Disclosure of Invention
The application provides a method, a device, a storage medium and a terminal for detecting line abnormality in a film material, which can solve the technical problems of low detection efficiency, large detection error or high detection cost of line abnormality detection in the film material in the related technology.
In a first aspect, an embodiment of the present application provides a method for detecting a line abnormality in a film material, including:
Acquiring reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state, and acquiring target output voltages at two ends of the reference resistor connected with a target circuit in the film material;
if the target output voltage and the reference voltage meet preset conditions, determining that the target line is in an abnormal state;
wherein the abnormal state is an open circuit state or a short circuit state.
When a circuit in the film material is broken or short-circuited, the resistance in the circuit can change, so that the voltage at two ends of the reference resistor connected with the circuit changes, the reference voltage at two ends of the reference resistor in the film material in a normal state of the circuit can be obtained, the target output voltage at two ends of the reference resistor connected with the target circuit in the film material is collected, and whether the circuit in the film material is in an abnormal state is judged according to the relation between the reference voltage and the target output voltage.
Wherein, the corresponding reference voltage of the circuit in the film material in the normal state can be obtained in advance,
Optionally, when the abnormal state is an open state, the method includes: acquiring open-circuit reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state, and acquiring first output voltages at two ends of the reference resistor connected with any marking line in the film material; and if the first output voltage and the disconnection reference voltage meet a first preset condition, determining that a target line corresponding to the first output voltage is in a disconnection state.
When the abnormal state is a short circuit state, the method includes: acquiring short circuit reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state, and acquiring second output voltages at two ends of the reference resistor connected with any two marked lines in the film material; and if the second output voltage and the short circuit reference voltage meet a second preset condition, determining that two target lines corresponding to the second output voltage are in a short circuit state.
Because the circuit in one circuit can be broken in the film material, and the film material can be short-circuited in two circuits, the circuit in the film material can be selected to be abnormally detected according to the needs, so that the needs of circuit detection under different scenes are met, and the application range of the detection method is improved.
Optionally, the obtaining the open-circuit reference voltage at two ends of the reference resistor of the circuit in the film material under the normal state includes: collecting a first sample resistance value of a circuit in the film material corresponding to the open-circuit sample film material, and obtaining a first control resistance value of the film material according to the first sample resistance value; obtaining a first reference resistance value of the reference resistance of the film material according to the first control resistance value, wherein the first reference resistance value and the first control resistance value are in the same order of magnitude; and obtaining the open-circuit reference voltage at two ends of the reference resistor of the circuit in the film material under the normal state according to the first control resistance, the first reference resistance and the first input voltage between the circuit to be detected and the reference resistor in the film material.
Optionally, the collecting the first output voltage of the two ends of the reference resistor connected with any one of the marking lines in the film material includes: transmitting a first resistance control signal to a reference resistance selection module, wherein the first resistance control signal is used for indicating the reference resistance selection module to control the reference resistance to be set to the first reference resistance value; a first to-be-detected selection signal is sent to a to-be-detected resistor selection module, and the first to-be-detected selection signal is used for indicating the to-be-detected resistor selection module to select any one line in the film material as a target line, connecting the target line with the reference resistor, and simultaneously adding the first input voltage to two ends of the connected target line and the reference resistor; a first output voltage across the reference resistor connected to the target line in the film material is collected.
Optionally, if the first output voltage and the open-circuit reference voltage meet a first preset condition, determining that the target line corresponding to the first output voltage is in an open-circuit state includes: comparing the first output voltage with the open circuit reference voltage; when the first output voltage is smaller than the disconnection reference voltage, the first output voltage and the disconnection reference voltage meet a first preset condition, and a target line corresponding to the first output voltage is determined to be in a disconnection state.
When whether a circuit in the film material has a circuit breaking condition or not needs to be detected, the sample resistance of the circuit breaking sample film material can be acquired, the control resistance and the resistance of the reference resistor are obtained according to the sample resistance, and finally the circuit breaking reference voltage is obtained, so that the circuit breaking condition can be determined according to the relation between the circuit breaking reference voltage and the first output voltage only by acquiring the first output voltage at two ends of the reference resistor connected with the target circuit in the film material, the detection efficiency and the detection accuracy are effectively improved, the detection device is simple in structure, expensive precision detection equipment is not needed, and the circuit detection cost can be reduced.
Optionally, the obtaining the short circuit reference voltage at two ends of the reference resistor of the circuit in the film material under the normal state includes: collecting a second sample resistance value of a circuit in the film material corresponding to the short-circuit sample film material, and obtaining a second control resistance value of the film material according to the second sample resistance value; obtaining a second reference resistance value of the reference resistance of the film material according to the second control resistance value, wherein the second reference resistance value and the second control resistance value are in the same order of magnitude; and obtaining short circuit reference voltages at two ends of the reference resistor of the circuit in the film material under a normal state according to the second control resistance, the second reference resistance and the second input voltage between the circuit to be detected and the reference resistor in the film material.
Optionally, the collecting the second output voltage of the two ends of the reference resistor connected with any two marked lines in the film material includes: transmitting a second resistance control signal to a reference resistance selection module, wherein the second resistance control signal is used for indicating the reference resistance selection module to control the reference resistance to be set to the second reference resistance value; sending a second to-be-detected selection signal to a to-be-detected resistor selection module, wherein the second to-be-detected selection signal is used for indicating the to-be-detected resistor selection module to select any two lines in the film material as target lines, connecting the target lines with the reference resistor, and simultaneously adding the second input voltage to two ends of the target lines after being connected with the reference resistor; and collecting second output voltages at two ends of the reference resistor connected with the target line in the film material.
Optionally, if the second output voltage and the short circuit reference voltage meet a second preset condition, determining that two target lines corresponding to the second output voltage are in a short circuit state includes: comparing the second output voltage with the short reference voltage; and when the second output voltage is larger than the short circuit reference voltage, the second output voltage and the short circuit reference voltage meet a second preset condition, and two target lines corresponding to the second output voltage are determined to be in a short circuit state. Optionally, the method further comprises: and sending out prompt information when the circuit in the film material is detected to be in an abnormal state. And if the target output voltage and the reference voltage do not meet the preset conditions, determining that the target line is in a normal state.
When the short circuit condition exists in the circuit in the film material, the sample resistance value of the short circuit sample film material can be acquired, the control resistance value and the resistance value of the reference resistor are obtained according to the sample resistance value, and finally the short circuit reference voltage is obtained, so that the second output voltage at two ends of the reference resistor connected with any two circuits in the film material is only acquired, whether the short circuit condition exists in the film material can be determined according to the relation between the short circuit reference voltage and the second output voltage, the detection efficiency and the detection accuracy are effectively improved, the detection device is simple in structure, expensive precision detection equipment is not needed, and the circuit detection cost can be reduced.
In a second aspect, an embodiment of the present application provides a device for detecting a line abnormality in a film material, the device including:
The reference resistor selection module is connected with the reference resistor and used for controlling the reference resistor to be set as a reference resistance value according to a resistor control signal;
the to-be-detected resistor selection module is connected with a to-be-detected circuit in the film material and is used for selecting a target circuit in the film material to be connected with the reference resistor according to a to-be-detected selection signal, and simultaneously, an input voltage is applied to two ends of the target circuit connected with the reference resistor;
the reference voltage module is used for outputting the reference voltage corresponding to the circuit in the film material in a normal state;
The processor module is respectively connected with the reference resistor selection module, the resistor to be detected selection module and the reference voltage module and is used for acquiring reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state and acquiring target output voltages at two ends of the reference resistor connected with a target circuit in the film material;
The processor module is further used for determining that the target line is in an abnormal state if the target output voltage and the reference voltage meet preset conditions; wherein the abnormal state is an open circuit state or a short circuit state.
Optionally, the reference resistor selecting module controls one end of the reference resistor to be connected with a ground terminal, and the other end of the reference resistor is connected with the first input terminal of the processor module; the resistor to be tested selection module controls one end of a circuit in the film material to be connected with a voltage output end of an input voltage, and the other end of the circuit in the film material is connected with a first input end of the processor module; the output end of the reference voltage module is connected with the second input end of the processor module.
Because the resistance in the circuit can change when the circuit in the film material is broken or short-circuited, the resistance value of the reference resistor can be set through the reference resistor selection module, the resistor selection module to be detected can connect the preset circuit in the film material with the voltage output end of the input voltage and the reference resistor, the reference voltage module can output the reference voltage, the reference voltage corresponding to the circuit in the film material in a normal state can be obtained, the target output voltages at the two ends of the reference resistor connected with the target circuit in the film material are collected, and whether the circuit in the film material is in an abnormal state is judged according to the relation between the reference voltage and the target output voltage.
In a third aspect, embodiments of the present application provide a computer storage medium storing a plurality of instructions adapted to be loaded by a processor and to perform steps implementing the method described above.
In a fourth aspect, an embodiment of the present application provides a terminal, including a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor implements the steps of the method described above when the processor executes the program.
The technical scheme provided by the embodiments of the application has the beneficial effects that at least:
The embodiment of the application provides a method and a device for detecting line abnormality in a film material, a storage medium and a terminal. The method for detecting the abnormal circuit in the film material comprises the following steps: acquiring reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state, and acquiring target output voltages at two ends of the reference resistor connected with a target circuit in the film material; if the target output voltage and the reference voltage meet the preset conditions, determining that the target line is in an abnormal state; wherein the abnormal state is an open state or a short state. When the circuit in the film material is broken or short-circuited, the resistance in the circuit can change, so that the output voltage in the circuit changes, the reference voltage at two ends of the reference resistance of the circuit in the film material in a normal state can be obtained, the target output voltages at two ends of the reference resistance connected with the target circuit in the film material are collected, and whether the circuit in the film material is in an abnormal state is judged according to the relation between the reference voltage and the target output voltage.
Detailed Description
In order to make the features and advantages of the present application more comprehensible, embodiments accompanied with figures in the present application are described in detail below, wherein the embodiments are described only in some but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application as detailed in the accompanying claims.
In the description of the embodiments of the present application, it is to be understood that in the description of the present application, unless otherwise indicated, "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a circuit in a film material according to a first embodiment of the present application.
The film material in the embodiment of the application can be solid or liquid with one-dimensional linear scale far smaller than other two-dimensional linear scales, and can be applied to various electronic equipment or terminals, for example, the film material can be a display screen in electronic equipment such as a mobile phone and the like. For convenience of description, in the embodiment of the present application, a specific implementation of a method for detecting a line abnormality in a film material is described by taking the film material as a touch screen in an electronic device as an example. It will be appreciated that when the film material is used as a touch screen, a transparent material may be used in the film material to facilitate the display of the relevant pattern or text by the touch screen; on the other hand, the touch screen is used as a main body for interaction between the electronic equipment and a user, and a plurality of circuits can be arranged in the film material, so that the user can sense touch of the user, or the circuits in the independently arranged circuit layers in the related technology are arranged in the film material for reducing the thickness.
As shown in fig. 1, the film material 100 in the embodiment of the present application may include a film body 110 and a circuit 120, where the film body 110 may include a first surface and a second surface (not shown in fig. 1) opposite to the first surface, the first surface and the second surface are planes, the circuit 120 is disposed between the first surface and the second surface, the film body 110 is an insulating material, and the circuit 120 is a conductive material, and the number, specific connection form and structural composition of the circuit 120 may not be limited. For example, in fig. 1, the structural composition of each wire 120 may be a portion of a silver paste wire and a portion of a layer of indium tin oxide (ITO, tndium Tin Oxide) wire. Further, the silver paste lines in each line 120 may be parallel or serial with the ITO lines, the resistance of the silver paste lines is smaller, and the resistance of the ITO lines is larger, in fig. 1, one end of one silver paste line in each line 120 is parallel with one end of three ITO lines, and then the other end of the silver paste line in the line 120 and the other end of the three ITO lines are led out of the film body 110, so as to serve as an interface for connecting the line 120 with external devices or components. In fig. 1, the film material 100 may include a plurality of wires 120, where the silver paste wires in the wires 120 may be disposed adjacently, and the interfaces thereof are respectively: CH1, CH 2. CHn (n is a positive integer greater than 2); ITO circuit that is connected with silver thick liquid circuit also sets up adjacently, and its interface is respectively: CH1', CH2 '. Cn ' (n is a positive integer greater than 2).
It should be understood that the structure of the lines 120 in the film material 100 shown in fig. 1 is merely an example, and in practical applications, the number, specific connection form and structural composition of the lines 120 in the film material 100 may be set according to the application environment, which is not limited in the embodiment of the present application.
Referring to fig. 2, fig. 2 is a flow chart of a method for detecting a circuit abnormality in a film material according to a first embodiment of the present application.
As shown in fig. 2, the detection method includes:
S201, acquiring reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state, and acquiring target output voltages at two ends of the reference resistor connected with a target circuit in the film material.
In practice, when a user needs to detect an abnormality in a line in the film material, the abnormality detection may include detecting a disconnection abnormality in the line and detecting a short circuit abnormality in the line. The abnormal disconnection refers to a state that one line in the film material is disconnected at a certain place, when the line is disconnected, the disconnected part of the line is air or insulating film material, so that after the line is disconnected, the resistance at two ends of the line is in an overload state, namely, the resistance at two ends of the line is infinite. The abnormal short circuit refers to the condition that two lines in the film material are short-circuited, and when the two lines are short-circuited, particularly adjacent lines or lines with smaller resistance are short-circuited, the resistance between the two short-circuited lines is small. Whether open or shorted will have an impact on the normal use of the film material, and thus line anomalies in the film material can be categorized as open anomalies or shorted anomalies.
When the circuit is broken in the film material, the resistance of the broken circuit is increased relative to the resistance of the circuit in a normal state; when the circuit in the film material is short-circuited, the resistance between the two short-circuited circuits is reduced relative to the resistance between the two circuits in the normal state, and although the resistance can be directly measured to judge whether the circuit in the film material is abnormal, the problems that the resistance measurement error is large and the resistance is difficult to realize exist, so that the change of the resistance of the measurement circuit can be converted into the voltage change of the measurement circuit to judge the abnormality of the circuit.
In the embodiment of the application, whether the circuit to be detected is abnormal or not is judged by comparing the actually measured output voltage values of the two ends of the reference resistor connected with the circuit to be detected with the reference voltage values of the two ends of the reference resistor (the voltage values of the two ends of the reference resistor in a normal state of the circuit), so that the circuit abnormality detection device can be arranged in the film material through the electronic component or the circuit module, the voltage output end of the external input voltage is connected with one end of the circuit to be detected, the other end of the circuit to be detected is connected with one end of the reference resistor, and the other end of the reference resistor is connected with the grounding end, wherein the input voltage and the reference resistor are known. The method is equivalent to connecting a line to be detected and a reference resistor between an external input voltage and a grounding end, so that according to the relation between the resistor and the voltage, the target output voltage at two ends of the reference resistor connected with the line to be detected can be obtained by collecting the voltage of the connection point between the other end of the line to be detected and one end of the reference resistor, and the target output voltage is the voltage at two ends of the reference resistor.
When the abnormal detection of disconnection is needed, the reference voltages of the two ends of the reference resistor of the circuit in the film material in the normal state are needed to be obtained, the reference voltages of the two ends of the reference resistor of the single circuit in the film material in the normal state are needed to be directly measured, and the reference voltages of disconnection can be obtained through calculation according to the sample resistance value, the input voltage and the reference resistor of the preset circuit in the known film material.
The first output voltage at two ends of the reference resistor connected with any one of the marking lines in the film material is required to be collected, namely, one line to be detected is connected into the line abnormality detection device in the film material, the voltage of the connection point between the other end of the line to be detected and one end of the reference resistor is collected, and the first output voltage at two ends of the reference resistor can be obtained, namely, the first output voltage is the voltage at two ends of the reference resistor.
When short-circuit abnormality detection is needed, short-circuit reference voltages at two ends of a reference resistor of a circuit in a film material in a normal state are needed to be obtained, wherein the short-circuit reference voltages refer to voltages at two ends of the reference resistor of any two circuits in the film material in the normal state, the short-circuit reference voltages do not need to be directly measured, and the short-circuit reference voltages can be obtained through calculation according to sample resistance values, input voltages and reference resistors of preset circuits in the known film material.
And the second output voltages at two ends of the reference resistor connected with any two marked lines in the film material are required to be collected, namely, the two lines to be detected are connected into the line abnormality detection device in the film material, and the voltages of the connection points of the other ends of the two lines to be detected and one end of the reference resistor are collected, so that the second output voltages at two ends of the reference resistor can be obtained, and the second output voltages are the voltages at two ends of the reference resistor.
S202, if the target output voltage and the reference voltage meet preset conditions, determining that the target line is in an abnormal state.
When the open circuit abnormality detection is required, since the open circuit reference voltages at both ends of the reference resistor in the normal state of the circuit in the film material are already obtained, and the first output voltages at both ends of the reference resistor connected with any one of the mark lines in the film material are collected, it is known from the above analysis that when the open circuit exists in the circuit in the film material, the resistance value of the circuit in which the open circuit occurs increases relative to the resistance value of the circuit in the normal state, and since the first output voltage can be regarded as the voltages at both ends of the reference resistor, when the open circuit is connected in series with the reference resistor, the resistance of the open circuit increases, the voltage distributed on the reference resistor decreases, and therefore the open circuit reference voltage and the first output voltage can be input into the above film material circuit abnormality detection device for voltage comparison, and if the first output voltage and the open circuit reference voltage satisfy the first preset condition, the first preset condition is the relationship between the open circuit reference voltage and the first output voltage, and the circuit corresponding to the first output voltage is determined to be the open circuit state.
When the short-circuit abnormality detection is required, since the short-circuit reference voltages at the two ends of the reference resistor in the normal state of the line in the film material are obtained, and the second output voltages at the two ends of the reference resistor connected with any two marked lines in the film material are collected, according to the analysis, when the line in the film material is short-circuited, the resistance value of the line in the normal state is reduced relative to the resistance value of the line in the normal state, the second output voltage can be regarded as the voltage at the two ends of the reference resistor, when the short-circuited line is connected with the reference resistor in series, the resistance of the short-circuited line is reduced greatly, the voltage distributed on the reference resistor can be increased, and therefore the short-circuit reference voltage and the second output voltage can be input into the line abnormality detection device in the film material for voltage comparison, and if the second output voltage and the short-circuit reference voltage meet the second preset condition, and the second preset condition is the relationship between the short-circuit reference voltage and the second output voltage, and the corresponding line is determined to be in the short-circuit state.
In the embodiment of the application, the method for detecting the abnormal circuit in the film material comprises the following steps: acquiring reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state, and acquiring target output voltages at two ends of the reference resistor connected with a target circuit in the film material; if the target output voltage and the reference voltage meet the preset conditions, determining that the target line is in an abnormal state; wherein the abnormal state is an open state or a short state. When the circuit in the film material is broken or short-circuited, the resistance in the circuit can change, so that the output voltage in the circuit changes, the reference voltage at two ends of the reference resistance of the circuit in the film material in a normal state can be obtained, the target output voltages at two ends of the reference resistance connected with the target circuit in the film material are collected, and whether the circuit in the film material is in an abnormal state is judged according to the relation between the reference voltage and the target output voltage.
Referring to fig. 3, fig. 3 is a flow chart of a method for detecting a circuit abnormality in a film material according to a second embodiment of the present application.
As shown in fig. 3, the embodiment of the present application mainly aims at detecting open circuit abnormality in a film material, and the method includes:
S301, acquiring a first sample resistance value of a circuit in the film material corresponding to the open-circuit sample film material, and obtaining a first control resistance value of the film material according to the first sample resistance value.
It can be understood that before a batch of film materials to be detected is detected, one or more qualified film materials with the same specification as the film materials to be detected can be obtained in advance as sample film materials, and the sample film materials can ensure that the circuit inside the sample film materials is not broken, namely the circuit in the film materials is in a normal state. The resistance of each individual line in the sample film material is measured by a relative circuit or technique, and the obtained resistance data is used as a first sample resistance value of the line in the sample film material, wherein the first sample resistance value can comprise a plurality of data.
And determining a first control resistance value of the film material according to the maximum value, the average value and the minimum value in the first sample resistance value. For example, in the case of a circuit in a film material shown in fig. 1, a plurality of circuits may be connected in parallel and then connected in series with a single circuit to form a circuit, when one of the plurality of circuits connected in parallel is broken, the resistance value of the whole circuit will not increase, but will not increase more, so in order to detect that the circuit of the certain circuit or the plurality of circuits in the parallel is broken, the resistance value of the parallel channel of the whole circuit needs to be calculated according to the specific circuit structure of the parallel circuit, when the circuit of the certain circuit and the plurality of circuits in the parallel are broken, and then the first control resistance value of the film material is determined according to the maximum value, the average value, the minimum value and the parallel channel resistance value in the first sample resistance value.
For example, in the line structure of the film material shown in fig. 1, one end of one silver paste line in each line is connected in parallel with one end of three ITO lines, if the average value of the first sample resistance values of the lines is 20kΩ, when the silver paste line is broken, the resistance value of the whole line is overloaded (infinite); when one ITO line is broken, the resistance value of the whole line is 30k omega; when two ITO lines are disconnected, the resistance value of the whole line is 60k omega; when three ITO lines are disconnected, the resistance value of the whole line is overload (infinite); that is, as long as the resistance value in the line is greater than 30kΩ, it is indicated that the line has an open circuit condition, so the first control resistance value may be set between 20kΩ and 30kΩ, so that even when one ITO line is open circuit, it may be determined whether the line has an open circuit condition by detecting a voltage change corresponding to the resistance value of the line, for example, a determined resistance value may be selected between 20kΩ and 30kΩ as the first control resistance value (for example, 25kΩ).
S302, obtaining a first reference resistance value of a reference resistance of the film material according to the first control resistance value, wherein the first reference resistance value and the first control resistance value are in the same order of magnitude.
In order to ensure that the voltages at the two ends of the reference resistor are relatively close to the voltages at the two ends of the line to be tested so as to ensure the precision of the open-circuit reference voltage, the magnitude of the first control resistance can be obtained after the first control resistance is obtained, a determined resistance is selected as the first reference resistance of the reference resistor in the magnitude, the magnitude of the resistance can be any one of omega, kΩ,10 kΩ, 100kΩ and mΩ, and the magnitude of the resistance is not limited by the embodiment of the application. For example, since the first control resistance value is 25kΩ, the first reference resistance value may be set to 10kΩ.
S303, obtaining the open circuit reference voltage at two ends of the reference resistor of the circuit in the film material under the normal state according to the first control resistance, the first reference resistance and the first input voltage between the circuit to be detected and the reference resistor in the film material.
In the circuit structure diagram of the film material in fig. 1, since the circuit to be detected and the reference resistor are connected between the external input voltage and the ground terminal, the external input voltage may be known, for example, the first input voltage may be 5V, the open reference voltage may be VREF according to the relationship between the resistor and the voltage, and the first input voltage VIN, the first control resistance RX, and the first reference resistance R obtained in the above embodiment may be VREF＝VIN*(R/(RX +r), for example, when VIN＝5V,RX =25kΩ and r=10kΩ are obtained, VREF =1.43v.
S304, a first resistance control signal is sent to the reference resistance selection module, and the first resistance control signal is used for indicating the reference resistance selection module to control the reference resistance to be set to a first reference resistance value.
Optionally, the reference resistor selection module may be a control circuit formed by an electronic component or a chip, and may receive the resistor control signal to set the resistance value of the reference resistor at will, so when abnormality detection of the line in the film material is actually performed, the first resistor control signal may be sent to the reference resistor selection module, so that the reference resistor selection module sets the resistance value of the reference resistor to be the first reference resistance value according to the data acquired in advance.
S305, a first to-be-detected selection signal is sent to the to-be-detected resistor selection module, the first to-be-detected selection signal is used for indicating the to-be-detected resistor selection module to select any one line in the film material as a target line, the target line is connected with the reference resistor, and meanwhile, a first input voltage is added to two ends of the connected target line and reference resistor.
Optionally, the resistor selection module to be tested may also be a control circuit formed by electronic components or chips, and may receive the control signal to select any one of the lines to be tested in the film material as a target line to be connected to the resistor selection module to be tested, so that the target line is connected to the reference resistor, and the first input voltage is applied to two ends of the connected target line and reference resistor. Specifically, the voltage output end of the external input voltage is connected with one end of a line to be detected, the other end of the line to be detected is connected with one end of a reference resistor, and the other end of the reference resistor is connected with a grounding end.
For example, in the circuit structure in fig. 1, the to-be-detected resistor selection module may sequentially connect CH1 and CH1 'between the voltage output end of the first input voltage and the reference resistor according to the first to-be-detected selection signal, and connect CHn and CHn' between the voltage output end of the first input voltage and the reference resistor.
S306, collecting first output voltages at two ends of a reference resistor connected with a target line in the film material.
And acquiring the voltage of the connection point between the other end of the line to be detected and one end of the reference resistor, so as to obtain first output voltages at two ends of the reference resistor connected with the line to be detected, wherein the first output voltages are the voltages at two ends of the reference resistor.
S307, comparing the first output voltage with the open circuit reference voltage.
When the open circuit abnormality detection is required, since the open circuit reference voltage at both ends of the reference resistor in the normal state of the line in the film material has been obtained, and the first output voltage at both ends of the reference resistor connected to any one of the line marking lines in the film material has been obtained, it is known from the above analysis that when the line in the film material is open, the resistance value of the line in which the open circuit occurs increases with respect to the resistance value of the line in the normal state, and since the first output voltage can be regarded as the voltage at both ends of the reference resistor, when the open circuit is connected in series with the reference resistor, the resistance of the open circuit increases, the voltage distributed on the reference resistor decreases, and therefore the open circuit reference voltage and the first output voltage can be input into the above-described device for detecting the open circuit abnormality in the film material for voltage comparison.
And S308, when the first output voltage is smaller than the disconnection reference voltage, the first output voltage and the disconnection reference voltage meet a first preset condition, and the target line corresponding to the first output voltage is determined to be in a disconnection state.
When a circuit break occurs in the circuit to be detected in the film material, the actual resistance RX 'in the circuit to be detected is increased, that is, RX' is greater than the first control resistance RX, so that the voltage VR distributed on the reference resistance is reduced, that is, VR is less than the circuit break reference voltage VREF (1.43V), and at this time, it can be determined that the circuit corresponding to the first output voltage is in the circuit break state.
That is, if the first output voltage and the open reference voltage satisfy a first preset condition, the first preset condition is a relationship between the open reference voltage and the first output voltage, and the first preset condition may be that the first output voltage is smaller than the open reference voltage, then it is determined that the line corresponding to the first output voltage is in an open state. If the first output voltage and the open circuit reference voltage do not meet the first preset condition, determining that the circuit corresponding to the first output voltage is in a normal state.
In the embodiment of the application, when whether the circuit in the film material has a circuit breaking condition or not is detected, the sample resistance of the circuit breaking sample film material can be acquired, the control resistance and the resistance of the reference resistor are obtained according to the sample resistance, and the circuit breaking reference voltage is finally obtained, so that the first output voltages at the two ends of the reference resistor connected with the target circuit in the film material are only acquired, whether the circuit breaking condition exists in the film material can be determined according to the relation between the circuit breaking reference voltage and the first output voltages, the detection efficiency and the detection accuracy are effectively improved, the detection device has a simple structure, expensive precision detection equipment is not needed, and the circuit detection cost can be reduced.
Referring to fig. 4, fig. 4 is a flow chart of a method for detecting a circuit abnormality in a film material according to a third embodiment of the present application.
As shown in fig. 4, the embodiment of the present application mainly aims at detecting short-circuit abnormality in a film material, and the method includes:
S401, acquiring a second sample resistance value of a circuit in the film material corresponding to the short-circuit sample film material, and obtaining a second control resistance value of the film material according to the second sample resistance value.
It can be understood that before a batch of film materials to be detected is detected, one or more qualified film materials with the same specification as the film materials to be detected can be obtained in advance as sample film materials, and the sample film materials can ensure that the circuit inside the sample film materials is not in a short circuit condition, namely the circuit in the sample film materials is in a normal state. The resistances of any two lines in the sample film material are measured by a relative circuit or technique, and the obtained resistance data is used as a second sample resistance value of the lines in the sample film material, wherein the second sample resistance value can comprise a plurality of data. And determining a second control resistance value of the film material according to the maximum value, the average value and the minimum value in the second sample resistance value.
S402, obtaining a second reference resistance value of the reference resistance of the film material according to the second control resistance value, wherein the second reference resistance value and the second control resistance value are in the same order of magnitude.
In order to ensure that the voltage at two ends of the reference resistor is relatively close to the voltage at two ends of the line to be tested so as to ensure the precision of the open-circuit reference voltage, the order of magnitude of the second control resistance can be obtained after the second control resistance is obtained, a determined resistance is selected as the second reference resistance of the reference resistor in the order of magnitude, and the order of magnitude of resistance can be any one of omega, kΩ, 10kΩ, 100kΩ and mΩ, and the embodiment of the application does not limit the order of magnitude of resistance
S403, obtaining the short circuit reference voltage at two ends of the reference resistor of the circuit in the film material under the normal state according to the second control resistance, the second reference resistance and the second input voltage between the circuit to be detected and the reference resistor in the film material.
Similar to the above-mentioned open reference voltage, the short reference voltage corresponding to the circuit in the film material can be obtained by the same or similar method, and will not be described here.
S404, a second resistance control signal is sent to the reference resistance selection module, and the second resistance control signal is used for indicating the reference resistance selection module to control the reference resistance to be set to a second reference resistance value.
Optionally, the reference resistor selection module may be a control circuit formed by an electronic component or a chip, and may receive the control signal to set the resistance value of the reference resistor at will, so when abnormality detection of the line in the film material is actually performed, a second resistor control signal may be sent to the reference resistor selection module, so that the reference resistor selection module sets the resistance value of the reference resistor to a second reference resistance value according to the data acquired in advance.
S405, sending a second to-be-detected selection signal to the to-be-detected resistor selection module, wherein the second to-be-detected selection signal is used for indicating the to-be-detected resistor selection module to select any two lines in the film material as target lines, connecting the target lines with the reference resistor, and simultaneously adding a second input voltage to two ends of the target lines after the target lines are connected with the reference resistor.
Optionally, the resistor selection module to be tested may also be a control circuit formed by electronic components or chips, and may receive the control signal to select any two lines to be tested in the film material as a target line, and connect the target line to the resistor selection module to be tested, so that the target line is connected with the reference resistor, and meanwhile, the second input voltage is applied to two ends of the target line after the target line is connected with the reference resistor. Specifically, the voltage output end of the external input voltage is connected with one end of a line to be detected, the other end of the line to be detected is connected with one end of a reference resistor, and the other end of the reference resistor is connected with a grounding end.
For example, in the circuit structure in fig. 1, the to-be-detected resistor selection module may sequentially connect, according to the second to-be-detected selection signal, the adjacent circuit most prone to occurrence of a short circuit abnormality between the voltage output end of the second input voltage and the reference resistor, that is, sequentially connect CH1 and CH2 between the second input voltage and the reference resistor, and connect CHn-1 and CHn between the voltage output end of the second input voltage and the reference resistor.
S406, collecting second output voltages at two ends of a reference resistor connected with a target line in the film material.
And acquiring the voltage of the connection point between the other end of the target line and one end of the reference resistor, so as to obtain second output voltages at two ends of the reference resistor connected with the target line, wherein the second output voltages are the voltages at two ends of the reference resistor.
S407, comparing the second output voltage with the short reference voltage.
When the short-circuit abnormality detection is required, since the short-circuit reference voltage at both ends of the reference resistor in the normal state of the line in the film material has been obtained, and the second output voltage at both ends of the reference resistor connected to any two of the line lines in the film material has been collected, it is known from the above analysis that when the line in the film material has a short circuit, the resistance value of the line in which the short circuit occurs is reduced with respect to the resistance value of the line in the normal state, and since the second output voltage can be regarded as the voltage at both ends of the reference resistor, when the short-circuited line is connected in series with the reference resistor, the resistance of the short-circuited line is reduced greatly, the voltage distributed on the reference resistor is increased, and therefore the short-circuit reference voltage and the second output voltage can be input to the line abnormality detection device in the film material for voltage comparison.
And S408, when the second output voltage is larger than the short circuit reference voltage, the second output voltage and the short circuit reference voltage meet a second preset condition, and two target lines corresponding to the second output voltage are determined to be in a short circuit state.
When a short circuit occurs in the circuit to be detected in the film material, the actual resistance in the circuit to be detected is reduced, that is, the actual resistance is smaller than the second control resistance, so that the voltage distributed on the reference resistance is increased, that is, the voltage distributed on the reference resistance is smaller than the open circuit reference voltage, and at the moment, the circuit corresponding to the second output voltage can be determined to be in a short circuit state.
That is, if the second output voltage and the short circuit reference voltage satisfy a second preset condition, the second preset condition is a relationship between the short circuit reference voltage and the second output voltage, and the second preset condition is that the second output voltage is greater than the short circuit reference voltage, it is determined that the line corresponding to the second output voltage is in a short circuit state. If the second output voltage and the short circuit reference voltage do not meet the second preset condition, determining that the circuit corresponding to the second output voltage is in a normal state.
Optionally, in the above embodiment, if the abnormal state of the line in the film material is detected, the abnormal state includes an open state and a short state, and a prompt message may be sent, so as to remind related personnel to record or process the abnormal line in the film material in time. Further, if the target output voltage and the reference voltage do not meet the preset conditions, the target line is determined to be in a normal state. No processing may be done.
In the embodiment of the application, when the short circuit condition exists in the circuit in the film material, the sample resistance of the short circuit sample film material can be acquired, the control resistance and the resistance of the reference resistor are obtained according to the sample resistance, and finally the short circuit reference voltage is obtained, so that the second output voltages at the two ends of the reference resistor connected with any two circuits in the film material are acquired, the existence of the short circuit condition in the film material can be determined according to the relation between the short circuit reference voltage and the second output voltages, the detection efficiency and the detection accuracy are effectively improved, the detection device has a simple structure, expensive precision detection equipment is not needed, and the circuit detection cost can be reduced.
The following are examples of the apparatus of the present application that may be used to perform the method embodiments of the present application. For details not disclosed in the embodiments of the apparatus of the present application, please refer to the embodiments of the method of the present application.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a device for detecting circuit abnormality in a film material according to a fourth embodiment of the present application.
As shown in fig. 5, the line abnormality detection device 500 in a film material includes:
The reference resistor selection module 510 is connected to the reference resistor, and is used for controlling the reference resistor to be set to a reference resistance value according to the resistor control signal.
The resistor to be detected selecting module 520 is connected with a circuit to be detected in the film material, and is used for selecting a target circuit in the film material to be connected with the reference resistor according to a selecting signal to be detected, and simultaneously, an input voltage is applied to two ends of the target circuit after the target circuit is connected with the reference resistor;
the reference voltage module 530 is configured to output a reference voltage corresponding to a line in the film material in a normal state.
The processor module 540 is respectively connected with the reference resistor selection module, the resistor selection module to be tested and the reference voltage module, and is used for acquiring the reference voltages at two ends of the reference resistor of the circuit in the film material in a normal state and acquiring the target output voltages at two ends of the reference resistor connected with the target circuit in the film material.
The processor module 540 is further configured to determine that the target line is in an abnormal state if the target output voltage and the reference voltage meet a preset condition; wherein the abnormal state is an open state or a short state.
The specific functions and implementations of the reference resistor selection module 510, the resistor to be measured selection module 520, the reference voltage module 530, and the processor module 540 may be referred to the specific descriptions in the above embodiments, and will not be repeated here.
Referring to fig. 6, fig. 6 is a schematic circuit diagram of a device for detecting a circuit abnormality in a film material according to a fifth embodiment of the present application.
Alternatively, the processor module 540 may include a voltage comparator 541 and a micro control unit 542, and the reference voltage module 530 may be an analog-to-digital converter.
As shown in fig. 6, one end of the reference resistor selection module 510 controlling the reference resistor is connected to the Ground (GND), the other end of the reference resistor is connected to the first input end of the voltage comparator 541 in the processor module, one end of the line to be tested in the film material is controlled by the resistor selection module 520 to be tested to be connected to the input voltage, the other end of the line to be tested in the film material is connected to the first input end of the voltage comparator 541 in the processor module, the output end of the reference voltage module 530 is connected to the second input end of the voltage comparator 541 in the processor module, the output end of the voltage comparator 541 is connected to the input end of the micro control unit 542, and the output end of the micro control unit 542 outputs the detection result. The voltage comparator 541 and the micro control unit 542 cooperate to implement the steps in the method embodiments described above. The reference resistance selection module 510, the resistance to be measured selection module 520, and the reference voltage module 530 may also receive the control command of the processor module 540 to perform the related operation.
Embodiments of the present application also provide a computer storage medium storing a plurality of instructions adapted to be loaded by a processor and to perform the steps of the method of any of the above embodiments.
Further, referring to fig. 7, fig. 7 is a schematic structural diagram of a terminal according to a sixth embodiment of the present application. As shown in fig. 7, the terminal 700 may include: at least one processor 701, at least one network interface 704, a user interface 703, a memory 705, at least one communication bus 702.
Wherein the communication bus 702 is used to enable connected communications between these components.
The user interface 703 may include a Display screen (Display), a Camera (Camera), and the optional user interface 703 may further include a standard wired interface, and a wireless interface.
The network interface 704 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface), among others.
Wherein the processor 701 may include one or more processing cores. The processor 701 connects various parts within the overall terminal 700 using various interfaces and lines, performs various functions of the terminal 700 and processes data by executing or executing instructions, programs, code sets, or instruction sets stored in the memory 705, and invoking data stored in the memory 705. Alternatively, the processor 701 may be implemented in at least one hardware form of digital signal Processing (DIGITAL SIGNAL Processing, DSP), field-Programmable gate array (Field-Programmable GATE ARRAY, FPGA), programmable logic array (Programmable Logic Array, PLA). The processor 701 may integrate one or a combination of several of a central processing unit (Central Processing Unit, CPU), an image processor (Graphics Processing Unit, GPU), a modem, etc. The CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for rendering and drawing the content required to be displayed by the display screen; the modem is used to handle wireless communications. It will be appreciated that the modem may not be integrated into the processor 701 and may be implemented by a single chip.
The Memory 705 may include a random access Memory (Random Access Memory, RAM) or a Read-Only Memory (Read-Only Memory). Optionally, the memory 705 includes a non-transitory computer readable medium (non-transitory computer-readable storage medium). Memory 705 may be used to store instructions, programs, code, sets of codes, or instruction sets. The memory 705 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing the various method embodiments described above, etc.; the storage data area may store data or the like referred to in the above respective method embodiments. The memory 705 may also optionally be at least one storage device located remotely from the processor 701. As shown in fig. 7, an operating system, a network communication module, a user interface module, and a line abnormality detection program in a film material may be included in a memory 705 as one type of computer storage medium.
In the terminal 700 shown in fig. 7, the user interface 703 is mainly used for providing an input interface for a user, and acquiring data input by the user; and the processor 701 may be configured to call a line abnormality detection program stored in the memory 705 and specifically perform the following operations:
Acquiring reference voltages at two ends of a reference resistor of a circuit in the film material in a normal state, and acquiring target output voltages at two ends of the reference resistor connected with a target circuit in the film material;
If the target output voltage and the reference voltage meet the preset conditions, determining that the target line is in an abnormal state;
wherein the abnormal state is an open state or a short state.
When the abnormal state is the open state, the processor 701 is further configured to perform:
acquiring open-circuit reference voltages at two ends of a reference resistor of a line in the film material in a normal state, and acquiring first output voltages at two ends of the reference resistor connected with any one marking line in the film material;
If the first output voltage and the disconnection reference voltage meet a first preset condition, determining that a target line corresponding to the first output voltage is in a disconnection state.
When the abnormal state is a short-circuit state, the processor 701 is further configured to perform:
acquiring short circuit reference voltages at two ends of a reference resistor of a line in the film material in a normal state, and acquiring second output voltages at two ends of the reference resistor connected with any two marking lines in the film material;
And if the second output voltage and the short circuit reference voltage meet a second preset condition, determining that two target lines corresponding to the second output voltage are in a short circuit state.
In one embodiment, the processor 701, when executing the acquisition of the open reference voltage across the reference resistor of the line in the film material in the normal state, further specifically executes the following steps:
Collecting a first sample resistance value of a circuit in the film material corresponding to the open-circuit sample film material, and obtaining a first control resistance value of the film material according to the first sample resistance value;
Obtaining a first reference resistance value of a reference resistance of the film material according to the first control resistance value, wherein the first reference resistance value and the first control resistance value are in the same order of magnitude;
And obtaining the open-circuit reference voltage at two ends of the reference resistor of the circuit in the film material under the normal state according to the first control resistance, the first reference resistance and the first input voltage between the circuit to be detected and the reference resistor in the film material.
In one embodiment, the processor 701, when executing the acquisition of the first output voltage across the reference resistor connected to any one of the reticle lines in the film material, further specifically executes the following steps:
transmitting a first resistance control signal to the reference resistance selection module, wherein the first resistance control signal is used for indicating the reference resistance selection module to control the reference resistance to be set to a first reference resistance value;
The method comprises the steps of sending a first to-be-detected selection signal to a to-be-detected resistor selection module, wherein the first to-be-detected selection signal is used for indicating the to-be-detected resistor selection module to select any one line in a film material as a target line, connecting the target line with a reference resistor, and simultaneously adding a first input voltage to two ends of the connected target line and reference resistor;
First output voltages are collected across a reference resistor connected to a target line in the film material.
In one embodiment, when the processor 701 determines that the target line corresponding to the first output voltage is in the off state if the first output voltage and the off reference voltage meet the first preset condition, the following steps are further specifically executed:
Comparing the first output voltage with an open circuit reference voltage;
when the first output voltage is smaller than the disconnection reference voltage, the first output voltage and the disconnection reference voltage meet a first preset condition, and the target line corresponding to the first output voltage is determined to be in a disconnection state.
In one embodiment, the processor 701 further specifically performs the following steps when performing the acquisition of the short reference voltage across the reference resistor of the line in the film material in the normal state:
collecting a second sample resistance value of a circuit in the film material corresponding to the short-circuit sample film material, and obtaining a second control resistance value of the film material according to the second sample resistance value;
Obtaining a second reference resistance value of the reference resistance of the film material according to the second control resistance value, wherein the second reference resistance value and the second control resistance value are in the same order of magnitude;
And obtaining the short circuit reference voltage at two ends of the reference resistor of the circuit in the film material under the normal state according to the second control resistance, the second reference resistance and the second input voltage between the circuit to be detected and the reference resistor in the film material.
In one embodiment, the processor 701, when executing the acquisition of the second output voltage across the reference resistor connected to any two reticle lines in the film material, further specifically executes the following steps:
Transmitting a second resistance control signal to the reference resistance selection module, wherein the second resistance control signal is used for indicating the reference resistance selection module to control the reference resistance to be set to a second reference resistance value;
sending a second to-be-detected selection signal to the to-be-detected resistor selection module, wherein the second to-be-detected selection signal is used for indicating the to-be-detected resistor selection module to select any two lines in the film material as target lines, connecting the target lines with the reference resistor, and simultaneously adding a second input voltage to two ends of the target lines after the connection with the reference resistor;
And collecting second output voltages at two ends of a reference resistor connected with a target line in the film material.
In one embodiment, when the processor 701 determines that the two target lines corresponding to the second output voltage are in a short circuit state if the second output voltage and the short circuit reference voltage meet the second preset condition, the following steps are further specifically executed:
Comparing the second output voltage with a short reference voltage;
When the second output voltage is larger than the short circuit reference voltage, the second output voltage and the short circuit reference voltage meet a second preset condition, and two target lines corresponding to the second output voltage are determined to be in a short circuit state.
In one embodiment, the processor 701 is further configured to perform: and sending out prompt information when detecting that the circuit in the film material is in an abnormal state.
In one embodiment, the processor 701 is further configured to perform: if the target output voltage and the reference voltage do not meet the preset conditions, the target line is determined to be in a normal state.
In the several embodiments provided by the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of modules is merely a logical function division, and there may be additional divisions of actual implementation, e.g., multiple modules or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or modules, which may be in electrical, mechanical, or other forms.
The modules illustrated as separate components may or may not be physically separate, and components shown as modules may or may not be physical modules, i.e., may be located in one place, or may be distributed over a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional module in each embodiment of the present application may be integrated into one processing module, or each module may exist alone physically, or two or more modules may be integrated into one module. The integrated modules may be implemented in hardware or in software functional modules.
The integrated modules, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be embodied in essence or a part contributing to the prior art or all or part of the technical solution in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of the embodiments of the present application. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a Read-only memory (ROM), a random access memory (RAM, randomAccessMemory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
It should be noted that, for the sake of simplicity of description, the foregoing method embodiments are all expressed as a series of combinations of actions, but it should be understood by those skilled in the art that the present application is not limited by the order of actions described, as some steps may be performed in other order or simultaneously in accordance with the present application. Further, those skilled in the art will appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily all required for the present application.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments.
The foregoing describes a method, apparatus, storage medium and terminal for detecting line anomalies in a film material, which are provided by the present application, and the present disclosure should not be construed as limiting the application to all aspects of the detailed description and the application range according to the concepts of the embodiments of the present application.