X射线装置可通过闪烁体将X射线转换成可见光，再通过感测面板感测可见光来成像。闪烁体可直接形成在感测面板上或是通过接合工艺而形成在感测面板上。在后者的制造方法中，通常会先将闪烁体形成在硬质载板上，然后再将形成有闪烁体的硬质载板贴附至感测面板。由于此种接合工艺属于硬对硬的贴合，因此存在大面积贴合不易以及在贴合面易产生气泡等问题，导致X射线装置的良率低和/或成本高。The X-ray device can convert X-rays into visible light through a scintillator, and then sense the visible light through a sensing panel to form an image. The scintillator can be formed directly on the sensing panel or formed on the sensing panel through a bonding process. In the latter manufacturing method, the scintillator is usually first formed on a hard carrier, and then the hard carrier with the scintillator is attached to the sensing panel. Since this bonding process is a hard-to-hard bonding, there are problems such as difficulty in large-area bonding and bubbles are easily generated on the bonding surface, resulting in low yield and/or high cost of the X-ray device.

发明内容Summary of the invention

本发明提供一种X射线装置及其制造方法，其有助于提升良率或降低成本。The present invention provides an X-ray device and a manufacturing method thereof, which are helpful to improve yield or reduce cost.

根据本发明的实施例，X射线装置包括感测面板以及软性闪烁体结构。软性闪烁体结构设置在感测面板上。According to an embodiment of the present invention, an X-ray device includes a sensing panel and a soft scintillator structure. The soft scintillator structure is arranged on the sensing panel.

根据本发明的实施例，X射线装置的制造方法包括以下步骤。提供载板。在载板上设置软性闪烁体结构。移除载板。将软性闪烁体结构设置在感测面板上。According to an embodiment of the present invention, a method for manufacturing an X-ray device comprises the following steps: providing a carrier plate, arranging a soft scintillator structure on the carrier plate, removing the carrier plate, and arranging the soft scintillator structure on a sensing panel.

基于上述，在本发明的实施例中，由于闪烁体结构是软性的，因此将软性闪烁体结构设置在感测面板上时可以不使用硬对硬贴合的真空贴合机，从而可改善大面积贴合不易或在贴合面易产生气泡等问题。因此，本公开的实施例的X射线装置及其制造方法有助于提升良率或降低成本。Based on the above, in the embodiment of the present invention, since the scintillator structure is soft, a vacuum laminating machine for hard-to-hard lamination can be used when the soft scintillator structure is set on the sensing panel, thereby improving the problem of difficulty in laminating a large area or bubbles being easily generated on the laminating surface. Therefore, the X-ray device and the manufacturing method thereof of the embodiment of the present disclosure help to improve the yield or reduce the cost.

为让本公开的上述特征和优点能更明显易懂，下文特举实施例，并配合附图详细说明如下。In order to make the above features and advantages of the present disclosure more obvious and understandable, embodiments are given below and described in detail with reference to the accompanying drawings.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

包含附图以便进一步理解本发明，且附图并入本说明书中并构成本说明书的一部分。附图说明本发明的实施例，并与描述一起用于解释本发明的原理。The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present invention and together with the description serve to explain the principles of the present invention.

图1是依照本公开的实施例的一种X射线装置的剖面示意图；FIG1 is a cross-sectional schematic diagram of an X-ray device according to an embodiment of the present disclosure;

图2是图1中区域R1的放大图；FIG2 is an enlarged view of region R1 in FIG1 ;

图3至图6是本公开的实施例的一种X射线装置的制造流程的剖面示意图。3 to 6 are cross-sectional schematic diagrams of a manufacturing process of an X-ray device according to an embodiment of the present disclosure.

具体实施方式Detailed ways

通过参考以下的详细描述并同时结合附图可以理解本公开。须注意的是，为了使读者能容易了解及附图的简洁，本公开中的多张附图只示出电子装置的部分，且附图中的特定元件并非依照实际比例绘图。此外，附图中各元件的数量及尺寸仅作为示意，并非用来限制本公开的范围。举例来说，为了清楚起见，各膜层、区域和/或结构的相对尺寸、厚度及位置可能缩小或放大。The present disclosure may be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, in order to facilitate the reader's understanding and the simplicity of the drawings, the various drawings in the present disclosure only show portions of the electronic device, and certain elements in the drawings are not drawn according to actual proportions. In addition, the number and size of each element in the drawings are for illustration only and are not intended to limit the scope of the present disclosure. For example, for clarity, the relative size, thickness, and position of each film layer, region, and/or structure may be reduced or enlarged.

本公开通篇说明书与后附的权利要求中会使用某些词汇来指称特定元件。本领域的技术人员应理解，电子设备制造商可能会以不同的名称来指称相同的元件。本文并不意在区分那些功能相同但名称不同的元件。在下文说明书与权利要求中，“具有”与“包括”等词为开放式词语，因此其应被解释为“包括但不限定为…”之意。Certain words are used throughout the specification and the claims that follow to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. It is not intended to distinguish between components that have the same function but different names. In the following specification and claims, the words "having" and "including" are open-ended words and should therefore be interpreted as "including but not limited to...".

本文中所提到的方向用语，例如：“上”、“下”、“前”、“后”、“左”、“右”等，仅是参考附图的方向。因此，使用的方向用语是用来说明，而并非用来限制本公开。应了解到，当元件或膜层被称为设置在另一个元件或膜层“上”或“连接”另一个元件或膜层时，所述元件或膜层可以直接在所述另一元件或膜层上或直接连接到所述另一元件或膜层，或者两者之间存在有插入的元件或膜层(非直接情况)。相反地，当元件或膜层被称为“直接”在另一个元件或膜层“上”或“直接连接”另一个元件或膜层时，两者之间不存在有插入的元件或膜层。The directional terms mentioned herein, such as: "up", "down", "front", "back", "left", "right", etc., are only reference directions of the accompanying drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. It should be understood that when an element or a film layer is referred to as being disposed "on" or "connected to" another element or film layer, the element or film layer may be directly on or directly connected to the other element or film layer, or there may be an intervening element or film layer between the two (non-direct case). Conversely, when an element or film layer is referred to as being "directly" "on" or "directly connected to" another element or film layer, there may be no intervening element or film layer between the two.

本文中所提到的术语“大约”、“等于”、“相等”、“相同”、“实质上”或“大致上”通常代表落在给定数值或范围的10％范围内，或代表落在给定数值或范围的5％、3％、2％、1％或0.5％范围内。此外，用语“给定范围为第一数值至第二数值”、“给定范围落在第一数值至第二数值的范围内”表示所述给定范围包含第一数值、第二数值以及它们之间的其它数值。The terms "approximately", "equal to", "equal", "same", "substantially" or "approximately" mentioned herein generally represent falling within 10% of a given value or range, or represent falling within 5%, 3%, 2%, 1% or 0.5% of a given value or range. In addition, the phrases "a given range is from a first value to a second value", "a given range falls within the range from a first value to a second value" indicate that the given range includes the first value, the second value and other values therebetween.

在本公开一些实施例中，关于接合、连接的用语例如“连接”、“互连”等，除非特别定义，否则可指两个结构是直接接触，或者亦可指两个结构并非直接接触，其中有其它结构设于此两个结构之间。关于接合、连接的用语亦可包括两个结构都可移动，或者两个结构都固定的情况。此外，用语“电性连接”、“耦接”包含任何直接及间接的电性连接手段。In some embodiments of the present disclosure, terms such as "connection" and "interconnection" related to bonding and connection, unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein there is another structure disposed between the two structures. Terms related to bonding and connection may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" and "coupled" include any direct and indirect electrical connection means.

在下述实施例中，相同或相似的元件将采用相同或相似的标号，且将省略其赘述。此外，不同实施例中的特征只要不违背发明精神或相冲突，均可任意混合搭配使用，且依本说明书或权利要求所作的简单的等效变化与修饰，皆仍属本公开涵盖的范围内。另外，本说明书或权利要求中提及的“第一”、“第二”等用语仅用以命名不同的元件或区别不同实施例或范围，而并非用来限制元件数量上的上限或下限，也并非用以限定元件的制造顺序或设置顺序。In the following embodiments, the same or similar elements will use the same or similar reference numerals, and their redundant description will be omitted. In addition, the features in different embodiments can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other, and simple equivalent changes and modifications made in accordance with this specification or claims are still within the scope of this disclosure. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name different elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements, nor are they used to limit the manufacturing order or setting order of the elements.

图1是依照本公开的实施例的一种X射线装置的剖面示意图。请参照图1，X射线装置1可包括感测面板10以及软性闪烁体结构12。软性闪烁体结构12设置在感测面板10上。软性闪烁体结构12适于将入射X射线装置1的X射线X转换成可见光V。感测面板10适于感测可见光V并产生对应于可见光V的光强度分布的图像。FIG1 is a cross-sectional schematic diagram of an X-ray device according to an embodiment of the present disclosure. Referring to FIG1 , the X-ray device 1 may include a sensing panel 10 and a flexible scintillator structure 12. The flexible scintillator structure 12 is disposed on the sensing panel 10. The flexible scintillator structure 12 is adapted to convert X-rays X incident on the X-ray device 1 into visible light V. The sensing panel 10 is adapted to sense the visible light V and generate an image corresponding to the light intensity distribution of the visible light V.

在一些实施例中，感测面板10可包括基板100以及感测阵列102，其中感测阵列102位于软性闪烁体结构12与基板100之间。基板100适于承载感测阵列102。依据不同的需求，基板100可为硬质基板、软性基板、弯曲式基板(curved substrate)、可挠性基板或任何型式的基板。此外，基板100的透光率不加以限制，也就是说，基板100可为透光基板、半透光基板或不透光基板。举例来说，基板100的材质可例如包括玻璃、塑料、陶瓷、不锈钢、石英、蓝宝石、聚酰亚胺(polyimide，PI)、聚碳酸(polycarbonate，PC)或聚对苯二甲酸乙二酯(polyethylene terephthalate，PET)，或前述的组合，但不限于此。In some embodiments, the sensing panel 10 may include a substrate 100 and a sensing array 102, wherein the sensing array 102 is located between the soft scintillator structure 12 and the substrate 100. The substrate 100 is suitable for carrying the sensing array 102. According to different requirements, the substrate 100 may be a hard substrate, a soft substrate, a curved substrate, a flexible substrate or any type of substrate. In addition, the light transmittance of the substrate 100 is not limited, that is, the substrate 100 may be a transparent substrate, a semi-transparent substrate or an opaque substrate. For example, the material of the substrate 100 may include glass, plastic, ceramic, stainless steel, quartz, sapphire, polyimide (PI), polycarbonate (PC) or polyethylene terephthalate (PET), or a combination of the foregoing, but is not limited thereto.

在一实施例中，感测阵列102可适于感测可见光V。举例来说，感测阵列102可包括多个感测单元(未示出)以及与这些感测单元电连接的电路(未示出)。这些感测单元排列成阵列，以产生图像。至少一个感测单元可包括一个或多个开关元件以及与所述一个或多个开关元件电连接的一个或多个感光元件。开关元件例如可包括薄膜晶体管，例如包括非晶硅(amorphous silicon)、低温多晶硅(Low Temperature Poly-Silicon，LTPS)或金属氧化物(metal oxide)的顶栅极、底栅极或双栅极薄膜晶体管，但不限于此。感光元件例如可包括光电二极管(photodiode)。然而，感测单元的排列方式、每一个感测单元所包括的开关元件的数量、每一个感测单元所包括的感光元件的数量、开关元件的种类或感光元件的种类可依需求改变，而不以上述为限。In one embodiment, the sensing array 102 may be suitable for sensing visible light V. For example, the sensing array 102 may include a plurality of sensing units (not shown) and circuits (not shown) electrically connected to the sensing units. The sensing units are arranged in an array to generate an image. At least one sensing unit may include one or more switching elements and one or more photosensitive elements electrically connected to the one or more switching elements. The switching element may, for example, include a thin film transistor, such as a top gate, bottom gate or double gate thin film transistor including amorphous silicon, low temperature polysilicon (LTPS) or metal oxide, but is not limited thereto. The photosensitive element may, for example, include a photodiode. However, the arrangement of the sensing units, the number of switching elements included in each sensing unit, the number of photosensitive elements included in each sensing unit, the type of switching element or the type of photosensitive element may be changed according to demand, and is not limited to the above.

在一些实施例中，软性闪烁体结构12可包括第一软性层120以及闪烁体层122，其中闪烁体层122位于第一软性层120与感测面板10之间。在又一些实施例中，软性闪烁体结构12还可包括第二软性层124，且第二软性层124位于闪烁体层122与感测面板10之间。In some embodiments, the soft scintillator structure 12 may include a first soft layer 120 and a scintillator layer 122, wherein the scintillator layer 122 is located between the first soft layer 120 and the sensing panel 10. In some other embodiments, the soft scintillator structure 12 may further include a second soft layer 124, and the second soft layer 124 is located between the scintillator layer 122 and the sensing panel 10.

第二软性层124可用于承载第一软性层120以及闪烁体层122。在一些实施例中，第二软性层124的材质可包括聚酰亚胺(Polyimide，PI)、玻璃、聚对苯二甲酸乙二酯(polyethylene terephthalate，PET)、聚二甲酸乙二酯(polyethylene naphthalate，PEN)或其他合适的材质。在一些实施例中，第二软性层124的厚度T124可大于或等于5μm(微米，micrometer)且小于或等于100μm，但不以此为限。在一些实施例中，第二软性层124对波长为530nm(奈米，nanometer)的光的穿透率可大于70％，但不以此为限。The second soft layer 124 can be used to support the first soft layer 120 and the scintillator layer 122. In some embodiments, the material of the second soft layer 124 may include polyimide (PI), glass, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or other suitable materials. In some embodiments, the thickness T124 of the second soft layer 124 may be greater than or equal to 5 μm (micrometer) and less than or equal to 100 μm, but not limited thereto. In some embodiments, the transmittance of the second soft layer 124 to light with a wavelength of 530 nm (nanometer) may be greater than 70%, but not limited thereto.

闪烁体层122设置在第二软性层124上。在一些实施例中，闪烁体层122的材质可包括碘化铯(CsI)，但不以此为限。在其他实施例中，闪烁体层122的材质可包括其他种类的无机闪烁体或有机闪烁体。在一些实施例中，闪烁体层122可通过沉积工艺而形成在第二软性层124上。沉积工艺可包括蒸镀工艺，但不以此为限。The scintillator layer 122 is disposed on the second soft layer 124. In some embodiments, the material of the scintillator layer 122 may include cesium iodide (CsI), but is not limited thereto. In other embodiments, the material of the scintillator layer 122 may include other types of inorganic scintillators or organic scintillators. In some embodiments, the scintillator layer 122 may be formed on the second soft layer 124 by a deposition process. The deposition process may include an evaporation process, but is not limited thereto.

图2是图1中区域R1的放大图，可以例如是闪烁体层122与第二软性层124的局部结构示意图。请参照图2，通过沉积工艺形成在第二软性层124上的闪烁体层122可包括多晶部122A以及单晶部122B，其中多晶部122A邻近感测面板10(参照图1)，而单晶部122B远离感测面板10。在另一实施例中，单晶部122B邻近第一软性层120(参照图1)，即多晶部122A位于单晶部122B与第二软性层124之间。多晶部122A以及单晶部122B的形貌差异可通过扫描式电子显微镜(Scanning Electron Microscope，SEM)观测出，于此不多加赘述。多晶部122A与单晶部122B为渐变结构，故并无明显的分界线。在本公开的一些实施例中，多晶部122A的高度H122A可大于0μm且例如小于或等于40μm。多晶部122A的高度H122A为多晶部122A的顶面至第二软性层124的上表面124A的距离。FIG. 2 is an enlarged view of the region R1 in FIG. 1 , which may be, for example, a schematic diagram of the partial structure of the scintillator layer 122 and the second soft layer 124. Referring to FIG. 2 , the scintillator layer 122 formed on the second soft layer 124 by a deposition process may include a polycrystalline portion 122A and a single crystal portion 122B, wherein the polycrystalline portion 122A is adjacent to the sensing panel 10 (refer to FIG. 1 ), and the single crystal portion 122B is away from the sensing panel 10. In another embodiment, the single crystal portion 122B is adjacent to the first soft layer 120 (refer to FIG. 1 ), that is, the polycrystalline portion 122A is located between the single crystal portion 122B and the second soft layer 124. The morphological difference between the polycrystalline portion 122A and the single crystal portion 122B can be observed by a scanning electron microscope (SEM), and no further details are given here. The polycrystalline portion 122A and the single crystal portion 122B are gradual structures, so there is no obvious dividing line. In some embodiments of the present disclosure, the height H122A of the polycrystalline portion 122A may be greater than 0 μm and, for example, less than or equal to 40 μm. The height H122A of the polycrystalline portion 122A is the distance from the top surface of the polycrystalline portion 122A to the upper surface 124A of the second soft layer 124 .

请再参照图1，第一软性层120设置在闪烁体层122以及第二软性层124上。依据不同的需求，第一软性层120可为多层功能层的堆叠层。多层功能层的材质可包括金属箔(metal foil)、塑料、金属以及其他合适的材质中的至少两个，但不以此为限。塑料可包括PET、PEN、聚对二甲苯(parylene)，但不以此为限。Referring to FIG. 1 again, the first soft layer 120 is disposed on the scintillator layer 122 and the second soft layer 124. According to different requirements, the first soft layer 120 can be a stacked layer of multiple functional layers. The material of the multiple functional layers can include at least two of metal foil, plastic, metal and other suitable materials, but is not limited thereto. The plastic can include PET, PEN, parylene, but is not limited thereto.

在一些实施例中，第一软性层120可包括黏着层(未示出)。第一软性层120可通过黏着层而贴附至闪烁体层122以及第二软性层124上。第一软性层120还可包括反射层(未示出)。反射层可让X射线通过且将可见光V(如可见光V1与可见光V2)反射。更精确来说，反射层可将外界环境光中的可见光V2反射，可降低外界环境光中的可见光V2对感测结果的干扰。此外，反射层还可将朝第一软性层120传递的可见光V1回收，例如当X射线X通过闪烁体层122后，X射线会转换成可见光V1，可见光V1打到反射层后，可见光V1可被反射层反射，并朝感测面板10的方向传递，可提升可见光V1的回收率。第一软性层120还可包括阻水层(未示出)。阻水层适于阻挡水气渗入闪烁体层122，从而降低水气对于闪烁体层122的负面影响或延长闪烁体层122的使用寿命。在一些实施例中，黏着层、反射层以及阻水层可依序堆叠在闪烁体层122上。然而，第一软性层120中的功能层的种类、数量及其堆叠顺序可依需求改变，而不以此为限。在一些实施例中，第一软性层120的最大厚度T120可落在20μm至300μm的范围内，即20μm≦T120≦300μm，但不以此为限。In some embodiments, the first soft layer 120 may include an adhesive layer (not shown). The first soft layer 120 may be attached to the scintillator layer 122 and the second soft layer 124 through the adhesive layer. The first soft layer 120 may also include a reflective layer (not shown). The reflective layer allows X-rays to pass through and reflects visible light V (such as visible light V1 and visible light V2). More precisely, the reflective layer can reflect the visible light V2 in the external ambient light, which can reduce the interference of the visible light V2 in the external ambient light on the sensing result. In addition, the reflective layer can also recycle the visible light V1 transmitted toward the first soft layer 120. For example, when the X-ray X passes through the scintillator layer 122, the X-ray will be converted into visible light V1. After the visible light V1 hits the reflective layer, the visible light V1 can be reflected by the reflective layer and transmitted in the direction of the sensing panel 10, which can improve the recovery rate of the visible light V1. The first soft layer 120 may also include a water-blocking layer (not shown). The water-blocking layer is suitable for blocking water vapor from penetrating into the scintillator layer 122, thereby reducing the negative impact of water vapor on the scintillator layer 122 or extending the service life of the scintillator layer 122. In some embodiments, the adhesive layer, the reflective layer, and the water-blocking layer may be stacked on the scintillator layer 122 in sequence. However, the type, quantity, and stacking order of the functional layers in the first soft layer 120 may be changed as required, but are not limited thereto. In some embodiments, the maximum thickness T120 of the first soft layer 120 may fall within the range of 20 μm to 300 μm, that is, 20 μm≦T120≦300 μm, but is not limited thereto.

虽然图1示出软性闪烁体结构12由第一软性层120、闪烁体层122以及第二软性层124等三层结构所组成，然而，软性闪烁体结构12的结构数量可依需求而增加或减少。举例来说，在一些实施例中，软性闪烁体结构12可省略第二软性层124，但不以此为限。Although FIG1 shows that the flexible scintillator structure 12 is composed of three layers, namely, the first flexible layer 120, the scintillator layer 122, and the second flexible layer 124, the number of structures of the flexible scintillator structure 12 can be increased or decreased according to demand. For example, in some embodiments, the flexible scintillator structure 12 can omit the second flexible layer 124, but is not limited thereto.

在X射线装置1中，由于闪烁体结构是软性的，因此将软性闪烁体结构12设置在感测面板10上时可以不使用硬对硬贴合的真空贴合机。举例来说，可使用一般滚轮式贴合机取代真空贴合机来简化贴合工艺、改善大面积贴合不易或改善在贴合面易产生气泡的问题。如此，有助于提升良率，或者可在相同的产量下降低成本。依据不同的需求，感测面板10也可为软性感测面板或弯取式感测面板，对应地，X射线装置1可为软性X射线装置或弯取式X射线装置，但不以此为限。In the X-ray device 1, since the scintillator structure is soft, a vacuum laminating machine for hard-to-hard lamination may not be used when the soft scintillator structure 12 is disposed on the sensing panel 10. For example, a general roller laminating machine may be used instead of a vacuum laminating machine to simplify the laminating process, improve the difficulty of laminating a large area, or improve the problem of bubbles being easily generated on the laminating surface. This helps to improve the yield, or can reduce costs at the same output. Depending on different needs, the sensing panel 10 may also be a soft sensing panel or a bendable sensing panel, and correspondingly, the X-ray device 1 may be a soft X-ray device or a bendable X-ray device, but is not limited thereto.

依据不同的需求，X射线装置1可进一步包括其他膜层或元件。举例来说，X射线装置1可进一步包括黏着层14。黏着层14位于感测面板10与软性闪烁体结构12之间，以将两者接合。在一些实施例中，黏着层14可包括UV解胶、热解胶或冷解胶。在另一实施例中，黏着层14可采用在照射UV光、受热或冷却的情况下会降低或丧失黏性的材料，但不以此为限。According to different requirements, the X-ray device 1 may further include other film layers or elements. For example, the X-ray device 1 may further include an adhesive layer 14. The adhesive layer 14 is located between the sensing panel 10 and the soft scintillator structure 12 to bond the two. In some embodiments, the adhesive layer 14 may include UV debonding, thermal debonding, or cold debonding. In another embodiment, the adhesive layer 14 may be made of a material that reduces or loses viscosity when exposed to UV light, heated, or cooled, but is not limited thereto.

在一些实施例中，X射线装置1还可包括电路板16。电路板16与感测阵列102中的电路(未示出)电连接，且电路板16上可设置有与所述电路电连接的驱动芯片16A。在一些实施例中，电路板16可为软性印刷电路板(FlexiblePrinted Circuit Board，FPCB)，其中电路板16的第一端E1可连接至感测阵列102中的电路，且电路板16的第二端E2可弯折至感测面板10的背面，以缩减电路板16占据的空间，从而缩减X射线装置1的体积。In some embodiments, the X-ray device 1 may further include a circuit board 16. The circuit board 16 is electrically connected to a circuit (not shown) in the sensing array 102, and a driving chip 16A electrically connected to the circuit may be disposed on the circuit board 16. In some embodiments, the circuit board 16 may be a flexible printed circuit board (FPCB), wherein a first end E1 of the circuit board 16 may be connected to a circuit in the sensing array 102, and a second end E2 of the circuit board 16 may be bent to the back of the sensing panel 10, so as to reduce the space occupied by the circuit board 16, thereby reducing the volume of the X-ray device 1.

在一些实施例中，X射线装置1还可包括外壳18。举例来说，外壳18可包括入光部18A以及承载部18B。入光部18A设置在X射线装置1的入光侧SE，其中X射线X经由入光部18A进入X射线装置1。入光部18A的材质例如可包括碳纤维(carbon fiber)，但不以此为限。承载部18B与入光部18A连接，且承载部18B与入光部18A形成至少容纳感测面板10、软性闪烁体结构12、黏着层14以及电路板16的空间S。承载部18B的材质可以是适于承载感测面板10、软性闪烁体结构12、黏着层14以及电路板16的任何材质，于此不多加限制。In some embodiments, the X-ray device 1 may further include a housing 18. For example, the housing 18 may include a light incident portion 18A and a bearing portion 18B. The light incident portion 18A is disposed at the light incident side SE of the X-ray device 1, wherein the X-ray X enters the X-ray device 1 via the light incident portion 18A. The material of the light incident portion 18A may include, for example, carbon fiber, but is not limited thereto. The bearing portion 18B is connected to the light incident portion 18A, and the bearing portion 18B and the light incident portion 18A form a space S that at least accommodates the sensing panel 10, the soft scintillator structure 12, the adhesive layer 14, and the circuit board 16. The material of the bearing portion 18B may be any material suitable for carrying the sensing panel 10, the soft scintillator structure 12, the adhesive layer 14, and the circuit board 16, without further limitation.

图3至图6是本公开的实施例的一种X射线装置的制造流程的剖面示意图。请参照图3，提供载板20。载板20为硬质载板。举例来说，载板20的材质可包括玻璃、陶瓷或不锈钢，但不以此为限。3 to 6 are cross-sectional schematic diagrams of a manufacturing process of an X-ray device according to an embodiment of the present disclosure. Referring to FIG. 3 , a carrier 20 is provided. The carrier 20 is a hard carrier. For example, the material of the carrier 20 may include glass, ceramic or stainless steel, but is not limited thereto.

在载板20上设置第二软性层124。举例来说，可通过黏着层(未示出)将第二软性层124贴附至载板20上，但不以此为限。The second flexible layer 124 is disposed on the carrier 20. For example, the second flexible layer 124 can be attached to the carrier 20 via an adhesive layer (not shown), but the present invention is not limited thereto.

接着，在第二软性层124上设置闪烁体层122。举例来说，可通过沉积工艺(如蒸镀工艺)将闪烁体层122形成在第二软性层124上，但不以此为限。Next, the scintillator layer 122 is disposed on the second soft layer 124. For example, the scintillator layer 122 may be formed on the second soft layer 124 by a deposition process (eg, an evaporation process), but is not limited thereto.

请参照图4，在闪烁体层122上设置第一软性层120。在一些实施例中，第一软性层120可进一步设置在第二软性层124上，但不以此为限。在形成第一软性层120后，即初步完成在载板20上设置软性闪烁体结构12的步骤。4 , a first soft layer 120 is disposed on the scintillator layer 122. In some embodiments, the first soft layer 120 may be further disposed on the second soft layer 124, but the present invention is not limited thereto. After the first soft layer 120 is formed, the step of disposing the soft scintillator structure 12 on the carrier 20 is preliminarily completed.

请参照图5，移除载板20。举例来说，可依据载板20与第二软性层124之间接合的方式采用激光剥离工艺、机械剥离工艺、UV光照射步骤、升温工艺以及降温工艺中的一种工艺来移除载板20。然后，将软性闪烁体结构12设置在感测面板10(参照图1)上。在一些实施例中，如图1所示，可通过黏着层14来接合软性闪烁体结构12与感测面板10，但不以此为限。Referring to FIG. 5 , the carrier 20 is removed. For example, the carrier 20 may be removed by using a laser peeling process, a mechanical peeling process, a UV light irradiation step, a heating process, and a cooling process according to the bonding method between the carrier 20 and the second soft layer 124. Then, the soft scintillator structure 12 is disposed on the sensing panel 10 (refer to FIG. 1 ). In some embodiments, as shown in FIG. 1 , the soft scintillator structure 12 and the sensing panel 10 may be bonded by an adhesive layer 14, but the present invention is not limited thereto.

在一些实施例中，如图6所示，在移除载板20之后，可进一步移除第二软性层124，以形成不包括第二软性层124的软性闪烁体结构12’。然后将软性闪烁体结构12’设置在感测面板10(参照图1)上，例如可通过黏着层14(参照图1)来接合软性闪烁体结构12’与感测面板10，但不以此为限。In some embodiments, as shown in FIG6 , after removing the carrier 20, the second soft layer 124 may be further removed to form a soft scintillator structure 12′ that does not include the second soft layer 124. The soft scintillator structure 12′ is then disposed on the sensing panel 10 (see FIG1 ), for example, the soft scintillator structure 12′ and the sensing panel 10 may be bonded by an adhesive layer 14 (see FIG1 ), but the present invention is not limited thereto.

参照图1与图6，将软性闪烁体结构12或软性闪烁体结构12’设置在感测面板10(参照图1)上之后，可选择性地将电路板16连接至感测面板10，并将感测面板10、软性闪烁体结构12或软性闪烁体结构12’、黏着层14以及电路板16装进外壳18中。1 and 6 , after the soft scintillator structure 12 or the soft scintillator structure 12′ is set on the sensing panel 10 (refer to FIG. 1 ), the circuit board 16 can be selectively connected to the sensing panel 10, and the sensing panel 10, the soft scintillator structure 12 or the soft scintillator structure 12′, the adhesive layer 14 and the circuit board 16 can be installed in the housing 18.

在X射线装置的制造方法中，由于闪烁体结构是软性的，因此将软性闪烁体结构12或软性闪烁体结构12’设置在感测面板10上时可以不使用硬对硬贴合的真空贴合机。举例来说，可使用一般滚轮式贴合机取代真空贴合机来简化贴合工艺、改善大面积贴合不易或改善在贴合面易产生气泡的问题。此外，相较于将所有的元件(如软性闪烁体结构12、感测面板10以及电路板16)皆形成在载板之后再移除载板，通过将X射线装置中的多个元件分别制作然后再组装在一起有助于提升良率，或者可在相同的产量下降低成本。In the manufacturing method of the X-ray device, since the scintillator structure is soft, a vacuum laminating machine for hard-to-hard lamination may not be used when the soft scintillator structure 12 or the soft scintillator structure 12' is disposed on the sensing panel 10. For example, a general roller-type laminating machine may be used instead of a vacuum laminating machine to simplify the laminating process, improve the difficulty of laminating a large area, or improve the problem of bubbles being easily generated on the laminating surface. In addition, compared to forming all components (such as the soft scintillator structure 12, the sensing panel 10, and the circuit board 16) on a carrier and then removing the carrier, by separately manufacturing multiple components in the X-ray device and then assembling them together, it helps to improve the yield, or reduce the cost at the same output.

综上所述，在本公开的实施例中，由于闪烁体结构是软性的，因此将软性闪烁体结构设置在感测面板上时可使用一般滚轮式贴合机取代真空贴合机来简化贴合工艺、改善大面积贴合不易或改善在贴合面易产生气泡的问题。因此，本公开的实施例的X射线装置及其制造方法有助于提升良率或降低成本。在一些实施例中，感测面板也可为软性感测面板或弯取式感测面板，对应地，X射线装置可为软性X射线装置或弯取式X射线装置。在一些实施例中，软性闪烁体结构可包括反射层，以提升可见光的回收率。在一些实施例中，软性闪烁体结构可包括阻水层，以降低水气对于闪烁体层的负面影响或延长闪烁体层的使用寿命。In summary, in the embodiments of the present disclosure, since the scintillator structure is soft, when the soft scintillator structure is set on the sensing panel, a general roller-type laminating machine can be used instead of a vacuum laminating machine to simplify the laminating process, improve the difficulty of large-area laminating, or improve the problem of bubbles easily generated on the laminating surface. Therefore, the X-ray device and the manufacturing method thereof of the embodiments of the present disclosure help to improve the yield or reduce costs. In some embodiments, the sensing panel may also be a soft sensing panel or a bendable sensing panel, and correspondingly, the X-ray device may be a soft X-ray device or a bendable X-ray device. In some embodiments, the soft scintillator structure may include a reflective layer to improve the recovery rate of visible light. In some embodiments, the soft scintillator structure may include a water-blocking layer to reduce the negative impact of water vapor on the scintillator layer or extend the service life of the scintillator layer.

以上各实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述各实施例对本公开进行了详细的说明，本领域的技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的范围。The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.

虽然本公开的实施例及其优点已公开如上，但应该了解的是，本领域的技术人员在不脱离本公开的精神和范围内，当可作更改、替代与润饰，且各实施例间的特征可任意互相混合替换而成其他新实施例。此外，本公开的保护范围并未局限于说明书内所述特定实施例中的工艺、机器、制造、物质组成、装置、方法及步骤，本领域的技术人员可从本公开揭示内容中理解现有或未来所发展出的工艺、机器、制造、物质组成、装置、方法及步骤，只要可以在此处所述实施例中实施大抵相同功能或获得大抵相同结果皆可根据本公开使用。因此，本公开的保护范围包括上述工艺、机器、制造、物质组成、装置、方法及步骤。另外，每一权利要求构成个别的实施例，且本公开的保护范围也包括各个权利要求及实施例的组合。本公开的保护范围当视随附的权利要求所界定的为准。Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that those skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure, and the features between the embodiments can be arbitrarily mixed and replaced with each other to form other new embodiments. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Those skilled in the art can understand the existing or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present disclosure, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment. The scope of protection of the present disclosure shall be determined by the attached claims.