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CN113205993A - Sintered metal gas distribution ring for plasma - Google Patents

Sintered metal gas distribution ring for plasma
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Publication number
CN113205993A
CN113205993ACN202110433982.3ACN202110433982ACN113205993ACN 113205993 ACN113205993 ACN 113205993ACN 202110433982 ACN202110433982 ACN 202110433982ACN 113205993 ACN113205993 ACN 113205993A
Authority
CN
China
Prior art keywords
ring
gas distribution
gas
metal
distribution ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110433982.3A
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Chinese (zh)
Inventor
徐鸣
唐欢欢
安建昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Micro Machinery Co ltd
Original Assignee
Jiangsu Micro Machinery Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Micro Machinery Co ltdfiledCriticalJiangsu Micro Machinery Co ltd
Priority to CN202110433982.3ApriorityCriticalpatent/CN113205993A/en
Publication of CN113205993ApublicationCriticalpatent/CN113205993A/en
Pendinglegal-statusCriticalCurrent

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Abstract

The invention provides a sintered metal gas distribution ring for plasma, which comprises a gas distribution ring body, wherein a metal ring is sintered on the side surface of an inner ring of the gas distribution ring body, and a plurality of vent holes are uniformly arranged on the metal ring at intervals. The whole metal ring can give off gas, the gas is uniformly distributed, the gas ionization efficiency is high, ions can be uniformly distributed in the ionization chamber, the gas output of oxygen can be increased, and the effectiveness of a coating process is enhanced.

Description

Sintered metal gas distribution ring for plasma
Technical Field
The invention relates to the technical field of plasmas, in particular to a sintered metal gas distribution ring for a plasma.
Background
The plasma source is a core part in a coating process, the gas distribution ring is of a hollow structure and is arranged in the plasma source, and the gas distribution ring can introduce oxygen into an ionization chamber of the plasma source so as to ionize the oxygen.
However, the side surface of the inner ring of the existing gas distribution ring is provided with a plurality of large vent holes, so that gas jet exists in the gas outlet process, the gas jet can cause gas to be discharged unevenly, the local concentration is too high, the gas distribution is uneven, and then accessories in the plasma source are easily damaged, and even the whole plasma source can be damaged.
Disclosure of Invention
The present invention is directed to a sintered metal gas distribution ring for plasma, which solves the above-mentioned problems of the prior art.
In order to solve the technical problems, the invention provides the following technical scheme: the sintered metal gas distribution ring for the plasma comprises a gas distribution ring body, wherein a metal ring is sintered on the side surface of an inner ring of the gas distribution ring body, and a plurality of vent holes with unequal intervals are formed in the metal ring.
The metal ring is formed by integrally sintering metal particles.
The diameter of the vent hole on the metal ring is 5-20 um.
The distance between the vent holes on the metal ring is 40-80 um.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the metal ring is sintered on the side surface of the inner ring of the gas distribution ring body, the plurality of vent holes are uniformly arranged on the metal ring at intervals, the whole ring can give out gas, the gas is uniformly discharged, the gas is uniformly distributed, the gas ionization efficiency is high, further, ions can be uniformly distributed in the ionization chamber, meanwhile, the gas discharge amount of oxygen can be increased, and the effectiveness of a coating process is enhanced.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, and are not intended to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a gas distribution ring before modification;
in the figure: 1 a gas distribution ring body; 2 a metal ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: the sintered metal gas distribution ring for the plasma comprises a gas distribution ring body 1, wherein a metal ring 2 is sintered on the side surface of an inner ring of the gas distribution ring body 1, and a plurality of vent holes with unequal intervals are formed in the metal ring 2.
The metal ring 2 is formed by integrally sintering metal particles.
The diameter of the vent hole on the metal ring 2 is 5-20 um.
The distance between the vent holes on the metal ring 2 is 40-80 um.
As shown in fig. 2, a plurality of large vent holes are formed in the side surface of the inner ring of the existing gas distribution ring, so that gas jet exists in the gas outlet process, the gas jet can cause the gas to be discharged unevenly, and the local concentration is too large, so that the gas distribution is uneven.
According to the invention, the metal ring 2 is sintered on the side surface of the inner ring of the gas distribution ring body 1, the metal ring 2 is uniformly provided with the plurality of vent holes at intervals, the whole ring can give out gas, the gas is uniformly distributed, the gas ionization efficiency is high, further, ions can be uniformly distributed in the ionization chamber, meanwhile, the gas output of oxygen can be increased, and the effectiveness of a coating process is enhanced.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (4)

CN202110433982.3A2021-04-222021-04-22Sintered metal gas distribution ring for plasmaPendingCN113205993A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN202110433982.3ACN113205993A (en)2021-04-222021-04-22Sintered metal gas distribution ring for plasma

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN202110433982.3ACN113205993A (en)2021-04-222021-04-22Sintered metal gas distribution ring for plasma

Publications (1)

Publication NumberPublication Date
CN113205993Atrue CN113205993A (en)2021-08-03

Family

ID=77027966

Family Applications (1)

Application NumberTitlePriority DateFiling Date
CN202110433982.3APendingCN113205993A (en)2021-04-222021-04-22Sintered metal gas distribution ring for plasma

Country Status (1)

CountryLink
CN (1)CN113205993A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH0797690A (en)*1993-09-291995-04-11Toppan Printing Co Ltd Plasma CVD equipment
US5595602A (en)*1995-08-141997-01-21Motorola, Inc.Diffuser for uniform gas distribution in semiconductor processing and method for using the same
JP2009181973A (en)*2008-01-292009-08-13Mitsubishi Materials CorpGas diffusion board for plasma processing device and plasma processing device
CN102424955A (en)*2011-11-292012-04-25中国科学院微电子研究所Novel even gas structure
CN111146063A (en)*2018-11-022020-05-12江苏鲁汶仪器有限公司Air inlet system of plasma reaction cavity

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH0797690A (en)*1993-09-291995-04-11Toppan Printing Co Ltd Plasma CVD equipment
US5595602A (en)*1995-08-141997-01-21Motorola, Inc.Diffuser for uniform gas distribution in semiconductor processing and method for using the same
JP2009181973A (en)*2008-01-292009-08-13Mitsubishi Materials CorpGas diffusion board for plasma processing device and plasma processing device
CN102424955A (en)*2011-11-292012-04-25中国科学院微电子研究所Novel even gas structure
CN111146063A (en)*2018-11-022020-05-12江苏鲁汶仪器有限公司Air inlet system of plasma reaction cavity

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Legal Events

DateCodeTitleDescription
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PB01Publication
SE01Entry into force of request for substantive examination
SE01Entry into force of request for substantive examination
RJ01Rejection of invention patent application after publication
RJ01Rejection of invention patent application after publication

Application publication date:20210803


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