CN113644057A - power module - Google Patents
power moduleDownload PDFInfo
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- CN113644057A CN113644057ACN202111079005.4ACN202111079005ACN113644057ACN 113644057 ACN113644057 ACN 113644057ACN 202111079005 ACN202111079005 ACN 202111079005ACN 113644057 ACN113644057 ACN 113644057A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Translated fromChinese
Description
Technical Field
The invention relates to the technical field of power module packaging, in particular to a power module.
Background
At present, in the related art, when the packaged power module is used, a certain amount of heat is generated by the power module itself due to the current passing through the power module, and if the heat generated by the power module itself is too large, the temperature of the power module rises sharply, so that the overall performance of the power module is affected, and even the power module is damaged.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
Therefore, the invention provides a power module.
In view of this, a first aspect of the present invention provides a power module including a substrate and a bonding assembly including a plurality of chips, a bonding member, and a terminal; the plurality of chips are arranged on the substrate and electrically connected with the substrate; the bonding components are respectively connected with the plurality of chips; the terminal is electrically connected to the bonding member.
The power module provided by the invention comprises a substrate and a bonding assembly, wherein the bonding assembly is arranged on the substrate, and the substrate can be a substrate with excellent heat dissipation performance and electric conductivity. The bonding assembly comprises a plurality of chips, a bonding component and a terminal, and when the power module works, current flows into the power module from the terminal, then flows onto the chips through the bonding component respectively, and then flows onto the substrate.
In the working process of the power module, after current passes through the terminal, the current flows to the plurality of chips through the bonding part respectively, and the plurality of chips are connected in parallel, so that the current density is uniformly distributed, the heat productivity of the power device is reduced, the influence on the performance of the power module due to the heat of the power module is reduced, the quality of the power module is improved, the probability of damage of the power module due to the heat is reduced, and the service life of the power device is prolonged.
Because the current density distribution is more uniform, the current allowed by the power module is larger, and the quality of the power module is further improved.
Because the current density distribution is more uniform, the heating of the power module is more uniform, the heat dissipation of the power module is facilitated, and the heat dissipation efficiency of the power module is improved.
The power module provided by the invention has the advantages of uniform stress distribution and good reliability.
The bonding member is a metal bonding member.
The substrate is provided with a mounting hole for connecting and fixing the packaging structure with other devices.
In particular, the chip is a diode chip.
In addition, the power module in the above technical solution provided by the present invention may further have the following additional technical features:
in one embodiment of the present invention, the bonding assembly further includes a first supporting plate disposed between the plurality of chips; the bonding part is electrically connected with the first supporting plate; the terminal is electrically connected with the first support plate.
In this technical scheme, first backup pad sets up on the base plate, and the bonding part bonds through first backup pad, has promoted the height of the one end that bonding part and terminal electricity are connected, and then makes the connection and the installation of bonding part more convenient.
The power module comprises a substrate and a bonding assembly, wherein the bonding assembly comprises a plurality of chips, a first supporting plate, a bonding part and a terminal, so that the structure of the power module is simpler, the weight is lighter, the overall weight of the power module is further reduced, and the lightweight of the power module is realized. Because the weight of the power module is reduced, the bonded position is not easy to break and fall off when the power module falls or is impacted by external force, the power module is not easy to damage, the service life of the power module is prolonged, and the work of the power module is safer and more reliable.
Specifically, the first support plate is a DBC (Direct Bonded Copper clad ceramic substrate) structure and/or a multilayer structure with an upper surface electrically conducting and intermediate insulating.
The terminal is welded on the first supporting plate.
The two ends of the bonding component can also be directly connected with the chips needing to be connected in parallel without passing through the first supporting plate.
In one aspect of the present invention, the first support plate includes an insulating portion and a conductive portion. The insulating part is attached to the substrate; the conductive part is attached to the insulating part; the bonding component is lapped on the conductive part; the terminal is connected to the conductive portion.
In the technical scheme, the first supporting plate comprises an insulating part and a conductive part, and the insulating part is attached to the substrate; the conductive part is attached to the insulating part, so that the first supporting plate is insulated in the longitudinal direction, the insulating part is further used for insulating the conductive part and the substrate, and the current is prevented from directly flowing to the substrate after passing through the supporting plate. The bonding component is lapped on the conductive part; the terminal is connected with the conductive part for first backup pad is electrically conductive in horizontal, and the conductive part switches on terminal and bonding part, makes the electric current that flows to the terminal flow to the base plate behind bonding part and the chip, and then promotes the stability of power module during operation.
In one aspect of the present invention, the terminal is in a shape of a sheet, a column, or a block, and includes a fixing portion, a connecting portion, and a mounting portion. The fixing part is attached to the conductive part; one end of the connecting part is connected with the fixing part, and the other end of the connecting part extends towards the direction departing from the first supporting plate; the installation part is connected with the other end of the connecting part, and a connecting hole is formed in the installation part.
In this technical scheme, the terminal includes fixed part and connecting portion, and the fixed part laminating is on the conductive part, and the area of contact of increase terminal and first backup pad reduces the resistance of the junction of terminal and first backup pad, and then reduces the calorific capacity of the junction of terminal and first backup pad, reduces the temperature of power module during operation. One end of the connecting part is connected with the fixing part, and the other end extends towards the direction deviating from the first supporting plate, so that the power module is connected with an external device conveniently.
The terminal can be in a sheet shape, a column shape or a block shape, so as to be convenient for processing the terminal.
When the terminal is the slice, the terminal includes two fixed parts and two connecting portion, and two fixed parts laminate respectively on the conductive part, and the one end of two connecting portion is connected with two fixed parts respectively to set up along the direction perpendicular with the conductive part, the terminal still includes the installation department, and the both ends of installation department are connected with the other end of two connecting portion respectively, are provided with the connecting hole that switches on that is used for interconnecting link on the installation department.
The power module further comprises a supporting block, and the supporting block penetrates between the two fixing parts and abuts against the mounting part.
The bonding component is lapped between the two fixing parts.
In one technical scheme of the invention, a plurality of chips are arranged on two sides of a first supporting plate; or a plurality of chips are arranged around the first support plate.
In the technical scheme, a plurality of chips are arranged on two sides of a first supporting plate; or a plurality of chips encircle first backup pad setting, the chip of being convenient for is connected with the electrically conductive part electricity through bonding part for the overall arrangement of chip is more reasonable.
In one embodiment of the present invention, the plurality of chips are symmetrically disposed with respect to the first support plate.
In the technical scheme, the plurality of chips are symmetrically arranged relative to the first supporting plate, so that the uniformity of the current density of the power module during working is further improved, the heat productivity of the power device is reduced, the influence on the performance of the power module due to the heat generation of the power module is further reduced, the quality of the power module is improved, the probability of the power module being damaged due to the heat generation is reduced, and the service life of the power device is prolonged. And the current allowed by the power module is larger, and the quality of the power module is further improved. And the heating of the power module is more uniform, so that the heat dissipation of the power module is facilitated, and the heat dissipation efficiency of the power module is improved.
In one embodiment of the present invention, the power module further includes a plurality of second supporting plates, the plurality of second supporting plates are respectively disposed between the plurality of chips and the substrate, and the plurality of second supporting plates are conductive supporting plates.
In one technical scheme of the invention, the bonding component is a copper sheet, an aluminum tape or a plurality of bonding wires arranged in parallel.
In the technical scheme, the bonding part is a copper sheet or an aluminum strip, the copper sheet and the aluminum strip are low in density and light in weight, the overall weight of the power module is further reduced, and the light weight of the power module is realized. Because the weight of the power module is reduced, the bonded position is not easy to break and fall off when the power module falls or is impacted by external force, the power module is not easy to damage, the service life of the power module is prolonged, and the work of the power module is safer and more reliable.
In one embodiment of the present invention, two ends of the bonding member are respectively connected to two of the plurality of chips and attached to the first support plate.
In this technical scheme, the both ends of bonded part overlap joint respectively on two chips in a plurality of chips, and laminate mutually with first backup pad for bonded part strides and locates on first backup pad, and then makes the atress of bonded part more even, promotes power module stress distribution's homogeneity, and then promotes power module's reliability, further prolongs power module's life-span.
In one embodiment of the present invention, one end of the bonding member is bonded to the plurality of chips, and the other end is bonded to the first support plate.
In the technical scheme, one end of each bonding component is lapped on the plurality of chips, the other end of each bonding component is lapped on the first supporting plate, each bonding component corresponds to one chip, the production process difficulty of the power module is simplified, and the qualification rate of the power module is improved.
In one technical scheme of the invention, the number of the bonding assemblies is two, and the two groups of bonding assemblies are symmetrically arranged.
In the technical scheme, the number of the bonding assemblies is two, the two groups of bonding assemblies are symmetrically arranged, the uniformity of the current density of the power module during working is further improved, the heat productivity of the power device is reduced, the influence on the performance of the power module due to the heat generation of the power module is further reduced, the quality of the power module is improved, the probability of damage of the power module due to the heat generation is reduced, and the service life of the power device is prolonged. And the current allowed by the power module is larger, and the quality of the power module is further improved. And the heating of the power module is more uniform, so that the heat dissipation of the power module is facilitated, and the heat dissipation efficiency of the power module is improved.
Specifically, the number of chips of each group of bonding assemblies is two, and the two chips are respectively arranged on two sides of the first supporting plate.
Specifically, the number of chips of each group of bonding assemblies is four, every two chips are a group, and the two groups of chips are totally two groups of chips, the two chips of each group are distributed along the length direction of the substrate, and the two groups of chips are respectively arranged on two sides of the first supporting plate.
Specifically, the number of chips of each group of bonding assemblies is four, every two chips are a group, and the two groups of chips are totally two groups of chips, the two chips of each group are distributed along the width direction of the substrate, and the two groups of chips are respectively arranged on two sides of the first supporting plate.
Specifically, the number of chips of each group of bonding assemblies is four, and the four chips are distributed around the first supporting plate.
In one aspect of the present invention, the power module further includes a housing and a filler; the shell is sleeved outside the bonding assembly and connected with the substrate; the filling is filled in the shell.
In the technical scheme, the shell is sleeved outside the bonding assembly to prevent a foreign object from contacting with the bonding component, so that the stability of the power module in working is further improved. The filler is filled in the shell, and when the power module receives external force impact, the external force can be buffered, so that the probability that the bonding assembly is damaged by the external force is reduced. And moreover, the filler is filled in the shell, and can also fix and support the bonding component, so that the stability of the power module in work is further improved.
Specifically, the shell is an insulating protective shell and is used for protecting the side face of the conductive terminal from abnormal contact with other conductors to cause work failure.
Specifically, the filler is epoxy resin and/or other substances for filling, and the epoxy resin and/or other substances for filling are filled in the shell and play roles in buffering, shock prevention, insulation and heat insulation.
The shell is provided with a filling hole which is used for filling epoxy resin and/or other substances for filling into the shell.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows an exploded view of a power module according to one embodiment of the invention;
FIG. 2a shows one of the schematic structural diagrams of a power module according to one embodiment of the invention;
FIG. 2b shows a second schematic diagram of the structure of a power module according to an embodiment of the invention;
fig. 2c shows a third schematic structural diagram of a power module according to an embodiment of the invention;
FIG. 2d shows a fourth schematic diagram of the structure of a power module according to an embodiment of the invention;
FIG. 3 illustrates a front view of a power module according to one embodiment of the invention;
FIG. 4 illustrates a front view of a power module according to another embodiment of the present invention;
fig. 5a shows one of the schematic structural views of a terminal according to an embodiment of the invention;
figure 5b shows a second schematic structural view of a terminal according to an embodiment of the invention;
fig. 5c shows a third schematic structural view of a terminal according to an embodiment of the invention;
fig. 6 shows a front view of a terminal according to an embodiment of the invention;
fig. 7 shows a top view of a terminal according to an embodiment of the invention;
FIG. 8 shows one of the chip distribution diagrams according to one embodiment of the invention;
FIG. 9 shows a second schematic diagram of a chip distribution according to an embodiment of the invention;
FIG. 10 shows a third schematic diagram of a chip distribution according to an embodiment of the invention;
FIG. 11 illustrates a schematic structural view of a bonding component according to one embodiment of the present invention;
FIG. 12 illustrates a front view of a keying component in accordance with an embodiment of the present invention;
FIG. 13 illustrates a schematic structural view of a bonding component according to another embodiment of the present invention;
FIG. 14 illustrates a front view of a key component according to another embodiment of the present invention;
FIG. 15a shows one of the structural schematics of a power module (including a housing) according to one embodiment of the invention;
fig. 15b shows a second schematic structural view of a power module (including a housing) according to an embodiment of the invention;
FIG. 16 shows one of the schematic structural views of the housing according to one embodiment of the invention;
FIG. 17 shows a second schematic structural view of a housing according to an embodiment of the invention;
FIG. 18 illustrates a schematic structural view of a support block according to an embodiment of the present invention;
FIG. 19 shows a fifth structural schematic of a power module according to an embodiment of the invention;
FIG. 20 shows a fourth schematic structural view of a terminal according to an embodiment of the invention;
fig. 21 shows a fifth structural schematic diagram of a terminal according to an embodiment of the present invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 21 is:
100 substrates, 200 bonding assemblies, 210 chips, 220 bonding components, 230 terminals, 232 fixing parts, 234 connecting parts, 236 mounting parts, 240 first supporting plates, 242 insulating parts, 244 conductive parts, 250 second supporting plates, 300 shells and 400 supporting blocks.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
Power modules according to some embodiments of the invention are described below with reference to fig. 1-21.
The first embodiment is as follows:
as shown in fig. 1, 2a, 2b, 2c and 2d, the present invention provides a power module including asubstrate 100 and abonding assembly 200, thebonding assembly 200 including a plurality ofchips 210, abonding member 220 and a terminal 230; the plurality ofchips 210 are disposed on thesubstrate 100 and electrically connected to thesubstrate 100; thebonding members 220 are connected to the plurality ofchips 210, respectively; the terminal 230 is electrically connected with thebonding member 220.
In this embodiment, the power module includes asubstrate 100 and abonding assembly 200, thebonding assembly 200 is disposed on thesubstrate 100, and thesubstrate 100 may be thesubstrate 100 with excellent heat dissipation performance and electrical conductivity. Thebonding assembly 200 includes a plurality ofchips 210, abonding member 220, andterminals 230, and when the power module operates, current flows into the power module through theterminals 230, flows onto the plurality ofchips 210 through thebonding member 220, and flows onto thesubstrate 100.
In the working process of the power module, after the current passes through the terminal 230, the current flows to the plurality ofchips 210 respectively through thebonding component 220, and the plurality ofchips 210 are connected in parallel, so that the current density is uniformly distributed, the heat productivity of the power device is reduced, the influence on the performance of the power module due to the heat generation of the power module is reduced, the quality of the power module is improved, the probability of damage of the power module due to the heat generation is reduced, and the service life of the power device is prolonged.
Because the current density distribution is more uniform, the current allowed by the power module is larger, and the quality of the power module is further improved.
Because the current density distribution is more uniform, the heating of the power module is more uniform, the heat dissipation of the power module is facilitated, and the heat dissipation efficiency of the power module is improved.
The power module provided by the invention has the advantages of uniform stress distribution and good reliability.
Thebonding part 220 is ametal bonding part 220, and specifically, thebonding part 220 may be an aluminum part or a copper part.
Thesubstrate 100 is provided with a mounting hole for connecting and fixing the package structure with other devices.
Specifically, thechip 210 is a diode chip.
Example two:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 3 and 4, thebonding assembly 200 further includes afirst support plate 240, thefirst support plate 240 being disposed between the plurality ofchips 210; thebonding member 220 is electrically connected to thefirst support plate 240; the terminal 230 is electrically connected to thefirst support plate 240.
In this embodiment, thefirst support plate 240 is disposed on thesubstrate 100, and thebonding member 220 is bonded by thefirst support plate 240, so that the height of the end of thebonding member 220 electrically connected to the terminal 230 is increased, thereby facilitating the connection and installation of thebonding member 220.
The power module includes asubstrate 100 and abonding assembly 200, and thebonding assembly 200 includes a plurality ofchips 210, afirst support plate 240, abonding member 220, and a terminal 230, so that the structure of the power module is simpler and the weight is lighter, thereby reducing the overall weight of the power module and realizing the lightweight of the power module. Because the weight of the power module is reduced, the bonded position is not easy to break and fall off when the power module falls or is impacted by external force, the power module is not easy to damage, the service life of the power module is prolonged, and the work of the power module is safer and more reliable.
As shown in fig. 3 and 4, the power module further includes a plurality ofsecond support plates 250, the plurality ofsecond support plates 250 are respectively disposed between the plurality of chips and thesubstrate 100, and thesecond support plates 250 are conductive structures.
Specifically, thefirst support plate 240 is a DBC structure and/or a multi-layer structure having an upper surface electrically conductive and intermediate insulating.
The terminal 230 is welded to thefirst support plate 240.
The two ends of thebonding member 220 may also be directly connected to thechips 210 to be connected in parallel without passing through thefirst support plate 240.
Thesecond support plate 250 can perform the functions of conducting electricity, reducing stress, heightening, etc., thereby facilitating bonding.
Example three:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 3, thefirst support plate 240 includes aninsulating part 242 and aconductive part 244. The insulatingportion 242 is attached to thesubstrate 100; theconductive portion 244 is attached to the insulatingportion 242; thebonding member 220 is lapped on theconductive portion 244; the terminal 230 is connected to theconductive portion 244.
In this embodiment, thefirst support plate 240 includes an insulatingportion 242 and aconductive portion 244, the insulatingportion 242 being attached to thesubstrate 100; theconductive portion 244 is attached to the insulatingportion 242, so that the first supportingplate 240 is insulated in the longitudinal direction, and the insulatingportion 242 insulates theconductive portion 244 from thesubstrate 100, thereby preventing current from flowing directly to thesubstrate 100 after passing through the supporting plate. Thebonding member 220 is lapped on theconductive portion 244; the terminal 230 is connected to theconductive portion 244, such that thefirst support plate 240 is laterally conductive, and theconductive portion 244 conducts the terminal 230 and thebonding member 220, such that a current flowing to the terminal 230 flows to thesubstrate 100 through thebonding member 220 and thechip 210, thereby improving stability of the power module during operation.
Example four:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 1, the terminal 230 has a plate shape, a column shape, or a block shape, and the terminal 230 includes a fixingportion 232 and a connectingportion 234. The fixingportion 232 is attached to theconductive portion 244; the connectingportion 234 has one end connected to the fixingportion 232 and the other end extending away from thefirst support plate 240.
In this embodiment, the terminal 230 includes a fixingportion 232 and a connectingportion 234, the fixingportion 232 is attached to theconductive portion 244, the contact area between the terminal 230 and thefirst support plate 240 is increased, the resistance at the connection portion between the terminal 230 and thefirst support plate 240 is reduced, the heat generation amount at the connection portion between the terminal 230 and thefirst support plate 240 is further reduced, and the temperature of the power module during operation is reduced. One end of the connectingportion 234 is connected to the fixingportion 232, and the other end extends away from thefirst support plate 240, so that the power module can be connected to an external device.
Specifically, as shown in fig. 2a and 5a, the terminal 230 may have a block shape, which may be a rectangular parallelepiped or a square cube.
Specifically, as shown in fig. 2b and 5b, the terminal 230 may have a cylindrical shape.
Specifically, as shown in fig. 2c and 5c, the terminal 230 may be in a sheet shape to facilitate processing of the terminal 230.
As shown in fig. 5c and fig. 6, when the terminal 230 is in a sheet shape, the terminal 230 includes two fixingportions 232 and two connectingportions 234, the two fixingportions 232 are respectively attached to theconductive portion 244, and one ends of the two connectingportions 234 are respectively connected to the two fixingportions 232 and are disposed in a direction perpendicular to theconductive portion 244. As shown in fig. 5c to 7, the terminal 230 further includes a mountingportion 236, two ends of the mountingportion 236 are respectively connected to the other ends of the two connectingportions 234, and a conductive connection hole for connecting a wire is provided on the mountingportion 236.
Thebonding member 220 is interposed between the two fixingportions 232.
When the terminal 230 has a columnar shape as shown in fig. 19, the terminal 230 includes two fixingportions 232, two connectingportions 234, and a mountingportion 236, the two fixingportions 232 are respectively attached to the conductive portion, one ends of the two connectingportions 234 are respectively connected to the two fixingportions 232, and the connectingportions 234 are arranged in a direction perpendicular to the conductive portion as shown in fig. 20, or the connectingportions 234 are arranged in a curved shape as shown in fig. 21. The terminal 230 mountingportion 236 is cylindrical. Both ends of the mountingportion 236 are connected to the other ends of the two connectingportions 234, respectively, and the mountingportion 236 is provided with a conductive connection hole for connecting a line. Thecylindrical terminal 230 has a simple process and is convenient to process; according to the simulation result, thecylindrical terminal 230 structure can effectively reduce the temperature of the bonding position and the temperature of the chip, so that the bonding position is not easy to lose efficacy, the chip is not easy to burn out, and the use reliability of the device is improved; in addition, the reasonable arrangement of the current inflow position also plays a certain role in reducing the inductance.
Example five:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 8 to 10, the plurality ofchips 210 are disposed at both sides of thefirst support plate 240; or a plurality ofchips 210 are disposed around thefirst support plate 240.
In this embodiment, the plurality ofchips 210 are disposed at both sides of thefirst support plate 240; or a plurality ofchips 210 are disposed around thefirst support plate 240, so that thechips 210 are electrically connected to theconductive parts 244 through thebonding members 220, thereby making the layout of thechips 210 more reasonable.
Example six:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 8 to 10, the plurality ofchips 210 are symmetrically disposed with respect to thefirst support plate 240.
In this embodiment, the plurality ofchips 210 are symmetrically disposed with respect to the first supportingplate 240, so that uniformity of current density of the power module during operation is further improved, heat generation amount of the power device is reduced, and further, influence on performance of the power module due to heat generation of the power module is reduced. And the current allowed by the power module is larger, and the quality of the power module is further improved. And the heating of the power module is more uniform, so that the heat dissipation of the power module is facilitated, and the heat dissipation efficiency of the power module is improved.
Example seven:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 2a and 2b, thebonding component 220 is a plurality of bonding wires arranged in parallel.
As shown in fig. 2c, thebonding member 220 is an aluminum tape.
As shown in fig. 2d, thebonding element 220 is a copper sheet.
In this embodiment, thebonding member 220 is a copper sheet or an aluminum tape, and the copper sheet and the aluminum tape have a lower density and a lower weight, so that the overall weight of the power module is reduced, and the light weight of the power module is realized. Because the weight of the power module is reduced, the bonded position is not easy to break and fall off when the power module falls or is impacted by external force, the power module is not easy to damage, the service life of the power module is prolonged, and the work of the power module is safer and more reliable.
Example eight:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 2 and 4, both ends of thebonding member 220 are respectively mounted on twochips 210 of the plurality ofchips 210 and attached to thefirst support plate 240.
In this embodiment, as shown in fig. 11 and 12, two ends of thebonding member 220 are respectively overlapped on twochips 210 of the plurality ofchips 210 and attached to the first supportingplate 240, so that thebonding member 220 is spanned on the first supportingplate 240, and further the stress of thebonding member 220 is more uniform, the uniformity of stress distribution of the power module is improved, and further the reliability of the power module is improved, and the service life of the power module is further prolonged.
Example nine:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 1 and 3, one end of thebonding member 220 is attached to the plurality ofchips 210, and the other end is attached to thefirst support plate 240.
In this embodiment, as shown in fig. 13 and 14, one end of each bondingmember 220 is connected to the plurality ofchips 210, and the other end of each bondingmember 220 is connected to thefirst support plate 240, so that the difficulty of the manufacturing process of the power module is reduced, and the yield of the power module is improved.
Example ten:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 1 and 2, the number of thekey assemblies 200 is two, and the twokey assemblies 200 are symmetrically arranged.
In this embodiment, the number of thebonding assemblies 200 is two, and the two groups ofbonding assemblies 200 are symmetrically arranged, so that the uniformity of the current density of the power module during operation is further improved, the heat productivity of the power device is reduced, the influence on the performance of the power module due to the heat generation of the power module is further reduced, the quality of the power module is improved, the probability of the damage of the power module due to the heat generation is reduced, and the service life of the power device is prolonged. And the current allowed by the power module is larger, and the quality of the power module is further improved. And the heating of the power module is more uniform, so that the heat dissipation of the power module is facilitated, and the heat dissipation efficiency of the power module is improved.
Specifically, as shown in fig. 1, the number of thechips 210 of each group of thebonding assemblies 200 is two, and the twochips 210 are respectively disposed on two sides of thefirst support plate 240.
Specifically, as shown in fig. 8, the number of thechips 210 of each group of thebonding assemblies 200 is four, each twochips 210 are in one group, and there are two groups ofchips 210, the twochips 210 of each group are distributed along the length direction of thesubstrate 100, and the two groups ofchips 210 are respectively disposed on two sides of thefirst support plate 240.
Specifically, as shown in fig. 9, the number of thechips 210 of each group of thebonding assemblies 200 is four, each twochips 210 are in one group, and there are two groups ofchips 210, the twochips 210 of each group are distributed along the width direction of thesubstrate 100, and the two groups ofchips 210 are respectively disposed on two sides of thefirst support plate 240.
Specifically, as shown in fig. 10, the number of thechips 210 of each group of thebonding assemblies 200 is four, and fourchips 210 are distributed around thefirst support plate 240.
Example eleven:
the present embodiment provides a power module, and in addition to the technical features of the above embodiments, the present embodiment further includes the following technical features.
As shown in fig. 15a, 15b, 16 and 17, the power module further includes acase 300 and a filler; thehousing 300 is sleeved outside thebonding assembly 200 and connected to thesubstrate 100; the filler is filled in thecase 300.
In this embodiment, thehousing 300 is sleeved outside thekey assembly 200 to prevent the foreign object from contacting thekey member 220, thereby further improving the stability of the power module during operation. The filler is filled in thehousing 300, and when the power module receives an external force impact, the external force can be buffered, so as to reduce the probability that thebonding assembly 200 is damaged by the external force. In addition, the filler is filled in thehousing 300, and can fix and support thebonding member 220, thereby further improving the stability of the power module during operation.
Specifically, thehousing 300 is an insulating protective housing for protecting the side surface of the conductive terminal 230 from abnormal contact with other conductive bodies, which may cause a failure in operation.
Specifically, the filler is epoxy resin and/or other substances for filling, and the epoxy resin and/or other substances for filling are filled in thehousing 300, and play roles of buffering, shock prevention, insulation and heat insulation.
Thehousing 300 is provided with a filling hole for filling thehousing 300 with epoxy resin and/or other filling materials.
Thehousing 300 may be an adhesive housing, or a plastic housing, or a 3D printed housing.
As shown in fig. 15b and fig. 18, the power module further includes a supportingblock 400, and the supportingblock 400 is inserted between the two fixingportions 232 and abuts against the mountingportion 236.
In the claims, the specification and the drawings of the specification of the present invention, the term "plurality" means two or more, unless explicitly defined otherwise, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings only for the purpose of describing the present invention more conveniently and simplifying the description, and do not indicate or imply that the referred device or element must have the described specific orientation, be constructed and operated in the specific orientation, and thus the description should not be construed as limiting the present invention; the terms "connect," "mount," "secure," and the like are to be construed broadly, and for example, "connect" may refer to a fixed connection between multiple objects, a removable connection between multiple objects, or an integral connection; the multiple objects may be directly connected to each other or indirectly connected to each other through an intermediate. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art from the above data specifically.
In the claims, specification, and drawings that follow the present disclosure, the description of the terms "one embodiment," "some embodiments," "specific embodiments," and so forth, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In the claims, specification and drawings of the present invention, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A power module comprising a substrate and a bonding assembly, the bonding assembly comprising:
the plurality of chips are arranged on the substrate and are electrically connected with the substrate;
bonding members connected to the plurality of chips, respectively;
a terminal electrically connected with the bonding part.
2. The power module of claim 1, wherein the key assembly further comprises:
a first support plate disposed between the plurality of chips;
the bonding part is electrically connected with the first supporting plate;
the terminal is electrically connected with the first support plate.
3. The power module of claim 2, wherein the first support plate comprises:
an insulating portion bonded to the substrate;
the conductive part is attached to the insulating part;
the bonding component is lapped on the conductive part;
the terminal is connected to the conductive portion.
4. The power module of claim 3, wherein the terminal is in the shape of a plate, a cylinder, or a block, the terminal comprising:
the fixing part is attached to the conductive part;
one end of the connecting part is connected with the fixing part, and the other end of the connecting part extends in the direction departing from the first supporting plate;
the installation department, the installation department with the other end of connecting portion is connected, be provided with the connecting hole on the installation department.
5. The power module of claim 2,
the plurality of chips are arranged on two sides of the first supporting plate; or
The plurality of chips are arranged around the first support plate.
6. The power module of claim 1, further comprising
The plurality of second supporting plates are respectively arranged between the plurality of chips and the substrate, and the plurality of second supporting plates are conductive supporting plates.
7. The power module of claim 2,
the bonding component is a copper sheet, an aluminum strip or a plurality of bonding wires arranged in parallel.
8. The power module of claim 7,
two ends of the bonding component are respectively lapped on two chips in the plurality of chips and are attached to the first supporting plate; or
One end of the bonding part is lapped on the plurality of chips, and the other end is lapped on the first supporting plate.
9. The power module according to any one of claims 1 to 8,
the number of the keying assemblies is two, and the two keying assemblies are symmetrically arranged.
10. The power module of any one of claims 1-8, further comprising:
the shell is sleeved outside the bonding assembly and is connected with the substrate;
a filler filled in the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111079005.4ACN113644057B (en) | 2021-09-15 | Power Module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111079005.4ACN113644057B (en) | 2021-09-15 | Power Module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113644057Atrue CN113644057A (en) | 2021-11-12 |
| CN113644057B CN113644057B (en) | 2025-10-10 |
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