技术领域technical field
本申请涉及消费性电子产品领域，具体涉及一种壳体、外壳组件以及电子设备。The present application relates to the field of consumer electronic products, in particular to a housing, a shell assembly and electronic equipment.
背景技术Background technique
随着通信技术的发展，手机和平板电脑等电子设备已经成为了人们不可或缺的工具。电子设备的电源或者其他电子器件在工作时会产生大量的热量，带来电子设备的整体温度升高，影响用户的使用体验。甚至当温度急剧升高时，存在自燃风险。现在的一些电子设备在温度升高后都会自动采取部分降低功耗的措施，这导致电子设备的运行效率下降，导致电子设备变得卡顿；同时用户握持电子设备时会有烫手情形。With the development of communication technology, electronic devices such as mobile phones and tablet computers have become indispensable tools for people. A power supply of an electronic device or other electronic devices will generate a large amount of heat during operation, which will increase the overall temperature of the electronic device and affect user experience. Even when the temperature rises sharply, there is a risk of spontaneous combustion. Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device.
发明内容Contents of the invention
本申请的目的在于提供一种壳体、外壳组件以及电子设备，以至少部分地解决上述技术问题。The purpose of the present application is to provide a casing, a shell assembly and an electronic device, so as to at least partly solve the above technical problems.
第一方面，本申请实施例提供了一种壳体，包括基板、散热膜片以及柔性膜层，散热膜片包括蒸发腔、散热流道、第一管道和第二管道，蒸发腔通过第一管道连通散热流道的进口，通过第二管道连通散热流道的出口，柔性膜层与基板之间形成多个气囊，多个气囊经由活塞管与第一管道连通，活塞管内设有能够自由移动且与活塞管的内壁气密地接触的活塞。蒸发腔内填充有处于第一相的相变介质，相变介质当由于受热相变为第二相并从蒸发腔进入第一管道时，驱动活塞运动，以改变气囊内的气压，进而使柔性膜层发生变形。In the first aspect, the embodiment of the present application provides a casing, which includes a substrate, a heat dissipation diaphragm, and a flexible film layer. The heat dissipation diaphragm includes an evaporation chamber, a heat dissipation flow channel, a first pipe, and a second pipe. The pipeline is connected to the inlet of the heat dissipation flow channel, and the second pipeline is connected to the outlet of the heat dissipation flow channel. A plurality of air bags are formed between the flexible film layer and the substrate, and the plurality of air bags are connected to the first pipe through the piston tube. and a piston that is in airtight contact with the inner wall of the piston tube. The evaporation chamber is filled with a phase-change medium in the first phase. When the phase-change medium changes to the second phase due to heat and enters the first pipeline from the evaporation chamber, it drives the piston to move to change the air pressure in the air bag, thereby making the flexible The film is deformed.
第二方面，本申请实施例提供了一种外壳组件，包括中框、前壳以及上述的壳体，前壳和壳体装配于中框，且位于中框的相背的两侧，壳体中的柔性膜层位于远离中框的一侧。In the second aspect, the embodiment of the present application provides a casing assembly, including a middle frame, a front casing, and the above-mentioned casing, the front casing and the casing are assembled on the middle frame, and are located on opposite sides of the middle frame, and the casing The flexible film layer is located on the side away from the middle frame.
第三方面，本申请实施例还提供了一种电子设备，包括上述的外壳组件和发热组件，发热组件设置于外壳组件内，且蒸发腔与发热组件对应设置。In a third aspect, the embodiment of the present application further provides an electronic device, including the above-mentioned casing assembly and a heating assembly, the heating assembly is arranged in the casing assembly, and the evaporation chamber is arranged correspondingly to the heating assembly.
本申请实施例提供的壳体及其制备方法、外壳组件以及电子设备，蒸发腔可以对应于电子设备的发热元件设置，当发热元件发热时，蒸发腔内第一相的相变介质相变为第二相，将热量从发热元件区域带到散热流道所在区域进行扩散，同时相变介质进入第一管道以及活塞管内，驱动活塞做功，使得气囊内的气压增大，又由于柔性膜层是柔性的，当气囊内气压增加时，会使得柔性膜层变形凸起，形成凹凸的触感，起到防滑作用。在此过程中，第二相的相变介质对活塞做功，使得一部分热能转换为机械能消耗掉，不仅可以快速的散热，降低电子设备的温度，也可以实现外壳的防滑效果。同时第二相的相变介质进入散热流道内，散热冷凝重新相变为第一相，并经第二管道回流入蒸发腔内，完成散热循环，热量从发热元件区域向电子设备的其他区域转移，这样可以加快散热效率。In the housing and its preparation method, housing assembly, and electronic equipment provided in the embodiments of the present application, the evaporation chamber can be set corresponding to the heating element of the electronic equipment. When the heating element generates heat, the phase change medium of the first phase in the evaporation chamber changes to In the second phase, the heat is diffused from the area of the heating element to the area where the heat dissipation channel is located. At the same time, the phase change medium enters the first pipe and the piston tube to drive the piston to do work, so that the air pressure in the air bag increases, and because the flexible film layer is Flexible, when the air pressure in the airbag increases, the flexible film layer will deform and bulge, forming a bumpy touch and playing an anti-skid role. During this process, the phase-change medium of the second phase acts on the piston, so that part of the heat energy is converted into mechanical energy and consumed, which can not only quickly dissipate heat, reduce the temperature of electronic equipment, but also achieve the anti-skid effect of the casing. At the same time, the phase change medium of the second phase enters the heat dissipation flow channel, and the heat dissipation condensation re-phases into the first phase, and flows back into the evaporation chamber through the second pipeline to complete the heat dissipation cycle, and the heat is transferred from the heating element area to other areas of the electronic device , which can speed up the cooling efficiency.
本申请的这些方面或其他方面在以下实施例的描述中会更加简明易懂。These or other aspects of the present application will be more concise and understandable in the description of the following embodiments.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.
图1是本申请实施例示出的一种电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device shown in an embodiment of the present application.
图2是图1中沿A-A线的剖面结构示意图。Fig. 2 is a schematic cross-sectional structure diagram along line A-A in Fig. 1 .
图3是本申请实施例提供的一种外壳组件的爆炸结构示意图。Fig. 3 is a schematic diagram of an exploded structure of a shell assembly provided by an embodiment of the present application.
图4是本申请实施例提供的一种壳体的剖视图。Fig. 4 is a cross-sectional view of a casing provided by an embodiment of the present application.
图5是本申请实施例提供的一种壳体中散热膜片的结构示意图。FIG. 5 is a schematic structural diagram of a heat dissipation diaphragm in a casing provided by an embodiment of the present application.
图6是图5中示出的壳体的部分剖面结构示意图。FIG. 6 is a partial cross-sectional structural schematic view of the housing shown in FIG. 5 .
图7是本申请实施例提供的另一种壳体的部分剖面结构示意图。Fig. 7 is a partial cross-sectional structural schematic diagram of another housing provided by an embodiment of the present application.
图8是本申请实施例提供的再一种壳体的部分剖面结构示意图。Fig. 8 is a partial cross-sectional structural schematic diagram of another casing provided by the embodiment of the present application.
图9是图8中示出的壳体在柔性膜层出现凹凸变化过程时的状态示意图。FIG. 9 is a schematic diagram of the state of the housing shown in FIG. 8 when the flexible film layer undergoes a concave-convex change process.
图10是本申请实施例提供的另一种壳体中散热膜片的结构示意图。FIG. 10 is a schematic structural diagram of another heat dissipation diaphragm in a casing provided by an embodiment of the present application.
图11是图10中示出的壳体的部分剖面结构示意图。FIG. 11 is a partial cross-sectional structural schematic diagram of the housing shown in FIG. 10 .
图12是本申请实施例提供的壳体的制备方法的流程图。Fig. 12 is a flow chart of a method for preparing a casing provided in an embodiment of the present application.
具体实施方式Detailed ways
下面将结合附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings. Apparently, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
随着通信技术的发展，手机和平板电脑等移动终端已经成为了人们不可或缺的工具。消费者在面对琳琅满目的移动终端产品时，不仅需要考虑产品的功能是否满足自身需求，产品的外观也是左右消费者是否选购的重要因素之一。然而，随着移动终端的迭代，各品牌的移动终端外形逐渐趋于同质化，外观辨识度较差。相关技术中，电子设备的壳体多是采用金属、玻璃、陶瓷等材质制备，且为了使色泽均一，通常会设计成较为光滑的造型，虽然美观，但存在握持时容易滑落的风险。With the development of communication technology, mobile terminals such as mobile phones and tablet computers have become indispensable tools for people. When faced with a wide range of mobile terminal products, consumers not only need to consider whether the functions of the products meet their own needs, but also the appearance of the products is one of the important factors that determine whether consumers choose or not. However, with the iteration of mobile terminals, the appearance of mobile terminals of various brands tends to be homogenized gradually, and the appearance recognition is poor. In the related art, the casings of electronic devices are mostly made of metal, glass, ceramics and other materials, and in order to make the color uniform, they are usually designed in a relatively smooth shape. Although they are beautiful, there is a risk of slipping when holding.
相关技术中，电子设备散热通常通过在中框内贴石墨导热片实现，这种散热方式的散热效率较低，且虽然石墨导热片可以将发热区域的热量带走，但不能快速的将热量散失，电子设备的整体温度上升仍会较快。In related technologies, the heat dissipation of electronic equipment is usually achieved by pasting graphite heat conduction sheets in the middle frame. The heat dissipation efficiency of this heat dissipation method is low, and although the graphite heat conduction sheets can take away the heat from the heat-generating area, they cannot quickly dissipate the heat. , the overall temperature rise of electronic equipment will still be relatively fast.
基于此，本申请的发明人提出了本申请各实施例的壳体、外壳组件以及电子设备，以至少部分地解决上述缺陷。以下结合附图具体描述本申请的各实施例。Based on this, the inventors of the present application propose the casing, the housing assembly and the electronic device of various embodiments of the present application to at least partly solve the above-mentioned defects. Various embodiments of the present application are described below in detail with reference to the accompanying drawings.
如图1和图2所示，本实施例提供一种电子设备10，包括外壳组件110以及发热组件(图未示出)，其中发热组件位于外壳组件110内，电子设备10还包括显示屏120、主板、电池140、前置摄像头130等。其中，发热组件例如可以是芯片、电池140、主板等中的一者或多者，在此不做限定。主板、电池140设置于外壳组件110内，前置摄像头130设置于电子设备10的显示屏120一侧。本实施例提供的电子设备10以手机为例进行说明，但不限定于此。显示屏120可以采用LCD(Liquid Crystal Display，液晶显示)屏用于显示信息，LCD屏可以为TFT(ThinFilm Transistor，薄膜晶体管)屏幕或IPS(In-Plane Switching，平面转换)屏幕或SLCD(Splice Liquid Crystal Display，拼接专用液晶显示)屏幕。在另一些实施例中，显示屏120可以采用OLED(Organic Light-Emitting Diode，有机电激光显示)屏用于显示信息，OLED屏可以为AMOLED(Active Matrix Organic Light Emitting Diode，有源矩阵有机发光二极体)屏幕或Super AMOLED(Super Active Matrix Organic Light EmittingDiode，超级主动驱动式有机发光二极体)屏幕或Super AMOLED Plus(Super ActiveMatrix Organic Light Emitting Diode Plus，魔丽屏)屏幕。As shown in Figures 1 and 2, this embodiment provides an electronic device 10, including a housing assembly 110 and a heating assembly (not shown), wherein the heating assembly is located in the housing assembly 110, and the electronic device 10 also includes a display screen 120 , motherboard, battery 140, front camera 130, etc. Wherein, the heating component may be, for example, one or more of a chip, a battery 140 , a motherboard, etc., which is not limited herein. The main board and the battery 140 are arranged in the shell assembly 110 , and the front camera 130 is arranged on the side of the display screen 120 of the electronic device 10 . The electronic device 10 provided in this embodiment is described by taking a mobile phone as an example, but is not limited thereto. Display screen 120 can adopt LCD (Liquid Crystal Display, liquid crystal display) screen to be used for displaying information, and LCD screen can be TFT (ThinFilm Transistor, thin film transistor) screen or IPS (In-Plane Switching, plane conversion) screen or SLCD (Splice Liquid Crystal Display, splicing dedicated liquid crystal display) screen. In other embodiments, the display screen 120 may use an OLED (Organic Light-Emitting Diode, organic electro-laser display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light Emitting Diode, active matrix organic light-emitting diode) Polar body) screen or Super AMOLED (Super Active Matrix Organic Light Emitting Diode, super active drive type organic light emitting diode) screen or Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus, magic screen) screen.
请参阅图2和图3，外壳组件110包括中框111、前壳112以及壳体200，中框111包括中板1111和边框1112，边框1112围设于中板1111的边缘且突出于中板1111，并且边框1112在中板1111的相背的两侧均突出于中板1111。显示屏120装配于前壳112。前壳112和壳体200分别装配于中板1111的相背的两侧，且前壳112和壳体200均与边框1112装配固定；壳体200与中框111以及前壳112共同形成容纳腔，容纳腔内可以设置主板、摄像头130、天线、处理器等各类元器件。Referring to FIG. 2 and FIG. 3 , the housing assembly 110 includes a middle frame 111 , a front shell 112 and a casing 200 , the middle frame 111 includes a middle plate 1111 and a frame 1112 , and the frame 1112 surrounds the edge of the middle plate 1111 and protrudes from the middle plate 1111 , and the frame 1112 protrudes from the middle board 1111 on opposite sides of the middle board 1111 . The display screen 120 is assembled on the front case 112 . The front shell 112 and the housing 200 are respectively assembled on opposite sides of the middle plate 1111, and the front shell 112 and the housing 200 are assembled and fixed with the frame 1112; , various components such as a motherboard, a camera 130, an antenna, a processor, etc. can be arranged in the accommodating cavity.
本实施例中，参阅图4，壳体200包括基板210、散热膜片230以及柔性膜层240，基板210具有相背的第一表面201和第二表面202，第一表面201朝向容纳腔102，第一表面201和第二表面202大致相互平行。基板210可以是透明结构，也可以非透明结构。为了增大壳体200的整体刚性，基板210可以采用硬质材料制成，例如硬塑料、陶瓷、玻璃、金属等材质制成。较佳的，为了使得壳体具有更好的导热效果，基板210可以采用导热系数更高的材料，例如金属制成。In this embodiment, referring to FIG. 4 , the housing 200 includes a substrate 210 , a heat dissipation film 230 and a flexible film layer 240 , the substrate 210 has a first surface 201 and a second surface 202 opposite to each other, and the first surface 201 faces the accommodation chamber 102 , the first surface 201 and the second surface 202 are substantially parallel to each other. The substrate 210 can be a transparent structure or a non-transparent structure. In order to increase the overall rigidity of the casing 200, the substrate 210 may be made of hard materials, such as hard plastic, ceramics, glass, metal and other materials. Preferably, in order to make the housing have a better heat conduction effect, the substrate 210 may be made of a material with a higher heat conduction coefficient, such as metal.
基板210可以为大致矩形的板体，基板210的边缘可以设置一定的弧度，以使电子设备10具备更好的握持手感。基板210可以包括相对的第一边缘和第二边缘，以及相对的第三边缘和第四边缘，其中第一边缘和第二边缘连接于第三边缘和第四边缘之间，第一边缘、第三边缘、第二边缘以及第四边缘首尾连接形成基板210的外边缘。第一边缘和第二边缘可以沿基板210的长度方向设置，第三边缘和第四边缘沿基板210的宽度方向设置。The substrate 210 may be a substantially rectangular board, and the edges of the substrate 210 may be provided with a certain arc, so that the electronic device 10 has a better grip. The substrate 210 may include opposite first edges and second edges, and opposite third edges and fourth edges, wherein the first edge and the second edge are connected between the third edge and the fourth edge, and the first edge, the second edge The three edges, the second edge and the fourth edge are connected end to end to form the outer edge of the substrate 210 . The first edge and the second edge may be arranged along the length direction of the substrate 210 , and the third edge and the fourth edge may be arranged along the width direction of the substrate 210 .
基板210还可以开设摄像头安装孔201，用于安装电子设备10的后置摄像头，摄像头安装孔201可以贯穿基板210，且摄像头安装孔201可以是矩形孔或者圆孔等，在此不做限定。The substrate 210 can also have a camera installation hole 201 for installing the rear camera of the electronic device 10. The camera installation hole 201 can pass through the substrate 210, and the camera installation hole 201 can be a rectangular hole or a round hole, etc., which is not limited here.
基板210可以包括第一区域211和第二区域212，其中，第一区域211和/或第二区域212可以是连续的，也可以是非连续的，在此不做限定。作为一种实施方式，第一区域211可以位于基板210的大致中部位置，第二区域212可以位于基板210的靠近边缘的位置。The substrate 210 may include a first region 211 and a second region 212 , wherein the first region 211 and/or the second region 212 may be continuous or discontinuous, which is not limited herein. As an implementation manner, the first region 211 may be located approximately in the middle of the substrate 210 , and the second region 212 may be located near the edge of the substrate 210 .
散热膜片230设置于基板210的第一区域211，具体而言，散热膜片230设置于基板210的第二表面202，即设置于基板210的远离容纳腔的一侧，并可以与电池140、芯片、主板等发热组件对应设置，以通过基板210实现热量传导。此外，基板210与发热组件之间还可以设置导热材料，导热材料例如可以是导热硅胶、石墨片、热管等。在电子设备10的使用过程中，发热组件会产生较多热量，因此发热组件所在区域温度上升会更快，尤其是电子设备10在长期使用过程中，发热组件所在区域的温度很高，出现烫手情形。The heat dissipation film 230 is disposed on the first region 211 of the substrate 210. Specifically, the heat dissipation film 230 is disposed on the second surface 202 of the substrate 210, that is, on the side of the substrate 210 away from the accommodating cavity, and can be connected to the battery 140 Heat-generating components such as chips, motherboards, etc. are arranged correspondingly, so as to realize heat conduction through the substrate 210 . In addition, a heat-conducting material may also be provided between the substrate 210 and the heating component, and the heat-conducting material may be, for example, heat-conducting silica gel, graphite sheet, heat pipe, and the like. During the use of the electronic device 10, the heating components will generate more heat, so the temperature of the area where the heating components are located will rise faster. situation.
参阅图5和图6，散热膜片230包括蒸发腔231、散热流道232、第一管道233、第二管道234、活塞管235和活塞236。其中，蒸发腔231可以对应于电子设备10内的一种或多种发热组件设置，即蒸发腔231位于发热组件所在区域，发热组件例如可以包括电池140、芯片、主板中的至少一者。散热流道232可以对应于电子设备10内的非发热组件设置，非发热组件是指在工作过程中产热量较少或者不发热的元器件，例如中框111。即散热流道232位于电子设备10的非发热组件所在区域，作为冷凝腔。Referring to FIG. 5 and FIG. 6 , the cooling diaphragm 230 includes an evaporation chamber 231 , a cooling channel 232 , a first pipeline 233 , a second pipeline 234 , a piston tube 235 and a piston 236 . Wherein, the evaporation chamber 231 can be set corresponding to one or more heating components in the electronic device 10, that is, the evaporation chamber 231 is located in the area where the heating components are located, and the heating components can include at least one of the battery 140, chip, and motherboard, for example. The heat dissipation channel 232 may be provided corresponding to the non-heating components in the electronic device 10 , and the non-heating components refer to components that generate less heat or do not generate heat during operation, such as the middle frame 111 . That is, the cooling channel 232 is located in the area where the non-heating components of the electronic device 10 are located, serving as a condensation cavity.
散热流道232具有进口(未示出)和出口(未示出)，蒸发腔231通过第一管道233连通进口，通过第二管道234连通出口，形成供相变介质循环流动的回路。活塞管235连通第一管道233和气囊241，活塞236设置于活塞管235内，且当活塞管235内的气压变化时，活塞236能够在活塞管235内自由移动，且与活塞管235的管壁气密地连接，使得活塞236两侧的气体不会彼此连通，活塞236例如可以采用硅胶、海绵、橡胶等材质制成。气囊2414可包括多个离散分布的气囊，这些气囊均与活塞管235保持连通，多个离散分布的气囊具有相同的内部气压。The cooling channel 232 has an inlet (not shown) and an outlet (not shown). The evaporation chamber 231 communicates with the inlet through the first pipe 233 and connects with the outlet through the second pipe 234 , forming a circuit for the phase change medium to circulate. The piston tube 235 communicates with the first pipeline 233 and the air bag 241, the piston 236 is arranged in the piston tube 235, and when the air pressure in the piston tube 235 changes, the piston 236 can move freely in the piston tube 235, and the tube of the piston tube 235 The walls are airtightly connected, so that the gases on both sides of the piston 236 will not communicate with each other. The piston 236 can be made of silica gel, sponge, rubber and other materials, for example. The airbag 2414 may include a plurality of discretely distributed airbags, all of which are in communication with the piston tube 235, and the multiple discretely distributed airbags have the same internal air pressure.
蒸发腔231内填充有处于第一相的相变介质(未示出)，相变介质是指在受热后可以发生相变的介质，例如水、乙醇等，其在常温下为第一相，第一相为液相，受热后相变为第二相，第二相为气相。本实施例中，相变介质可以是氟化液，其是一种含氟液体，沸点可以是40-45℃之间，氟化液作为相变介质的好处在于其沸点低，在40-45℃的温度下即可以相变气化，因此应用于电子设备10时，可以在较低温度下进行相变，利于快速的将热量带走，提高散热效果。需要说明的是，散热流道232内也可以填充部分相变介质，在此不做限定。The evaporation chamber 231 is filled with a phase change medium (not shown) in the first phase. The phase change medium refers to a medium that can undergo a phase change after being heated, such as water, ethanol, etc., which is the first phase at normal temperature. The first phase is a liquid phase, which changes into a second phase after being heated, and the second phase is a gas phase. In this embodiment, the phase change medium can be a fluorinated liquid, which is a fluorine-containing liquid, and its boiling point can be between 40-45°C. The advantage of using a fluorinated liquid as a phase change medium is that its boiling point is low, at 40-45°C. Phase change and gasification can be performed at a temperature of °C. Therefore, when applied to the electronic device 10, the phase change can be performed at a lower temperature, which is beneficial to quickly take away heat and improve the heat dissipation effect. It should be noted that part of the phase change medium may also be filled in the heat dissipation channel 232 , which is not limited here.
柔性膜层240至少设置于第二区域212，柔性膜层240位于壳体200的远离中框111的一侧，并可以作为电子设备10的部分外观面。具体地，柔性膜层240设置于基板210的第二表面一侧，并可以与散热膜片230相邻设置，以使得壳体更为平整，适于握持。在一个更为具体的实施方式中，如图6所示，柔性膜层240可以同时设置于第一区域211和第二区域212，柔性膜层240直接作为电子设备10的部分外观面。此时，柔性膜层240覆盖散热膜片230，柔性膜层240与基板210的第二区域212之间形成多个气囊241，气囊241内填充有气体，气体可以是空气。作为一种更为具体的方式，气囊241内可以填充惰性气体，例如氦气(He)、氩气(Ar)、氮气(N2)等。填充惰性气体的好处在于，气体较为稳定，不易在受热过程中发生化学变化。The flexible film layer 240 is at least disposed on the second region 212 , and the flexible film layer 240 is located on a side of the casing 200 away from the middle frame 111 , and can serve as a part of the appearance surface of the electronic device 10 . Specifically, the flexible film layer 240 is disposed on the side of the second surface of the substrate 210 , and can be disposed adjacent to the heat dissipation film 230 , so that the housing is flatter and suitable for handling. In a more specific embodiment, as shown in FIG. 6 , the flexible film layer 240 can be disposed on the first region 211 and the second region 212 at the same time, and the flexible film layer 240 directly serves as a part of the appearance surface of the electronic device 10 . At this time, the flexible film layer 240 covers the heat dissipation film 230 , and a plurality of air pockets 241 are formed between the flexible film layer 240 and the second region 212 of the substrate 210 , and the air pockets 241 are filled with gas, which may be air. As a more specific manner, the airbag 241 may be filled with an inert gas, such as helium (He), argon (Ar), nitrogen (N2 ) and the like. The advantage of filling inert gas is that the gas is relatively stable and is not easy to undergo chemical changes during the heating process.
每个气囊241均与活塞管235连通，当气囊241内的气压与第一管道233内的气压相同时，活塞236在活塞管235内处于平衡状态，保持静止。当第一管道233内的气压大于气囊241内的气压时，活塞236在活塞管235内朝向靠近气囊241的方向运动，气囊241内的气压增大，并最终与活塞管235内的气压达到平衡，直至活塞236停止运动。当第一管道233内的气压小于气囊241内的气压时，活塞236朝向远离气囊241的方向运动，气囊241内的气压减小，并最终与活塞管235内的气压达到平衡，直至活塞236停止运动。Each air bag 241 is in communication with the piston tube 235. When the air pressure in the air bag 241 is the same as the air pressure in the first pipe 233, the piston 236 is in a balanced state in the piston tube 235 and remains stationary. When the air pressure in the first pipeline 233 is greater than the air pressure in the air bag 241, the piston 236 moves in the direction close to the air bag 241 in the piston tube 235, the air pressure in the air bag 241 increases, and finally reaches equilibrium with the air pressure in the piston tube 235 , until the piston 236 stops moving. When the air pressure in the first pipeline 233 is lower than the air pressure in the air bag 241, the piston 236 moves away from the air bag 241, the air pressure in the air bag 241 decreases, and finally reaches equilibrium with the air pressure in the piston tube 235 until the piston 236 stops sports.
其中，多个气囊241可以由柔性膜层240与基板210直接形成，此时，柔性膜层240可以配置成具有多个腔体的结构，通过粘接的方式固定于基板210的第二区域212，并与第二区域212共同限定多个气囊241。Wherein, the plurality of airbags 241 can be directly formed by the flexible film layer 240 and the substrate 210. At this time, the flexible film layer 240 can be configured as a structure with multiple cavities, and fixed to the second region 212 of the substrate 210 by bonding. , and together with the second region 212 define a plurality of airbags 241 .
作为另一种方式，参阅图7，壳体还可以包括间隔件250，间隔件250连接于柔性膜层240和基板210之间。这种设置方式，不需要对柔性膜层240进行加工形成腔体结构，直接在基板210上设置间隔件250后，即可将柔性膜层240粘接至间隔件250以及散热膜片230，即可在柔性膜层240、间隔件250以及基板210之间限定气囊241。As another way, referring to FIG. 7 , the casing may further include a spacer 250 connected between the flexible film layer 240 and the substrate 210 . In this arrangement, the flexible film layer 240 does not need to be processed to form a cavity structure, and the flexible film layer 240 can be bonded to the spacer 250 and the heat dissipation diaphragm 230 after the spacer 250 is directly arranged on the substrate 210, that is, An air pocket 241 may be defined between the flexible film layer 240 , the spacer 250 and the substrate 210 .
作为另一种方式，参阅图8，壳体还可以包括基底层260和间隔件250，基底层260设置于第二区域212，柔性膜层240与基底层260相对设置，间隔件250连接于柔性膜层240和基底层260之间，使得柔性膜层240与基底层260相对设置，柔性膜层240与基底层260之间限定形成多个气囊241。这种设置方式，不需要对柔性膜层240进行过多加工，直接在基底层260上设置间隔件250后，即可将柔性膜层240粘接至间隔件250以及散热膜片230。同时，柔性膜层240与基底层260以及间隔件250可以预制，后续一并设置于极板210上，进而简化制造工艺。As another way, referring to FIG. 8 , the housing may further include a base layer 260 and a spacer 250, the base layer 260 is disposed in the second area 212, the flexible film layer 240 is disposed opposite to the base layer 260, and the spacer 250 is connected to the flexible Between the film layer 240 and the base layer 260 , the flexible film layer 240 is disposed opposite to the base layer 260 , and a plurality of air cells 241 are defined between the flexible film layer 240 and the base layer 260 . This arrangement does not require excessive processing of the flexible film layer 240 , and the flexible film layer 240 can be bonded to the spacer 250 and the heat dissipation film 230 after the spacer 250 is directly disposed on the base layer 260 . At the same time, the flexible film layer 240 , the base layer 260 and the spacer 250 can be prefabricated and subsequently disposed on the pole plate 210 , thereby simplifying the manufacturing process.
作为一种更为具体的实施方式，间隔件250可以是框胶，基底层260可以由聚对苯二甲酸乙二醇酯(polyethylene terephthalate，PET)制成，柔性膜层240可以采用高分子膜，例如以聚丙烯、聚碳酸酯等为材质进行制备。通过设置基底层260，可以预先将基底层260通过间隔件250与柔性膜层240形成气囊结构，后续直接与散热膜片230一并设置于基板210上，减少制备工艺步骤。As a more specific implementation, the spacer 250 can be a sealant, the base layer 260 can be made of polyethylene terephthalate (polyethylene terephthalate, PET), and the flexible film layer 240 can be a polymer film , such as polypropylene, polycarbonate, and the like. By setting the base layer 260 , the base layer 260 can be preformed through the spacer 250 and the flexible film layer 240 to form an airbag structure, and then directly set on the substrate 210 together with the heat dissipation film 230 , reducing the manufacturing process steps.
本实施例中，间隔件250上开设有气道242，多个气囊241通过气道242彼此连通，这种设置方式，可以在第二区域212形成更多数量的气囊241，利于后续在气囊241鼓起时起到更好的防滑作用，还可以更好地确保多个气囊241之间的气压平衡，使多个气囊中的气体迅速地彼此流通。在另一实施方式中，多个气囊241还可以彼此独立地与活塞管235连通。In this embodiment, an airway 242 is opened on the spacer 250, and a plurality of airbags 241 communicate with each other through the airway 242. This arrangement can form a larger number of airbags 241 in the second area 212, which is beneficial to subsequent airbags 241. When inflated, it has a better anti-skid effect, and can also better ensure the air pressure balance among the multiple airbags 241, so that the gas in the multiple airbags can quickly communicate with each other. In another embodiment, a plurality of airbags 241 may communicate with the piston tube 235 independently of each other.
如图9所示，当蒸发腔231受热时，处于第一相的相变介质相变为第二相，进入第一管道233内，此时第一管道233内的气压会增大，活塞管235内的气压随之增大，活塞236朝靠近气囊241的方向运动，对气囊241内的气体做功，导致气囊241内的气压增大。由于柔性膜层240是柔性的，可以发生形变，柔性膜层240对应于气囊241的位置会由于压力的增大而凸起。由于多个气囊241的位置是离散的，因此柔性膜层240会在离散的位置形成多个凹凸结构，用户在握持时会起到防滑作用。As shown in Figure 9, when the evaporation chamber 231 is heated, the phase-change medium in the first phase changes into the second phase and enters the first pipeline 233. At this time, the air pressure in the first pipeline 233 will increase, and the piston tube will The air pressure in the air bag 235 increases accordingly, and the piston 236 moves towards the direction close to the air bag 241 to perform work on the gas in the air bag 241, causing the air pressure in the air bag 241 to increase. Since the flexible film layer 240 is flexible and can be deformed, the position of the flexible film layer 240 corresponding to the airbag 241 will protrude due to the increase of pressure. Since the positions of the plurality of airbags 241 are discrete, the flexible film layer 240 will form a plurality of concave-convex structures at discrete positions, which will play an anti-slip effect when the user holds it.
与此同时，进入第一管道233内的处于第二相的相变介质会进入散热流道232，此时处于第二相的相变介质的温度较高。由于散热流道232对应的区域为非发热区域，温度较蒸发腔231所在区域低，相当于冷凝腔，因此处于第二相的相变介质的热量逐渐扩散，温度降低，第二相的相变介质至少部分会重新冷凝相变为第一相。在此过程中，发热组件产生的部分热量被从蒸发腔231对应的发热组件所在区域带往散热流道232对应的非发热组件区域，进行散失，散热效率提高，发热组件所在区域的温度降低得更快。At the same time, the phase-change medium in the second phase entering the first pipe 233 will enter the cooling channel 232 , and the temperature of the phase-change medium in the second phase is relatively high at this time. Since the area corresponding to the heat dissipation channel 232 is a non-heating area, the temperature is lower than the area where the evaporation chamber 231 is located, which is equivalent to a condensation chamber, so the heat of the phase change medium in the second phase gradually diffuses, the temperature decreases, and the phase change of the second phase The medium will at least partially recondense to change phase to the first phase. During this process, part of the heat generated by the heating component is taken from the heating component area corresponding to the evaporation chamber 231 to the non-heating component area corresponding to the heat dissipation flow channel 232, and is dissipated. The heat dissipation efficiency is improved, and the temperature in the heating component area is greatly reduced. faster.
为了提高散热流道232的散热效率，散热流道232可以包括多根彼此连通的毛细管，每根毛细管可以独立延伸设置，这样可以增加相变介质的散热面积，实现快速冷凝的目的。其中，在第二相的相变介质进入散热流道232内时，可能有少量处于第二相的相变介质未冷凝相变为第一相，这部分未相变为第一相的相变介质也会随第一相的相变介质进入后续的第二管道234，并回流至蒸发腔231。In order to improve the heat dissipation efficiency of the heat dissipation channel 232, the heat dissipation channel 232 may include a plurality of capillary tubes communicating with each other, and each capillary tube may be extended independently, so as to increase the heat dissipation area of the phase change medium and achieve rapid condensation. Wherein, when the phase-change medium of the second phase enters the heat dissipation channel 232, there may be a small amount of phase-change medium in the second phase that is not condensed and phase-changed into the first phase, and this part of the phase-change medium that is not phase-transformed into the first phase The medium also enters the subsequent second pipeline 234 along with the phase-change medium of the first phase, and flows back to the evaporation chamber 231 .
为了控制蒸发腔231内的相变介质仅在气化后进入散热流道232，散热膜片230还可以包括单向压力阀238，单向压力阀238可以控制相变为第二相的相变介质单向流动。具体地，单向压力阀238控制相变介质仅能从蒸发腔231一侧向散热流道232一侧单向流动，防止第一管道233内的相变介质倒流回蒸发腔231。同时，单向压力阀238可以被配置成在外部压力大于预设阈值时可以自动开启，在外部压力小于预设阈值时可以自动关闭的形式，实现自行开启或关闭，无需设置额外的控制装置来控制单向压力阀238开启或关闭。In order to control the phase change medium in the evaporation chamber 231 to enter the heat dissipation channel 232 only after being vaporized, the heat dissipation diaphragm 230 can also include a one-way pressure valve 238, which can control the phase change of the second phase The medium flows in one direction. Specifically, the one-way pressure valve 238 controls the phase change medium to only flow in one direction from the side of the evaporation chamber 231 to the side of the cooling channel 232 , preventing the phase change medium in the first pipeline 233 from flowing back into the evaporation chamber 231 . At the same time, the one-way pressure valve 238 can be configured to be automatically opened when the external pressure is greater than the preset threshold, and can be automatically closed when the external pressure is lower than the preset threshold, so as to realize automatic opening or closing without setting additional control devices to Control the one-way pressure valve 238 to open or close.
单向压力阀238位于第一管道233与蒸发腔231的连通口2331和第一管道233与活塞管235的连通口2332之间。单向压力阀238可以仅在蒸发腔231内的相变介质气化后打开，这样可以避免相变介质频繁流动，产生声音。当单向压力阀238处于关闭状态时，相变介质无法进入第一管道233。单向压力阀238可以是电磁阀，且可以与电子设备10的主板电性连接，由主板上集成的处理器控制打开或关闭。The one-way pressure valve 238 is located between the communication port 2331 of the first pipeline 233 and the evaporation chamber 231 and the communication port 2332 of the first pipeline 233 and the piston tube 235 . The one-way pressure valve 238 can be opened only after the phase-change medium in the evaporation chamber 231 is vaporized, so as to avoid the frequent flow of the phase-change medium and the generation of sound. When the one-way pressure valve 238 is in the closed state, the phase change medium cannot enter the first pipeline 233 . The one-way pressure valve 238 may be a solenoid valve, and may be electrically connected to the main board of the electronic device 10, and opened or closed by the processor integrated on the main board.
由于蒸发腔231与散热流道232的受热不均，蒸发腔231内的相变介质的蒸气压逐渐增大，当蒸发腔231内的蒸气压大于等于预设阈值时，单向压力阀238自动打开，此时气化的相变介质进入第一管道233，并在散热流道232内冷凝液化，重新形成液态的相变介质。Due to the uneven heating between the evaporation chamber 231 and the heat dissipation channel 232, the vapor pressure of the phase change medium in the evaporation chamber 231 gradually increases. When the vapor pressure in the evaporation chamber 231 is greater than or equal to a preset threshold, the one-way pressure valve 238 automatically When it is opened, the vaporized phase-change medium enters the first pipeline 233 and condenses and liquefies in the heat dissipation channel 232 to form a liquid phase-change medium again.
为了防止进入蒸发腔231内的相变介质经第二管道234进入散热流道232，请继续参阅图5，本实施例的散热膜片230还可以包括单向阀239。具体地，单向阀239可以设置于散热流道232与第二管道234的连通口2341处，用于防止第二管道234内的相变介质倒流回散热流道232。单向阀239可以被配置为仅在有第一相的相变介质到达第二管道234处时才打开，避免进入第二管道234内的相变介质回流至散热流道232内。在一个更为具体的实施例中，单向阀239可以是电磁阀，且可以与电子设备10的主板电性连接，由主板上集成的处理器控制打开或关闭。In order to prevent the phase-change medium entering the evaporation chamber 231 from entering the heat dissipation channel 232 through the second pipe 234 , please continue to refer to FIG. 5 , the heat dissipation diaphragm 230 of this embodiment may further include a one-way valve 239 . Specifically, the one-way valve 239 can be arranged at the communication port 2341 between the cooling channel 232 and the second pipeline 234 to prevent the phase change medium in the second pipeline 234 from flowing back into the cooling channel 232 . The one-way valve 239 can be configured to open only when the phase-change medium of the first phase reaches the second pipeline 234 , so as to prevent the phase-change medium entering the second pipeline 234 from flowing back into the cooling channel 232 . In a more specific embodiment, the one-way valve 239 may be a solenoid valve, and may be electrically connected to the main board of the electronic device 10, and opened or closed by the processor integrated on the main board.
本实施例提供的壳体200的工作原理是：The working principle of the housing 200 provided in this embodiment is:
当蒸发腔231所处的发热组件区域产生较多热量时，位于蒸发腔231内的第一相的相变介质吸热相变为第二相，蒸发腔231内的蒸气压逐渐增大，使得单向压力阀238开启，第二相的相变介质进入第一管道233，且部分相变介质进入活塞管235，活塞管235内的蒸气压增大，推动活塞236做功，导致气囊241内的气压增大，柔性膜层240与气囊241对应的位置变形鼓起，形成凹凸触感，起到防滑作用，相变介质携带的热量转化为活塞236的机械能，使得相变介质的温度降低。When the heat-generating component area where the evaporation chamber 231 is located generates more heat, the phase-change medium of the first phase in the evaporation chamber 231 absorbs heat and changes to the second phase, and the vapor pressure in the evaporation chamber 231 gradually increases, so that The one-way pressure valve 238 is opened, the phase-change medium of the second phase enters the first pipe 233, and part of the phase-change medium enters the piston tube 235, and the vapor pressure in the piston tube 235 increases, pushing the piston 236 to do work, resulting in a As the air pressure increases, the position corresponding to the flexible film layer 240 and the airbag 241 deforms and bulges, forming a concave-convex tactile feeling and playing an anti-slip effect. The heat carried by the phase-change medium is converted into mechanical energy of the piston 236, which reduces the temperature of the phase-change medium.
当第二相的相变介质进入第一管道233时，由于散热流道232所处区域的温度相对较低，因此第二相的相变介质至少部分冷凝重新相变为第一相，而后相变介质经由第二管道234流回蒸发腔231，完成散热循环，发热组件产生的热量经散热膜片230散失，达到良好的散热效果。When the phase-change medium of the second phase enters the first pipeline 233, because the temperature of the area where the cooling channel 232 is located is relatively low, at least part of the phase-change medium of the second phase condenses and re-phases into the first phase, and then the phase change medium The variable medium flows back to the evaporation chamber 231 through the second pipe 234 to complete the heat dissipation cycle, and the heat generated by the heating element is dissipated through the heat dissipation diaphragm 230 to achieve a good heat dissipation effect.
当蒸发腔231所处的发热组件区域发热量减少，蒸发腔231内的第一相的相变介质不再继续相变，此时，第一管道233内的蒸气压会逐步降低，气囊241内的气压大于活塞管235内的气压，气囊241内的气体推动活塞236朝向远离气囊241的方向运动，直至气囊241内的气压逐渐与第一管道233内的气压达到平衡，凸起的气囊241借助于柔性膜层240的弹性恢复力而逐渐恢复至初始状态。When the calorific value of the heating component area where the evaporation chamber 231 is located decreases, the phase change medium of the first phase in the evaporation chamber 231 will no longer continue to change phases. At this time, the vapor pressure in the first pipeline 233 will gradually decrease, and the airbag 241 The air pressure in the air bag 241 is greater than the air pressure in the piston pipe 235, and the gas in the air bag 241 pushes the piston 236 to move in a direction away from the air bag 241 until the air pressure in the air bag 241 gradually reaches equilibrium with the air pressure in the first pipe 233, and the raised air bag 241 is Due to the elastic recovery force of the flexible film layer 240, the original state is gradually restored.
本实施例提供的壳体200中，散热膜片230不仅可以将热量从电子设备10内的高温区域传导至低温区域，同时热量在传导过程中，对活塞236做功，使得柔性膜层240产生凹凸触感，提高电子设备10的防滑效果。由于活塞236做功过程中消耗一部分热量，因此热量的散失更加快速，有利于散热。In the housing 200 provided in this embodiment, the heat dissipation diaphragm 230 can not only conduct heat from the high temperature area in the electronic device 10 to the low temperature area, but also perform work on the piston 236 during the heat conduction process, so that the flexible film layer 240 produces unevenness. tactile, and improve the anti-slip effect of the electronic device 10 . Because the piston 236 consumes part of the heat during the working process, the heat is dissipated faster, which is beneficial to heat dissipation.
用户在观看视频、玩游戏等应用场景下，电子设备10的发热量较大，此时，用户通常会双手握持电子设备10，尤其是握持电子设备10的长度方向的两端。此时，为了使电子设备10具有更好的防滑效果，在另一种实施方式中，参阅图10，第一区域211位于电子设备10的大致中部位置，第二区域212包括两个离散的区域，这两个区域分别位于第一区域211的沿壳体长度方向的两侧。When the user is watching videos, playing games and other application scenarios, the electronic device 10 generates a lot of heat. At this time, the user usually holds the electronic device 10 with both hands, especially the two ends of the electronic device 10 in the length direction. At this time, in order to make the electronic device 10 have a better anti-slip effect, in another embodiment, referring to FIG. 10 , the first area 211 is located approximately in the middle of the electronic device 10, and the second area 212 includes two discrete areas. , these two regions are respectively located on both sides of the first region 211 along the length direction of the casing.
多个气囊241分布于第一区域211的两侧，这样相变介质当由于受热相变为第二相并从蒸发腔231进入第一管道233时，驱动活塞236运动，使得气囊241内的压力增大，柔性膜层240变形鼓起，此时第一区域211两侧的柔性膜层240均会形成凹凸结构，可以增加用户握持时的防滑效果。这种实施方式中，可以设置的气囊241数量更多，因而使得活塞236运动做功时，可以消耗更多的热量，提高散热效果。A plurality of air pockets 241 are distributed on both sides of the first area 211, so that when the phase change medium changes to the second phase due to heat and enters the first pipeline 233 from the evaporation chamber 231, the piston 236 is driven to move, so that the pressure in the air pockets 241 When the size increases, the flexible film layer 240 deforms and bulges. At this time, the flexible film layer 240 on both sides of the first region 211 will form a concave-convex structure, which can increase the anti-slip effect when the user holds it. In this embodiment, more airbags 241 can be provided, so that when the piston 236 moves and does work, more heat can be consumed and the cooling effect can be improved.
本实施例中，活塞管235包括第一活塞管2351和第二活塞管2352，第一活塞管2351以及第二活塞管2352均与第一管道233连通，并分别连通第一区域211两侧的气囊241，第一活塞管2351以及第二活塞管2352内均设置有活塞236，相变介质当由于受热相变为第二相并从蒸发腔231进入第一管道233时，驱动第一活塞管2351以及第二活塞管2352内的活塞236运动，使得第一区域211两侧的气囊241内的压力增大，导致第一区域211两侧的柔性膜层240均会形成凹凸结构。In this embodiment, the piston tube 235 includes a first piston tube 2351 and a second piston tube 2352. Both the first piston tube 2351 and the second piston tube 2352 communicate with the first pipeline 233, and respectively communicate with the two sides of the first area 211. The air bag 241, the first piston tube 2351 and the second piston tube 2352 are all provided with a piston 236. When the phase change medium changes to the second phase due to heat and enters the first pipeline 233 from the evaporation chamber 231, the first piston tube is driven. 2351 and the piston 236 in the second piston tube 2352 move so that the pressure in the air bag 241 on both sides of the first area 211 increases, causing the flexible film layer 240 on both sides of the first area 211 to form a concave-convex structure.
当然，在其他的一些实施方式中，也可以不设置第一活塞管2351和第二活塞管2352，而是使第一区域211两侧的气囊241可以通过前文所述的气道242方式连通，在此不做具体限定。Of course, in some other embodiments, the first piston tube 2351 and the second piston tube 2352 may not be provided, but the airbags 241 on both sides of the first area 211 can communicate through the aforementioned air passage 242, No specific limitation is made here.
尽管本实施例并未示出，在上述各实施方式的基础上，本领域技术人员还可以将第二区域212以及第一区域211设置成其他的布置形式，例如第二区域212环绕于第一区域211设置的形式，或者其他形式，上述实施方式并不作为对本申请中第一区域211和第二区域212的布置方式的限定。Although not shown in this embodiment, on the basis of the above-mentioned embodiments, those skilled in the art can also arrange the second area 212 and the first area 211 in other arrangements, for example, the second area 212 surrounds the first area The arrangement form of the region 211 or other forms, the above-mentioned embodiment is not limited to the arrangement manner of the first region 211 and the second region 212 in this application.
为了增加壳体的握持手感，在一种实施方式中，如图11所示，壳体还可以包括柔性革层220，柔性革层220设置于散热膜片230以及柔性膜层240的远离基板210的表面。此时，柔性膜层240可以仅覆盖基板210的第二区域212，当然，柔性膜层240也可以同时覆盖第一区域211的散热膜片230以及第二区域212，在此不做限定。柔性革层220可以采用人造革、皮革等材质制成，使得电子设备10的整体触感更佳，并且由于柔性革层220也是柔性可形变的，因此当气囊241内气压增大，柔性膜层240凸起时，柔性革层220也随之形成凹凸结构，同样可以起到防滑作用。In order to increase the grip feeling of the housing, in one embodiment, as shown in FIG. 210 surface. At this time, the flexible film layer 240 may only cover the second region 212 of the substrate 210 , of course, the flexible film layer 240 may also cover the heat dissipation film 230 of the first region 211 and the second region 212 at the same time, which is not limited herein. The flexible leather layer 220 can be made of artificial leather, leather and other materials, so that the overall touch of the electronic device 10 is better, and because the flexible leather layer 220 is also flexible and deformable, when the air pressure in the airbag 241 increases, the flexible film layer 240 will protrude. When it is lifted, the flexible leather layer 220 also forms a concave-convex structure, which can also play an anti-slip effect.
柔性革层220可以完全覆盖基板210，并可以直接与基板210的边缘通过粘接、缝制等方式连接固定。The flexible leather layer 220 can completely cover the substrate 210 , and can be directly connected and fixed to the edge of the substrate 210 by bonding, sewing or the like.
本实施例还提供上述壳体的制备方法，如图12所示，包括以下步骤：This embodiment also provides a method for preparing the above shell, as shown in FIG. 12 , including the following steps:
步骤S110：提供基板210。Step S110 : providing a substrate 210 .
步骤S120：在基板的第一区域211形成散热膜片230。Step S120 : forming a heat dissipation film 230 on the first region 211 of the substrate.
散热膜片230可以是一平面膜形结构，例如散热膜片230可以由两层相对的平面膜形成，且两层平面膜的边缘连接形成内部的蒸发腔231、散热流道232以及第一管道233、第二管道234、活塞管235等各类结构。散热膜片230也可以是由两层金属板通过封边焊接后形成的，在此均不做限定。散热膜片230可以预先制备，而后通过粘接、焊接等方式形成于第一区域211，在此不做限定。在散热膜片230设置于第一区域211后，活塞管235可以预留开口，以供与后续的气囊241连通。The heat dissipation film 230 can be a planar film structure. For example, the heat dissipation film 230 can be formed by two opposite planar films, and the edges of the two planar films are connected to form an internal evaporation chamber 231, a heat dissipation channel 232 and a first pipe 233. , second pipeline 234, piston tube 235 and other various structures. The heat dissipation diaphragm 230 may also be formed by welding two layers of metal plates through edge sealing, which is not limited here. The heat dissipation film 230 can be prepared in advance, and then formed on the first region 211 by bonding, welding, etc., which is not limited here. After the heat dissipation film 230 is disposed on the first area 211 , an opening may be reserved in the piston tube 235 for communicating with the subsequent air bag 241 .
步骤S130：在基板的第二区域212设置柔性膜层240，以使柔性膜层240与基板210之间形成多个气囊241，连通气囊241与散热膜片230中的活塞管235。Step S130 : setting the flexible film layer 240 on the second area 212 of the substrate, so that a plurality of airbags 241 are formed between the flexible film layer 240 and the substrate 210 , and the airbags 241 communicate with the piston tube 235 in the heat dissipation film 230 .
在一种实施方式中，柔性膜层240预先加工成具有多个囊状结构的形式，而后直接贴设于第二区域212，由基板210封闭囊状结构形成气囊241，而后将气囊241与活塞管235的开口通过封边焊接等方式连通封闭。可以在气囊241形成过程中，自然地向气囊内充入空气，也可以在形成气囊241后，向气囊241内充入惰性气体，将其中的空气置换排出，而后再与活塞管235连通。In one embodiment, the flexible film layer 240 is pre-processed into a form with a plurality of bladder structures, and then directly attached to the second area 212, the bladder structure is closed by the substrate 210 to form the air bag 241, and then the air bag 241 and the piston The opening of the pipe 235 is communicated and closed by edge sealing welding or the like. Air can be filled into the airbag 241 naturally during the formation of the airbag 241 , or an inert gas can be filled into the airbag 241 after the airbag 241 is formed, and the air therein can be displaced and discharged, and then communicated with the piston tube 235 .
在另一种实施方式中，先在第二区域212设置基底层260，将间隔件250设置于基底层260上，形成分隔的腔体结构，将柔性膜层240连接于间隔件250的远离基板210的一侧，封闭腔体形成气囊241。当需要连通多个气囊241时，可以预先在间隔件250上开设气道242，使得分隔形成的腔体彼此连通即可。In another embodiment, the base layer 260 is firstly disposed in the second region 212, the spacer 250 is disposed on the base layer 260 to form a separated cavity structure, and the flexible film layer 240 is connected to the spacer 250 that is far away from the substrate. On one side of 210, the closed cavity forms an air bag 241. When it is necessary to communicate with multiple airbags 241 , air passages 242 can be pre-opened on the spacer 250 so that the cavities formed separately can communicate with each other.
为了提高壳体的触摸手感，上述的方法还可以包括步骤S140：在散热膜片230以及柔性膜层240的远离基板210的表面设置柔性革层220。柔性革层220可以直接通过粘接、缝制等方式与基板210的边缘连接。In order to improve the touch feeling of the casing, the above method may further include step S140 : disposing the flexible leather layer 220 on the surface of the heat dissipation diaphragm 230 and the flexible film layer 240 away from the substrate 210 . The flexible leather layer 220 can be directly connected to the edge of the substrate 210 by bonding, sewing and other methods.
需要说明的是，步骤S120和步骤S130可以同时进行，也可以先进行步骤S120再进行步骤S130，还可以先进行步骤S130再进行步骤S120，在此不做限定。It should be noted that step S120 and step S130 can be performed at the same time, or step S120 can be performed first and then step S130 can be performed, or step S130 can be performed first and then step S120 can be performed, which is not limited here.
本实施例提供的壳体200、外壳组件110以及电子设备10，可以提高壳体的防滑效果，同时由于散热膜片230在进行散热循环的过程中，将部分的热能转化为了活塞236的机械能，因此可以更快速的散失热量，可以提高散热效率。The casing 200, the casing assembly 110 and the electronic device 10 provided in this embodiment can improve the anti-skid effect of the casing, and at the same time, because the heat dissipation diaphragm 230 converts part of the heat energy into the mechanical energy of the piston 236 during the heat dissipation cycle, Therefore, the heat can be dissipated more quickly, and the heat dissipation efficiency can be improved.
本申请中的电子设备10可以为移动电话或智能电话(例如，基于iPhone TM，基于Android TM的电话)、便携式游戏设备(例如Nintendo DS TM，PlayStation Portable TM，Gameboy Advance TM，iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备，其他手持设备诸如手表、耳机、吊坠、耳机等。电子设备10还可以为其他的可穿戴设备(诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身、电子设备或智能手表、头戴式设备(HMD))。The electronic device 10 in the present application may be a mobile phone or a smart phone (for example, based on iPhone TM, a phone based on Android TM), a portable gaming device (for example, Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop Computers, PDAs, portable Internet devices, music players and data storage devices, other handheld devices such as watches, earphones, pendants, earphones, etc. The electronic device 10 may also be other wearable devices (such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices or smart watches, head-mounted devices (HMD)).
以上所述仅为本申请的优选实施例，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, there may be various modifications and changes in the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111652102.8ACN114340262B (en) | 2021-12-30 | 2021-12-30 | Shell, shell assembly and electronic equipment |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111652102.8ACN114340262B (en) | 2021-12-30 | 2021-12-30 | Shell, shell assembly and electronic equipment |
| Publication Number | Publication Date |
|---|---|
| CN114340262A CN114340262A (en) | 2022-04-12 |
| CN114340262Btrue CN114340262B (en) | 2023-08-29 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111652102.8AActiveCN114340262B (en) | 2021-12-30 | 2021-12-30 | Shell, shell assembly and electronic equipment |
| Country | Link |
|---|---|
| CN (1) | CN114340262B (en) |
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|---|---|---|---|---|
| CN114867330B (en)* | 2022-06-17 | 2023-06-23 | 青岛海兴电子有限公司 | Heat dissipation structure and heat dissipation method for electronic controller |
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| CN112218481A (en)* | 2019-07-10 | 2021-01-12 | 汎海科技股份有限公司 | Heat dissipation plate, method for manufacturing the same, and electronic device with heat dissipation plate |
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| CN109343596A (en)* | 2018-09-29 | 2019-02-15 | 西安交通大学 | A mobile phone temperature control device based on phase change capsule and bionic microchannel |
| CN109640606A (en)* | 2019-02-20 | 2019-04-16 | 京东方科技集团股份有限公司 | Cooling system and terminal device |
| CN112218481A (en)* | 2019-07-10 | 2021-01-12 | 汎海科技股份有限公司 | Heat dissipation plate, method for manufacturing the same, and electronic device with heat dissipation plate |
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