CN113573477B - PCB (printed Circuit Board) manufacturing indication method, production coefficient generation method, pre-expansion system, medium and equipment - Google Patents
PCB (printed Circuit Board) manufacturing indication method, production coefficient generation method, pre-expansion system, medium and equipmentDownload PDFInfo
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- CN113573477B CN113573477BCN202110687297.3ACN202110687297ACN113573477BCN 113573477 BCN113573477 BCN 113573477BCN 202110687297 ACN202110687297 ACN 202110687297ACN 113573477 BCN113573477 BCN 113573477B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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Abstract
Description
Technical Field
The invention relates to the field of printed circuit board manufacturing, in particular to a PCB manufacturing indication and production coefficient generation method, a pre-expansion system, a medium and equipment.
Background
Along with the continuous development of printed circuit board technology, the number of layers, the jointed board area, the line density and the pad density of the printed circuit board are continuously improved, the size of a component is gradually reduced, but the stitch density is improved, and the precision of a piece to be pasted is higher and higher. In the processes of pressing and drilling the printed circuit board, the printed circuit board is heated in the processes of baking before copper deposition, baking before resin hole plugging, baking green oil, spraying tin and the like, and in addition, the printed circuit board is contracted due to heat impact in the process of pasting the part.
In order to ensure that a finished product formed by manufacturing a printed circuit board meets the design requirement, the shrinkage of the printed circuit board after being heated needs to be pre-compensated, the conventional pre-compensation method of the printed circuit board increases the production coefficient through manual calculation according to the PCB manufacturing process and the shrinkage before and after IR, but the manual calculation is easy to generate errors, so that the printed circuit board cannot be put on a clamp after the part sticking process; after production data such as production coefficients and the like are modified, all procedures need to be synchronized, manual operation is easy to miss and delay, and a link error can cause the whole batch of printed circuit boards to be scrapped.
Disclosure of Invention
The present invention is directed to overcoming at least one of the above-mentioned disadvantages of the prior art, and providing a PCB manufacturing instruction, a production coefficient generating method, a pre-expansion system, a medium, and an apparatus.
The technical scheme of the invention comprises the following steps:
a PCB manufacturing instruction generation method comprises the following steps:
and a version judgment step: judging whether the version of the circuit board to be manufactured is a brand new version or an upgraded version according to the original data to generate a first judgment result;
modification judgment: judging whether the modification mode of the production coefficient is a special modification mode or a conventional modification mode according to the original data; when the modification mode of the production coefficient is a special modification mode, calculating a coefficient preset value according to a preset rule; when the modification mode of the production coefficient is a conventional modification mode, taking a preset fixed value as a coefficient preset value;
and an indication uploading step: generating a manufacturing instruction according to the first judgment result and the coefficient preset value, uploading the manufacturing instruction to a network end so that an optimization system obtains the manufacturing instruction from the network end, and determining a production coefficient according to the manufacturing instruction;
the coefficient pre-large value is used for drilling the circuit board to be manufactured by a printed circuit board engineering system, and the production coefficient is used for photo-painting the circuit board to be manufactured by a photo-painting system.
The original data is provided by the circuit board demand side and comprises the design parameters of the circuit board to be manufactured. In production, production data such as coefficient preset values and production coefficients used in production need to be calculated according to design parameters of a circuit board to be produced of original data, so that circuit boards can be produced by using corresponding data in different processes, and the production data used in different processes are matched with each other, so that the circuit board meeting the design of a demand party can be produced. The printed circuit board engineering system reads the coefficient pre-large value to drill the circuit board, and the optical drawing system reads the production coefficient to perform optical drawing on the circuit board. For various reasons, including the requirement change of a circuit board demand side and the process improvement of a circuit board production side, the design parameters of the circuit board are frequently changed, the production data are modified accordingly, and the change of part of the circuit board to be manufactured is adjusted based on the produced circuit board to be an upgraded version; and the rest circuit boards to be manufactured have no version iteration and are brand new versions.
The edition judgment step and the modification judgment step automatically analyze original data, convert the original data into production data for production to form a manufacturing instruction, and the instruction uploading step uploads the manufacturing instruction to a network end to instruct a printed circuit board engineering system and a photoplotting system to manufacture a circuit board, so that manual proofreading and calculation are not needed in the whole process, and the production data are efficiently and accurately iterated or newly built; different processes can timely and accurately synchronize the updated production data, and the circuit board scrapping caused by the unmatched production data used in different processes is avoided. And the modification mode of the production coefficient is divided into a special modification mode and a conventional modification mode, so that the production requirements of different circuit board products are met.
Further, after the version determining step and before the modification mode determining step, the method further includes:
judging whether the version of the circuit board to be manufactured is consistent with the version of the drill tape and the version of the film according to the original material;
the modification mode determining step specifically includes:
when the version of the circuit board to be manufactured is judged to be consistent with the version of the drill tape and the version of the film, judging whether the modification mode of the production coefficient is a special modification mode or a conventional modification mode according to the original material; when the modification mode of the production coefficient is a special modification mode, calculating a coefficient preset value according to a preset rule; when the modification mode of the production coefficient is a conventional modification mode, taking a preset fixed value as a coefficient preset value;
the instruction uploading step specifically comprises:
when the version of the circuit board to be manufactured is judged to be consistent with the version of the drill strip and the version of the film, a manufacturing instruction is generated according to the first judgment result and the coefficient preset value, and the manufacturing instruction is uploaded to a network end, so that an optimization system obtains the manufacturing instruction from the network end, and the optimization system determines a production coefficient according to the manufacturing instruction;
and when the version of the circuit board to be manufactured is judged to be inconsistent with the version of the drill tape and the version of the film, generating a manufacturing instruction according to the first judgment result, and uploading the manufacturing instruction to a network terminal so that an optimization system obtains the manufacturing instruction from the network terminal and determines a production coefficient according to the manufacturing instruction.
The version of the drilling tape is a procedural document version used in a drilling process, the version of the film is a graph version used in a light-drawing process, before a production coefficient is modified, whether the procedural document version used by a system corresponding to each process of the circuit board to be manufactured is synchronously replaced is judged according to original data, if yes, the production coefficient can be modified, and a manufacturing instruction is generated by combining a first judgment result and a coefficient preset value; if not, the production coefficient is not modified, only the first judgment result is used for generating a manufacturing instruction, and mismatching of production data used in each process after the production coefficient is modified is avoided.
Further, the step of calculating the coefficient preset value according to a preset rule specifically includes:
when the manufacturing material of the circuit board to be manufactured is an original material, the suggested value of the original material is used as a coefficient pre-enlargement value;
when the surface treatment mode of the circuit board to be manufactured is lead-free tin spraying and/or tin spraying, obtaining the production coefficient of the same surface treatment mode from the network end as a coefficient preset value;
when the distance requirement of the circuit board to be manufactured is a reference distance requirement, calculating a coefficient preset value a by the formula (1):
a＝1000(d1-d2)/d1 (1)
wherein d is1Measured values of optical positioning points before reflow soldering, d2The measured value of the optical positioning point after reflow soldering.
The special modification mode is one of the three cases, and the original data can be used as the basis to determine the condition of the circuit board to be manufactured.
The technical scheme of the invention also comprises:
a PCB production coefficient generation method comprises the following steps:
acquiring a manufacturing instruction generated by the PCB manufacturing instruction generation method from a network terminal;
and determining a production coefficient according to the manufacturing instruction.
Further, the step of determining the production coefficient according to the manufacturing instruction specifically includes:
if the first judgment information and the coefficient preset value can be obtained according to the manufacturing instruction, determining a preset coefficient according to the first judgment information, and determining a production coefficient according to the preset coefficient and the coefficient preset value;
and if only the first judgment information can be obtained according to the manufacturing instruction, determining a pre-given coefficient according to the first judgment information, and determining a production coefficient according to the pre-given coefficient.
By whether the coefficient pre-maximum value can be obtained, it can be determined whether further increase is required on the basis of the pre-given coefficient to determine the production coefficient. The production coefficient of the circuit board to be manufactured is calculated by reading the manufacturing instruction at the network end, the production coefficient is matched with other production data of the circuit board to be manufactured, and the change of original data is quickly and accurately synchronized so as to be implemented in the actual circuit board manufacturing.
Further, the step of determining a pre-given coefficient according to the first determination information specifically includes:
judging whether the circuit board to be manufactured is a brand new version or not according to the first judgment information;
when a brand-new version is judged according to the first judgment information, obtaining production coefficients of similar models from the network end as pre-given coefficients;
and when the upgrading version is judged according to the first judgment information, reading the production coefficient of the previous version from the network terminal as a pre-given coefficient.
Generally, the production coefficient is equal to the sum of the pre-given coefficient and the pre-scaled value of the coefficient. When the circuit board to be manufactured is an upgraded version, carrying out conventional modification or special modification on the basis of the production coefficient of the previous version to obtain the production coefficient of the new version; and when the circuit board to be manufactured is a brand new version, reading the production coefficient of the similar model stored in the network terminal, and carrying out conventional modification or special modification on the basis of the production coefficient to obtain the production coefficient of the brand new version.
Further, still include:
obtaining measurement data of a first sample test plate of the circuit board to be manufactured;
determining a film compensation coefficient according to the measurement data;
determining a production coefficient according to the pre-given coefficient and the coefficient pre-maximum value, specifically comprising:
determining a production coefficient according to the pre-given coefficient, the coefficient pre-maximum value and the film compensation coefficient;
determining a production coefficient according to the pre-given coefficient, which specifically comprises:
and determining a production coefficient according to the pre-given coefficient and the film compensation coefficient.
In order to verify whether the modified production data such as the coefficient preset value, the production coefficient and the like conform to the circuit board designed by the original material, a first test board is manufactured. The measurement data are data for measuring a first sample test plate actually produced, the production coefficient is optimized for the inner film according to the measurement data, and the difference value between the optimized production coefficient and the production coefficient before the first sample test plate is the film compensation coefficient. Because of the introduction of the optimization process, the finally used production coefficient is no longer equal to the sum of the coefficient pre-emphasis value and the pre-given coefficient, but is equal to the sum of the coefficient pre-emphasis value, the pre-given coefficient and the film compensation coefficient. The optimized production coefficient is applied to large-batch formal production, the shrinkage problem caused by other processes after the pressing process is considered for the optimization of the inner film, and the quality parameters of the manufactured circuit board patch precision, the optical positioning point distance and the like are ensured to meet the design requirements and specifications.
Based on the PCB manufacturing instruction generation method and the PCB production coefficient generation method, the invention also comprises the following steps:
a PCB pre-tensioning system, comprising: the preliminary enlargement judging system is used for realizing the PCB manufacturing instruction generating method; and the film compensation system is used for realizing the PCB production coefficient generation method.
A computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a PCB production instruction generating method as described above or a PCB production coefficient generating method as described above.
A computer device comprising a memory storing a computer program and a processor implementing the PCB production instructions generation method or the PCB production coefficients generation method as described above when the computer program is executed.
Compared with the prior art, the invention has the beneficial effects that:
(1) the production instruction generation process does not need manual proofreading calculation, iteration or new construction of production data is efficiently and accurately carried out, different processes can timely and accurately synchronously update the production data, and circuit board scrapping caused by unmatched production data used by different processes is avoided.
(2) The modification mode of the production coefficient is divided into a special modification mode and a conventional modification mode, and the production requirements of different circuit board products are met.
(3) The production coefficient is optimized for the inner film, the shrinkage problem caused by other processes after the pressing process is considered, and the quality parameters of the manufactured circuit board patch, such as the precision, the optical positioning point distance and the like, are ensured to meet the design requirements and specifications.
Drawings
Fig. 1 is a flowchart of a first PCB production instruction generation method according to embodiment 1 of the present invention.
Fig. 2 is a flowchart of a second PCB manufacture instruction generation method according to embodiment 1 of the present invention.
Fig. 3 is a flowchart of a first PCB production coefficient generation method according to embodiment 2 of the present invention.
Fig. 4 is a flowchart of a first PCB production coefficient generation method according to embodiment 2 of the present invention.
Fig. 5 is a flow chart of the operation of the preliminary enlargement determining system of the printed circuit board preliminary enlargement method according to embodiment 3 of the present invention.
Fig. 6 is a flowchart illustrating operation of a film compensation system of a printed circuit board pre-enlarging method according to embodiment 3 of the present invention.
Detailed Description
The drawings are only for purposes of illustration and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
As shown in fig. 1, the present embodiment provides a method for generating a PCB production instruction, including the steps of:
s10, version judgment step: judging whether the version of the circuit board to be manufactured is a brand new version or an upgraded version according to the original data to generate a first judgment result;
s20, modification judgment step: judging whether the modification mode of the production coefficient is a special modification mode or a conventional modification mode according to the original data; when the modification mode of the production coefficient is a special modification mode, calculating a coefficient preset value according to a preset rule; when the modification mode of the production coefficient is a conventional modification mode, taking a preset fixed value as a coefficient preset value;
s30, indicating an uploading step: generating a manufacturing instruction according to the first judgment result and the coefficient preset value, uploading the manufacturing instruction to a network end so that an optimization system obtains the manufacturing instruction from the network end, and determining a production coefficient according to the manufacturing instruction;
the coefficient preset value is used for drilling the circuit board to be manufactured by a printed circuit board engineering system, and the production coefficient is used for photo-painting the circuit board to be manufactured by a photo-painting system.
The original data is provided by the circuit board demand side and comprises the design parameters of the circuit board to be manufactured. The production data of this embodiment includes a production coefficient, a coefficient pre-emphasis value, and a film compensation coefficient. The printed circuit board engineering system reads the coefficient preset value to drill the circuit board, and the optical drawing system reads the production coefficient obtained by combining the coefficient preset value and the film compensation coefficient to perform optical drawing on the circuit board.
For various reasons, including the requirement change of a circuit board demand side and the process improvement of a circuit board production side, the design parameters of the circuit board are frequently changed, the production data are modified accordingly, and the change of part of the circuit board to be manufactured is adjusted based on the produced circuit board to be an upgraded version; and the rest circuit boards to be manufactured have no version iteration and are brand new versions.
The edition judgment step and the modification judgment step automatically analyze original data, convert the original data into production data for production to form a manufacturing instruction, and the instruction uploading step uploads the manufacturing instruction to a network end to instruct a printed circuit board engineering system and a photoplotting system to manufacture a circuit board, so that manual proofreading and calculation are not needed in the whole process, and the production data are efficiently and accurately iterated or newly built; different processes can timely and accurately synchronize the updated production data, and the circuit board scrapping caused by the unmatched production data used in different processes is avoided. And the modification mode of the production coefficient is divided into a special modification mode and a conventional modification mode, so that the production requirements of different circuit board products are met.
Preferably, as shown in fig. 2, after step S10 and before step S20, the method further includes step S11:
judging whether the version of the circuit board to be manufactured is consistent with the version of the drill tape and the version of the film according to the original material;
if yes, executing step S20 and step S30 sequentially;
step S20 specifically includes:
when the version of the circuit board to be manufactured is judged to be consistent with the version of the drill tape and the version of the film, judging whether the modification mode of the production coefficient is a special modification mode or a conventional modification mode according to the original material; when the modification mode of the production coefficient is a special modification mode, calculating a coefficient preset value according to a preset rule; when the modification mode of the production coefficient is a conventional modification mode, taking a preset fixed value as a coefficient preset value;
the instruction uploading step S30 specifically includes:
when the version of the circuit board to be manufactured is judged to be consistent with the version of the drill strip and the version of the film, a manufacturing instruction is generated according to the first judgment result and the coefficient preset value, and the manufacturing instruction is uploaded to a network end, so that an optimization system obtains the manufacturing instruction from the network end, and the optimization system determines a production coefficient according to the manufacturing instruction;
if not, go to step S12;
step S12 specifically includes:
and generating a manufacturing instruction according to the first judgment result, and uploading the manufacturing instruction to a network terminal so that an optimization system obtains the manufacturing instruction from the network terminal, so that the optimization system determines a production coefficient according to the manufacturing instruction.
The version of the drilling tape is a procedural document version used in a drilling process, the version of the film is a graph version used in a light-drawing process, before a production coefficient is modified, whether the procedural document version used by a system corresponding to each process of the circuit board to be manufactured is synchronously replaced is judged according to original data, if yes, the production coefficient can be modified, and a manufacturing instruction is generated by combining a first judgment result and a coefficient preset value; if not, the production coefficient is not modified, only the first judgment result is used for generating a manufacturing instruction, and mismatching of production data used in each process after the production coefficient is modified is avoided.
Preferably, the step of calculating the coefficient preset value according to a preset rule in S20 specifically includes:
when the manufacturing material of the circuit board to be manufactured is an original material, the suggested value of the original material is used as a coefficient preset value;
when the surface treatment mode of the circuit board to be manufactured is lead-free tin spraying and/or tin spraying, obtaining the production coefficient of the same surface treatment mode from the network end as a coefficient preset value;
when the distance requirement of the circuit board to be manufactured is a reference distance requirement, calculating a coefficient preset value a by the formula (1):
a＝1000(d1-d2)/d1 (1)
wherein d is1Is light before reflow solderingMeasured value of the location point, d2The measured value of the optical positioning point after reflow soldering. This embodiment uses a CCD camera to scan a printed circuit board to obtain d1And d2。
The special modification mode is one of the three situations, and the original data is used as the basis to determine the situation of the circuit board to be manufactured.
Based on the PCB manufacture instruction generating method, the embodiment further provides:
a PCB pre-tensioning system, comprising: the preliminary enlargement judging system is used for realizing the PCB manufacturing instruction generating method; and the film compensation system is used for calculating the production coefficient of the printed circuit board according to the manufacturing instruction generated by the preliminary judgment system.
A computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a PCB production instruction generating method as described above.
A computer device comprising a memory storing a computer program and a processor implementing the PCB production instruction generation method as described above when executing the computer program.
Example 2
As shown in fig. 3, the present embodiment provides a method for generating a PCB production coefficient, including the steps of:
a10, obtaining the production instruction generated by the PCB production instruction generation method from the network end;
and A20, determining the production coefficient according to the production instruction.
Preferably, step a20 specifically includes:
if the first judgment information and the coefficient preset value can be obtained according to the manufacturing instruction, determining a preset coefficient according to the first judgment information, and determining a production coefficient according to the preset coefficient and the coefficient preset value;
and if only the first judgment information can be obtained according to the manufacturing instruction, determining a pre-given coefficient according to the first judgment information, and determining a production coefficient according to the pre-given coefficient.
By whether the coefficient pre-maximum value can be obtained, it can be determined whether further increase is required on the basis of the pre-given coefficient to determine the production coefficient. The production coefficient of the circuit board to be manufactured is calculated by reading the manufacturing instruction at the network end, the production coefficient is matched with other production data of the circuit board to be manufactured, and the change of original data is quickly and accurately synchronized so as to be implemented in the actual circuit board manufacturing.
It should be noted that there are various ways to obtain the pre-amplification value of the coefficient according to the production instruction, including but not limited to: the making instruction comprises a readable concrete numerical value of the coefficient preset value, or the making instruction comprises a storage path of the coefficient preset value at the network end, and the corresponding coefficient preset value is read from the network end according to the path.
Preferably, the process of determining the pre-given coefficient according to the first determination information in step a20 specifically includes:
judging whether the circuit board to be manufactured is a brand new version or not according to the first judgment information;
when a brand-new version is judged according to the first judgment information, obtaining production coefficients of similar models from the network end as pre-given coefficients;
and when the upgrading version is judged according to the first judgment information, reading the production coefficient of the previous version from the network terminal as a pre-given coefficient.
Generally, the production coefficient is equal to the sum of the pre-given coefficient and the pre-scaled value of the coefficient. When the circuit board to be manufactured is an upgraded version, carrying out conventional modification or special modification on the basis of the production coefficient of the previous version to obtain the production coefficient of the new version; and when the circuit board to be manufactured is a brand new version, reading the production coefficient of the similar model stored in the network terminal, and carrying out conventional modification or special modification on the basis of the production coefficient to obtain the production coefficient of the brand new version.
It should be noted that there are various implementation manners for obtaining the production coefficients of similar models from the network side, and in this embodiment, the sheet material, the size, and the processing technology are used as the screening conditions, and the production coefficients of the manufactured circuit boards similar to the circuit board to be manufactured are searched in a traversing manner at the network side. The former version of the circuit board to be manufactured can be the last version or a plurality of versions.
Preferably, as shown in fig. 4, the method for generating PCB production coefficients of the present embodiment further includes the steps of:
a11, obtaining the measurement data of the first sample test board of the circuit board to be manufactured;
a12, determining a film compensation coefficient according to the measured data;
in step a20, determining a production coefficient according to the pre-given coefficient and the pre-maximum value of the coefficient, specifically including:
and determining a production coefficient according to the pre-given coefficient, the coefficient pre-maximum value and the film compensation coefficient.
Determining a production coefficient according to the pre-given coefficient, which specifically comprises:
and determining a production coefficient according to the pre-given coefficient and the film compensation coefficient.
The production coefficient of this embodiment is equal to the sum of the pre-given coefficient, the coefficient pre-maximum value and the film compensation coefficient, and in other embodiments, other correction compensation coefficients may be added according to actual needs.
In order to verify whether the modified production data such as the coefficient preset value, the production coefficient and the like conform to the circuit board designed by the original material, a first test board is manufactured. The measurement data are data for measuring a first sample test plate actually produced, the production coefficient is optimized for the inner film according to the measurement data, and the difference value between the optimized production coefficient and the production coefficient before the first sample test plate is the film compensation coefficient. Because of the introduction of the optimization process, the finally used production coefficient is no longer equal to the sum of the coefficient pre-emphasis value and the pre-given coefficient, but is equal to the sum of the coefficient pre-emphasis value, the pre-given coefficient and the film compensation coefficient. The optimized production coefficient is applied to large-batch formal production, the shrinkage problem caused by other processes after the pressing process is considered for the optimization of the inner film, and the quality parameters of the manufactured circuit board patch precision, the optical positioning point distance and the like are ensured to meet the design requirements and specifications.
Based on the above PCB production coefficient generation method, the present embodiment further provides:
a PCB pre-tensioning system, comprising: a preliminary enlargement determination system for implementing the PCB production instruction generation method according to embodiment 1; and the film compensation system is used for realizing the PCB production coefficient generation method.
A computer-readable storage medium, having stored thereon a computer program which, when executed by a processor, implements a PCB production coefficient generation method as described above.
A computer device comprising a memory storing a computer program and a processor implementing the PCB production coefficient generation method as described above when executing the computer program.
Example 3
As shown in fig. 5-6, the present embodiment provides a PCB pre-tensioning system, including:
a preliminary enlargement determination system for implementing the PCB production instruction generation method according to embodiment 1;
a film compensation system for implementing the PCB production coefficient generation method as described in embodiment 2.
Based on the PCB pre-expansion system, the embodiment further provides a printed circuit board pre-generation method, which includes the steps of:
b10, judging whether the circuit board to be manufactured is of a special type or not by the pre-enlarging judging system according to the original material, if not, executing B20, and if so, executing B52;
b20, judging whether the circuit board to be manufactured is a designated plate material or not by the pre-enlarging judging system according to the original material, if not, executing B30, and if so, executing B52;
b30, judging whether the circuit board to be manufactured uses the special requirements of the customer or not by the pre-enlarging judging system according to the original data, if not, executing B40, and if so, executing B52;
b40, judging whether the circuit board to be manufactured is the appointed process flow according to the original data by the pre-enlarging judging system, if not, executing B51;
b51, the pre-amplification judging system judges that the modification mode of the production coefficient is a conventional modification mode, takes a preset fixed value as a coefficient pre-amplification value, and uploads the coefficient pre-amplification value to a network end;
the preset fixed value of this embodiment is 0.13 mil/inch;
b52, judging that the modification mode of the production coefficient is a special modification mode by the pre-amplification judging system, calculating a coefficient pre-amplification value according to a preset rule, and uploading the coefficient pre-amplification value to a network terminal;
b60, the pre-enlarging judging system judges whether the first sample test board is needed to be manufactured according to the original data to generate the second judging result
B70, judging whether the circuit board to be manufactured is a brand-new version or not by the pre-enlarging judging system according to the original data, if not, executing B80, and if so, executing B93;
b80, judging whether the circuit board to be manufactured is subjected to version upgrading by the preliminary enlargement judging system, if not, executing B90, and if so, executing B103;
b90, judging whether the version of the circuit board to be manufactured is consistent with the version of the drill tape and the version of the film according to the original data by the pre-enlarging judging system, if not, executing B101, and if so, executing B102;
b101, the pre-amplification judging system generates a first judging result marked as an upgrading version, generates a manufacturing instruction by combining the first judging result and a second judging result, and uploads the manufacturing instruction to a network end;
b102, the pre-amplification judging system generates a first judging result marked as an upgrading version, generates a manufacturing instruction by combining the first judging result, the second judging result and the coefficient pre-amplification value, and uploads the manufacturing instruction to a network end;
b103, generating a first judgment result with a brand-new version identifier by the pre-amplification judgment system, generating a manufacturing instruction by combining the first judgment result, the second judgment result and the coefficient pre-amplification value, and uploading the manufacturing instruction to a network end;
b110, the film compensation system obtains a manufacturing instruction from a network end;
b120, the film compensation system can obtain a coefficient preset value according to the manufacture instruction, if not, B130B is executed, and if yes, B130a is executed;
b130a, judging whether to manufacture a first sample test board according to the manufacture instruction by the film compensation system, if not, executing B152a, and if so, executing B140 a;
b140a, the film compensation system acquires the measurement data of the first test board of the circuit board to be manufactured, and the film compensation coefficient is determined according to the measurement data;
b151a, the film compensation system determines a pre-given coefficient according to the first judgment information in the production instruction, determines a production coefficient according to the pre-given coefficient, the coefficient pre-maximum value and the film compensation coefficient, and uploads the production coefficient to the network end;
b152a, the film compensation system determines a pre-given coefficient according to the first judgment information in the production instruction, determines a production coefficient according to the pre-given coefficient and the coefficient pre-maximum value, and uploads the production coefficient to the network end;
B130B, the film compensation system determines a pre-given coefficient according to the first judgment information in the production instruction, determines a production coefficient according to the pre-given coefficient, and uploads the production coefficient to the network terminal.
The network terminal of the embodiment comprises a pre-expansion page and a backup network disk, wherein the pre-expansion page can be used as a manual query interface for querying the specific model coefficient preset value, and the backup network disk stores and records production data of all versions of all models. The coefficient preset value is uploaded to a backup network disk by a preset judgment system in a csv format for manual inquiry and calling of other system programs. The film compensation system leads out the production instruction from the network end in an xml format for reading.
Preferably, in order to avoid the query error caused by listing the version information of each model, the pre-expansion webpage only displays the current latest version, and the maintainer of the pre-expansion webpage can query the change history of each version.
Preferably, in order to maintain the continuity of the production data, the csv format file exported from the network side records the production data of all versions of circuit boards, and the csv format file is only automatically called by the system and does not open manual inquiry.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.
Claims (10)
1. A method for manufacturing a PCB, comprising:
and a version judgment step: judging whether the version of the circuit board to be manufactured is a brand new version or an upgraded version according to the original data to generate a first judgment result;
modification judgment: judging whether the modification mode of the production coefficient is a special modification mode or a conventional modification mode according to the original data; when the modification mode of the production coefficient is a special modification mode, calculating a coefficient preset value according to a preset rule; when the modification mode of the production coefficient is a conventional modification mode, taking a preset fixed value as a coefficient preset value;
and an indication uploading step: generating a manufacturing instruction according to the first judgment result and the coefficient pre-maximum value or generating a manufacturing instruction according to the first judgment result, uploading the manufacturing instruction to a network end so that an optimization system obtains the manufacturing instruction from the network end, and determining a production coefficient according to the manufacturing instruction;
the coefficient preset value is used for drilling the circuit board to be manufactured by a printed circuit board engineering system, and the production coefficient is used for photo-painting the circuit board to be manufactured by a photo-painting system.
2. The method for manufacturing a PCB of claim 1, further comprising, after the step of determining the version and before the step of determining the modification:
judging whether the version of the circuit board to be manufactured is consistent with the version of the drill tape and the version of the film according to the original material;
the modification determination step specifically includes:
when the version of the circuit board to be manufactured is judged to be consistent with the version of the drill tape and the version of the film, judging whether the modification mode of the production coefficient is a special modification mode or a conventional modification mode according to the original material; when the modification mode of the production coefficient is a special modification mode, calculating a coefficient preset value according to a preset rule; when the modification mode of the production coefficient is a conventional modification mode, taking a preset fixed value as a coefficient preset value;
the instruction uploading step specifically comprises:
when the version of the circuit board to be manufactured is judged to be consistent with the version of the drill strip and the version of the film, a manufacturing instruction is generated according to the first judgment result and the coefficient preset value, and the manufacturing instruction is uploaded to a network end, so that an optimization system obtains the manufacturing instruction from the network end, and the optimization system determines a production coefficient according to the manufacturing instruction;
and when the version of the circuit board to be manufactured is judged to be inconsistent with the version of the drill tape and the version of the film, generating a manufacturing instruction according to the first judgment result, and uploading the manufacturing instruction to a network terminal so that an optimization system obtains the manufacturing instruction from the network terminal and determines a production coefficient according to the manufacturing instruction.
3. The method for manufacturing a PCB according to claim 1 or 2, wherein the step of calculating the pre-maximum value of the coefficient according to a pre-set rule specifically comprises:
when the manufacturing material of the circuit board to be manufactured is an original material, the suggested value of the original material is used as a coefficient preset value;
when the surface treatment mode of the circuit board to be manufactured is tin spraying, obtaining the production coefficient of the same surface treatment mode from the network terminal as a coefficient preset value;
when the distance requirement of the circuit board to be manufactured is a reference distance requirement, calculating a coefficient preset value a by the formula (1):
a＝1000(d1-d2)/d1(1)
wherein d is1Measured values of optical positioning points before reflow soldering, d2The measured value of the optical positioning point after reflow soldering.
4. A PCB production coefficient generation method is characterized by comprising the following steps:
acquiring a manufacturing instruction generated by the PCB manufacturing method according to any one of claims 1-3 from a network terminal;
and determining a production coefficient according to the manufacturing instruction.
5. The method for generating the PCB production coefficient of claim 4, wherein the step of determining the production coefficient according to the manufacturing instruction specifically comprises:
if first judgment information and the coefficient preset value can be obtained according to the manufacturing instruction, a preset coefficient is determined according to the first judgment information, and a production coefficient is determined according to the preset coefficient and the coefficient preset value;
and if only first judgment information can be obtained according to the manufacturing instruction, determining a pre-given coefficient according to the first judgment information, and determining a production coefficient according to the pre-given coefficient.
6. The method for generating the PCB production coefficient according to claim 5, wherein the step of determining the pre-given coefficient according to the first determination information specifically comprises:
judging whether the circuit board to be manufactured is a brand new version or not according to the first judgment information;
when the brand-new version is judged according to the first judgment information, acquiring a production coefficient of a similar model from the network end as a pre-given coefficient;
and when the upgrading version is judged according to the first judgment information, reading the production coefficient of the previous version from the network terminal as a pre-given coefficient.
7. The PCB production coefficient generation method of claim 5, further comprising:
obtaining measurement data of a first sample test plate of the circuit board to be manufactured;
determining a film compensation coefficient according to the measurement data;
determining a production coefficient according to the pre-given coefficient and the coefficient pre-maximum value, specifically comprising:
determining a production coefficient according to the pre-given coefficient, the coefficient pre-maximum value and the film compensation coefficient;
determining a production coefficient according to the pre-given coefficient, which specifically comprises:
and determining a production coefficient according to the pre-given coefficient and the film compensation coefficient.
8. A PCB pre-tensioning system, comprising:
a pre-large judgment system for generating and uploading a manufacturing instruction of the PCB manufacturing method according to any one of claims 1 to 3;
a film compensation system for implementing the PCB production coefficient generation method of claim 7.
9. A computer-readable storage medium having stored thereon a computer program, characterized in that,
the computer program, when executed by a processor, implements the PCB fabrication method of claim 1 or the PCB production coefficient generation method of claim 4.
10. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that,
the processor, when executing the computer program, implements the PCB manufacturing method of claim 1 or the PCB production coefficient generating method of claim 4.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636345A (en)* | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| WO2020186850A1 (en)* | 2019-03-19 | 2020-09-24 | 上海望友信息科技有限公司 | Mesh plate steps design method, system, computer readable storage medium and device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100412873C (en)* | 2002-08-08 | 2008-08-20 | 弗赖斯金属有限公司d/b/a阿尔发金属有限公司 | System and method for modifying electronic design data |
| US7321967B2 (en)* | 2003-04-25 | 2008-01-22 | Verigy (Singapore) Pte. Ltd. | System and method for configuring capabilities of printed circuit boards |
| GB0612805D0 (en)* | 2006-06-28 | 2006-08-09 | Xact Pcb Ltd | Registration system and method |
| CN104185375A (en)* | 2014-09-01 | 2014-12-03 | 梅州市志浩电子科技有限公司 | Coefficient compensation control method for printed circuit board |
| CN105183971A (en)* | 2015-08-31 | 2015-12-23 | 深圳崇达多层线路板有限公司 | PCB borehole enlargement method |
| CN105246258B (en)* | 2015-10-27 | 2018-08-07 | 珠海方正科技高密电子有限公司 | A kind of circuit board harmomegathus ratio control method and system |
| CN106528977A (en)* | 2016-10-26 | 2017-03-22 | 上海斐讯数据通信技术有限公司 | Gerber file generation method and system |
| CN109426674B (en)* | 2017-08-22 | 2022-11-08 | 凌云光技术股份有限公司 | Printed circuit board detection method and system |
| CN108520403A (en)* | 2018-04-12 | 2018-09-11 | 江苏博敏电子有限公司 | A kind of anti-welding preceding harmomegathus management method of printed wiring board |
| CN108668444B (en)* | 2018-06-25 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Collapsible control method, machining method and system, computer storage medium and device |
| CN109548289A (en)* | 2018-11-29 | 2019-03-29 | 江西省长益光电有限公司 | A kind of preparation method of photoelectric circuit board |
| CN112347117A (en)* | 2020-12-01 | 2021-02-09 | 广州辰创科技发展有限公司 | Method and system for realizing PCB design resource sharing based on ERP system |
| CN112580290B (en)* | 2020-12-25 | 2024-07-05 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing device and storage medium |
- 2021
- 2021-06-21CNCN202110687297.3Apatent/CN113573477B/enactiveActive
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636345A (en)* | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| WO2020186850A1 (en)* | 2019-03-19 | 2020-09-24 | 上海望友信息科技有限公司 | Mesh plate steps design method, system, computer readable storage medium and device |
Non-Patent Citations (1)
| Title |
|---|
| 数学计量模型控制PCB芯板涨缩补偿系数的研究;徐琪琳等;《印制电路信息》;20161110(第11期);全文* |
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