CN113193919A - Photoelectric conversion device, computer mainboard and computer host - Google Patents

Abstract

The invention discloses a photoelectric conversion device, a computer mainboard and a computer host. The photoelectric conversion device includes: the device comprises a substrate, an optical transceiver chip and an electric chip; the optical transceiver chip and the electric chip are arranged and connected to the substrate, the optical transceiver chip is connected with the optical fiber, and the optical transceiver chip and the electric chip are connected through the substrate. The photoelectric conversion device is arranged on the computer mainboard to directly form an optical fiber interface on the computer mainboard, so that direct optical connection with the external environment is realized.

Description

Photoelectric conversion device, computer mainboard and computer host

Technical Field

The present invention relates to the field of servers and computer systems, and more particularly, to a photoelectric conversion device capable of directly outputting optical fibers on a computer motherboard, and a computer host.

Background

In various computer systems, in order to communicate with the outside world, an ethernet interface is generally provided on a computer motherboard, and the ethernet interface is physically connected with the outside world through a network cable. The computer system is usually connected to an ethernet switch (or router), and when the speed is low (e.g. 100Mbps) and the distance is short (e.g. <100 meters, which is required by the six types of wire standards of copper wires), a copper wire (also called twisted pair) can be used for connection, but when the connection distance is long and the speed is high (e.g. above 25 Gbps), an optical fiber is required for connection between the computer system and the switch.

In a computer system, since signal transmission on a computer motherboard is based on electrical signals, in order to implement connection between the computer motherboard and the outside using optical fibers, it is necessary to have optical-to-electrical conversion and transceiver modules (hereinafter referred to as optical modules), which are usually designed according to various specifications (such as QSFP) and can be directly connected to a designed optical fiber Cable, and an AOC (Active optical Cable ) even directly includes 2 optical modules and connecting optical fibers, as long as the optical modules are directly inserted into devices at both ends.

Due to the historical reason that the transmission rate is developed from low speed to high speed (only the low speed is directly used by a copper wire), the size of the optical module is large and the cost of the optical module is high, generally, the optical module is not directly integrated on a mainboard of a computer system, but is placed on an external network card with a PCIe interface. The external PCIe network card generally has a higher transmission rate than a network card (LoM) integrated on a Motherboard of the computer system, so as to adapt to an application environment of the computer system more flexibly. However, this situation has changed with the further increase of the ethernet transmission rate, the need for optical fiber connection due to the expansion of the data center area, the advent of silicon-based optoelectronic technology, and the maturity of optoelectronic integration technology, which can make the optical module smaller. At present and in the future, there is a strong need for a direct optical fiber interface on the motherboard of a computer system.

Disclosure of Invention

In view of the problems in the prior art, a primary object of the present invention is to provide a photoelectric conversion device, a computer motherboard, and a computer host, wherein the photoelectric conversion device can realize the integration of an electrical chip and an optical transceiver chip, and the photoelectric conversion device is disposed on the computer motherboard to directly provide an optical fiber interface on the computer motherboard.

In order to achieve the above object, the present invention provides a photoelectric conversion apparatus comprising: the device comprises a substrate, an optical transceiver chip and an electric chip; the optical transceiver chip and the electric chip are arranged and connected with the substrate, the optical transceiver chip is connected with the optical fiber, and the optical transceiver chip is connected with the electric chip through the substrate.

The photoelectric conversion device further comprises a first SOCKET connector, and the optical transceiver chip is disposed on and connected to the substrate through the first SOCKET connector.

In the photoelectric conversion device, the electric core includes an electric receiving sub-chip and an electric transmitting sub-chip, and the electric receiving sub-chip and the electric transmitting sub-chip are respectively connected with the optical transceiver chip.

In the photoelectric conversion device, the electric chip is connected to the substrate through a gold wire or a flip chip.

In order to achieve the above object, the present invention also provides a computer motherboard comprising: the CPU and the photoelectric conversion device are arranged and connected to the mainboard, and the CPU and an electric chip of the photoelectric conversion device are connected through the mainboard.

In the computer motherboard, the photoelectric conversion device further includes a second SOCKET connector disposed between the substrate and the motherboard, and the photoelectric conversion device is disposed and connected to the motherboard through the second SOCKET connector.

The computer motherboard further comprises a fixing device for fixing the optical fiber.

In the computer motherboard, the fixing device comprises two studs and two rubber strips, one ends of the two studs are fixedly arranged on the motherboard, two ends of the two rubber strips are respectively and fixedly arranged at the other ends of the two studs, and the optical fiber is clamped between the two rubber strips.

In order to achieve the above object, the present invention further provides a computer host, including: the computer mainboard is arranged in the case.

In the computer host, the case is provided with the interface of the optical fiber.

In the computer host, the interface of the optical fiber is in an MPO form.

In summary, the photoelectric conversion device provided by the invention is an integrated structure with high density and low cost of the optical transceiver chip and the electric chip, and the optical transceiver chip and the substrate are connected through the first SOCKET connector so as to be conveniently plugged and pulled out; meanwhile, the photoelectric conversion device is arranged on a mainboard of a computer mainboard, so that an optical fiber interface is directly led out of the computer mainboard, optical communication with the outside can be realized without using an external network card, and the photoelectric conversion device is conveniently plugged in the mainboard of the computer mainboard by using a second SOCKET connector; thus, in a conventional computer or server, a direct optical connection to the external environment is realized to cope with the demand for higher bandwidth data transmission and the demand for an expanded range of data centers.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1 is a schematic diagram of a photoelectric conversion device according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of an optical transceiver chip according to an embodiment of the invention.

Fig. 3 is a schematic diagram of a computer motherboard according to an embodiment of the invention.

Fig. 4 is a schematic diagram of a second SOCKET connector according to an embodiment of the invention.

Fig. 5 is a schematic view of a fixing device according to an embodiment of the invention.

Fig. 6 is a schematic diagram of a host computer according to an embodiment of the present invention.

Fig. 7 is a schematic diagram of an optical fiber interface according to an embodiment of the invention.

Wherein, the reference numbers:

100: photoelectric conversion device

10: substrate

20: optical transceiver chip

21: optical fiber connector

22: optical fiber

30: electrical chip

40: first SOCKET connector

200: computer main board

50: second SOCKET connector

60：CPU

70: fixing device

71: stud bolt

72: rubber strip

90: main board

300: computer main unit

90: cabinet

91: interface

Detailed Description

The following detailed description of the embodiments of the present invention with reference to the drawings and specific examples is provided for further understanding the objects, aspects and effects of the present invention, but not for limiting the scope of the appended claims.

Where certain terms are used in the specification and following claims to refer to particular components or features, those skilled in the art will understand that various terms or numbers may be used by a skilled user or manufacturer to refer to the same component or feature. This specification and the claims that follow do not intend to distinguish between components or features that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. In addition, the term "connected" is intended to encompass any direct or indirect electrical connection. Indirect electrical connection means include connection by other means.

It should be noted that in the description of the present invention, the terms "lateral", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and "about", or "approximately", "substantially", "left" and "right", etc. indicate the orientation or positional relationship or parameters, etc. based on the orientation or positional relationship shown in the drawings, which are only for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, a specific size or be constructed and operated in a specific orientation, and thus, the present invention is not to be construed as being limited thereto.

Referring to fig. 1, in the present embodiment, aphotoelectric conversion device 100 includes:substrate 10,optical transceiver chip 20,electrical chip 30. Wherein theOptical transceiver chip 20 and theelectrical chip 30 are disposed on thesubstrate 10 and connected to each other through a circuit inside thesubstrate 10, thesubstrate 10 may be a Printed Circuit Board (PCB), for example, while theOptical transceiver chip 20 is connected to theOptical fiber 22 through an Optical fiber Connector 21(Optical Connector) and may receive an Optical signal from theOptical fiber 22 or transmit an Optical signal to theOptical fiber 22. Further, theoptical transceiver chip 20 is disposed on thesubstrate 10 and connected to thesubstrate 10 through thefirst SOCKET connector 40, specifically, as shown in fig. 1 and fig. 2, thefirst SOCKET connector 40 is composed of a daughter board and a mother board, the daughter board and the mother board can be plugged together adaptively, for example, the daughter board is disposed on theoptical transceiver chip 20, the mother board is disposed on thesubstrate 10, wherein the connection manner between the daughter board and theoptical transceiver chip 20 and between the mother board and thesubstrate 10 is, for example, soldering, thefirst SOCKET connector 40 is disposed between thesubstrate 10 and theoptical transceiver chip 30 to connect the two, and theoptical transceiver chip 20 is convenient to mount and dismount with respect to thesubstrate 10 because the first SOCKET connector is detachable and plugged. In addition, the optical transceiver chip adopts a silicon optical transceiver chip, which adopts a silicon optical technology route, so that the integration level is high, and all optical devices except the light source, the drive amplifying circuit and the light source are integrated in a single chip or in a mixed mode. Theelectrical chip 30 is, for example, an ethernet physical layer chip for taking charge of physical layer receiving and transmitting communication, and theelectrical chip 30 may be connected to thesubstrate 10 by soldering gold wire (wire bonding) or flip chip. Specifically, in the present embodiment, theelectrical chip 30 includes an electrical receiving sub-chip and an electrical transmitting sub-chip, that is, the receiving and transmitting channels of theelectrical chip 30 are independent, for example, NGbps (depending on the driving signal of the optical transceiver chip, for example, 100G 4 × 25Gbps optical transceiver chip, the electrical driving signal at the transmitting end is 4 serdes circuits of 25G, and the receiving end is also connected to the same number of serdes circuits). Theoptical transceiver chip 20 may convert an optical signal received by theoptical fiber 22 into an electrical signal and transmit the electrical signal to the electrical chip 30 (e.g., an electrical receiving sub-chip), and theoptical transceiver chip 20 converts an electrical signal transmitted from the electrical chip 30 (e.g., an electrical transmitting sub-chip) into an electrical signal and transmits the electrical signal to theoptical fiber 22. In addition, the specific model of thefirst SOCKET connector 40 or thesecond SOCKET connector 50 used in the embodiment of the present invention is not limited, and may be specifically selected and determined according to the size or the structure of theoptical transceiver chip 20 or thesubstrate 10.

Referring to fig. 3, in the present embodiment, the invention provides acomputer motherboard 200, which includes a CPU60, amotherboard 80, and the above-mentionedphotoelectric conversion device 100, and the CPU60 and thephotoelectric conversion device 100 are disposed on and connected to themotherboard 80, the CPU60 and thephotoelectric conversion device 100 can be connected to each other through a circuit inside themotherboard 80, more specifically, the CPU60 is connected to anelectrical chip 30 of thephotoelectric conversion device 100, and theelectrical chip 30 can be connected to a MAC unit (media access Control, MAC) of the CPU60, so that electrical signals can be transmitted between the two. Furthermore, thephotoelectric conversion device 100 further includes asecond SOCKET connector 50 disposed between thesubstrate 10 of thephotoelectric conversion device 100 and themotherboard 80 of thecomputer motherboard 200, and thephotoelectric conversion device 100 and thecomputer motherboard 200 are connected to each other via thesecond SOCKET connector 50, that is, thesecond SOCKET connector 50 is connected to thesubstrate 10 and themotherboard 80 respectively, as shown in fig. 1 and 4, thesecond SOCKET connector 50 has a similar structure to thefirst SOCKET connector 40, and may also include a daughter board and a motherboard, the daughter board and the motherboard are fittingly inserted into each other, for example, disposed on thesubstrate 10 of thephotoelectric conversion device 100, the motherboard is disposed on themotherboard 80 of thecomputer motherboard 200, wherein the connection manner between the daughter board and thesubstrate 10 and between themotherboard 80 is, for example, soldering, thesecond SOCKET connector 50 is disposed between thephotoelectric conversion device 100 and thecomputer motherboard 200 to connect the two, since the second SOCKET connector is detachable and plug-in type, thephotoelectric conversion device 100 is easy to mount and dismount with respect to thecomputer motherboard 200. Preferably, thecomputer motherboard 200 further comprises a fixingdevice 70, wherein the fixingdevice 70 is disposed on themotherboard 80 and is used for fixing theoptical fiber 22 connected to theoptical transceiver chip 20 of the optical-to-electrical conversion device 100, so as to prevent theoptical fiber 22 from being pulled and damaged; specifically, referring to fig. 5, the fixingdevice 70 includes twostuds 71 and tworubber strips 72, wherein one end of each of the twostuds 71 is fixed on thecomputer motherboard 200, for example, two screw holes may be formed on thecomputer motherboard 80, the twostuds 71 are fixed in the two screw holes so as to be fixed on thecomputer motherboard 80, two ends of each of the tworubber strips 72 are respectively fixed on the other ends of the twostuds 71, for example, the tworubber strips 72 may be fixed on the other ends of the twostuds 71 by screws, and theoptical fiber 22 is sandwiched between the tworubber strips 72, so that theoptical fiber 22 can be fixed on thecomputer motherboard 200.

Referring to fig. 6, in the present embodiment, the invention provides acomputer host 300, which includes acase 90 and thecomputer motherboard 200, wherein thecomputer motherboard 200 is disposed in thecase 90. Further, theenclosure 90 is provided with aninterface 91 for theoptical fiber 22, which is used for connecting with the optical fiber outside theenclosure 90. Preferably, as shown in fig. 7, theinterface 91 of theoptical fiber 22 is an interface in a WPO format, when thecomputer motherboard 200 is installed in thechassis 90 for use, theinterface 91 in an MPO format may be fixed to thechassis 90, and an external optical fiber having an MPO format interface may be directly plugged into the correspondinginterface 91 in an MPO format on thechassis 90 for use, so as to facilitate insertion and removal of the optical fiber.

To sum up, thephotoelectric conversion device 100 provided in the embodiment of the present invention is an integrated structure of theoptical transceiver chip 20 and theelectrical chip 30 with high density and low cost, and theoptical transceiver chip 20 and thesubstrate 10 can be connected by thefirst SOCKET connector 40 to be conveniently plugged and unplugged; meanwhile, thephotoelectric conversion device 100 is disposed on themotherboard 80 of thecomputer motherboard 200, so as to directly provide an optical fiber interface from thecomputer motherboard 200, and realize optical communication with the outside without using an external network card, and in addition, thesecond SOCKET connector 50 is used to facilitate the insertion and removal of thephotoelectric conversion device 100 into and from themotherboard 80 of thecomputer motherboard 200. Thus, in a conventional computer or server, a direct optical connection to the external environment is realized to cope with the demand for higher bandwidth data transmission and the demand for an expanded range of data centers.

The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (11)

1. A photoelectric conversion device, comprising: the device comprises a substrate, an optical transceiver chip and an electric chip; the optical transceiver chip and the electric chip are arranged and connected with the substrate, the optical transceiver chip is connected with the optical fiber, and the optical transceiver chip is connected with the electric chip through the substrate.

2. The photoelectric conversion device according to claim 1, further comprising a first SOCKET connector, wherein the optical transceiver chip is provided and connected to the substrate through the first SOCKET connector.

3. The photoelectric conversion device according to claim 1, wherein the cell sheet includes an electrical receiving sub-chip and an electrical transmitting sub-chip, and the electrical receiving sub-chip and the electrical transmitting sub-chip are respectively connected to the optical transceiver chip.

4. The photoelectric conversion device according to claim 1, wherein the electric chip is connected to the substrate by a gold wire or a flip chip.

5. A computer motherboard, comprising: mainboard, CPU and the photoelectric conversion device according to any of claims 1-4, the CPU and the photoelectric conversion device are arranged and connected to the mainboard, and the CPU and the electric chip of the photoelectric conversion device are connected through the mainboard.

6. The computer motherboard according to claim 5, wherein said photoelectric conversion device further comprises a second SOCKET connector disposed between said substrate and said motherboard, said photoelectric conversion device being disposed and connected to said motherboard through said second SOCKET connector.

7. A computer motherboard according to claim 5 and further comprising fixing means for fixing the optical fibre.

8. The computer motherboard of claim 7, wherein the fixing device comprises two studs and two rubber strips, one end of each stud is fixedly arranged on the motherboard, two ends of each rubber strip are respectively fixedly arranged at the other ends of the two studs, and the optical fiber is clamped between the two rubber strips.

9. A computer host, comprising: a chassis and a computer board as claimed in any one of claims 5 to 8, the computer board being disposed within the chassis.

10. The host computer of claim 9, wherein the chassis is provided with an interface for the optical fiber.

11. The host computer of claim 10 wherein the interface to the optical fiber is in the form of MPO.

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