CN113639873A

Movatterモバイル変換

Info

Publication number: CN113639873A
Application number: CN202110937092.6A
Authority: CN
Inventors: 许哲涛
Original assignee: Beijing Jingdong Qianshi Technology Co Ltd
Current assignee: Beijing Jingdong Qianshi Technology Co Ltd
Priority date: 2021-08-16
Filing date: 2021-08-16
Publication date: 2021-11-12
Anticipated expiration: 2041-08-16
Also published as: CN113639873B

Abstract

Translated fromChinese

本发明公开了一种热红外相机测试方法、装置、测试设备、测试系统及介质。该方法包括：向温度控制电路发送温度控制信号，以将靶标的表面温度调节至目标温度；将置于环境试验箱中的被测热红外相机依次作为目标被测热红外相机，向复用电路发送第一连通控制信号，以通过复用电路将测试设备与目标被测热红外相机的通信链路导通；获取目标被测热红外相机在设定时刻对靶标测得的温度分布图；根据温度分布图以及目标被测热红外相机的初始温度分布图，确定目标被测热红外相机的测试结果。上述技术方案通过对复用电路进行连通控制，可与各被测热红外相机导通并获取其测得的温度分布图，实现了对多个热红外相机的自动化测试，降低测试本，提高测试效率。

The invention discloses a thermal infrared camera testing method, device, testing equipment, testing system and medium. The method includes: sending a temperature control signal to a temperature control circuit to adjust the surface temperature of the target to the target temperature; taking the measured thermal infrared cameras placed in the environmental test box as the target measured thermal infrared cameras in turn, and sending them to the multiplexing circuit Send the first connection control signal to conduct the communication link between the test equipment and the target thermal infrared camera through the multiplexing circuit; obtain the temperature distribution map measured by the target thermal infrared camera at the set time on the target; according to The temperature distribution map and the initial temperature distribution map of the target thermal infrared camera under test determine the test results of the target thermal infrared camera under test. The above technical solution can conduct the connection control with each thermal infrared camera to be tested and obtain the temperature distribution map measured by the multiplexing circuit through the connection control, which realizes the automatic testing of multiple thermal infrared cameras, reduces the test cost, and improves the test performance. efficiency.

Description

Thermal infrared camera test method, device, test equipment, test system and medium

Technical Field

The embodiment of the invention relates to the technical field of camera testing, in particular to a thermal infrared camera testing method, a thermal infrared camera testing device, thermal infrared camera testing equipment, a thermal infrared camera testing system and a thermal infrared camera testing medium.

Background

The machine room inspection robot is used for assisting or replacing operation and maintenance personnel to carry out daily inspection of a data machine room, temperature monitoring is carried out on a computer in the machine room, the important work of inspection is one of temperature monitoring, the inspection robot mainly depends on a thermal infrared camera carried by the inspection robot to monitor the temperature distribution of the computer, the performance requirement on the thermal infrared camera is high, the thermal infrared camera needs to adapt to various environments where the robot is located, and the robot can run stably and reliably in the service life. In order to ensure the performance of the thermal infrared camera, a performance test needs to be performed on the thermal infrared camera to evaluate the adaptability of the thermal infrared camera to the environment and the reliability of the temperature monitoring result.

In the process of implementing the invention, the following technical problems are found in the prior art: in the process of carrying out performance test on the thermal infrared camera, the thermal infrared camera is required to be arranged in the environment experiment box and then connected to the external computer of the environment experiment box through a network cable, one computer can only be in interactive communication with one thermal infrared camera and can only realize the test on a single thermal infrared camera, the environment in the environment experiment box is required to be manually regulated and controlled, timing monitoring and recording are carried out, and the test efficiency is low.

Disclosure of Invention

The invention provides a thermal infrared camera testing method, a thermal infrared camera testing device, a thermal infrared camera testing system and a thermal infrared camera testing medium, so that automatic testing of a plurality of thermal infrared cameras is realized, the testing cost is reduced, and the testing efficiency is improved.

In a first aspect, an embodiment of the present invention provides a thermal infrared camera testing method, including:

sending a temperature control signal to a temperature control circuit to adjust a surface temperature of a target placed in an environmental test chamber to a target temperature by the temperature control circuit;

sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, and sending a first communication control signal to a multiplexing circuit so as to communicate a communication link between test equipment and the target tested thermal infrared cameras through the multiplexing circuit; acquiring a temperature distribution map of the target measured by the target measured thermal infrared camera at a set moment;

and determining the test result of the target measured thermal infrared camera according to the temperature distribution map and the initial temperature distribution map of the target measured thermal infrared camera.

In a second aspect, an embodiment of the present invention provides a thermal infrared camera testing apparatus, including:

the temperature control module is used for sending a temperature control signal to the temperature control circuit so as to adjust the surface temperature of the target in the environmental test box to a target temperature through the temperature control circuit;

the communication control module is used for sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, and sending a first communication control signal to the multiplexing circuit so as to communicate the communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit; acquiring a temperature distribution map of the target measured by the target measured thermal infrared camera at a set moment;

and the test module is used for determining the test result of the target measured thermal infrared camera according to the temperature distribution map and the initial temperature distribution map of the target measured thermal infrared camera.

In a third aspect, an embodiment of the present invention provides a test apparatus, including:

one or more processors;

a memory for storing one or more programs;

when executed by the one or more processors, cause the one or more processors to implement the method for thermal infrared camera testing as described in the first aspect.

In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored, which when executed by a processor implements the thermal infrared camera testing method according to the first aspect or the thermal infrared camera testing method according to the second aspect.

In a fifth aspect, an embodiment of the present invention provides a test system, including: an environmental test chamber, a target, at least two thermal infrared cameras under test, a multiplexing circuit, a temperature control circuit, and the test apparatus of claim 11; wherein:

the target and each thermal infrared camera to be measured are arranged in the environmental test chamber;

the environmental test chamber is used for providing a test environment for each tested thermal infrared camera.

The embodiment of the invention provides a thermal infrared camera testing method, a thermal infrared camera testing device, thermal infrared camera testing equipment, a thermal infrared camera testing system and a thermal infrared camera testing medium. The method comprises the following steps: sending a temperature control signal to a temperature control circuit to adjust the surface temperature of a target placed in an environmental test chamber to a target temperature through the temperature control circuit; sequentially taking at least two tested thermal infrared cameras in an environment test box as target tested thermal infrared cameras, and sending a first communication control signal to a multiplexing circuit so as to communicate a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit; acquiring a temperature distribution map of a target measured by a target measured thermal infrared camera at a set moment; and determining the test result of the target measured thermal infrared camera according to the temperature distribution graph and the initial temperature distribution graph of the target measured thermal infrared camera. According to the technical scheme, the multiplex circuit is communicated and controlled, the multiplex circuit can be conducted with each thermal infrared camera to be tested, the measured temperature distribution graph can be obtained, automatic testing of the plurality of thermal infrared cameras is achieved, the testing cost is reduced, and the testing efficiency is improved.

Drawings

Fig. 1 is a flowchart of a thermal infrared camera testing method according to an embodiment of the present invention;

fig. 2 is a flowchart of a thermal infrared camera testing method according to a second embodiment of the present invention;

FIG. 3 is a flowchart illustrating the control of the surface temperature of a target according to a third embodiment of the present invention;

FIG. 4 is a schematic diagram of a target provided in a third embodiment of the present invention;

fig. 5 is a schematic diagram of a target and a thermal infrared camera to be measured according to a third embodiment of the present invention;

fig. 6 is a schematic structural diagram of a thermal infrared camera testing apparatus according to a fourth embodiment of the present invention;

fig. 7 is a schematic hardware structure diagram of a testing apparatus according to a fifth embodiment of the present invention;

fig. 8 is a schematic structural diagram of a test system according to a sixth embodiment of the present invention;

fig. 9 is a schematic structural diagram of another test system according to a sixth embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. In addition, the embodiments and features of the embodiments in the present invention may be combined with each other without conflict. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the steps as a sequential process, many of the steps can be performed in parallel, concurrently or simultaneously. In addition, the order of the steps may be rearranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.

It should be noted that the terms "first", "second", and the like in the embodiments of the present invention are only used for distinguishing different apparatuses, modules, units, or other objects, and are not used for limiting the order or interdependence relationship of the functions performed by these apparatuses, modules, units, or other objects.

Example one

Fig. 1 is a flowchart of a thermal infrared camera testing method according to an embodiment of the present invention, which is applicable to a situation where various working environments are simulated through an environmental test chamber to test performance of a thermal infrared camera. Specifically, the thermal infrared camera testing method may be executed by a thermal infrared camera testing apparatus, and the thermal infrared camera testing apparatus may be implemented in a software and/or hardware manner and integrated in the testing device. Further, the test equipment includes, but is not limited to: desktop computer, notebook computer, host computer, industry integration server, system background server and high in the clouds server.

As shown in fig. 1, the method specifically includes the following steps:

and S110, sending a temperature control signal to a temperature control circuit so as to adjust the surface temperature of the target placed in the environmental test chamber to a target temperature through the temperature control circuit.

In this embodiment, to perform a reliability test on the thermal infrared camera, evaluate the adaptability of the thermal infrared camera to different working environments and whether the temperature of the target can be accurately and stably measured in different working environments, place the thermal infrared camera and the target to be measured in an environmental test chamber, and simulate the working environments such as high temperature, low temperature, high humidity, low humidity, or alternating humid heat by using the environmental test chamber. The temperature of the target is controllable, the surface temperature of the target is adjusted to the target temperature, then a temperature distribution graph of the measured thermal infrared camera measured on the target is read, the deviation of the measured thermal infrared camera in measuring the temperature of the target can be analyzed, and the test accuracy and stability under different working environments can be analyzed.

Specifically, the target is a temperature measurement object of the thermal infrared camera to be measured, and can be a current transduction type piece such as a semiconductor refrigerator or a thermoelectric refrigerator, and the like, and based on the peltier effect, the target can be cooled or heated by changing the polarity of the current or the flow direction in the target, so that high-precision temperature control is realized. The surface temperature of the target can be measured by a temperature sensor arranged on the surface of the target, and a reference is provided for accurate control of the surface temperature. The number of the targets can be one or more, the target temperature of each target can be different, but is usually set within the possible temperature range of the measured thermal infrared camera in the working environment, for example, for machine room inspection, the temperature of each computer in the machine room is usually between 20 ° and 60 °, and then the target temperature of the target can include 20 ° and 60 °, so that the measured thermal infrared camera measures the temperature distribution diagram of the target at 20 ° and 60 °, and the measurement performance of the measured thermal infrared camera on the possible upper limit and lower limit of the temperature in the machine room inspection scene can be comprehensively analyzed.

The temperature control circuit is used for driving the target to refrigerate or heat. The input of the temperature control circuit is a temperature control signal sent by the testing equipment, and the output current is used for inputting the target from different ends so as to adjust the temperature of the target. The temperature control circuit can be composed of a field effect tube, a logic element and the like, different pins of the field effect tube can be connected to different ends of the target, on the basis, according to different temperature control signals, the conduction states of the field effect tube are different, the pins of the output current are different, and then the directions of the current flowing into the target are also different, so that the target is cooled or heated.

The temperature control signal can be a level signal, and the direction of the output current input target of the temperature control circuit is controlled by inputting a high level and/or a low level to the temperature control circuit, so that the target is cooled or heated.

S120, sequentially using at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, and sending a first communication control signal to a multiplexing circuit so as to communicate a communication link between test equipment and the target tested thermal infrared cameras through the multiplexing circuit; and acquiring a temperature distribution graph of the target measured by the target measured thermal infrared camera at a set moment.

In this embodiment, the first connection control signal is used to indicate a connection state of a plurality of branches or a plurality of communication links of the multiplexing circuit. The multiplexing circuit can conduct a communication link with the target thermal infrared camera to be detected according to the first communication control signal. The multiplexing circuit is mainly implemented based on a multiplexer, for example, a communication port of the thermal infrared camera to be tested is connected to the multiplexer, a network port of the testing device is also connected to the multiplexer, the testing device inputs a first communication control signal to the multiplexer through an input or output (In/Out, I/O) connection line, one of the thermal infrared cameras to be tested is selected as a target thermal infrared camera to be tested, and a temperature distribution map measured by the target thermal infrared camera to be tested can be read after a communication link is conducted.

It should be noted that, in this embodiment, there may be a plurality of measured thermal infrared cameras, and the test device needs to acquire the temperature distribution map of each measured thermal infrared camera, but in fact, at the same time, the test device can only read data of one measured thermal infrared camera, and by sending the first connection control signal to the multiplexing circuit, the communication link between the multiplexing circuit and any one measured thermal infrared camera can be made conductive, and this measured thermal infrared camera is the target measured thermal infrared camera, and then reads the temperature distribution map of the target measured thermal infrared camera. On the basis, the measured thermal infrared cameras are sequentially used as target measured thermal infrared cameras, and corresponding first communication control signals are sent to the target measured thermal infrared cameras, so that the communication link of each measured thermal infrared camera is sequentially communicated, and the temperature distribution diagram of each measured thermal infrared camera is sequentially read.

Illustratively, when the temperature distribution map of each measured thermal infrared camera needs to be read, the measured thermal infrared camera a is taken as a target measured thermal infrared camera, the corresponding communication link is conducted through the multiplexing circuit, and the currently measured temperature distribution map of the measured thermal infrared camera a is read; and then taking the measured thermal infrared camera B as a target measured thermal infrared camera, conducting a corresponding communication link through a multiplexing circuit, reading a temperature distribution diagram currently measured by the measured thermal infrared camera B, and so on until the temperature distribution diagrams of all the measured thermal infrared cameras are obtained. The temperature profile of each thermal infrared camera under test may be stored locally in the testing device for comparison with a standard test temperature profile (e.g., an initial temperature profile) to analyze the test performance of each thermal infrared camera under test.

Optionally, for the target measured thermal infrared camera, whether the communication link is connected or not may depend on whether a switch between the multiplexing circuit and the target measured thermal infrared camera is connected or not, where the switch is a switch in the multiplexing circuit for connecting each input/output communication port of the target measured thermal infrared camera, and when the switches of each communication port of the target measured thermal infrared camera are connected, data interaction between the test device and the target measured thermal infrared camera may be implemented.

In this embodiment, the temperature distribution map of each thermal infrared camera to be tested may be sequentially read at intervals according to a set period or frequency, so as to periodically analyze the test performance of each thermal infrared camera to be tested at the interval. On the basis, whether the test performance of the tested thermal infrared camera is stable in the continuous working process can be determined.

S130, determining a test result of the target thermal infrared camera to be tested according to the temperature distribution graph and the initial temperature distribution graph of the target thermal infrared camera to be tested.

Specifically, the temperature distribution graph of the target at the set moment read by the target measured thermal infrared camera is compared with the initial temperature distribution graph, if the deviation is within the specified range, the performance of the target measured thermal infrared camera is considered to be normal, and the temperature distribution of the target can be accurately measured; if the deviation exceeds the specified range, the target thermal infrared camera is considered to be incapable of effectively measuring the temperature distribution of the target at the set moment, and the performance of the target thermal infrared camera is marked as abnormal.

In the case that the target temperature of the target is known, the initial temperature distribution map may be stored locally in the testing device, generated based on the set temperature of the target, or generated based on the measurement result of the temperature sensor on the surface temperature of the target, or may be the temperature distribution map in the initial state read by the target measured thermal infrared camera after the surface temperature of the target is adjusted according to the target temperature. It should be noted that, the configuration of different measured thermal infrared cameras may be different, and the angle for capturing the target may be different, so that when different measured thermal infrared cameras are used as the target measured thermal infrared cameras, the corresponding initial temperature profiles may also be different.

According to the thermal infrared camera testing method provided by the embodiment of the invention, the surface temperature of the target is adjusted to the target temperature by sending the temperature control signal to the temperature control circuit, so that a temperature measurement object is provided for the thermal infrared camera to be tested, and the thermal infrared camera to be tested can effectively work; through carrying out intercommunication control to multiplexing circuit, can switch on and acquire its temperature distribution diagram that records with each thermal infrared camera that is surveyed respectively, realized the automated test to a plurality of thermal infrared cameras, reduce the test originally, improve efficiency of software testing.

Example two

Fig. 2 is a flowchart of a thermal infrared camera testing method according to a second embodiment of the present invention, which is optimized based on the second embodiment, and specifically describes a temperature measurement process and a test result determination process of a thermal infrared camera. It should be noted that technical details that are not described in detail in the present embodiment may be referred to any of the above embodiments.

In this embodiment, before sending the first connection control signal to the multiplexing circuit, the method further includes: and sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, sending a second communication control signal to the multiplexing circuit, conducting a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and reading an initial temperature distribution graph of the target tested thermal infrared cameras to the target. By reading the initial temperature distribution map after the target is adjusted to the target temperature and taking the initial temperature distribution map as the comparison reference of the subsequently measured temperature distribution map, the real and effective initial temperature distribution map can be obtained for the target at any target temperature, and the test accuracy and the applicability to different targets are improved.

In this embodiment, at least two measured thermal infrared cameras placed in the environmental test chamber are sequentially used as target measured thermal infrared cameras to send a first connection control signal to the multiplexing circuit, and the method includes: and in each temperature distribution diagram reading period, sequentially taking at least two measured thermal infrared cameras in the environment test box as target measured thermal infrared cameras, and sending a first communication control signal to the multiplexing circuit. The temperature distribution maps of all the tested thermal infrared cameras are periodically and sequentially read according to the temperature distribution map, so that the performance stability of each tested thermal infrared camera in the continuous working process can be determined, and the testing reliability is improved.

In this embodiment, before sending the temperature control signal to the temperature control circuit, the method further includes: and sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, sending a third communication control signal to the multiplexing circuit, conducting a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and writing a corresponding test configuration file into the target tested thermal infrared cameras. By writing in the configuration file, the configuration parameters of the thermal infrared cameras to be tested can be flexibly set so as to realize the performance test of the thermal infrared cameras to be tested under different configuration conditions.

In this embodiment, for the target measured thermal infrared camera, determining a test result of the target measured thermal infrared camera according to the temperature distribution map and the initial temperature distribution map of the target measured thermal infrared camera includes: calculating the difference value between the temperature value of each pixel point in the temperature distribution graph of the target measured thermal infrared camera at the set moment and the temperature value of the corresponding pixel point in the initial temperature distribution graph of the target measured thermal infrared camera; and if the difference value corresponding to each pixel point is in an abnormal state, determining that the test result of the target thermal infrared camera to be tested is in abnormal performance. On the basis, the temperature values of all pixel points of the initial temperature distribution graph and the temperature distribution graph at the set moment are compared, so that the temperature measurement deviation can be determined, and the test reliability is improved.

Specifically, as shown in fig. 2, the method specifically includes the following steps:

s210, sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, sending a third communication control signal to the multiplexing circuit, conducting a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and writing corresponding test configuration files into the target tested thermal infrared cameras.

In this embodiment, the third communication control signal is used to communicate the communication link to configure the target measured thermal infrared camera. And taking each measured thermal infrared camera as a target measured thermal infrared camera in sequence, conducting a communication link for the target measured thermal infrared camera through a multiplexing circuit according to a third communication control signal, and writing a corresponding test configuration file into the target measured thermal infrared camera, wherein configuration parameters such as resolution, focal length and the like are stored in the test configuration file so as to complete the configuration of the target measured thermal infrared camera, and thus the performance of the target measured thermal infrared camera under corresponding configuration is tested. On the basis, the configuration of the thermal infrared cameras to be detected is completed one by one.

And S220, sending a temperature control signal to a temperature control circuit so as to adjust the surface temperature of the target in the environmental test box to a target temperature through the temperature control circuit.

And S230, sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, sending a second communication control signal to the multiplexing circuit, conducting the communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and reading an initial temperature distribution graph of the target tested thermal infrared cameras to the target.

In this embodiment, the second communication control signal is used to communicate the communication link to read an initial temperature distribution map of the target measured by the target measured thermal infrared camera. For the target thermal infrared camera to be tested, the communication link is conducted through the multiplexing circuit, the corresponding initial temperature distribution graph is read, the initial measurement result of the target thermal infrared camera to be tested on the target temperature is recorded and is used as a comparison reference of the subsequently measured temperature distribution graph, so that the performance stability of the target thermal infrared camera to be tested in the continuous working process is determined, and the testing reliability is improved. On the basis, each measured thermal infrared camera is sequentially used as a target measured thermal infrared camera, and the test equipment can read the initial temperature distribution graph of each measured thermal infrared camera to the target one by one.

And S240, in each temperature distribution graph reading period, sequentially using at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, sending a first communication control signal to the multiplexing circuit, so as to communicate the test equipment with a communication link of the target tested thermal infrared cameras through the multiplexing circuit, and obtaining the temperature distribution graph measured by the target tested thermal infrared cameras on the target at the set moment.

Specifically, the operation of reading the temperature profile is performed in accordance with the temperature profile reading period. The thermographic profile reading period may refer to the interval between a plurality of set moments being tested, or the time interval between two readings of the thermographic profile for a thermal infrared camera, such as 5 minutes or 10 minutes.

For example, in the first period of reading the temperature distribution map, the measured thermal infrared camera a is taken as the target measured thermal infrared camera, the corresponding communication link is conducted through the multiplexing circuit, and the measured thermal infrared camera a is read at t_A1Time (t)_A1The time may be the start time of the first thermographic profile reading period); then taking the measured thermal infrared camera B as a target measured thermal infrared camera, conducting a corresponding communication link through a multiplexing circuit and reading the measured thermal infrared camera B at t_B1The temperature distribution diagram measured at a moment is analogized until the temperature distribution diagrams of all the measured thermal infrared cameras in the first temperature distribution diagram reading period are obtained; then, when entering a second temperature distribution diagram reading period, firstly taking the measured thermal infrared camera A as a target measured thermal infrared camera, conducting a corresponding communication link through a multiplexing circuit and reading the measured thermal infrared camera A at t_A2Time (t)_A2The time may be the start time of the second thermographic profile reading period); then taking the measured thermal infrared camera B as a target measured thermal infrared camera, conducting a corresponding communication link through a multiplexing circuit and reading the measured thermal infrared camera B at t_B2And (4) the temperature distribution diagrams measured at the moment are analogized until the temperature distribution diagrams of all the measured thermal infrared cameras in the second temperature distribution diagram reading period are obtained. On the basis, the performance stability test of the thermal infrared camera in the continuous working process can be realized.

And S250, calculating the difference value between the temperature value of each pixel point in the temperature distribution graph of the target measured thermal infrared camera at the set moment and the temperature value of the corresponding pixel point in the initial temperature distribution graph of the target measured thermal infrared camera.

In this embodiment, for the target measured thermal infrared camera, whether the measurement result of the target measured thermal infrared camera at the set time has a large deviation is determined according to the difference between the initial temperature distribution map and the temperature values of the corresponding pixels in the temperature distribution map at the set time, if so, it is indicated that the target measured thermal infrared camera cannot accurately, stably or continuously measure the surface temperature of the target, and the test result is performance abnormality.

S260, the corresponding difference value of each pixel is in an abnormal state? If yes, go to S280; otherwise, S270 is executed.

Illustratively, after the target reaches the target temperature, the test equipment starts an environmental test chamber and an internal test program, communicates with each thermal infrared camera to be tested one by one through a multiplexing circuit, reads an initial temperature distribution diagram of each thermal infrared camera to be tested, and stores the initial temperature distribution diagram into the data storage device. And then, reading the temperature distribution diagram of each tested thermal infrared camera one by the testing equipment every 10 minutes, simultaneously reading the current operating parameters of the environmental test box through an RS232 serial port, and storing the temperature distribution diagram and the corresponding environmental parameters into a data storage device. And subtracting the initial temperature distribution map from the temperature distribution map read by each thermal infrared camera to obtain the difference value of the temperature value of each pixel point, determining whether the difference value corresponding to each pixel point is in an abnormal state or not, and marking the corresponding thermal infrared camera to be tested as performance abnormity in the test result if the difference value is in the abnormal state.

The difference value corresponding to each pixel point is an abnormal state, and mainly means that the measurement result at the set time has a larger deviation compared with the initial temperature distribution map. Specifically, the abnormal state includes at least one of:

1) the mean value, the minimum value or the maximum value of the difference values corresponding to each pixel point exceeds a first threshold value; for example, if the measured thermal infrared camera a is initially taken as the target measured thermal infrared camera, the temperature value corresponding to each pixel point in the initial temperature distribution map is (s1, s2, s3, …, sn), the temperature value corresponding to each pixel point in the temperature distribution map at the time T1 is (s1 ', s 2', s3 ', …, sn'), and the difference value of the temperature values of each pixel point is (d1 ', d 2', d3 ', …, dn'), the difference value corresponding to each pixel point is an abnormal state if the mean value of d1 ', d 2', d3 ', …, dn' exceeds the first threshold T1, which indicates that the deviation between the measurement result at the time T1 and the initial temperature distribution map is too large, and the test result of the target measured thermal infrared camera is a performance abnormality.

2) The variance or standard deviation of the difference value corresponding to each pixel point exceeds a second threshold value; for example, the measured thermal infrared camera a is initially taken as the target measured thermal infrared camera, the temperature value corresponding to each pixel point in the initial temperature distribution map is (s1, s2, s3, …, sn '), the temperature value corresponding to each pixel point in the temperature distribution map at the time T1 is (s1 ', s2 ', s3 ', …, sn '), the difference value of the temperature values of each pixel point is (d1 ', d2 ', d3 ', …, dn '), if the variance of d1 ', d2 ', d3 ', …, dn ' exceeds the second threshold T2, the fluctuation of the difference value corresponding to each pixel point is large, which indicates that the stability degree measured for different pixel points is inconsistent, and the test result of the target measured thermal infrared camera is performance abnormality.

3) The number of the pixel points of which the corresponding difference value exceeds the third threshold value exceeds a set number; for example, the measured thermal infrared camera a is initially taken as the target measured thermal infrared camera, the temperature value corresponding to each pixel point in the initial temperature distribution map is (s1, s2, s3, …, sn '), the temperature value corresponding to each pixel point in the temperature distribution map at the time T1 is (s1 ', s2 ', s3 ', …, sn '), and the difference value of the temperature values of each pixel point is (d1 ', d2 ', d3 ', …, dn '), if the number of the d1 ', d2 ', d3 ', …, dn ' exceeding the three-threshold T3 exceeds the set number, the measured deviation before and after the number of the pixel points is large, which indicates that the measurement of more pixel points is inaccurate, and the test result of the target measured thermal infrared camera is performance abnormality.

4) The proportion of the number of the pixels of which the corresponding difference value exceeds the fourth threshold value to the total number of the pixels exceeds a set proportion; for example, the thermal infrared camera a to be measured is initially taken as a target thermal infrared camera to be measured, the temperature value corresponding to each pixel point in the initial temperature distribution map is (s1, s2, s3, …, sn), the temperature value corresponding to each pixel point in the temperature distribution map at the time T1 is (s1 ', s 2', s3 ', …, sn'), and the difference value between the temperature values of each pixel point is (d1 ', d 2', d3 ', …, dn'), if the ratio of the number of the pixels exceeding the four threshold T4 in the d1 ', d 2', d3 ', …, dn' to the total number n of the pixel points exceeds the set ratio, the measured deviation before and after more pixel points is large, which indicates that the measurement of more pixel points is inaccurate, and the test result of the target thermal infrared camera to be measured is performance abnormality.

And S270, determining that the test result of the target thermal infrared camera to be tested is normal in performance.

S280, determining that the test result of the target thermal infrared camera to be tested is abnormal in performance.

It should be noted that S250-S280 may be performed after each measured thermal infrared camera is read as the temperature distribution map of the target measured thermal infrared camera, that is, each time one temperature distribution map of the measured thermal infrared camera is read in one temperature distribution map reading period, the test result of the measured thermal infrared camera is analyzed; after the temperature distribution maps of all the thermal infrared cameras to be measured are read, that is, after the temperature distribution maps of all the thermal infrared cameras to be measured are read in one temperature distribution reading period, each thermal infrared camera to be measured is sequentially used as a target thermal infrared camera to be measured, and the test result of each thermal infrared camera to be measured is determined respectively.

According to the thermal infrared camera testing method provided by the embodiment II of the invention, optimization is carried out on the basis of the embodiment, the initial temperature distribution map is read after the target is adjusted to the target temperature and is used as the comparison reference of the subsequently measured temperature distribution map, the real and effective initial temperature distribution map can be provided for the target at any target temperature, and the testing accuracy and the applicability to different targets are improved; the temperature distribution maps of all the tested thermal infrared cameras are periodically and sequentially read according to the temperature distribution map reading, so that the performance stability of the target tested thermal infrared camera in the continuous working process can be determined, and the testing reliability is improved; configuration parameters of the thermal infrared camera to be tested can be flexibly set by writing in the configuration file, so that flexible testing of the thermal infrared camera to be tested under different configuration conditions is realized; by comparing the temperature values of the pixel points of the initial temperature distribution graph and the temperature distribution graph at the set moment, the temperature measurement deviation can be accurately determined, and the test reliability is improved.

EXAMPLE III

Fig. 3 is a flowchart of controlling the surface temperature of the target according to a third embodiment of the present invention, which is optimized based on the third embodiment, and the process of controlling the surface temperature of the target is specifically described. It should be noted that technical details that are not described in detail in the present embodiment may be referred to any of the above embodiments.

In this embodiment, sending a temperature control signal to a temperature control circuit to adjust a surface temperature of a target placed in an environmental test chamber to a target temperature by the temperature control circuit includes: sending a detection signal to a temperature sensor so as to detect the surface temperature of the target in real time through the temperature sensor; if the surface temperature is higher than the upper limit of the temperature range of the target temperature, sending a first level signal to the temperature control circuit so as to enable the current output by the temperature control circuit to flow into the target from a first direction until the surface temperature is reduced to be within the temperature range of the target temperature; if the surface temperature is lower than the lower limit of the temperature range of the target temperature, a second level signal is sent to the temperature control circuit for enabling the current output by the temperature control circuit to flow into the target from a second direction until the surface temperature is increased to be within the temperature range of the target temperature; and if the surface temperature is in the temperature range of the target temperature, alternately inputting a first level signal and a second level signal to the temperature control circuit so as to maintain the surface temperature of the target in the temperature range. On the basis, the target can be refrigerated or heated by controlling the flow direction of the current output by the temperature control circuit in the target, so that the surface temperature of the target is maintained in a temperature range, the stability of the surface temperature of the target is kept, and the performance of the tested thermal infrared camera is conveniently and accurately tested.

Specifically, as shown in fig. 3, the method specifically includes the following steps:

and S310, sending a detection signal to the temperature sensor.

And S320, detecting the surface temperature of the target in real time through a temperature sensor.

In this embodiment, the target may be a semiconductor refrigerator, which is a device for producing cold by using the thermoelectric effect of a semiconductor, and after the power is turned on, an electron-hole pair is generated near the upper contact, so that the internal energy is reduced, the temperature is lowered, and heat is absorbed to the outside, which is called as a cold end; the other end is called a hot end because the electron hole pairs are compounded, the internal energy is increased, the temperature is increased, and heat is released to the environment; if the power supply is reversed, the temperature at the junction will exhibit the opposite change. The testing equipment can control the surface temperature of the side, facing the tested thermal infrared camera, of the semiconductor refrigerator to be increased or decreased, and the surface temperature of the semiconductor refrigerator is detected and recorded in real time through the temperature sensor. The target can be a plurality of targets, the target temperature of each target is different, and each target corresponds to one temperature sensor.

S330, the upper limit of the temperature range in which the surface temperature is higher than the target temperature? If yes, go to S350; if not, go to S340.

S340, lower limit of temperature range where surface temperature is lower than target temperature? If yes, executing S360; otherwise, S370 is performed.

And S350, sending a first level signal to the temperature control circuit to enable the current output by the temperature control circuit to flow into the target from a first direction so as to reduce the surface temperature.

For example, in the case where the surface temperature is higher than the upper limit of the temperature range of the target temperature, the first level signal may cause a current to flow into the target from a first direction, i.e., from the cathode to the anode of the target, thereby gradually decreasing the surface temperature of the target to within the temperature range of the target temperature.

And S360, sending a second level signal to the temperature control circuit for the first time, so that the current output by the temperature control circuit flows into the target from a second direction, and the surface temperature is increased. For example, in the case where the surface temperature is below the lower limit of the temperature range of the target temperature, the second level signal may cause current to flow into the target from a second direction, i.e., from the positive pole to the negative pole of the target, thereby gradually increasing the surface temperature of the target to within the temperature range of the target temperature.

S370, is the surface temperature within the temperature range of the target temperature? If yes, go to S380; if not, the process returns to S330.

And S380, alternately inputting the first level signal and the second level signal to the temperature control circuit so as to maintain the surface temperature of the target within the temperature range.

For example, in the case where the surface temperature belongs to the temperature range of the target temperature, the test apparatus alternately inputs high and low level signals to the temperature control circuit, and no current passes through the target, thereby maintaining the surface temperature of the target within the temperature range of the target temperature.

It should be noted that the temperature control signal in this embodiment may be output by the testing apparatus through a plurality of pins, each of which may output a high level signal or a low level signal, that is, the first level signal and the second level signal may be used to distinguish a combined state in which the respective pins output a high level or a low level, corresponding to different current directions of the current in the target. For example, the first level signal may mean that the test equipment outputs a high level through one pin and a low level through the other pin.

Optionally, the method further includes: sending a parameter adjusting signal to the environmental test chamber to adjust the operating parameters of the environmental test chamber according to the working mode to be tested; wherein, the working mode to be tested comprises at least one of the following: the temperature setting mode, the humidity setting mode, the temperature and humidity setting mode, the alternating temperature mode, the alternating humidity mode and the alternating temperature and humidity mode.

In this embodiment, through the operating parameter of adjustment environmental test case, can simulate different mode or operational environment, test the performance of being surveyed thermal infrared camera comprehensively. The operation parameters of the environmental test chamber mainly comprise temperature and/or humidity, and the work mode to be tested mainly comprises a high-temperature mode (such as 95 ℃), a low-temperature mode (such as 0 ℃), a high-humidity mode (such as 40%), a low-humidity mode (such as 5%), an alternating temperature mode (such as 95 ℃ and 0 ℃) alternating, an alternating humidity mode (such as 40% and 5% alternating), an alternating temperature and humidity mode 40% (such as 95 ℃ and 40%, 0 ℃ and 5% alternating) and the like.

Optionally, the test device may be connected to the environmental test chamber through RS232 to read the current operating parameters of the environmental test chamber.

It should be noted that although the operation parameters of the environmental test chamber are variable, the surface temperature of the target is maintained within the temperature range of the target temperature, so as to test whether the thermal infrared camera to be tested can accurately and stably measure the temperature distribution map of the target in different environments.

Optionally, the operation parameters of the working mode to be tested or the environmental test chamber may be adjusted according to the temperature distribution reading period, for example, the operation parameters are adjusted once every M (M ≧ 1) temperature distribution reading periods.

Optionally, the number of targets is at least two; the target temperature corresponding to each target is different; the field of view of each measured thermal infrared camera encompasses all or part of the area of each target.

Fig. 4 is a schematic diagram of a target provided in the third embodiment of the present invention. As shown in fig. 4, there are two targets, one target has a target temperature of 20 ℃, the other target has a target temperature of 60 ℃, and in the temperature distribution diagram, a 20 ℃ region and a 60 ℃ region should be included, so as to determine the test accuracy of the thermal infrared camera to be tested for different temperatures, and improve the test comprehensiveness.

Fig. 5 is a schematic diagram of a target and a thermal infrared camera to be measured according to a third embodiment of the present invention. As shown in FIG. 5, the semiconductor cooler 1 and the semiconductor cooler 2, which are targets of the thermal infrared cameras 1 to 5 to be tested, are placed inside the environmental test chamber together with the thermal infrared cameras 1 to 5 to be tested, and the semiconductor cooler 1 and the semiconductor cooler 2 are both present in the visual field of the thermal infrared cameras 1 to 5 to be tested. Semiconductor cooler 1 is set to 20 ℃ temperature plane (computer low temperature section in the analog data room), semiconductor cooler 2 is set to 60 ℃ (computer high temperature section in the analog data room), and semiconductor coolers with different temperatures are isolated. And controlling the environmental test chamber to pass through working modes or working environments such as high temperature, low temperature, high humidity, alternating temperature and humidity and the like.

It should be noted that each semiconductor refrigerator can theoretically simulate any temperature. For one target, the temperature control range can be increased by connecting a plurality of semiconductor refrigerators in series.

As shown in fig. 5, the process of testing the plurality of thermal infrared cameras includes:

placing the tested thermal infrared camera 1-5 and the semiconductor refrigerators 1 and 2 in an environment test box, and setting the target temperatures of the semiconductor refrigerators 1 and 2 to be 20 ℃ and 60 ℃ respectively. The method comprises the following steps that test equipment calls a test configuration file corresponding to each tested thermal infrared camera, and writes corresponding test configuration files into the tested thermal infrared cameras 1-5 one by controlling the communication state of an I/O connecting line;

after the semiconductor refrigerators 1 and 2 respectively reach corresponding target temperatures, the test equipment starts an environmental test box and an internal test program of the controller, communicates with the tested thermal infrared cameras 1 to 5 one by one through an Ethernet port, reads an initial temperature distribution map of each tested thermal infrared camera 1 to 5, and stores the initial temperature distribution map in a data storage device;

every 10 minutes, the test equipment reads the temperature distribution diagram of the tested thermal infrared camera 1-5 at a set moment one by one, reads the current operating parameters of the environmental test box through an RS232 serial port, and stores the temperature distribution diagram and the corresponding environmental parameters into a data storage device;

the testing equipment subtracts the temperature value of each pixel point in the temperature distribution diagram at the set moment measured by each measured thermal infrared camera from the temperature value of the corresponding pixel point in the corresponding initial temperature distribution diagram to obtain the temperature value difference value of each pixel point, and if the temperature value difference value of each pixel point is one field, the temperature distribution diagram at the set moment and the corresponding environment parameter are marked as abnormal performance.

The thermal infrared camera testing method provided by the third embodiment of the invention is optimized on the basis of the above embodiments, and can realize refrigeration or heating of the target by controlling the flow direction of the current output by the temperature control circuit in the target, so that the surface temperature of the target is maintained in a temperature range, the stability of the surface temperature of the target is kept, and the performance of the tested thermal infrared camera is conveniently and accurately tested; by adjusting the operating parameters of the environmental test chamber, different working modes or working environments can be simulated, and the comprehensiveness and flexibility of the test are improved.

Example four

Fig. 6 is a schematic structural diagram of a thermal infrared camera testing apparatus according to a fourth embodiment of the present invention. As shown in fig. 6, the thermal infrared camera testing apparatus provided in this embodiment includes:

atemperature control module 410 for sending a temperature control signal to a temperature control circuit to adjust a surface temperature of a target placed in an environmental test chamber to a target temperature by the temperature control circuit;

thecommunication control module 420 is configured to sequentially use at least two measured thermal infrared cameras placed in the environmental test chamber as target measured thermal infrared cameras, and send a first communication control signal to a multiplexing circuit to communicate a communication link between the test equipment and the target measured thermal infrared cameras through the multiplexing circuit; acquiring a temperature distribution map of the target measured by the target measured thermal infrared camera at a set moment;

thetesting module 430 is configured to determine a testing result of the target measured thermal infrared camera according to the temperature distribution map and the initial temperature distribution map of the target measured thermal infrared camera.

According to the thermal infrared camera testing device provided by the fourth embodiment of the invention, the multiplex circuit is communicated and controlled, so that the device can be conducted with each thermal infrared camera to be tested and obtain the temperature distribution diagram measured by the thermal infrared camera to be tested, the automatic testing of a plurality of thermal infrared cameras is realized, the testing cost is reduced, and the testing efficiency is improved.

On the basis of the above embodiment, the apparatus further includes:

and the initial reading module is used for sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras before sending the temperature control signals to the temperature control circuit, sending second communication control signals to the multiplexing circuit, conducting a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and reading an initial temperature distribution graph measured by the target tested thermal infrared cameras on the target.

On the basis of the foregoing embodiment, thecommunication control module 420 is specifically configured to:

and in each temperature distribution diagram reading period, sequentially taking at least two measured thermal infrared cameras in the environment test box as target measured thermal infrared cameras, and sending a first communication control signal to the multiplexing circuit.

On the basis of the above embodiment, the apparatus further includes:

and the configuration module is used for sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras before sending the temperature control signals to the temperature control circuit, sending a third communication control signal to the multiplexing circuit, conducting a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and writing corresponding test configuration files into the target tested thermal infrared cameras.

On the basis of the above embodiment, the temperature control signal includes a first level signal and/or a second level signal;

a temperature control module comprising:

the temperature detection unit is used for sending a detection signal to a temperature sensor so as to detect the surface temperature of the target in real time through the temperature sensor;

the temperature adjusting unit is used for sending a first level signal to the temperature control circuit if the surface temperature is higher than the upper limit of the temperature range of the target temperature so as to enable the current output by the temperature control circuit to flow into the target from a first direction until the surface temperature is reduced to be within the temperature range of the target temperature;

if the surface temperature is lower than the lower limit of the temperature range of the target temperature, a second level signal is sent to the temperature control circuit for enabling the current output by the temperature control circuit to flow into the target from a second direction until the surface temperature is increased to be within the temperature range of the target temperature;

and if the surface temperature is in a temperature range of the target temperature, alternately inputting a first level signal and a second level signal to the temperature control circuit so as to maintain the surface temperature of the target in the temperature range.

On the basis of the above embodiment, the apparatus further includes:

the parameter adjusting module is used for sending a parameter adjusting signal to the environmental test chamber so as to adjust the running parameters of the environmental test chamber according to the working mode to be tested;

wherein, the working mode to be tested comprises at least one of the following:

the temperature setting mode, the humidity setting mode, the temperature and humidity setting mode, the alternating temperature mode, the alternating humidity mode and the alternating temperature and humidity mode.

On the basis of the above embodiment, the test module includes:

the calculation unit is used for calculating the difference value between the temperature value of each pixel point in the temperature distribution diagram of the target measured thermal infrared camera at the set moment and the temperature value of the corresponding pixel point in the initial temperature distribution diagram of the target measured thermal infrared camera;

and the test unit is used for determining that the test result of the target thermal infrared camera to be tested is abnormal in performance if the corresponding difference value of each pixel point is in an abnormal state.

On the basis of the above embodiment, the abnormal state includes at least one of:

the mean value, the minimum value or the maximum value of the difference values corresponding to the pixel points exceeds a first threshold value;

the variance or standard deviation of the difference value corresponding to each pixel point exceeds a second threshold value;

the number of the pixel points of which the corresponding difference value exceeds the third threshold value exceeds a set number;

the proportion of the number of the pixels of which the corresponding difference value exceeds the fourth threshold value to the total number of the pixels exceeds a set proportion.

On the basis of the above embodiment, the number of the targets is at least two;

the target temperature corresponding to each target is different;

the visual field range of each measured thermal infrared camera comprises all or part of the area of each target. .

The thermal infrared camera testing device provided by the fifth embodiment of the invention can be used for executing the thermal infrared camera testing method provided by any embodiment, and has corresponding functions and beneficial effects.

EXAMPLE five

Fig. 7 is a schematic diagram of a hardware structure of a testing apparatus according to a fifth embodiment of the present invention. The test equipment includes, but is not limited to: desktop computer, notebook computer, host computer, industry integration server, system background server and high in the clouds server. As shown in fig. 7, the testing apparatus provided in the present application includes amemory 52, aprocessor 51, and a computer program stored in the memory and executable on the processor, and when theprocessor 51 executes the computer program, the thermal infrared camera testing method is implemented.

The test equipment may also include amemory 52; the number of theprocessors 51 in the test device may be one or more, and oneprocessor 51 is taken as an example in fig. 7; thememory 52 is used to store one or more programs; the one or more programs are executed by the one ormore processors 51, such that the one ormore processors 51 implement the thermal infrared camera testing method as described in the embodiments of the present application.

The test apparatus further comprises: acommunication device 53, aninput device 54 and anoutput device 55.

Theprocessor 51, thememory 52, the communication means 53, the input means 54 and the output means 55 in the test device may be connected by a bus or other means, as exemplified by the bus connection in fig. 7.

Theinput device 54 may be used to receive entered numeric or character information and to generate key signal inputs relating to user settings and functional control of the test apparatus. Theoutput device 55 may include a display device such as a display screen.

The communication means 53 may comprise a receiver and a transmitter. Thecommunication device 53 is configured to perform information transceiving communication according to the control of theprocessor 51.

Thememory 52, as a computer-readable storage medium, may be configured to store software programs, computer-executable programs, and modules, such as program instructions/modules corresponding to the thermal infrared camera testing method according to the embodiment of the present application (for example, the temperature control module, the communication control module, and the testing module 0 in the thermal infrared camera testing apparatus). Thememory 52 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to use of the test equipment, and the like. Further, thememory 52 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device. In some examples, thememory 52 may further include memory located remotely from theprocessor 51, which may be connected to the test equipment over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

On the basis of the above embodiments, the present embodiment also provides a computer-readable storage medium on which a computer program is stored, the program, when being executed by the thermal infrared camera testing apparatus, implementing the thermal infrared camera testing method or the information display method in any of the above embodiments of the present invention.

The thermal infrared camera test method comprises the following steps: sending a temperature control signal to a temperature control circuit to adjust a surface temperature of a target placed in an environmental test chamber to a target temperature by the temperature control circuit; sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, and sending a first communication control signal to a multiplexing circuit so as to communicate a communication link between test equipment and the target tested thermal infrared cameras through the multiplexing circuit; acquiring a temperature distribution map of the target measured by the target measured thermal infrared camera at a set moment; and determining the test result of the target measured thermal infrared camera according to the temperature distribution map and the initial temperature distribution map of the target measured thermal infrared camera.

Embodiments of the present invention provide a storage medium including computer-executable instructions, which may take any combination of one or more computer-readable media. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. The computer-readable storage medium may be, for example, but is not limited to: an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a Read Only Memory (ROM), an Erasable Programmable Read Only Memory (EPROM), a flash Memory, an optical fiber, a portable CD-ROM, an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. A computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take a variety of forms, including, but not limited to: an electromagnetic signal, an optical signal, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.

Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, Radio Frequency (RF), etc., or any suitable combination of the foregoing.

Computer program code for carrying out operations for aspects of the present application may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C + +, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).

From the above description of the embodiments, it is obvious for those skilled in the art that the present invention can be implemented by software and necessary general hardware, and certainly, can also be implemented by hardware, but the former is a better embodiment in many cases. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which may be stored in a computer-readable storage medium, such as a floppy disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a FLASH Memory (FLASH), a hard disk or an optical disk of a computer, and includes several instructions for enabling a computer device (which may be a personal computer, a server, or a network device) to execute the thermal infrared camera testing method according to the embodiments of the present invention.

EXAMPLE six

The sixth embodiment of the invention provides a test system. Fig. 8 is a schematic structural diagram of a test system according to a sixth embodiment of the present invention. As shown in fig. 8, the system includes: the system comprises anenvironmental test chamber 610, atarget 620, at least two thermalinfrared cameras 630 to be tested, amultiplexing circuit 640, atemperature control circuit 660 and atest device 650; wherein: thetarget 620 and each measured thermalinfrared camera 630 are arranged in theenvironmental test chamber 610; theenvironmental test chamber 610 is used to provide a test environment for each thermalinfrared camera 630 being tested.

Optionally, themultiplexing circuit 640 includes a multiplexer, at least one input or output I/O connection line, and a switch corresponding to each measured thermalinfrared camera 630; thetest equipment 650 is connected with the signal input end of the multiplexer through each I/O connecting line; the data communication end of the multiplexer is connected with the corresponding measured thermalinfrared camera 630 through each switch; thetest equipment 650 controls the conduction state of the switches through the I/O connection lines.

Fig. 9 is a schematic structural diagram of another test system according to a sixth embodiment of the present invention. As shown in fig. 9, thetest equipment 650 may input a communication control signal to the multiplexer through the I/O connection line to select which communication link between thetest equipment 650 and which thermalinfrared camera 630 under test is turned on. The thermalinfrared cameras 630 to be tested are connected to the multiplexer, the Ethernet port of thetesting device 650 is also connected to the multiplexer, and thetesting device 650 can be selectively conducted with any one of the thermalinfrared cameras 630 to read the measured temperature distribution diagram through the I/O connection line. Thetest equipment 650 is connected to theenvironmental test chamber 610 through the RS232, and can read the current operating parameters of theenvironmental test chamber 610.

It should be noted that if there are n I/O connection lines, the connection control signal of each I/O connection line may correspond to a binary status bit 0 or 1, and the total number of the three I/O connection lines is 2ⁿThe connection control signal can be at most 2 pairsⁿA thermal infrared camera was used for the test.

In fig. 9, taking five tested thermalinfrared cameras 630 and three I/O connection lines (denoted as IO1, IO2, and IO3) as an example, assuming that the state bit corresponding to the connection control signal of the three I/O connection lines is 000, the communication link between thetest equipment 650 and the first tested thermalinfrared camera 630 can be conducted, that is, the switch SW1 is conducted, where the SW1 includes four sub-switches, which are respectively connected to the positive and negative electrodes of the transmission communication port (TX) and the positive and negative electrodes of the reception communication port (RX) of the first tested thermalinfrared camera 630;

assuming that the corresponding status bit of the connection control signals of the three I/O connection lines is 001, the communication link between thetesting device 650 and the second thermalinfrared camera 630 to be tested can be turned on, i.e. the switch SW2 is turned on;

assuming that the corresponding status bit of the connection control signals of the three I/O connection lines is 010, the communication link between thetest equipment 650 and the third thermalinfrared camera 630 to be tested can be conducted, i.e. the switch SW3 is turned on;

assuming that the state bit corresponding to the connection control signals of the three I/O connection lines is 011, the communication link between thetest equipment 650 and the fourth thermalinfrared camera 630 to be tested can be turned on, i.e. the switch SW4 is turned on;

assuming that the corresponding status bit of the connection control signals of the three I/O connection lines is 100, the communication link between thetest equipment 650 and the fifth thermalinfrared camera 630 under test can be turned on, i.e., the switch SW5 is turned on.

Optionally, thetemperature control circuit 660 includes a field effect transistor, a power supply, and a logic element; thetest equipment 650 is connected to an input terminal of thetemperature control circuit 660 through an enable pin and a direction selection pin; the output of thetemperature control circuit 660 is connected to thetarget 620.

Wherein, the Field Effect Transistor mainly refers to a Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET or MOS), and comprises an N-type substrate, a p-channel, a MOS (Positive channel Metal Oxide Semiconductor, PMOS) tube for carrying current by the flowing of a cavity and an MOS (N-Metal-Oxide-Semiconductor, NMOS) tube for N-type Metal Oxide Semiconductor; the logic elements include or gates, and gates, not gates, and the like. The power supply is used to generate a voltage for the fet, and the fet and logic element combination is used to control the direction of current flow and input current to different terminals of thetarget 620.

As shown in fig. 9, there are twotargets 620, and for theupper target 620, thetest equipment 650 inputs a temperature control signal through the ENABLE pin ENABLE1 and the direction select pin DIR 1; ENABLE1 is connected to the gate (G pole) of PMOS Q1 through NOT gate 1, OR gate 1, ENABLE1 is also connected to the G pole of NMOS Q2 through AND gate 1; DIR1 is connected to the G pole of NMOS Q2 through AND gate 1; the S-pole of Q1 is commonly connected to the positive pole oftarget 620 with the D-pole of Q2;

ENABLE1 is also connected to the G-pole of PMOS Q3 via NOT-gate 2, OR-gate 2, ENABLE1 is also connected to the G-pole of NMOS Q4 via AND-gate 2; DIR1 is also connected to the G pole of NMOS Q4 through AND gate 2; the D pole of Q3 and the S pole of Q4 are commonly connected to the negative pole of the target.

The D pole of Q1 and the S pole of Q3 are connected with a 12V power supply; the S pole of Q2 and the D pole of Q4 are grounded.

For theupper target 620, the temperature control principle is as follows: a target temperature such as 20 deg.c is set, and the surface temperature thereof is detected by a temperature sensor. If the current surface temperature is higher than 20 ℃, the first level signal may indicate that the test equipment 650 outputs a high level through ENABLE1 and DIR1, at this time, the PMOS Q1 is turned off, the Q3 is turned on, the NMOS Q2 is turned on, the Q4 is turned off, the current flows from the cathode to the anode of the target 620, and the cooling temperature starts to decrease toward the side of the measured thermal infrared camera 630; if the current surface temperature is lower than 20 ℃, the second level signal may indicate that the test equipment 650 outputs a high level through ENABLE1, the DIR1 outputs a low level, at this time, the PMOS Q1 is turned on, the Q3 is turned off, the NMOS Q2 is turned off, the Q4 is turned on, the power flows from the anode to the cathode of the target 620, and the heating temperature starts to rise toward the side of the measured thermal infrared camera 630; if the side of the target 620 facing the measured thermal infrared camera 630 reaches the temperature range of the target temperature, the testing device 650 outputs high and low levels alternately through ENABLE1 and DIR1, at this time, PMOS Q1 and Q3 are cut off, NMOS Q2 and Q4 are cut off, no current flows through the target 620, no cooling or heating is performed, the target 620 faces the side of the measured thermal infrared camera 630, the temperature is maintained in the temperature range, and the surface temperature of the target 620 continues to be detected in real time through the temperature sensor.

For thelower target 620, thetest equipment 650 inputs a temperature control signal through an ENABLE pin ENABLE2 and a direction selection pin DIR2, wherein the connection relationship between each MOS transistor and the logic element and the temperature control principle can refer to theupper target 620.

Optionally, the system further comprises: atemperature sensor 670 coupled to thetesting device 650, thetemperature sensor 670 configured to detect a surface temperature of thetarget 620. As shown in fig. 9, each target corresponds to atemperature sensor 670, and thetemperature sensors 670 are coupled to thetesting device 650 to report the surface temperature of thecorresponding target 620 to thetesting device 650.

Optionally, the number of thetargets 620 is at least two, and the target temperature corresponding to eachtarget 620 is different; the field of view of each of the thermalinfrared cameras 630 under test encompasses all or a portion of the area of eachtarget 620.

The test system provided by the sixth embodiment can be used for executing the test method of the thermal infrared camera provided by any embodiment, and has corresponding functions and beneficial effects.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A thermal infrared camera test method is characterized by comprising the following steps:

2. The method of claim 1, further comprising, prior to sending the first connection control signal to the multiplexing circuit:

and sequentially taking at least two tested thermal infrared cameras in the environmental test box as target tested thermal infrared cameras, sending a second communication control signal to the multiplexing circuit, so as to conduct a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and reading an initial temperature distribution graph of the target tested thermal infrared cameras to the target.

3. The method according to claim 2, wherein the sending the first connection control signal to the multiplexing circuit by using at least two measured thermal infrared cameras placed in the environmental test chamber as target measured thermal infrared cameras in sequence comprises:

4. The method of claim 1, prior to sending the temperature control signal to the temperature control circuit, further comprising:

and sequentially taking at least two tested thermal infrared cameras in the environment test box as target tested thermal infrared cameras, sending a third communication control signal to the multiplexing circuit, conducting a communication link between the test equipment and the target tested thermal infrared cameras through the multiplexing circuit, and writing corresponding test configuration files into the target tested thermal infrared cameras.

5. The method of claim 1, wherein the temperature control signal comprises a first level signal and/or a second level signal;

the sending of the temperature control signal to the temperature control circuit to adjust the surface temperature of the target placed in the environmental test chamber to a target temperature by the temperature control circuit includes:

sending a detection signal to a temperature sensor to detect the surface temperature of the target in real time through the temperature sensor;

if the surface temperature is higher than the upper limit of the temperature range of the target temperature, sending a first level signal to the temperature control circuit so as to enable the current output by the temperature control circuit to flow into the target from a first direction until the surface temperature is reduced to be within the temperature range of the target temperature;

6. The method of claim 1, further comprising:

sending a parameter adjusting signal to the environmental test chamber so as to adjust the operating parameters of the environmental test chamber according to the working mode to be tested;

wherein, the working mode to be tested comprises at least one of the following:

7. The method of claim 1, wherein determining the test result of the target measured thermal infrared camera according to the temperature distribution map and the initial temperature distribution map of the target measured thermal infrared camera comprises:

calculating the difference value between the temperature value of each pixel point in the temperature distribution graph of the target measured thermal infrared camera at the set moment and the temperature value of the corresponding pixel point in the initial temperature distribution graph of the target measured thermal infrared camera;

and if the difference value corresponding to each pixel point is in an abnormal state, determining that the test result of the target thermal infrared camera to be tested is in abnormal performance.

8. The method of claim 7, wherein the abnormal condition comprises at least one of:

9. The method of claim 1, wherein the number of targets is at least two;

the target temperature corresponding to each target is different;

the visual field range of each measured thermal infrared camera comprises all or part of the area of each target.

10. A thermal infrared camera testing device, comprising:

11. A test apparatus, comprising:

one or more processors;

storage means for storing one or more programs;

when executed by the one or more processors, cause the one or more processors to implement the thermal infrared camera testing method of any one of claims 1-9.

12. A test system, comprising: an environmental test chamber, a target, at least two thermal infrared cameras under test, a multiplexing circuit, a temperature control circuit, and the test apparatus of claim 11; wherein:

13. The system of claim 12, wherein the multiplexing circuit comprises a multiplexer, at least one input or output I/O connection, and a switch corresponding to each of the thermal infrared cameras under test;

the test equipment is connected with the signal input end of the multiplexer through each I/O connecting line;

the data communication end of the multiplexer is connected with the corresponding tested thermal infrared camera through each switch;

and the test equipment controls the conduction state of each switch through each I/O connecting line.

14. The system of claim 12, wherein the temperature control circuit comprises a field effect transistor, a power supply, and a logic element;

the test equipment is connected with the input end of the temperature control circuit through an enable pin and a direction selection pin;

the output end of the temperature control circuit is connected with the target.

15. The system of claim 12, further comprising:

a temperature sensor coupled to the testing device, the temperature sensor to detect a surface temperature of the target.

16. The system of claim 12, wherein the number of targets is at least two, and the target temperature for each target is different;

17. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out a method for testing a thermal infrared camera according to any one of claims 1 to 9.