CN114035286A - Optical module - Google Patents

Abstract

The optical module comprises a circuit board, a secondary circuit board attached to the circuit board, a first optical transceiving secondary module, a second optical transceiving secondary module, an optical fiber ribbon and a fixing frame, wherein the secondary circuit board is provided with a connecting hole; the second optical transceiving submodule and the first optical transceiving submodule are arranged on the circuit board side by side along the left-right direction; the transmitting optical fiber ribbon is connected with the transmitting light port, and the receiving optical fiber ribbon is connected with the receiving light port; the fixing frame is arranged at the periphery of the second optical transceiver sub-module and comprises a first fixing plate, a second fixing plate and a third fixing plate, the second fixing plate is arranged on a silicon optical chip of the second optical transceiver sub-module, the transmitting optical fiber ribbon is clamped on the third fixing plate, and the receiving optical fiber ribbon is clamped on the first fixing plate. The application adopts a double-circuit-board attaching mode, so that the layout area of the circuit board is increased; the optical fiber ribbon connected with the first optical transceiver sub-module is fixed on the circuit board through the fixing frame, so that the bending of the optical fiber ribbon is avoided.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

At present, with the continuous improvement of the requirement of the transmission rate of the optical module, the integration level of the optical module is higher and higher, and as the integration level of the optical module is higher and higher, the power density of the optical module is also increased, so that more wiring lines are arranged on a circuit board of the optical module. And when the photoelectric device arranged on the circuit board is provided with more wires, signal crosstalk between the wires is easily caused, the transmission rate of the optical module is influenced, and the integration of the optical module is not facilitated.

Disclosure of Invention

The embodiment of the application provides an optical module, which aims to solve the problem that when the integration level of the optical module is higher, more photoelectric devices and wiring lines are arranged on a circuit board of the optical module, and the transmission rate of the optical module is influenced.

The application provides an optical module, includes:

a circuit board;

the secondary circuit board is attached to the circuit board and is provided with a connecting hole;

the first optical transceiving sub-module is arranged on the surface of the circuit board, positioned in the connecting hole and comprises a first silicon optical chip, wherein the first silicon optical chip comprises an emitting optical port and a receiving optical port, and the emitting optical port and the receiving optical port are positioned on the same side;

the second optical transceiving submodule is arranged on the surface of the circuit board and is arranged with the first optical transceiving submodule in parallel along the left-right direction;

the optical fiber ribbon comprises a transmitting optical fiber ribbon and a receiving optical fiber ribbon, the transmitting optical fiber ribbon is connected with the transmitting optical port of the first silicon optical chip, and the receiving optical fiber ribbon is connected with the receiving optical port of the first silicon optical chip;

the fixing frame is arranged at the periphery of the second optical transceiver sub-module and comprises a first fixing plate, a second fixing plate and a third fixing plate, two ends of the second fixing plate are respectively connected with the first fixing plate and the third fixing plate, and the first fixing plate and the third fixing plate are arranged oppositely; the second fixing plate is arranged on a silicon optical chip of the second optical transceiver sub-module, the transmitting optical fiber ribbon is clamped on the third fixing plate, and the receiving optical fiber ribbon is clamped on the first fixing plate;

and the optical fiber connector is respectively connected with the first optical transceiving submodule and the second optical transceiving submodule through optical fiber ribbons.

The optical module comprises a circuit board, a secondary circuit board, a first optical transceiving secondary module, a second optical transceiving secondary module, an optical fiber ribbon, a fixing frame and an optical fiber connector, wherein the secondary circuit board is attached to the circuit board, a connecting hole is formed in the secondary circuit board, the first optical transceiving secondary module is arranged on the surface of the circuit board and located in the connecting hole and comprises a first silicon optical chip, the first silicon optical chip comprises a transmitting optical port and a receiving optical port, and the transmitting optical port and the receiving optical port are located on the same side; the second optical transceiving submodule is arranged on the surface of the circuit board and arranged with the first optical transceiving submodule along the left-right direction; the optical fiber ribbon comprises a transmitting optical fiber ribbon and a receiving optical fiber ribbon, the transmitting optical fiber ribbon is connected with a transmitting optical port of the first silicon optical chip, the receiving optical fiber ribbon is connected with a receiving optical port of the first silicon optical chip, and light in the first silicon optical chip is transmitted and received through the transmitting optical fiber ribbon and the receiving optical fiber ribbon; the fixing frame is arranged on the periphery of the second optical transceiver sub-module and comprises a first fixing plate, a second fixing plate and a third fixing plate, two ends of the second fixing plate are respectively connected with the first fixing plate and the third fixing plate, and the first fixing plate and the third fixing plate are arranged oppositely; the second fixing plate is arranged on the silicon optical chip of the second optical transceiver sub-module, the transmitting optical fiber ribbon is clamped on the third fixing plate, and the receiving optical fiber ribbon is clamped on the first fixing plate; the optical fiber connector is respectively connected with the first optical transceiving submodule and the second optical transceiving submodule through optical fiber ribbons. The layout area of the circuit board can be increased by adopting a double-circuit-board attaching mode, and the photoelectric device can be arranged on the circuit board and the secondary circuit board, so that wiring for connecting the photoelectric device is more dispersed; the optical fiber ribbon connected with the first optical transceiver sub-module is fixed on the circuit board through the fixing frame, so that the bending of the optical fiber ribbon can be avoided.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a schematic assembly diagram of a circuit board, an optical transceiver sub-assembly, an optical fiber ribbon, and an optical fiber connector in an optical module according to an embodiment of the present disclosure;

FIG. 6 is a side view of an optical module according to an embodiment of the present disclosure, showing an assembly of a circuit board, an optical transceiver sub-assembly, and an optical fiber ribbon;

fig. 7 is an exploded schematic view of a circuit board, a sub-circuit board, and an optical transceiver sub-module in an optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a secondary circuit board in an optical module provided in the embodiment of the present application;

fig. 9 is an assembly schematic diagram of a secondary circuit board and a first optical transceiver secondary module in an optical module according to an embodiment of the present disclosure;

fig. 10 is a partially exploded schematic view of a circuit board, a sub-circuit board, and an optical transceiver sub-module in an optical module according to an embodiment of the present disclosure;

fig. 11 is a partially exploded schematic view of an optical transceiver sub-assembly in an optical module according to an embodiment of the present disclosure;

fig. 12 is a front view of an optical transceiver sub-assembly in an optical module provided in an embodiment of the present application;

fig. 13 is a schematic structural diagram of a transmitting housing in an optical module provided in the embodiment of the present application;

fig. 14 is a partially exploded schematic view of a secondary circuit board and an optical transceiver sub-module in an optical module according to an embodiment of the present disclosure;

fig. 15 is a schematic structural diagram of a fixing frame in an optical module according to an embodiment of the present application;

fig. 16 is a schematic diagram illustrating a partial assembly of a circuit board, a first rosa, a second rosa, and an optical fiber ribbon in an optical module according to an embodiment of the present disclosure;

fig. 17 is a schematic diagram illustrating a secondary circuit board and a signal processing chip in an optical module according to an embodiment of the present application in a separated manner;

fig. 18 is a signal connection cross-sectional view of a first optical sub-transceiver module and a second optical sub-transceiver module in an optical module provided in the embodiment of the present application;

fig. 19 is another exploded schematic view of a secondary circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 20 is a cross-sectional view of another signal connection between a circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 21 is a schematic diagram of signal connection between a silicon optical chip and a signal processing chip in an optical module according to an embodiment of the present application;

fig. 22 is a schematic diagram illustrating signal connection between a first silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present application;

fig. 23 is a schematic diagram illustrating signal connection between a second silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present application;

fig. 24 is a schematic power connection diagram of a circuit board, a signal processing chip, and a first optical transceiver sub-module in an optical module according to an embodiment of the present disclosure;

fig. 25 is a cross-sectional view of a power connection of a first optical sub-transceiver module in an optical module according to an embodiment of the present disclosure;

fig. 26 is a schematic power connection diagram of a circuit board, a signal processing chip, and a second optical transceiver sub-module in an optical module according to an embodiment of the present disclosure;

fig. 27 is a cross-sectional view of a power connection of a second optical sub-transceiver module in an optical module according to an embodiment of the present disclosure;

fig. 28 is a schematic diagram of a pad structure of a secondary circuit board in an optical module according to an embodiment of the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C," each including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes aremote server 1000, a localinformation processing device 2000, anoptical network terminal 100, anoptical module 200, anoptical fiber 101, and anetwork cable 103;

one end of theoptical fiber 101 is connected to theremote server 1000, and the other end is connected to theoptical network terminal 100 through theoptical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between theremote server 1000 and theoptical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of thenetwork cable 103 is connected to the localinformation processing device 2000, and the other end is connected to theoptical network terminal 100. The localinformation processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between theremote server 1000 and theoptical network terminal 100 is greater than the physical distance between the localinformation processing apparatus 2000 and theoptical network terminal 100. The connection between the localinformation processing device 2000 and theremote server 1000 is completed by theoptical fiber 101 and thenetwork cable 103; and the connection between theoptical fiber 101 and thenetwork cable 103 is completed by theoptical module 200 and theoptical network terminal 100.

Theoptical module 200 includes an optical port and an electrical port. The optical port is configured to connect with theoptical fiber 101, so that theoptical module 200 establishes a bidirectional optical signal connection with theoptical fiber 101; the electrical port is configured to be accessed into theoptical network terminal 100, so that theoptical module 200 establishes a bidirectional electrical signal connection with theoptical network terminal 100. Theoptical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between theoptical fiber 101 and theoptical network terminal 100. For example, an optical signal from theoptical fiber 101 is converted into an electrical signal by theoptical module 200 and then input to theoptical network terminal 100, and an electrical signal from theoptical network terminal 100 is converted into an optical signal by theoptical module 200 and input to theoptical fiber 101.

Theoptical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and anoptical module interface 102 and anetwork cable interface 104 provided on the housing. Theoptical module interface 102 is configured to access theoptical module 200, so that theoptical network terminal 100 establishes a bidirectional electrical signal connection with theoptical module 200; thenetwork cable interface 104 is configured to access thenetwork cable 103 such that theoptical network terminal 100 establishes a bi-directional electrical signal connection with thenetwork cable 103. Theoptical module 200 is connected to thenetwork cable 103 via theoptical network terminal 100. For example, theoptical network terminal 100 transmits an electrical signal from theoptical module 200 to thenetwork cable 103, and transmits a signal from thenetwork cable 103 to theoptical module 200, so that theoptical network terminal 100 can monitor the operation of theoptical module 200 as an upper computer of theoptical module 200. The upper computer of theOptical module 200 may include an Optical Line Terminal (OLT) and the like in addition to theOptical network Terminal 100.

Theremote server 1000 establishes a bidirectional signal transmission channel with the localinformation processing device 2000 through theoptical fiber 101, theoptical module 200, theoptical network terminal 100, and thenetwork cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of theoptical module 100 related to theoptical module 200 in order to clearly show a connection relationship between theoptical module 200 and theoptical network terminal 100. As shown in fig. 2, theoptical network terminal 100 further includes aPCB circuit board 105 disposed in the housing, acage 106 disposed on a surface of thePCB circuit board 105, and an electrical connector disposed inside thecage 106. The electrical connector is configured to access an electrical port of theoptical module 200; theheat sink 107 has a projection such as a fin that increases a heat radiation area.

Theoptical module 200 is inserted into acage 106 of theoptical network terminal 100, thecage 106 holds theoptical module 200, and heat generated by theoptical module 200 is conducted to thecage 106 and then diffused by aheat sink 107. After theoptical module 200 is inserted into thecage 106, an electrical port of theoptical module 200 is connected to an electrical connector inside thecage 106, and thus theoptical module 200 establishes a bidirectional electrical signal connection with theoptical network terminal 100. Further, the optical port of theoptical module 200 is connected to theoptical fiber 101, and theoptical module 200 establishes bidirectional electrical signal connection with theoptical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, theoptical module 200 includes a housing, acircuit board 300 disposed in the housing, and an optical transceiver;

the shell comprises anupper shell 201 and alower shell 202, wherein theupper shell 201 is covered on thelower shell 202 to form the shell with twoopenings 204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, thelower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; theupper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover theupper housing 201 on thelower housing 202.

The direction of the connecting line of the twoopenings 204 and 205 may be the same as the length direction of theoptical module 200, or may not be the same as the length direction of theoptical module 200. For example, theopening 204 is located at an end (right end in fig. 3) of theoptical module 200, and theopening 205 is also located at an end (left end in fig. 3) of theoptical module 200. Alternatively, theopening 204 is located at an end of theoptical module 200, and theopening 205 is located at a side of theoptical module 200. Wherein, theopening 204 is an electrical port, and the gold finger of thecircuit board 300 extends out of theelectrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); theopening 205 is an optical port configured to receive the externaloptical fiber 101, so that theoptical fiber 101 is connected to an optical transceiver inside theoptical module 200.

Theupper shell 201 and thelower shell 202 are combined in an assembly mode, so that devices such as thecircuit board 300 and the optical transceiver can be conveniently installed in the shells, and theupper shell 201 and thelower shell 202 can form packaging protection for the devices. In addition, when the devices such as thecircuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, theupper housing 201 and thelower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, theoptical module 200 further includes an unlockingcomponent 203 located on an outer wall of a housing thereof, and the unlockingcomponent 203 is configured to realize a fixed connection between theoptical module 200 and an upper computer or release the fixed connection between theoptical module 200 and the upper computer.

Illustratively, the unlockingmembers 203 are located on the outer walls of the two lower side plates of thelower housing 202, and include snap-fit members that mate with a cage of an upper computer (e.g., thecage 106 of the optical network terminal 100). When theoptical module 200 is inserted into the cage of the upper computer, theoptical module 200 is fixed in the cage of the upper computer by the engaging member of the unlockingmember 203; when the unlockingmember 203 is pulled, the engaging member of the unlockingmember 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between theoptical module 200 and the upper computer is released, and theoptical module 200 can be drawn out from the cage of the upper computer.

Thecircuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a Transimpedance Amplifier (TIA), a Clock and Data Recovery (CDR), a power management chip, and a Digital Signal Processing (DSP) chip.

Thecircuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

Thecircuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. Thecircuit board 300 is inserted into thecage 106 and electrically connected to the electrical connector in thecage 106 by gold fingers. The gold fingers may be disposed on only one side surface (e.g., the upper surface shown in fig. 4) of thecircuit board 300, or may be disposed on both upper and lower surfaces of thecircuit board 300, so as to adapt to the situation with a large demand for the number of pins. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

Fig. 5 is a schematic view illustrating an assembly of a circuit board, an optical transceiver sub-assembly, an optical fiber ribbon, and an optical fiber connector in an optical module according to an embodiment of the present application, and fig. 6 is a side view illustrating an assembly of a circuit board, an optical transceiver sub-assembly, and an optical fiber ribbon in an optical module according to an embodiment of the present application. As shown in fig. 5 and 6, the optical module provided in the embodiment of the present application includes acircuit board 300, asub circuit board 310, asignal processing chip 320, a first opticaltransceiver sub module 400, a second opticaltransceiver sub module 500, a plurality of optical fiber ribbons, and anoptical fiber connector 600, wherein thesub circuit board 310 is attached to thecircuit board 300, thesignal processing chip 320 is disposed on thesub circuit board 310, that is, a lower surface of thesub circuit board 310 is attached to an upper surface of thecircuit board 300, and thesignal processing chip 320 is disposed on the upper surface of thesub circuit board 310.

Thesub circuit board 310 is provided with a connection hole penetrating through thesub circuit board 310 such that a portion of the surface of thecircuit board 300 is exposed through the connection hole, and thus the first opticalsub-transceiver module 400 may be disposed on the upper surface of thecircuit board 300 through the connection hole.

Specifically, the firstoptical sub-assembly 400 is disposed on thecircuit board 300, the firstoptical sub-assembly 400 is embedded in the connecting hole of thesub-circuit board 310, and one side of the firstoptical sub-assembly 400 is attached to the upper surface of thecircuit board 300. After the first opticalsub-transceiver module 400 is mounted on thecircuit board 300 through the connection hole, signal connection between the first opticalsub-transceiver module 400 and thesignal processing chip 320 is realized through a high-speed differential signal line arranged on thesub-circuit board 310, so that a signal output by thesignal processing chip 320 is transmitted to the optical transmitting component of the first opticalsub-transceiver module 400, and the optical transmitting component is driven to transmit an optical signal; and, transmitting the electrical signal converted by the optical receiving element of the firstoptical transceiver sub-assembly 400 to thesignal processing chip 320 for subsequent processing.

The second opticalsub-transceiver module 500 and the first opticalsub-transceiver module 400 are disposed side by side on thecircuit board 300 along the left-right direction, and are in signal connection with thesignal processing chip 320 through high-speed differential signal lines disposed on thesub-circuit board 310, and the high-speed differential signal lines connected to the second opticalsub-transceiver module 500 are located at one side of the connection holes. That is, thesignal processing chip 320 is connected to one end of the high-speed differential signal line on thesecondary circuit board 310, the other end of the high-speed differential signal line is connected to the secondoptical transceiver sub-module 500 through a wire bonding, and the high-speed differential signal line on thesecondary circuit board 310 is located at one side of the connection hole to avoid the firstoptical transceiver sub-module 400 embedded in the connection hole. Thus, the signal output by thesignal processing chip 320 can be transmitted to the light emitting element of the secondoptical transceiver sub-module 500 through the high-speed differential signal line on thesub-circuit board 310, so as to drive the light emitting element to emit a light signal; and, transmitting the electrical signal converted by the optical receiving element of the secondoptical transceiver sub-module 500 to thesignal processing chip 320 through the high-speed differential signal line on thesub-circuit board 310 for subsequent processing.

The plurality of optical fiber ribbons include two transmitting optical fiber ribbons and two receiving optical fiber ribbons, and the transmitting component of the firstoptical transceiver sub-module 400 is connected to one end of the transmitting optical fiber ribbon to transmit the optical signal transmitted by the firstoptical transceiver sub-module 400; the receiving module of thefirst rosa 400 is connected to one end of a receiving optical fiber ribbon to transmit external optical signals to the receiving module. The transmitting component of the secondoptical transceiver sub-module 500 is connected with one end of another transmitting optical fiber ribbon to transmit the optical signal transmitted by the secondoptical transceiver sub-module 500; the receiving module of thesecond rosa 500 is connected to one end of another receiving optical fiber ribbon to transmit an external optical signal to the receiving module.

The two transmitting optical fiber ribbons and the two receiving optical fiber ribbons are connected with theoptical fiber connector 600, so that optical signals carried by the transmitting optical fiber ribbons are transmitted to external optical fibers through theoptical fiber connector 600, and light is transmitted; and transmitting the optical signal transmitted by the external optical fiber to the receiving optical fiber ribbon through theoptical fiber connector 600, thereby realizing the optical reception.

Fig. 7 is an exploded schematic view of a circuit board, a sub-circuit board, and an optical transceiver sub-module in an optical module according to an embodiment of the present disclosure. As shown in fig. 7, the length dimension of thesub circuit board 310 in the left-right direction is smaller than the length dimension of thecircuit board 300 in the left-right direction, and thesub circuit board 310 is close to one end of thecircuit board 300 where the gold finger is disposed. The lower surface of thesub circuit board 310 is provided with a pad and a solder ball, thecircuit board 300 is also provided with a pad at a position corresponding to thesub circuit board 310, and the pad and the solder ball of thesub circuit board 310 are bonded with the pad on thecircuit board 300 through soldering tin, so that thesub circuit board 310 is bonded on thecircuit board 300.

Thecircuit board 300 is further provided with a first mounting area and a second mounting area, the first mounting area and the second mounting area are arranged side by side along the left-right direction, the first mounting area is close to the golden finger on thecircuit board 300, and the second mounting area is located on the left side of the first mounting area. Thefirst rosa 400 is disposed on the first mounting region through the connection hole, and thesecond rosa 500 is disposed on the second mounting region, so that thefirst rosa 400 and thesecond rosa 500 are attached to thecircuit board 300.

Fig. 8 is a schematic structural diagram of a secondary circuit board in an optical module according to an embodiment of the present disclosure, and fig. 9 is an assembly schematic diagram of the secondary circuit board and a first optical transceiver sub-module in the optical module according to the embodiment of the present disclosure. As shown in fig. 8 and 9, thesecondary circuit board 310 is provided with aconnection hole 330, and theconnection hole 330 penetrates through thesecondary circuit board 310, so that after thesecondary circuit board 310 is attached to thecircuit board 300, the first mounting region on thecircuit board 300 is exposed through theconnection hole 330, and the first optical transceiversecondary module 400 is mounted on the first mounting region through theconnection hole 330.

In some embodiments, the firstoptical transceiver sub-assembly 400 includes a firstoptical transmitter module 410 and a first siliconoptical chip 420, the firstoptical transmitter module 410 and the first siliconoptical chip 420 are both embedded in theconnection hole 330 of thesub-circuit board 310, the first siliconoptical chip 420 is close to the gold finger on thecircuit board 300, the firstoptical transmitter module 410 is located at the left side of the first siliconoptical chip 420, and the optical beam emitted by the firstoptical transmitter module 410 is transmitted into the first siliconoptical chip 420 to perform electro-optical modulation through the first siliconoptical chip 420.

The right side of the first siliconoptical chip 420 is provided with a signal pad, a first high-speed signal line is arranged between the right side edge of the connectinghole 330 and thesignal processing chip 320, the right end of the first high-speed signal line is connected with thesignal processing chip 320, and the left end of the first high-speed signal line is connected with the signal pad on the first siliconoptical chip 420 through a routing wire, so that the signal connection between thesignal processing chip 320 and the first siliconoptical chip 420 is realized through the first high-speed signal line on thesecondary circuit board 310.

In some embodiments, the second opticalsub-transceiver module 500 includes a second light emitting element and a second silicon optical chip, the second light emitting element is located on the left side, the second silicon optical chip is located on the right side, and the light beam emitted by the second light emitting element is transmitted into the second silicon optical chip and is electro-optically modulated by the second silicon optical chip.

The right side of the second silicon optical chip is provided with a signal pad, a second high-speed signal line is arranged between the left side edge of thesecondary circuit board 310 and thesignal processing chip 320, the second high-speed signal line is positioned at one side of the connectinghole 330, the right end of the second high-speed signal line is connected with thesignal processing chip 320, the left end of the second high-speed signal line is connected with the signal pad on the second silicon optical chip through a routing wire, and the signal connection between thesignal processing chip 320 and the second silicon optical chip is realized through the second high-speed signal line on thesecondary circuit board 310.

Fig. 10 is a partially exploded schematic view of a circuit board, a sub-circuit board, and an optical transceiver sub-module in an optical module according to an embodiment of the present disclosure. As shown in fig. 10, when the optical transceiver sub-module is mounted, thesecondary circuit board 310 may be firstly attached to thecircuit board 300, and the first mounting region on thecircuit board 300 is exposed through theconnection hole 330 on thesecondary circuit board 310; then thesignal processing chip 320 is disposed on thesub circuit board 310; then embedding the firstoptical transceiver sub-assembly 400 in theconnection hole 330, so that the firstoptical transceiver sub-assembly 400 is mounted on the first mounting region; the second opticalsub-transceiver module 500 is then mounted on the second mounting region of thecircuit board 300.

After the first opticalsub-transceiver module 400 and the second opticalsub-transceiver module 500 are mounted on thecircuit board 300, the first opticalsub-transceiver module 400 and the second opticalsub-transceiver module 500 need to be electrically connected to ensure the photoelectric conversion of the first opticalsub-transceiver module 400 and the second opticalsub-transceiver module 500.

Fig. 11 is a partially exploded schematic view of an optical transceiver sub-assembly in an optical module according to an embodiment of the present application, and fig. 12 is a front view of the optical transceiver sub-assembly in the optical module according to the embodiment of the present application. As shown in fig. 11 and 12, the first siliconoptical chip 420 and the firstlight emitting module 410 are disposed on theheat sink 430, the firstlight emitting module 410 includes an emittinghousing 4110, alaser 4120, acollimating lens 4130, anoptical isolator 4140 and a focusinglens 4150, thelaser 4120, thecollimating lens 4130, theoptical isolator 4140 and the focusinglens 4150 are disposed on theheat sink 430, the emittinghousing 4110 is covered on theheat sink 430, and thelaser 4120, thecollimating lens 4130, theoptical isolator 4140 and the focusinglens 4150 are disposed in a sealed cavity formed between the emittinghousing 4110 and theheat sink 430.

In some embodiments, after the firstsilicon photonics chip 420 is placed on theheat sink 430, heat generated by the firstsilicon photonics chip 420 is transferred to the high thermalconductivity heat sink 430, ensuring heat dissipation performance of the firstsilicon photonics chip 420.

The light beam emitted by thelaser 4120 is converted into a collimated light beam by thecollimating lens 4130, the collimated light beam directly passes through theoptical isolator 4140, the collimated light beam passing through theoptical isolator 4140 is converted into a converged light beam by the converginglens 4150, the converged light beam is incident on the firstsilicon photonic chip 420, and the light beam is subjected to electro-optical modulation in the firstsilicon photonic chip 420.

In some embodiments, thelaser 4120, thecollimating lens 4130, theoptical isolator 4140 and the converginglens 4150 are sequentially disposed on theheat sink 430 along a horizontal direction, the firstsilicon photo chip 420 is disposed obliquely, and a central axis of the firstsilicon photo chip 420 and a light emitting direction of the firstlight emitting assembly 410 are disposed at a predetermined angle, so that when a light beam emitted from the converginglens 4150 is reflected at an input end surface of the firstsilicon photo chip 420, a reflected light beam does not return to thelaser 4120 along a primary path, and when the reflected light beam is emitted to theoptical isolator 4140, the reflected light beam is isolated by theoptical isolator 4140, so that the reflected light beam does not return to thelaser 4120, thereby preventing the reflected light beam from affecting a light emitting performance of thelaser 4120.

In some embodiments, the angle between the central axis of the firstsilicon photonics chip 420 and the light exit direction of the firstlight emitting assembly 410 is 8 degrees.

In some embodiments, the firstlight emitting module 410 further comprises anoptical glass block 4160, theoptical glass block 4160 is located between the converginglens 4150 and the input end surface of the firstsilicon photo chip 420, the output end of theoptical glass block 4160 is in contact with the input end surface of the firstsilicon photo chip 420, and theoptical glass block 4160 is a wedge-shaped block for changing the beam exit angle to ensure that the horizontal beam emitted by thelaser 4120 smoothly enters the firstsilicon photo chip 420 which is obliquely arranged.

In some embodiments, the firstsilicon photo chip 420 may include one emitting light port and two receiving light ports, and theoptical glass block 4160 is disposed corresponding to one receiving light port of the firstsilicon photo chip 420, so as to emit the light beam with the changed light path angle into the firstsilicon photo chip 420 through the receiving light port.

The transmitting optical port of the first siliconoptical chip 420 is connected to the transmittingoptical fiber ribbon 700 through the transmittingend 440, and the first siliconoptical chip 420 transmits the processed optical signal to the transmittingoptical fiber ribbon 700 through the transmitting optical port, so that the optical signal is transmitted to the external optical fiber through the transmittingoptical fiber ribbon 700 and theoptical fiber connector 600, thereby implementing the transmission of light.

The other receiving optical port of the first siliconoptical chip 420 is connected to the receivingoptical fiber ribbon 800 through the receivingend 450, the external optical signal is transmitted into the first siliconoptical chip 420 through the receivingoptical fiber ribbon 800, the first siliconoptical chip 420 converts the external optical signal into an electrical signal, the electrical signal is transmitted to thesignal processing chip 320 through the routing and the high-speed differential signal line on thesecondary circuit board 310, and is transmitted to thecircuit board 300 after being processed by thesignal processing chip 320.

In some embodiments, the transmitting optical port and the receiving optical port of the first siliconoptical chip 420 are located on the same end surface, that is, the transmitting end and the receiving end connected to the first siliconoptical chip 420 are both located on the left side of the first siliconoptical chip 420, so that theoptical fiber ribbon 700 and the receivingoptical fiber ribbon 800 can be directly connected to theoptical fiber connector 600 and the first siliconoptical chip 420, the optical fiber ribbon is prevented from being wound, and power consumption is reduced.

Theheat sink 430 of the first opticalsub-transceiver module 400 is embedded in theconnection hole 330, the lower surface of theheat sink 430 is attached to the first mounting area of thecircuit board 300, and the first siliconoptical chip 420 is attached to the upper surface of theheat sink 430. After the first siliconoptical chip 420 and theheat sink 430 are embedded in theconnection hole 330, since theheat sink 430 raises the first siliconoptical chip 420, the bonding pad on the upper surface of the first siliconoptical chip 420 and thesecondary circuit board 310 can be located on the same horizontal plane. Specifically, the first siliconoptical chip 420 is mounted on theheat sink 430 by silver paste, so as to ensure the heat dissipation performance of the first siliconoptical chip 420.

Fig. 13 is a schematic structural diagram of a transmitting housing in an optical module according to an embodiment of the present disclosure, and fig. 14 is a schematic partial exploded view of a secondary circuit board and an optical transceiver sub-module in an optical module according to an embodiment of the present disclosure. As shown in fig. 13 and 14, a signal pad is disposed at the left edge of theconnection hole 330 on thesecondary circuit board 310, and the signal pad is in signal connection with thelaser 4120 through wire bonding to drive thelaser 4120 to emit a laser beam. The laser beam emitted by thelaser 4120 is transmitted into thefirst silicon microchip 420 through thecollimating lens 4130, theoptical isolator 4140, the converginglens 4150 and theoptical glass block 4160 in sequence.

Since thelaser 4120 is connected to the signal pad on thesub-circuit board 310 by wire bonding, in order to cover the wire bonding, theend 4170 of the emittinghousing 4110 facing away from the firstsilicon photonic chip 420 protrudes out of the connectinghole 330, and theend 4170 protruding out of the connectinghole 330 contacts with the upper surface of thesub-circuit board 310, so that the signal pad and the wire bonding are covered in the emittinghousing 4110 by theend 4170, so that theprotruding end 4170 of the emittinghousing 4110 covers the wire bonding for protection, and simultaneously, the wire bonding is prevented from generating EMI radiation to the outside.

In some embodiments, after thelaser 4120, thecollimating lens 4130, theoptical isolator 4140, the condensinglens 4150, theoptical glass block 4160 and the firstsilicon photo chip 420 are fixed on theheat sink 430, the assembledheat sink 430 is mounted to the first mounting region of thecircuit board 300 through theconnection hole 330; then, the signal bonding pad on thesecondary circuit board 310 is connected with thelaser 4120 through routing; theemission housing 4110 is then covered on theheat sink 430 to enclose thelaser 4120,collimating lens 4130,optical isolator 4140, focusinglens 4150,optical glass block 4160, and wire bonds within theemission housing 4110.

In some embodiments, thesecond rosa 500 and thefirst rosa 400 have the same structure, thefirst rosa 400 is mounted to the first mounting area of thecircuit board 300 through theconnection hole 330 of thesecondary circuit board 310, and the electrical connection between thefirst rosa 400 and thesignal processing chip 320 and thecircuit board 300 is realized through wire bonding, high-speed differential signal lines, etc. to drive thefirst rosa 400 to perform photoelectric conversion. Similarly, the secondoptical transceiver sub-assembly 500 is mounted in the second mounting area of thecircuit board 300 and electrically connected to thesub-circuit board 310 by wire bonding, so that the electrical connection between the secondoptical transceiver sub-assembly 500 and thesignal processing chip 320 and thecircuit board 300 is realized.

Specifically, one side of the secondoptical transceiver sub-assembly 500 is adjacent to one end of thesecondary circuit board 310, and the secondoptical transceiver sub-assembly 500 is located at the left side of thesecondary circuit board 310. The secondoptical transceiver sub-module 500 includes a secondlight emitting assembly 510, a second siliconoptical chip 520 and a heat sink, wherein the secondlight emitting assembly 510 and the second siliconoptical chip 520 are both disposed on the heat sink, and the secondlight emitting assembly 510 and the second siliconoptical chip 520 are raised by the heat sink, so that the second siliconoptical chip 520 and thesub-circuit board 310 are located on the same horizontal plane.

The second siliconoptical chip 520 is provided with a high-speed differential signal pad, one end of thesecondary circuit board 310, which faces away from the golden finger, is provided with a high-speed differential signal pad, the high-speed differential signal pad on the second siliconoptical chip 520 is electrically connected with the high-speed differential signal pad on thesecondary circuit board 310 through a routing wire, and the high-speed differential signal pad on thesecondary circuit board 310 is electrically connected with thesignal processing chip 320 through a high-speed differential signal wire on thesecondary circuit board 310, so that the electrical connection between the secondoptical transceiver sub-module 500 and thesignal processing chip 320 is realized.

A second high-speed signal line is arranged between the left edge of thesecondary circuit board 310 and thesignal processing chip 320, the second high-speed signal line is located at one side of the connectinghole 330, one end of the second high-speed signal line is connected with thesignal processing chip 320, and the other end of the second high-speed signal line is connected with the second siliconoptical chip 520 through a routing wire, so that signal transmission between thesignal processing chip 320 and the second siliconoptical chip 520 is realized through the second high-speed signal line on thesecondary circuit board 310.

In some embodiments, the second siliconoptical chip 520 may include one transmitting optical port and two receiving optical ports, the light beam emitted by the secondlight emitting component 510 is emitted to the second siliconoptical chip 520 through the receiving optical ports, and the second siliconoptical chip 520 transmits the processed optical signal to theoptical fiber connector 600 through the transmitting optical fiber ribbon, so as to achieve the emission of light; and, the external optical signal is transmitted to the second siliconoptical chip 520 through theoptical fiber connector 600 and the receiving optical fiber ribbon, so that the optical reception is realized.

Because the firstoptical transceiver sub-module 400 is located on the right side of the secondoptical transceiver sub-module 500, the transmittingoptical fiber ribbon 700 and the receivingoptical fiber ribbon 800 connected to the firstoptical transceiver sub-module 400 are relatively long, and the transmittingoptical fiber ribbon 700 and the receivingoptical fiber ribbon 800 need to be fixed in order to avoid the messy arrangement of the transmittingoptical fiber ribbon 700 and the receivingoptical fiber ribbon 800.

Fig. 15 is a schematic structural diagram of a fixing frame in an optical module provided in the embodiment of the present application, and fig. 16 is a schematic partial structural diagram of a circuit board, a first optical subassembly, a second optical subassembly, and an optical fiber ribbon in the optical module provided in the embodiment of the present application. As shown in fig. 15 and 16, the optical module according to the embodiment of the present application further includes a fixingframe 900, where the fixingframe 900 is disposed on thecircuit board 300, and the transmittingoptical fiber ribbon 700 and the receivingoptical fiber ribbon 800 connected to the firstoptical transceiver sub-module 400 are fixed on thecircuit board 300 through the fixingframe 900.

Specifically, the fixingframe 900 includes afirst fixing plate 910, asecond fixing plate 920 and athird fixing plate 930, two ends of thesecond fixing plate 920 are respectively connected to thefirst fixing plate 910 and thethird fixing plate 930, thefirst fixing plate 910 and thethird fixing plate 930 are disposed opposite to each other, so that thefirst fixing plate 910, thesecond fixing plate 920 and thethird fixing plate 930 form a U-shaped fixing frame.

Thefirst fixing plate 910 and thethird fixing plate 930 are located at the periphery of thesecond rosa 500, and thesecond fixing plate 920 is located above the second siliconoptical chip 520, so that thesecond rosa 500 is embedded in the fixingframe 900.

In some embodiments, the thickness of thesecond fixing plate 920 in the vertical direction is smaller than the thickness of thefirst fixing plate 910 and thethird fixing plate 930 in the vertical direction, so that thesecond fixing plate 920 covers thesecond silicon microchip 520 when thefirst fixing plate 910 and thethird fixing plate 930 are fixed on thecircuit board 300.

The right side of the second siliconoptical chip 520 is provided with a high-speed differential signal pad, the high-speed differential signal pad is connected with the left side of thesecondary circuit board 310 through a routing, and thesecond fixing plate 920 covering the second siliconoptical chip 520 can cover the high-speed differential signal pad and the routing so as to protect the routing connecting the second siliconoptical chip 520 and thesecondary circuit board 310.

In some embodiments, a throughhole 940 may be formed in thesecond fixing plate 920, and the throughhole 940 penetrates through thesecond fixing plate 920. After thesecond fixing plate 920 is disposed on the second siliconoptical chip 520, a portion of the second siliconoptical chip 520 can be exposed through the throughhole 940, so as to be conveniently connected to the second siliconoptical chip 520 through wire bonding.

After thefixing frame 900 is fixed on thecircuit board 300, the transmittingoptical fiber ribbon 700 connected to the firstoptical transceiver sub-module 400 is fixed on thethird fixing plate 930 in a clamping manner, and the receivingoptical fiber ribbon 800 connected to the firstoptical transceiver sub-module 400 is fixed on thefirst fixing plate 910 in a clamping manner, so that the transmittingoptical fiber ribbon 700 and the receivingoptical fiber ribbon 800 are fixed on thecircuit board 300.

In some embodiments, the secondoptical transceiver sub-module 500 further includes an emission housing and a second optical transmitter module, the emission housing covers the second optical transmitter module, and the second optical transceiver module includes a laser, a collimating lens, an optical isolator, a converging lens and an optical glass block. A signal bonding pad is arranged on thecircuit board 300 and close to the second light emitting assembly, and the signal bonding pad is in signal connection with the second light emitting assembly through a routing wire; one end of the emission shell, which is back to the second siliconoptical chip 520, protrudes, and the protruding end covers the signal pad and the routing to protect the routing connected to the second siliconoptical chip 520.

Thesecond fixing plate 920 is provided with a protrusion toward one end of the transmitting case, and the protrusion may contact with one end of the transmitting case, so that the transmitting case may be limited by the protrusion.

After the first and second opticalsub-transceiver modules 400 and 500 are disposed on thecircuit board 300, thesignal processing chip 320 is required to transmit the high-frequency signal from thecircuit board 300 to the first and second opticalsub-transceiver modules 400 and 500, so that the first and second opticalsub-transceiver modules 400 and 500 work normally.

Fig. 17 is a schematic diagram illustrating a separation of a secondary circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure, and fig. 18 is a cross-sectional view illustrating signal connections of a first optical sub-transceiver module and a second optical sub-transceiver module in the optical module according to the embodiment of the present disclosure. As shown in fig. 17 and 18, thesignal processing chip 320 is disposed on thesub circuit board 310, the signal transmitted by thegold finger 340 on thecircuit board 300 is transmitted to thesignal processing chip 320 through thesub circuit board 310, and thesignal processing chip 320 transmits the signal to the first opticalsub transceiver module 400 through the high frequency signal line to drive the first opticalsub transceiver module 400 to transmit and receive the optical signal.

Specifically, BGA (Ball Grid Array Package) solder balls are disposed on the back surface (the side facing the circuit board 300) of thesignal processing chip 320, and the BGA solder balls aresignal solder balls 3210, and when thesignal processing chip 320 is disposed on thesecondary circuit board 310, thesignal solder balls 3210 on thesignal processing chip 320 are connected to the surface of thesecondary circuit board 310, so as to electrically connect thesignal processing chip 320 and thesecondary circuit board 310.

Thesignal processing chip 320 is further provided with a groundingsolder ball 3220, the groundingsolder ball 3220 is a grounding property solder ball, the groundingsolder ball 3220 is disposed on the periphery of thesignal solder ball 3210, that is, a circle of groundingsolder balls 3220 is disposed around thesignal solder ball 3210, and a signal ground backflow path is increased by the groundingsolder ball 3220, so as to prevent external interference of the high-speed signal line.

In some embodiments, signal solder balls are also disposed on the side of thesecondary circuit board 310 facing thecircuit board 300, and when thesecondary circuit board 310 is disposed on thecircuit board 300, the signal solder balls on thesecondary circuit board 310 are connected to the surface of thecircuit board 300, so as to electrically connect thesecondary circuit board 310 to thecircuit board 300.

Thesecondary circuit board 310 is connected with the upper surface of thecircuit board 300 through the signal solder balls on the back surface of thesecondary circuit board 310, thesignal processing chip 320 is connected with the upper surface of thesecondary circuit board 310 through thesignal solder balls 3210 on the back surface of thesecondary circuit board 310, the high-speeddifferential signal line 301 is arranged inside thesecondary circuit board 310, one end of the high-speeddifferential signal line 301 is connected with thesignal solder balls 3210 on the back surface of thesignal processing chip 320, the other end of the high-speeddifferential signal line 301 is connected with the bonding pad on thecircuit board 300, so that the data signals on thecircuit board 300 are transmitted to thesignal processing chip 320 through the high-speeddifferential signal line 301, and the signal transmission between thecircuit board 300 and thesignal processing chip 320 is realized.

One end of the high-speed signal line disposed on the surface of thecircuit board 300 is in signal connection with thegold finger 340, and the other end is in signal connection with the high-speed differential signal line on the back of thesecondary circuit board 310, that is, one end of the high-speeddifferential signal line 301 in thesecondary circuit board 310 is in signal connection with the high-speed signal line on thecircuit board 300, and the other end is in signal connection with thesignal processing chip 320, so as to transmit the data signal on thecircuit board 300 to thesignal processing chip 320.

In some embodiments, thesecondary circuit board 310 is further provided with aground signal line 302 inside, one end of theground signal line 302 is connected to theground solder ball 3220 on the back side of thesignal processing chip 320, and the other end of theground signal line 302 is connected to the ground pad on thecircuit board 300, so as to implement ground connection of thesignal processing chip 320 through theground signal line 302.

In some embodiments, theground signal lines 302 in thesecondary circuit board 310 are located outside the high-speeddifferential signal lines 301, i.e., theground signal lines 302 are disposed on thesecondary circuit board 310 at positions corresponding to the left and right sides of thesignal processing chip 320, and the high-speeddifferential signal lines 301 are disposed between theground signal lines 302 on both sides. In this way, theground signal line 302 and the high-speeddifferential signal line 301 form a return path, and electromagnetic radiation from the high-speeddifferential signal line 301 to the outside and interference from the outside to the high-speeddifferential signal line 301 can be reduced by theground signal line 302.

After thesignal processing chip 320 is in signal connection with thecircuit board 300, thesignal processing chip 320 is in signal connection with the first siliconoptical chip 420 and the second siliconoptical chip 520 through thesecondary circuit board 300, so as to drive the first siliconoptical chip 420 and the second siliconoptical chip 520 to perform light emitting and receiving processing.

In some embodiments, when thesignal processing chip 320 is connected to thecircuit board 300, in addition to thegrounding solder balls 3220 disposed on the side surface of thesignal processing chip 320 and thegrounding signal line 302 disposed in thesecondary circuit board 310, a ground signal hole may be additionally formed in thesecondary circuit board 310, and a signal ground return path may be additionally formed through the ground signal hole, so as to prevent external interference of the high-speed signal line.

Fig. 19 is another exploded schematic view of a secondary circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure, and fig. 20 is another signal connection cross-sectional view of a circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure. As shown in fig. 19 and 20, thesub circuit board 310 is provided with a plurality of ground signal holes 3110, theground signal holes 3110 penetrate the upper and lower surfaces of thesub circuit board 310, one end of eachground signal hole 3110 is connected to a ground solder ball on the back surface of thesignal processing chip 320, the other end is connected to a ground pad on the front surface of thecircuit board 300, and the ground connection between thesignal processing chip 320 and thecircuit board 300 is realized through the ground signal holes 3110 on thesub circuit board 310.

In some embodiments, thesignal processing chip 320 is provided with a plurality of signal solder balls on the back surface thereof, and when thesignal processing chip 320 is mounted on thesecondary circuit board 310, the signal solder balls on the back surface of thesignal processing chip 320 are connected to thesecondary circuit board 310, and then thesecondary circuit board 310 is mounted on thecircuit board 300. Thesecondary circuit board 310 is provided therein with a high-speeddifferential signal line 301, one end of the high-speeddifferential signal line 301 is connected to the signal solder ball on the back surface of thesignal processing chip 320, and the other end is connected to the signal pad on the front surface of thecircuit board 300, so as to realize signal transmission between thesignal processing chip 320 and thecircuit board 300 through the high-speeddifferential signal line 301.

Theground signal hole 3110 is disposed outside the high-speeddifferential signal line 301 in thesub circuit board 310, that is, theground signal hole 3110 is disposed on both left and right sides of thesub circuit board 310 corresponding to thesignal processing chip 320, thesub circuit board 310 is connected to thecircuit board 300 through the high-speeddifferential signal line 301 therein, and the high-speeddifferential signal line 301 is disposed between two rows of ground signal holes 3110, so that theground signal hole 3110 is close to the high-speeddifferential signal line 301 in thesub circuit board 310, so that theground signal hole 3110 and the high-speeddifferential signal line 301 form a reflow.

After thecircuit board 300 and thesignal processing chip 320 are connected through the high-speed differential signal line, the ground signal line, or the ground signal hole, thesignal processing chip 320 is in signal connection with the first siliconoptical chip 420 and the second siliconoptical chip 520 through the high-speed signal line arranged on the front surface of thesecondary circuit board 310, so as to drive the first siliconoptical chip 420 and the second siliconoptical chip 520 to process the emitted light signal and the received light signal.

Fig. 21 is a schematic diagram of signal connection between a silicon optical chip and a signal processing chip in an optical module according to an embodiment of the present application. As shown in fig. 21, a high frequency signal line is disposed on the surface of thesecondary circuit board 310, one end of the high frequency signal line is in signal connection with thesignal processing chip 320, and the other end of the high frequency signal line is disposed at the edge of theconnection hole 330, and the first siliconoptical chip 420 is in signal connection with the high frequency signal line at the edge of theconnection hole 330 through a wire bonding, so as to transmit the data signal output by thesignal processing chip 320 to the first siliconoptical chip 420.

In some embodiments, the firstsilicon photo chip 420 is provided with a transmitting pad group, a receiving pad group and a power signal pad P on a side facing thesignal processing chip 320, and the power signal pad P is disposed between the transmitting pad group and the receiving pad group to reduce interference of the transmitting signal to the receiving signal.

The transmission pad group comprises a transmission signal pad S and a first grounding signal pad G, and the first grounding signal pad G is arranged on the outer side of the transmission signal pad S. An emission pad corresponding to the emission signal pad S and a first grounding pad corresponding to the first grounding signal pad G are arranged at the edge of thesecondary circuit board 310 close to the connectinghole 330, the emission signal pad S is in signal connection with the emission pad on thesecondary circuit board 310 through two routing wires, and the emission pad on thesecondary circuit board 310 is in signal connection with thesignal processing chip 320 through a high-frequency signal wire; the first ground signal pad G is in signal connection with the first ground pad on thesecondary circuit board 310 through three wires to form a backflow with the wires connecting the transmission signal pad S and the transmission pad.

Similarly, the receiving pad group includes a receiving signal pad S and a second ground signal pad G disposed outside the receiving signal pad S. A receiving pad corresponding to the receiving signal pad S and a second grounding pad corresponding to the second grounding signal pad G are arranged at the edge of thesecondary circuit board 310 close to the connectinghole 330, the receiving signal pad S is in signal connection with the receiving pad on thesecondary circuit board 310 through two routing wires, and the receiving pad on thesecondary circuit board 310 is in signal connection with thesignal processing chip 320 through a high-frequency signal wire; the second ground signal pad G is in signal connection with the second ground pad on thesecondary circuit board 310 through three wires to form a backflow with the wires connecting the signal receiving pad S and the receiving pad.

In some embodiments, at least three power signal pads P are disposed on the first siliconoptical chip 420, and the at least three power signal pads P are disposed side by side along a vertical direction; at least threepower pads 350 are disposed on the edge of thesub circuit board 310 near theconnection hole 330, and the at least threepower pads 350 are disposed side by side in the left-right direction. That is, at least three parallel power signal pads P are disposed on thefirst silicon microchip 420, and at least threevertical power pads 350 are disposed on thesecondary circuit board 310.

The middle one of the three power signal pads P on the first siliconoptical chip 420 is connected with thenearest power pad 350 on thesecondary circuit board 310 through at least two routing signals, the power signal pads P on the two sides of the first siliconoptical chip 420 are respectively and sequentially routed to thepower pads 350 on thesecondary circuit board 310, and the routing number is also two or more. That is, the middle power signal pad P is in signal connection with theleft power pad 350 through 2 wires, the lower power signal pad P is in signal connection with themiddle power pad 350 through 2 wires, and the upper power signal pad P is in signal connection with theright power pad 350 through 2 wires.

Specifically, a first power signal pad P, a second power signal pad P and a third power signal pad P are arranged on the first siliconoptical chip 420 side by side in the up-down direction, and the second power signal pad P is located between the first power signal pad P and the third power signal pad P; thesub circuit board 310 is provided with a first power supply pad, a second power supply pad and a third power supply pad which are arranged side by side in the left-right direction, and the second power supply pad is located between the first power supply pad and the third power supply pad.

The first power signal bonding pad P is connected with the third power bonding pad through a routing, the second power signal bonding pad P is connected with the first power bonding pad through a routing, and the third power signal bonding pad P is connected with the second power bonding pad through a routing.

Fig. 22 is a schematic signal connection diagram of a first silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present application. As shown in fig. 22, three power signal pads P on thefirst silicon microchip 420 are disposed between the first ground signal pad G of the transmission pad group and the second ground signal pad G of the reception pad group, threepower pads 350 on thesub-circuit board 310 are disposed between the first ground pad and the second ground pad, and the sizes of the first ground pad and the second ground pad in the left-right direction are larger than the sizes of the power pads in the left-right direction.

In some embodiments, the threepower pads 350 on thesecondary circuit board 310 are arranged in a left-middle-right sequence, but not in a horizontal sequence, so that the bonding wires are spatially staggered, and form a staggered return path with the ground on both sides to prevent signal crosstalk between the transmitting signal and the receiving signal.

The first siliconoptical chip 420 is electrically connected with thegolden finger 340 on thecircuit board 300 through a power signal pad, a routing, apower pad 350 and a power line, so that an electrical signal of thegolden finger 340 is routed to thesecondary circuit board 310 through the power line, then is routed to the edge of the connectinghole 330 through the inner layer and the surface layer of thesecondary circuit board 310, and then is connected with the power signal pad P on thesecondary circuit board 310 and the power signal pad P of the first siliconoptical chip 420 through the routing to supply power to the first siliconoptical chip 420, so that the first siliconoptical chip 420 receives the laser beam.

The first siliconoptical chip 420 is in signal connection with thesignal processing chip 320 on thesecondary circuit board 310 through the emission pad group, the reception pad group, the routing, the emission pad, the reception pad, the high-speed signal line, so that signals output by thesignal processing chip 320 are transmitted to the first siliconoptical chip 420 through the high-speed signal line, the emission pad, the routing and the emission pad group to provide data signals for the first siliconoptical chip 420, so that the first siliconoptical chip 420 can perform optical modulation on the laser beam according to the data signals, and the modulated optical signals are emitted out through the emissionoptical fiber ribbon 700.

After the external optical signal is transmitted to the first siliconoptical chip 420 through the receivingoptical fiber ribbon 800, the first siliconoptical chip 420 processes the external optical signal, the processed electrical signal is transmitted to thesignal processing chip 320 through the receiving pad group, the routing, the receiving pad, the high-speed signal line, and thesignal processing chip 320 performs subsequent processing on the electrical signal.

Fig. 23 is a schematic diagram of signal connection between a second silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present application. As shown in fig. 23, a side of the secondsilicon photo chip 520 facing thesignal processing chip 320 is provided with a transmitting pad group, a receiving pad group and a power signal pad P, and the power signal pad P is disposed between the transmitting pad group and the receiving pad group to reduce interference of the transmitting signal to the receiving signal.

The transmission pad group comprises a transmission signal pad S and a first grounding signal pad G, and the first grounding signal pad G is arranged on the outer side of the transmission signal pad S. An emission pad corresponding to the emission signal pad S and a first grounding pad corresponding to the first grounding signal pad G are arranged at the left edge of thesecondary circuit board 310, the emission signal pad S is in signal connection with the emission pad on thesecondary circuit board 310 through two routing wires, and the emission pad on thesecondary circuit board 310 is in signal connection with thesignal processing chip 320 through a high-frequency signal wire; the first ground signal pad G is in signal connection with the first ground pad on thesecondary circuit board 310 through three wires to form a backflow with the wires connecting the transmission signal pad S and the transmission pad.

Similarly, the receiving pad group includes a receiving signal pad S and a second ground signal pad G disposed outside the receiving signal pad S. A receiving pad corresponding to the receiving signal pad S and a second grounding pad corresponding to the second grounding signal pad G are arranged at the left edge of thesecondary circuit board 310, the receiving signal pad S is in signal connection with the receiving pad on thesecondary circuit board 310 through two routing wires, and the receiving pad on thesecondary circuit board 310 is in signal connection with thesignal processing chip 320 through a high-frequency signal wire; the second ground signal pad G is in signal connection with the second ground pad on thesecondary circuit board 310 through three wires to form a backflow with the wires connecting the signal receiving pad S and the receiving pad.

In some embodiments, at least three power signal pads P are disposed on thesecond silicon microchip 520, and the at least three power signal pads P are disposed side by side along the vertical direction; at least three power pads are arranged at the left edge of thesecondary circuit board 310 and arranged side by side along the left-right direction. That is, at least three parallel power signal pads P are disposed on thesecond silicon microchip 520, and at least three vertical power pads are disposed on thesecondary circuit board 310.

The power signal pads P on both sides of the second siliconoptical chip 520 are respectively and sequentially wired on the power pads on thesecondary circuit board 310, and the number of the wired lines is also two or more. Namely, the middle power signal pad P is in signal connection with the left power pad through 2 wires, the lower power signal pad P is in signal connection with the middle power pad through 2 wires, and the upper power signal pad P is in signal connection with the right power pad through 2 wires.

Specifically, the second siliconoptical chip 520 is provided with a first power signal pad P, a second power signal pad P and a third power signal pad P which are arranged side by side in the up-down direction, and the second power signal pad P is located between the first power signal pad P and the third power signal pad P; the left side of thesecondary circuit board 310 is provided with a first power supply pad, a second power supply pad and a third power supply pad which are arranged side by side along the left-right direction, and the second power supply pad is positioned between the first power supply pad and the third power supply pad.

The first power signal bonding pad P is connected with the third power bonding pad through a routing, the second power signal bonding pad P is connected with the first power bonding pad through a routing, and the third power signal bonding pad P is connected with the second power bonding pad through a routing.

The three power signal pads P on thesecond silicon microchip 520 are disposed between the first ground signal pad G of the transmission pad group and the second ground signal pad G of the reception pad group, the three power pads on the left side of thesecondary circuit board 310 are disposed between the first ground pad and the second ground pad, and the sizes of the first ground pad and the second ground pad in the left-right direction are larger than the sizes of the power pads in the left-right direction.

In some embodiments, the three power signal pads on thesecondary circuit board 310 are arranged in a left-middle-right sequence, but not in a horizontal arrangement, so that the routing lines are spatially staggered, and form a staggered return path with the ground on both sides, thereby preventing signal crosstalk between the transmitting signal and the receiving signal.

The second siliconoptical chip 520 is electrically connected with thegolden finger 340 on thecircuit board 300 through a power signal pad, a routing, a power pad and a power line, so that the power signal of thegolden finger 340 is routed to thesecondary circuit board 310 through the power line, then is routed to the edge of thesecondary circuit board 310 through the inner layer and the surface layer of thesecondary circuit board 310, and then is connected with the power pad on thesecondary circuit board 310 and the power signal pad P of the second siliconoptical chip 520 through the routing to supply power to the second siliconoptical chip 520, so that the second siliconoptical chip 520 receives an external optical signal.

The second siliconoptical chip 520 is in signal connection with thesignal processing chip 320 on thesecondary circuit board 310 through the emission bonding pad group, the receiving bonding pad group, the routing, the emission bonding pad, the receiving bonding pad and the high-speed signal line, so that signals output by thesignal processing chip 320 are transmitted to the second siliconoptical chip 520 through the high-speed signal line, the emission bonding pad, the routing and the emission bonding pad group to provide data signals for the second siliconoptical chip 520, and thus the second siliconoptical chip 520 can perform optical modulation on the laser beams according to the data signals, and the modulated optical signals are emitted out through the emissionoptical fiber ribbon 700.

After the external optical signal is transmitted to the second siliconoptical chip 520 through the receivingoptical fiber ribbon 800, the second siliconoptical chip 520 processes the external optical signal, the processed electrical signal is transmitted to thesignal processing chip 320 through the receiving pad group, the routing, the receiving pad, the high-speed signal line, and thesignal processing chip 320 performs subsequent processing on the electrical signal.

In some embodiments, after thesignal processing chip 320 implements signal transmission with the first siliconoptical chip 420 and the second siliconoptical chip 520 through the high-speed signal lines, thecircuit board 300 is further required to supply power to the firstoptical transceiver sub-module 400 and the secondoptical transceiver sub-module 500.

Fig. 24 is a schematic power connection diagram of a circuit board, a signal processing chip, and a first optical sub-transceiver module in an optical module according to an embodiment of the present disclosure, and fig. 25 is a cross-sectional power connection diagram of the first optical sub-transceiver module in the optical module according to the embodiment of the present disclosure. As shown in fig. 24 and 25, thesignal solder balls 3210 are disposed on the back surface of thesignal processing chip 320, and after thesignal processing chip 320 is disposed on thesecondary circuit board 310 through thesignal solder balls 3210, the electrical signal enters thecircuit board 300 from thegold finger 340, and then is connected to thesecondary circuit board 310 through the signal solder balls between thecircuit board 300 and thesecondary circuit board 310, so as to transmit power to thesecondary circuit board 310, and power is supplied to the firstoptical transceiver sub-module 400 through thesecondary circuit board 310.

Specifically, one end of a power line disposed on thecircuit board 300 is electrically connected to thegold finger 340, and the other end is electrically connected to a signal solder ball disposed between thecircuit board 300 and thesub circuit board 310, so as to transmit an electrical signal to thesub circuit board 310; the inner layer of thesub circuit board 310 is electrically connected with the solder balls on the back surface of thesub circuit board 310 to transmit the electrical signal to the inner layer of thesub circuit board 310; the inner layer of thesub circuit board 310 is electrically connected to power lines disposed on the front surface of thesub circuit board 310 to transmit electrical signals from the inner layer of thesub circuit board 310 to the surface of thesub circuit board 310; the power line disposed on the front surface of thesecondary circuit board 310 is electrically connected to the first siliconoptical chip 420 through a wire bonding, so as to transmit the electrical signal to the first siliconoptical chip 420 through the power line and the wire bonding, and supply power to the first siliconoptical chip 420.

In some embodiments, since thesignal processing chip 320 is connected to the front surface of thesecondary circuit board 310 through thesignal solder balls 3210, in order to avoid thesignal processing chip 320 on the front surface of thesecondary circuit board 310, the power line for supplying power to the first siliconoptical chip 420 should be disposed inside thesecondary circuit board 310, and the power line can be disposed on the front surface of thesecondary circuit board 310 through the via hole after avoiding thesignal processing chip 320.

Specifically, a first power line may be disposed inside thesub-circuit board 310, one end of the power signal line on thecircuit board 300 is electrically connected to thegold finger 340 on thecircuit board 300, and the other end is electrically connected to the first power line, and the first power line is electrically connected to the first siliconoptical chip 420 through a wire bonding.

A first power trace may be disposed on the front surface of thesecondary circuit board 310, and one end of the first power trace is electrically connected to the first power line through a via hole, and the other end of the first power trace is electrically connected to the first siliconoptical chip 420 through a wire bonding.

In some embodiments, to provide power to thelaser 4120 of the firstoptical transceiver sub-module 400, a second power trace may be further disposed on the front surface of thesub-circuit board 310, the second power trace is located at one side of the connectinghole 330, one end of the second power trace is electrically connected to thelaser 4120 through a wire bonding, and the other end of the second power trace is electrically connected to the first power line through a via hole.

After the first siliconoptical chip 420 and thelaser 4120 of the firstoptical transceiver sub-module 400 receive the electrical signal, thelaser 4120 emits a laser beam, the laser beam sequentially passes through thecollimating lens 4130, theoptical isolator 4140, the converginglens 4150 and theoptical glass block 4160 to be transmitted to the first siliconoptical chip 420, and the laser beam is subjected to electro-optical modulation by the first siliconoptical chip 420 to realize light emission.

Fig. 26 is a schematic power connection diagram of a circuit board, a signal processing chip, and a second optical sub-transceiver module in an optical module according to an embodiment of the present disclosure, and fig. 27 is a cross-sectional power connection diagram of the second optical sub-transceiver module in the optical module according to the embodiment of the present disclosure. As shown in fig. 26 and 27, thesignal processing chip 320 is disposed on thesub-circuit board 310, and the electrical signal enters thecircuit board 300 from thegold finger 340, and then is connected to thesub-circuit board 310 through the signal solder ball between thecircuit board 300 and thesub-circuit board 310, so as to transmit power to thesub-circuit board 310, and power is supplied to the secondoptical transceiver sub-module 500 through thesub-circuit board 310.

Specifically, one end of a power line disposed on thecircuit board 300 is electrically connected to thegold finger 340, and the other end is electrically connected to the signal solder ball between thecircuit board 300 and thesecondary circuit board 310, so as to transmit an electrical signal to the signal solder ball; the inner layer of thesub circuit board 310 is electrically connected with the signal solder balls on the back surface of thesub circuit board 310 to transmit the electrical signals to the inner layer of thesub circuit board 310; the inner layer of thesub circuit board 310 is electrically connected to power lines disposed on the front surface of thesub circuit board 310 to transmit electrical signals from the inner layer of thesub circuit board 310 to the surface of thesub circuit board 310; the power line disposed on the front surface of thesecondary circuit board 310 is electrically connected to the second siliconoptical chip 520 through a wire bonding, so as to transmit the electrical signal to the second siliconoptical chip 520 through the power line and the wire bonding, and supply power to the second siliconoptical chip 520.

When the power line of the inner layer of thesub circuit board 310 supplies power to thesecond silicon microchip 520, the power line of the inner layer of thesub circuit board 310 needs to be located at one side of theconnection hole 330 to avoid crosstalk between the power line connected to the firstoptical transceiver sub-module 400 and the power line connected to the secondoptical transceiver sub-module 500.

In some embodiments, since thesignal processing chip 320 is connected to the front surface of thesecondary circuit board 310 through thesignal solder balls 3210, in order to avoid thesignal processing chip 320 on the front surface of thesecondary circuit board 310, the power line for supplying power to the second siliconoptical chip 520 should be disposed inside thesecondary circuit board 310, and the power line can be disposed on the front surface of thesecondary circuit board 310 through the via hole after avoiding thesignal processing chip 320.

Specifically, a second power line may be disposed inside thesecondary circuit board 310, the second power line is located at one side of theconnection hole 330, one end of the power signal line on thecircuit board 300 is electrically connected to thegold finger 340 on thecircuit board 300, the other end of the power signal line is electrically connected to the second power line, and the second power line is electrically connected to thesecond silicon microchip 520 through a wire bonding.

A third power trace may be disposed on the front surface of thesecondary circuit board 310, the third power trace is located at one side of the connectinghole 330, one end of the first power trace is electrically connected to the second power line through a via hole, and the other end of the first power trace is electrically connected to the second siliconoptical chip 520 through a routing.

In some embodiments, to supply power to the laser of the secondoptical transceiver sub-module 500, a fourth power trace may be further disposed on the front surface of thesub-circuit board 310, and a power signal line is disposed on thecircuit board 300 at the secondoptical transceiver sub-module 500, wherein one end of the power signal line is electrically connected to the fourth power trace and the other end is electrically connected to the laser through a wire bonding.

After the second siliconoptical chip 520 and the laser of the secondoptical transceiver sub-module 500 receive the electrical signal, the laser emits a laser beam, the laser beam sequentially passes through the collimating lens, the optical isolator, the converging lens and the optical glass block to be transmitted to the second siliconoptical chip 520, and the laser beam is subjected to electro-optical modulation by the second siliconoptical chip 520, so that light emission is realized.

After the firstoptical transceiver sub-module 400 receives the electrical signal and the data signal transmitted by thecircuit board 300, a laser beam generated by the laser is emitted into the first siliconoptical chip 420, the first siliconoptical chip 420 performs electro-optical modulation on the laser beam according to the data signal, and the modulated emission signal is emitted through the emissionoptical fiber ribbon 700; after the secondoptical transceiver sub-module 500 receives the electrical signal and the data signal transmitted by thecircuit board 300, the laser beam generated by the laser is emitted into the first siliconoptical chip 420, the second siliconoptical chip 520 performs electro-optical modulation on the laser beam according to the data signal, and the modulated emission signal is emitted through the emission optical fiber ribbon.

After the firstoptical transceiver sub-module 400 receives the electrical signal and the data signal transmitted by thecircuit board 300, the external optical signal is transmitted to the first siliconoptical chip 420 through the receivingoptical fiber ribbon 800, the first siliconoptical chip 420 converts the optical signal into the electrical signal according to the data signal, and the electrical signal is transmitted to thesignal processing chip 320 through the high-frequency signal line for processing; after the secondoptical transceiver sub-module 500 receives the electrical signal and the data signal transmitted by thecircuit board 300, the external optical signal is transmitted to the second siliconoptical chip 520 through the receiving optical fiber ribbon, the second siliconoptical chip 520 converts the optical signal into the electrical signal according to the data signal, and the electrical signal is transmitted to thesignal processing chip 320 through the high-frequency signal line for processing.

Fig. 28 is a schematic diagram of a pad structure of a secondary circuit board in an optical module according to an embodiment of the present application. As shown in fig. 28, a signal pad and a protection pad are disposed on the back surface of thesecondary circuit board 310, the protection pad is located outside the signal pad, and thesecondary circuit board 310 is connected to thecircuit board 300 through the signal pad and the protection pad, so as to connect thesecondary circuit board 310 to thecircuit board 300

Specifically, the back surface of thesub circuit board 310 is provided withfirst signal pads 3120, and thefirst signal pads 3120 correspond to the signal solder balls on the back surface of thesignal processing chip 320, that is, thefirst signal pads 3120 on the back surface of thesub circuit board 310 are close to thegold fingers 340 on thecircuit board 300. Thus, thefirst signal pad 3120 on the back surface of thesecondary circuit board 310 is connected to the front surface of thecircuit board 300, so that the electrical signals and data signals transmitted by thegold finger 340 on thecircuit board 300 are transmitted to thesecondary circuit board 310 through thefirst signal pad 3120 on the back surface of thesecondary circuit board 310, and then transmitted to thesignal processing chip 320 through thesecondary circuit board 310.

In some embodiments, the back surface of thesecondary circuit board 310 is provided with afirst protection pad 3130 in addition to thefirst signal pad 3120, thefirst protection pad 3130 being located around thefirst signal pad 3120. Specifically,first protection pads 3130 are disposed on both upper and lower sides of thefirst signal pads 3120, thefirst protection pads 3130 are adjacent to thefirst signal pads 3120 on the rear surface of thesecondary circuit board 310, and thefirst protection pads 3130 may protect thefirst signal pads 3120 from being damaged when thesecondary circuit board 310 is mounted.

In some embodiments, thefirst protection pad 3130 is a ground GND property, such that after thesub circuit board 310 is mounted on thecircuit board 300, thefirst signal pad 3120 on the back side of thesub circuit board 310 is connected to a pad on the front side of thecircuit board 300, thefirst protection pad 3130 on the back side of thesub circuit board 310 is connected to a ground pad on the front side of thecircuit board 300, and a ground connection between thesub circuit board 310 and thecircuit board 300 is achieved through thefirst protection pad 3130.

Thefirst protection land 3130 may not only achieve the ground connection between thesecondary circuit board 310 and thecircuit board 300, but also play a role of supporting thesecondary circuit board 310, so as to avoid the cold joint caused by the inconsistent front and rear stresses during the SMT mounting process of thesecondary circuit board 310 onto thecircuit board 300.

In some embodiments, thesecondary circuit board 310 includes a first edge disposed opposite the third edge, a second edge disposed opposite the fourth edge, and a third edge and a fourth edge, thefirst signal pad 3120 being proximate to the fourth edge. I.e., the first edge is located at the upper side of thesub circuit board 310, the second edge is located at the left side of thesub circuit board 310, the third edge is located at the lower side of thesub circuit board 310, and the fourth edge is located at the right side of thesub circuit board 310.

The first edge and the third edge are both provided with asecond protection pad 3150, the second edge is provided with athird protection pad 3160, thesecond protection pad 3150 is located at the upper side edge and the lower side edge of thesecondary circuit board 310, thethird protection pad 3160 is located at the left side edge of thesecondary circuit board 310, and the edge of thesecondary circuit board 310 can be supported by thesecond protection pad 3150 and thethird protection pad 3160.

In some embodiments, asecond signal pad 3180 is disposed on thesecondary circuit board 310 on the left side of theconnection hole 330, and thesecond signal pad 3180 is electrically connected to thelaser 4120 by wire bonding to provide an electrical signal and a data signal for thelaser 4120. Thefourth protection pad 3170 is disposed on the left side of thesecond signal pad 3180 on thesub circuit board 310, and the right side of theconnection hole 330. Afifth protection pad 3190 is disposed such that the edge of theconnection hole 330 on thesub circuit board 310 can be supported by thefourth protection pad 3170 and thefifth protection pad 3190.

In some embodiments, there is a gap between thefirst protection pad 3130 and the first and third edges, and a gap between thesecond protection pad 3150 and the fourth edge; thesub circuit board 310 is further provided with asixth protection pad 3140, and thesixth protection pad 3140 is located outside thefirst protection pad 3130 and is disposed in a gap between thefirst protection pad 3130 and the first edge, the third edge, and a gap between thesecond protection pad 3150 and the fourth edge.

Thesecond protection pad 3150, thethird protection pad 3160, thefourth protection pad 3170, thefifth protection pad 3190 and thesixth protection pad 3140 are all grounded GND properties, so that after thesecondary circuit board 310 is mounted on thecircuit board 300, thesecond protection pad 3150, thethird protection pad 3160, thefourth protection pad 3170, thefifth protection pad 3190 and thesixth protection pad 3140 on the back surface of thesecondary circuit board 310 are respectively connected with the ground pad on the front surface of thecircuit board 300, so as to realize ground connection between thesecondary circuit board 310 and thecircuit board 300.

The optical module comprises a circuit board, a secondary circuit board, a signal processing chip, a first optical transceiving secondary module, a second optical transceiving secondary module, a plurality of optical fiber ribbons and an optical fiber connector, wherein the secondary circuit board is attached to the circuit board and is provided with a connecting hole, part of area on the circuit board 300 is exposed through the connecting hole, and the secondary circuit board is in signal connection with the circuit board through a high-speed differential signal line; the signal processing chip is arranged on the secondary circuit board, so that the signal processing chip is closer to the shell of the optical module, and heat generated by the signal processing chip is conducted to the shell more quickly; the first optical transceiving secondary module is arranged on the surface of the circuit board, is positioned in the connecting hole and is in signal connection with the signal processing chip through a high-speed differential signal line arranged on the secondary circuit board; the second optical transceiving submodule is arranged on the surface of the circuit board, arranged side by side with the first optical transceiving submodule and the signal processing chip along the left-right direction and in signal connection with a high-speed differential signal line arranged on the secondary circuit board through a routing, so that the second optical transceiving submodule is in signal connection with the signal processing chip through the secondary circuit board; the transmitting ends and the receiving ends of the first optical transceiving submodule and the second optical transceiving submodule are correspondingly connected with the optical fiber ribbon so as to transmit optical signals transmitted by the first optical transceiving submodule and the second optical transceiving submodule and transmit the optical signals to the first optical transceiving submodule and the second optical transceiving submodule; the optical fiber connector is connected with a plurality of optical fiber ribbons and is used for transmitting optical signals carried by the optical fiber ribbons and transmitting the optical signals to the optical fiber ribbons. The application adopts a mode of attaching the double circuit boards, the first optical transceiving secondary module and the second optical transceiving secondary module are arranged on the circuit board along the left-right direction, the layout area of the circuit board is increased, the photoelectric device can be arranged on the circuit board and the secondary circuit board, and if the signal processing chip is arranged on the secondary circuit board, the wiring for connecting the photoelectric device is more dispersed, and the signal crosstalk between the wiring is prevented, so that the transmission rate of the optical module is improved, and the integrated design of the optical module is facilitated; in addition, the signal processing chip of the main heating device is placed on the secondary circuit board, so that the signal processing chip is closer to the upper shell of the optical module, heat generated by the signal processing chip is more quickly conducted to the upper shell, the internal temperature of the module is reduced, and the heat dissipation performance of the optical module is improved; the circuit board is in signal connection with the secondary circuit board through a high-speed differential signal line, and the first optical transceiving secondary module embedded in the connecting hole on the secondary circuit board is in signal connection with the signal processing chip through the high-speed differential signal line arranged on the secondary circuit board to provide a high-frequency signal for the first optical transceiving secondary module; the second optical transceiver secondary module arranged on the circuit board is in signal connection with the high-speed differential signal line arranged on the secondary circuit board through a routing, and provides a high-frequency signal for the second optical transceiver secondary module through the secondary circuit board, so that the high-frequency characteristic of the optical transceiver secondary module is ensured, and the high-frequency characteristic of the optical module and the heat dissipation of key devices are considered.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (10)

1. A light module, comprising:

a circuit board;

the secondary circuit board is attached to the circuit board and is provided with a connecting hole;

the first optical transceiving sub-module is arranged on the surface of the circuit board, positioned in the connecting hole and comprises a first silicon optical chip, wherein the first silicon optical chip comprises an emitting optical port and a receiving optical port, and the emitting optical port and the receiving optical port are positioned on the same side;

the second optical transceiving submodule is arranged on the surface of the circuit board and is arranged with the first optical transceiving submodule in parallel along the left-right direction;

the optical fiber ribbon comprises a transmitting optical fiber ribbon and a receiving optical fiber ribbon, the transmitting optical fiber ribbon is connected with the transmitting optical port of the first silicon optical chip, and the receiving optical fiber ribbon is connected with the receiving optical port of the first silicon optical chip;

the fixing frame is arranged at the periphery of the second optical transceiver sub-module and comprises a first fixing plate, a second fixing plate and a third fixing plate, two ends of the second fixing plate are respectively connected with the first fixing plate and the third fixing plate, and the first fixing plate and the third fixing plate are arranged oppositely; the second fixing plate is arranged on a silicon optical chip of the second optical transceiver sub-module, the transmitting optical fiber ribbon is clamped on the third fixing plate, and the receiving optical fiber ribbon is clamped on the first fixing plate;

and the optical fiber connector is respectively connected with the first optical transceiving submodule and the second optical transceiving submodule through optical fiber ribbons.

2. The optical module of claim 1, wherein the second optical transceiver sub-module comprises a second silicon optical chip, the second silicon optical chip being adjacent to one end of the secondary circuit board, the second silicon optical chip being connected to the secondary circuit board by wire bonding; the second fixing plate covers the second silicon optical chip and the routing.

3. The optical module according to claim 2, wherein a thickness dimension of the second fixing plate in the vertical direction is smaller than a thickness dimension of the first fixing plate and the third fixing plate in the vertical direction.

4. The optical module of claim 2, wherein the second fixing plate is provided with a through hole, and the second silicon optical chip is exposed through the through hole.

5. The optical module of claim 2, wherein the second optical transceiver sub-module further comprises an emission housing and an optical emission assembly, the emission housing is covered on the optical emission assembly;

the second fixed plate is provided with the arch towards the one end of transmission casing, the arch is used for right the transmission casing carries on spacingly.

6. The optical module of claim 5, wherein a signal pad is disposed on the circuit board near the optical transmitter module, and the signal pad is in signal connection with the optical transmitter module by wire bonding;

one end of the emission shell, which is back to the second silicon optical chip, protrudes, and the protruding end part covers the signal bonding pad and the routing.

7. The optical module of claim 5, wherein the second silicon photo chip is disposed obliquely, and the second silicon photo chip is disposed at a predetermined angle with respect to a light emitting direction of the light emitting module.

8. The optical module of claim 5, wherein the light emitting assembly comprises a laser, a collimating lens, a condensing lens and an optical glass block arranged in sequence, wherein the output end of the optical glass block is in contact with the input end face of the silicon optical chip; the light beam emitted by the laser is converted into collimated light beam through the collimating lens, the collimated light beam is converged to the optical glass block through the converging lens, and the converged light beam is emitted into the second silicon optical chip after the emergent direction of the converged light beam is changed through the optical glass block.

9. The light module as claimed in claim 8, wherein the optical glass block is a wedge-shaped block.

10. The optical module of claim 5, wherein the second photonic transceiver module further comprises a heat sink disposed on the circuit board, and the second silicon optical chip and the light emitting assembly are both disposed on the heat sink.

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