Disclosure of Invention
The embodiment of the application provides a display device and a display terminal, and can solve the problem that when a protective film of a back plate layer in the existing display device is peeled off, a circuit board or a driving chip is easily peeled off from a pad part, so that the circuit board or the driving chip is not in good contact with the pad part, and the yield of the display device is reduced.
An embodiment of the present application provides a display device, including:
the display panel comprises a display panel body and a display panel, wherein the display panel body comprises a flat plate part, a bent part and a welding disc part, the bent part is positioned between the flat plate part and the welding disc part, and the welding disc part is positioned on the back side of the flat plate part after the bent part is bent;
a back plate layer including a first back plate and a second back plate, the first back plate being disposed at a back side of the flat plate portion, the second back plate being disposed at a side of the pad portion facing the flat plate portion, the first back plate being disposed between the second back plate and the flat plate portion;
wherein the second back plate comprises a first sub-back plate, and the elastic modulus of the first sub-back plate is greater than that of the first back plate.
Optionally, in some embodiments of the present application, the second back plate further includes a second sub-back plate, and an elastic modulus of the second sub-back plate is smaller than or equal to an elastic modulus of the first back plate.
Optionally, in some embodiments of the application, before the bending portion is bent, the back plate layer further includes a protective film, and the protective film is attached to a side surface of the first back plate and the second back plate, which is away from the display panel body.
Optionally, in some embodiments of the present application, the first back plate and the second back plate have the same thickness.
Optionally, in some embodiments of the present application, the material of the first sub-backplate includes at least one of stainless steel and ceramic.
Optionally, in some embodiments of the present application, the material of the second sub-back plate includes at least one of polyimide, polyethylene terephthalate, and foam.
Optionally, in some embodiments of the present application, the material of the first back sheet includes at least one of polyimide and polyethylene terephthalate.
Optionally, in some embodiments of the present application, a material of the first back plate and a material of the second sub-back plate are the same.
Optionally, in some embodiments of the present application, the method further includes:
the rigid support layer is arranged between the first back plate and the second back plate, the second back plate is fixedly connected with the rigid support layer, and the materials of the rigid support layer and the first sub-back plate are the same.
Correspondingly, the embodiment of the application also provides a display terminal, which comprises a terminal main body and the display device, wherein the terminal main body and the display device are combined into a whole.
In the embodiment of the application, a display device and a display terminal are provided, the back plate layer of the back side of the display panel body comprises a first back plate and a second back plate, the second back plate comprises a first sub back plate, the elastic modulus of the first sub back plate is greater than that of the first back plate, when the protective film of the back plate layer is peeled off, because the elastic modulus of the first sub back plate is relatively large, the second back plate is not easy to tilt, the circuit board or the driving chip can be prevented from being peeled off from the pad portion, the circuit board or the driving chip cannot be in poor contact with the pad portion, and therefore the yield of the display device is improved.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
An embodiment of the present application provides a display device, and the display device includes: the display panel comprises a display panel body and a display panel, wherein the display panel body comprises a flat plate part, a bent part and a pad part, the bent part is positioned between the flat plate part and the pad part, and the pad part is positioned on the back side of the flat plate part after the bent part is bent; the back plate layer comprises a first back plate and a second back plate, the first back plate is arranged on the back side of the flat plate part, the second back plate is arranged on one side, facing the flat plate part, of the pad part, and the first back plate is arranged between the second back plate and the flat plate part; the second back plate comprises a first sub back plate, and the elastic modulus of the first sub back plate is greater than that of the first back plate.
The embodiment of the application provides a display device and a display terminal. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
The first embodiment,
Referring to fig. 2 and fig. 3, fig. 2 is a first schematic view of adisplay device 100 according to an embodiment of the present disclosure before a bending portion is bent; fig. 3 is a schematic diagram illustrating adisplay device 100 according to an embodiment of the present disclosure when a protection film of a back plate layer is peeled; fig. 4 is a first schematic view of adisplay device 100 according to an embodiment of the present disclosure after being bent at a bending portion.
The embodiment of the application provides adisplay device 100, as shown in fig. 4, thedisplay device 100 includes adisplay panel body 10 and aback plate layer 11, thedisplay panel body 10 includes a flat plate portion FF1, a bent portion FF2 and a pad portion FF3, the bent portion FF2 is located between the flat plate portion FF1 and the pad portion FF3, and when the bent portion FF2 is bent, the pad portion FF3 is located on the back side of the flat plate portion FF 1; theback plate layer 11 includes afirst back plate 111 and asecond back plate 112, thefirst back plate 111 is disposed on the back side of the flat plate portion FF1, thesecond back plate 112 is disposed on the side of the pad portion FF3 facing the flat plate portion FF1, and thefirst back plate 111 is disposed between thesecond back plate 112 and the flat plate portion FF 1; thesecond back plate 112 includes afirst sub-back plate 1121, and an elastic modulus of thefirst sub-back plate 1121 is greater than an elastic modulus of thefirst back plate 111.
Specifically, thedisplay device 100 includes two states of the bent portion FF2 before being bent and the bent portion FF2 after being bent, and usually the bent portion FF2 before being bent is an intermediate state or a transition state of thedisplay device 100.
Specifically, after the bent portion FF2 is bent, the pad portion FF3 is disposed on the back side or the non-display side of the flat portion FF1, so that the bezel width of thedisplay device 100 can be reduced.
Specifically, the flat portion FF1 of thedisplay device 100 is usually a portion where an image is displayed, and the display side of the flat portion FF1 is a side where an image is displayed or a side observed by human eyes.
Specifically, the back side of the flat portion FF1 is the side or the other side that is away from the display side.
Specifically, it is easily understood that the back side of the flat portion FF1 is the same side as the back side of thedisplay panel body 10 and the back side of the pad portion FF3 before the bent portion FF2 is bent.
Specifically, as shown in fig. 2, thedisplay panel body 10 may include asubstrate 101, an arrayfunctional layer 102, a lightemitting device layer 103 disposed on the arrayfunctional layer 102, and an encapsulation layer (not shown) disposed on the lightemitting device layer 103, where the arrayfunctional layer 102 may include structures such as a thin film transistor, the structure of thedisplay panel body 10 is not limited thereto, and the structure of thedisplay device 100 may include other structures in the prior art, which is not described herein again.
Specifically, theback plate layer 11 includes afirst back plate 111 and asecond back plate 112, that is, thefirst back plate 111 and thesecond back plate 112 are the same layer, that is, are disposed adjacent to the back surface of thedisplay panel body 10, and theback plate layer 11 may be disposed on the back side of thedisplay panel body 10 by means of adhesive layer adhesion or the like.
Specifically, after the bent portion FF2 is bent, thefirst back plate 111 is disposed on the back side of the flat plate portion FF1, thesecond back plate 112 is disposed on the side of the pad portion FF3 facing the flat plate portion FF1, and thefirst back plate 111 is disposed between thesecond back plate 112 and the flat plate portion FF 1.
In some embodiments, as shown in fig. 2 and fig. 3, before the bending portion FF2 is bent, theback plate layer 11 further includes aprotection film 113, and theprotection film 113 is attached to a side surface of thefirst back plate 111 and thesecond back plate 112 away from thedisplay panel body 10.
Specifically, before the bending portion FF2 is bent, thefirst back plate 111 and thesecond back plate 112 of theback plate layer 11 are disposed on the back side of thedisplay panel body 10.
Specifically, before the bending portion FF2 is bent, thefirst back plate 111 is disposed on the back side of the flat portion FF1, thesecond back plate 112 is disposed on the back side of the pad portion FF3, and the back side of the flat portion FF1 and the back side of the pad portion FF3 are the same side of thedisplay panel body 10 before the bending portion FF2 is bent.
Specifically, it is easy to understand that, comparing the structures of thedisplay device 100 in fig. 2 and fig. 4, after the bending portion FF2 is bent, other structures or film layers may be disposed in thedisplay device 100.
Specifically, it is easy to understand that before the bending portion FF2 is bent, theprotection film 113 is disposed on the surfaces of thefirst back plate 111 and thesecond back plate 112 on the sides away from thedisplay panel body 10, and theprotection film 113 is used to protect theback plate layer 11, so as to prevent theback plate layer 11 from being damaged due to external force such as scratching and impact.
Specifically, it is easily understood that before the bending of the bending portion FF2 is started, theprotective film 113 needs to be removed or peeled off in order to provide other structures or film layers in thedisplay device 100.
Specifically, as shown in fig. 3, the elastic modulus of thefirst sub-back plate 1121 is greater than the elastic modulus of thefirst back plate 111, and when theprotective film 113 of theback plate layer 11 is peeled off, because the elastic modulus of thefirst sub-back plate 1121 is relatively large, thesecond back plate 112 is not easy to tilt or cannot tilt, so that the circuit board or thedriver chip 14 can be prevented from being peeled off from the pad portion FF3, the circuit board or the driver chip cannot be in poor contact with the pad portion, and the yield of the display device is improved.
In some embodiments, the thickness of thefirst back sheet 111 and thesecond back sheet 112 is the same.
Specifically, the thicknesses of thefirst back plate 111 and thesecond back plate 112 are the same, and thesame protection film 113 may be disposed on the surfaces of thefirst back plate 111 and thesecond back plate 112 away from thedisplay panel body 10.
In some embodiments, the material of thefirst sub-back plate 1121 includes at least one of stainless steel and ceramic.
In some embodiments, the material of thefirst back sheet 111 includes at least one of polyimide and polyethylene terephthalate.
Specifically, as shown in fig. 4, after the bent portion FF2 is bent, thefirst back plate 111 is a flexible support layer, which can provide good flexibility with the flat portion FF 1.
Specifically, as shown in fig. 4, after the bent portion FF2 is bent, the first sub-back 1121 is a rigid support layer, thesecond back 112 includes a rigid support layer, the pad portion FF3 is not used for displaying, and a flexible support layer, that is, thefirst back 111, is disposed between the flat portion FF1 and the pad portion FF 3.
In this embodiment, the elastic modulus of the firstsub-back plate 1121 is greater than the elastic modulus of thefirst back plate 111, or the firstsub-back plate 1121 is a rigid support layer, and is subjected to the peelingforce 60 when theprotection film 113 of theback plate layer 11 is peeled off, and because the elastic modulus of the firstsub-back plate 1121 is relatively large, thesecond back plate 112 is not easily or not tilted, so that the circuit board or thedriver chip 14 can be prevented from being peeled off from the pad portion FF3, and the circuit board or thedriver chip 14 is not in poor contact with the pad portion FF3, thereby improving the yield of thedisplay device 100.
Example II,
The present embodiment is the same as or similar to the above-described embodiments, except that the structure of thedisplay device 100 is further described.
Referring to fig. 5 and fig. 6, fig. 5 is a second schematic view of thedisplay device 100 according to the embodiment of the present disclosure before being bent; fig. 6 is a third schematic view of thedisplay device 100 according to the embodiment of the present application before the bending portion is bent.
In some embodiments, thesecond back plate 112 further includes a secondsub-back plate 1122, and the elastic modulus of the secondsub-back plate 1122 is less than or equal to the elastic modulus of thefirst back plate 111.
Specifically, in the present embodiment, theback plate layer 11 includes afirst back plate 111 and asecond back plate 112, and thesecond back plate 112 includes a firstsub-back plate 1121 and a secondsub-back plate 1122.
Specifically, the elastic modulus of the firstsub-back plate 1121 is greater than the elastic modulus of thefirst back plate 111, or the firstsub-back plate 1121 is a rigid support layer, which can prevent the circuit board or thedriver chip 14 from peeling off from the pad portion FF3, and thus the circuit board or the driver chip and the pad portion are not in poor contact, thereby improving the yield of the display device.
Specifically, the elastic modulus of the secondsub-back plate 1122 is smaller than or equal to the elastic modulus of thefirst back plate 111, or the elastic modulus of the secondsub-back plate 1122 is a flexible support layer, and may provide a cushioning effect or a flexible support effect for the pad portion FF 3.
Specifically, before the bending portion FF2 is bent, thedisplay device 100 further includes aprotection film 113, theprotection film 113 is attached to one side surface of thefirst back plate 111 and thesecond back plate 112 away from thedisplay panel body 10, at this time, the first sub backplate 1121 may be located between the second sub backplate 1122 and thedisplay panel body 10, or the second sub backplate 1122 may be located between the first sub backplate 1121 and thedisplay panel body 10.
In some embodiments, the material of the secondsub-back plate 1122 includes at least one of polyimide, polyethylene terephthalate, and foam.
In some embodiments, the material of thefirst back plate 111 and the material of the secondsub-back plate 1122 are the same.
Specifically, the material of thefirst back plate 111 and the secondsub-back plate 1122 respectively provide flexible supporting functions for different portions of the display panel body, and therefore, the material of thefirst back plate 111 and the material of the secondsub-back plate 1122 can be the same.
Specifically, as shown in fig. 5, in some embodiments, the thickness of thesecond back plate 112 is the same as the thickness of thefirst back plate 111, and the thicknesses of the firstsub-back plate 1121 and the secondsub-back plate 1122 are both smaller than the thickness of thefirst back plate 111.
Specifically, as shown in fig. 6, in some embodiments, the thickness of thesecond back plate 112 is different from the thickness of thefirst back plate 111, and the thickness of the secondsub-back plate 1122 may be equal to the thickness of thefirst back plate 111, so as to increase the convenience of disposing thefirst back plate 111 and the secondsub-back plate 1122.
In this embodiment, theback plate layer 11 includes afirst back plate 111 and asecond back plate 112, thesecond back plate 112 includes a firstsub-back plate 1121 and a secondsub-back plate 1122, an elastic modulus of the firstsub-back plate 1121 is greater than an elastic modulus of thefirst back plate 111, and an elastic modulus of the secondsub-back plate 1122 is less than or equal to an elastic modulus of thefirst back plate 111, so that the circuit board or thedriver chip 14 can be prevented from being peeled off from the pad portion FF3, the circuit board or the driver chip and the pad portion are not in poor contact, and thus the yield of the display device is improved, and thesecond back plate 112 can provide a buffering effect for the pad portion FF3 or provide a flexible supporting effect, so as to prevent the pad portion FF3 from being damaged by an external force.
Example III,
The present embodiment is the same as or similar to the above-described embodiments, except that the structure of thedisplay device 100 is further described.
Referring to fig. 4 and 7, fig. 7 is a second schematic view of thedisplay device 100 according to the embodiment of the present disclosure after being bent at the bending portion.
In some embodiments, thedisplay device 100 further includes arigid support layer 13, therigid support layer 13 is disposed between thefirst back plate 111 and thesecond back plate 112, and thesecond back plate 112 is fixedly connected to therigid support layer 13.
Specifically, thesecond back plate 112 and therigid support layer 13 may be fixedly connected by an adhesive layer such as a double-sided adhesive tape.
In some embodiments, the material of the firstsub-back plate 1121 and the material of therigid support layer 13 are the same.
In some embodiments, the material of therigid support layer 13 includes at least one of stainless steel, ceramic.
Specifically, in the foldable orbendable display device 100, thedisplay panel body 10 is a flexibledisplay panel body 10, thedisplay device 100 includes arigid support layer 13, therigid support layer 13 provides a rigid support function for thedisplay panel device 100 to maintain the flatness of the surface of the flat portion FF1, in this case, therigid support layer 13 may be stainless steel (SUS) which is used as a material of therigid support layer 13, and may also provide a bending resilience for thedisplay 100 to avoid bending marks.
Specifically, in some non-foldable ornon-bendable display devices 100, thedisplay device 100 includes arigid support layer 13, and therigid support layer 13 provides a rigid support function for thedisplay panel device 100 to maintain the flatness of the surface of the flat portion FF1, in which case the rigid support layer may be stainless steel or ceramic.
Specifically, in some embodiments, thedisplay device 100 further includes abuffer layer 12, and thebuffer layer 12 is disposed between thefirst back plate 111 and therigid support layer 13.
Specifically, the material of thebuffer layer 12 may be foam, which provides a buffer effect for thedisplay device 100, and when thedisplay device 100 is subjected to an external force, the buffer layer can buffer the external force, so as to prevent thedisplay device 100 from being damaged.
In the display device in the above embodiment, after the bending portion FF2 is bent, therigid support layer 13 and/or thebuffer layer 12 may not be provided in thedisplay device 100.
Specifically, after the bending portion FF2 is bent, thesecond back plate 112 includes a firstsub-back plate 1121 and a secondsub-back plate 1122, and when thedisplay device 100 is not provided with thebuffer layer 12, the secondsub-back plate 1122 provides a buffer and flexible supporting function for the pad portion.
Example four,
Referring to fig. 8, fig. 8 is a schematic view of a display terminal according to an embodiment of the present disclosure.
The embodiment of the present application further provides adisplay terminal 200, where thedisplay terminal 200 includes a terminalmain body 201 and thedisplay device 100 in any one of the foregoing embodiments, and the terminalmain body 201 and thedisplay device 100 are combined into a whole.
Specifically, thedisplay terminal 200 may be a mobile phone, a notebook computer, a television, and the like.
The display device and the display terminal provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.