preferably, the reaction monomer is a mixture of styrene, butyl acrylate and acrylic acid, wherein the mass percentage ratio of the styrene to the butyl acrylate to the acrylic acid is 34-40: 50-61: 2-5.5.

Preferably, the functional monomer is 4-hydroxybutylacrylate.

Preferably, the flame retardant monomer is hydroxyethyl methacrylate phosphate.

Preferably, the composite emulsifier is a mixture of SR-10 and ER-10, and the mass fraction ratio of SR-10 to ER-10 is 1-4: 1.

Wherein SR-10 is an anionic emulsifier and is Idiaceae brand; ER-10 is a nonionic emulsifier and is made by Ediko brand.

Preferably, the pH adjusting agent is 2-amino-2-methyl-1-propanol.

Preferably, the antimicrobial agent is CN-46.

The antibacterial agent used in the invention is a hoffman Defros CN-46 tank preservative.

Preferably, the silica sol is a dispersion liquid with the mass fraction of silica being 28-32%, the pH value of the silica sol is 9.0-11.0, and the average particle size of the silica in the silica sol is 3-5 nm.

The silica sol used in the present invention was HS-530K, and the manufacturer was Linyi Kohn silicon products, Inc.

The invention also aims to provide a preparation method of the high-thixotropy flame-retardant water-based transparent nail-free glue, which comprises the following specific steps:

preparation of pre-emulsion:

adding a composite emulsifier and deionized water into an emulsifying machine, and stirring for 1h until the mixture is dispersed to prepare an emulsifier aqueous solution with the mass percentage concentration of 5-16%; dropwise adding a reaction monomer, a functional monomer and a flame-retardant monomer into the emulsifier aqueous solution, and stirring for 1h until the mixture is uniformly dispersed to obtain a pre-emulsion;

preparing a seed emulsion:

dissolving ammonium persulfate in deionized water to prepare an initiator aqueous solution with the mass percentage concentration of 12-17%; according to the weight ratio of sodium citrate: pre-emulsion: emulsifier: deionized water is 1.4-2: 20: 1: 181-200, stirring and heating to 78 ℃; adding an aqueous initiator solution to the reaction kettle when the temperature rises to 78 ℃, wherein the ratio of the aqueous initiator solution: the mass ratio of the sodium citrate is 3.3: 1.3-2.1; reacting for 1h at the temperature of 79 +/-1 ℃ to obtain seed emulsion;

preparing the water-based base material:

at the temperature of 79 +/-1 ℃, dropwise adding the pre-emulsion and the initiator aqueous solution into the seed emulsion again, wherein the dropwise adding of the pre-emulsion and the initiator aqueous solution is carried out simultaneously, wherein the initiator aqueous solution: pre-emulsion: the mass ratio of the sodium citrate is 8.0-9.0: 446-450: 1.3-2.1, wherein the dripping time is 4.0 +/-0.5 h; after the dropwise addition is finished, heating and raising the temperature, and carrying out heat preservation reaction for 1-2 h at the temperature of 83 +/-2 ℃ to obtain a water-based base material;

fourthly, preparing glue:

and (3) putting the water-based base material into a high-speed dispersion power mixer, sequentially adding the pH regulator, the bactericide and the silica sol at the rotating speed of 600 +/-30 r/min, and stirring for 15 +/-2 min until the materials are uniformly dispersed to prepare the high-thixotropy flame-retardant water-based transparent nail-free adhesive.

In the step of preparing the pre-emulsion, a part of emulsifier is added to prepare emulsifier aqueous solution; in the preparation step of the seed emulsion, a part of emulsifier is added into the reaction kettle, and the sum of the two parts is the total amount of the whole emulsifier.

In the step of preparing the pre-emulsion, mixed monomers (reaction monomers, functional monomers and flame-retardant monomers) are added dropwise into an emulsifier aqueous solution to prepare the pre-emulsion, wherein the pre-emulsion is the amount of the whole pre-emulsion, part of the pre-emulsion is added into a reaction kettle in the process of preparing the seed emulsion, and the rest of the pre-emulsion is added in the process of preparing the aqueous base material.

In the preparation process of the seed emulsion, ammonium persulfate is dissolved in deionized water to prepare an initiator aqueous solution with the mass percentage concentration of 12-17%, wherein the initiator aqueous solution is the whole initiator aqueous solution. And c, adding a part of initiator aqueous solution into the reaction kettle in the preparation process of the seed emulsion, and dropwise adding the rest of initiator aqueous solution into the seed emulsion in the preparation process of the water-based base material, wherein the sum of the part of initiator aqueous solution and the rest of initiator aqueous solution is the amount of the whole initiator aqueous solution.

Compared with the prior art, the invention has the following characteristics:

the invention uses deionized water as a dispersion medium, does not add any organic solvent, tackifying emulsion, chelating tin and other metal catalysts, is environment-friendly and harmless to human bodies, and ensures that the product really has good environmental protection;

styrene, butyl acrylate and acrylic acid are used as reaction monomers, 4-hydroxybutyl acrylate is used as a functional monomer for polymerization, the obtained polymer has a large number of hydroxyl structures and can form strong hydrogen bonds with silicon dioxide particles in alkaline silica sol, so that silicon dioxide aggregates dispersed in the system are connected into a complete silicon dioxide network to fill the whole system, the viscosity of the system is increased, and the thickening effect is achieved; in addition, carboxyl on the obtained polymer can be neutralized into salt by alkali, electrostatic repulsion and hydration are generated in molecules, a macromolecular structure is gradually stretched from a curling state, a large amount of water molecules around the macromolecular structure are adsorbed, free water is reduced, the consistency of the system is further greatly improved, the glue solution can obtain high thixotropy, and the vertical face construction can be realized;

the traditional thickening thixotropic agent such as fumed silica, precipitated silica, modified polyamide wax powder, modified castor oil, organic bentonite, inorganic bentonite and the like is not used, so that the adverse effect of the thickening thixotropic agent on the transparency is avoided, and the excellent transparency of the glue solution is ensured;

the invention adopts hydroxyethyl methacrylate phosphate as a reactive phosphorus-containing flame retardant, and introduces phosphate groups with flame retardant function to the polymer through copolymerization, so that the polymer has certain flame retardant capability, thereby realizing flame retardance of the adhesive film;

the invention uses the anionic reactive emulsifier SR-10 and the nonionic reactive emulsifier ER-10 to compound as the compound emulsifier. The reactive emulsifier can copolymerize with monomers, so that the polymer molecular chain is grafted with a long chain with a surface active structure, and the long chain structure has both hydrophobic groups and hydrophilic groups, so that the polymer molecular chain also has surface activity. They can form a large micelle structure in water, and are mutually adsorbed and associated in molecules or among molecules, so that the consistency of the emulsion is further increased. Meanwhile, the stability of the aqueous base material is greatly improved;

sixthly, the water-based transparent nail-free glue provided by the invention has the advantages that the glue film is milky when in use, and is in a completely transparent state after the glue film is completely cured. The adhesive film has good transparency, the light transmission capability is better than that of a shoulder solvent type nail-free adhesive, the seamless adhesion can be realized on transparent materials such as glass, acrylic and the like, and the application range is wider;

the invention has the curing speed and the super strong bonding ability which are comparable to those of solvent type transparent nail-free glue.

Detailed Description

The present invention is further illustrated by the following specific examples.

Example 1

The high-thixotropy flame-retardant water-based transparent nail-free glue comprises the following components in percentage by weight:

the preparation method comprises the following steps:

preparation of a Pre-emulsion

Adding 105g of deionized water, 3.0gSR-10 and 3.0gER-10 emulsifiers into an emulsifying machine in sequence, and stirring for 1h until the mixture is uniformly dispersed to obtain an emulsifier aqueous solution; the mixed monomers (110g of styrene, 189g of butyl acrylate, 16g of acrylic acid, 14g of 4-hydroxybutyl acrylate and 28g of hydroxyethyl methacrylate phosphate) were added dropwise to the aqueous emulsifier solution, and the mixture was stirred for 1 hour until the dispersion was uniform, thereby obtaining 468g of a pre-emulsion.

② preparation of seed emulsion

a. Dissolving 1.4g of ammonium persulfate in 10g of deionized water to prepare 11.4g of initiator aqueous solution;

b. adding 200g of deionized water, 1.4g of sodium citrate, 20g of pre-emulsion, 0.5g of SR-10 and 0.5g of ER-10 emulsifier into a reaction kettle in sequence, stirring and heating to 78 ℃; adding 3.3g of initiator aqueous solution into the reaction kettle, and carrying out heat preservation reaction for 1h at the temperature of 79 +/-1 ℃ to obtain the seed emulsion showing blue light.

Preparation of aqueous base stock

Simultaneously dropwise adding 448g of the residual whole pre-emulsion and 8.1g of the residual initiator aqueous solution into the seed emulsion at the temperature of 79 +/-1 ℃, wherein the dropwise adding time is 4.0 +/-0.5 h; after the dropwise addition is finished, heating and raising the temperature, and carrying out heat preservation reaction for 2 hours at the temperature of 83 +/-2 ℃ to obtain the aqueous base material.

Fourthly, glue preparation

Putting the water-based base material into a high-speed dispersion power mixer, starting stirring, sequentially adding 7.0g of 2-amino-2-methyl-1-propanol, 0.7g of bactericide CN-46 and 17.5g of silica sol HS-530K at the rotating speed of 600 +/-30 r/min, and dispersing for 15 +/-2 min until the materials are uniformly dispersed to prepare the high-thixotropy flame-retardant water-based transparent nail-free adhesive.

The nail-free glue prepared by the ingredients and the method is white before solidification, has excellent thixotropy, does not flow when standing upside down, and is transparent after solidification.

Example 2

the preparation method comprises the following steps:

preparation of a Pre-emulsion

Adding 105g of deionized water, 10gSR-10 and 3gER-10 emulsifier in sequence into an emulsifying machine, and stirring for 1h until the mixture is uniformly dispersed; mixed monomers (98g of styrene, 168g of butyl acrylate, 14g of acrylic acid, 28g of 4-hydroxybutyl acrylate and 42g of hydroxyethyl methacrylate phosphate) are added dropwise into the emulsifier aqueous solution, and the mixture is stirred for 1 hour until the mixture is uniformly dispersed, so that 468g of pre-emulsion is prepared.

② preparation of seed emulsion

a. 2.0g of ammonium persulfate is dissolved in 10g of deionized water to prepare 12g of initiator aqueous solution;

b. adding 181.3g of deionized water, 2.0g of sodium citrate, 20g of pre-emulsion, 0.5gSR-10 and 0.5gER-10 of emulsifier into a reaction kettle in sequence, stirring and heating to 78 ℃; adding 3.3g of initiator aqueous solution into the reaction kettle, and carrying out heat preservation reaction for 1h at the temperature of 79 +/-1 ℃ to obtain the seed emulsion showing blue light.

Preparation of aqueous base stock

Simultaneously dropwise adding 448g of the rest of all pre-emulsion and 8.7g of initiator aqueous solution into the seed emulsion at the temperature of 79 +/-1 ℃, wherein the dropwise adding time is 4.0 +/-0.5 h; after the dropwise addition is finished, heating and raising the temperature, and carrying out heat preservation reaction for 2 hours at the temperature of 83 +/-2 ℃ to obtain the aqueous base material.

Fourthly, glue preparation

Putting the water-based base material into a high-speed dispersion power mixer, starting stirring at 600 +/-30 r/min, sequentially adding 7.0g of 2-amino-2-methyl-1-propanol, 0.7g of bactericide CN-46 and 28g of HS-530K, and dispersing for 15 +/-2 min until the materials are uniformly dispersed to obtain the high-thixotropy flame-retardant water-based transparent nail-free adhesive.

Example 3

the preparation method comprises the following steps:

firstly, preparation of Pre-emulsion

Adding 105g of deionized water, 14.5gSR-10 and 5.5gER-10 emulsifier in sequence into an emulsifying machine, and stirring for 1 hour until the mixture is uniformly dispersed; mixed monomers (98g of styrene, 168g of butyl acrylate, 14g of acrylic acid, 16g of 4-hydroxybutyl acrylate and 28.6g of hydroxyethyl methacrylate phosphate) are added dropwise into the emulsifier aqueous solution, and stirred for 1 hour until the mixture is uniformly dispersed, thereby obtaining 449.6g of pre-emulsion.

② preparation of seed emulsion

b. adding 200g of deionized water, 2.0g of sodium citrate, 20g of pre-emulsion, 0.5gSR-10 and 0.5gER-10 of emulsifier into a reaction kettle in sequence, stirring and heating to 78 ℃; adding 3.3g of initiator aqueous solution into the reaction kettle, and carrying out heat preservation reaction for 1h at the temperature of 79 +/-1 ℃ to obtain the seed emulsion showing blue light.

Preparation of aqueous base stock

Simultaneously dropwise adding 429.6g of the rest total pre-emulsion and 8.7g of the rest initiator aqueous solution into the seed emulsion at the temperature of 79 +/-1 ℃, wherein the dropwise adding time is 4.0 +/-0.5 h; after the dropwise addition is finished, heating and raising the temperature, and carrying out heat preservation reaction for 2 hours at the temperature of 83 +/-2 ℃ to obtain the aqueous base material.

Fourthly, glue preparation

Putting the water-based base material into a high-speed dispersion power mixer, starting stirring at 600 +/-30 r/min, sequentially adding 2-amino-2-methyl-1-propanol (14.0 g), a bactericide CN-46 (1.4 g) and 20gHS-530K, and dispersing for 15 +/-2 min until the materials are uniformly dispersed to prepare the high-thixotropy flame-retardant water-based transparent nail-free adhesive.

Comparative example 1

This comparative example is the case of a nail-free adhesive prepared using a conventional thickening thixotropic agent (fumed silica) and the product obtained is a nontransparent product. It is considered in the industry that the adhesive force of the transparent product is generally lower than that of the non-transparent product, but the product prepared according to the technical scheme provided by the invention, such as the products in the examples 1 and 2, is a transparent product, but the adhesive force of the product can reach or even be better than that of the product in the comparative example 1.

The novel environment-friendly water-based nail-free glue comprises the following components in percentage by weight:

the preparation method comprises the following steps:

putting the VAE emulsion into a high-speed dispersion power mixer, adding water, chlorinated fatty acid methyl ester, a dispersing agent 5040, a defoaming agent DF-681 and a foam inhibitor DF-814, and stirring for 30min until the mixture is uniformly dispersed.

Adding heavy calcium carbonate, and stirring for 30-50 min until the mixture is uniformly dispersed.

And thirdly, adding fumed silica, and stirring for 40-60 min until the fumed silica is uniformly dispersed to prepare the novel environment-friendly water-based nail-free glue.

Comparative example 2

The comparative example is a compounding system and a preparation method of a solvent type transparent nail-free glue. The transparency of the solvent type nail-free glue is the best transparency of all the nail-free glues, and the nail-free glue prepared by adopting the technical scheme of the invention is a water-based product, does not add an organic solvent and a tackifying emulsion, and achieves the transparency level of the solvent type nail-free glue after being cured.

The preparation method of the transparent nail-free glue comprises the following steps: adding 10 parts of cyclohexane, 2 parts of methylal, 8 parts of ethyl acetate and 10 parts of tetrachloroethylene into a reaction kettle according to the weight part ratio of the formula, adding 25 parts of SEBS, 7 parts of rosin resin, 4 parts of terpene resin and 4 parts of tackifier AT-90X under the stirring state, uniformly stirring, adding 10 parts of transparent powder, BP-186B5 parts of organic bentonite, 2450.7 parts of antioxidant, HP-1361.7 parts and 7700.7 parts of hindered amine light stabilizer, stirring until the materials are completely dissolved, filtering and discharging to obtain the transparent nail-free glue.

Comparative example 3

In comparison to the batch system of the present invention, no silica sol was added to this comparative example.

The flame-retardant water-based transparent nail-free glue comprises the following components in percentage by weight:

the preparation method comprises the following steps:

preparation of a Pre-emulsion

Adding 105g of deionized water, 3.0gSR-10 and 3.0gER-10 emulsifiers into an emulsifying machine in sequence, and stirring for 1 hour until the mixture is uniformly dispersed; obtaining an emulsifier aqueous solution;

the mixed monomers (110g of styrene, 189g of butyl acrylate, 16g of acrylic acid, 14g of 4-hydroxybutyl acrylate and 28g of hydroxyethyl methacrylate phosphate) are added dropwise into the aqueous solution of the emulsifier and stirred for 1 hour until the mixture is uniformly dispersed, thus obtaining the pre-emulsion.

② preparation of seed emulsion

a. Dissolving 1.40g of ammonium persulfate in 10g of deionized water to prepare an initiator aqueous solution;

b. adding 200g of deionized water, 1.40g of sodium citrate, 20g of pre-emulsion, 0.5gSR-10 and 0.5gER-10 of emulsifier into a reaction kettle in sequence, stirring and heating to 78 ℃; adding 3.3g of initiator aqueous solution into the reaction kettle, and carrying out heat preservation reaction for 1 hour at the temperature of 79 +/-1 ℃ to obtain the seed emulsion showing blue light.

Preparation of aqueous base stock

Simultaneously dripping all the residual pre-emulsion and the initiator aqueous solution into the seed emulsion at the temperature of 83 +/-2 ℃, wherein the dripping time is 4.0 +/-0.5 h; after the dropwise addition is finished, heating and raising the temperature, and carrying out heat preservation reaction for 2 hours at the temperature of 83 +/-2 ℃ to obtain the aqueous base material.

Fourthly, glue preparation

Putting the water-based base material into a high-speed dispersion power mixer, starting stirring at 600 +/-30 r/min, sequentially adding 7.0g of 2-amino-2-methyl-1-propanol and 0.7g of bactericide CN-46, and dispersing for 15 +/-2 min until the materials are uniformly dispersed to obtain the flame-retardant water-based transparent nail-free adhesive.

Comparative example 4

In comparison with the compounding system of the present invention, no functional monomer was added in this comparative example.

the preparation method comprises the following steps:

preparation of a Pre-emulsion

Adding 105g of deionized water, 3.0gSR-10 and 3.0gER-10 emulsifier in sequence into an emulsifying machine, and stirring for 1h until the mixture is uniformly dispersed; the mixed monomer (110g of styrene, 189g of butyl acrylate, 16g of acrylic acid and 28g of hydroxyethyl methacrylate phosphate) is added dropwise into the emulsifier aqueous solution, and the mixture is stirred for 1 hour until the mixture is uniformly dispersed, so that the pre-emulsion is prepared.

② preparation of seed emulsion

b. adding 200g of deionized water, 1.40g of sodium citrate, 20g of pre-emulsion, 0.5gSR-10 and 0.5gER-10 of emulsifier into a reaction kettle in sequence, stirring and heating to 78 ℃; adding 3.3g of initiator aqueous solution into the reaction kettle, and carrying out heat preservation reaction for 1h at the temperature of 79 +/-1 ℃ to obtain the seed emulsion showing blue light.

Preparation of aqueous base stock

Simultaneously dripping all the residual pre-emulsion and the initiator aqueous solution into the seed emulsion at the temperature of 79 +/-1 ℃, wherein the dripping time is 4.0 +/-0.5 h; after the dropwise addition is finished, the reaction is carried out for 2 hours at the temperature of 83 +/-2 ℃ to obtain the aqueous base material.

Fourthly, glue preparation

Putting the water-based base material into a high-speed dispersion power mixer, starting stirring at 600 +/-30 r/min, sequentially adding 7.0g of 2-amino-2-methyl-1-propanol, 0.7g of bactericide CN-46 and 17.5g of HS-530K, and dispersing for 15 +/-2 min until the materials are uniformly dispersed to obtain the flame-retardant water-based transparent nail-free adhesive.

Comparative example 5

In this comparative example, no flame retardant monomer was used, as compared to the compounding system of the present invention.

The high thixotropic water-based transparent nail-free glue comprises the following components in percentage by weight:

the preparation method comprises the following steps:

preparation of a Pre-emulsion

Adding 105g of deionized water, 3.0gSR-10 and 3.0gER-10 emulsifier in sequence into an emulsifying machine, and stirring for 1 hour until the mixture is uniformly dispersed; the mixed monomers (110g of styrene, 189g of butyl acrylate, 16g of acrylic acid and 14g of 4-hydroxybutyl acrylate) are added dropwise to the aqueous emulsifier solution and stirred for 1h until the mixture is uniformly dispersed, thus obtaining the pre-emulsion.

② preparation of seed emulsion

Preparation of aqueous base stock

Simultaneously dripping all the residual pre-emulsion and the initiator aqueous solution into the seed emulsion at the temperature of 79 +/-1 ℃, wherein the dripping time is 3.5-4.0 h; after the dropwise addition is finished, the reaction is carried out for 2 hours at the temperature of 83 +/-2 ℃ to obtain the aqueous base material.

Fourthly, preparing the glue

Putting the water-based base material into a high-speed dispersion power mixer, starting stirring at 600r/min +/-30 r/min, sequentially adding 7.0g of 2-amino-2-methyl-1-propanol, 0.7g of bactericide CN-46 and 17.5g of HS-530K, and dispersing for 15 +/-2 min until the materials are uniformly dispersed to obtain the high-thixotropy water-based transparent nail-free adhesive.

The relative performance of the nail-free glues of examples 1-3 and comparative examples 1-5 was tested using the following method:

test of tensile shear Strength

And testing according to a method for testing the tensile shear strength of 24h and 168h in standard nail-free glue for indoor wall surface light decorative plates JC/T2186-2013.

② thixotropic ability

The thixotropic capacity of the nail-free glue is measured by taking the sag as an index, and the detection method is tested according to a sag test method in standard nail-free glue for indoor wall surface light decorative plates JC/T2186-2013.

Flame retardant ability

The glass rod was inserted into the gel to a depth of 10mm, and then taken out and cured at room temperature for 7 days. After the glue had solidified, the alcohol lamp was lit for 3s, the lamp was removed and the duration of the open flame on the sample after removal of the lamp was measured with a stopwatch with a minimum graduation of 0.1 s. And evaluating the flame retardant capability of the cured glue solution by taking the duration of the open flame as an index. The test method refers to HG/T3659-2020 Chlorella adhesive for quick bonding conveyer belt.

Fourthly, transparency

Comparative nail-free glue clarity tests for examples 1-3 and comparative examples 1-2 were conducted as follows:

the transparent PVC plastic (50 mm. times.50 mm. times.2 mm) was bonded with the appropriate amounts of examples 1-3 and comparative examples 1-2. And curing the sample for 48 hours at room temperature, and comparing the transparencies of different samples.

The results of the performance tests on the nail-free adhesives obtained in examples 1 to 3 and comparative examples 1 to 5 are shown in Table 1.

TABLE 1 test results of examples and comparative examples

From the detection results, it can be seen that:

comparison of tensile shear strengths:

the conclusion obtained from the test results of the shear strength of 24h and 168h is that the tensile shear strength of the nail-free glue obtained by applying the technical scheme of the invention can reach or even be superior to that of the nail-free glue in the comparative example.

② comparison result of thixotropic ability:

comparative examples 1, 2, 3 and 5 show the sag of the nail-free glue prepared by using the functional monomer 4-hydroxy butyl acrylate and silica sol HS-530K, and the performance test results are 0.5mm, 0.4mm and 0.5 mm; comparative example 3 with the addition of a functional monomer and without the addition of silica sol data 5.2mm, and comparative example 4 with the addition of silica sol and without the addition of a functional monomer data 7.2 mm.

Therefore, when only the functional monomer 4-hydroxybutyl acrylate is matched with the silica sol HS-530K for use, the sag of the glue solution is smaller, and the glue solution has better thixotropy.

③ the comparison result of flame retardant ability:

the open flame duration data shows that: in comparative example 1, example 2, example 3, comparative example 3 and comparative example 4, the flame-retardant monomer hydroxyethyl methacrylate phosphate is used for polymerization, and the obtained nail-free glue has excellent flame retardant capability; the hydroxyethyl methacrylate phosphate which is not used as a flame retardant monomer in comparative example 5 participates in polymerization and has no flame retardant ability.

Comparison result of transparency:

the transparency of the nail-free glue prepared in the embodiments 1, 2 and 3 of the invention can reach the level of the solvent type transparent nail-free glue in the comparative example 2.

The data in Table 1 show that the high-thixotropy flame-retardant water-based transparent nail-free glue obtained by the invention has high bonding strength, meets the related index requirements in the standard JC/T2186-2013, has extremely high transparency and good flame retardance, and is obviously superior to the products in the prior art.

It should be understood that the detailed description of the present invention is only for illustrating the present invention and is not limited by the technical solutions described in the embodiments of the present invention, and those skilled in the art should understand that the present invention can be modified or substituted equally to achieve the same technical effects; as long as the use requirements are met, the method is within the protection scope of the invention.

Claims

1. The high-thixotropy flame-retardant water-based transparent nail-free glue is characterized by comprising the following components in percentage by mass:

2. the highly thixotropic flame retardant water-based transparent nail-free adhesive according to claim 1, which is characterized in that: the reaction monomer is a mixture of styrene, butyl acrylate and acrylic acid, wherein the mass percentage ratio of the styrene to the butyl acrylate to the acrylic acid is 34-40: 50-61: 2-5.5.

3. The highly thixotropic flame retardant water-based transparent nail-free adhesive according to claim 1, which is characterized in that: the functional monomer is 4-hydroxy butyl acrylate.

4. The highly thixotropic flame retardant water-based transparent nail-free adhesive according to claim 1, which is characterized in that: the flame-retardant monomer is hydroxyethyl methacrylate phosphate.

5. The highly thixotropic flame retardant water-based transparent nail-free adhesive according to claim 1, which is characterized in that: the composite emulsifier is a mixture of SR-10 and ER-10, and the mass fraction ratio of SR-10 to ER-10 is 1-4: 1.

6. The highly thixotropic flame retardant water-based transparent nail-free adhesive according to claim 1, which is characterized in that: the pH regulator is 2-amino-2-methyl-1-propanol.

7. The highly thixotropic flame retardant water-based transparent nail-free adhesive according to claim 1, which is characterized in that: the antibacterial agent is CN-46.

8. The highly thixotropic flame retardant water-based transparent nail-free adhesive according to claim 1, which is characterized in that: the silica sol is a dispersion liquid with the mass fraction of 28-32% of silica, the pH value of the silica sol is 9.0-11.0, and the average particle size of the silica in the silica sol is 3-5 nm.

9. The preparation method of the high thixotropic flame retardant water-based transparent nail-free glue according to any one of claims 1 to 8, which is characterized by comprising the following specific steps:

preparation of pre-emulsion:

preparing a seed emulsion:

preparing the water-based base material:

fourthly, preparing glue: