The application relates to a driving structure for an optical actuator and a corresponding camera module, which are divided into a plurality of patent applications, wherein the patent application number of the patent application is 202011338741.2, and the patent application is filed in the year 2020, 11 and 25.
Detailed Description
For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the application and is not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation of the feature. Accordingly, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size and shape of the object have been slightly exaggerated for convenience of explanation. The figures are merely examples and are not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of a table approximation, not as terms of a table level, and are intended to illustrate inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
The invention is further described below with reference to the drawings and specific embodiments.
Fig. 2 is a schematic cross-sectional view of an image capturing module with anti-shake function according to an embodiment of the present application. Referring to fig. 2, in the present embodiment, the image capturing module includes a lens 10, a photosensitive assembly 20, a first driving portion 30, and a second driving portion 40. Wherein the photosensitive assembly 20 includes a photosensitive chip 21. The first driving part 30 is configured to drive the lens 10 to move in both x and y directions, and the second driving part 40 is configured to drive the photosensitive chip 21 to move in both x and y directions. In this embodiment, the x and y directions are perpendicular to each other and are parallel to the photosensitive surface of the photosensitive element 20. The z direction is parallel to the normal direction of the photosensitive surface. for ease of understanding, a three-dimensional rectangular coordinate system constructed based on the x, y, z directions is also shown in fig. 2. In this embodiment, the control module drives the lens 10 and the photosensitive chip 21 to move in opposite directions at the same time, so as to realize optical anti-shake of the image capturing module. Specifically, the lens 1 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions, for example, the lens 10 is driven to move in the positive x-axis direction, and the photosensitive chip 21 is driven to move in the negative x-axis direction; the lens 10 is driven to move toward the positive y-axis direction, and the photosensitive chip 21 is driven to move toward the negative y-axis direction; or the lens 10 is driven to move in the x-axis and the y-axis while the photosensitive chip 21 is driven to move in the x-axis and the y-axis in the opposite direction to the movement of the lens 10, in other words, when the movement in the x-axis and the y-axis is required to be simultaneously performed, the direction of the displacement vector of the lens 10 and the direction of the displacement vector of the photosensitive chip 21 are opposite in the xoy plane. The camera module generally includes a position sensor for detecting shake of the camera module or a terminal device (i.e., an electronic device, such as a mobile phone, on which the camera module is mounted). When the shake is detected, the position sensor sends a signal to the image pickup module, and the lens 10 and the photosensitive chip 21 are driven to move correspondingly to compensate the shake, so that the purpose of optical shake prevention is achieved. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the movement directions of the lens 10 and the photosensitive chip 21 are opposite, so that a faster response can be achieved, and a better anti-shake effect is achieved. In addition, the anti-shake angle range of the camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in the present embodiment, by driving the lens 10 or the photosensitive chip 21 to move in opposite directions at the same time, a larger relative movement stroke (for convenience of description, the relative movement stroke may be simply referred to as an anti-shake stroke) is provided between the lens 10 and the photosensitive chip 21 than in the case of driving only the lens 10. In particular, due to the increase of the anti-shake stroke, the embodiment also has a better compensation effect on the tilting shake of the camera module. Further, the moving direction of the anti-shake movement of the present embodiment may be defined in the xoy plane, and the optical axis of the lens 10 or the photosensitive chip 21 does not need to be tilted, so that the problem of image sticking caused by the anti-shake movement is avoided.
Further, in another embodiment of the present application, the photosensitive chip 21 may be further driven by the second driving part 40 to rotate in the xoy plane, so as to implement compensation for shake in the rotation direction of the camera module.
Further, still referring to fig. 2, in one embodiment of the present application, the image capturing module includes a first driving section 30, a lens 10, a second driving section 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The first driving part 30 may have a cylindrical first motor carrier, which may be a movable part of the first driving part, and the lens is mounted on an inner side surface of the first motor carrier. The first driving part also has a stationary part, or called base part. In this embodiment, the base portion may be implemented as a motor housing. The motor housing may include a base and a cover. The base is provided with a light-passing hole. The movable part is movably connected with the base part. The driving element may be a coil magnet combination, which may be mounted between the movable part and the base part. For example, may be mounted between the first motor carrier and the motor housing. In fact, the first driving part in the present embodiment may directly adopt a common structure of the optical anti-shake motor in the prior art. Further, in the present embodiment, the second driving part 40 may be supported and fixed on the bottom surface of the first driving part 30. The second driving part 40 may also include a base part and a movable part. Wherein the base portion is directly connected with the first driving portion. The movable part is arranged below the base part and is movably connected with the base part. The photosensitive assembly 20 comprises a circuit board 23, a photosensitive chip 21 mounted on the surface of the circuit board, and a lens base 22 surrounding the photosensitive chip 21. The bottom of the lens base 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the movable portion of the second driving portion 40. The center of the lens base 22 has a light-transmitting hole, and a light filter 24 is mounted on the lens base 22 (the light filter 24 can also be regarded as a component of the photosensitive assembly 20). The photosensitive assembly 20 can translate in the x and y directions or rotate in the xoy plane relative to the base portion under the driving of the movable portion of the second driving portion 40. For convenience of description, the base portion of the first driving portion 30 is sometimes referred to herein as a first base portion, the base portion of the second driving portion 40 is referred to as a second base portion, the movable portion of the first driving portion 30 is referred to as a first movable portion, and the movable portion of the second driving portion 40 is referred to as a second movable portion.
Fig. 3 is a schematic cross-sectional view of an image capturing module with anti-shake function according to another embodiment of the present application. In this embodiment, the image capturing module includes a first driving portion 30, a lens 10, a second driving portion 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly of the first driving part 30 and the lens 10 may be identical to those of the previous embodiment shown in fig. 2, and will not be described again. This embodiment differs from the previous embodiment in that: the second driving part 40 is located inside the photosensitive assembly 20. In this embodiment, the photosensitive assembly 20 includes a circuit board 23, a lens base 22, an optical filter 24, and a photosensitive chip 21. The bottom of the lens base 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the base portion of the first driving portion 30. The center of the lens base 22 has a light-transmitting hole, and a light filter 24 is mounted on the lens base 22. The lens base 22, the optical filter 24 and the circuit board 23 can form a cavity, and the photosensitive chip 21 is located in the cavity 25. In this embodiment, the second driving portion 40 may also be located in the cavity 25. Specifically, the base portion of the second driving portion 40 may be mounted on the surface of the circuit board 23, and the movable portion of the second driving portion 40 may be movably connected to the base portion. The photosensitive chip 21 is mounted on the surface of the movable portion. In this way, the photosensitive chip 21 can translate in the x and y directions or rotate in the xoy plane relative to the base portion under the drive of the movable portion of the second driving portion 40.
The above describes, in connection with two embodiments, different structural implementations of the second driving part of the camera module according to the present application. The method for compensating the inclination shake of the camera module is further introduced based on the design thought of the application.
Fig. 4 is a schematic diagram showing the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the present application. In the figure, the position A represents the combination of the moving distance of the lens and the photosensitive chip for compensating the shake angle a of the camera module. As shown in fig. 4, the lens moving distance is b, the moving distance of the photosensitive chip (hereinafter sometimes simply referred to as chip) is c, and the lens or chip moving distance can be equivalent to the angle of the image plane deviating from the optical axis at the time of optical imaging. Specifically, when the translational distance of the lens in the xoy plane is b, an arithmetic relationship is formed between the image plane offset angle α1 and the image distance, the image distance is different at different shooting distances, and the image distance is replaced by the focal length of the image side for the convenience of calculation and expression. Specifically, the relationship between the image plane offset angle α1 and the focal length f of the lens is: tan (α1) =b/f, when the translation distance of the photosensitive chip in the xoy plane is c, the relationship between the image plane offset angle α2 and the focal length f of the lens image space is: tan (α2) =c/f. In this embodiment, the moving directions of the lens and the photosensitive chip are opposite, so the calculation mode of the comprehensive compensation angle a of the camera module is as follows: a=α1+α2=arctan (b/f) +arctan (c/f). In one embodiment, the moving distance of the lens and the photosensitive chip may be set to be the same, i.e., b=c. In another embodiment, the distance the lens moves from the photosensitive chip may be set to be unequal, for example, the distance the lens moves may be greater than the distance the photosensitive chip moves, i.e., b > c. In this embodiment, the second driving portion may select a smaller-sized driver (such as a mems driver, etc., and the movable stroke of such a driver is also relatively small), so as to help the overall miniaturization of the camera module.
Further, in one embodiment of the present application, the ratio of the lens moving distance to the moving distance of the photosensitive chip is optionally set to maintain a fixed ratio, for example, b/c=6:4, b/c=7:3, or b/c=5:5, and the distance between the lens and the moving distance of the photosensitive chip is maintained at the preset ratio no matter what the compensation value (e.g. the integrated compensation angle a) of the shake of the camera module is, which is beneficial to the uniformity of the compensation effect of the camera module in the compensable range and the design difficulty of the driving logic module of the anti-shake system of the camera module is also beneficial to be reduced.
Further, in the configuration in which the lens movement distance and the photosensitive chip movement distance are subjected to anti-shake movement based on a fixed ratio, since the movable range of the photosensitive chip is small, sometimes the shake of the image pickup module may exceed the maximum movement stroke of the photosensitive chip. Therefore, in one embodiment of the present application, an anti-shake threshold may be set, for example, for a shake angle a to be compensated, a threshold K may be set, and when the shake angle a actually calculated is less than or equal to the anti-shake threshold K, the lens moving distance b and the photosensitive chip moving distance c are kept at a fixed ratio, where the fixed ratio may be preset, for example, b/c=6:4, b/c=7:3, or b/c=5:5. When the actually calculated shake angle a is greater than the anti-shake threshold K, the moving distance c of the photosensitive chip takes the maximum value of the moving stroke, that is, the maximum stroke cmax of the photosensitive chip, and the lens moving distance b=tan (a/f) -cmax. In other words, when the shake angle to be compensated by the image capturing module is above the anti-shake threshold K, based on the preset fixed ratio, after the lens moves to the position corresponding to the maximum value of the movement distance of the photosensitive chip (i.e. the maximum stroke cmax of the photosensitive chip), the first driving portion may drive the lens to continue moving until the lens movement distance b=tan (a/f) -cmax. At the same time, the photosensitive chip is moved to the maximum value cmax of the movement distance of the photosensitive chip in the opposite direction in synchronization and then kept still.
Further, in another embodiment of the present application, in the xoy plane, an anti-shake angle corresponding to the maximum stroke bmax of the lens movement (the anti-shake angle refers to an angle of tilting shake of the image capturing module) may be smaller than an anti-shake angle corresponding to the maximum stroke cmax of the photosensitive chip. Under the design, the anti-shake system of the camera module can have a faster response speed. In high-end lenses, the lenses often have a large number of lenses, for example, the number of lenses in the rear-end main camera lens in the current smart phone can reach 8 lenses, and in order to further improve imaging quality, glass lenses are used in some lenses, which all result in a large lens weight. When the driving force is not significantly increased, the speed at which the driving device drives the lens to move will decrease. The weight of the photosensitive chip or the photosensitive component is relatively light, and the preset position can be reached by a small driving force. Therefore, in the scheme of the embodiment, the advantage that the photosensitive chip or the photosensitive assembly is relatively close in weight and relatively fast in moving speed can be better utilized, and the response speed of the anti-shake system of the camera module is effectively improved.
Further, in another embodiment of the present application, the fixed ratio of the lens moving distance to the moving distance of the photosensitive chip may be set according to factors such as the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip (or photosensitive assembly), the driving force of the second driving portion, and the like, and the proper fixed ratio may be set, so that the time for the lens and the photosensitive chip to move to the respective anti-shake target positions may be substantially consistent, thereby obtaining a better anti-shake effect. Specifically, the weight of the lens and the driving force of the first driving part may substantially determine the moving speed of the lens, and the weight of the photosensitive chip (or the photosensitive assembly) and the driving force of the second driving part may substantially determine the moving speed of the photosensitive chip, when the moving speed of the lens is smaller than the moving speed of the photosensitive chip (for example, when the weight of the lens is larger), the moving distance of the photosensitive chip may occupy a larger proportion when the fixed proportion is set, so that the characteristic of the moving speed of the photosensitive chip is higher may be utilized, so that the photosensitive chip moves a longer distance, and the time for the lens and the photosensitive chip to move to respective anti-shake target positions is substantially consistent.
Further, in another embodiment of the present application, the first driving part may employ a driving element having a large driving force, and a suspension system having a large stroke. For example, the first driving portion may be driven by an SMA (shape memory alloy) element. Compared with the traditional coil magnet combination, the SMA element can provide larger driving force with smaller occupied space, so that the first driving part can be designed more compactly, and the miniaturization of the camera module is facilitated.
Further, fig. 5 shows a schematic cross-sectional view of an image capturing module according to an embodiment of the present application. Referring to fig. 5, in the present embodiment, the second base portion 41 of the second driving portion 40 is fixed with the base portion (not specifically shown in fig. 5) of the first driving portion 30. The lens 10 may be mounted to a movable part (e.g., a first motor carrier, not specifically shown in fig. 5) of the first driving part 30. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21, a lens base 22, an optical filter 24, and the like. The photosensitive assembly 20 may be mounted to the second movable portion 42 of the second driving portion 40. Specifically, the bottom surface of the second movable portion 42 may bear against the top surface of the mirror base 22 of the photosensitive assembly 20. In the second driving portion 40, the second base portion 41 and the second movable portion 42 may be elastically connected by a suspension system. In this embodiment, the suspension system allows the second movable portion 42 to translate in the xoy plane with respect to the second base portion 41. Alternatively, the suspension system may be a ball system, which has the advantage that: in the z direction, the second movable portion 42 and the second base portion 41 are brought into contact by balls, the second movable portion 42 moves only in the xoy plane, and movement in the optical axis direction can be prevented by the balls between the second movable portion 42 and the second base portion 41, thereby avoiding an influence on focusing of the camera module.
Alternatively, in another embodiment, the suspension system may comprise a resilient element (e.g. a spring) by which the fixed and movable parts are connected, which allows translation of the movable part relative to the base part in the xoy plane but prevents movement of the movable part relative to the base part outside the xoy plane. The advantage of providing an elastic element compared to a ball system is: the elastic element can provide an initial force between the base part and the movable part, and the initial force can control the moving distance of the movable part or keep the position of the movable part by matching with the driving force of the driving element, so that the position of the movable part can be controlled without additionally providing a driving element for providing conjugate driving force. If a ball system is employed, the movable portion is free to move in the xoy direction relative to the base portion in the case where the driving element does not provide driving force, and therefore it is often necessary to provide at least a pair of driving forces in opposition to each other to control the holding of the movable portion in its initial position.
Further, still referring to fig. 5, in one embodiment of the present application, anti-shake may be achieved by driving the entire photosensitive assembly 20 to move. Meanwhile, the circuit board 23, the photosensitive chip 21, the lens seat 22 and the optical filter 24 are packaged into a whole, the circuit board 23, the lens seat 22 and the optical filter 24 form a closed space, the photosensitive chip 21 is accommodated in the closed space, the sealing performance of the photosensitive assembly 20 is improved, and the imaging of the photosensitive chip 21 in the process of making or using the camera module is not influenced by dust.
In this embodiment, still referring to fig. 5, in an embodiment of the present application, the back surface of the circuit board may directly bear against the terminal device (i.e. the electronic device on which the camera module is mounted, such as a mobile phone), and specifically, the back surface of the circuit board 23 may bear against the motherboard or other bearing member 90 of the terminal device. Although in the present embodiment, the second movable portion 42 is connected to the photosensitive assembly 20 and the second base portion 41 is connected to the first driving portion 30, it is understood that the movement of the second movable portion 42 and the second base portion 41 is opposite. In anti-shake movement, the movement direction is opposite: the direction of movement of the movable part of the first driving part relative to the base part thereof is opposite to the direction of movement of the movable part of the second driving part relative to the base part thereof.
Further, fig. 6 is a schematic cross-sectional view of an image capturing module according to another embodiment of the present application. Referring to fig. 6, in the present embodiment, a rear case 49 is added below the second driving part 40, and the rear case 49 is connected to the second base part 41 of the second driving part 40, and forms a receiving cavity in which the second movable part 42 of the second driving part 40 and the photosensitive member 20 are received. Referring to fig. 6, a gap 49a may be provided between the photosensitive member 20 and the bottom of the rear case 49. That is, the photosensitive assembly 20 is suspended, and the photosensitive assembly 20 is connected to only the second movable portion 42 of the second driving portion 40. In this embodiment, the rear housing 49 is directly supported against the terminal device. Since the rear case 49 connects the terminal device and the second driving part 40 and the base part of the first driving part 30, the movable parts of the first driving part 30 and the second driving part 40 simultaneously drive the lens 10 and the photosensitive member 20 to move in opposite directions, respectively, with the terminal device as a reference during the anti-shake process. Further, in the present embodiment, the second movable portion 42 of the second driving portion 40 is directly adhered to the upper end surface of the photosensitive assembly 20, so that the optical filter 24 is separated from the external space, and therefore, the chips generated by friction or collision of the second movable portion 42 during the movement relative to the second base portion 41 are prevented from directly falling onto the surface of the optical filter 24.
Fig. 7 is a schematic cross-sectional view of an image capturing module according to still another embodiment of the present application. Referring to fig. 7, in the present embodiment, the first driving part 30 is implemented to be adapted to drive the lens 10 to move in the optical axis direction to realize the focusing function, while also being adapted to drive the lens 10 to move in the xoy plane to realize the anti-shake function. Optionally, the first driving portion 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32, the lens 10 is supported by the first carrier 31, a suspension system is disposed between the first carrier 31 and the second carrier 32, and a suspension system is disposed between the second carrier 32 and a housing 33 of the first driving portion 30. The suspension system between the first carrier 31 and the second carrier 32 (i.e., the first suspension system) in this embodiment is configured as a ball system, and the suspension system between the second carrier 32 and the housing 33 (i.e., the second suspension system) is a suspension system based on elastic elements (e.g., spring plates). In the present embodiment, the second suspension system is provided outside the first suspension system, the first suspension system allows the lens 10 and the first carrier 31 to translate in the xoy plane to realize the anti-shake function, and the second suspension system allows the lens 10, the first carrier 31, and the second carrier 32 to integrally move in the optical axis direction to realize the focusing function. Alternatively, in another embodiment, the second suspension system may also be arranged inside the first suspension system. In another variant embodiment, the second suspension system may also be arranged below the first suspension system. In this embodiment, the suspension system is a system in which two members are movably connected, and the degree of freedom (i.e., the moving direction) of relative movement of the two members is limited. These two articulating components may be referred to as a base portion and a movable portion, respectively. Typically, the suspension system is used in conjunction with a drive element (e.g., an SMA element or coil magnet combination). Wherein a driving force is provided by the driving element, under which driving force the movable part is moved relative to the base part in a movement direction defined by the suspension system.
Further, fig. 8 is a schematic cross-sectional view of an image capturing module according to still another embodiment of the present application. Referring to fig. 8, the movable portion of the second driving portion 40 of the present embodiment may be provided with a downward extending arm 42a, and the extending arm 42a is adhered to the circuit board 23 of the photosensitive assembly 20. The extension arm 42a may be provided with an FPC board 42b, and the FPC board 42b may be directly soldered to the circuit board 23, thereby electrically conducting the driving element mounted on the movable portion and the circuit board 23. The embodiment can avoid the glue water flowing onto the optical filter when the photosensitive assembly 20 is adhered to the movable part, thereby influencing imaging. In addition, in the present embodiment, the upper end surface (i.e. the top end) of the photosensitive member 20 and the second driving portion 40 have a gap, so that the color filter can be prevented from being scratched or broken.
Further, fig. 9a shows a schematic perspective view of the second driving part in one embodiment of the present application, and fig. 9b shows a schematic exploded perspective view of the second driving part in one embodiment of the present application. Referring to fig. 9a and 9b, in the present embodiment, the second movable portion 42 of the second driving portion 40 and the center of the second base portion 41 each have a light passing hole through which light passing through the lens is incident on the photosensitive chip and imaged. In the present embodiment, the number of balls 80 is preferably four, and the balls are provided at four corners (i.e., four corner positions in a plan view) of the second driving portion 40.
Further, fig. 10a is a schematic cross-sectional view of the second driving portion and the photosensitive assembly according to an embodiment of the application. Referring to fig. 10a, in the present embodiment, the second driving part 40 includes a second movable part 42 and a second base part 41, wherein the second base part 41 includes a base 41a and a cover 41b. The cover 41b includes a side wall 41c extending downward from the base 41a to form a surrounding of the second movable portion 42 and a rest 41d extending horizontally inward from the side wall 41 c. The top of the sidewall 41c is connected to the base 41a, and the lower surface of the edge region 42a of the second movable portion 42 may be supported against the upper surface of the support table 41d. The balls 80 and the edge region 42a of the second movable portion 42 are sandwiched between the base 41a and the rest 41d of the cover 41b, ensuring that the second movable portion 42 and the second base portion 41 do not move relative to each other in the optical axis direction (i.e., the z-axis direction). In this way, the second driving portion 40 allows only the second movable portion 42 to translate in the xoy plane with respect to the second base portion 41. More specifically, at least one accommodation space is provided between the base 41a and the cover 41b, the accommodation space being provided with the balls 80, and the second movable portion 42 and the base 41a being respectively abutted against the balls 80, thereby ensuring that the second movable portion 42 and the second base portion 41 do not relatively move in the optical axis direction. The second movable portion 42 may include a body portion 42b and an edge region 42a, and the thickness of the edge region 42a may be smaller than that of the body portion 42 b. The lower surface (may also be referred to as a lower end surface or a bottom surface) of the main body portion 42b may be lower than the lower surface (may also be referred to as a lower end surface or a bottom surface) of the cover 41b, so as to ensure that the photosensitive assembly 20 does not contact the cover 41b after being attached to the second movable portion 42, and prevent the photosensitive assembly 20 from touching or rubbing against the cover when performing anti-shake movement.
Further, still referring to fig. 10a, in one embodiment of the present application, the upper surface of the second base part 41 may have a stepped structure, and the stepped structure may include a first stepped surface 41e located at the outer side and a second stepped surface 41f located at the inner side, and the height of the second stepped surface 41f is lower than that of the first stepped surface 41e, so as to provide a larger axial (i.e., z-axis) movement space for focusing of the camera module. In this embodiment, the first driving portion may be mounted to the first stepped surface 41e of the second base portion 41 of the second driving portion 40. The upper surface of the edge region 42a of the second movable portion 42 may form a groove that can accommodate the ball 80 and restrict the ball 80 from moving within the groove, while also retaining debris generated by friction of the ball 80 with the second movable portion 42 or the second base portion 41 within the groove. Also, since the balls 80 can be placed in the grooves, the second movable portion 42, the base 41a and the cover 41b of the second base portion 41 can be more conveniently assembled. In another embodiment, the boss on the outer side of the groove can be omitted, so that the design can reduce the transverse dimension of the second driving part, and the miniaturization of the camera module is facilitated. Since the outer-lying elevation of the recess is eliminated, the recess is now effectively degraded to a depression step whose outer-side step surface is lower than the inner-side step surface, and which, together with the side wall of the cover and the base, forms a receiving space for receiving the balls.
Further, in an embodiment of the present application, the edge region of the movable portion may be provided with a plurality of grooves, and the number of grooves may be matched with the number of balls. Each ball is respectively accommodated in the corresponding groove. The bottom surface of the groove can be a plane, so that the movable part can be ensured not to incline during translation, and meanwhile, the movable part and the base part can relatively move on three axes in the xoy plane only through a single-layer ball. Alternatively, a base groove may be provided at a position of the base corresponding to the movable portion groove. This design allows to reduce the thickness of the second drive part in case the ball diameter is constant. The bottom surface of the groove or the bottom surface of the recessed step (i.e., the outer step surface of the recessed step) is flat, and the movable portion is allowed to rotate in the xoy plane, i.e., about the z-axis, with respect to the base portion. The direction of rotation about the z-axis may be referred to as the Rz direction, and may also be referred to as Rz-axis rotation. In this embodiment, the photosensitive chip can move in three directions of x, y and Rz to realize anti-shake, so that the anti-shake device has better anti-shake capability. Since the x, y, and Rz directions of movement are all in the xoy plane, the aforementioned relative movement in the xoy plane on three axes, that is, movement in the x, y, and Rz directions is referred to.
Fig. 10b shows a schematic cross-sectional view of a second driving part with balls arranged at the lower side of the movable part in a variant embodiment of the application. Referring to fig. 10b, in the present embodiment, the ball 80 is located between the rest 41d of the cover 41b and the second movable portion 42. At the positions corresponding to the balls 80, the edge regions 42a of the second movable portion 42 and/or the rest table 41d may be provided with grooves, and groove bottom surfaces of the grooves may be provided as planes, thereby allowing the second movable portion 42 to move only in the xoy plane with respect to the second base portion 41 and not to be inclined when moving in the xoy plane.
Fig. 10c shows a schematic cross-sectional view of a second driving part with two layers of balls in a variant embodiment of the application. In the present embodiment, two layers of balls 81 and 82 are provided. Specifically, a layer of balls 81 is provided between the base 41a and the second movable portion 42, and a layer of balls 82 is provided between the second movable portion 42 and the rest 41d of the cover 41 b. Compared with the embodiment shown in fig. 10a, since a layer of balls 82 is added between the second movable part 42 and the rest 41d, the second movable part 42 does not directly rub against the rest 41d during anti-shake movement, and generation of debris is reduced. And the resistance of the second movable portion 42 at the time of movement can be reduced by providing the two layers of balls 81 and 82.
Further, fig. 11a shows a schematic cross-sectional view of the second driving part in an embodiment of the application. Referring to fig. 11a, in the present embodiment, an inward concave locking groove 42c is provided on the outer side surface of the second movable portion 42, and a receiving base 41d of a cover 41b of the second base portion 41 is fitted into the locking groove 42c. In this solution, the lower end surface of the second driving portion 40 may have a larger area, and when the lens base 22 is attached to the second movable portion 42, the glue may be disposed in an area further outside the lens base 22, so that the glue is kept away from the optical filter as far as possible, and the risk that the glue flows onto the optical filter 24 is reduced, and meanwhile, the risk that the lens base 22 rubs against the second base portion 41 during the anti-shake movement process is completely avoided. Further, in this embodiment, the second movable portion 42 may be split, for example, the second movable portion 42 may include a first movable portion member 43 and a second movable portion member 44, and the second movable portion member 44 and/or the first movable portion member 43 may be recessed laterally inward to form the slot 42c. Further, fig. 11b shows an assembled schematic view of the second driving part in an embodiment of the application. Referring to fig. 11a and 11b in combination, in the assembly process of the second driving part 42, the movable part first member 43, the second base part 41, and the balls 80 may be assembled, and then the movable part second member 44 may be attached to the lower end surface of the movable part first member 43. Under this kind of design, need not to worry when the mirror seat is attached that glue contacts basic portion, glue also can set up in the place that the mirror seat is close to the edge (need not dodge the basic portion in four corners) simultaneously and avoid glue to pollute the colour filter.
Alternatively, fig. 11c shows a schematic cross-sectional view of the second driving part in another embodiment of the present application. Referring to fig. 11c, in the present embodiment, the second movable portion 42 may be integrally formed, that is, the locking groove 42c is directly formed when the second movable portion 42 is formed. And the cover 41b may be of a separate type. Referring to fig. 11b, the cover 41b may include two separate cover members 41b1 and 41b2, and the two separate cover members 41b1 and 41b2 may be laterally inserted into the locking grooves 42c of the second movable part 42 from both left and right sides, respectively, to fix the axial (i.e., z-axis direction) positions of the second movable part 42 and the second base part 41, thereby completing the encapsulation of the second driving part 40.
Further, fig. 12 shows a schematic cross-sectional view of a second driving part in still another embodiment of the present application. Referring to fig. 12, in the present embodiment, an inward concave locking groove 42c is provided on the outer side surface of the second movable portion 42, and both the bearing table 41d of the second base portion 41 and the balls 80 are disposed in the locking groove.
In an embodiment of the present application, the movable portion is adhered to the upper end surface of the lens base of the photosensitive assembly, so as to connect the movable portion and the photosensitive assembly. In a modified embodiment, the movable portion may also be provided with a downward extending extension arm, and the circuit board of the photosensitive assembly is bonded through the extension arm, so as to realize connection between the movable portion and the photosensitive assembly. Referring to fig. 8 in combination, in the case where the extension arm 42a of the movable portion is bonded to the circuit board 23, alternatively, the lens holder may be selected as a small lens holder 22a with a low height, the small lens holder 22a is used only for mounting the photosensitive chip 24, and the electronic component 25 with a high height such as a capacitor or the like is disposed outside the photosensitive chip 21 and the small lens holder 22 a. The scheme can reduce the height of the lens base, thereby reducing the back focus of the camera module and further reducing the overall height of the module. In the present embodiment, since at least a portion of the electronic component is disposed outside the lens holder, preferably, the outer side surface of the movable portion of the second driving portion 40 has the clamping slot, so that the extension arm is disposed at the edge of the second driving portion, so that the extension arm is far away from the electronic component as far as possible, and the electronic component is prevented from being affected by glue.
Fig. 13a shows a schematic bottom view of the movable part of the second driving part in one embodiment of the application. In this embodiment, the glue 50 is disposed between the lower end surface of the second movable portion 42 and the upper end surface of the lens base of the photosensitive assembly. The glue 50 may be disposed so as to avoid the four corner regions, so as to avoid the glue 50 leaking into the gaps of the ball receiving structures at the four corners, thereby negatively affecting the anti-shake movement. At the same time, the edge of the second movable part 42 is prevented from being too close to the optical filter, so that the risk of glue contaminating the optical filter is reduced. Fig. 13b shows a schematic bottom view of the movable part of the second driving part in another embodiment of the present application. In this embodiment, the glue 50 may be arranged in a closed loop along the edge area of the lower end surface of the second movable part 42. This design can increase the sealing of the photosensitive assembly and prevent dust from falling onto the color filter.
It should be noted that the above embodiments may be combined with each other, for example, the card slot designs shown in fig. 11a, 11b and 12 may be combined with a double-layer ball design. Wherein the groove/recess step may be provided on the rest stand or on the movable portion.
Further, fig. 14 shows the mounting position of the driving element of the second driving part in the bottom view angle in one embodiment of the present application. Fig. 15a shows a schematic cross-sectional view of the driving element of the second driving part in an embodiment of the application. In the present embodiment, the magnet 61 may be provided at an edge region of the second base portion 41, and the coil 62 may be provided at an edge region 42a of the second movable portion 42. The coil 62 may be soldered to and connected to the circuit board 23 of the photosensitive member 20 via an FPC board (flexible board) provided on the second movable portion 42. Since the second movable portion 42 and the photosensitive member 20 are moved synchronously during the anti-shake process, soldering the coil 62 to the wiring board 23 through the FPC board can ensure that there is no relative movement of the wires or solder during the movement, reducing the risk of electrical connection failure or poor contact at the solder. In this embodiment, a magnet may be provided at the base 41a of the second base portion 41.
Further, fig. 15b shows a schematic cross-sectional view of an image capturing module according to an embodiment of the present application. Referring to fig. 14 and 15b, in one embodiment of the present application, the driving elements of the first driving part 30 and the second driving part 40 are both coil magnet combinations, and the first driving part 30 and the second driving part 40 may have a common magnet 61'. The common magnet 61' may be provided to the first base portion 31 or may be provided to the second base portion 41 (see fig. 15 b). For convenience of description, the coil of the first driving part 30 will be referred to as a lens driving coil 62a, and the coil of the second driving part 40 will be referred to as a photosensitive assembly driving coil 62b. The lens driving coil 62a is attached to the first movable portion 32, and the photosensitive assembly driving coil 62b is attached to the second movable portion 42. In this embodiment, the first driving part 30 drives the lens 10 to translate in the x-axis and y-axis directions by electromagnetic induction of the lens driving coil 62a and the common magnet 61', and the second driving part 40 drives the photosensitive chip to translate in the x-axis and y-axis directions by electromagnetic induction of the photosensitive assembly driving coil 62b and the common magnet 61'. Further, in the present embodiment, the common magnet 61' is disposed at an edge region of the second base portion 41, and the photosensitive member driving coil 62b is disposed at an edge region of the second movable portion 42. For convenience of description, in the second driving part 40, the common magnet 61' and the photosensitive assembly driving coil 62b are referred to as a coil magnet combination. Referring to fig. 14 in combination, in the present embodiment, the coil magnet combination includes a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65 in a plan view; wherein the first coil magnet pair 63 and the second coil magnet pair 64 are used for providing driving force in the x-axis direction; the third pair of coil magnets 65 is for providing a driving force in the y-axis direction. The second driving part 40 has a rectangular outer shape in a plan view, and the first coil magnet pair 61 and the second coil magnet pair 62 are disposed along the first side 48 and the second side 49 of the second driving part 40, respectively, and the first side 48 and the second side 49 do not intersect. The second coil magnet pair 63 is arranged along a third side 47 of the second driving part 40, and the third side 47 intersects both the first side 48 and the second side 49. Correspondingly, in the present embodiment, the lens driving coils include a first lens driving coil 62a1, a second lens driving coil 62a2, and a third lens driving coil (not shown in fig. 15b, the positions of which in the top view may refer to the positions of the third coil magnet pair 65 in fig. 14) disposed above the first, second, and third coil magnet pairs 63, 64, and 65, respectively. The common magnet 61' of the first lens driving coil 62a1 and the first coil magnet pair 63, and the common magnet 61' of the second lens driving coil 62a2 and the second coil magnet pair 64 are for providing a driving force in the x-axis direction, and the common magnet 61' of the third lens driving coil and the third coil magnet pair 65 is for providing a driving force in the y-axis direction.
Further, fig. 15c shows a schematic cross-sectional view of an image capturing module according to yet another embodiment of the present application. Reference is made to fig. 14 and 15c. In this embodiment, the first base portion 31 may include a motor base 31a located below the first movable portion 32, and the motor base 31a has a light-passing hole. In the present embodiment, the common magnet 61' is mounted on an edge region of the motor base 31 a; the first movable portion 32 has a cylindrical shape, the lens is attached to an inner surface of the first movable portion 32, and the lens driving coil 62a (for example, the first lens driving coil 62a1 and the second lens driving coil 62a 2) is attached to a bottom portion of the first movable portion 32. In the present embodiment, the magnet coil pair including the common magnet 61' and the lens driving coil 62a includes a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65 (see fig. 14); wherein the first pair of coil magnets 63 and the second pair of coil magnets 64 are for providing a driving force in the x-axis direction; the third pair of coil magnets 65 is for providing a driving force in the y-axis direction; and the outer contour of the first driving part is rectangular in a plan view, the first coil magnet pair 63 and the second coil magnet 64 are arranged along a first side and a second side of the first driving part 30, respectively, the first side and the second side do not intersect, and the third coil magnet 65 pair is arranged along a third side of the first driving part 30, the third side intersecting both the first side and the second side. The photosensitive assembly driving coil 62b includes a first photosensitive assembly driving coil, a second photosensitive assembly driving coil, and a third photosensitive assembly driving coil disposed below the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65, respectively; the common magnet of the first photosensitive assembly driving coil and the first coil magnet pair, and the common magnet of the second photosensitive assembly driving coil and the second coil magnet pair are used for providing a driving force of the photosensitive assembly 20 in the x-axis direction, and the common magnet of the third photosensitive assembly driving coil and the third coil magnet pair is used for providing a driving force of the photosensitive assembly 20 in the y-axis direction.
Further, in a modified embodiment of the present application, in the first driving section, one of the first lens driving coil and the second lens driving coil may be omitted, i.e., the first base section of the first driving section may be mounted with only the first lens driving coil or only the second lens driving coil to provide the driving force in the x-axis direction. In this embodiment, the lens does not need to rotate around the z-axis, but the first lens driving coil and the third lens driving coil are reserved, so that the movement of the x-axis and the y-axis can be realized. Specifically, in this embodiment, the magnet coil pair including the common magnet and the photosensitive member driving coil includes: a first coil magnet pair, a second coil magnet pair, and a third coil magnet pair; wherein the first coil magnet pair and the second coil magnet pair are used for providing driving force in the x-axis direction; the third coil magnet pair is used for providing driving force in the y-axis direction; and the outer contour of the second driving part is rectangular in a top view, the first coil magnet pair and the second coil magnet pair are respectively arranged along a first side and a second side of the first driving part, the first side and the second side are not intersected, the third coil magnet pair is arranged along a third side of the second driving part, and the third side is intersected with both the first side and the second side. The lens driving coil comprises an x-axis lens driving coil and a y-axis lens driving coil, wherein the x-axis lens driving coil can be positioned right above the first coil magnet pair, and the y-axis lens driving coil can be positioned right above the third coil magnet pair. And the lens driving coil may not be arranged right above the second coil magnet pair. The design can reduce the number of the lens driving coils of the first movable part, and is beneficial to reducing the difficulty in realizing the electric connection between the coils of the first movable part and the circuit board of the photosensitive assembly, so that the process cost is reduced, and the production yield is also beneficial to being improved. Meanwhile, due to the Rz movement freedom (namely, the freedom of rotation around the z axis) of the second movable part, the embodiment can still realize the relative rotation between the photosensitive chip and the electronic terminal equipment (such as a mobile phone) in the Rz freedom.
Further, fig. 15d shows a schematic cross-sectional view of an imaging module according to a variant embodiment of the application. This embodiment can be considered as a variation of the embodiment of fig. 15 c. Referring to fig. 15d, in the present embodiment, the common magnet is mounted on the bottom of the first base portion (for example, on the motor base). With this design, the distance between the lens driving coil 62a and the common magnet 61' in the first driving section is small, and the driving force of the coil magnet pair of the first driving section can be increased. However, the distance between the common magnet 61' and the coil of the second driving portion (photosensitive member driving coil 62 b) may be relatively large. Therefore, in the present embodiment, the notch 68 or the through hole 69 may be disposed at the position of the second base portion 41 corresponding to the common magnet 61 '(i.e. the photosensitive assembly driving coil is not blocked by the second base portion in the top view through the hollowed structure), so as to avoid reducing the electromagnetic force between the common magnet 61' and the photosensitive assembly driving coil 62b due to the blocking of the second base portion 41. In this embodiment, the notch 68 or the through hole 69 is a hollow structure formed by hollowing out a part of the block on the second base portion. Further, fig. 15e shows a schematic perspective view of the second driving part with the notch in the second base part, and fig. 15f shows a schematic exploded perspective view of the second driving part with the notch in the second base part. Referring to fig. 15e and 15f, it can be seen that the notch 68 refers to a hollowed-out structure with at least one side not surrounded by the non-hollowed-out area of the second base portion. For example, when the coil is disposed at a position close to the outer side surface of the second driving portion, the edge area of the second base portion corresponding to the coil may be hollowed out to form the notch. The photosensitive assembly driving coil may be any one or more of the first photosensitive assembly driving coil, the second photosensitive assembly driving coil, and the third photosensitive assembly driving coil. Fig. 15g shows a perspective view of the second driving part of the second base part having the through hole, and fig. 15h shows an exploded perspective view of the second driving part of the second base part having the through hole. Referring to fig. 15g and 15h, it can be seen that the through hole 69 is a hollow structure surrounded by the non-hollow area of the second base portion 41. In the present embodiment, the base 41b of the second base portion 41 is located between the motor base 31a and the second movable portion 42, and therefore the notch 68 or the through hole 69 is located on the base 41b of the second base portion 41. Note that the through hole 69 here refers to a through hole in the edge region for avoiding the magnetic field of the magnet, and is not a light passing hole in the center.
In the above embodiments, the design concept that the first driving portion and the second driving portion share the magnet is adopted, and this design concept can reduce the volume occupied by the first base portion or the second base portion for mounting the magnet, and help reduce the thickness of the base of the first base portion (for example, the motor base) or the base of the second base portion (the base of the second base portion is typically located between the first base portion and the second movable portion), thereby helping the anti-shake imaging module to achieve reduction in the height direction.
In the above embodiment, the bottom surface of the first base portion may be bonded with the top surface of the second base portion by using a first adhesive, so as to bond a first assembly formed by the first driving portion and the lens assembly with a second assembly formed by the second driving portion and the photosensitive assembly, thereby forming a complete image capturing module. In the top view, the first adhesive may be disposed outside the common magnet of the first base portion or the second base portion. This design can avoid that the adhesion between the first base part and the second base part is negatively affected. This is because the glue type is often selected according to the material of the first base portion and the second base portion, and therefore the adhesive force between the glue and the magnet is often weaker than the adhesive force between the glue and the first base portion and the second base portion. Therefore, in this embodiment, the arrangement position of the glue avoids the common magnet of the first base portion or the second base portion, which can help to improve the structural strength and reliability of the camera module.
Further, in the image capturing module according to an embodiment of the present application, the photosensitive assembly may include a circuit board, a photosensitive chip mounted on a surface of the circuit board, a lens mount mounted on a surface of the circuit board and surrounding the photosensitive chip, an optical filter mounted on the lens mount, and an electronic component mounted on a surface of the circuit board and located outside the lens mount. In the second driving part, the second movable part may have a rigid extension arm extending downward, the extension arm is adhered to the circuit board of the photosensitive assembly, the extension arm surrounds the periphery of the lens base, and the electronic component is located in a gap between the inner side surface of the extension arm and the outer side surface of the lens base; and the photosensitive assembly driving coil is electrically connected with the circuit board through an FPC, the FPC is attached to a side of the extension arm, and the FPC is directly soldered to the circuit board. In this embodiment, the rigid extension arm surrounding the lens mount may provide protection for the electronic components. The electronic components may be, for example, resistors, capacitors, etc., which may form, together with the lines in the circuit board, the various functional circuits required by the camera module.
Further, fig. 16a shows a schematic cross-sectional view of an image capturing module according to an embodiment of the present application. Referring to fig. 16a, in the present embodiment, a sidewall of the rear case 49 may have a first through hole 49b so that a Flexible Printed Circuit (FPC) of the circuit board 23 passes therethrough to make electrical connection with a main board or other parts of the terminal device. The center of the bottom plate 49c of the rear case 49 may have a second through hole 49d to facilitate assembly of the camera module. The process of assembling the camera module may include: the lens 10 is mounted on the first driving part 30, the second driving part 40 is attached to the bottom of the first driving part 30, and finally the photosensitive assembly 20 is attached to the second movable part 42 of the second driving part 40 upwards through the second through hole 49d at the bottom of the rear case 49.
Fig. 16b is a schematic diagram illustrating an assembly method of the camera module according to an embodiment of the present application. In this embodiment, optionally, the photosensitive assembly 20 may be placed on the adjusting device 29, and the second through hole 49d at the bottom of the rear case 49 allows the adjusting device 29 to determine the preferred position and posture of the photosensitive assembly 20 through an active calibration process, and then adhere to the second movable portion 42 of the second driving portion 40 through the glue 28.
Fig. 16c shows a schematic cross-sectional view of an imaging module according to another embodiment of the application. Referring to fig. 16c, in this embodiment, the bottom of the rear case 49 is a complete bottom plate 49c, i.e. the bottom plate 49c is not provided with a second through hole, when assembling, the second driving part 40 and the photosensitive assembly 20 may be attached together to form a first assembly, the first driving part 30 and the lens 10 may be assembled together to form a second assembly, then the relative positions of the first assembly and the second assembly (the active calibration includes the adjustment of the position and the posture) may be determined through the active calibration process, and finally the first driving part 30 and the second driving part 40 may be attached according to the relative positions determined through the active calibration, wherein the glue 27 for bonding the first assembly and the second assembly may be disposed between the bottom surface of the first driving part 30 and the top surface of the second driving part 40.
Further, fig. 17 shows an arrangement of an image capturing module and a connection strap thereof in an embodiment of the present application. Referring to fig. 17, in the present embodiment, the camera module may include a first connection belt 26a and a second connection belt 26b, the first connection belt 26a is disposed at a top region of the first driving portion 30 and electrically connected to the first driving portion 30, and the second connection belt 26b is in communication with the circuit board 23 of the photosensitive assembly 20. The second connecting strip 26b may be provided with a plurality of bends to form a bending lamination shape to buffer the stress caused by the movement of the photosensitive assembly 20. The end of the second connecting strap 26b may be provided with a connector which is optionally secured by pressing and electrically connected to the central column, and which in turn conducts the main board (or other component) of the terminal device through the central column 26 c. Likewise, the end of the first connecting strap 26a may also be connected to a connector that is fixed by pressing and electrically connected to the center pillar 26c, and then conducts the main board (or other components) of the terminal device through the center pillar 26 c. In the solution of this embodiment, the conducting circuit of the first driving portion 30 may be separated from the photosensitive assembly 20, and is not affected by the movement of the photosensitive assembly 20. The second connection strap 26b and the center pillar 26c may be accommodated in the second housing 70, the first connection strap 26a is located outside the second housing 70, and the top of the second housing 70 may have a third through hole 70a so that the connector of the first connection strap 26a protrudes into and is electrically conducted with the second connection strap 26b or the center pillar 26 c.
In the above embodiment, the first driving portion and the second driving portion may constitute a driving structure for the optical actuator, in which the first driving portion is adapted to mount the lens, the second driving portion is adapted to mount the photosensitive assembly, and the lens and the photosensitive chip are configured to be driven simultaneously and to move in opposite directions. For example, if the lens is driven to move towards the positive direction of the x axis, the photosensitive chip is driven to move towards the negative direction of the x axis; the lens is driven to move towards the positive direction of the y axis, and the photosensitive chip is driven to move towards the negative direction of the y axis; or the lens is driven to move in the x-axis and the y-axis while the photosensitive chip is driven to move in the x-axis and the y-axis in the opposite direction to the movement of the lens, in other words, when the movement in the x-axis and the y-axis is required to be simultaneously performed, the directions of the displacement vector of the lens and the displacement vector of the photosensitive chip are opposite in the xoy plane. In this embodiment, the lens and the photosensitive chip are configured to move simultaneously, and the moving directions of the lens and the photosensitive chip are opposite, so that a faster response can be realized, and the anti-shake effect is better. In addition, the anti-shake angle range of the normal camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in this embodiment, by driving the lens or the photosensitive chip to move in opposite directions at the same time, compared with the scheme of driving only the lens to move, a larger relative movement stroke (for convenience of description, the relative movement stroke may be simply referred to as an anti-shake stroke) is provided between the lens and the photosensitive chip, which may have a better compensation effect. In particular, due to the increase of the anti-shake stroke, the embodiment also has a better compensation effect on the tilting shake of the camera module. Further, the moving direction of the anti-shake movement in the embodiment may be limited in the xoy plane, so that the optical axis of the lens or the photosensitive chip does not need to be inclined, thereby avoiding the problem of image sticking caused by the anti-shake movement.
Further, in the camera module, the circuit board of the photosensitive assembly generally includes a rigid circuit board body and a flexible connection strap, one end of which is connected to the circuit board body, and the other end of which is connected to and conducts with a motherboard or other member of the electronic device through a connector. In the prior art, the flexible connecting belt of the photosensitive assembly is usually led out from the side surface of the main body of the circuit board, and the flexible connecting belt is approximately parallel to the surface of the column body of the circuit board. In this arrangement, the flexible connection strip may generate a large resistance to the movement of the circuit board main body, which may increase the force required to drive the circuit board main body to move, resulting in insufficient stroke of anti-shake compensation and a decrease in response speed. Also, the resistance caused by the connection belt is irregular, which makes it difficult for the second driving portion to compensate for the resistance, possibly causing a decrease in the accuracy of the anti-shake compensation. Therefore, the present embodiment provides a suspended circuit board as the circuit board of the photosensitive assembly adapted to the second driving portion, which is designed to help overcome the above-mentioned drawbacks caused by the connection belt.
Fig. 18 is a perspective view showing an assembled second driving part and photosensitive member in one embodiment of the present application. Fig. 19 shows an exploded view of the second driving part and the photosensitive member in one embodiment of the present application. Fig. 20 is a schematic perspective view of a photosensitive assembly and a suspension circuit board used in the photosensitive assembly according to an embodiment of the present application. Referring to fig. 18, 19 and 20, in the image capturing module of the embodiment, the photosensitive assembly 20 is connected to the second movable portion 42 of the second driving portion 40, so that the circuit board main body 71 can move in the xoy plane under the driving of the second movable portion 42. The wiring board 23 of the present embodiment is designed as a suspension structure. Specifically, the circuit board 23 includes a rigid circuit board body 71 and a flexible connection strap 72, and the connection strap 72 may include a third connection strap 72a and a fourth connection strap 72b, and the third connection strap 72a and the fourth connection strap 72b may be respectively led out from two opposite sides (for convenience of description, the two opposite sides may be referred to as a first side 74a and a second side 74 b) of the circuit board body 71 and bent upward. The third and fourth connection bands 72a and 72b after bending may form hanging parts 75, respectively. The suspension 75 may be connected to the base portion of the second driving portion 40 (or the first driving portion 30) to form a suspension structure. The suspension structure allows the base portion to suspend the circuit board main body 71 and its surface-mounted components (i.e., suspend the photosensitive assembly 20) by the bent portion 73 of the flexible connection strap 72. Specifically, in one example, the suspension portion 75 may have a through hole (suspension hole 75 a), and the second base portion 41 of the second driving portion 40 may have a corresponding hook 75b, and the hook 75b hooks the through hole of the suspension portion 75 to connect the suspension portion 75. In the prior art, the connecting belt and the circuit board main body are usually in the same plane, and deflection of the connecting belt on the same plane relative to the circuit board main body can generate larger resistance. In the present embodiment, the connecting strip 72 and the circuit board body 71 are provided with a bending portion 73 formed by bending upwards, and the resistance of the connecting strip 72 on the xoy plane (which can be regarded as a horizontal plane) relative to the circuit board body 71 is relatively small.
Further, in one embodiment of the present application, the third and fourth connection bands 72a and 72b may extend along the circumference of the circuit board main body 71 and the photosensitive assembly 20 such that the connection band 72 surrounds the photosensitive assembly on at least three sides. And, the third connection strap 72a and the fourth connection strap 72b are connected to each other and electrically connected. Wherein the photosensitive member 20 has a first side 74a and a second side 74b which are positioned in conformity with the wiring board main body 71. The first side 74a and the second side 74b are disposed opposite (i.e., do not intersect) and the third side 74c of the photosensitive assembly 20 intersects both the first side 74a and the second side 74b. The connecting band 72 may be looped around the first side 74a, the second side 74b, and the third side 74c of the photosensitive assembly 20. The third connecting band 72a is led out from the first side 74a of the circuit board main body 71 and is bent upward to form the bending portion 73, then extends along the first side 74a of the photosensitive member 20, is bent in the horizontal direction at the corner, and continues to extend along the third side 74c. The fourth connecting strip 72b is led out from the second side 74b of the circuit board main body 71 and is bent upwards to form another bending part 73, then extends along the second side 74b of the photosensitive assembly 20, is bent horizontally at a corner, and continues to extend along the third side 74c. The third 72a and fourth 72b connecting strips may be joined and electrically conductive to each other at the third side 74c, thereby forming a complete connecting strip 72. The three connection strap sections at the first, second and third sides 74a, 74b and 74c may have at least one hanging portion 75, respectively, each of the hanging portions 75 having at least one through hole so as to be connected with the second base portion 41 of the second driving portion 40 (or the first driving portion 30). In this embodiment, the suspension portion 75 can suspend the circuit board body 71 by the bending portions 73 located at opposite sides of the circuit board body 71, so that the bending portions 73 and the connecting strap 72 can bend and deform when the circuit board body 71 is driven to move by the second driving portion 40, thereby satisfying the movement stroke of the circuit board body 71.
Further, in one embodiment of the present application, the suspension 73 of the three connecting band sections at the first, second and third sides 74a, 74b, 74c may be reinforced by a rigid substrate. For example, a rigid substrate may be attached to a partial region of the flexible connection tape to form the suspension 73. While other areas of the flexible connecting band remain flexible so as to be capable of bending and deforming and meet the movement stroke of the circuit board main body 71.
Further, in one embodiment of the present application, the connection strap section located on the third side 74c may have a rigid hanging portion 75c, and the hanging portion 75c may lead out a fifth connection strap 76, and the fifth connection strap 76 may be used to connect to a motherboard of an electronic device (e.g., a mobile phone).
Further, in another embodiment of the present application, the suspension part may be connected to an external bracket (not shown) which is directly or indirectly fixed to the base part of the second driving part. In the present application, the suspension portion may be fixed to the base portion of the second driving portion through another intermediary. Wherein the intermediary may be directly or indirectly fixed to the base part of the second driving part. The intermediate has hooks thereon to hook the suspension portion, or the intermediate is adhered to the suspension portion. The intermediate may be an outer bracket, a base portion of the first driving portion, or another intermediate.
Further, in another embodiment of the present application, the hanging portion may not have the through hole. In this embodiment, the suspension part may be fixed to the base part of the second driving part (or to the base part of the first driving part or the outer bracket) by means of adhesion. Further, in another embodiment of the present application, the third connection strap and the fourth connection strap may be a rigid-flex board, wherein a portion forming the suspension portion may be a rigid board, and both a portion connecting the suspension portion and the bending portion formed by bending upward may be a flexible board. Since the suspension portion is directly formed by the hard plate, the suspension portion in the embodiment can be reinforced without attaching the rigid substrate.
Further, in an embodiment of the present application, the circuit board main body, the third connection strap and the fourth connection strap may be formed of a single integrated soft and hard combined board.
Further, still referring to fig. 18, 19 and 20, in one embodiment of the present application, the circuit board may further have a fixing portion 76a for fixing the fifth connection strap 76, which is designed to prevent the circuit board main body 71, the third connection strap 72a and the fourth connection strap 72b from being affected by external factors.
Further, fig. 21a shows a schematic front view of a suspension board according to an embodiment of the present application after being unfolded; fig. 21b shows a schematic back view of a suspension board in an embodiment of the application after deployment. Referring to fig. 21a and 21b, in the present embodiment, the circuit board 23 may be formed of a rigid-flex board. Wherein the sections of the third connecting strip 72a and the fourth connecting strip 72b on the third side 74c can be snapped together by means of connectors 78, 79 (see fig. 20 in combination), the third connecting strip 72a and the fourth connecting strip 72b are fixedly connected and further electrically connected. Circuits are provided in the third connecting strip 72a and the fourth connecting strip 72b to lead out the wires in the circuit board main body 71, and then the wires are connected to an external circuit through the fifth connecting strip 76 and the connector 77 thereof. Since the third connecting band 72a and the fourth connecting band 72b can each draw out a part of the wiring by the corresponding bent portion 73 formed by the upward bending, the wiring required to be drawn out of each bent portion 73 can be reduced, so that the width of each bent portion 73 can be reduced, thereby further reducing the resistance of the flexible connecting band 72 to the movement of the wiring board main body 71, and further reducing the driving force required to be supplied by the second driving portion 40. It should be noted that, in other embodiments of the present application, the circuit of the circuit board main body may be led out through only one of the bending portions (for example, the bending portion of the third connecting strip that is bent upward or the bending portion of the fourth connecting strip that is bent upward).
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and are not limiting. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the appended claims.