating assembly (130) is arranged along a first direction, the rotating assembly (130) is connected with the rotating baffle (110) and can drive the rotating baffle (110) to rotate in a rotating plane, and the first direction is perpendicular to the rotating plane.

2. The deposition source shutter mechanism according to claim 1, wherein the rotating shutter (110) includes a first shutter (111) and a second shutter (112).

3. The deposition source shutter mechanism according to claim 2, wherein the rotating assembly (130) includes a first rotating shaft (131) and a second rotating shaft (132), and the first rotating shaft (131) and the second rotating shaft (132) are connected to the first shutter plate (111) and the second shutter plate (112), respectively.

4. The deposition source shutter mechanism according to claim 3, wherein the rotating assembly (130) further comprises a linkage (133), the linkage (133) connecting the first rotating shaft (131) and the second rotating shaft (132) such that the first rotating shaft (131) and the second rotating shaft (132) rotate synchronously.

5. The deposition source shutter mechanism according to claim 4, wherein the linkage member (133) and the first rotating shaft (131) and the linkage member (133) and the second rotating shaft (132) are in meshing transmission.

6. The deposition source shutter mechanism according to claim 5, wherein the first rotating shaft (131) and the second rotating shaft (132) are each a rotary bearing housing.

7. The deposition source baffle mechanism of claim 3, wherein the deposition source baffle mechanism (100) further comprises an adapter flange (140), and the first rotating shaft (131) and the second rotating shaft (132) both extend through the adapter flange (140).

8. The deposition source shutter mechanism according to claim 7, wherein the first shutter plate (111) and the second shutter plate (112) are staggered in the first direction, and the first shutter plate (111) and the second shutter plate (112) do not interfere with each other when they rotate.

9. The deposition source baffle mechanism of claim 7, wherein a gap between the first baffle (111) and the adaptor flange (140) and a gap between the second baffle (112) and the adaptor flange (140) are no greater than 10mm in a first direction.

10. A plating apparatus comprising a vacuum chamber (200) and a deposition source, characterized by further comprising the deposition source barrier mechanism (100) according to any one of claims 1 to 9, wherein the rotation barrier (110) is rotatable in a rotation plane to shield the deposition source.

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