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CN113891552A - Circuit board assembly and electronic device - Google Patents

Circuit board assembly and electronic device
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Publication number
CN113891552A
CN113891552ACN202010624951.1ACN202010624951ACN113891552ACN 113891552 ACN113891552 ACN 113891552ACN 202010624951 ACN202010624951 ACN 202010624951ACN 113891552 ACN113891552 ACN 113891552A
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CN
China
Prior art keywords
circuit board
clip
plate
board assembly
fixing bracket
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Granted
Application number
CN202010624951.1A
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Chinese (zh)
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CN113891552B (en
Inventor
张民
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Oppo Chongqing Intelligent Technology Co Ltd
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Oppo Chongqing Intelligent Technology Co Ltd
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Priority to CN202010624951.1ApriorityCriticalpatent/CN113891552B/en
Publication of CN113891552ApublicationCriticalpatent/CN113891552A/en
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Publication of CN113891552BpublicationCriticalpatent/CN113891552B/en
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Abstract

The application discloses circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, a fixing support and a signal wire, wherein the fixing support is arranged on the upper surface of the circuit board, and a mounting gap is formed between the fixing support and the upper surface of the circuit board; the signal wire is electrically connected with the circuit board and abuts against one side of the fixing support, which is far away from the circuit board. The space utilization of the circuit board assembly is high.

Description

Circuit board assembly and electronic device
Technical Field
The present invention relates to the field of electronic product technologies, and in particular, to a circuit board assembly and an electronic device using the same.
Background
With the development of electronic technology and the increase of 5G communication frequency bands, in some electronic devices (such as smart phones, tablet computers, and the like), related components on a circuit board (such as radio frequency front end components, 5G antennas, and the like on the circuit board) will also increase. Therefore, the area and the number of layers of the circuit board in the related art are increased, which is not favorable for the design of small size, light weight and thin weight, and therefore how to improve the space utilization of the circuit board becomes a problem to be solved.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a circuit board assembly with high space utilization rate.
To achieve the above object, the present invention provides a circuit board assembly comprising:
a circuit board;
the fixing bracket is arranged on the upper surface of the circuit board, and a mounting gap is formed between the fixing bracket and the upper surface of the circuit board; and
and the signal wire is electrically connected with the circuit board and abuts against one side of the fixed support, which is far away from the circuit board.
The present invention also provides an electronic device, including a circuit board assembly, the circuit board assembly including:
a circuit board;
the fixing bracket is arranged on the upper surface of the circuit board, and a mounting gap is formed between the fixing bracket and the upper surface of the circuit board; and
and the signal wire is electrically connected with the circuit board and abuts against one side of the fixed support, which is far away from the circuit board.
The circuit board assembly of the technical scheme sets up the fixed bolster through the upper surface at the circuit board to make and form the installation clearance between the upper surface of fixed bolster and circuit board, thereby make other electronic components of circuit board assembly can install in this installation clearance. And after signal line and circuit board electric connection, then can be supported and deviate from one side of circuit board at the fixed bolster, so, the signal line can be supported by the fixed bolster after the equipment is accomplished, and other electronic components then can correspond and set up in the installation clearance of the below of signal line, even under the unchangeable circumstances of circuit board area, also can accomplish the installation to signal line and other electronic components to circuit board assembly's space utilization has been improved greatly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the exploded structure of FIG. 1;
FIG. 3 is a schematic structural diagram of a fixing bracket of a circuit board assembly according to an embodiment of the present invention;
FIG. 4 is another perspective view of the mounting bracket of FIG. 3;
FIG. 5 is a schematic cross-sectional view of one embodiment of a circuit board assembly of the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 5 at A;
fig. 7 is a schematic structural diagram of an embodiment of a card clip in the circuit board assembly of the present invention.
The reference numbers illustrate:
Figure BDA0002565399320000021
Figure BDA0002565399320000031
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present application provides acircuit board assembly 1000.
Referring to fig. 1 and fig. 2 in combination, in the embodiment of the present application, thecircuit board assembly 1000 includes acircuit board 10, afixing bracket 20, and asignal line 30. Wherein, thefixed bracket 20 is arranged on the upper surface of thecircuit board 10, and a mounting gap is formed between the fixed bracket and the upper surface of thecircuit board 10; thesignal line 30 is electrically connected to thecircuit board 10 and abuts against a side of thefixing bracket 20 away from thecircuit board 10.
Thecircuit board 10 may be designed in various shapes such as a rectangle, a circle, an ellipse, and the like. Thesignal line 30 may be a radio frequency signal transmission line for transmitting a radio frequency signal by using the radiofrequency signal line 30, or thesignal line 30 may be a data transmission line of the sensor for transmitting data collected by the sensor to a corresponding processor for processing by using the data transmission line.
Themounting bracket 20 may be used to support thesignal lines 30 so that thesignal lines 30 can be elevated a distance above thecircuit board 10 without interfering with and interfering with the mounting of other components (e.g., rf front-end components, 5G antennas, etc.) in thecircuit board 10 in the mounting gap between thecircuit board 10 and themounting bracket 20. In addition, thefixing bracket 20 can cover and protect other components mounted in the mounting gap. It should be noted that, in the present application, thefixing bracket 20 may be made of a plastic material, on one hand, the weight of the plastic part is light, and thesignal line 30 is supported without damaging thecircuit board 10 and other electronic components; on the other hand, the plastic material has good insulating property and better safety.
Therefore, in thecircuit board assembly 1000 according to the present invention, thefixing bracket 20 is disposed on the upper surface of thecircuit board 10, and a mounting gap is formed between thefixing bracket 20 and the upper surface of thecircuit board 10, so that other electronic components of thecircuit board assembly 1000 can be mounted in the mounting gap. And after thesignal line 30 and thecircuit board 10 are electrically connected, thesignal line 30 can be supported on one side of thefixing support 20 departing from thecircuit board 10, so that thesignal line 30 can be supported by thefixing support 20 after the assembly is completed, and other electronic components can be correspondingly arranged in the mounting gap below thesignal line 30, and even if the area of thecircuit board 10 is not changed, the mounting of thesignal line 30 and other electronic components can be completed, so that the space utilization rate of thecircuit board assembly 1000 is greatly improved.
Referring to fig. 3 and 4 in combination, in an embodiment of the present application, thefixing bracket 20 includes aconnection section 21 and a raisedsection 22 connected to theconnection section 21, theconnection section 21 is connected to thecircuit board 10, and a mounting gap is formed between a side of the raisedsection 22 facing thecircuit board 10 and an upper surface of thecircuit board 10.
In the above embodiment, the connectingsection 21 and thearching section 22 may be formed as a unitary structure to ensure good structural strength between the connectingsection 21 and thearching section 22 and facilitate the machining. Theconnection section 21 may be detachably connected or fixedly connected to thecircuit board 10. In practical application, after the connectingsection 21 is connected to thecircuit board 10, the connectingsection 21 and thearching section 22 can support thesignal line 30 together, and thearching section 22 is higher than the connectingsection 21, so that a certain distance is formed between thearching section 22 and thecircuit board 10 to form a mounting gap, and other components can be mounted, so that thesignal line 30 can be stably supported, meanwhile, the mounting gap can be reserved between thearching section 22 and thecircuit board 10 to mount electronic components, and the area of thecircuit board 10 is ensured to be utilized to the maximum.
Based on the above-mentioned embodiment, in the present application, thefixing bracket 20 further includes a supportingsection 23, and the supportingsection 23 is connected to an end of thearching section 22 away from the connectingsection 21 and abuts against the upper surface of thecircuit board 10. Specifically, the supportingsection 23 may be formed as an integral structure with thearching section 22 to ensure good structural strength between the supportingsection 23 and thearching section 22 and to facilitate the process molding, and the supportingsection 23, thearching section 22 and the connectingsection 21 are sequentially connected to form a "several" shape. Through setting up thesupport section 23 for can utilizesupport section 23 andlinkage segment 21 to support and fix, the both ends atress ofarching section 22 is balanced, andlinkage segment 21 andarching section 22 can receive firm support when raisingsignal line 30, are favorable to other electronic components's installation.
Referring to fig. 4, in the present application, the number of theconnection sections 21 and the number of thearch sections 22 are two, respectively, and thesupport section 23 is located at a position between the twoarch sections 22, that is, onearch section 22 and oneconnection section 21 are provided at both ends of thesupport section 23, respectively, so that thefixing bracket 20 is formed in a double "zigzag" shape, thus ensuring a sufficient mounting gap between thefixing bracket 20 and thecircuit board 10 for mounting electronic components. It is understood that the number of the connectingsections 21, thearching sections 22 and the supportingsections 23 can be designed more adaptively according to the length ofdifferent signal wires 30.
With reference to fig. 4, in an embodiment of the present application, alimiting post 24 is protruded from one side of the supportingsection 23 and/or the connectingsection 21 facing thecircuit board 10, thecircuit board 10 is provided with alimiting hole 11, and the limitingpost 24 is inserted into thelimiting hole 11.
In the above embodiment, thelimiting column 24 may be a circular column or a square column, thelimiting column 24 may be integrated with the supportingsection 23 and the connectingsection 21, and the height of thelimiting column 24 may be designed to be adaptive according to the height of the installation gap. By arranging thelimiting columns 24 and the limitingholes 11, when thefixing support 20 is installed on thecircuit board 10, the fixing support can be pre-fixed through the matching of thelimiting columns 24 and the limitingholes 11, so that subsequent installation operation is facilitated, connection between thefixing support 20 and thecircuit board 10 is firmer, and thefixing support 20 cannot be easily loosened to damage other electronic components on thecircuit board 10.
In order to make thefixing bracket 20 detachably connect thecircuit board 10 for easy dismounting and maintenance, in an embodiment of the present application, thecircuit board assembly 1000 includes a connectingmember 40, the connectingsection 21 has a first connectinghole 211, thecircuit board 10 has a second connectinghole 12 corresponding to the first connectinghole 211, and the connectingmember 40 is inserted into the first connectinghole 211 and the second connectinghole 12.
Specifically, the connectingmember 40 may be a screw member or a rivet member, and the first connectinghole 211 and the second connectinghole 12 may be corresponding to a screw hole or a rivet hole, so that the connectingsection 21 may be detachably fixed to thecircuit board 10 by using a screw connection or rivet connection manner, and the dismounting operation is simple and convenient. Of course, in other embodiments, theconnection section 21 and thecircuit board 10 may be detachably fixed by a snap connection structure, which is not described in detail in this application.
Referring to fig. 3, in the embodiment of the present application, a side of thefixing bracket 20 facing away from thecircuit board 10 is recessed to form awiring groove 20a, and thesignal line 30 is at least partially received in thewiring groove 20 a. By such arrangement, when thesignal wire 30 is supported on thefixing bracket 20 in a propping manner, the signal wire can be accommodated in thewiring groove 20a for limiting, so that thesignal wire 30 and thefixing bracket 20 can be kept stable, and the signal wire is not easy to be disconnected to interfere with other electronic components on thecircuit board 10 in the using process.
Based on the above embodiments, in the present application, thefixing bracket 20 is provided with a clamping block at the edge of thewiring groove 20a for clamping thesignal wire 30. Wherein, press from both sides tight piece and can set up two in the both sides edge oftrough 20a is relative to, press from both sides tight piece and can set up many places along the extending direction oftrough 20a to whensignal line 30 arranges the line alongtrough 20a, can also press from both sides tightly by the tight piece of clamp, further guaranteed the stability of being connected betweensignal line 30 and the fixedbolster 20,signal line 30 is difficult to the off-line.
Referring to fig. 5 to fig. 7, in an embodiment of thecircuit board assembly 1000 of the present application, thecircuit board assembly 1000 further includes awire clip 50, thefixing bracket 20 is formed with an avoidinghole 26, thewire clip 50 is disposed through the avoidinghole 26, a portion of thewire clip 50 is exposed out of thefixing bracket 20 for clamping thesignal wire 30, and a portion of the wire clip abuts against thecircuit board 10 and is electrically connected to a ground electrode of thecircuit board 10.
Thewire clamping clip 50 may be a metal member, the avoidinghole 26 may be disposed at the bottom of thewiring groove 20a of thefixing bracket 20, so that the top of thewire clamping clip 50 may extend out of thewiring groove 20a via the avoidinghole 26, and the bottom of thewire clamping clip 50 may be fixed to thefixing bracket 20 and abut against thecircuit board 10. When thesignal line 30 is arranged through thewiring groove 20a, on the one hand, thesignal line 30 can be clamped and fixed by theclamping wire clamp 50, on the other hand, thesignal line 30 can be grounded through theclamping wire clamp 50, and theclamping wire clamp 50 does not need to be directly fixed on thecircuit board 10 and is fixed by thefixing support 20, so that the problems of space utilization rate of thecircuit board 10 and fastening and grounding of thesignal line 30 are solved.
Based on the above embodiment, referring to fig. 7, in the present application, theclip 50 includes afirst clip 51, asecond clip 52 and a fixingplate 53, thefirst clip 51 and thesecond clip 52 are disposed opposite to each other and fixed to the fixingplate 53, thefirst clip 51 and thesecond clip 52 are disposed through the avoidinghole 26, thesignal line 30 is clipped between thefirst clip 51 and thesecond clip 52, the fixingplate 53 is connected to thefirst clip 51 and thesecond clip 52 and located below thefirst clip 51 and thesecond clip 52, and the fixingplate 53 abuts against thecircuit board 10 and is electrically connected to the ground pole of thecircuit board 10.
In this embodiment, thefirst locking plate 51 and thesecond locking plate 52 may be plate bodies having the same shape and size and certain elasticity, so that the portions of thefirst locking plate 51 and thesecond locking plate 52 exposed out of the fixingbracket 20 through the avoidinghole 26 can elastically lock thesignal line 30, so that thesignal line 30 is locked. The bottom surface of the supportingsection 23 in the fixingbracket 20 is attached to the fixingplate 53, one side of the fixingplate 53 away from the supportingsection 23 is abutted to thecircuit board 10, so that thesignal line 30 can be grounded through thefirst clamping plate 51, thesecond clamping plate 52 and the fixingplate 53 and thecircuit board 10, and thesignal line 30 can be clamped and conveniently grounded.
In order to enable thesignal line 30 to be grounded while being clamped, in an embodiment of the present application, thewire clamping clamp 50 further includes a first connectingplate 54 and a second connectingplate 55, the first connectingplate 54 connects thefirst clamping plate 51 and thesecond clamping plate 52, one side of the second connectingplate 55 is connected to a side of thesecond clamping plate 52 away from thefirst clamping plate 51 in a bending manner, and the other side of the second connectingplate 55 is connected to the fixingplate 53.
Thefirst chucking plate 51, the first connectingplate 54, thesecond chucking plate 52, the second connectingplate 55, and the fixingplate 53 may be provided as an integrated structure to ensure structural stability of the chuckingclip 50 while facilitating process molding. The firstengaging plate 51 and the second engagingplate 52 may be respectively formed by bending and extending two opposite sides of the first connectingplate 54, so that one sides of the first engagingplate 51 and the second engagingplate 52 away from the first connectingplate 54 form free ends, and the free ends are exposed out of the fixingbracket 20 for fastening thesignal line 30. The second connectingplate 55 connects the fixingplate 53 with thesecond card 52 so that thesignal lines 30 can be grounded through thesecond card 52, the second connectingplate 55 and the fixingplate 53. Therefore, thesignal lines 30 can be installed on the surface of thecircuit board 10 at intervals, so that the space is reserved for installing other electronic components, meanwhile, the signal lines can be conveniently connected to the ground pole of thecircuit board 10, and the structure design is reasonable and simple.
Of course, in another embodiment, thefirst card 51 and thesecond card 52 may also be directly protruded from the surface of the fixingplate 53 facing away from thecircuit board 10, so that thesignal wires 30 can be clamped and grounded.
With continued reference to fig. 7, in an embodiment of the present application, the distance between thefirst card 51 and thesecond card 52 gradually decreases in a direction away from the fixingplate 53. So set up forsignal line 30 is behind the chucking, when producing the trend of pine and taking off, can be held byfirst cardboard 51 andsecond cardboard 52 and fasten more, andsignal line 30 is difficult for deviating from.
Further, the side of thefirst card 51 that deviates from thesecond card 52 is bent and extended to form a reinforcingplate 511, and the reinforcingplate 511 is located on the side of thefirst card 51 that is far away from the fixingplate 53. Through the reinforcingplate 511, the free end of thefirst clamping plate 51 is not easy to deform or lose efficacy in the opening and closing process, and thesignal wire 30 is clamped.
Further, in the present application, two clampingplates 56 are protruded from a side of the fixingplate 53 facing away from thecircuit board 10, and the two clampingplates 56 are disposed opposite to each other and used for clamping the fixingbracket 20. In this embodiment, when the fixingbracket 20 abuts against the fixingplate 53, the fixing bracket can be clamped and fixed by the two clampingplates 56, so that the clampingclip 50 and the fixingbracket 20 can be stably connected, the clampingclip 50 is fixed by the fixingbracket 20 without being directly fixed to thecircuit board 10, and the problems of space utilization rate of thecircuit board 10, fastening of thesignal line 30 and grounding are solved.
In an embodiment of the present application, the surface of thecircuit board 10 further has aconductive layer 13, and theclip 50 abuts against theconductive layer 13 and is electrically connected to the ground of thecircuit board 10. Theconductive layer 13 may be a conductive cloth or a conductive coating disposed on the surface of thecircuit board 10. By providing theconductive layer 13, the fixingplate 53 of theclip 50 can be brought into contact with theconductive layer 13 after being fastened to the fixingbracket 20, thereby ensuring that thesignal line 30 can be grounded well by theclip 50.
In another embodiment of the present application, thecircuit board assembly 1000 further includes a pressing bracket (not shown) disposed above the fixingbracket 20 and used for pressing the fixingbracket 20 against the upper surface of thecircuit board 10. In this embodiment, the pressing bracket may be made of a plastic material, and the pressing bracket may directly abut against the fixingbracket 20, or indirectly abut against the fixingbracket 20 by abutting againstother circuit boards 10, so that the pressing bracket may press thecircuit board 10 through the fixingbracket 20, thereby making the grounding effect of thecircuit board 10 better.
The invention also provides an electronic device, which can be a smart phone, a tablet computer and other devices, and can also be a game device, an AR (Augmented Reality) device, an automobile device, a data storage device, an audio playing device, a video playing device, a notebook computer, a desktop computing device and the like. The electronic device includes acircuit board assembly 1000, the specific structure of thecircuit board assembly 1000 refers to the above embodiments, and since the electronic device adopts all the technical solutions of all the above embodiments, the electronic device at least has all the beneficial effects brought by the technical solutions of the above embodiments, and no further description is given here
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (14)

1. A circuit board assembly, comprising:
a circuit board;
the fixing bracket is arranged on the upper surface of the circuit board, and a mounting gap is formed between the fixing bracket and the upper surface of the circuit board; and
and the signal wire is electrically connected with the circuit board and abuts against one side of the fixed support, which is far away from the circuit board.
2. The circuit board assembly of claim 1, wherein the fixing bracket includes a connection section and a raised section connected to the connection section, the connection section being connected to the circuit board, the raised section having the mounting gap formed between a side thereof facing the circuit board and an upper surface of the circuit board.
3. The circuit board assembly of claim 2, wherein the fixing bracket further comprises a supporting section, the supporting section is connected to an end of the arching section away from the connecting section and abuts against an upper surface of the circuit board.
4. The circuit board assembly of claim 3, wherein a limiting post is convexly disposed on one side of the supporting section and/or the connecting section facing the circuit board, the circuit board is provided with a limiting hole, and the limiting post is inserted into the limiting hole.
5. The circuit board assembly of claim 2, wherein the circuit board assembly comprises a connecting member, the connecting section defines a first connecting hole, the circuit board defines a second connecting hole corresponding to the first connecting hole, and the connecting member is disposed through the first connecting hole and the second connecting hole.
6. The circuit board assembly of claim 1, wherein a side of the mounting bracket facing away from the circuit board is recessed with a routing channel, the signal wires being at least partially received within the routing channel.
7. The circuit board assembly of claim 6, wherein the fixing bracket is provided with a clamping block at an edge of the wiring groove to clamp the signal wire.
8. The circuit board assembly according to any one of claims 1 to 7, further comprising a clip, wherein the fixing bracket has an avoiding hole, the clip is inserted into the avoiding hole, a portion of the clip is exposed out of the fixing bracket for clamping the signal line, and a portion of the clip abuts against the circuit board and is electrically connected to a ground electrode of the circuit board.
9. The circuit board assembly of claim 8, wherein the clip comprises a first clip, a second clip and a fixing plate, the first clip and the second clip are disposed opposite to each other and fixed to the fixing plate, the first clip and the second clip are disposed through the avoiding hole, and the signal line is clamped between the first clip and the second clip;
the fixing plate is connected to the first clamping plate and the second clamping plate and located below the first clamping plate and the second clamping plate, and the fixing plate abuts against the circuit board and is electrically connected with the ground pole of the circuit board.
10. The circuit board assembly of claim 9, wherein the card clip further comprises a first connecting plate and a second connecting plate, the first connecting plate connects the first card and the second card, one side of the second connecting plate is connected to a side of the second card facing away from the first card in a bent manner, and the other side of the second connecting plate is connected to the fixing plate.
11. The circuit board assembly of claim 9, wherein a distance between the first card and the second card gradually decreases in a direction away from the fixing plate;
and/or one side of the first clamping plate, which is far away from the second clamping plate, is bent and extended to form a reinforcing plate, and the reinforcing plate is positioned on one side of the first clamping plate, which is far away from the fixed plate;
and/or one side of the fixed plate, which is back to the circuit board, is convexly provided with two clamping plates, and the two clamping plates are oppositely arranged and are used for clamping the fixed support.
12. The circuit board assembly of claim 8, wherein the surface of the circuit board further comprises a conductive layer, and the wire clamp abuts against the conductive layer and is electrically connected to the ground of the circuit board.
13. The circuit board assembly according to any one of claims 1 to 7, further comprising a pressing bracket disposed above the fixing bracket and configured to press the fixing bracket against the upper surface of the circuit board.
14. An electronic device, characterized in that the electronic device comprises a circuit board assembly according to any one of claims 1 to 13.
CN202010624951.1A2020-07-012020-07-01Circuit board assembly and electronic equipmentActiveCN113891552B (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN202010624951.1ACN113891552B (en)2020-07-012020-07-01Circuit board assembly and electronic equipment

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN202010624951.1ACN113891552B (en)2020-07-012020-07-01Circuit board assembly and electronic equipment

Publications (2)

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CN113891552Atrue CN113891552A (en)2022-01-04
CN113891552B CN113891552B (en)2023-05-23

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Citations (8)

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Publication numberPriority datePublication dateAssigneeTitle
US20020051346A1 (en)*2000-10-262002-05-02International Business Machines CorporationComputer system, electronic circuit board, and card
US20040155724A1 (en)*2003-02-072004-08-12Harris CorporationMicrowave device having a slotted coaxial cable-to-microstrip connection and related methods
JP2005303798A (en)*2004-04-142005-10-27Hitachi Cable Ltd Optical communication device
JP2013135000A (en)*2011-12-232013-07-08Denso CorpPower conversion device
US20170290184A1 (en)*2016-04-012017-10-05Samsung Electronics Co., Ltd.Printed circuit board and electronic device including the same
US9848493B1 (en)*2016-12-092017-12-19Foxconn Interconnect Technology LimitedPrinted circuit board having improved high speed transmission lines
US20190297722A1 (en)*2017-02-202019-09-26Murata Manufacturing Co., Ltd.Electronic device
CN110797678A (en)*2019-11-182020-02-14Oppo广东移动通信有限公司 Wire clips, circuit board assemblies and electronic equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20020051346A1 (en)*2000-10-262002-05-02International Business Machines CorporationComputer system, electronic circuit board, and card
US20040155724A1 (en)*2003-02-072004-08-12Harris CorporationMicrowave device having a slotted coaxial cable-to-microstrip connection and related methods
JP2005303798A (en)*2004-04-142005-10-27Hitachi Cable Ltd Optical communication device
JP2013135000A (en)*2011-12-232013-07-08Denso CorpPower conversion device
US20170290184A1 (en)*2016-04-012017-10-05Samsung Electronics Co., Ltd.Printed circuit board and electronic device including the same
US9848493B1 (en)*2016-12-092017-12-19Foxconn Interconnect Technology LimitedPrinted circuit board having improved high speed transmission lines
US20190297722A1 (en)*2017-02-202019-09-26Murata Manufacturing Co., Ltd.Electronic device
CN110797678A (en)*2019-11-182020-02-14Oppo广东移动通信有限公司 Wire clips, circuit board assemblies and electronic equipment

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