CN114206000A - Circuit Board Assemblies and Electronics - Google Patents

Abstract

The application discloses a circuit board assembly and electronic equipment, and belongs to the technical field of communication equipment, wherein the circuit board assembly comprises a first circuit board, a second circuit board and at least one bonding pad, the second circuit board comprises a board main body and a skeleton frame plate which are mutually connected, the board main body and the first circuit board are stacked and arranged at intervals along the thickness direction, the skeleton frame plate is clamped between the first circuit board and the board main body, and the bonding pad is arranged at one end, far away from the board main body, of the skeleton frame plate and is electrically connected with the first circuit board; the framework plate is provided with at least one conductive connecting hole group which is arranged in one-to-one correspondence to the bonding pad, conductive materials are arranged in each conductive connecting hole group, and the plate main body is electrically connected with the bonding pad through the conductive connecting hole group; at least one of the conductive connection hole groups is a first conductive connection hole group comprising a plurality of conductive single holes, the projection of the bonding pad corresponding to the first conductive connection hole group in the thickness direction covers the first conductive connection hole group, and the bonding pad is connected with one end of each of the plurality of conductive single holes of the corresponding first conductive connection hole group.

Description

Circuit board assembly and electronic device

Technical Field

The application belongs to the technical field of communication equipment, and particularly relates to a circuit board assembly and electronic equipment.

Background

With the continuous improvement of the functions of electronic equipment such as a smart phone, the number of functional devices in the electronic equipment is gradually increased, and the size of a battery of the electronic equipment is correspondingly increased, so that the internal space of the electronic equipment in the length and width directions is gradually reduced, and the area of the electronic equipment, in which a circuit board can be arranged, is seriously compressed.

At present, Cavity (translated into holes or holes and the like) plate type circuit boards are mostly adopted to utilize the space in the thickness direction of electronic equipment, the Cavity plate type circuit boards comprise a skeleton frame plate structure, one end of the skeleton frame plate structure is provided with a bonding pad, so that the skeleton frame plate structure and the bonding pad are connected with two circuit boards which are arranged in a stacked mode in the thickness direction, and the two circuit boards are enabled to form an electrical connection relation. In addition, in the Cavity board type circuit board, the width of the bone rack board is relatively small, so that the space occupied by the bone rack board can be reduced.

However, the size of the pad at one end of the framework is relatively small due to the influence of the width of the framework, and therefore when the pad and the framework are connected through the conductive via hole, the pad can only correspond to one conductive via hole, and the mechanical connection performance and the overcurrent capacity between the pad and the framework are relatively poor.

Disclosure of Invention

The embodiment of the application aims to provide a circuit board assembly and electronic equipment, and aims to solve the problem that in the existing laminated circuit board, the mechanical connection performance and the overcurrent capacity between a bonding pad and a frame plate are relatively poor.

In a first aspect, an embodiment of the present application discloses a circuit board assembly, which includes a first circuit board, a second circuit board and at least one pad, where the second circuit board includes a board main body and a skeleton frame plate, the board main body and the first circuit board are stacked and arranged at intervals along a thickness direction of the first circuit board, the skeleton frame plate is clamped between the first circuit board and the board main body, one end of the skeleton frame plate is connected with the board main body, the pad is arranged at one end of the skeleton frame plate, which is far away from the board main body, and the pad is electrically connected with the first circuit board;

the framework plate is provided with at least one conductive connecting hole group, conductive materials are arranged in each conductive connecting hole group, the conductive connecting hole groups and the bonding pads are arranged in a one-to-one correspondence mode, and the plate main body is electrically connected with the bonding pads through the conductive connecting hole groups; at least one of the conductive connection hole groups is a first conductive connection hole group comprising a plurality of conductive single holes, the projection of the pad in the thickness direction of the first circuit board, corresponding to the first conductive connection hole group, covers the first conductive connection hole group, and the pad is connected with one end of each conductive single hole corresponding to the first conductive connection hole group.

In a second aspect, an embodiment of the present application discloses an electronic device, which includes the above circuit board assembly.

The embodiment of the application discloses circuit board assembly, it includes first circuit board, second circuit board and pad, and the board main part of second circuit board is range upon range of setting with first circuit board along the thickness direction of first circuit board, and the position of bone frame plate clamp of second circuit board is established between first circuit board and board main part, and the one end and the board main part of position of bone frame plate are connected, and the pad setting is kept away from the one end of board main part at the position of bone frame plate. And at least one conductive connecting hole group is arranged on the framework plate, conductive materials are arranged in the conductive connecting hole groups, and the conductive connecting hole groups and the bonding pads are arranged in a one-to-one correspondence mode, so that the bonding pads are electrically connected with the plate main body, and the first circuit board is further electrically connected with the plate main body.

Meanwhile, at least one of the conductive connection hole groups is a first conductive connection hole group comprising a plurality of conductive single holes, so that the overcurrent capacity of the first conductive connection hole group can be improved; meanwhile, the projection of the pad corresponding to the first conductive connection hole group in the thickness direction of the first circuit board covers the first conductive connection hole group, and the pad is connected with one end of each of the plurality of conductive single holes in the corresponding first conductive connection hole group, so that the connection area between the first conductive connection hole group and the pad is increased, the connection reliability between the pad and the pad is relatively high, the adhesion capability between the pad and the bone position frame plate is improved, and the overall performance of the circuit board assembly is relatively good.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic cross-sectional view of a circuit board assembly disclosed in an embodiment of the present application;

FIG. 2 is an enlarged view of a portion of one embodiment of a circuit board assembly disclosed in embodiments herein;

FIG. 3 is a schematic view of a portion of the circuit board assembly shown in FIG. 2 in another orientation;

fig. 4 is an enlarged view of a portion of another embodiment of a circuit board assembly according to an embodiment of the present disclosure;

FIG. 5 is a schematic view of a portion of the structure shown in FIG. 4 in another orientation;

fig. 6 is an enlarged view of a portion of a circuit board assembly according to still another embodiment of the disclosure;

fig. 7 is a schematic view of a portion of the structure in another direction in the circuit board assembly shown in fig. 6.

Description of reference numerals:

100-a first circuit board,

210-plate body, 220-bone rack plate, 230-mechanical hole, 240-first conductive connection hole group, 241-conductive single hole, 241 a-first hole, 241 b-second hole, 250-conductive layer,

300-first bonding pad,

400-solder ball,

500-electronic components,

600-pad external connection.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The folding mechanism and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

As shown in fig. 1 to 7, an embodiment of the present application discloses a circuit board assembly and an electronic device, where the circuit board assembly can be applied to the electronic device. The circuit board assembly includes afirst circuit board 100, a second circuit board, and at least one pad.

Thefirst circuit board 100 may be a conventional flat circuit board, and theelectronic component 500 may be soldered on the first circuit board; of course, thefirst circuit board 100 may also be a special-shaped circuit board, which is not limited herein.

As shown in fig. 1, the second circuit board includes a boardmain body 210 and askeletal frame plate 220, wherein the boardmain body 210 is a portion of the second circuit board for mounting theelectronic component 500, that is, theelectronic component 500 to be mounted on the second circuit board can be soldered to the boardmain body 210. In other words, the boardmain body 210 in the second circuit board may be identical in structure and function to thefirst circuit board 100 described above.

The boardmain body 210 and thefirst circuit board 100 are stacked and spaced apart in the thickness direction of thefirst circuit board 100, so that the circuit board assembly can maximally utilize the space in the thickness direction of the electronic device, and the space for accommodating the circuit board assembly in the electronic device is increased. Also, thebone bay plate 220 is sandwiched between thefirst circuit board 100 and theplate body 210 to provide a structural foundation for the connection between thefirst circuit board 100 and theplate body 210.

Meanwhile, one end of the ribposition shelf plate 220 is connected with the platemain body 210, so that the platemain body 210 and the ribposition shelf plate 220 are connected into a whole; alternatively, theboard body 210 and thebone rack 220 may be integrally formed to improve the structural reliability of the second circuit board and the reliability of the electrical connection between theboard body 210 and thefirst circuit board 100.

And, the pad is disposed at an end of therib shelf 220 far away from the boardmain body 210, that is, the pad is disposed at an end of therib shelf 220 close to thefirst circuit board 100, and the pad can provide a bridging effect for the electrical connection between thefirst circuit board 100 and the second circuit board. The pads are electrically connected to thefirst circuit board 100, and specifically, the pads may be directly electrically connected to corresponding positions on thefirst circuit board 100 by welding or the like; in another embodiment of the present application, optionally, the bonding pad is electrically connected to thefirst circuit board 100 through the solder ball 400, which can improve the connection reliability between the bonding pad and thefirst circuit board 100 and reduce the connection difficulty between the bonding pad and thefirst circuit board 100.

In order to enable theboard body 210 to be electrically connected to the bonding pad through thebone rack board 220, as shown in fig. 1, at least one conductive connection hole set is provided on thebone rack board 220, and a conductive material is provided in each conductive connection hole set, the conductive material is provided in a manner including, but not limited to, filling, electroplating, or bonding, and the conductive material includes, but not limited to, a metal conductive material such as copper, tin, and the like; and the conductive connection hole groups and the pads are arranged in a one-to-one correspondence, so that theboard body 210 can form an electrical connection relationship with the pads through the conductive connection hole groups under the action of the conductive material in the conductive connection hole groups. The conductive connecting hole group can be formed in a laser processing mode so as to reduce the processing difficulty of the conductive connecting hole group and improve the processing precision of the conductive connecting hole group.

The size of the conductive connection hole group in the thickness direction of thefirst circuit board 100 may be determined according to specific conditions such as a processing technology and actual requirements, and is not limited herein. The number of the conductive connection hole groups between the boardmain body 210 and the pads may be one or more, and the pads may be ensured to be disposed in one-to-one correspondence with the conductive connection hole groups by making the number of the conductive connection hole groups between the boardmain body 210 and the pads correspond to the number of the pads. In the case that the number of the conductive connection hole groups is multiple, thebone rack 220 may have a multi-layer structure, and the ends of the conductive connection hole groups departing from the bonding pads are respectively connected to different positions of thebone rack 220. The conductive material may be copper, and copper may be injected into the conductive via set through a copper injection process, so that theboard body 210 and the pad are electrically connected. In addition, aconductive layer 250 may be embedded in theskeletal plate 220, so that the conductive material in the conductive via set can be electrically connected to theplate body 210 through theconductive layer 250.

Meanwhile, in order to further improve the overcurrent capability between thefirst circuit board 100 and the boardmain body 210 in the circuit board assembly, as shown in fig. 2, 4 and 6, the at least one conductive connection hole group may be made to include a plurality of conductivesingle holes 241. Specifically, as described above, the number of the conductive connection hole groups may be one or more, in this case, at least one of the conductive connection hole groups may be the first conductive connection hole group 240, and the first conductive connection hole group 240 includes a plurality of conductivesingle holes 241, and in a case where the sectional area of each conductivesingle hole 241 is kept unchanged, the amount of the conductive material that the first conductive connection hole group 240 can accommodate is relatively larger, so that the sectional area of the first conductive connection hole group 240 can be increased, and by connecting the pad to one end of each of the plurality of conductivesingle holes 241 in the corresponding first conductive connection hole group 240, an effect of increasing the overcurrent capacity of the first conductive connection hole group 240 can be achieved. Even if the size of the single conductive via 241 in the first conductive via group 240 is reduced compared to the cross-sectional area of the conventional conductive via, the cross-sectional area of the entire first conductive via group 240 may be increased when the first conductive via group 240 includes a plurality of singleconductive vias 241.

Certainly, in order to ensure that the connection reliability between the first conductive connection hole group 240 and the pad is relatively high, it is further required to make the projection of the pad corresponding to the first conductive connection hole group 240 in the thickness direction of thefirst circuit board 100 cover the first conductive connection hole group 240, so that the conductive material in each conductivesingle hole 241 in the first conductive connection hole group 240 can "fall" on the surface of the pad, so as to improve the adhesion capability between the pad and the first conductive connection hole group 240, and further improve the overall performance of the circuit board assembly.

Specifically, the arrangement manner of the plurality of conductivesingle holes 241 in the first conductive connection hole group 240 may be determined based on the size of the pad, so as to determine the specific relative positions of the plurality of conductivesingle holes 241 under the condition that the correspondence relationship between the pad and the plurality of conductivesingle holes 241 is satisfied. More specifically, the number of the conductivesingle holes 241 may be two, and two conductivesingle holes 241 may be arranged at an area with the largest size span on the pad, and a plurality of conductivesingle holes 241 may be arranged in a structure corresponding to the pad. For example, the bonding pad may be a circular structure, in which case the conductivesingle hole 241 may be arranged corresponding to a straight line on the bonding pad where any diameter is located.

The embodiment of the application discloses a circuit board assembly, it includesfirst circuit board 100, second circuit board and pad, and the boardmain part 210 and thefirst circuit board 100 of second circuit board are along the range upon range of setting of the thickness direction offirst circuit board 100, and the position ofbone frame 220 clamp of second circuit board is established betweenfirst circuit board 100 and boardmain part 210, and the one end and the boardmain part 210 of position ofbone frame 220 are connected, and the pad setting is kept away from the one end of boardmain part 210 at position ofbone frame 220. Furthermore, at least one conductive connection hole set is disposed on theskeleton frame plate 220, and the conductive connection hole sets and the pads are disposed in a one-to-one correspondence manner, so that the pads are electrically connected to the boardmain body 210, and thefirst circuit board 100 and the boardmain body 210 form an electrical connection relationship.

Meanwhile, at least one of the conductive via groups is the first conductive via group 240 including a plurality of conductivesingle holes 241, which enables the overcurrent capability of the first conductive via group 240 to be improved; meanwhile, the projection of the pad corresponding to the first conductive connection hole group 240 in the thickness direction of thefirst circuit board 100 covers the first conductive connection hole group 240, so that the connection area between the first conductive connection hole group 240 and the pad is increased, the connection reliability between the first conductive connection hole group 240 and the pad is relatively high, the adhesion capability between the pad and thebone frame plate 220 is improved, and the overall performance of the circuit board assembly is relatively good.

Optionally, the number of the conductivesingle holes 241 in the first conductive connection hole group 240 is two, which may improve the over-current capability of the conductive material in the first conductive connection hole group 240 and the connection reliability between the conductive material in the first conductive connection hole group 240 and the pad without changing the structure of the existing pad.

On this basis, the two conductivesingle holes 241 in the first conductive connection hole group 240 may be a first conductive single hole and a second conductive single hole, respectively, and optionally, a projection of the first conductive single hole in the thickness direction of thefirst circuit board 100 is located outside the second conductive single hole. In other words, the first conductive via and the second conductive via are independent of each other. Under the condition of adopting the technical scheme, the positions of the two conductive single holes 241 (namely the first conductive single hole and the second conductive single hole) are determined, so that the conductive single holes can be formed in a laser processing mode, the processing difficulty of the first conductive connection hole group 240 is relatively low, and the cost cannot be obviously increased while the overcurrent capacity of the first conductive connection hole group 240 is improved.

In the above embodiment, the cross-sectional areas of the conductivesingle holes 241 at different positions are optionally the same, and the first conductive single hole and the second conductive single hole may be arranged in a tangential manner.

In another embodiment of the present application, optionally, the cross-sectional area of each conductivesingle hole 241 in the first conductive connection hole group 240 is different at different positions, and in detail, the cross-sectional area of each conductivesingle hole 241 may be gradually reduced along a direction in which afirst aperture 241a of the conductivesingle hole 241 points to asecond aperture 241b thereof, wherein thefirst aperture 241a is an aperture of the conductivesingle hole 241 towards the pad, and thesecond aperture 241b is an aperture of the conductivesingle hole 241 towards themechanical hole 230. Under the condition of adopting the technical scheme, the forming difficulty of the conductivesingle hole 241 can be reduced.

Based on the above embodiment, as shown in fig. 3, thefirst aperture 241a of the first conductive single hole and thefirst aperture 241a of the second conductive single hole may be arranged at an interval, so as to further reduce the processing difficulty of the first conductive single hole and the second conductive single hole; in addition, the processing processes of the first conductive single hole and the second conductive single hole can be prevented from being interfered with each other as much as possible, and the processing precision and reliability of the first conductive single hole and the second conductive single hole are improved.

Specifically, the distance between thefirst aperture 241a of the first conductive single hole and thefirst aperture 241a of the second conductive single hole may be determined according to the actual conditions such as the size of the pad, and the size of the interval between thefirst apertures 241a of the first conductive single hole and thefirst aperture 241a of the second conductive single hole may be made as large as possible within a feasible range, so as to reduce the processing difficulty of the first conductive single hole and the second conductive single hole to the maximum.

In addition, in the case that the cross-sectional areas at different positions on each conductivesingle hole 241 are different, the cross-sectional area at the second opening of each conductivesingle hole 241 facing themechanical hole 230 is the smallest, i.e. the cross-sectional area of the conductive material in the conductivesingle hole 241 represents the overcurrent capacity of the conductivesingle hole 241. In the case where the first conductive connection hole group 240 includes two conductivesingle holes 241 of the above-described structure, the overcurrent capacity of the first conductive connection hole group 240 is twice the sectional area of the second orifice of the conductivesingle hole 241.

In the case where the first conductive single hole group 240 includes two conductivesingle holes 241, and the sectional area of each conductivesingle hole 241 is gradually reduced along the direction in which thefirst hole 241a is directed to the second hole, the two conductivesingle holes 241 may also be a first conductive single hole and a second conductive single hole, respectively. On this basis, in order to further improve the overcurrent capacity of the first conductive via group 240, a communication cavity may be disposed at the second aperture of each of the first conductive single hole and the second conductive single hole, so that the portion between the second apertures of each of the first conductive single hole and the second conductive single hole may also be filled with a conductive material, thereby further improving the conductive capacity of the first conductive via group 240.

In detail, the first conductive connection hole group 240 further includes a communication cavity, and the communication cavity may be filled with a conductive material, similar to each conductivesingle hole 241. In the process of laying the first conductive single hole and the second conductive single hole, the arrangement positions of the first conductive single hole and the second conductive single hole can be determined based on the sizes of the second orifices of the first conductive single hole and the second conductive single hole, so that the second orifices of the first conductive single hole and the second orifices of the second conductive single hole are spaced from each other. Furthermore, the interval between the second apertures of the two conductivesingle holes 241 can be removed by laser drilling to form a communicating cavity, so that the communicating cavity is communicated between the second aperture of the first conductive single hole and the second aperture of the second conductive single hole, and thus, in the process of filling the conductive material, the second apertures of the two conductivesingle holes 241 are connected with the conductive material in the communicating cavity to form a whole, and the overcurrent capacity is provided together. Obviously, in the case that the first electrically conductive connection hole group 240 includes two electrically conductivesingle holes 241, the overcurrent capacity of the first electrically conductive connection hole group 240 may be further increased by adopting the above technical solution.

In the above embodiment, the first apertures of the first conductive single hole and the second conductive single hole may also be spaced from each other, in which case, the communication cavity may further extend from the second aperture of the conductivesingle hole 241 to thefirst aperture 241a, and thefirst aperture 241a of the first conductive single hole and thefirst aperture 241a of the second conductive single hole are also communicated with each other through the communication cavity, so as to further ensure that the overcurrent capability of the conductive connection aperture set disclosed in this embodiment is significantly increased.

In another embodiment of the present application, as shown in fig. 4 and 5, a projection portion of the first conductive single via and the second conductive single via in the thickness direction of thefirst circuit board 100 may be made to coincide; alternatively, a part of a projection of thefirst aperture 241a of the first conductive single hole in the thickness direction of thefirst circuit board 100 may be located inside thefirst aperture 241a of the second conductive single hole.

Of course, in this embodiment, since the first conductive single hole and the second conductive single hole are partially overlapped in the thickness direction, the hole walls of the first conductive single hole and the second conductive single hole have a portion connected to each other, and the communication cavity is communicated with the second openings of the first conductive single hole and the second conductive single hole, on the basis, in order to prevent the formation material of thebone frame plate 220 from being still sandwiched between the first conductive single hole and the second conductive single hole, the communication cavity may extend from the position where the second opening of the first conductive single hole is located to the connection position of the hole walls of the first conductive single hole and the second conductive single hole. That is, in the conductive connection hole group disclosed in this embodiment, the first conductive single hole and the second conductive single hole are respectively directly connected along one portion of the hole walls in the thickness direction of thefirst circuit board 100, and the other portions are indirectly connected through the cavity walls of the communication cavity, so that the first conductive single hole and the second conductive single hole are integrally connected together.

Under the condition of adopting the technical scheme, the processing difficulty of the first conductive single hole and the second conductive single hole can be reduced to a certain extent, and the processing difficulty of the communicating cavity is relatively low. Of course, in the case that thefirst apertures 241a of the two singleconductive holes 241 overlap each other, it is necessary to ensure that the second apertures of the two singleconductive holes 241 are still spaced apart from each other, so as to ensure that the overcurrent capacity of the first conductive connection hole set 240 is relatively large.

In another embodiment of the present application, the first conductive via group 240 may include at least threeconductive vias 241, in which case, the utilization rate of the bonding area on the pad may be further improved, so that the overcurrent capability of the conductive material in the first conductive via group 240 may be further increased, and the adhesion reliability between the conductive material in the first conductive via group 240 and the pad may be improved. Of course, in the process of laying out at least three conductivesingle holes 241 in the first conductive connection hole group 240, it is necessary to ensure that any two conductivesingle holes 241 cannot be completely overlapped.

As described above, the number of the pads may be one or more, in which case, at least one of the pads may be thefirst pad 300, thefirst pad 300 is disposed corresponding to the first conductive connection hole group 240, and accordingly, the number of the first conductive connection hole group 240 is the same as the number of thefirst pad 300, and corresponds to one.

Based on the above embodiments, optionally, the circuit board assembly disclosed in the embodiments of the present application may further include a pad external-connection portion 600, and the outer edge of thefirst pad 300 is externally connected with the pad external-connection portion 600, so that thefirst pad 300 and the pad external-connection portion 600 are combined to form a "new pad" with a larger size, and the butt-joint area on the "new pad" is relatively larger, so that the circuit board assembly may be matched with a larger number of conductivesingle holes 241.

Accordingly, when the first conductive connection hole set 240 includes at least three conductivesingle holes 241, the projections of the conductivesingle holes 241 of the first conductive connection hole set 240 in the thickness direction of thefirst circuit board 100 may not overlap each other. Furthermore, the difficulty of processing at least three conductivesingle holes 241 in the first conductive connection hole group 240 is relatively small.

In addition, as described above, the size of the pad can be made as small as possible by connecting the pad and the boardmain body 210 by combining themechanical hole 230 and the set of conductive connection holes through thebone rack board 220, and in the above embodiment, since the outer edge of thefirst pad 300 is externally connected with the padexternal portion 600, the butt joint area on the "new pad" is relatively large, for this reason, in this embodiment, the insulating layer can be covered on the side of the padexternal portion 600 away from thefirst circuit board 100 to cover the padexternal portion 600 through the insulating layer, so that the padexternal portion 600 can provide a larger bearing area for the set of conductive connection holes, and at the same time, the exposed portion, i.e., the portion capable of conducting electricity, remains unchanged, and the portion capable of electrically connecting the surface of the pad is still relatively small.

Specifically, in the processing process, thefirst pad 300 and the padexternal connection portion 600 on the outer edge thereof may be integrally formed, so that the forming difficulty of thefirst pad 300 and the padexternal connection portion 600 is reduced, the connection reliability between thefirst pad 300 and the padexternal connection portion 600 is relatively higher, and the bearing capacity of a new pad is improved. In addition, the insulating layer may be solder resist ink, so as to ensure that the conductive material in the plurality of conductivesingle holes 241 can form a reliable insulating relationship with the padexternal connection 600 through the insulating layer.

In the case that the number of the conductivesingle holes 241 in the first conductive connection hole group 240 is at least three, and the outer edge of thefirst pad 300 is externally connected with the padexternal connection part 600, further, any two conductivesingle holes 241 in the first conductive connection hole group 240 may be spaced from each other toward the hole opening of thefirst pad 300, that is, the projections of any two conductivesingle holes 241 in the first conductive connection hole group 240 in the thickness direction of thefirst circuit board 100 are spaced from each other, which may further reduce the difficulty in forming each conductivesingle hole 241 in the first conductive connection hole group 240, and may prevent the processing processes of any two conductivesingle holes 241 from interfering with each other.

Alternatively, as shown in fig. 7, the first conductive connection hole group 240 may include three conductivesingle holes 241, in which case, the distances between any two adjacent conductivesingle holes 241 may also be equal, or in which a connection line of the centers of the first apertures 241a (or the second apertures) of the three conductivesingle holes 241 may form an equilateral triangle, in which case, the size of the area occupied by the whole first conductive connection hole group 240 can be reduced as much as possible, and thus the size of the pad external-connection portion 600 that needs to be added can be reduced; meanwhile, the sectional area of the conductive material filled in the first conductive connection hole group 240 can be maximized, the overcurrent capability of the conductive material in the first conductive connection hole group 240 can be improved, and the connection reliability between the conductive material in the first conductive connection hole group 240 and thefirst pad 300 can be improved.

In addition, based on the circuit board assemblies disclosed in the above embodiments, in the process of forming the ribposition frame plate 220 in the second circuit board, the respective advantages of the conductive connection hole groups disclosed in different embodiments can be utilized, and the conductive connection hole groups with different structures are respectively formed at different positions of the ribposition frame plate 220, so that the whole ribposition frame plate 220 has various advantages of superior performance, lower processing difficulty and the like, and the market competitiveness of the circuit board assembly is maximally improved.

As described above, the conductive connection hole group may be processed by laser processing, that is, the conductive connection hole group is a laser hole group, in this case, limited by factors such as a maximum cross-sectional area of the conductive connection hole group, the depth of the conductive connection hole group needs to be within a preset range, and if the size of the space between the conductive connection hole group and thefirst circuit board 100 is relatively large in the process of connecting theboard body 210 and thefirst circuit board 100, optionally, amechanical hole 230 is further disposed on theframework 220, that is, a via hole formed by mechanical processing is used, themechanical hole 230 communicates with the conductive connection hole group, and themechanical hole 230 can be filled with a conductive material, so that theboard body 210 can be electrically connected to the pad through the conductive connection hole group and themechanical hole 230.

Further, along the thickness direction of thefirst circuit board 100, at least one first conductive connection hole set 240 may be disposed at both ends of themechanical hole 230 opposite to each other, that is, at least one conductive connection hole set is disposed at both ends of themechanical hole 230 opposite to each other, and at least one first conductive connection hole set 240 is correspondingly included in at least one conductive connection hole set at both ends of themechanical hole 230 opposite to each other, and each first conductive connection hole set includes a plurality of conductivesingle holes 241. One end of each of the plurality of conductivesingle holes 241 in the first conductive connection hole group on the side of themechanical hole 230 away from the pad is connected to theboard body 210, so as to improve the reliability and overcurrent capacity of the mechanical connection between thebone rack plate 220 and theboard body 210.

Based on any of the above embodiments, the present application further discloses an electronic device, where the electronic device includes the circuit board assembly disclosed in any of the above embodiments, and of course, the electronic device may further include other devices such as a chip and a battery, and the details are not described here in detail in view of brevity of text.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (12)

Translated fromChinese

1.一种电路板组件，其特征在于，包括第一电路板、第二电路板和至少一个焊盘，所述第二电路板包括板主体和骨位架板，所述板主体和所述第一电路板沿所述第一电路板的厚度方向层叠且间隔设置，所述骨位架板夹设于所述第一电路板和所述板主体之间，且所述骨位架板的一端与所述板主体连接，所述焊盘设置于所述骨位架板远离所述板主体的一端，且所述焊盘与所述第一电路板电性连接；1. A circuit board assembly, characterized by comprising a first circuit board, a second circuit board and at least one solder pad, the second circuit board comprising a board body and a skeleton frame board, the board body and the The first circuit boards are stacked and spaced along the thickness direction of the first circuit board, the skeleton frame board is sandwiched between the first circuit board and the board main body, and the skeleton frame board is One end is connected to the board main body, the pad is arranged on one end of the skeleton board away from the board main body, and the solder pad is electrically connected to the first circuit board;所述骨位架板设有至少一个导电连接孔组，各所述导电连接孔组内均设置有导电材料，所述导电连接孔组与所述焊盘一一对应设置，所述板主体通过所述导电连接孔组与所述焊盘电连接；其中，所述导电连接孔组中的至少一者为包括多个导电单孔的第一导电连接孔组，与所述第一导电连接孔组对应的所述焊盘在所述第一电路板的厚度方向的投影覆盖所述第一导电连接孔组，且所述焊盘与对应的所述第一导电连接孔组的多个所述导电单孔的一端均连接。The skeleton plate is provided with at least one conductive connection hole group, each of the conductive connection hole groups is provided with a conductive material, the conductive connection hole group and the pads are arranged in a one-to-one correspondence, and the board body passes through the The conductive connection hole group is electrically connected to the pad; wherein, at least one of the conductive connection hole group is a first conductive connection hole group including a plurality of conductive single holes, which is connected to the first conductive connection hole The projection of the pads corresponding to the group in the thickness direction of the first circuit board covers the first conductive connection hole group, and the pads correspond to the plurality of the first conductive connection hole groups. One end of the conductive single hole is connected.2.根据权利要求1所述的电路板组件，其特征在于，所述第一导电连接孔组中的所述导电单孔的数量为两个，且分别为第一导电单孔和第二导电单孔，所述第一导电单孔在所述厚度方向上的投影位于所述第二导电单孔之外。2 . The circuit board assembly according to claim 1 , wherein the number of the conductive single holes in the first conductive connection hole group is two, and they are the first conductive single hole and the second conductive hole respectively. 3 . A single hole, the projection of the first conductive single hole in the thickness direction is located outside the second conductive single hole.3.根据权利要求2所述的电路板组件，其特征在于，沿所述导电单孔朝向焊盘的第一孔口指向所述导电单孔朝向所述板主体的第二孔口的方向，各所述导电单孔的截面积逐渐减小，且所述第一导电单孔的第一孔口与所述第二导电单孔的第一孔口间隔设置。3 . The circuit board assembly according to claim 2 , wherein, along the direction of the conductive single hole facing the second hole of the board body along the direction of the first hole of the conductive single hole facing the pad, 3 . The cross-sectional area of each of the conductive single holes is gradually reduced, and the first holes of the first conductive single holes and the first holes of the second conductive single holes are arranged at intervals.4.根据权利要求1所述的电路板组件，其特征在于，所述第一导电连接孔组中的所述导电单孔的数量为两个，且分别为第一导电单孔和第二导电单孔，沿所述导电单孔朝向焊盘的第一孔口指向所述导电单孔朝向所述板主体的第二孔口的方向，各所述导电单孔的截面积逐渐减小；4 . The circuit board assembly according to claim 1 , wherein the number of the conductive single holes in the first conductive connection hole group is two, and they are the first conductive single hole and the second conductive hole respectively. 5 . A single hole, the cross-sectional area of each conductive single hole gradually decreases along the direction in which the conductive single hole faces the first hole of the pad and the conductive single hole faces the second hole of the board body;所述第一导电连接孔组还包括连通腔，所述连通腔内设置有导电材料，所述第一导电单孔的第二孔口与所述第二导电单孔的第二孔口间隔设置，所述连通腔连通于所述第一导电单孔的第二孔口与所述第二导电单孔的第二孔口之间。The first conductive connection hole group further includes a communication cavity, a conductive material is arranged in the communication cavity, and the second orifice of the first conductive single hole is spaced from the second orifice of the second conductive single hole and the communication cavity is communicated between the second orifice of the first conductive single hole and the second orifice of the second conductive single hole.5.根据权利要求4所述的电路板组件，其特征在于，所述第一导电单孔与所述第二导电单孔在所述第一电路板的厚度方向上的投影部分重叠。5 . The circuit board assembly of claim 4 , wherein the projection portion of the first conductive single hole and the second conductive single hole in the thickness direction of the first circuit board overlaps. 6 .6.根据权利要求1所述的电路板组件，其特征在于，所述第一导电连接孔组包括至少三个所述导电单孔。6 . The circuit board assembly of claim 1 , wherein the first conductive connection hole group comprises at least three of the conductive single holes. 7 .7.根据权利要求6所述的电路板组件，其特征在于，所述电路板组件还包括焊盘外接部，所述焊盘中的至少一者为第一焊盘，所述第一焊盘与所述第一导电连接孔组对应设置，所述第一焊盘的外缘外接有所述焊盘外接部，所述焊盘外接部背离所述第一电路板的一侧覆盖有绝缘层，所述第一导电连接孔组的各所述导电单孔在所述厚度方向上的投影互不重叠。7 . The circuit board assembly according to claim 6 , wherein the circuit board assembly further comprises a portion outside the pads, at least one of the pads is a first pad, and the first pad Corresponding to the first conductive connection hole group, the outer edge of the first pad is circumscribed with the pad outer portion, and the side of the pad outer portion away from the first circuit board is covered with an insulating layer , the projections of the conductive single holes in the first conductive connection hole group in the thickness direction do not overlap each other.8.根据权利要求7所述的电路板组件，其特征在于，所述第一导电连接孔组中的任意两个所述导电单孔朝向所述第一焊盘的孔口均相互间隔。8 . The circuit board assembly according to claim 7 , wherein any two of the conductive single holes in the first conductive connection hole group are spaced apart from each other.9.根据权利要求7所述的电路板组件，其特征在于，所述第一导电连接孔组包括三个所述导电单孔，任意相邻的两个所述导电单孔之间的间距均相等。9 . The circuit board assembly according to claim 7 , wherein the first conductive connection hole group comprises three single conductive holes, and the distance between any two adjacent single conductive holes is equal to 9 . equal.10.根据权利要求1所述的电路板组件，其特征在于，所述导电连接孔组为激光孔组，所述骨位架板设有机械孔，所述板主体通过所述导电连接孔组和所述机械孔与所述焊盘电连接。10 . The circuit board assembly according to claim 1 , wherein the conductive connection hole group is a laser hole group, the skeleton frame plate is provided with a mechanical hole, and the board main body passes through the conductive connection hole group. 11 . and the mechanical hole is electrically connected to the pad.11.根据权利要求10所述的电路板组件，其特征在于，沿所述第一电路板的厚度方向，所述机械孔的相背两端均设有至少一个所述第一导电连接孔组。11 . The circuit board assembly according to claim 10 , wherein, along the thickness direction of the first circuit board, at least one set of the first conductive connection holes is provided at opposite ends of the mechanical hole. 12 . .12.一种电子设备，其特征在于，包括权利要求1-11任意一项所述的电路板组件。12. An electronic device, comprising the circuit board assembly according to any one of claims 1-11.

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