CN113903701A - Wet processing equipment for porous substrates - Google Patents

Abstract

Translated fromChinese

本揭示提供一种多孔性基板的湿式处理设备，包含旋转装置和液体供应装置。旋转装置包含承载台、旋转件、管路、和排液管。承载台配置为将多孔性基板保持于其上。旋转件与所述承载台连接，配置为带动所述承载台绕着旋转轴旋转。管路设置在所述旋转件内部，包含进液口和多个排出口。排液管与所述旋转件相邻。液体供应装置设置在所述旋转装置的所述承载台的上方，配置为对所述多孔性基板施加一工艺液体。所述工艺液体依序通过所述管路和所述排液管而被排出至所述旋转装置的外部。

The present disclosure provides a wet processing equipment for porous substrates, which includes a rotating device and a liquid supply device. The rotating device includes a bearing platform, a rotating part, a pipeline, and a drain pipe. The stage is configured to hold the porous substrate thereon. The rotating member is connected with the bearing platform and is configured to drive the bearing platform to rotate around the rotation axis. A pipeline is arranged inside the rotating member, and includes a liquid inlet and a plurality of discharge ports. A drain is adjacent to the rotating member. A liquid supply device is disposed above the stage of the rotation device, and is configured to apply a process liquid to the porous substrate. The process liquid is discharged to the outside of the rotating device through the pipeline and the drain pipe in sequence.

Description

Wet processing equipment for porous substrate

Technical Field

The present disclosure relates to a wet processing apparatus, and more particularly, to a wet processing apparatus for a porous substrate.

Background

With the continuous development of semiconductor device integration technology, the semiconductor substrate is no longer a conventional two-dimensional structure, but a three-dimensional structure and has a variety of variations. For example, the semiconductor substrate of today may include an island structure or a plurality of via patterns. Furthermore, the conventional wet processing apparatus mainly performs etching or cleaning of the substrate by using a high pressure rinse or soak. However, when the substrate having a plurality of via patterns is cleaned and etched by a high pressure rinse or a soak, the substrate may be damaged or broken, or the cleaning and etching process of the substrate may be incomplete. Therefore, with the structural change of the semiconductor substrate, the conventional wet processing apparatus has failed to meet the current manufacturing requirements.

In view of the above, it is desirable to provide a wet processing apparatus for porous substrates, which solves the problems in the prior art.

Disclosure of Invention

In order to solve the above-mentioned problems of the prior art, it is an object of the present disclosure to provide a wet processing apparatus for porous substrates, which can ensure that a process liquid can pass through each through hole of a substrate and avoid applying an excessive pressure to a surface of the substrate by providing a pipe inside a rotating member so that the process liquid applied on the porous substrate can smoothly pass through the plurality of through holes of the porous substrate and guiding the process liquid downward into the pipe by gravity or an extraction force.

To achieve the above object, the present disclosure provides a wet processing apparatus for a porous substrate, comprising: a rotating device and a liquid supply device. The rotating device comprises a bearing platform, a rotating piece, a pipeline and at least one liquid discharging pipe. The susceptor is configured to hold a porous substrate thereon. The rotating piece is connected with the bearing platform and is configured to drive the bearing platform to rotate around a rotating shaft. The pipeline is arranged in the rotating part and comprises a liquid inlet and a plurality of discharge ports, wherein the liquid inlet faces the bearing platform, and the discharge ports are arranged at the same horizontal height in a surrounding manner. At least one drain tube is adjacent the rotating member. The liquid supply device is arranged above the bearing platform of the rotating device and is configured to apply a process liquid to the porous substrate, wherein the process liquid is discharged to the outside of the rotating device through the pipeline and the liquid discharge pipe in sequence.

In one preferred embodiment of the present disclosure, the pipeline includes a main pipeline and a plurality of branch pipelines, wherein the main pipeline extends longitudinally from the liquid inlet to the interior of the rotating member and terminates at a first position in the interior of the rotating member, and the plurality of branch pipelines extend transversely from the first position in different directions and terminate at the corresponding discharge ports.

In one preferred embodiment of the present disclosure, the rotating device further comprises a Chamber housing (Chamber Case) tightly connected to the rotating member of the rotating device by a Dynamic Seal (Dynamic soft Seal).

In one preferred embodiment of the present disclosure, the wet treatment apparatus further comprises a chamber disposed between the chamber housing and the rotary member and communicating with the pipe and the at least one drain pipe, such that the process liquid is discharged to the chamber through the plurality of discharge ports of the pipe, and the at least one drain pipe discharges the process liquid in the chamber to the outside.

In one preferred embodiment of the present disclosure, the rotating member of the rotating device includes an inner layer and an outer layer, the outer layer covers the inner layer, and the pipe is disposed on the inner layer.

In one of the preferred embodiments of the present disclosure, the strength of the outer layer structure is greater than the strength of the inner layer structure.

In one preferred embodiment of the present disclosure, the inner layer structure is made of a corrosion-resistant plastic material, and the outer layer structure is made of a high-strength corrosion-resistant metal material.

In one preferred embodiment of the present disclosure, the rotating device further comprises at least one pillar extending from the surface of the outer layer structure through the interior of the inner layer structure.

In one preferred embodiment of the present disclosure, the rotating device further comprises a motor, and the motor is connected to the rotating member and drives the rotating member to rotate.

In one preferred embodiment of the present disclosure, the rotating device further comprises a recycling device connected to the rotating device through the at least one liquid discharging pipe.

Compared with the prior art, the back surface of the porous substrate is supported by the rotating device so as to prevent the substrate from cracking and bending. And the spraying direction and pressure of the process liquid are accurately controlled by the liquid supply device, so that the process liquid can pass through each through hole pattern of the porous substrate, and each through hole of the etched porous substrate is cleaned.

Drawings

Fig. 1 shows a schematic view of a wet processing apparatus according to a preferred embodiment of the present disclosure.

Fig. 2 shows a cross-sectional view of the rotating device of the wet processing apparatus of fig. 1.

Fig. 3 shows a schematic view of the rotary member of fig. 2.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present disclosure comprehensible, preferred embodiments accompanied with figures are described in detail below.

Referring to fig. 1, a schematic diagram of a wet processing apparatus 1 according to a preferred embodiment of the present disclosure is shown. The wet processing apparatus 1 is preferably used to perform various wet processes such as etching and cleaning on theporous substrate 2. Theporous substrate 2 is asubstrate 2 including a plurality of through holes (through holes) 3, and the arrangement positions or sizes of the through holes 3 may be regular or irregular. As shown in fig. 1, the wet processing apparatus 1 includes aliquid supply device 10, arotation device 20, and arecovery device 30. Therotating device 20 is used to place theporous substrate 2. Theliquid supply device 10 is disposed above thesusceptor 21 of therotating device 20 for applying a process liquid to theporous substrate 2. Therecovery device 30 is connected to the rotatingdevice 20 for collecting the used process liquid and storing it in a storage tank, and the recovered process liquid may be further processed, such as filtration, gas-liquid separation, etc.

Referring to fig. 2, a cross-sectional view of the rotatingdevice 20 of the wet processing apparatus 1 of fig. 1 is shown. Therotating device 20 comprises a bearing table 21, a rotatingmember 22, apipeline 23, acavity housing 25 and twodrain pipes 26. Thestage 21 holds theporous substrate 2 thereon by a fixture including a jig, a vacuum chuck, and the like. Therotary member 22 is connected to the carrier table 21 and themotor 27, wherein themotor 27 controls therotary member 22 to rotate, and therotary member 22 jointly drives the carrier table 21 to rotate around the rotation axis. Theconduit 23 is embodied as a conduit for extracting gas and liquid, which is arranged inside therotary member 22 and comprises aninlet 233 and a plurality ofoutlets 234. Wherein theliquid inlet 233 is disposed on the upper surface of the rotatingmember 22 and faces thebearing platform 21. A plurality ofdischarge ports 234 are formed at a side surface of therotary 22 and are circumferentially disposed at the same level. Thechamber housing 25 is tightly coupled to therotary device 20 by adynamic shaft seal 251 and surrounds a plurality ofexhaust ports 234 defining achamber 24 between thechamber housing 25 and therotary member 22. The twodrain pipes 26 are provided corresponding to the plurality ofdischarge ports 234 of therotary 22. In particular, theduct 23 and the twodrains 26 communicate with each other through thechamber 24. That is, the process liquid or the gas-liquid mixture after the cleaning and etching is merged into thepipe 23 of thespin device 20 and is discharged to thechamber 24 through the plurality ofdischarge ports 234 of thepipe 23. That is, thechamber 24 acts as a collection chamber for gases and liquids. Twodrains 26 then drain the process liquid in thechamber 24 to arecovery unit 30 located outside the rotatingunit 20. It should be understood that the number ofdrain pipes 26 may vary according to practical requirements, but is not limited thereto.

As shown in fig. 2, thepipeline 23 includes amain pipeline 231 and a plurality ofbranch pipelines 232. Themain conduit 231 extends longitudinally from the inlet opening 233 in a direction parallel to the axis of rotation to the interior of theswivel 22 and terminates at a first position P1 inside theswivel 22. The plurality ofbranch lines 232 extend laterally in different directions from the first position P1, respectively, and terminate atcorresponding discharge ports 234. That is, thedischarge port 234 is equal to the number of thebranch lines 232. Preferably, the extension direction of thebranch line 232 is substantially perpendicular to the extension direction of themain line 231. By this arrangement, the process liquid entering themain pipe 231 is transferred into thebranch pipe 232 by centrifugal force generated by rotation, and is discharged to thechamber 24 through thebranch pipe 232. In the present embodiment, the number of thebranch lines 232 is four, but is not limited thereto.

Referring to fig. 2 and fig. 3, wherein fig. 3 shows a schematic view of the rotatingmember 22 of fig. 2, the rotatingmember 22 of therotating device 20 includes aninner layer 222, anouter layer 221, and a plurality ofpillars 223. Theouter layer 221 covers a portion of theinner layer 222, and thetube 23 is disposed in theinner layer 222. Since theinner layer 222 is mainly used for transporting process liquids, theinner layer 222 is preferably made of an erosion-resistant plastic material, such as PEEK plastic. On the other hand, since the strength of the plastic material is hard to withstand the force of rotation, the overall mechanical strength of therotary member 22 is enhanced by theouter layer structure 221 and thesupport column 223. Specifically, the strength (e.g., hardness) of the material of theouter layer 221 and thesupport column 223 is greater than that of theinner layer 222, for example, theouter layer 221 may be made of a high-strength corrosion-resistant metal material, or a stainless steel material. Also, thepillars 223 are formed extending from the surface of theouter layer structure 221, and thepillars 223 pass through the inside of theinner layer structure 222. In the present disclosure, the number ofstruts 223 preferably corresponds to the number ofbranch lines 232, and eachstrut 223 is disposed between twoadjacent branch lines 232, respectively.

In summary, the present disclosure supports the back surface of the porous substrate by the rotating device to prevent the substrate from cracking or bending. And the spraying direction and pressure of the process liquid are accurately controlled by the liquid supply device, so that the process liquid can pass through each through hole pattern of the porous substrate, and each through hole of the etched porous substrate is cleaned. Next, the cleaned process liquid or its entrained gas-liquid mixture is collected by the rotating device and conveyed by the rotating device down to a recovery device for subsequent recovery processing.

The foregoing is merely a preferred embodiment of the present disclosure, and it should be noted that modifications and refinements may be made by those skilled in the art without departing from the principle of the present disclosure, and these modifications and refinements should also be regarded as the protection scope of the present disclosure.

Claims (10)

Translated fromChinese

1.一种多孔性基板的湿式处理设备，其特征在于，包含：1. A wet processing equipment for a porous substrate, characterized in that, comprising:一旋转装置，包含：a rotating device, comprising:一承载台，配置为将一多孔性基板保持于其上；a stage configured to hold a porous substrate thereon;一旋转件，与所述承载台连接，配置为带动所述承载台绕着一旋转轴旋转；a rotating member, connected with the bearing platform, configured to drive the bearing platform to rotate around a rotation axis;一管路，设置在所述旋转件内部，包含一进液口和多个排出口，其中所述进液口面对所述承载台，以及所述多个排出口环绕地设置在相同的水平高度；以及A pipeline, arranged inside the rotating member, includes a liquid inlet and a plurality of discharge ports, wherein the liquid inlet faces the bearing platform, and the plurality of discharge ports are circumferentially arranged at the same level height; and至少一排液管，与所述旋转件相邻；以及at least one drain pipe adjacent to the rotating member; and一液体供应装置，设置在所述旋转装置的所述承载台的上方，配置为对所述多孔性基板施加一工艺液体，其中所述工艺液体依序通过所述管路和所述排液管而被排出至所述旋转装置的外部。A liquid supply device, disposed above the stage of the rotating device, is configured to apply a process liquid to the porous substrate, wherein the process liquid passes through the pipeline and the drain in sequence and discharged to the outside of the rotating device.2.如权利要求1所述的多孔性基板的湿式处理设备，其特征在于，所述管路包含一主管路和多个分支管路，其中所述主管路从所述进液口纵向延伸至所述旋转件内部且终止于所述旋转件内部的第一位置，以及所述多个分支管路从所述第一位置分别朝不同方向横向延伸并且终止于对应的所述排出口。2. The wet processing equipment for porous substrates according to claim 1, wherein the pipeline comprises a main pipeline and a plurality of branch pipelines, wherein the main pipeline extends longitudinally from the liquid inlet to The rotating member is inside and terminated at a first position inside the rotating member, and the plurality of branch pipes extend laterally in different directions from the first position respectively and terminate at the corresponding discharge port.3.如权利要求1所述的多孔性基板的湿式处理设备，其特征在于，所述旋转装置还包含一腔体外壳，通过动态轴封与所述旋转装置的所述旋转件作紧密连接。3 . The wet processing equipment for porous substrates according to claim 1 , wherein the rotating device further comprises a cavity shell, which is tightly connected with the rotating member of the rotating device through a dynamic shaft seal. 4 .4.如权利要求3所述的多孔性基板的湿式处理设备，其特征在于，所述湿式处理设备还包含一腔体，设置在所述腔体外壳与所述旋转件之间，并且与所述管路和所述至少一排液管连通，使得所述工艺液体通过所述管路的所述多个排出口排出至所述腔体，并且所述至少一排液管将所述腔体内的所述工艺液体排出至外部。4 . The wet processing equipment for porous substrates according to claim 3 , wherein the wet processing equipment further comprises a cavity, which is arranged between the cavity shell and the rotating member, and is connected to the cavity. 5 . The pipeline is communicated with the at least one liquid discharge pipe, so that the process liquid is discharged to the cavity through the plurality of discharge ports of the pipeline, and the at least one liquid discharge pipe discharges the liquid into the cavity. The process liquid is discharged to the outside.5.如权利要求1所述的多孔性基板的湿式处理设备，其特征在于，所述旋转装置的所述旋转件包含一内层结构和一外层结构，且所述外层结构包覆所述内层结构，以及所述管路设置在所述内层结构。5 . The wet processing equipment for porous substrates according to claim 1 , wherein the rotating member of the rotating device comprises an inner layer structure and an outer layer structure, and the outer layer structure covers the outer layer structure. 6 . The inner layer structure, and the pipeline is arranged in the inner layer structure.6.如权利要求5所述的多孔性基板的湿式处理设备，其特征在于，所述外层结构的强度大于所述内层结构的强度。6 . The wet processing equipment for porous substrates according to claim 5 , wherein the strength of the outer layer structure is greater than the strength of the inner layer structure. 7 .7.如权利要求5所述的多孔性基板的湿式处理设备，其特征在于，所述内层结构采用耐侵蚀的塑胶材料，以及所述外层结构采用高强度耐腐蚀的金属材料。7 . The wet processing equipment for porous substrates according to claim 5 , wherein the inner layer structure adopts corrosion-resistant plastic material, and the outer layer structure adopts high-strength corrosion-resistant metal material. 8 .8.如权利要求5所述的多孔性基板的湿式处理设备，其特征在于，所述旋转装置还包含至少一支柱，从所述外层结构的表面延伸穿过所述内层结构的内部。8 . The wet processing apparatus for porous substrates according to claim 5 , wherein the rotating device further comprises at least one pillar extending from the surface of the outer layer structure through the interior of the inner layer structure. 9 .9.如权利要求1所述的多孔性基板的湿式处理设备，其特征在于，所述旋转装置还包含一马达，所述马达连接所述旋转件并传动所述旋转件旋转。9 . The wet processing equipment for porous substrates according to claim 1 , wherein the rotating device further comprises a motor, and the motor is connected to the rotating member and drives the rotating member to rotate. 10 .10.如权利要求1所述的多孔性基板的湿式处理设备，其特征在于，所述旋转装置还包含一回收装置，通过所述至少一排液管与所述旋转装置连接。10 . The wet processing equipment for porous substrates according to claim 1 , wherein the rotating device further comprises a recovery device connected to the rotating device through the at least one drain pipe. 11 .

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