CN113504694A - Cooling device and linear scanning camera and automatic optical detection equipment using same - Google Patents

Abstract

Translated fromChinese

本发明公开了冷却装置及使用其的线扫相机和自动光学检测设备，冷却装置包括：第一散热组件、第二散热组件和温度控制组件，第一散热组件包括多个半导体散热片，半导体散热片的冷端朝向被作用物体；第二散热组件设在第一散热组件远离被作用物体的一侧，半导体散热片的热端朝向第二散热组件，第二散热组件用于对半导体散热片的热端降温；温度控制组件包括温度传感器和温度控制器，温度传感器用于检测被作用物体的温度值，温度控制器用于根据温度值控制第一散热组件的通电频率。根据本发明实施例的冷却装置，通过多段相互独立的半导体散热片同时给相机降温冷却，每段半导体散热片提供相同的制冷量，使得相机各处的温度均匀冷却。

The invention discloses a cooling device and a line scan camera and automatic optical detection equipment using the same. The cooling device includes: a first heat dissipation component, a second heat dissipation component and a temperature control component. The first heat dissipation component includes a plurality of semiconductor heat sinks, and the semiconductor heat sinks The cold end of the sheet faces the object to be applied; the second heat dissipation component is arranged on the side of the first heat dissipation component away from the object to be applied, and the hot end of the semiconductor heat sink faces the second heat dissipation component, and the second heat dissipation component is used for the cooling of the semiconductor heat sink. The hot end is cooled down; the temperature control component includes a temperature sensor and a temperature controller, the temperature sensor is used to detect the temperature value of the object being acted upon, and the temperature controller is used to control the power-on frequency of the first heat dissipation component according to the temperature value. According to the cooling device of the embodiment of the present invention, the camera is simultaneously cooled by a plurality of mutually independent semiconductor heat sinks, each segment of the semiconductor heat sink provides the same cooling capacity, so that the temperature of the camera is uniformly cooled.

Description

Cooling device and linear scanning camera and automatic optical detection equipment using same

Technical Field

The invention relates to the field of cameras, in particular to a cooling device, a line scanning camera using the same and automatic optical detection equipment.

Background

The existing camera is simple and compact in structure and small in installation space, particularly a CIS camera, a control part of the camera can generate a large amount of heat during the operation of the camera, the generated heat is conducted to all parts inside the camera, all devices are integrated in a fully-closed alloy shell, the heat cannot be timely transmitted out, the internal working temperature of the camera is increased, a sensor component of the camera is sensitive to temperature change, the change of the temperature can cause the obvious expansion and contraction of the sensor component, and the integral measurement precision of the camera is influenced.

The existing cooling method comprises a water cooling device, an air cooling device and a semiconductor cooling device, wherein the water cooling device and the air cooling device cannot achieve constant temperature control, and the semiconductor cooling device cannot be installed in a narrow and long space and can achieve constant temperature control, so that the cooling device which can keep the internal temperature within a controllable temperature range is urgently needed when a camera works.

The temperature of the existing camera is reduced when the camera is started, the camera cannot be normally used due to the lower temperature, the camera can be used only when the camera is heated to a certain temperature, and the working efficiency of the camera is greatly reduced.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. To this end, it is an object of the invention to propose a cooling device which allows a uniform cooling of the temperature throughout the camera.

Another object of the present invention is to provide a camera including the above cooling device, wherein the camera can maintain a constant temperature inside the camera during operation, thereby improving the usability of the camera.

According to a cooling device of an embodiment of a first aspect of the present invention, the cooling device includes: the first heat dissipation assembly comprises a plurality of semiconductor heat dissipation fins, and the cold ends of the semiconductor heat dissipation fins face towards an acted object; the second heat dissipation assembly is arranged on one side, away from the acted object, of the first heat dissipation assembly, the hot end of the semiconductor heat dissipation sheet faces the second heat dissipation assembly, and the second heat dissipation assembly is used for cooling the hot end of the semiconductor heat dissipation sheet; the temperature control assembly comprises a temperature sensor and a temperature controller, the temperature sensor is used for detecting the temperature value of the acted object, and the temperature controller is used for controlling the power-on frequency of the first heat dissipation assembly according to the temperature value.

According to the cooling device provided by the embodiment of the invention, the camera is cooled down and cooled simultaneously through the plurality of sections of mutually independent semiconductor cooling fins, and each section of semiconductor cooling fin provides the same refrigerating capacity, so that the temperature at each position in the camera is uniformly cooled; detect the temperature by the effect object through temperature sensor, temperature sensor feeds back the temperature that detects to temperature controller, and temperature controller measures the operating frequency of temperature regulation radiator unit according to temperature sensor, and then realizes the purpose of high accuracy accuse temperature for camera inside keeps at the constant temperature.

In addition, the cooling device according to the present invention may have the following additional features:

in some embodiments of the invention, the cooling device further comprises: a thermally conductive member disposed between the first heat dissipating assembly and the acted-upon object.

Further, the cooling device further includes: the heat-insulating part is arranged on the heat-conducting part, a plurality of assembling through holes corresponding to the semiconductor radiating fins are formed in the heat-insulating part, and at least part of the semiconductor radiating fins penetrate through the assembling through holes to be attached to the heat-conducting part.

Further, the second heat dissipation assembly includes: a water tank; the water rail is internally provided with a first water flow channel which is communicated with the water tank, and the water rail is an aluminum rail or a copper rail; and the water pump is arranged between the water inlet of the first water flow channel and the water tank.

Further, the cooling device further comprises a third heat dissipation assembly, the third heat dissipation assembly is arranged between the water outlet of the first water flow channel and the water tank, and the third heat dissipation assembly comprises: the air-cooled water discharge is internally provided with a second water flow channel, and two ends of the second water flow channel are respectively communicated with the water outlet of the first water flow channel and the water tank; and the fan is arranged on the air cooling water discharge and used for blowing air towards the air cooling water discharge.

Further, the cooling device further includes: a flow control assembly, the flow control assembly comprising: a flow sensor for detecting a flow rate of the water pump; and the flow controller is used for receiving the electrifying frequency to control the flow of the water pump.

Further, the second heat dissipation assembly includes: the heat dissipation plate is attached to one side of the semiconductor heat dissipation plate; the radiating fins are arranged on the other side of the radiating plate.

Further, the second heat dissipation assembly further includes: the sealing plate is used for being matched with the heat dissipation plate, so that a plurality of heat dissipation air channels are formed between every two adjacent heat dissipation fins; the fan is communicated with the air nozzles, and the air nozzles are opposite to the plurality of heat dissipation air channels; and the silencer is arranged at the air outlet of the heat dissipation air duct.

Further, the distance a between two adjacent semiconductor cooling fins and the length b of the semiconductor cooling fins satisfy: a is less than or equal to 1.5 b.

The invention also provides a line scan camera with the cooling device of the embodiment.

A line scan camera according to an embodiment of a second aspect of the present invention includes: the camera comprises a camera shell and a cooling device, wherein the cooling device is arranged on at least one side of the camera shell.

According to the line scan camera provided by the embodiment of the invention, the cooling device is arranged on the line scan camera, so that heat generated during the operation of the line scan camera can be conducted to the camera shell, and the line scan camera is cooled by the joint of the cooling device and the camera shell, so that the temperature of the line scan camera is kept at a constant temperature, and the working performance of the line scan camera is improved.

The invention also provides automatic optical detection equipment with the line scanning camera of the embodiment.

According to the automatic optical detection equipment provided by the embodiment of the invention, the working performance of the automatic optical detection equipment can be better improved by arranging the line scanning camera provided by the embodiment of the invention.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural view of a cooling apparatus according to an embodiment of the present invention;

FIG. 2 is an exploded view of a camera object, a first heat sink assembly and a second heat sink assembly of a cooling apparatus according to an embodiment of the present invention;

FIG. 3 is an exploded view of a semiconductor chilling plate, thermal insulation member, and heat conductive member of a cooling device according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of a camera affected object, a first heat dissipation assembly and a second heat dissipation assembly of the cooling device according to the embodiment of the invention;

FIG. 5 is an enlarged view of area I of FIG. 4;

fig. 6 is a schematic structural view of a semiconductor cooling sheet, a heat insulating member and a heat conducting member of a cooling device according to an embodiment of the present invention;

fig. 7 is a sectional view of water-cooling heat dissipation of a second heat dissipation member of the cooling device according to the embodiment of the invention;

fig. 8 is a structural diagram of air-cooled heat dissipation of a second heat dissipation assembly of a cooling device according to an embodiment of the invention;

FIG. 9 is an enlarged view of area II of FIG. 8;

FIG. 10 is an electrical schematic diagram of a cooling device according to an embodiment of the invention;

reference numerals:

1000-camera; 100-a cooling device;

10-a first heat dissipating component; 11-a semiconductor heat sink; 12-a semiconductor heating plate; 20-a camera housing;

30-a second heat dissipation assembly; 300-a water tank; 301-water rail; 302-a water pump; 303-a first water flow channel; 304-a water inlet;

310-a heat sink plate; 311-heat dissipation fins; 312-a closure plate; 313-an air outlet; 314-a tuyere; 315-air inlet; 316-a silencer;

40-a temperature control assembly; 41-temperature sensor; 42-a temperature controller; 50-a thermally conductive member; 51-insulation; 52-assembly through holes; 60-a third heat dissipation assembly; 600-air cooling water discharge; 601-a fan; 602-second water flow channel.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Acooling device 100 according to an embodiment of the present invention is described below with reference to the drawings.

As shown in fig. 1 and 2, acooling apparatus 100 according to an embodiment of the present invention includes: firstheat radiation component 10, secondheat radiation component 30, heating element andtemperature control assembly 40, firstheat radiation component 10 includes a plurality of semiconductor cooling fins 11, a plurality ofsemiconductor cooling fins 11 are evenly spaced apart to be established on acted on the object, the cold junction orientation ofsemiconductor cooling fins 11 is acted on the object, semiconductor cooling fins 11 adopt the mutually independent setting of multistage, multistagesemiconductor cooling fins 11 is for heating element cooling simultaneously, every sectionsemiconductor cooling fins 11 provides the same refrigerating output for the inside temperature homogeneous cooling everywhere of heating element.

The secondheat dissipation assembly 30 is arranged on one side, far away from the acted object, of the firstheat dissipation assembly 10, the hot end of thesemiconductor cooling fin 11 faces the secondheat dissipation assembly 30, the secondheat dissipation assembly 30 is used for cooling the hot end of thesemiconductor cooling fin 11, after the heating element generates heat, heat is conducted through the acted object, the cold end of thesemiconductor cooling fin 11 is attached to the acted object, thesemiconductor cooling fin 11 starts to work when being electrified, the cold end of thesemiconductor cooling fin 11 can absorb the heat dissipated by the acted object, the hot end of thesemiconductor cooling fin 11 releases the heat absorbed by the cold end, the secondheat dissipation assembly 30 is attached to the hot end of thesemiconductor cooling fin 11, the secondheat dissipation assembly 30 further dissipates the heat of the hot end of thesemiconductor cooling fin 11, and therefore the cooling effect is achieved.

As shown in fig. 5 and 6, since the temperature of some heating elements at the beginning of starting cannot reach the room temperature or cannot be 1-2 ℃ higher than the room temperature, the heating elements need to be preheated before starting, and in addition, the hot ends of a plurality ofsemiconductor cooling fins 11 are attached to an object to be acted, so that the cold ends of one part of semiconductor cooling fins are attached to the heat-conductingmember 50, and the hot ends of the other part of semiconductor cooling fins are attached to the heat-conductingmember 50, so that the use function of thecooling device 100 is increased, and the work efficiency is improved.

Thetemperature control assembly 40 comprises a plurality oftemperature sensors 41 and a plurality of temperature controllers 42, thetemperature sensors 41 are arranged, thetemperature sensors 41 are used for detecting temperature values of acted objects, the temperature controllers 42 are used for controlling the power-on frequency of the firstheat dissipation assembly 10 according to the temperature values, thetemperature sensors 41 detect the temperatures of the acted objects, thetemperature sensors 41 can also be used for detecting the temperatures of the hot ends of thesemiconductor cooling fins 11, thetemperature sensors 41 feed the detected temperatures back to the temperature controllers 42, the temperature controllers 42 adjust the working frequency of the heat dissipation assemblies according to the temperatures detected by thetemperature sensors 41, and then the purpose of high-precision temperature control is achieved, so that the interior of the heating element is kept at a constant temperature.

The heating element generates heat after working, the heat is conducted through an acted object, the cold end of thesemiconductor radiating fin 11 is attached to the acted object, thesemiconductor radiating fin 11 starts to work after being electrified, the cold end of thesemiconductor radiating fin 11 can absorb the heat emitted by the acted object, the hot end of thesemiconductor radiating fin 11 releases the heat absorbed by the cold end, thesecond radiating component 30 is attached to the hot end of thesemiconductor radiating fin 11, and thesecond radiating component 30 further emits the heat of the hot end of thesemiconductor radiating fin 11, so that the cooling effect is achieved; thesemiconductor radiating fins 11 are arranged in a plurality of sections which are mutually independent, the plurality of sections ofsemiconductor radiating fins 11 simultaneously cool the heating element, and each section ofsemiconductor radiating fin 11 provides the same refrigerating capacity, so that the temperature at each part inside the heating element is uniformly cooled.

When the equipment cannot be started due to low temperature when the equipment starts to work, thesemiconductor heating sheet 12 provides heat for the equipment, so that the equipment reaches the working temperature, the equipment is prevented from being incapable of being used due to low temperature, and the working performance of the equipment is improved; thetemperature sensor 41 detects the temperature of the acted object, thetemperature sensor 41 can also be used for detecting the temperature of the hot end of thesemiconductor cooling fin 11, thetemperature sensor 41 feeds the detected temperature back to the temperature controller 42, the temperature controller 42 adjusts the working frequency of the cooling component according to the temperature detected by thetemperature sensor 41, and then the purpose of high-precision temperature control is achieved, so that the inside of the heating element is kept at a constant temperature.

According to thecooling device 100 of the embodiment of the invention, thelinear scanning camera 1000 is cooled down through a plurality of sections of mutually independentsemiconductor cooling fins 11, and each section ofsemiconductor cooling fin 11 provides the same cooling capacity, so that the temperature at each position inside thelinear scanning camera 1000 is uniformly cooled; when the equipment cannot be started due to low temperature when the equipment starts to work, thesemiconductor heating sheet 12 provides heat for the equipment, so that the equipment reaches the working temperature, the equipment is prevented from being incapable of being used due to low temperature, and the working performance of the equipment is improved; detect the temperature of acted on the object throughtemperature sensor 41,temperature sensor 41 feeds back the temperature that detects to temperature controller 42, and temperature controller 42 measures the operating frequency of temperature regulation radiator unit according totemperature sensor 41, and then realizes the purpose of high accuracy accuse temperature forline scan camera 1000 is inside to be kept at constant temperature.

As shown in fig. 2 and 3, further, the cooling device 100 further includes: the heat conducting part 50 and the heat insulating part 51, the heat conducting part 50 is arranged between the first heat radiating component 10 and the acted object, the heat conducting part 50 is attached to the acted object, the heat generated by the acted object is transmitted better through the heat conducting part 50, the first heat radiating part is attached to the heat conducting part 50, namely, the cold end of the semiconductor heat radiating fin 11 is attached to the heat conducting part 50, the heat conducting part 50 transmits the heat emitted by the acted object to the cold end of the semiconductor heat radiating fin 11, the temperature of the cold end of the semiconductor heat radiating fin 11 after working is reduced, the heat transmission is realized through the temperature difference between the cold end of the semiconductor heat radiating fin 11 and the heat conducting part 50, namely, the cold end of the semiconductor heat radiating fin 11 absorbs the heat transmitted by the heat conducting part 50, so that the temperature of the acted object is integrally reduced, the semiconductor heat radiating fin 11 is arranged in a plurality of sections which are mutually independent, and the plurality of sections of the semiconductor heat radiating fins 11 cool the heat conducting part 50 simultaneously, every section semiconductor fin 11 provides the same refrigerating output for the temperature of heat-conducting piece 50 each department is evenly cooled down, also obtains evenly cooling by the temperature of effect object, and rectangular shape structure's aluminium soaking plate or copper soaking plate can be chooseed for use to heat-conducting piece 50, is equipped with heat conduction silicone grease between semiconductor fin 11 and the heat-conducting piece 50 and plays better heat conduction effect.

As shown in fig. 3, the heat insulating member 51 is provided on the heat conducting member 50, the heat insulating member 51 is provided with a plurality of assembling through holes 52 corresponding to the semiconductor heat sink 11, at least a part of the semiconductor heat sink 11 passes through the assembling through holes 52 to be attached to the heat conducting member 50, the heat insulating member 51 is provided on the heat conducting member 50, the heat insulating member 51 is attached to the heat conducting member 50, and the assembling through holes 52 extending from the semiconductor heat sink 11 are left on the heat insulating member 51, when the heat of the object to be acted is conducted through the heat conducting member 50, the cold end of the semiconductor heat sink 11 absorbs the heat radiated from the object to be acted, the semiconductor heat sink 11 is provided in a plurality of sections independent from each other and does not completely cover the heat conducting member 50, therefore, in order to prevent the heat radiated from the uncovered part of the semiconductor heat sink 11 on the heat conducting member 50 from being diffused into the object to be acted, the uncovered part is insulated by the heat insulating member 51, and further prevents the heat from being radiated into the object to be acted, all heat is ensured to be cooled through the cold end of the semiconductor radiating fin 11, and the heat insulation piece 51 can be heat insulation cotton, a heat insulation plate, a heat insulation film or a heat insulation foil.

As shown in fig. 4, theheat conducting member 50 is attached to the acted object, the heat generated by the acted object is better transmitted through theheat conducting member 50, so as to achieve better heat conducting effect, the cold end of thesemiconductor heat sink 11 absorbs the heat conducted by theheat conducting member 50, so that the temperature of the acted object is integrally reduced, thesemiconductor heat sink 11 adopts a plurality of sections of mutually independent arrangements, the plurality of sections ofsemiconductor heat sinks 11 simultaneously cool theheat conducting member 50, each section ofsemiconductor heat sink 11 provides the same refrigerating capacity, so that the temperatures of all parts of theheat conducting member 50 are uniformly cooled, and the temperature of the acted object is also uniformly cooled; in order to prevent the heat dissipated from the uncovered part of thesemiconductor heat sink 11 on theheat conducting member 50 from diffusing into the acted object, the uncovered part is isolated by theheat insulating member 51, so as to prevent the heat from dissipating into the acted object, and ensure that all the heat is cooled by the cold end of thesemiconductor heat sink 11.

As shown in fig. 1 and 5, further, the second heat dissipation assembly 30 includes: the water cooling device comprises a water tank 300, a water rail 301 and a water pump 302, wherein a first water flow channel 303 is formed in the water rail 301, heat-conducting silicone grease is arranged between the water rail 301 and the semiconductor radiating fin 11 to achieve a better heat conducting effect, the water rail 301 is attached to the hot end of the semiconductor radiating fin 11, the first water flow channel 303 is communicated with the water tank 300, a cooling medium in the water tank 300 enters the water rail 301 through the first water flow channel 303, and the cooling medium entering the water rail 301 absorbs heat conducted by the hot end of the semiconductor radiating fin 11; the water pump 302 is arranged between the water inlet 304 of the first water flow channel 303 and the water tank 300, the water pump 302 realizes the effect of recycling the cooling medium in the water rail 301, the cooling medium in the water tank 300 enters the first water flow channel 303 through the power provided by the water pump 302, and the cooling medium flowing through the first water flow channel 303 absorbs the heat conducted from the hot end of the semiconductor heat sink 11 and then returns to the water tank 300 in a circulating manner.

As shown in fig. 5, the cooling medium in the water tank 300 enters the water rail 301 through the firstwater flow channel 303, the cooling medium entering the water rail 301 absorbs heat conducted from the hot end of thesemiconductor heat sink 11, and then is circulated back to the water tank 300 for the next round of cooling, thereby improving the cooling effect of thesemiconductor heat sink 11.

Further, the water rail 301 is an aluminum rail or a copper rail, and the aluminum and copper rails can conduct heat better to absorb heat at the hot end of thesemiconductor heat sink 11, thereby cooling the hot end of thesemiconductor heat sink 11.

As shown in fig. 1, further, thecooling device 100 further includes athird heat sink 60, thethird heat sink 60 is disposed between the water outlet of the firstwater flow channel 303 and the water tank 300, the cooling medium flowing through the firstwater flow channel 303 absorbs heat conducted from the hot end of thesemiconductor heat sink 11, the cooling circulating flow passing through thethird heat sink 60 returns to the water tank 300, thethird heat sink 60 cools the cooling medium absorbing heat again, and the cooled medium circulating flow returns to the water tank 300 to prepare for the next round of cooling, so as to improve the cooling effect of the hot end of thesemiconductor heat sink 11.

As shown in fig. 1, further, the third heat dissipation assembly 60 includes: the air-cooled water discharge 600 and the fan 601, a second water flow channel 602 is formed in the air-cooled water discharge 600, two ends of the second water flow channel 602 are respectively communicated with the water outlet of the first water flow channel 303 and the water tank 300, a cooling medium flowing through the first water flow channel 303 absorbs heat conducted by the hot end of the semiconductor cooling fin 11, flows out through the first water flow channel 303 and enters the second water flow channel 602, and is cooled in the second water flow channel 602 and then circulated back to the water tank 300, the cooled medium is circulated back to the water tank 300 to prepare for the next round of cooling, and the cooling effect of the hot end of the semiconductor cooling fin 11 is improved; the fan 601 is disposed on the air-cooled water discharge 600 and is used for blowing air towards the air-cooled water discharge 600, the cooling medium passing through the first water flow channel 303 flows out into the second water flow channel 602, and the cooling medium in the second water flow channel 602 is cooled by the air-cooled water discharge 600, so as to further improve the cooling effect of the hot end of the semiconductor heat sink 11.

Further, thecooling device 100 further includes: a flow control assembly, the flow control assembly comprising: a flow sensor for detecting the flow rate of thewater pump 302 and a flow controller; the flow controller is used for receiving the electrifying frequency to control the flow of thewater pump 302, the flow of thewater pump 302 detected by the flow sensor is fed back to the flow controller, and the flow controller adjusts the flow of thewater pump 302 according to the current temperature, so that the flow of thewater pump 302 is enough to absorb the heat emitted by the hot end of thesemiconductor cooling fin 11, and further the acted object is kept in a constant temperature range.

As shown in fig. 2 and 8, further, the secondheat dissipation assembly 30 includes: aheat dissipating plate 310 andheat dissipating fins 311, one side of theheat dissipating plate 310 being bonded to thesemiconductor heat sink 11; the plurality of radiatingfins 311 are arranged, the plurality of radiatingfins 311 are arranged on the other side of the radiatingplate 310, the radiatingplate 310 is attached to the hot end of thesemiconductor radiating fin 11, the radiatingplate 310 conducts heat of the hot end of thesemiconductor radiating fin 11 to the radiatingfins 311, the radiatingfins 311 radiate the heat of the hot end of thesemiconductor radiating fin 11, and the plurality of radiatingfins 311 are arranged to improve the cooling effect of thesemiconductor radiating fin 11.

As shown in fig. 4 and 8, further, the second heat dissipation assembly 30 further includes: the heat dissipation device comprises a sealing plate 312, a fan, a wind nozzle 314 and a silencer 316, wherein the sealing plate 312 is used for being matched with a heat dissipation plate 310, so that a plurality of heat dissipation air channels are formed between two adjacent heat dissipation fins 311, the fan is connected with the wind nozzle 314, wind generated by the fan enters the heat dissipation air channels through the wind nozzle 314, heat in the heat dissipation channels is taken out through the wind, and then the heat dissipation fins 311 are cooled, so that the heat dissipation fins 311 can absorb heat at the hot end of the semiconductor cooling fin 11 more efficiently; the fan is communicated with the air nozzle 314, the air nozzle 314 is over against the air inlets 315 of the plurality of radiating air channels, the air generated by the fan enters the radiating air channels through the air nozzle 314, the air generated by the fan is divided and accelerated by the air nozzle 314, so that the air is dispersed into different radiating air channels, the heat is absorbed by each air channel more efficiently, and each radiating fin 311 can radiate the heat; the silencer 316 is arranged at the air outlet 313 of the heat dissipation air duct, and certain noise can be generated when air enters the heat dissipation channel, so that the noise of the air is reduced by installing the silencer 316, and the use comfort is improved.

As shown in fig. 5, further, a distance a between twoadjacent semiconductor fins 11 and a length b of thesemiconductor fins 11 satisfy: a is less than or equal to 1.5b, for example, the length of thesemiconductor heat sink 11 is selected to be 1.5b, so that a good heat dissipation effect can be ensured, and the situations of waste of excessive cooling capacity and insufficient heat dissipation can be avoided.

The present invention also proposes aline scan camera 1000 having thecooling device 100 of the above embodiment.

As shown in fig. 4 and 9, a line-scan camera 1000 according to an embodiment of the second aspect of the present invention includes: thecamera housing 20 and thecooling device 100 are provided, and thecooling device 100 is provided on at least one side of thecamera housing 20.

The heat generated when theline scan camera 1000 operates is conducted to thecamera housing 20, and thecooling device 100 is attached to one surface or both surfaces of thecamera housing 20 to cool theline scan camera 1000, so that the temperature of theline scan camera 1000 is maintained at a constant temperature, thereby improving the operating performance of theline scan camera 1000.

According to theline scan camera 1000 of the embodiment of the present invention, by providing thecooling device 100 on the line scan camera, heat generated during the operation of the line scan camera can be conducted to thecamera housing 20, and by cooling theline scan camera 1000 by the engagement of thecooling device 100 and thecamera housing 20, the temperature of theline scan camera 1000 can be maintained at a constant temperature, thereby improving the operation performance of theline scan camera 1000.

The present invention also proposes an automatic optical inspection apparatus having the line-scan camera 1000 of the above embodiment. The automatic optical detection equipment for detecting the circuit board comprises a machine table, a workbench movably arranged on the machine table and aline scanning camera 1000 arranged on the machine table, wherein the workbench is used for bearing the circuit board to be detected and driving the circuit board to pass through theline scanning camera 1000, and theline scanning camera 1000 can adopt a contact type image sensor.

According to the automatic optical detection equipment provided by the embodiment of the invention, the working performance of the automatic optical detection equipment can be better improved by arranging theline scanning camera 1000 of the embodiment.

In the description herein, references to the description of the terms "some embodiments," "optionally," "further," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (12)

Translated fromChinese

1.一种冷却装置，其特征在于，包括：1. A cooling device, characterized in that, comprising:第一散热组件，所述第一散热组件包括多个半导体散热片，所述半导体散热片的冷端朝向被作用物体；a first heat dissipation assembly, the first heat dissipation assembly includes a plurality of semiconductor heat dissipation fins, and the cold ends of the semiconductor heat dissipation fins face the object to be applied;第二散热组件，所述第二散热组件设在所述第一散热组件远离所述被作用物体的一侧，所述半导体散热片的热端朝向所述第二散热组件，所述第二散热组件用于对所述半导体散热片的热端降温；A second heat dissipation assembly, the second heat dissipation assembly is provided on the side of the first heat dissipation assembly away from the object to be applied, the hot end of the semiconductor heat sink faces the second heat dissipation assembly, and the second heat dissipation assembly The component is used for cooling the hot end of the semiconductor heat sink;温度控制组件，所述温度控制组件包括温度传感器和温度控制器，所述温度传感器用于检测所述被作用物体的温度值，所述温度控制器用于根据所述温度值控制所述第一散热组件的通电频率。a temperature control component, the temperature control component includes a temperature sensor and a temperature controller, the temperature sensor is used to detect the temperature value of the object to be applied, and the temperature controller is used to control the first heat dissipation according to the temperature value The power-on frequency of the component.2.根据权利要求1所述的冷却装置，其特征在于，多个所述半导体散热片相互间隔开设置，所述冷却装置还包括：2 . The cooling device according to claim 1 , wherein a plurality of the semiconductor heat sinks are spaced apart from each other, and the cooling device further comprises: 2 .加热组件，所述加热组件包括半导体加热片，所述半导体加热片设有多个，多个所述半导体加热片均匀间隔开设置在所述被作用物体上，所述半导体加热片的热端朝向所述被作用物体。A heating assembly, the heating assembly includes a semiconductor heating sheet, a plurality of the semiconductor heating sheets are provided, the plurality of the semiconductor heating sheets are evenly spaced and arranged on the object to be applied, and the hot end of the semiconductor heating sheet faces the object being acted upon.3.根据权利要求1所述的冷却装置，其特征在于，还包括：导热件，所述导热件设在所述第一散热组件和所述被作用物体之间。3 . The cooling device according to claim 1 , further comprising: a heat-conducting member, wherein the heat-conducting member is provided between the first heat dissipation component and the object to be applied. 4 .4.根据权利要求2所述的冷却装置，其特征在于，还包括：隔热件，所述隔热件设在所述导热件上，所述隔热件上形成有多个与所述半导体散热片对应的装配通孔，所述半导体散热片的至少部分穿过所述装配通孔与所述导热件贴合。4 . The cooling device according to claim 2 , further comprising: a heat insulating member, the heat insulating member is provided on the heat conducting member, and a plurality of insulating members corresponding to the semiconductors are formed on the heat insulating member. 5 . A mounting through hole corresponding to the heat sink, at least a part of the semiconductor heat sink passes through the mounting through hole and is attached to the heat conducting member.5.根据权利要求1-4任意一项所述的冷却装置，其特征在于，所述第二散热组件包括：5. The cooling device according to any one of claims 1-4, wherein the second heat dissipation component comprises:水箱；water tank;水轨，所述水轨内形成有第一水流通道，所述第一水流通道与所述水箱联通，所述水轨为铝轨或者铜轨；a water rail, wherein a first water flow channel is formed in the water rail, the first water flow channel communicates with the water tank, and the water rail is an aluminum rail or a copper rail;水泵，所述水泵设在所述第一水流通道的进水口和所述水箱之间。A water pump, the water pump is arranged between the water inlet of the first water flow channel and the water tank.6.根据权利要求5所述的冷却装置，其特征在于，还包括第三散热组件，所述第三散热组件设在所述第一水流通道的出水口和所述水箱之间，所述第三散热组件包括：6 . The cooling device according to claim 5 , further comprising a third heat dissipation assembly, wherein the third heat dissipation assembly is provided between the water outlet of the first water flow channel and the water tank, and the first heat dissipation assembly is provided. 7 . Three cooling components include:风冷水排，所述风冷水排内形成有第二水流通道，所述第二水流通道的两端分别与所述第一水流通道的出水口和所述水箱联通；an air-cooled water row, wherein a second water flow channel is formed in the air-cooled water row, and both ends of the second water flow channel are respectively communicated with the water outlet of the first water flow channel and the water tank;风扇，所述风扇设在所述风冷水排上，用于朝向所述风冷水排吹风。a fan, which is arranged on the air-cooled exhaust and is used for blowing air toward the air-cooled exhaust.7.根据权利要求5所述的冷却装置，其特征在于，还包括：流量控制组件，所述流量控制组件包括：7. The cooling device of claim 5, further comprising: a flow control assembly, the flow control assembly comprising:流量传感器，所述流量传感器用于检测所述水泵的流量；a flow sensor, which is used to detect the flow of the water pump;流量控制器，所述流量控制器用于接收所述通电频率控制所述水泵的流量。a flow controller, which is used for receiving the power-on frequency to control the flow of the water pump.8.根据权利要求1-4任意一项所述的冷却装置，其特征在于，所述第二散热组件包括：8. The cooling device according to any one of claims 1-4, wherein the second heat dissipation component comprises:散热板，所述散热板的一侧与所述半导体散热片贴合；a heat dissipation plate, one side of the heat dissipation plate is attached to the semiconductor heat sink;散热翅片，所述散热翅片设有多个，多个所述所述散热翅片设在所述散热板的另一侧。A plurality of heat dissipation fins are provided, and a plurality of the heat dissipation fins are provided on the other side of the heat dissipation plate.9.根据权利要求8所述的冷却装置，其特征在于，所述第二散热组件还包括：9. The cooling device according to claim 8, wherein the second heat dissipation component further comprises:封闭板，所述封闭板用于与所述散热板配合，以使相邻的两个所述散热翅片之间构造出多个散热风道；a closing plate, which is used to cooperate with the heat dissipation plate, so that a plurality of heat dissipation air ducts are constructed between two adjacent heat dissipation fins;风机和风嘴，所述风机与所述风嘴联通，所述风嘴正对多个所述散热风道；a fan and a tuyere, the fan communicates with the tuyere, and the tuyere is facing the plurality of the cooling air ducts;消音器，所述消音器设在所述散热风道的出风口。The muffler is arranged at the air outlet of the cooling air duct.10.根据权利要求1或2所述的冷却装置，其特征在于，相邻的两个所述半导体散热片之间的距离a与所述半导体散热片的长度b之间满足：a≤1.5b。10. The cooling device according to claim 1 or 2, wherein the distance a between two adjacent semiconductor heat sinks and the length b of the semiconductor heat sinks satisfy: a≤1.5b .11.一种线扫相机，其特征在于，包括：11. A line scan camera, characterized in that, comprising:相机壳体；camera housing;根据权利要求1-10中任一项所述的冷却装置，所述冷却装置设在所述相机壳体的至少一侧。The cooling device according to any one of claims 1-10, which is provided on at least one side of the camera housing.12.一种自动光学检测设备，其特征在于，包括权利要求11中所述的线扫相机。12. An automatic optical inspection device, characterized in that it comprises the line scan camera as claimed in claim 11.

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