CN113838378A - Display module and display device - Google Patents
Display module and display deviceDownload PDFInfo
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- CN113838378A CN113838378ACN202111080439.6ACN202111080439ACN113838378ACN 113838378 ACN113838378 ACN 113838378ACN 202111080439 ACN202111080439 ACN 202111080439ACN 113838378 ACN113838378 ACN 113838378A
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- display module
- display panel
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a display device.
Background
Along with the improvement of the performance requirement of the display product by the user, the display product is continuously developed towards high refreshing and high resolution, so that more and more lines are arranged, more binding golden fingers are required to be reserved during the design of the display panel, the size of the display panel is increased due to the arrangement of more golden fingers, and the user experience is influenced.
Disclosure of Invention
The embodiment of the invention provides a display module and a display device, wherein the display module can meet the requirements of high-refresh and high-resolution display products and can meet the user experience.
On one hand, the embodiment of the invention provides a display panel, which comprises a display area and a binding area positioned on at least one side of the display area, wherein the binding area is provided with a binding part; the binding part is provided with a first surface and a second surface which are oppositely arranged in the thickness direction of the display panel, and golden fingers are respectively arranged on the first surface and the second surface; the circuit board comprises at least two wiring layers which are stacked in the thickness direction of the display panel and are arranged in an insulating mode through insulating layers, the same ends of the at least two wiring layers are partially exposed out of the insulating layers located between the at least two wiring layers to form pins respectively, the pins on one of the at least two wiring layers are connected with the golden fingers located on the first surface, and the pins on the other wiring layer are connected with the golden fingers located on the second surface.
According to an aspect of the embodiment of the present invention, two wiring layers having the pins are disposed adjacent to each other in a thickness direction of the display panel, and the bonding portion is inserted between the two wiring layers having the pins.
According to an aspect of the embodiment of the present invention, the number of the gold fingers on the same surface is multiple, and the pins formed on one of the wiring layers on the circuit board are electrically connected to the gold fingers on the same surface in a one-to-one correspondence.
According to an aspect of the embodiment of the present invention, the outermost side of the circuit board in the thickness direction of the display panel is an insulating layer.
According to an aspect of the embodiment of the present invention, the wiring layers and the insulating layers are alternately arranged in a thickness direction of the display panel.
According to an aspect of the embodiment of the present invention, the total number of layers of the wiring layers and the insulating layers is greater than or equal to 5.
According to an aspect of the embodiment of the present invention, the pin is connected to the gold finger through an electrical connection portion.
According to an aspect of the embodiment of the present invention, the electrical connection portion includes a plurality of conductive blocks each having a shape matching a shape of the gold finger and connected between the lead pin and the gold finger.
According to one aspect of the embodiment of the invention, the display module further comprises a driving chip, the driving chip is arranged on the first surface or the second surface, and the driving chip is electrically connected with the golden finger.
According to an aspect of the embodiment of the present invention, the binding portion further has a via hole disposed through the first surface and the second surface, and the driving chip is electrically connected to the gold finger on the other of the first surface and the second surface through the via hole.
According to an aspect of the embodiment of the present invention, the via hole is located between the display area and the gold finger.
On the other hand, an embodiment of the invention provides a display device including the display module.
According to the display module and the display device provided by the embodiment of the invention, the display module comprises the display panel and the circuit board, the binding part is arranged in the binding area of the display panel, the binding part is provided with the first surface and the second surface in the thickness direction, and the golden fingers are arranged on the first surface and the second surface.
Drawings
Features, advantages and technical effects of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a partial structure of a display panel according to an embodiment of the present invention;
FIG. 2 is a partial side view of a display panel of one embodiment of the present invention;
FIG. 3 is a schematic diagram of a partial structure of a display panel and a circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a partial structure of a display panel and a circuit board according to another embodiment of the present invention;
FIG. 5 is a schematic diagram of a layout for connecting a driver chip and a golden finger of the display panel according to an embodiment of the invention;
fig. 6 is a schematic size diagram of the arrangement of the gold fingers in the conventional display module;
fig. 7 is a schematic size diagram of the golden finger arrangement in the display module according to an embodiment of the invention.
Wherein:
10-a display panel; 10 a-a display area; 10 b-a binding region; 101-binding part
111-a first surface; 112-a second surface; 113-a via;
11-gold finger;
20-a circuit board; 21-a wiring layer; 22-an insulating layer; 221-pin;
30-an electrical connection;
40-a driving chip;
51-normal line; 52-via lines;
x-thickness direction; y-a first direction; z-second direction.
In the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
With the improvement of the performance requirements of users on display products, the display products are continuously developed towards high refreshing and high resolution, so that more and more lines are required to be routed, and more binding golden fingers are required to be reserved during the design of the display products.
The traditional display product adopts a plurality of golden fingers arranged on the same surface of a binding area so as to meet the requirements of high-refresh and high-resolution display products. And this kind of mode of binding that adopts a plurality of golden fingers then needs more arrangement space, will lead to display module assembly's the oversize, especially binds the size in district for display module assembly's lower frame broad is unfavorable for satisfying user experience and feels.
In order to solve the above problems, embodiments of the present invention provide a display module and a display device, and the following describes embodiments of the display module and the display device with reference to fig. 1 to 7.
Fig. 1 to 3 are schematic partial structural diagrams of a display panel according to an embodiment of the present invention in fig. 1, fig. 2 is a partial side view of the display panel according to an embodiment of the present invention, and fig. 3 is a schematic partial structural diagram of the display panel according to an embodiment of the present invention in cooperation with a circuit board.
The display module provided by the embodiment of the invention comprises adisplay panel 10 and acircuit board 20, wherein thedisplay panel 10 comprises adisplay area 10a and abinding area 10b positioned on at least one side of thedisplay area 10a, thebinding area 10b is provided with abinding part 101, thebinding part 101 is provided with afirst surface 111 and asecond surface 112 which are oppositely arranged in the thickness direction X of thedisplay panel 10, and thefirst surface 111 and thesecond surface 112 are respectively provided with agolden finger 11. Thecircuit board 20 includes at least twowiring layers 21 stacked in a thickness direction X of thedisplay panel 10 and insulated by aninsulating layer 22, and the same ends of the at least twowiring layers 21 are partially exposed to theinsulating layer 22 between the at least twowiring layers 21 to form theleads 221, respectively. Wherein, thepins 221 formed on onewiring layer 21 of the at least twowiring layers 21 are connected with thegold fingers 11 on thefirst surface 111 in a binding manner, and thepins 221 formed on theother wiring layer 21 are connected with thegold fingers 11 on thesecond surface 112 in a binding manner.
According to the display module provided by the embodiment of the invention, since thegolden fingers 11 are arranged on thefirst surface 111 and thesecond surface 112, when the driving chip is bound on thedisplay panel 10, the driving chip can be bound and connected with thepins 221 of thecircuit board 20 through thegolden fingers 11 on thefirst surface 111 and thesecond surface 112, so that the functional requirements of the display module are met. And, all be provided withgolden finger 11 on withfirst surface 111 andsecond surface 112 for display module assembly can satisfy the demand of high refresh, high resolution display product, can also reducegolden finger 11 at the area occupied of the frame ofdisplay panel 10, reducesdisplay panel 10's overall dimension, satisfies user experience and feels.
Optionally, in the display module provided in the embodiment of the present invention, thedisplay panel 10 includes an array substrate and a light emitting layer, which are stacked, the array substrate includes a substrate and a device layer, which are stacked, and the light emitting layer is located on a side of the device layer away from the substrate.
Optionally, the substrate may be a flexible substrate, and optionally, a material of the substrate may be a Polyimide (PI) material or a material including PI, so that the substrate is a flexible substrate, and the array substrate may be bent.
Optionally, the device layer includes a plurality of driving circuits distributed in an array, and optionally, the light emitting layer includes a plurality of sub-pixels distributed in an array, and the driving circuits are connected to the sub-pixels and are used for driving the sub-pixels. The display requirements of thedisplay panel 10 are fulfilled.
As an optional implementation manner, the bindingportion 101 is formed on the array substrate, and optionally, the bindingportion 101 protrudes from the light emitting layer.
In some optional embodiments, the number of thegold fingers 11 on the same surface is multiple, and thepins 221 formed on one of the wiring layers 21 on thecircuit board 20 are electrically connected to the gold fingers on the same surface in a one-to-one correspondence. Through the setting, the number of thegolden fingers 11 can be increased, so that the display module develops towards the direction of high refreshing and high resolution, the occupied area of thegolden fingers 11 in thebinding area 10b can be reduced, the overall dimension of thedisplay panel 10 is reduced, and the user experience is optimized
Illustratively, the number of thegold fingers 11 on thefirst surface 111 may be multiple, and theleads 221 formed on one of the wiring layers 21 on thecircuit board 20 are electrically connected to thegold fingers 11 on thefirst surface 111 in a one-to-one correspondence. The number of thegolden fingers 11 on thefirst surface 111 is multiple, so that the number of thegolden fingers 11 arranged on thefirst surface 111 can be increased, and the display module is developed towards high refreshing and high resolution.
Optionally, at least a partial number of thegold fingers 11 on thefirst surface 111 are arranged side by side in the same direction. Through the arrangement, the occupied area of thegolden fingers 11 in thebinding part 101 can be reduced as much as possible on the basis of increasing the number of thegolden fingers 11, the overall dimension of thedisplay panel 10 is reduced, and the user experience is optimized.
In some alternative embodiments, all thegolden fingers 11 on thefirst surface 111 may be arranged side by side along the same direction, such as the first direction Y in fig. 1, and by the arrangement, the external size of thedisplay panel 10 can be further reduced.
For example, the number of thegold fingers 11 on thesecond surface 112 may be multiple, and thepins 221 formed on one of the wiring layers 21 on thecircuit board 20 may be electrically connected to thegold fingers 11 on thesecond surface 112 in a one-to-one correspondence. The number of thegolden fingers 11 on thesecond surface 112 is multiple, so that the number of thegolden fingers 11 arranged on thesecond surface 112 can be increased, and the display module is developed towards high refreshing and high resolution.
Optionally, at least a partial number of thegold fingers 11 in the plurality ofgold fingers 11 on thesecond surface 112 are arranged side by side in the same direction. Through the arrangement, the occupied area of thegolden fingers 11 in thebinding part 101 can be reduced as much as possible on the basis of increasing the number of thegolden fingers 11, the overall dimension of thedisplay panel 10 is reduced, and the user experience is optimized.
In some alternative embodiments, all thegolden fingers 11 on thesecond surface 112 may be arranged side by side along the same direction, such as the first direction Y in fig. 1, and by the arrangement, the external size of thedisplay panel 10 can be further reduced.
In some alternative embodiments, the first direction Y may be perpendicular to the thickness direction X.
As an alternative embodiment, when the row ofgold fingers 11 is included on both thefirst surface 111 and thesecond surface 112, the row ofgold fingers 11 on thefirst surface 111 and the row ofgold fingers 11 on thesecond surface 112 may be located at the same distance from the edge of thebinding region 10b in the second direction Z. Through the arrangement, the rows of thegolden fingers 11 on thefirst surface 111 and the rows of thegolden fingers 11 on thesecond surface 112 are approximately corresponding to each other, so that the overall size of thedisplay panel 10 is reduced. Optionally, the second direction Z is perpendicular to the thickness direction X and the first direction Y.
In some optional embodiments, the number of thegold fingers 11 included on thefirst surface 111 may be the same as the number of thegold fingers 11 included on thesecond surface 112, and of course, in some embodiments, may also be different, and may be specifically set according to the requirement of binding with thecircuit board 20.
As shown in fig. 3, as an alternative embodiment, thecircuit board 20 includes multiple wiring layers 21 and insulatinglayers 22, the number of the wiring layers 21 and the insulatinglayers 22 of thecircuit board 20 is not particularly limited, and may be adjusted according to the number of lines and the arrangement space.
Alternatively, the material of thewiring layer 21 and the insulatinglayer 22 may be various, and the present application does not specifically limit this. Optionally, the material of thewiring layer 21 may be copper foil or aluminum foil, which has good electrical conductivity and bending performance. The material of the insulatinglayer 22 may be Polyimide (PI) or PI-containing material, so that thecircuit board 20 can be bent.
Alternatively, when thecircuit board 20 is manufactured, thewiring layer 21 may be formed by directly evaporating copper foil on one of the insulatinglayers 22, or of course, several single-layer circuit boards or multiple-layer circuit boards may be stacked and bonded by an adhesive layer, and then the insulatinglayer 22 may be disposed on theoutermost wiring layer 21, as long as the performance requirements of the display module can be met.
In some optional embodiments, the twowiring layers 21 having thepins 221 are adjacently disposed on top in the thickness direction X of thedisplay panel 10, and the bindingportion 101 is interposed between the twowiring layers 21 having thepins 221. Through the above arrangement, the requirement of binding between thecircuit board 20 and thegold fingers 11 on both sides of thebinding region 10b of thedisplay panel 10 can be favorably satisfied.
As an optional implementation manner, in the display module provided in the embodiment of the present invention, the outermost sides of thecircuit boards 20 are respectively the insulatinglayers 22 along the thickness direction X of thedisplay panel 10. Through the arrangement, the insulation between the wiring layers 21 and the protection of theouter wiring layer 21 can be realized through the insulatinglayer 22, and the safety performance of the display module is ensured.
The wiring layers 21 and the insulatinglayers 22 are alternately arranged in the thickness direction X of thedisplay panel 10, facilitating the formation of theleads 221.
In some alternative embodiments, the total number m of wiring layers 21 and insulatinglayers 22 is greater than or equal to 5. Through the arrangement, thecircuit board 20 comprises at least twowiring layers 21, and connection requirements of thepins 221 on thefirst surface 111 and thepins 221 on thesecond surface 112 are guaranteed.
As shown in fig. 3, an exemplary display module according to an embodiment of the invention is provided. In some optional embodiments, the value of m may be 5, and may include twowiring layers 21 and three insulatinglayers 22, onewiring layer 21 is disposed between two adjacent insulatinglayers 22, and thefirst wiring layer 21 and thesecond wiring layer 21 are symmetrical with respect to the second insulatinglayer 22 and protrude from the second insulatinglayer 22 along the same direction, respectively, so as to form thepin 221. The leads 221 formed on thefirst wiring layer 21 can be bonded to thegold fingers 11 on one of thefirst surface 111 and thesecond surface 112, and theleads 221 on thesecond wiring layer 21 can be bonded to thegold fingers 11 on the other of thefirst surface 111 and thesecond surface 112. Alternatively, in this example, thecircuit board 20 may be an axisymmetric structure.
As shown in fig. 4, fig. 4 is a schematic partial structure diagram of a display panel and a circuit board according to another embodiment of the present invention. It is understood that the value of m is 5 is only an alternative embodiment. In some embodiments, the value of m may also be 7, so that thewiring layer 21 includes three layers, and the insulatinglayer 22 includes four layers, and in the three layers of wiring layers 21, any two adjacent wiring layers 21 may protrude from the insulatinglayer 22 between the two layers of wiring layers in the same direction, and thepins 221 are formed, so as to ensure the binding requirement with thedisplay panel 10.
For example, when the value of m is 7, the first layer ofwiring layer 21 and the second layer ofwiring layer 21 may be disposed to protrude from the insulatinglayer 22 therebetween from one side to another side, such as from the left side to the right side, in the thickness direction X, so as to form thepins 221 required for bonding with thegold fingers 11 on thedisplay panel 10. Of course, in some other examples, the second layer ofwiring layer 21 and the third layer ofwiring layer 21 may be disposed to protrude from the insulatinglayer 22 therebetween, and thepins 221 can also be formed to meet the requirement of binding with thegold fingers 11 on thedisplay panel 10.
It is understood that the values of m as 5, 7, etc. are only optional examples. In some embodiments, the value of m may be greater than 7, for example, 9, 11, and the like, as long as the requirement of binding with thedisplay panel 10 can be met, and the requirement of a high-refresh and high-resolution display product can be met.
As shown in fig. 3 and 4, in some optional embodiments, in the display module provided in the embodiments of the present invention, thecircuit board 20 further includes anelectrical connection portion 30, and thepin 221 is connected to thegold finger 11 through theelectrical connection portion 30 in a binding manner. Through setting upelectric connection portion 30, can do benefit to the binding connection demand betweenpin 221 and thegolden finger 11, simultaneously, need not to set upgolden finger 11 or the size ofpin 221 on thickness direction X too big, set upelectric connection portion 30 according to the interval betweengolden finger 11 and thepin 221, guarantee that the connection demand betweengolden finger 11 and thepin 221 can.
In some alternative embodiments, theelectrical connection 30 may include a plurality of conductive bumps, each having a shape matching the shape of thegold finger 11 and connected between the lead 221 and thegold finger 11. By making theelectrical connection portion 30 include a plurality of conductive blocks and making the shapes of the conductive blocks match the shapes of thegold fingers 11, eachpin 221 is bound and connected with thegold finger 11 through the conductive blocks, connection requirements are ensured, and influence on electrical signals due to mismatch between the sizes of the conductive blocks and the shapes of thegold fingers 11 and the like is avoided.
As an optional implementation manner, the conductive block may be made of a plurality of materials, and optionally, the conductive block may be made of anisotropic conductive adhesive, so that on one hand, thefirst pin 221 and the first solder joint can be fixedly connected while the conductive block is conductive, and on the other hand, the anisotropic conductive adhesive has a lower curing temperature and a better flexibility, and can improve the environmental adaptability of the connection point and reduce failure.
In some optional embodiments, the display module further includes adriving chip 40, thedriving chip 40 is disposed on thefirst surface 111 or thesecond surface 112, and thedriving chip 40 is electrically connected to thegold finger 11. Thedriving chip 40 is provided to meet the control requirement of thedisplay panel 10.
As an optional implementation manner, thebonding portion 101 further has a via 113, the via 113 is disposed through thefirst surface 111 and thesecond surface 112, and thedriving chip 40 is electrically connected to thegold finger 11 on the other of thefirst surface 111 and thesecond surface 112 through thevia 113.
As shown in fig. 2 and fig. 5, in some optional embodiments, a plurality of bonding lines for connecting thedriver chip 40 and thegold finger 11 may be disposed on thebonding portion 101, and the plurality of bonding lines may include anormal line 51 and a vialine 52, where one end of thenormal line 51 is electrically connected to thedriver chip 40, and the other end of the normal line is electrically connected to thegold finger 11 on the same surface as thedriver chip 40. One end of the vialine 52 is electrically connected to thedriving chip 40, and the other end extends to the via 113, and penetrates from the via 113 to the surface where thedriving chip 40 is located and extends into the other surface, and if thedriving chip 40 is located on thefirst surface 111, the other end of the vialine 52 penetrates from the via 113 to thefirst surface 111 and extends to thesecond surface 112, so as to electrically connect thedriving chip 40 to thegold finger 11 on the second surface 122.
Because the substrate of the array substrate may be a flexible substrate, the above-mentioned setting of thedriving chip 40 may cause thebinding portion 101 to be at least partially bent to thedisplay area 10a and located on a side of the substrate away from the device layer, and further cause thedriving chip 40 and thecircuit board 20 to be both located on a side of thedisplay area 10a away from the device layer or the light emitting surface thereof, that is, the lower frame of the display device adopts a cop (chip on plastic) attaching scheme, so that the lower frame of the display device can be reduced.
As an optional implementation manner, in the display module provided in the embodiment of the present invention, the viahole 113 may be located between thedisplay area 10a and thegold finger 11, and by the above arrangement, thegold finger 11 not on the same surface as thedriving chip 40 may be connected to thedriving chip 40 through the viahole 113. On the basis of reducing the overall dimension of the display module, the requirement for binding can be effectively guaranteed.
As shown in fig. 6 and 7, fig. 6 is a schematic size diagram corresponding to arrangement of golden fingers in a conventional display module, and fig. 7 is a schematic size diagram corresponding to arrangement of golden fingers in a display module according to an embodiment of the present invention. As can be seen from fig. 6 and 7, in the display module provided in the embodiment of the present invention, taking thedisplay panel 10 including two rows ofgold fingers 11 as an example, the two rows ofgold fingers 11 are located on the same side of thedisplay panel 10, and as the number of thegold fingers 11 is increased, the area occupied by thegold fingers 11 on the lower frame of thedisplay panel 10 is increased. If the two rows ofgolden fingers 11 are all arranged on the same surface, the occupied area is increased, and the width of the lower frame of the display module is larger. By adopting the display module provided by the embodiment of the invention, thegold fingers 11 also include two rows, wherein one row is arranged on thefirst surface 111, and the other row is arranged on thesecond surface 112, so that the number of thegold fingers 11 on the same surface can be reduced.
For example, as shown in fig. 6, taking two rows ofgolden fingers 11 as an example, when the two rows ofgolden fingers 11 are all located on the same surface, there are values of H1+ H3+ H4, H and H2, and the frame size of thedisplay panel 10 included in the conventional display module can be fed back. As shown in fig. 7, with the display module provided in the embodiment of the present invention, if the height of thebonding area 10b occupied by thegold finger 11 is H5 or H6, then the sum of the values of H5 and H7 or the sum of the values of H6 and H7 and the size of the frame of thedisplay panel 10 included in the display module provided in the embodiment of the present invention can be fed back, because H5 ═ H6 ═ H3 ═ H4 and H2 ═ H7 can be made, so that H5 or H6 can be compared with the value of H, the size of thebonding area 10b occupied by thedisplay gold finger 11 on thedisplay panel 10 can be greatly reduced, the size of the lower frame of thedisplay panel 10 is made smaller, so that the display module can meet the requirements of high refresh and high resolution display products, and the external size of thedisplay panel 10 can be reduced, thereby meeting the user experience.
On the other hand, an embodiment of the present invention further provides a display device, including the display module according to the foregoing embodiments. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a notebook computer, a digital photo frame, a navigator and the like, and can be integrated with a photosensitive assembly such as a camera and the like. The display device provided by the embodiment of the invention comprises the display module in any one of the embodiments, so that the display device has high refreshing and high resolution display capabilities and can meet the user experience.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A display module, comprising:
the display panel comprises a display area and a binding area positioned on at least one side of the display area, wherein the binding area is provided with a binding part;
the binding part is provided with a first surface and a second surface which are oppositely arranged in the thickness direction of the display panel, and golden fingers are respectively arranged on the first surface and the second surface;
the circuit board comprises at least two wiring layers which are stacked in the thickness direction of the display panel and are arranged in an insulating mode through insulating layers, the same ends of the at least two wiring layers are partially exposed out of the insulating layers located between the at least two wiring layers to form pins respectively, the pins on one of the at least two wiring layers are connected with the golden fingers located on the first surface, and the pins on the other wiring layer are connected with the golden fingers located on the second surface.
2. The display module according to claim 1, wherein two wiring layers having the pins are disposed adjacent to each other in a thickness direction of the display panel, and the bonding portion is interposed between the two wiring layers having the pins.
3. The display module according to claim 1, wherein the number of the gold fingers on the same surface is plural, and the pins formed on one of the wiring layers on the circuit board are electrically connected to the gold fingers on the same surface in a one-to-one correspondence.
4. The display module according to any one of claims 1 to 3, wherein the outermost side of the circuit board is an insulating layer in the thickness direction of the display panel;
preferably, the wiring layers and the insulating layers are alternately arranged in a thickness direction of the display panel;
preferably, the total number of layers of the wiring layers and the insulating layers is greater than or equal to 5.
5. The display module according to any one of claims 1 to 3, wherein the pins are connected to the gold fingers through electrical connections.
6. The display module assembly according to claim 5, wherein the electrical connection portion comprises a plurality of conductive blocks, each conductive block having a shape matching the shape of the gold finger and being connected between the lead and the gold finger.
7. The display module according to any one of claims 1 to 3, further comprising a driving chip disposed on the first surface or the second surface, wherein the driving chip is electrically connected to the gold finger.
8. The display module assembly according to claim 7, wherein the bonding portion further has a via hole, the via hole is disposed through the first surface and the second surface, and the driving chip is electrically connected to the gold finger on the other of the first surface and the second surface through the via hole.
9. The display module of claim 8, wherein the via hole is located between the display area and the gold finger.
10. A display device comprising a display module according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111080439.6ACN113838378B (en) | 2021-09-15 | 2021-09-15 | Display module and display device |
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|---|---|---|---|
| CN202111080439.6ACN113838378B (en) | 2021-09-15 | 2021-09-15 | Display module and display device |
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| CN113838378Atrue CN113838378A (en) | 2021-12-24 |
| CN113838378B CN113838378B (en) | 2023-07-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828410A (en)* | 2022-04-26 | 2022-07-29 | 昆山国显光电有限公司 | Bonding structure and display device |
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| CN114828410B (en)* | 2022-04-26 | 2024-09-13 | 昆山国显光电有限公司 | Bonding structure and display device |
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| CN113838378B (en) | 2023-07-25 |
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