CN114599215B - High-efficient radiating intelligent passenger cabin district liquid cooling host computer - Google Patents

Abstract

The invention discloses an efficient heat-dissipation intelligent cabin area liquid cooling host, which comprises an upper cover, a bottom shell, a main circuit board and a water cooling plate, wherein the upper cover and the bottom shell are connected in a sealing manner; an inlet and an outlet are arranged on the side wall of the upper cover or the bottom shell; the water cooling plate is hermetically arranged on the upper cover or the bottom shell, a cooling liquid cavity communicated with the inlet and the outlet is formed between the water cooling plate and the upper cover or the bottom shell, at least one circulation channel is formed in the cooling liquid cavity, and a plurality of first radiating fins positioned in the circulation channel are arranged on the water cooling plate in a protruding mode. This host computer passes through coolant liquid cavity, first heat radiation fin's design for the radiating efficiency is high, and the noise is little, and electrical property is better, and in addition, structural design space requires lowly, stability is higher, and life is longer.

Description

High-efficient radiating intelligent passenger cabin district liquid cooling host computer

Technical Field

The invention relates to the technical field of vehicle-mounted host heat dissipation, in particular to an intelligent cabin area liquid cooling host capable of dissipating heat efficiently.

Background

The automobile industry is developing towards the direction of multi-functionalization, so that the power consumption of a part of chips used in an automobile exceeds the traditional cooling requirement, the single aluminum alloy, fan cooling and the like cannot meet the heat dissipation requirement, and the liquid cooling technology is needed to dissipate heat of the chips so as to meet the industry requirements of normal work, structural design space, stability, service life and the like of the chips.

At present, the heat dissipation of a large-power-consumption host in the industry generally adopts a mode of matching a copper pipe and an aluminum alloy, the copper pipe is pressed into a groove on the aluminum alloy after being bent, and two ends of the copper pipe are provided with a cooling liquid inlet and a cooling liquid outlet which are connected with an original vehicle cooling system. The disadvantages of this structure are: the cooling liquid has low flowing speed and low cooling efficiency, the copper pipe is easy to crack after being flattened, so that the problem of cooling liquid leakage is caused, the needed copper pipe is long, and the material consumption is large; the shape of the aluminum alloy is limited, the copper pipe can be pressed in only by being relatively flat, the space modeling design of the product is not facilitated, and the popularization of the liquid cooling technology is also not facilitated; in addition, the heat dissipation effect can be influenced when the contact between the copper pipe and the aluminum alloy is poor.

Therefore, it is necessary to provide an intelligent liquid cooling host with high heat dissipation efficiency, low noise, better electrical performance, low requirement on structural design space, higher stability, longer service life and more convenient installation, so as to solve the above problems.

Disclosure of Invention

The invention aims to provide the intelligent cabin area liquid cooling host machine with high heat dissipation efficiency, low noise, better electrical performance, low structural design space requirement, higher stability, longer service life and simpler and more convenient installation.

In order to achieve the purpose, the technical scheme of the invention is as follows: the intelligent cabin area liquid cooling host comprises an upper cover, a bottom shell, a main circuit board and a water cooling plate, wherein the upper cover and the bottom shell are connected in a sealing mode; the side wall of the upper cover or the bottom shell is provided with an inlet and an outlet; the water cooling plate is installed in the upper cover or the bottom shell in a sealing mode, a cooling liquid cavity communicated with the inlet and the outlet is formed between the water cooling plate and the upper cover or the bottom shell, at least one circulating channel is formed in the cooling liquid cavity, and a plurality of first radiating fins located in the circulating channel are arranged on the water cooling plate in a protruding mode.

Preferably, the water-cooling plate is convexly provided with at least one flow guide wall, the flow guide wall divides the cooling liquid cavity into at least two circulation channels, the shape of the flow guide wall is designed according to the shape of the cooling liquid cavity and the positions of the inlet and the outlet, and the arrangement of the plurality of circulation channels can enable flowing cooling liquid to more fully take away heat of chips in the host machine, so that the heat dissipation effect of the host machine is optimized.

Preferably, the inner side surface of the upper cover or the bottom shell is convexly provided with a mounting boss corresponding to the water cooling plate in shape, the water cooling plate is hermetically mounted on the mounting boss, a cooling liquid cavity is formed between the water cooling plate and the mounting boss, and the outer side surface of the upper cover or the bottom shell is provided with a plurality of second heat dissipation fins corresponding to the mounting boss; the mounting bosses and the water cooling plates can be designed into different shapes according to actual product requirements so as to save the space of a host machine and facilitate technical popularization, and the cooling liquid cavity can enable the liquid storage space to be larger and is beneficial to improving the heat dissipation efficiency; in addition, the second radiating fins increase the radiating surface area and improve the radiating efficiency; moreover, seamless welding is carried out between the water-cooling plate and the upper cover or the bottom shell by adopting a friction welding technology mature in the industry, so that the leakage of cooling liquid is avoided, and the reliability is better.

Preferably, at least one heating element is arranged on the main circuit board; the water-cooling plate is provided with a plurality of first heat dissipation bosses corresponding to the heating elements in a protruding mode, the first heat dissipation bosses are in contact with the heating elements in a laminating mode through heat conducting glue, heat generated by the heating elements is directly transmitted to the water-cooling plate through the first heat dissipation bosses to dissipate heat, the heat dissipation speed is higher, and the heat dissipation capacity is improved.

Preferably, a plurality of second heat dissipation bosses are further convexly arranged on the inner side surfaces of the upper cover or/and the bottom shell, the second heat dissipation bosses are attached to and contact with the main circuit board through heat conducting glue, a plurality of third heat dissipation fins are further convexly arranged on the outer side surface of one of the upper cover and the bottom shell, which is far away from the water cooling plate, heat generated by the main circuit board is transferred to the upper cover or/and the bottom shell through the second heat dissipation bosses to be directly dissipated, heat accumulation in the host is reduced, the heat dissipation surface area is increased through the third heat dissipation fins, and the heat dissipation efficiency is improved.

Preferably, the first heat dissipation boss and the second heat dissipation boss respectively comprise a top surface and a plurality of inclined surfaces connected to the top surface, the top surface is attached to and contacted with the heating element or the main circuit board through heat conducting glue, and the inclined surfaces increase the heat dissipation surface area, so that the heat dissipation efficiency is improved.

Preferably, high-efficient radiating intelligent passenger cabin district liquid cooling host computer still includes at least one first circuit board, the lateral surface of upper cover is the concave at least one signal chamber that is equipped with still, the protruding flange that is equipped with in edge in signal chamber, first circuit board is located the top in signal chamber and edge butt in the flange blocks, first circuit board sealing connection in the upper cover, signal chamber set up and satisfied signal transmission and shielding demand, still reduced spare part, and the flange that blocks then is used for waterproofly, and water-proof effects is better.

Preferably, the medial surface of upper cover still protruding first shielding muscle that is equipped with, the medial surface of drain pan is protruding to be equipped with the second shielding muscle, first shielding muscle the second shielding muscle pass through the conducting resin with the contact of dew copper district of main circuit board, consequently, need not design a plurality of shield covers in addition on the main circuit board, make the structure more simplify to the signal shielding effect that makes the host computer is better, each high-speed signal does not influence each other, makes host computer electrical property better, reduce cost.

Preferably, a flow guiding and dust blocking structure is arranged between the upper cover and the bottom shell, so that the dustproof and waterproof effect is better, and the service life of the host is longer.

Preferably, the edge of the bottom shell is also convexly provided with a plurality of mounting lugs which are used for being quickly locked with the support of the automobile, so that the host does not need to additionally design a left mounting support, a right mounting support and the like to be fixed with the automobile, and the mounting lugs and the support of the automobile are directly locked by screws, compared with the existing mode, two supports and two sets of hardware molds are saved, and the structure is simplified; meanwhile, the mounting lug can also play a role in heat dissipation, so that the heat dissipation efficiency is improved.

Compared with the prior art, the intelligent cabin area liquid cooling host machine with high-efficiency heat dissipation is provided with the water cooling plate, the water cooling plate is hermetically arranged on the upper cover or the bottom shell, a cooling liquid cavity is formed between the water cooling plate and the upper cover or the bottom shell, the side wall of the upper cover or the bottom shell is provided with an inlet and an outlet which are communicated with the cooling liquid cavity, at least one circulation channel is formed in the cooling liquid cavity, and the water cooling plate is convexly provided with a plurality of first heat dissipation fins positioned in the circulation channel. This high-efficient radiating intelligent passenger cabin territory liquid cooling host computer has following effect: firstly, the cooling liquid cavity can be designed into different shapes according to the actual product requirements, the structural design space requirement is low, the host space can be saved, the technical popularization is facilitated, and the cooling liquid cavity is designed to enable the storage space of the cooling liquid to be larger, so that the heat dissipation efficiency is improved; secondly, a circulating channel can be designed according to the shape of the cooling liquid cavity, the positions and the directions of the inlet and the outlet, so that the heat of the chip can be more fully taken away by the flowing cooling liquid, and the first radiating fins are uniformly and alternately arranged, so that the flowing resistance of the cooling liquid can be reduced, the radiating area is larger, and the radiating effect of the host is optimized; moreover, the upper cover, the bottom shell and the water cooling plate are all designed by die-casting aluminum alloy, and can perform auxiliary heat dissipation on the chip; in addition, the main machine of the invention has lower noise, solves the problem of noise generated by high-speed operation of the traditional fan and improves the user experience.

Drawings

Fig. 1 is a schematic front structural view of an intelligent cabin area liquid cooling host with efficient heat dissipation according to the invention.

Fig. 2 is a schematic view of the backside structure of fig. 1.

Fig. 3 is a top view of fig. 1.

Fig. 4 is a sectional view taken along line a-a of fig. 3.

Fig. 5 is a sectional view taken along line B-B of fig. 3.

Fig. 6 is an exploded view of fig. 3.

Fig. 7 is a schematic structural view of the water cooling plate and the upper cover in fig. 6 after being installed in a matching manner.

Fig. 8 is an exploded view of fig. 7.

Fig. 9 is a schematic view of the water-cooled plate of fig. 8 at another angle.

Fig. 10 is a schematic view of the upper cover of fig. 8 at another angle.

Fig. 11 is a schematic view of the water cooling plate and the main circuit board in fig. 6.

Fig. 12 is a schematic view of the bottom shell of fig. 6 at another angle.

Fig. 13 is a front plan view of the main circuit board of fig. 6.

Fig. 14 is a back plan view of the main circuit board of fig. 6.

Detailed Description

Embodiments of the present invention will now be described with reference to the drawings, wherein like element numerals represent like elements. It should be noted that the orientation descriptions of the present invention, such as the directions or positional relationships indicated above, below, left, right, front, rear, etc., are all based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the technical solutions of the present application or simplifying the description, but do not indicate or imply that the devices or elements referred to must have specific orientations, be constructed in specific orientations, and operate, and therefore, should not be construed as limiting the present application. The description of first, second, etc. merely serves to distinguish technical features and should not be interpreted as indicating or implying any relative importance or implying any indication of the number of technical features indicated or implying any order of precedence among or between the technical features indicated.

Referring to fig. 1 to 14, the intelligent liquid-cooledcabin host 100 with high heat dissipation efficiency according to the present invention includes anupper cover 110, abottom case 120, amain circuit board 130, and a water-cooledplate 140. Theupper cover 110 and thebottom case 120 are hermetically connected, thewater cooling plate 140 is hermetically installed on theupper cover 110 or thebottom case 120, acooling liquid cavity 140a (see fig. 4-5) is formed between thewater cooling plate 140 and theupper cover 110 or thebottom case 120, aninlet 111 and anoutlet 112 communicating with thecooling liquid cavity 140a are disposed on a sidewall of theupper cover 110 or thebottom case 120, at least onecirculation channel 141 is formed in the coolingliquid cavity 140a, and a plurality of firstheat dissipation fins 143 located in thecirculation channel 141 are further convexly disposed on thewater cooling plate 140. Themain circuit board 130 is installed between theupper cover 110 and thebottom case 120, the chips on themain circuit board 130 are reasonably arranged according to the power consumption and the electrical requirements, and the chips with high power consumption on themain circuit board 130 are intensively arranged at the position corresponding to thewater cooling plate 140, so that heat can be quickly led out.

In the invention, theupper cover 110, thebottom shell 120 and thewater cooling plate 140 are all designed by die-casting aluminum alloy, so that the chips can be subjected to auxiliary heat dissipation. Of course, the three components are not limited to the above materials, and can also be made of other materials with better heat dissipation effect.

More specifically, the inner side surface of theupper cover 110 or thebottom shell 120 is convexly provided with themounting boss 113 corresponding to the shape of thewater cooling plate 140, the shapes of themounting boss 113 and thewater cooling plate 140 are not specifically limited in the present invention, and can be designed into different shapes according to actual product requirements, so as to save the space of the host computer and facilitate technical popularization; thewater cooling plate 140 is hermetically installed on theinstallation boss 113, and thecooling liquid cavity 140a is formed between thewater cooling plate 140 and theinstallation boss 113, seamless welding is preferably performed between thewater cooling plate 140 and theinstallation boss 113 by using a friction welding technology mature in the industry, so that the cooling liquid is prevented from leaking, the reliability is better, and the coolingliquid cavity 140a is designed to enable the storage space of the cooling liquid to be larger, so that the heat dissipation efficiency is favorably improved; a plurality of secondheat dissipation fins 114 are disposed on the outer side of theupper cover 110 or thebottom shell 120 corresponding to themounting bosses 113, and the heat dissipation surface area is increased by the second heat dissipation fins 114, so as to further improve the heat dissipation efficiency.

As shown in fig. 4-8, in an embodiment of the present invention, the water-cooling plate 140 is hermetically installed on theupper cover 110, the top wall of theupper cover 110 is recessed downward to form theinstallation boss 113, and the secondheat dissipation fins 114 are disposed in the recessed area of theupper cover 110. Aninlet 111 and anoutlet 112 are provided on one side wall of theupper cover 110. Themain circuit board 130 is installed between theupper cover 110 and thebottom case 120 and is located below thewater cooling plate 140. Of course, the arrangement is not limited to this, and thewater cooling plate 140 may be hermetically mounted on thebottom case 120 as needed, so that the coolingliquid cavity 140a is formed between thewater cooling plate 140 and thebottom case 120, and themain circuit board 130 is mounted between thewater cooling plate 140 and theupper cover 110.

Referring to fig. 4 to 8, in the present invention, at least oneflow guiding wall 142 is convexly disposed on an inner side surface of thewater cooling plate 140, specifically, the shape of theflow guiding wall 142 is designed according to the shape of thewater cooling plate 140 and the positions of theinlet 111 and theoutlet 112, theflow guiding wall 142 divides thecooling liquid cavity 140a into at least twocirculation channels 141, and the firstheat dissipation fins 143 are disposed in thecirculation channels 141, and the plurality ofcirculation channels 141 and the firstheat dissipation fins 143 therein are disposed, so that the heat of the chip in the host can be sufficiently taken away by the flowing cooling liquid, and the heat dissipation effect of the host is optimized.

Referring to fig. 3, 8 and 11, in a specific embodiment, a bentflow guiding wall 142 is convexly disposed on thewater cooling plate 140, theflow guiding wall 142 divides thecooling liquid cavity 140a into twocirculation channels 141, the twocirculation channels 141 correspond to regions of themain circuit board 130 where heat dissipation chips are to be emphasized, specifically, one of thecirculation channels 141 is disposed along the edge of thewater cooling plate 140, theother circulation channel 141 passes through the approximate middle of thewater cooling plate 140, and a plurality of firstheat dissipation fins 143 are convexly disposed in eachcirculation channel 141, the first heat dissipation fins 143 correspond to regions 131 (see fig. 3) of themain circuit board 130 where heat dissipation chips are to be emphasized (see fig. 3), and the firstheat dissipation fins 143 are preferably in an elliptical structure and are uniformly staggered. As shown in fig. 8, aboss 145 is further disposed at one end of the water-cooling plate 140, theboss 145 separates achannel inlet 141a and achannel outlet 141b on the water-cooling plate 140, the twocirculation channels 141 are respectively connected to thechannel inlet 141a and thechannel outlet 141b, thechannel inlet 141a is connected to theinlet 111, and thechannel outlet 141b is connected to theoutlet 112. After the cooling liquid flows into the coolingliquid cavity 140a from theinlet 111 and theflow channel inlet 141a, the cooling liquid respectively flows into the twocirculation channels 141 under the action of theflow guide wall 142, flows through the twocirculation channels 141, is converged by theflow channel outlet 141b, and then flows out from theoutlet 112, wherein the firstheat dissipation fins 143 are beneficial to reducing the flow resistance of the cooling liquid, so that the heat dissipation area is larger, the cooling liquid more fully takes away the heat of the chip, and the heat dissipation effect of the host is optimized.

With continued reference to FIG. 8, the edge of themounting boss 113 is protruded with arib 1131, and the water-cooledplate 140 is hermetically connected to therib 1131, so that the coolingliquid cavity 140a is formed between the water-cooledplate 140 and themounting boss 113. Furthermore, theprojection 145 of thewater cooling plate 140 is provided with a substantially T-shaped protrusion 146, and theguide wall 142 is also provided with aprotrusion 146, wherein at least a portion of theprotrusion 146 of theguide wall 142 extends thereon as required. Correspondingly, agroove 1132 matched with theprotrusion 146 is concavely arranged on themounting boss 113, and after thewater cooling plate 140 and themounting boss 113 are mounted, theprotrusion 146 is correspondingly clamped in thegroove 1132, so that the connection between the two is enhanced.

Understandably, the number and shape of thecirculation channels 141 are not limited in this embodiment, but of course, the number and shape can be flexibly designed according to the position of the chip on themain circuit board 130, the shape of the water-cooling plate 140, and the directions of the inlet andoutlet 112; the shape of the firstheat radiation fins 143 is not limited to the embodiment, and may be any other shape that can increase the heat radiation area.

Referring to fig. 4-7 and 9, in a preferred embodiment of the present invention, a plurality of firstheat dissipation bosses 144 are protruded from positions of thewater cooling plate 140 corresponding to main heat generating elements (e.g., chips with larger heat generation amount and requiring important heat dissipation) on themain circuit board 130, that is, the firstheat dissipation bosses 144 and the firstheat dissipation fins 143 are respectively protruded from two sides of thewater cooling plate 140, in other words, the firstheat dissipation bosses 144 are protruded from the outer side of thewater cooling plate 140, and the firstheat dissipation bosses 144 are in contact with the chips by the heat conductive adhesive 160 with high thermal conductivity, as shown in fig. 4-5, heat generated by the chips is directly transferred to thewater cooling plate 140 through the firstheat dissipation bosses 144, and is dissipated by the cooling liquid flowing through the coolingliquid cavity 140a, so that the heat dissipation speed is faster and the heat dissipation capability is improved.

As shown in fig. 4-5 and 9, the firstheat dissipation projection 144 preferably includes atop surface 1441 and a plurality ofinclined surfaces 1442 connected between thetop surface 1441 and thewater cooling plate 140, and thetop surface 1441 is preferably parallel to thewater cooling plate 140, but not limited thereto, thetop surface 1441 contacts the chip by the thermalconductive adhesive 160, and theinclined surfaces 1442 increase the heat dissipation surface area, thereby improving the heat dissipation efficiency. Of course, the firstheat dissipation projection 144 is not limited to this shape, and may be provided in any other shape to increase the heat dissipation area.

Referring to fig. 4-6 and 10, in the present invention, a plurality of second heat dissipation bosses are further convexly disposed on inner sides of theupper cover 110 or/and thebottom case 120, the second heat dissipation bosses contact themain circuit board 130 through the heat conductive adhesive 160 with a high thermal conductivity, and a plurality of third heat dissipation fins are further convexly disposed on an outer side of one of theupper cover 110 and thebottom case 120 away from thewater cooling plate 140, heat generated by themain circuit board 130 is transferred to theupper cover 110 or/and thebottom case 120 through the second heat dissipation bosses to directly dissipate heat, so as to reduce heat accumulation inside the host, and the third heat dissipation fins increase a heat dissipation surface area and improve heat dissipation efficiency.

As shown in fig. 4-5 and 10, in one embodiment, a plurality of secondheat dissipation bosses 121 are convexly disposed on an inner side surface of thebottom case 120, and a plurality of thirdheat dissipation fins 122 are convexly disposed on an outer side surface of thebottom case 120, so that heat generated by themain circuit board 130 is transferred to thebottom case 120 through the secondheat dissipation bosses 121 to be directly dissipated, and the third heat dissipation fins 122 increase a heat dissipation surface area, thereby improving heat dissipation efficiency.

With reference to fig. 5 and 10, the secondheat dissipation protrusion 121 includes atop surface 1211 and a plurality ofinclined surfaces 1212 connected between thetop surface 1211 and thebottom case 120, thetop surface 1211 contacts themain circuit board 130 through the thermalconductive adhesive 160, and theinclined surfaces 1212 increase the heat dissipation surface area, thereby improving the heat dissipation efficiency. It is understood that the secondheat dissipation projection 121 is not limited to this shape, and may be provided in any other shape to increase the heat dissipation area.

Referring now to fig. 3, 5-6 and 12, in an embodiment of the present invention, the smart cabin liquid-cooledhost 100 with efficient heat dissipation further includes afirst circuit board 150 for mounting an antenna, and thefirst circuit board 150 is mounted on theupper cover 110. Specifically, at least onesignal cavity 115 is concavely arranged on the outer side surface of theupper cover 110, a blockingedge 116 is convexly arranged on the edge of eachsignal cavity 115, the shape of the blockingedge 116 corresponds to that of thefirst circuit board 150, and a throughhole 117 communicated with the inside of theupper cover 110 is formed in the bottom of eachsignal cavity 115. Thefirst circuit board 150 is disposed above thesignal cavity 115, and the edge of thefirst circuit board 150 abuts against the blockingedge 116, that is, thefirst circuit board 150 is embedded in the blockingedge 116, and thefirst circuit board 150 is connected to theupper cover 110 in a sealing manner, in this embodiment, thefirst circuit board 150 is directly adhered to the surface of theupper cover 110 by using 3M glue, and the adheredfirst circuit board 150 is as shown in fig. 1 and 4-5, which reduces the number of parts and facilitates installation, and the wires electrically connected to thefirst circuit board 150 penetrate into theupper cover 110 through the throughholes 117 to electrically connect themain circuit board 130, which is a conventional manner in the art. Thesignal cavity 115 meets the signal transmission and shielding requirements of the antenna, and the blockingedge 116 is used for water prevention, so that a better waterproof effect is achieved.

Referring to fig. 7-8, 10, and 13-14, in a preferred embodiment of the present invention, the inner side surface of theupper cover 110 is further protruded with a first shielding rib 118 (see fig. 8), the inner side surface of thebottom cover 120 is protruded with a second shielding rib 123 (see fig. 10), and the shapes of thefirst shielding rib 118 and thesecond shielding rib 123 correspond to the exposed copper area on the surface of themain circuit board 130. Referring specifically to fig. 13-14, themain circuit board 130 has a front surface with a copper exposedarea 132, the shape of the copper exposedarea 132 is the same as the shape of thefirst shielding rib 118, and a back surface with a copper exposedarea 133, the shape of the copper exposedarea 133 is the same as the shape of thesecond shielding rib 123. After themain circuit board 130 is installed, thecopper exposing area 132 on the main circuit board is in contact with thefirst shielding rib 118 through the flexible conductive adhesive, and thecopper exposing area 133 is in contact with thesecond shielding rib 123 through the flexible conductive adhesive, so that a plurality of shielding covers are not required to be additionally designed on themain circuit board 130, the structure is simplified, the signal shielding effect of the host is better, high-speed signals are not influenced by each other, the electrical performance of the host is better, and the cost is reduced.

As shown in fig. 8 and 10, a plurality of first connectingposts 119 connected to thefirst shielding ribs 118 are further protruded from the inner side surface of theupper cover 110, and the first connectingposts 119 are provided with first connecting holes. Correspondingly, thebottom case 120 is provided with a plurality of second connectingposts 124 connected to thesecond shielding ribs 123, and the second connectingposts 124 are provided with second connecting holes penetrating therethrough. In addition, a third connection hole (not numbered) corresponding to the first connection hole and the second connection hole is further penetratingly formed in themain circuit board 130. During installation, the screws sequentially penetrate through the first connecting hole, the third connecting hole and the second connecting hole to fixedly connect thefirst shielding rib 118, thesecond shielding rib 123 and themain circuit board 130, after the host is used for a long time, thefirst shielding rib 118 and thesecond shielding rib 123 are not easy to deform, and then the influence of the deformation of thefirst shielding rib 118 and thesecond shielding rib 123 on the signal shielding effect of themain circuit board 130 is reduced.

Referring to fig. 4-5 again, in an embodiment of the present invention, a flow guiding and dust blocking structure is disposed between theupper cover 110 and thebottom case 120, so that the dustproof and waterproof effect of the host is better, and the service life of the host is longer.

More specifically, the flow guiding and dust blocking structure includes a firstprotruding rib 110a protruding from the edge of the sidewall of theupper cover 110, and the first protrudingrib 110a protrudes downward and is stepped with thefirst shielding rib 118, as shown in fig. 5; the airflow guiding and dust blocking structure further includes a secondprotruding rib 120a protruding from the edge of the sidewall of thebottom case 120, the secondprotruding rib 120a protrudes outward along the radial direction of thebottom case 120 and is stepped with thesecond shielding rib 123, specifically, thesecond shielding rib 123 is higher than the secondprotruding rib 120a, as shown in fig. 5. When theupper cover 110 and thebottom cover 120 are fitted, thefirst shielding rib 118 and thesecond shielding rib 123 are clamped and abutted against themain circuit board 130, thefirst rib 110a surrounds themain circuit board 130 from the outside and protrudes downward, and thefirst rib 110a abuts against thesecond rib 120a of thebottom cover 120, see the enlarged part in fig. 5, thereby achieving the dustproof and waterproof effect.

It is understood that the flow guiding and dust blocking structure is not limited to the above structure, but may be configured in other structures to achieve the purpose.

As shown in fig. 1-3, 6, and 10, a plurality of mountingtabs 125 are further convexly provided at the edge of thebottom case 120, and the mountingtabs 125 are used for quickly locking thehost 100 to the bracket of the vehicle, so that thehost 100 of the present invention does not need to additionally design a left mounting bracket and a right mounting bracket to fix to the vehicle, but directly uses screws to lock the mountingtabs 125 to the bracket of the vehicle, which saves two brackets and two sets of hardware molds compared to the existing method, thereby simplifying the structure of thehost 100. In addition, the mountinglug 125 can also play a role in heat dissipation, so that the heat dissipation efficiency is improved, only heat dissipation fins can dissipate heat in the traditional host, and only other parts of the electrolytic galvanized steel Sheet (SECC) can be mounted, so that the heat dissipation effect of the invention is better.

The cooling principle of the intelligent cabin area liquid-cooledhost 100 with efficient heat dissipation according to the present invention will be described with reference to fig. 1 to 14 again.

As shown in fig. 1-3, 4-5, and 11, when the host 100 is cooled during operation, the cooling liquid flows into the cooling liquid cavity 140a from the inlet 111 and the flow channel inlet 141a, and then flows into the two circulation channels 141 respectively under the action of the flow guide wall 142, as shown by the arrow in fig. 11, because the first heat dissipation fins 143 in the circulation channels 141 correspond to the region 131 (see fig. 3) of the main circuit board 130 where the chip is located, where heat is to be dissipated, and the cooling liquid flows in the circulation channels 141 and passes through the first heat dissipation fins 143, the first heat dissipation fins 143 reduce the flow resistance of the cooling liquid, increase the heat dissipation area, and improve the heat dissipation efficiency of the main circuit board 130; meanwhile, heat generated by the chip, which is mainly required to be cooled, on the main circuit board 130 is directly transferred to the water cooling plate 140 through the first heat dissipation boss 144, and then is dissipated through the cooling liquid flowing in the circulation channel 141, so that the heat dissipation speed of the main circuit board 130 is higher, the heat dissipation capacity is improved, the heat of the chip is more sufficiently taken away by the cooling liquid, and the heat dissipation effect of the host computer is optimal.

As shown in fig. 4-5, the heat generated by themain circuit board 130 is also transferred to thebottom case 120 through the secondheat dissipation bosses 121, and is directly dissipated from thebottom case 120, and meanwhile, the plurality of thirdheat dissipation fins 122 protruding from the outer side surface of thebottom case 120 further increase the heat dissipation surface area, thereby improving the heat dissipation efficiency.

In the above process, since theupper cover 110, thebottom case 120 and thewater cooling plate 140 are all designed by die-casting aluminum alloy, the chips can be subjected to auxiliary heat dissipation, and the heat dissipation efficiency is further improved.

In summary, the intelligent liquid-cooledcabin area host 100 with high heat dissipation efficiency of the present invention includes a water-cooledplate 140, the water-cooledplate 140 is hermetically mounted on theupper cover 110 or thebottom case 120, a coolingliquid cavity 140a is formed between the water-cooledplate 140 and theupper cover 110 or thebottom case 120, aninlet 111 and anoutlet 112 communicating with the coolingliquid cavity 140a are disposed on a sidewall of theupper cover 110 or thebottom case 120, at least onecirculation channel 141 is formed in the coolingliquid cavity 140a, and a plurality of firstheat dissipation fins 143 disposed in thecirculation channel 141 are convexly disposed on the water-cooledplate 140. The intelligent cabin area liquid cooling host 100 with high-efficiency heat dissipation has the following effects: firstly, the cooling liquid cavity 140a can be designed into different shapes according to actual product requirements, the structural design space requirement is low, the host space can be saved, the technical popularization is facilitated, and the cooling liquid cavity 140a is designed to enable the storage space of the cooling liquid to be larger, so that the heat dissipation efficiency is improved; secondly, the circulating channel 141 can be designed according to the shape of the cooling liquid cavity 140a, the positions and the directions of the inlet 111 and the outlet 112, so that the heat of the chip can be taken away by the flowing cooling liquid more fully, and the first radiating fins 143 are arranged in a uniform and staggered manner, so that the flowing resistance of the cooling liquid can be reduced, the radiating area is larger, and the radiating effect of the host is optimized; moreover, the upper cover 110, the bottom shell 120 and the water cooling plate 140 are all designed by die-casting aluminum alloy, and can perform auxiliary heat dissipation on the chip; in addition, the main unit 100 of the present invention has less noise, solves the problem of noise caused by high-speed operation of the conventional fan, and improves user experience.

Other structures of the intelligent cabin area liquid-cooledhost 100 with efficient heat dissipation according to the present invention are conventional and well known to those skilled in the art, and will not be described in detail herein.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.

Claims (8)

1. An intelligent cabin area liquid cooling host capable of efficiently dissipating heat comprises an upper cover, a bottom shell and a main circuit board, wherein the upper cover and the bottom shell are connected in a sealing manner;

an inlet and an outlet are formed in the side wall of the upper cover or the bottom shell, an installation boss corresponding to the water cooling plate in shape is convexly arranged on the inner side surface of the upper cover or the bottom shell inwards, convex ribs are convexly arranged at the edge of the installation boss, a concave area is formed on the outer side surface of the upper cover or the bottom shell corresponding to the installation boss, and a plurality of second heat dissipation fins are arranged in the concave area;

the water cooling plate is hermetically arranged on the convex ribs, a cooling liquid cavity communicated with the inlet and the outlet is formed between the water cooling plate and the mounting boss, at least one flow guide wall is convexly arranged on the water cooling plate, the flow guide wall divides the cooling liquid cavity into at least two circulating channels, and a plurality of first radiating fins positioned in the circulating channels are also convexly arranged on the water cooling plate;

the other side of the water cooling plate, which is opposite to the first radiating fins, is also convexly provided with a plurality of first radiating bosses, and the first radiating bosses are in contact with the main circuit board.

2. The intelligent high-efficiency heat-dissipating liquid-cooled host computer of claim 1, wherein the main circuit board is provided with at least one heating element; the water cooling plate is convexly provided with a plurality of first heat dissipation bosses corresponding to the heating elements, and the first heat dissipation bosses are in contact with the heating elements in a laminating manner through heat-conducting glue.

3. The intelligent high-efficiency heat-dissipation cabin area liquid cooling host computer as claimed in claim 2, wherein a plurality of second heat dissipation bosses are further provided on an inner side of the upper cover or/and the bottom case in a protruding manner, the second heat dissipation bosses are in contact with the main circuit board through heat-conducting glue in a bonding manner, and a plurality of third heat dissipation fins are further provided on an outer side of one of the upper cover and the bottom case, which is far away from the water cooling plate, in a protruding manner.

4. The liquid-cooled host computer of claim 3, wherein each of the first heat-dissipating projection and the second heat-dissipating projection comprises a top surface and a plurality of inclined surfaces connected to the top surface, and the top surface contacts the heat-generating component or the main circuit board by heat-conducting glue.

5. The intelligent high-efficiency heat-dissipation cabin area liquid-cooled host computer of claim 1, further comprising at least one first circuit board, wherein at least one signal cavity is further concavely arranged on the outer side surface of the upper cover, a blocking edge is convexly arranged on the edge of the signal cavity, the first circuit board is arranged above the signal cavity, the edge of the first circuit board abuts against the blocking edge, and the first circuit board is hermetically connected to the upper cover.

6. The intelligent high-efficiency heat-dissipation cabin area liquid cooling host computer as claimed in claim 1, wherein a first shielding rib is further protruded on an inner side surface of the upper cover, a second shielding rib is protruded on an inner side surface of the bottom shell, and the first shielding rib and the second shielding rib are in contact with a copper exposed area of the main circuit board through conductive adhesive.

7. The intelligent high-efficiency heat-dissipation liquid-cooled host computer of any one of claims 1 and 5-6, wherein a flow-guiding dust-blocking structure is arranged between the upper cover and the bottom shell.

8. The intelligent high-efficiency heat-dissipation liquid-cooled host computer in the passenger cabin area as claimed in any one of claims 1 and 5 to 6, wherein a plurality of mounting lugs are further protruded from the edge of the bottom shell, and the mounting lugs are used for being quickly locked with the support of the automobile.

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