CN113894703B - Preparation process of brazed diamond dresser based on cluster-shaped units - Google Patents
Preparation process of brazed diamond dresser based on cluster-shaped unitsDownload PDFInfo
- Publication number
- CN113894703B CN113894703BCN202111270275.3ACN202111270275ACN113894703BCN 113894703 BCN113894703 BCN 113894703BCN 202111270275 ACN202111270275 ACN 202111270275ACN 113894703 BCN113894703 BCN 113894703B
- Authority
- CN
- China
- Prior art keywords
- diamond
- cluster
- hole
- template
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Technical Field
The invention relates to a preparation process of a brazed diamond dresser based on cluster units, belongs to the field of semiconductor manufacturing, and particularly relates to a dresser used in a Chemical Mechanical Polishing (CMP) process in the field of semiconductor manufacturing, which can dress a polishing pad used in the process.
Background
Chemical Mechanical Polishing (CMP) is a key process for Planarization of semiconductor wafer surfaces. In the chemical mechanical polishing process, the polishing pad stably and uniformly conveys polishing liquid between a wafer and the polishing pad, and a deposited layer protruding on the wafer is removed under the interaction of chemical etching and mechanical grinding. In order to improve the efficiency of chemical mechanical polishing and maintain the stability of the polishing efficiency, the polishing pad needs to be cleaned online in real time to remove the by-products of chemical mechanical polishing, so as to ensure the uniform distribution of the polishing solution and recover the rough surface state of the polishing pad, so that the operation can be stabilized without being affected by the accumulation of the removed materials.
The dresser is used for on-line real-time cleaning of the polishing pad. At present, the mainstream trimmer is prepared by fixing diamond on a steel matrix, diamond particles are fixed on the steel matrix through the processes of electroplating, brazing and the like, and the polishing pad is trimmed by utilizing the sharp cutting edge of the diamond.
Through many years of improvement and updating, a Diamond dresser (Diamond dresser) commonly used in the market is prepared by a Diamond brazing process, namely, artificial Diamond is welded on the surface of a steel matrix through a vacuum brazing process and can be distributed in a certain shape to achieve different grinding characteristics.
However, the equal height of the brazed diamond dresser is influenced by the difference of diamond particles and the crystal form, so that a height error of more than 5-10% is generated, the number of diamond grinding particles which effectively participate in processing has large fluctuation, and the processing stability is influenced. When the contour is poor, the early-stage finishing efficiency is high, and the later-stage efficiency is rapidly reduced; when the equal height is good, the stability of the dresser before and after dressing efficiency is good, but if the distance between diamond particles is small and the exposure height is low, the overall dressing efficiency is very easy to cause, and the improvement of the efficiency of chemically and mechanically polishing and processing the silicon wafer is not facilitated. In order to solve the scheme, a novel dresser prepared by using a Chinese grinding wheel KINKI in Taiwan is reported and recorded, polycrystalline diamond is welded on a substrate disc surface for processing, the crystal direction and the height of each polycrystalline diamond are consistent through grinding, although the number of cutting edges is smaller than that of a conventional brazed diamond dressing disc, the particle consistency is high, the top dressing stability is good, the particles are large, the exposure is high, and the better dressing efficiency and the service life can still be achieved. However, because the manufacturing cost of the polycrystalline diamond particles, the precision finishing cost and the overall manufacturing cost of the dresser are high, the application is limited to a certain extent, and the polycrystalline diamond particles are mostly applied to the field of silicon wafer processing with short process and high precision requirements at present.
If the effect of the PCD trimming disc is realized by adopting conventional large-particle diamond welding, the problems of the shape control, the height consistency and the welding consistency of the diamond tip are high, and the larger the granularity of the applied diamond is, the higher the cost is, which is not beneficial to controlling the cost performance of the trimmer.
Another patent relates to a diamond cluster dresser (CN 102049737A-pad dresser), which has a low exposed height, is formed by the aggregation of several diamonds in a plane area, and has a limitation in forming a high debris discharge space and a high sharpness.
Disclosure of Invention
Aiming at the problems that the dressing efficiency of a diamond dresser obtained by the existing preparation process is unstable when the diamond dresser dresses a polishing pad and the dressing efficiency is difficult to be considered with high efficiency, the invention creatively invents a vacuum brazing preparation process of a novel brazing diamond dresser based on cluster-shaped units, the cluster-shaped dressing units can be welded on a dresser substrate, the top ends of the dressing units are single diamonds, the overall height is consistent, and the efficient and stable dressing of the polishing pad is realized.
The invention provides a preparation process of a brazed diamond dresser based on cluster units, which comprises the following preparation steps:
(1) Preparing raw materials: the diamond-based alloy welding material comprises a steel substrate, a plurality of cluster-shaped units, a plurality of diamonds, a binder I, a binder II, a cluster-shaped unit hole template, a diamond hole template and alloy welding materials;
(2) Cleaning one working surface of a steel matrix, and coating a layer of adhesive II for later use;
(3) Distributing a plurality of cluster units to the surface of the cluster unit hole template, wherein cluster unit particles are embedded into holes on the surface of the cluster unit hole template and are kept fixed and are not embedded and removed;
(4) Covering the working surface of the steel matrix coated with the binder II obtained in the step (2) on the surface of the cluster unit hole template distributed with the cluster units in the step (3), and then inverting the template to obtain a cluster unit matrix distributed according to the design requirement on the surface of the steel matrix;
(5) Spraying a layer of adhesive I on the surface of the steel substrate bonded with the cluster units, and then spraying alloy solder with matched granularity;
(6) Spraying a layer of adhesive I on the surface after the alloy solder is sprayed;
(7) A plurality of diamond particles are distributed on the surface of the diamond hole template, and the diamond particles fall into holes on the surface of the diamond hole template and are kept fixed; diamond falls into the template, and the diamond in the pit is contacted with the bottom surface of the hole;
(8) Aligning the surface of the steel substrate sprayed with the binder I after the treatment in the step (6) with a diamond hole template sprayed with diamond particles, and pressing diamond in;
(9) And (4) carrying out vacuum brazing on the integral structure obtained in the step (8), removing the diamond hole template after vacuum brazing, and then taking out the diamond hole template in an inverted manner to obtain the brazed diamond dresser based on the cluster units.
The material of the steel substrate of the dresser can be steel, can be 40Cr, 45 steel and Q235 steel, and particularly can select 304 stainless steel series.
The diamond is natural diamond or artificial diamond, mainly is single crystal diamond or polycrystalline diamond, preferably regular octahedron or approximate regular octahedron, and can also be selected into hexahedron-octahedron poly-shape; the grain diameter of the diamond grains is between 0.4 and 3mm, and the grain diameter difference of the diamond grains applied to the same trimmer is not more than 15 percent.
The top ends of the cluster-shaped units are arc concave surfaces and are used for supporting diamond particles, and the particle size of the matched diamond particles is smaller than the diameter of the concave surfaces; the shape of the cluster unit is preferably a pyramid or a cone, the bottom surface of the cluster unit is a regular polygon or a circle, and the regular polygon is preferably a regular triangle, a regular quadrangle, a regular pentagon or a regular hexagon. The diameter of the bottom surface of the cluster unit is 0.6-5 mm, the height of the cluster unit is 0.3-7 mm, and the included angle between the edge or the bus of the cluster unit and the horizontal plane is 30-75 degrees. The cluster unit can be prepared by powder metallurgy sintering, injection molding sintering and 3D laser printing sintering processes, and can also be prepared by machining processes, and the materials are steel, stainless steel and other materials.
The material of the cluster unit hole template is silica gel, and the Shore hardness is more than 65; the surface of the cluster unit hole template is provided with a plurality of holes, the holes are in the shape of inverted pyramids or inverted cones and are matched with the cluster unit matrix, the hole diameter is 1.2-1.6 times of the diamond grain diameter, and the hole depth is 1.1-1.4 times of the diamond grain diameter; the ratio of the outer diameter of the surface of the hole to the maximum outer diameter of the cluster unit is 1:1.2 to 1.8; the aperture of the cluster unit hole template is 0.8 to 0.95 times of the diameter of the bottom surface of the cluster unit to be implanted.
The invention isThe surface of the diamond hole template is provided with a plurality of holes, the shape of each hole is matched with the shape of the cluster unit matrix, the shape of each hole is in a reverse pyramid shape or reverse cone shape, the diamond hole template is made of a non-metal hard brittle material capable of resisting high temperature of more than 1200 ℃, and the linear expansion coefficient does not exceed 8 multiplied by 10 at normal temperature-6 The temperature is lower than the temperature of the diamond hole template, and the material does not have chemical metallurgical reaction with the nickel-based alloy solder, and particularly an alumina ceramic substrate or a silicon dioxide substrate material can be adopted, and the surface flatness of the diamond hole template is not more than 0.03mm.
The cluster unit hole templates and the diamond hole templates have consistent arrangement shapes of holes on the surfaces, so that each cluster unit corresponds to each diamond position, positioning holes can be designed on the peripheries of the cluster unit hole templates and the diamond hole templates for ensuring the alignment accuracy, the cluster unit hole templates and the diamond hole templates are fixed through pin shafts, namely, a plurality of small holes are drilled in the same positions of the two templates, a positioning pin is plugged in one template hole, and the other template is inserted into the holes according to the position of the positioning pin, so that the alignment accuracy is ensured.
The arrangement appearances of the holes on the surfaces of the cluster unit hole templates and the diamond hole templates are symmetrical along a central axis, and the holes on the surfaces of the hole templates are distributed continuously or at intervals; the distribution morphology of the holes on the surfaces of the cluster unit hole template and the diamond hole template is in a dot matrix form, a concentric ring form, a radial form or a spiral line form. .
The alloy solder is nickel-based alloy solder particles, which refers to nickel-based alloy solder capable of generating chemical metallurgical reaction with diamond, particularly BNi2 grade solder is selected, the particle size of the nickel-based alloy solder particles is 30-120 meshes, and the ratio of the maximum particle size to the diamond particle size is not more than 1:3.
in the preparation process, the adhesive I is an acrylate pressure-sensitive adhesive and an organic solvent I, and the ratio of the acrylate pressure-sensitive adhesive to the organic solvent I is 1:3 to 1:12, the adhesive II is acrylate pressure-sensitive adhesive and organic solvent II, and the volume ratio of the acrylate pressure-sensitive adhesive to the organic solvent II is 1:3 to 1:5, and acetone is selected as the organic solvent I and the organic solvent II.
In the preparation process, because the surface of the base body of the trimmer adopted by the invention may have certain oil stain, rust spot, dust and the like, the surface of the base body is cleaned by alcohol, acetone or the like before the trimmer is prepared, and the base body needs to be dried before the surface of the base body is coated with a layer of adhesive in the step (2), wherein the coating mode is brush coating or roll coating.
The aperture of the cluster unit hole template is 0.8-0.95 times of the diameter of the bottom surface of the cluster unit to be implanted, when the cluster unit substrate falls into the surface of the cluster unit hole template in the step (3), because the hole is smaller than the maximum diameter of the cluster unit, the pointed end of the cluster unit substrate cannot enter the hole template or the horizontal cluster unit substrate cannot enter the hole template, only the pointed end of the cluster unit substrate can fall, after the cluster unit substrate is sprayed for a period of time, whether the cluster unit is embedded into the surface hole is checked, if the cluster unit is empty, the cluster unit substrate is continuously sprayed until the cluster unit is empty, then the cluster unit substrate is vibrated or the template is inclined for a certain angle, the cluster unit which is not embedded into the hole slides down from the surface of the template, and the cluster unit substrate is fixed in the embedding hole, so that the required appearance can be obtained.
In the preparation process, due to the viscosity of the adhesive in the step (4), the bottoms of the cluster units are contacted with the adhesive on the surface of the matrix and are adhered, and the bottoms of the cluster units are higher than the surface of the hole template, so that the adhesive does not touch the surface of the hole template, the cluster units are favorably demoulded, and the required arrangement morphology is obtained after inversion.
In the preparation process, in the step (5), in order to bond the diamond particles, the nickel-based alloy solder needs to be arranged, and then the diamond particles are bonded, so that the bonding agent needs to be further sprayed, and the surface is covered with a layer in a spraying manner. The granularity of the nickel-based alloy solder cannot be too large, too small or too large, the solder particles occupy too large space at the top ends of the cluster units and cannot be completely spread in the concave surfaces of the cluster units, the arrangement of diamond is influenced, the granularity is too small, the thickness of a melted solder layer is small, and the welding strength is influenced. Therefore, the granularity of the nickel-based alloy solder is preferably between 30 meshes and 120 meshes, wherein the ratio of the maximum particle granularity to the diamond particle size is not more than 1:3.
in the preparation process, after the nickel-based alloy solder is distributed in the step (6), the surface is sprayed with a layer of adhesive for bonding the diamond.
In the preparation process, in the step (7), the flatness of the surface of the diamond hole template is required to be not more than 0.03mm, the diamond hole template can be brazed along with a furnace in a vacuum manner, the bottom surface of a hole in the template is a plane and is in contact with diamond, the bottom surface is flat, and the exposure height of the diamond is determined through the bottom surface.
In the preparation process, in the step (8) and the step (9), due to the existence of the concave surfaces of the cluster-shaped units, diamond particles can be contacted with the concave surfaces at the top ends of the cluster-shaped units to a certain degree, according to the relation of particle size, the diamond after welding can be welded and held in the concave surfaces, and the edges of the concave surfaces also provide a certain holding effect. Because the diamond particles have certain particle size difference, the diamond particles with large particle size are held by much solder, and the diamond particles with small particle size are held less, but the condition that the height of the alloy solder layer embedded into the concave surface of the cluster-shaped unit is 30-50% of the particle size of the diamond particles is met, and the diamond particles can enter the concave surface, so that the holding effect is improved. This ensures that the diamond tips are flush.
In the step (9) of vacuum brazing, because the alloy solder layer is brazed on the surface of the base body and the surfaces of the cluster units can contain the alloy solder, although the alloy solder is not arranged at the bottoms of the cluster units, the alloy solder can enter gaps between the cluster units and the base body through the melting, flowing and climbing actions of the alloy solder, and the cluster unit structure is brazed on the surface of the base body, which is equivalent to the brazing of the cluster units on the surface of the base body.
The brazed diamond dresser prepared in the step (9) comprises a steel matrix provided with a working surface, an alloy solder layer welded on the working surface of the steel matrix and a plurality of cluster-shaped units, wherein the top ends of the cluster-shaped units are arc concave surfaces, one diamond particle is welded at the top end of each cluster-shaped unit, the tip end of each diamond particle faces upwards, and the height from the top end of each diamond particle to the surface of the steel matrix is consistent;
the distribution appearance of the cluster units on the surface of the substrate is consistent with the distribution appearance of the holes on the surfaces of the cluster unit hole template and the diamond hole template.
The purpose of the brazed diamond dresser prepared by the invention is that each cluster unit can be firmly brazed on the surface of a steel substrate and is arranged according to a certain shape, a diamond is welded at the top end of the arranged cluster unit, the diamond is firmly welded at the top end of the cluster unit, the heights of the top end and the bottom surface of the cluster unit are basically consistent, the equal-altitude exposure is kept, and the welded diamond is used for realizing efficient and stable dressing of a CMP polishing pad. Because the cluster-shaped unit is pointed upwards, the chip removal space is large, the waste material and the cutting fluid cannot block a grinding area, the sharpness is high, the welded height of the diamond top end is basically consistent, and when the diamond grinding machine is used, the stress distribution of the diamond is uniform, the abrasion is stable, the service life is long, and the efficiency is stable.
The process is relatively simple, stable and controllable, single diamond does not need to be polished and shaped, the preparation process is simple and reliable, the production material cost is greatly reduced, the preparation process is combined with a certain template and a certain clamp, large-scale preparation is easy to realize, the process is suitable for the preparation of a customized trimmer, the trimming can be customized according to requirements, batch high-efficiency preparation can be realized, the process can be applied to the preparation of brazed diamond trimmers for chemical mechanical polishing, and brazed diamond grinding tools for grinding and processing hard and brittle materials such as ceramics, sapphire, polysilicon and the like, and the process has wide applicability, high cost performance and economic benefit.
Drawings
Fig. 1 is a schematic structural view of a brazed diamond conditioner of the present invention.
Fig. 2 is a partial schematic view of the brazing of the diamond particles to the cluster elements in the brazed diamond conditioner of the present invention.
Fig. 3 is a vertical cross-sectional view of the tufted cells of the present invention.
FIG. 4 is a diagram of a tufted cell aperture template according to the present invention.
FIG. 5 is a schematic view of the tufted cell pattern plate of the present invention after being coated with tufted cells.
FIG. 6 is a schematic structural view of the steel matrix and cluster units according to the present invention.
Fig. 7 is a schematic view of the diamond hole pattern after diamond particles are distributed thereon.
FIG. 8 is a schematic view of the surface topography of a brazed diamond conditioner with the cluster units arranged in a phyllotactic structure.
FIG. 9 is a schematic view of the surface topography of a brazed diamond conditioner with the cluster units arranged in a lattice structure according to the present invention.
FIG. 10 is a schematic view of the surface topography of a brazed diamond conditioner with the cluster units arranged in a triangular lattice structure according to the present invention.
FIG. 11 is a schematic view of the surface topography of a brazed diamond conditioner with the cluster units arranged in a spiral ring configuration in accordance with the present invention.
Each of fig. 1-11 is labeled as: the diamond template comprises asteel matrix 1, analloy solder layer
Detailed Description
The present invention will be described in further detail with reference to the following examples, but the present invention is not limited to the following examples. The present invention includes various alterations and modifications based on the above technical idea and common knowledge in the art, and all such alterations and modifications are intended to be included in the scope of the present invention.
The invention provides a preparation process of a brazed diamond dresser based on cluster units, which comprises the following preparation steps:
(1) Preparing raw materials: the diamond-based alloy welding material comprises a steel substrate, a plurality of cluster-shaped units, a plurality of diamonds, a binder I, a binder II, a cluster-shaped unit hole template, a diamond hole template and alloy welding materials;
(2) Cleaning one working surface of a steel matrix, and coating a layer of adhesive II for later use;
(3) Distributing a plurality of cluster units on the surface of the cluster unit hole template, wherein the cluster unit particles are embedded into holes on the surface of the cluster unit hole template and are kept fixed without being embedded and removed;
(4) Covering the working surface of the steel matrix coated with the binder II obtained in the step (2) on the surface of the cluster unit hole template distributed with the cluster units in the step (3), and then inverting the template to obtain a cluster unit matrix distributed according to the design requirement on the surface of the steel matrix;
(5) Spraying a layer of adhesive I on the surface of the steel substrate bonded with the cluster units, and then spraying alloy solder with matched granularity;
(6) Spraying a layer of adhesive I on the surface after the alloy solder is spread;
(7) A plurality of diamond particles are distributed on the surface of the diamond hole template, and the diamond particles fall into holes on the surface of the diamond hole template and are kept fixed; diamond falls into the template, and the diamond in the pit is contacted with the bottom surface of the hole;
(8) Aligning the surface of the steel substrate sprayed with the binder I after the treatment in the step (6) with a diamond hole template sprayed with diamond particles, and pressing diamond in;
(9) And (4) carrying out vacuum brazing on the integral structure obtained in the step (8), removing the diamond hole template after vacuum brazing, and then taking out the diamond hole template in an inverted manner to obtain the brazed diamond dresser based on the cluster units.
The material of the steel substrate of the dresser is a steel product, and can be 40Cr, 45 steel and Q235 steel, and particularly 304 stainless steel series can be selected.
The diamond is natural diamond or artificial diamond, mainly monocrystalline diamond or polycrystalline diamond, preferably regular octahedron or approximate regular octahedron, and can also be selected into hexahedron-octahedron aggregate shape; the grain diameter of the diamond grains is between 0.4 and 3mm, and the grain diameter difference of the diamond applied to the same trimmer is not more than 15 percent.
The top ends of the cluster-shaped units are arc concave surfaces, and the particle size of the matched diamond is smaller than the diameter of the concave surface; the shape of the cluster unit is preferably a pyramid or a cone, the bottom surface of the cluster unit is a regular polygon or a circle, and the regular polygon is preferably a regular triangle, a regular quadrangle, a regular pentagon or a regular hexagon. The diameter of the bottom surface of the cluster unit is 0.6-5 mm, the height of the cluster unit is 0.3-7 mm, and the included angle between the edge or the bus of the cluster unit and the horizontal plane is 30-75 degrees. The cluster-shaped unit can be prepared by powder metallurgy sintering, injection molding sintering and 3D laser printing sintering processes, and can also be prepared by a machining process, and the cluster-shaped unit is made of materials such as steel and stainless steel.
The material of the cluster unit hole template is silica gel, and the Shore hardness is more than 65; the surface of the cluster unit hole template is provided with a plurality of holes, the holes are in the shape of inverted pyramids or inverted cones and are matched with the cluster unit matrix, the hole diameter is 1.2-1.6 times of the diamond grain diameter, and the hole depth is 1.1-1.4 times of the diamond grain diameter; the ratio of the outer diameter of the surface of the hole to the maximum outer diameter of the cluster unit is 1:1.2 to 1.8; the aperture of the cluster unit hole template is 0.8 to 0.95 times of the diameter of the bottom surface of the cluster unit to be implanted.
The surface of the diamond hole template is provided with a plurality of holes, the holes are in a shape of inverted pyramids or inverted cones, the diamond hole template is made of a non-metal hard brittle material which can resist high temperature of more than 1200 ℃, the linear expansion coefficient does not exceed 8 multiplied by 10 < -6 >/DEG C at normal temperature, the material does not undergo chemical metallurgical reaction with nickel-based alloy solder, particularly, an alumina ceramic substrate or a silicon dioxide substrate can be adopted, and the surface flatness of the diamond hole template is not more than 0.03mm.
The cluster unit hole templates and the diamond hole templates have the same arrangement appearance of the holes on the surfaces, so that each cluster unit corresponds to each diamond position, positioning holes can be designed on the peripheries of the cluster unit templates and the hole templates for ensuring the alignment accuracy, the cluster unit templates and the hole templates are fixed through pin shafts, namely, a plurality of small holes are drilled in the same positions on the two templates, positioning pins are plugged in the holes of one template, and the other template is inserted into the holes according to the positions of the positioning pins, so that the alignment accuracy is ensured.
The arrangement appearance of the holes on the surfaces of the cluster unit hole templates and the diamond hole templates is symmetrical along the central axis, and the holes on the surfaces of the hole templates are distributed continuously or at intervals. The distribution appearance of the holes on the surfaces of the cluster unit hole template and the diamond hole template is in a dot matrix form, a concentric ring form, a radial form or a spiral line form.
The alloy solder is nickel-based alloy solder particles, particularly BNi2 grade solder is selected, the particle size of the nickel-based alloy solder particles is 30-120 meshes, and the ratio of the maximum particle size to the diamond particle size is not more than 1:3.
the adhesive I is an acrylate pressure-sensitive adhesive and an organic solvent I, and the ratio of the acrylate pressure-sensitive adhesive to the organic solvent I is 1:3 to 1:12, the adhesive II is acrylate pressure-sensitive adhesive and organic solvent II, and the volume ratio of the acrylate pressure-sensitive adhesive to the organic solvent II is 1:3 to 1:5, and the organic solvent I and the organic solvent II are acetone.
The height of the alloy solder layer embedded into the concave surfaces of the cluster-shaped units is 30-50% of the grain diameter of the diamond particles.
The brazed diamond dresser prepared in the step (9) comprises a steel matrix provided with a working surface, an alloy solder layer welded on the working surface of the steel matrix and a plurality of cluster units, wherein the top ends of the cluster units are arc concave surfaces, a diamond particle is welded at the top end of each cluster unit, the tip end of each diamond particle is upward, and the height from the top end of each diamond particle to the surface of the steel matrix is consistent;
the cluster units are distributed on the surface of the substrate in an array, annular or radial shape and are distributed on the surface of the substrate continuously or at intervals. Several surface topographies of brazed diamond conditioners prepared in accordance with the present invention are shown in fig. 8-11.
Example 1
A cluster-shaped unit diamond dresser pill is used for a combined chemical mechanical polishing pad for dressing sapphire, the outer diameter of the dresser is 20mm, the height of the dresser is 7.3mm, and the specific steps are as follows:
(1) Preparing a raw material, wherein a steel substrate of the dresser is processed and prepared by a 304 stainless steel machine, and the integral dimensional precision is controlled within 0.02 mm; the cluster-shaped unit adopts a conical structure, the diameter of the bottom surface is 2.5mm, the included angle between the side surface of the cone and the horizontal plane is 60 degrees, the diameter of the top end is 1.2mm, and the central arc is sunken;
the artificial diamond is selected from high-grade single crystal with 18/20 meshes;
the volume ratio of the acrylate to the acetone is 1:3 and 1:8, preparing two binders;
the cluster unit hole templates and the diamond hole templates are all arranged in a spiral annular mode, and the arrangement positions are consistent.
The nickel-based alloy solder is selected from BNi2 alloy solder with the granularity of 40 meshes to 60 meshes;
(2) Cleaning the surface of a substrate, and coating a layer 1:3 volume ratio of binder for standby;
(3) The cluster unit matrix is sprayed on the surface of a cluster unit hole template, the hole is in a reverse pyramid shape, and cluster unit body particles are embedded into the hole and kept fixed and are removed without embedding;
(4) Covering the matrix coated with the adhesive on the surface of the hole template, and then inverting to obtain a clustered unit matrix arranged according to the design requirement;
(5) Spraying a layer of acrylic ester and acetone on the surface of the substrate 1:8 volume ratio of the adhesive, and then spraying alloy solder with matched granularity;
(6) And spraying a layer of acrylic ester and acetone 1:8 volume ratio binder;
(7) Spraying diamond particles on the surface of the diamond hole template, wherein the hole is in a reverse pyramid shape, and the diamond particles fall into the hole and are kept fixed; diamond falls into the template, and the diamond in the pit is contacted with the bottom surface of the hole;
(8) Aligning the treated dresser basal body with the diamond hole template, and pressing the diamond in;
(9) And (3) carrying out vacuum brazing on the integral structure at the brazing temperature of 1020 ℃, heating for 25 minutes, keeping the temperature for 18 minutes, and keeping the vacuum degree in the vacuum brazing process within 0.06Pa to obtain the brazed diamond dresser based on the cluster units, wherein the appearance of the brazed diamond dresser is shown in fig. 11.
Example 2
A disk-shaped cluster-shaped unit diamond dresser is used for dressing a chemical mechanical polishing pad of a silicon wafer, the dresser has an outer diameter of 110mm, an inner hole of 65mm and a thickness of 3.6mm, and the dresser specifically comprises the following steps:
(1) Preparing a raw material, wherein a steel substrate of the dresser is processed and prepared by a 304 stainless steel machine, and the integral dimensional precision is controlled within 0.02 mm; the cluster-shaped unit adopts a conical structure, the diameter of the bottom surface is 2.0mm, the included angle between the side surface of the cone and the horizontal plane is 45 degrees, the diameter of the top end is 1.0mm, and the central circular arc is sunken;
the artificial diamond is high-grade single crystal with 30 meshes;
adhesive: the volume ratio of the acrylate to the acetone is 1:3. 1:10, preparation;
the cluster unit hole templates and the diamond hole templates are uniformly arranged in an array at the same position.
The nickel-based alloy solder is selected from BNi2 alloy solder with the granularity of 60-80 meshes;
(2) Cleaning the surface of a substrate, coating a layer 1:3 volume ratio of binder for standby;
(3) And (3) spraying the clustered unit matrix on the surface of the clustered unit hole template, wherein the hole is in the shape of an inverted pyramid, and the particles of the clustered unit body are embedded into the holes and kept fixed without being embedded.
(4) Covering the matrix coated with the adhesive on the surface of the hole template, and then inverting to obtain the clustered unit matrix arranged according to the design requirement.
(5) Spraying a layer of acrylic ester and acetone on the surface of the substrate 1:10 volume percent of adhesive, and then alloy solder with matched granularity is distributed;
(6) And spraying a layer of acrylic ester and acetone 1:10 volume ratio binder;
(7) Spraying diamond particles on the surface of the diamond hole template, wherein the hole is in a reverse pyramid shape, and the diamond particles fall into the hole and are kept fixed;
(8) Aligning the dresser basal body with the diamond hole template, and pressing the diamond in;
(9) And (3) carrying out vacuum brazing on the integral structure at the brazing temperature of 1020 ℃, heating for 25 minutes, keeping the temperature for 18 minutes, and keeping the vacuum degree in the vacuum brazing process within 0.06Pa to obtain the brazed diamond dresser based on the cluster units, wherein the appearance of the brazed diamond dresser is shown in fig. 9.
Claims (14)
1. A preparation process of a brazed diamond dresser based on cluster units is characterized by comprising the following preparation steps:
(1) Preparing raw materials: the diamond-based alloy welding material comprises a steel substrate, a plurality of cluster-shaped units, a plurality of diamonds, a binder I, a binder II, a cluster-shaped unit hole template, a diamond hole template and alloy welding materials;
(2) Cleaning one working surface of a steel matrix, and coating a layer of adhesive II for later use;
(3) Distributing a plurality of cluster units on the surface of the cluster unit hole template, wherein the cluster unit particles are embedded into holes on the surface of the cluster unit hole template and are kept fixed without being embedded and removed;
(4) Covering the working surface of the steel matrix coated with the binder II obtained in the step (2) on the surface of the cluster unit hole template distributed with the cluster units in the step (3), and then inverting the template to obtain a cluster unit matrix distributed according to the design requirement on the surface of the steel matrix;
(5) Spraying a layer of adhesive I on the surface of the steel substrate bonded with the cluster units, and then spraying alloy solder with matched granularity;
(6) Spraying a layer of adhesive I on the surface after the alloy solder is spread;
(7) Spraying a plurality of diamond particles on the surface of the diamond hole template, wherein the diamond particles fall into holes on the surface of the diamond hole template and are kept fixed; diamond falls into the template, and the diamond in the pit is contacted with the bottom surface of the hole;
(8) Aligning the surface of the steel substrate treated in the step (6) sprayed with the binder I with a diamond hole template sprayed with diamond particles, and pressing the diamond in;
(9) Performing vacuum brazing on the integral structure obtained in the step (8), removing the diamond hole template after the vacuum brazing, and then inversely taking out the diamond hole template to obtain a brazed diamond dresser based on the cluster-shaped units;
the top ends of the cluster-shaped units are arc concave surfaces and are used for supporting diamond particles, and the particle size of the matched diamond is smaller than the diameter of the concave surfaces;
the alloy solder is nickel-based alloy solder particles;
the adhesive I is an acrylate pressure-sensitive adhesive and an organic solvent I, and the ratio of the acrylate pressure-sensitive adhesive to the organic solvent I is 1:3 to 1:12, and the adhesive II is an acrylate pressure-sensitive adhesive and an organic solvent II according to a volume ratio of 1:3 to 1:5, preparing according to a volume ratio;
a plurality of holes are formed in the surface of the cluster unit hole template, and the shapes of the holes are matched with those of the cluster unit matrix; the surface of the diamond hole template is provided with a plurality of holes, and the shape of each hole is matched with the shape of the cluster unit matrix; the arrangement appearances of the holes on the surfaces of the cluster unit hole template and the diamond hole template are consistent;
and (3) when the cluster unit substrates fall into the surface of the hole template, spraying for a period of time, checking whether the cluster units are embedded in the holes of the surface, continuously spraying until no holes exist if the cluster units are embedded in the holes of the surface, and then vibrating or inclining the template for a certain angle, so that the cluster units which are not embedded in the holes slide off the surface of the template and are fixedly embedded in the holes.
2. The process of claim 1, wherein the material of said dresser steel substrate is 40Cr, 45 steel, Q235 steel or 304 stainless steel series.
3. The process of claim 1, wherein the diamond is natural diamond or synthetic diamond; the diamond is monocrystalline diamond or polycrystalline diamond, and the diamond is in a regular octahedral or hexahedral-octahedral crystal form;
the grain diameter of the diamond grains is between 0.4 and 3mm, and the grain diameter difference is not more than 15 percent.
4. The process of claim 1, wherein the shape of the cluster elements is pyramid or cone, the bottom surface of the cluster elements is regular polygon or circle, and the regular polygon is regular triangle, regular quadrangle, regular pentagon or regular hexagon;
the diameter of the bottom surface of the cluster unit is 0.6 mm-5 mm, the height of the cluster unit is 0.3 mm-7 mm, and the included angle between the edge or the bus of the cluster unit and the horizontal plane is 30-75 degrees;
the cluster unit is prepared by a powder metallurgy sintering process, an injection molding sintering process, a 3D laser printing sintering process or a machining process, and is made of steel or stainless steel materials.
5. The process according to claim 1, wherein the material of the cluster element hole templates is selected from silica gel, and the shore hardness is greater than 65;
the hole shape of the surface of the cluster unit hole template is in a reverse pyramid shape or a reverse cone shape, the aperture size is 1.2-1.6 times of the diamond particle size, and the hole depth is 1.1-1.4 times of the diamond particle size; the ratio of the outer diameter of the surface of the hole to the maximum outer diameter of the cluster unit is 1:1.2 to 1.8; the aperture of the cluster unit hole template is 0.8 to 0.95 times of the diameter of the bottom surface of the cluster unit to be implanted.
6. The process of claim 1, wherein the diamond pore template surface has a pore shape of a reverse pyramid or a reverse cone;
the diamond hole template is made of a non-metal hard and brittle material capable of resisting high temperature of more than 1200 ℃, the linear expansion coefficient does not exceed 8 multiplied by 10 < -6 >/DEG C at normal temperature, the material does not have chemical metallurgical reaction with nickel-based alloy solder, and the surface flatness of the diamond hole template is not more than 0.03mm;
the bottom surface of the hole in the diamond hole template is a plane.
7. The process of claim 6, wherein the diamond pore template is made of an alumina ceramic substrate or a silica substrate.
8. The process for preparing a brazed diamond dresser based on cluster units according to claim 1, wherein positioning holes are designed on the peripheries of the cluster unit hole templates and the diamond hole templates and are fixed through pin shafts, namely, a plurality of small holes are drilled in the same positions of the two templates, positioning pins are plugged in the holes of one template, and the other template is inserted into the holes according to the positions of the positioning pins, so that the alignment accuracy in the step (8) is ensured.
9. The process of claim 1, wherein the holes on the surfaces of the cluster unit hole templates and the diamond hole templates are symmetrically arranged along the central axis, and the holes on the surfaces of the hole templates are distributed continuously or at intervals.
10. The process for preparing a brazed diamond dresser based on cluster elements as claimed in claim 1, wherein the distribution of the pores on the surfaces of the cluster element pore templates and the diamond pore templates is in a lattice type, a concentric ring type, a radial type or a spiral line type.
11. The process of claim 1, wherein BNi2 grade solder is selected as the alloy solder, the particle size of the nickel-based alloy solder is between 30 mesh and 120 mesh, and the ratio of the maximum particle size to the diamond particle size is not greater than 1:3.
12. the process of claim 1, wherein the organic solvent I and the organic solvent II are selected from acetone.
13. The process for manufacturing a brazed diamond dresser based on cluster units according to any one of claims 1 to 12, wherein the brazed diamond dresser manufactured in the step (9) comprises a steel substrate provided with a working surface, an alloy brazing layer welded on the working surface of the steel substrate and a plurality of cluster units, the top ends of the cluster units are arc concave surfaces, one diamond particle is welded on the top end of each cluster unit, the tip end of each diamond particle faces upwards, and the top ends of the diamond particles are consistent in height from the surface of the steel substrate;
the distribution appearance of the cluster units on the surface of the substrate is consistent with the distribution appearance of the holes on the surfaces of the cluster unit hole templates and the diamond hole templates.
14. The process of claim 13, wherein the height of the alloy solder layer of the diamond particles embedded in the concave surfaces of the cluster elements in step (9) is 30-50% of the diameter of the diamond particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111270275.3ACN113894703B (en) | 2021-10-29 | 2021-10-29 | Preparation process of brazed diamond dresser based on cluster-shaped units |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111270275.3ACN113894703B (en) | 2021-10-29 | 2021-10-29 | Preparation process of brazed diamond dresser based on cluster-shaped units |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113894703A CN113894703A (en) | 2022-01-07 |
| CN113894703Btrue CN113894703B (en) | 2022-12-13 |
Family
ID=79027572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111270275.3AActiveCN113894703B (en) | 2021-10-29 | 2021-10-29 | Preparation process of brazed diamond dresser based on cluster-shaped units |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113894703B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117001535A (en)* | 2023-06-21 | 2023-11-07 | 深圳烯钻科技有限公司 | Brazed diamond trimming disc and manufacturing method thereof |
| CN116728293A (en)* | 2023-06-27 | 2023-09-12 | 宁波晶钻科技股份有限公司 | A kind of CMP dresser manufacturing method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7124753B2 (en)* | 1997-04-04 | 2006-10-24 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6368198B1 (en)* | 1999-11-22 | 2002-04-09 | Kinik Company | Diamond grid CMP pad dresser |
| CN102049737B (en)* | 2009-10-29 | 2012-08-29 | 宋健民 | Polishing pad conditioner |
| CN102172897B (en)* | 2011-02-23 | 2013-07-10 | 厦门致力金刚石科技股份有限公司 | Brazed diamond flexible abrasive disc and manufacturing method thereof |
| CN202952160U (en)* | 2012-12-11 | 2013-05-29 | 中芯国际集成电路制造(北京)有限公司 | Chemical-mechanical polishing finisher |
| CN104070469B (en)* | 2014-06-19 | 2017-04-26 | 南京航空航天大学 | Multi-abrasive collaborative arrangement process based on hole template technology |
| CN106584286B (en)* | 2016-12-21 | 2019-05-03 | 江苏索力德机电科技股份有限公司 | A kind of preparation process in super hard abrasive abrasive band and super hard abrasive abrasive band |
| CN112247863B (en)* | 2020-10-23 | 2022-05-13 | 江苏韦尔博新材料科技有限公司 | Remanufacturing process of brazed diamond grinding wheel |
| CN113043178A (en)* | 2021-03-17 | 2021-06-29 | 江苏韦尔博新材料科技有限公司 | Brazing diamond grinding and polishing sheet and preparation process thereof |
| CN113524058B (en)* | 2021-07-12 | 2022-05-03 | 华侨大学 | Single-layer diamond abrasive particle ordered arrangement brazing method for template-free furnace brazing |
- 2021
- 2021-10-29CNCN202111270275.3Apatent/CN113894703B/enactiveActive
Also Published As
| Publication number | Publication date |
|---|---|
| CN113894703A (en) | 2022-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101247923B (en) | Abrasive tool, method of manufacturing the same, and method of remanufacturing the same | |
| CN101068654B (en) | Non-planar chemical mechanical polishing pad dresser and related methods | |
| CN113894703B (en) | Preparation process of brazed diamond dresser based on cluster-shaped units | |
| JP3829092B2 (en) | Conditioner for polishing pad and method for producing the same | |
| TW200821092A (en) | Conditioning disk having uniform structures | |
| JP2006130586A (en) | Cmp conditioner and manufacturing method thereof | |
| CN201516579U (en) | Precision grinding tools | |
| CN106041741B (en) | A CMP polishing pad dresser with porous structure | |
| CN102049737A (en) | Polishing pad conditioner | |
| CN112677061A (en) | Brazed diamond grinding disc for steel grinding and preparation method thereof | |
| TWI290337B (en) | Pad conditioner for conditioning a CMP pad and method of making the same | |
| CN202088116U (en) | Diamond grinding disc | |
| TWI383860B (en) | Modular dresser | |
| CN216913433U (en) | Brazed diamond dresser based on cluster-shaped units | |
| KR100502574B1 (en) | Abrasive tools and manufacture thereof | |
| KR200175263Y1 (en) | The structure of the conditioner for CMP(Chemical Mechanical Polishing) Pad in CMP process | |
| JPH1044023A (en) | Dresser and manufacturing method thereof | |
| JP2011020182A (en) | Polishing tool suitable for pad conditioning, and polishing method using the same | |
| CN108655970A (en) | A kind of preparation of laser near-net-shape structuring diamond outer circle grinding wheel and its dressing method | |
| CN113199400A (en) | Chemical mechanical grinding polishing pad dressing device and preparation method thereof | |
| CN106078516B (en) | A kind of CMP polishing pad dresser | |
| CN116494130A (en) | Diamond trimmer for chemical mechanical planarization and processing method thereof | |
| CN216030184U (en) | Chip grinding supporting pad dresser | |
| CN212824753U (en) | Sapphire wafer and sapphire dresser for chemical mechanical polishing pad | |
| CN102990529A (en) | Two-sided repairing disc of chemical-mechanical polishing pad |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |