Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present application provides acircuit board assembly 1000.
Referring to fig. 1 and fig. 2 in combination, in the embodiment of the present application, thecircuit board assembly 1000 includes acircuit board 10, afixing bracket 20, and asignal line 30. Wherein, thefixed bracket 20 is arranged on the upper surface of thecircuit board 10, and a mounting gap is formed between the fixed bracket and the upper surface of thecircuit board 10; thesignal line 30 is electrically connected to thecircuit board 10 and abuts against a side of thefixing bracket 20 away from thecircuit board 10.
Thecircuit board 10 may be designed in various shapes such as a rectangle, a circle, an ellipse, and the like. Thesignal line 30 may be a radio frequency signal transmission line for transmitting a radio frequency signal by using the radiofrequency signal line 30, or thesignal line 30 may be a data transmission line of the sensor for transmitting data collected by the sensor to a corresponding processor for processing by using the data transmission line.
Themounting bracket 20 may be used to support thesignal lines 30 so that thesignal lines 30 can be elevated a distance above thecircuit board 10 without interfering with and interfering with the mounting of other components (e.g., rf front-end components, 5G antennas, etc.) in thecircuit board 10 in the mounting gap between thecircuit board 10 and themounting bracket 20. In addition, thefixing bracket 20 can cover and protect other components mounted in the mounting gap. It should be noted that, in the present application, thefixing bracket 20 may be made of a plastic material, on one hand, the weight of the plastic part is light, and thesignal line 30 is supported without damaging thecircuit board 10 and other electronic components; on the other hand, the plastic material has good insulating property and better safety.
Therefore, in thecircuit board assembly 1000 according to the present invention, thefixing bracket 20 is disposed on the upper surface of thecircuit board 10, and a mounting gap is formed between thefixing bracket 20 and the upper surface of thecircuit board 10, so that other electronic components of thecircuit board assembly 1000 can be mounted in the mounting gap. And after thesignal line 30 and thecircuit board 10 are electrically connected, thesignal line 30 can be supported on one side of thefixing support 20 departing from thecircuit board 10, so that thesignal line 30 can be supported by thefixing support 20 after the assembly is completed, and other electronic components can be correspondingly arranged in the mounting gap below thesignal line 30, and even if the area of thecircuit board 10 is not changed, the mounting of thesignal line 30 and other electronic components can be completed, so that the space utilization rate of thecircuit board assembly 1000 is greatly improved.
Referring to fig. 3 and 4 in combination, in an embodiment of the present application, thefixing bracket 20 includes aconnection section 21 and a raisedsection 22 connected to theconnection section 21, theconnection section 21 is connected to thecircuit board 10, and a mounting gap is formed between a side of the raisedsection 22 facing thecircuit board 10 and an upper surface of thecircuit board 10.
In the above embodiment, the connectingsection 21 and thearching section 22 may be formed as a unitary structure to ensure good structural strength between the connectingsection 21 and thearching section 22 and facilitate the machining. Theconnection section 21 may be detachably connected or fixedly connected to thecircuit board 10. In practical application, after the connectingsection 21 is connected to thecircuit board 10, the connectingsection 21 and thearching section 22 can support thesignal line 30 together, and thearching section 22 is higher than the connectingsection 21, so that a certain distance is formed between thearching section 22 and thecircuit board 10 to form a mounting gap, and other components can be mounted, so that thesignal line 30 can be stably supported, meanwhile, the mounting gap can be reserved between thearching section 22 and thecircuit board 10 to mount electronic components, and the area of thecircuit board 10 is ensured to be utilized to the maximum.
Based on the above-mentioned embodiment, in the present application, thefixing bracket 20 further includes a supportingsection 23, and the supportingsection 23 is connected to an end of thearching section 22 away from the connectingsection 21 and abuts against the upper surface of thecircuit board 10. Specifically, the supportingsection 23 may be formed as an integral structure with thearching section 22 to ensure good structural strength between the supportingsection 23 and thearching section 22 and to facilitate the process molding, and the supportingsection 23, thearching section 22 and the connectingsection 21 are sequentially connected to form a "several" shape. Through setting up thesupport section 23 for can utilizesupport section 23 andlinkage segment 21 to support and fix, the both ends atress ofarching section 22 is balanced, andlinkage segment 21 andarching section 22 can receive firm support when raisingsignal line 30, are favorable to other electronic components's installation.
Referring to fig. 4, in the present application, the number of theconnection sections 21 and the number of thearch sections 22 are two, respectively, and thesupport section 23 is located at a position between the twoarch sections 22, that is, onearch section 22 and oneconnection section 21 are provided at both ends of thesupport section 23, respectively, so that thefixing bracket 20 is formed in a double "zigzag" shape, thus ensuring a sufficient mounting gap between thefixing bracket 20 and thecircuit board 10 for mounting electronic components. It is understood that the number of the connectingsections 21, thearching sections 22 and the supportingsections 23 can be designed more adaptively according to the length ofdifferent signal wires 30.
With reference to fig. 4, in an embodiment of the present application, alimiting post 24 is protruded from one side of the supportingsection 23 and/or the connectingsection 21 facing thecircuit board 10, thecircuit board 10 is provided with alimiting hole 11, and the limitingpost 24 is inserted into thelimiting hole 11.
In the above embodiment, thelimiting column 24 may be a circular column or a square column, thelimiting column 24 may be integrated with the supportingsection 23 and the connectingsection 21, and the height of thelimiting column 24 may be designed to be adaptive according to the height of the installation gap. By arranging thelimiting columns 24 and the limitingholes 11, when thefixing support 20 is installed on thecircuit board 10, the fixing support can be pre-fixed through the matching of thelimiting columns 24 and the limitingholes 11, so that subsequent installation operation is facilitated, connection between thefixing support 20 and thecircuit board 10 is firmer, and thefixing support 20 cannot be easily loosened to damage other electronic components on thecircuit board 10.
In order to make thefixing bracket 20 detachably connect thecircuit board 10 for easy dismounting and maintenance, in an embodiment of the present application, thecircuit board assembly 1000 includes a connectingmember 40, the connectingsection 21 has a first connectinghole 211, thecircuit board 10 has a second connectinghole 12 corresponding to the first connectinghole 211, and the connectingmember 40 is inserted into the first connectinghole 211 and the second connectinghole 12.
Specifically, the connectingmember 40 may be a screw member or a rivet member, and the first connectinghole 211 and the second connectinghole 12 may be corresponding to a screw hole or a rivet hole, so that the connectingsection 21 may be detachably fixed to thecircuit board 10 by using a screw connection or rivet connection manner, and the dismounting operation is simple and convenient. Of course, in other embodiments, theconnection section 21 and thecircuit board 10 may be detachably fixed by a snap connection structure, which is not described in detail in this application.
Referring to fig. 3, in the embodiment of the present application, a side of thefixing bracket 20 facing away from thecircuit board 10 is recessed to form awiring groove 20a, and thesignal line 30 is at least partially received in thewiring groove 20 a. By such arrangement, when thesignal wire 30 is supported on thefixing bracket 20 in a propping manner, the signal wire can be accommodated in thewiring groove 20a for limiting, so that thesignal wire 30 and thefixing bracket 20 can be kept stable, and the signal wire is not easy to be disconnected to interfere with other electronic components on thecircuit board 10 in the using process.
Based on the above embodiments, in the present application, thefixing bracket 20 is provided with a clamping block at the edge of thewiring groove 20a for clamping thesignal wire 30. Wherein, press from both sides tight piece and can set up two in the both sides edge oftrough 20a is relative to, press from both sides tight piece and can set up many places along the extending direction oftrough 20a to whensignal line 30 arranges the line alongtrough 20a, can also press from both sides tightly by the tight piece of clamp, further guaranteed the stability of being connected betweensignal line 30 and the fixedbolster 20,signal line 30 is difficult to the off-line.
Referring to fig. 5 to fig. 7, in an embodiment of thecircuit board assembly 1000 of the present application, thecircuit board assembly 1000 further includes awire clip 50, thefixing bracket 20 is formed with an avoidinghole 26, thewire clip 50 is disposed through the avoidinghole 26, a portion of thewire clip 50 is exposed out of thefixing bracket 20 for clamping thesignal wire 30, and a portion of the wire clip abuts against thecircuit board 10 and is electrically connected to a ground electrode of thecircuit board 10.
Thewire clamping clip 50 may be a metal member, the avoidinghole 26 may be disposed at the bottom of thewiring groove 20a of thefixing bracket 20, so that the top of thewire clamping clip 50 may extend out of thewiring groove 20a via the avoidinghole 26, and the bottom of thewire clamping clip 50 may be fixed to thefixing bracket 20 and abut against thecircuit board 10. When thesignal line 30 is arranged through thewiring groove 20a, on the one hand, thesignal line 30 can be clamped and fixed by theclamping wire clamp 50, on the other hand, thesignal line 30 can be grounded through theclamping wire clamp 50, and theclamping wire clamp 50 does not need to be directly fixed on thecircuit board 10 and is fixed by thefixing support 20, so that the problems of space utilization rate of thecircuit board 10 and fastening and grounding of thesignal line 30 are solved.
Based on the above embodiment, referring to fig. 7, in the present application, theclip 50 includes afirst clip 51, asecond clip 52 and a fixingplate 53, thefirst clip 51 and thesecond clip 52 are disposed opposite to each other and fixed to the fixingplate 53, thefirst clip 51 and thesecond clip 52 are disposed through the avoidinghole 26, thesignal line 30 is clipped between thefirst clip 51 and thesecond clip 52, the fixingplate 53 is connected to thefirst clip 51 and thesecond clip 52 and located below thefirst clip 51 and thesecond clip 52, and the fixingplate 53 abuts against thecircuit board 10 and is electrically connected to the ground pole of thecircuit board 10.
In this embodiment, thefirst locking plate 51 and thesecond locking plate 52 may be plate bodies having the same shape and size and certain elasticity, so that the portions of thefirst locking plate 51 and thesecond locking plate 52 exposed out of the fixingbracket 20 through the avoidinghole 26 can elastically lock thesignal line 30, so that thesignal line 30 is locked. The bottom surface of the supportingsection 23 in the fixingbracket 20 is attached to the fixingplate 53, one side of the fixingplate 53 away from the supportingsection 23 is abutted to thecircuit board 10, so that thesignal line 30 can be grounded through thefirst clamping plate 51, thesecond clamping plate 52 and the fixingplate 53 and thecircuit board 10, and thesignal line 30 can be clamped and conveniently grounded.
In order to enable thesignal line 30 to be grounded while being clamped, in an embodiment of the present application, thewire clamping clamp 50 further includes a first connectingplate 54 and a second connectingplate 55, the first connectingplate 54 connects thefirst clamping plate 51 and thesecond clamping plate 52, one side of the second connectingplate 55 is connected to a side of thesecond clamping plate 52 away from thefirst clamping plate 51 in a bending manner, and the other side of the second connectingplate 55 is connected to the fixingplate 53.
Thefirst chucking plate 51, the first connectingplate 54, thesecond chucking plate 52, the second connectingplate 55, and the fixingplate 53 may be provided as an integrated structure to ensure structural stability of the chuckingclip 50 while facilitating process molding. The firstengaging plate 51 and the second engagingplate 52 may be respectively formed by bending and extending two opposite sides of the first connectingplate 54, so that one sides of the first engagingplate 51 and the second engagingplate 52 away from the first connectingplate 54 form free ends, and the free ends are exposed out of the fixingbracket 20 for fastening thesignal line 30. The second connectingplate 55 connects the fixingplate 53 with thesecond card 52 so that thesignal lines 30 can be grounded through thesecond card 52, the second connectingplate 55 and the fixingplate 53. Therefore, thesignal lines 30 can be installed on the surface of thecircuit board 10 at intervals, so that the space is reserved for installing other electronic components, meanwhile, the signal lines can be conveniently connected to the ground pole of thecircuit board 10, and the structure design is reasonable and simple.
Of course, in another embodiment, thefirst card 51 and thesecond card 52 may also be directly protruded from the surface of the fixingplate 53 facing away from thecircuit board 10, so that thesignal wires 30 can be clamped and grounded.
With continued reference to fig. 7, in an embodiment of the present application, the distance between thefirst card 51 and thesecond card 52 gradually decreases in a direction away from the fixingplate 53. So set up forsignal line 30 is behind the chucking, when producing the trend of pine and taking off, can be held byfirst cardboard 51 andsecond cardboard 52 and fasten more, andsignal line 30 is difficult for deviating from.
Further, the side of thefirst card 51 that deviates from thesecond card 52 is bent and extended to form a reinforcingplate 511, and the reinforcingplate 511 is located on the side of thefirst card 51 that is far away from the fixingplate 53. Through the reinforcingplate 511, the free end of thefirst clamping plate 51 is not easy to deform or lose efficacy in the opening and closing process, and thesignal wire 30 is clamped.
Further, in the present application, two clampingplates 56 are protruded from a side of the fixingplate 53 facing away from thecircuit board 10, and the two clampingplates 56 are disposed opposite to each other and used for clamping the fixingbracket 20. In this embodiment, when the fixingbracket 20 abuts against the fixingplate 53, the fixing bracket can be clamped and fixed by the two clampingplates 56, so that the clampingclip 50 and the fixingbracket 20 can be stably connected, the clampingclip 50 is fixed by the fixingbracket 20 without being directly fixed to thecircuit board 10, and the problems of space utilization rate of thecircuit board 10, fastening of thesignal line 30 and grounding are solved.
In an embodiment of the present application, the surface of thecircuit board 10 further has aconductive layer 13, and theclip 50 abuts against theconductive layer 13 and is electrically connected to the ground of thecircuit board 10. Theconductive layer 13 may be a conductive cloth or a conductive coating disposed on the surface of thecircuit board 10. By providing theconductive layer 13, the fixingplate 53 of theclip 50 can be brought into contact with theconductive layer 13 after being fastened to the fixingbracket 20, thereby ensuring that thesignal line 30 can be grounded well by theclip 50.
In another embodiment of the present application, thecircuit board assembly 1000 further includes a pressing bracket (not shown) disposed above the fixingbracket 20 and used for pressing the fixingbracket 20 against the upper surface of thecircuit board 10. In this embodiment, the pressing bracket may be made of a plastic material, and the pressing bracket may directly abut against the fixingbracket 20, or indirectly abut against the fixingbracket 20 by abutting againstother circuit boards 10, so that the pressing bracket may press thecircuit board 10 through the fixingbracket 20, thereby making the grounding effect of thecircuit board 10 better.
The invention also provides an electronic device, which can be a smart phone, a tablet computer and other devices, and can also be a game device, an AR (Augmented Reality) device, an automobile device, a data storage device, an audio playing device, a video playing device, a notebook computer, a desktop computing device and the like. The electronic device includes acircuit board assembly 1000, the specific structure of thecircuit board assembly 1000 refers to the above embodiments, and since the electronic device adopts all the technical solutions of all the above embodiments, the electronic device at least has all the beneficial effects brought by the technical solutions of the above embodiments, and no further description is given here
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.