CN113363188A - Wafer carrying table and wafer transmission device - Google Patents
Wafer carrying table and wafer transmission deviceDownload PDFInfo
- Publication number
- CN113363188A CN113363188ACN202110628938.8ACN202110628938ACN113363188ACN 113363188 ACN113363188 ACN 113363188ACN 202110628938 ACN202110628938 ACN 202110628938ACN 113363188 ACN113363188 ACN 113363188A
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- wafer
- hole
- buffer pad
- clean
- source
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- 230000005540biological transmissionEffects0.000titleabstractdescription11
- XLYOFNOQVPJJNP-UHFFFAOYSA-NwaterSubstancesOXLYOFNOQVPJJNP-UHFFFAOYSA-N0.000claimsabstractdescription64
- 238000005498polishingMethods0.000claimsabstractdescription20
- 239000007789gasSubstances0.000claimsdescription10
- 239000011159matrix materialSubstances0.000claimsdescription8
- 239000008367deionised waterSubstances0.000claimsdescription3
- 229910021641deionized waterInorganic materials0.000claimsdescription3
- 239000011261inert gasSubstances0.000claimsdescription3
- 230000000694effectsEffects0.000abstractdescription11
- 238000000034methodMethods0.000abstractdescription10
- 239000000126substanceSubstances0.000abstractdescription5
- 229910052755nonmetalInorganic materials0.000description4
- 239000007788liquidSubstances0.000description3
- 238000004519manufacturing processMethods0.000description3
- 125000006850spacer groupChemical group0.000description3
- 238000003486chemical etchingMethods0.000description2
- 238000004140cleaningMethods0.000description2
- 238000012986modificationMethods0.000description2
- 230000004048modificationEffects0.000description2
- 239000004065semiconductorSubstances0.000description2
- 238000005406washingMethods0.000description2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-NSiliconChemical compound[Si]XUIMIQQOPSSXEZ-UHFFFAOYSA-N0.000description1
- 239000004020conductorSubstances0.000description1
- 230000007797corrosionEffects0.000description1
- 238000005260corrosionMethods0.000description1
- 230000007547defectEffects0.000description1
- 230000008021depositionEffects0.000description1
- 238000005137deposition processMethods0.000description1
- 238000010586diagramMethods0.000description1
- 238000000227grindingMethods0.000description1
- 239000012212insulatorSubstances0.000description1
- 229910052710siliconInorganic materials0.000description1
- 239000010703siliconSubstances0.000description1
- 238000001179sorption measurementMethods0.000description1
- 239000000758substrateSubstances0.000description1
- 230000002195synergetic effectEffects0.000description1
- 229940095676wafer productDrugs0.000description1
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Classifications
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing equipment, in particular to a wafer carrying table and a wafer transmission device.
Background
Integrated circuit fabrication processes generally refer to the deposition of conductor, semiconductor, and insulator layers on a particular substrate (e.g., a silicon-based wafer) in a process sequence. In the manufacturing process, a Chemical Mechanical Planarization (CMP) technique is mainly used to perform global Planarization on a microscopically rough surface of a wafer after a film deposition process, so as to perform a subsequent semiconductor process. CMP utilizes the synergistic effects of chemical etching and mechanical grinding to effectively compromise local and global planarity of a wafer and has been widely used in the manufacture of very large scale integrated circuits.
In the CMP technology, after chemical etching, a wafer needs to be mechanically ground, and during the movement of the wafer, a loading and unloading platform needs to be used to move the wafer to the position of a polishing head. The loading platform is provided with a wafer carrying platform, the wafer after chemical corrosion is placed on the wafer carrying platform, the loading platform is controlled by electrical and pneumatic equipment and moves to the position below the polishing head, then the loading platform rises and contacts the polishing head to complete centering of the polishing head and the loading platform, the wafer carrying platform rises to complete contact of the wafer and the polishing head, and the polishing head is enabled to complete grabbing of the wafer.
Wherein, for the protection wafer, prevent that the wafer from taking place wearing and tearing, can be provided with nonmetal buffer spacer on the slide holder usually, and the wafer can carry some remaining slope liquid usually after the chemical attack, remaining washing liquid is when existing between wafer and nonmetal buffer spacer, can form the water film effect, under the water film effect, have certain adhesion between wafer and the nonmetal buffer spacer, lead to forming certain adsorption to the wafer, when carrying out wafer transmission, probably can make the wafer take place deformation or slip and shift, produce the influence to the wafer product.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that the wafer transmission process is affected due to the water film effect formed by the residual cleaning liquid between the wafer and the nonmetal buffer pad, thereby providing a wafer stage and a wafer transmission device.
In order to solve the above technical problem, the present invention provides a wafer stage, comprising:
the wafer polishing device comprises a table body, a polishing head and a polishing head, wherein the table body is provided with a groove for accommodating a wafer;
a buffer pad mounted at the bottom of the groove, wherein the wafer is placed on the buffer pad;
at least one through hole is formed in the buffer pad and is suitable for being connected with a clean water source or a clean air source through a pipeline.
Optionally, the through holes are uniformly arranged on the buffer pad.
Optionally, the through holes are arranged into a plurality of through hole matrixes, a plurality of through holes are arranged on the through hole matrixes, each through hole matrix is linearly arranged, and the through hole matrixes are arranged at equal included angles.
Optionally, the cushion pad is in a circular shape, each group of through hole matrixes extend along the radius direction of the cushion pad, and the adjacent two groups of through hole matrixes are arranged at equal central angles.
Optionally, the pipeline has a plurality of through holes, and the through holes correspond to each group of the through hole matrix.
Optionally, the system further comprises a water separator, wherein the water separator is provided with an inlet and a plurality of outlets, and the inlet is communicated with the clean water source or the clean air source;
the outlets are communicated with the pipelines in a one-to-one correspondence mode.
Optionally, the clean water source is deionized water, and the clean gas source is an inert gas.
Still provide wafer transmission device, including above-mentioned wafer slide holder, still include:
the loading and unloading platform is internally provided with an accommodating cavity; the wafer carrying table is arranged in the accommodating cavity.
Optionally, the wafer stage further comprises a lifting device, which is arranged in the accommodating cavity and is adapted to drive the wafer stage to lift.
The technical scheme of the invention has the following advantages:
1. the wafer slide holder provided by the invention has the advantages that the holder body is provided with the groove for accommodating the wafer, the bottom of the groove is provided with the buffer pad, the wafer is placed on the buffer pad, the buffer pad is provided with at least one through hole, and the through hole is connected with a clean water source or a clean air source. In the wafer transferring process, the polishing head needs to adsorb and take away the wafer, when the polishing head adsorbs the wafer, a clean water source or a clean air source is opened, the space between the wafer and the buffer pad is washed or blown, so that the wafer is separated from the buffer pad, the water film effect between the wafer and the buffer pad is eliminated, the wafer can be stably transmitted, the phenomenon that the wafer is mistakenly loaded and unloaded in the loading and unloading process due to the water viscosity generated by the water film effect is avoided, and the wafer loading and unloading success rate is improved.
2. According to the wafer stage provided by the invention, the through holes are uniformly arranged on the buffer cushion and are arranged into a plurality of through hole matrixes, so that clean water or clean gas can be quickly filled between the wafer and the buffer cushion and the wafer can be quickly separated from the water film effect.
3. According to the wafer slide holder provided by the invention, water supply or gas supply of a plurality of groups of through hole matrixes can be realized by using only one water inlet pipe through the water separator, the number of water inlet pipelines is reduced, and the complexity of pipelines under the wafer slide holder is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer stage according to the present invention;
FIG. 2 is a cross-sectional view of a wafer stage according to the present invention;
fig. 3 is a schematic structural view of the water separator.
Description of reference numerals:
1. a table body; 2. a cushion pad; 3. a through hole; 4. a wafer; 5. a water separator; 6. a loading and unloading platform.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
The embodiment provides a specific implementation manner of a wafer slide holder, as shown in fig. 1 and fig. 2, atable body 1 is provided with a groove for accommodating awafer 4, acushion pad 2 is installed at the bottom of the groove, thewafer 4 is placed on thecushion pad 2, at least one throughhole 3 is formed in thecushion pad 2, and the throughhole 3 is connected with a clean water source or a clean air source. In this embodiment, thethrough hole 3 is connected to a clean water source. In-process is transferred atwafer 4, the burnishing head needadsorb wafer 4 and take away, when the burnishing head adsorbswafer 4, open clean water source, clean water passes through the pipeline and discharges from through-hole 3, to the washing betweenwafer 4 and thebuffer pad 2, makewafer 4 break away frombuffer pad 2, eliminate the water film effect betweenwafer 4 and thebuffer pad 2, guarantee that wafer 4 can the steady transmission, avoid making mistake appear in the loading and unloading process because of the water viscidity that the water film effect producedwafer 4, improvewafer 4 and load and unload and carry the success rate.
Specifically, the clean water source may be deionized water or a cleaning solution that does not chemically react with thewafer 4; the gas in the clean gas source is inert gas which is difficult to chemically react with thewafer 4, so that the quality of thewafer 4 is ensured.
In this embodiment, the throughholes 3 are uniformly arranged on thecushion pad 2 and are arranged in a plurality of through hole matrixes, so that thewafer 4 and thecushion pad 2 can be quickly filled with clean water and quickly separated from the water film effect. The through hole matrixes can be arranged in shapes of rectangle, triangle, polygon and the like, each group of through hole matrixes are linearly arranged, and included angles between two adjacent groups of through hole matrixes are the same in size.
Specifically,blotter 2 is circular setting, and every group through-hole matrix extends alongblotter 2's direction of radius, and the size of the central angle between two sets of adjacent through-hole matrices is the same. Wherein, the through hole matrix is radially arranged by taking the circle center of thecushion pad 2 as an origin.
In this embodiment, be equipped with three through-hole matrixes of three groups, every through-hole matrix of group is equipped with three through-hole 3, and three through-hole 3 is linear setting, and three through-hole 3 all sets up on the same radius ofblotter 2, and the central angle between every two sets of through-hole matrixes is 120 degrees.
As shown in fig. 3, the water separator 5 provided in this embodiment has one water inlet and three water outlets, the water separator 5 is disposed under thestage body 1, and the water inlet of the water separator 5 is connected to a clean water source. The bottom of thetable body 1 is provided with a pipeline matched with the matrix shape of the through hole, the pipeline is provided with an opening communicated with the throughhole 3, and the water inlet end of the pipeline is communicated with the water outlets on the water segregator 5 in a one-to-one correspondence manner. The water distributor 5 can realize water supply or air supply of a plurality of groups of through hole matrixes by using only one water inlet pipe, so that the number of water inlet pipelines is reduced, and the complicated pipeline arrangement under the wafer slide holder is avoided.
Specifically, the water separator 5 may be used as a gas separator. The clean water source can be a water tank or a water tank filled with clean water; the clean gas source may be a compressed gas tank containing clean gas.
Example 2
The embodiment provides a specific implementation manner of a wafer transmission device, as shown in fig. 1 and fig. 2, the wafer transmission device includes a loading andunloading platform 6, a containing cavity for containing a wafer carrying platform is arranged in the loading andunloading platform 6, a lifting device is installed in the containing cavity of the loading andunloading platform 6, a driving end of the lifting device is connected with a bottom end of aplatform body 1 of the wafer carrying platform, and the height of the wafer carrying platform can be adjusted through the lifting device, so that the position of awafer 4 is convenient for a polishing head to grasp the wafer in jinxin.
Specifically, the lifting device may employ an air cylinder.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (9)
1. A wafer stage, comprising:
the wafer polishing device comprises a table body (1), wherein a groove for accommodating a wafer (4) is formed in the table body (1);
the buffer pad (2) is arranged at the bottom of the groove, and the wafer (4) is placed on the buffer pad (2);
the buffer pad (2) is provided with at least one through hole (3), and the through hole (3) is suitable for being connected with a clean water source or a clean air source through a pipeline.
2. Wafer carrier table according to claim 1, characterized in that the through-hole (3) has a plurality of evenly arranged holes on the cushion pad (2).
3. The wafer stage of claim 2, wherein the through holes (3) are arranged in a plurality of through hole matrixes, the through hole matrixes are provided with a plurality of through holes (3), each group of through hole matrixes are arranged linearly, and two adjacent groups of through hole matrixes are arranged at equal included angles.
4. The wafer stage of claim 3, wherein the cushion pad (2) is circular, each set of the through-hole matrix extends along a radius direction of the cushion pad (2), and the through-hole matrices of adjacent sets are arranged at equal central angles.
5. Wafer carrier as claimed in claim 4, characterized in that the conduits have a plurality of channels and are arranged in correspondence of the through holes (3) of each set of the matrix of through holes.
6. The wafer stage of claim 5, further comprising a water separator (5), wherein the water separator (5) has an inlet and a plurality of outlets, and the inlet is in communication with the clean water source or the clean air source;
the outlets are communicated with the pipelines in a one-to-one correspondence mode.
7. The wafer stage of any of claims 1-6, wherein the source of clean water is deionized water and the source of clean gas is an inert gas.
8. Wafer transfer apparatus comprising the wafer stage of any of claims 1-7, further comprising:
the loading and unloading platform (6) is internally provided with an accommodating cavity; the wafer carrying table is arranged in the accommodating cavity.
9. The wafer conveying device according to claim 8, further comprising a lifting device disposed in the accommodating chamber and adapted to drive the wafer stage to lift.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110628938.8ACN113363188A (en) | 2021-06-04 | 2021-06-04 | Wafer carrying table and wafer transmission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110628938.8ACN113363188A (en) | 2021-06-04 | 2021-06-04 | Wafer carrying table and wafer transmission device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113363188Atrue CN113363188A (en) | 2021-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110628938.8APendingCN113363188A (en) | 2021-06-04 | 2021-06-04 | Wafer carrying table and wafer transmission device |
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| Country | Link |
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| CN (1) | CN113363188A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116564854A (en)* | 2023-05-16 | 2023-08-08 | 弥费科技(上海)股份有限公司 | Cleaning equipment, air tap device, air channel device and control method thereof |
| WO2024234396A1 (en)* | 2023-05-16 | 2024-11-21 | 弥费科技(上海)股份有限公司 | Cleaning apparatus, and gas nozzle device, gas path device, control method, interface circuit, and control system thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102371535A (en)* | 2010-08-11 | 2012-03-14 | 中国电子科技集团公司第四十五研究所 | Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment |
| US20130309874A1 (en)* | 2012-05-15 | 2013-11-21 | Lam Research Ag | Method and apparatus for liquid treatment of wafer-shaped articles |
| CN109037109A (en)* | 2018-08-03 | 2018-12-18 | 德淮半导体有限公司 | A kind of method of semiconductor equipment and cleaning wafer |
| CN208781872U (en)* | 2018-08-09 | 2019-04-23 | 安徽英发三友新能源科技有限公司 | A kind of solar cell wafer clamping device |
| CN109909870A (en)* | 2017-12-13 | 2019-06-21 | 三星电子株式会社 | Method of manufacturing semiconductor device |
| US20190371646A1 (en)* | 2018-05-30 | 2019-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer chuck |
- 2021
- 2021-06-04CNCN202110628938.8Apatent/CN113363188A/enactivePending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102371535A (en)* | 2010-08-11 | 2012-03-14 | 中国电子科技集团公司第四十五研究所 | Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment |
| US20130309874A1 (en)* | 2012-05-15 | 2013-11-21 | Lam Research Ag | Method and apparatus for liquid treatment of wafer-shaped articles |
| CN109909870A (en)* | 2017-12-13 | 2019-06-21 | 三星电子株式会社 | Method of manufacturing semiconductor device |
| US20190371646A1 (en)* | 2018-05-30 | 2019-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer chuck |
| CN109037109A (en)* | 2018-08-03 | 2018-12-18 | 德淮半导体有限公司 | A kind of method of semiconductor equipment and cleaning wafer |
| CN208781872U (en)* | 2018-08-09 | 2019-04-23 | 安徽英发三友新能源科技有限公司 | A kind of solar cell wafer clamping device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116564854A (en)* | 2023-05-16 | 2023-08-08 | 弥费科技(上海)股份有限公司 | Cleaning equipment, air tap device, air channel device and control method thereof |
| CN116564854B (en)* | 2023-05-16 | 2024-03-19 | 弥费科技(上海)股份有限公司 | Cleaning equipment, air tap device, air channel device and control method thereof |
| WO2024234396A1 (en)* | 2023-05-16 | 2024-11-21 | 弥费科技(上海)股份有限公司 | Cleaning apparatus, and gas nozzle device, gas path device, control method, interface circuit, and control system thereof |
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