Background
When the electronic element is applied to a high-temperature operation environment or a low-temperature operation environment, the test classification equipment must make the electronic element execute a test in a preset test temperature range simulating the actual operation environment; therefore, the test classification device is provided with a temperature control device, so that the electronic element executes hot test operation or cold test operation in a preset test temperature range. However, the electronic device is distinguished by an internal temperature (Tj) and a surface temperature (Tc), during the temperature control process of the test operation, the sealing tester uses the internal temperature (Tj) of the electronic device as a standard of a predetermined test temperature, but the internal temperature (Tj) of the electronic device must be obtained by reading through the electrical connection of the tester, when the tester of the sealing tester does not open to provide the value of the internal temperature (Tj) of the electronic device, the test classification device of the equipment manufacturer can only sense the surface temperature (Tc) of the electronic device and estimate whether the internal temperature (Tj) is within the predetermined test temperature range according to the experience of the staff, but in this way, when the temperature of the tester itself and the temperature of the electronic device have a large temperature difference to increase the heat conduction effect, the internal temperature (Tj) of the electronic device is often unable to be within the predetermined test temperature range, which is common in the test operation of the first time of the electronic device.
Referring to fig. 1, a testing device of a testing and sorting apparatus is provided with a press-connection device 21 for pressing and transferring electronic components 10, a cooling chip 22 is mounted on the press-connection device 21, the electronic components are heated or cooled by the cooling chip 22 according to the requirement of the testing operation, a suction nozzle 23 is arranged at the end of the press-connection device 21 to pick up the electronic components 10, a temperature sensor 24 is arranged at the periphery of the suction nozzle 23 to sense the surface temperature (Tc) of the electronic components 10, and the sensed data is transmitted to a central control device (not shown); the two electrically connected circuit boards 25 and the test seat 26, the test seat 26 holds and tests the electronic component 10, the circuit board 25 is electrically connected with the testing machine 27 provided by the sealing and testing industry, the testing machine 27 is connected with the central control device through signals, and the central control device controls the relevant devices to operate.
However, as described above, the test machine 27 of the sealing manufacturer does not provide the internal temperature (Tj) of the electronic component 10, and the test classification apparatus manufactured by the equipment manufacturer can only read the surface temperature (Tc) of the electronic component 10 through the temperature sensor 24, and estimate that the internal temperature (Tj) of the electronic component 10 may reach the preset test temperature range according to the working experience; in this way, a situation of misdetection occurs in the testing operation of the electronic components 10 in the first batch, for example, the preset testing temperature range is 130±10 ℃, although the cooling chip 22 can heat the surface temperature (Tc) of the electronic components 10 in the temperature range of 130±10 ℃, the temperature of the internal temperature (Tj) of the electronic components 10 in the first batch is only about 15 to 25 ℃ when the testing machine 27 is in the initial testing, so that the internal temperature (Tj) of the electronic components 10 in the first batch will be greatly conducted to the testing machine 27 through the circuit board 25 and the test seat 26, so that the internal temperature (Tj) of the electronic components 10 is lower than the preset testing temperature range 130±10 ℃, the testing machine 27 can misjudge the electronic components 10 in the first batch as defective products, but in fact, the electronic components 10 in the first batch are not actually defective products, only the internal temperature (Tj) is lower than the preset testing temperature range due to heat conduction to the testing machine 27, but the misdetection situation must be performed until the internal temperature (Tj) of the testing machine 27 is raised to a certain degree, the subsequent electronic components 10 can be reduced by heat conduction to the testing machine 10, and the subsequent electronic components 10 in the first batch (i.e. the first electronic components 10, the first electronic components 10 in the first batch, 3, the electronic components 10 in the first batch, 4 and the electronic components, which are not actually defective, can be subjected to the first test, and the quality of the electronic components, and the electronic components 10 in the first batch, and the electronic components, 4, and the electronic components, and the electronic component 10, and the next test device are subjected to be subjected to the next to the quality test are improved to the quality test and have the quality test.
Disclosure of Invention
The invention provides a testing device with a temperature control unit, wherein the temperature control unit preheats a first batch of electronic components by a first temperature generator and preheats a circuit board by a second temperature generator, the temperature control unit is provided with a first sensor on a crimping device for sensing the surface temperature of the electronic components and sensing the temperature of the circuit board by the second sensor, the first sensor and the second sensor transmit the surface temperature sensing data of the electronic components and the temperature sensing data of the circuit board to a processor, and the processor analyzes the surface temperature sensing data of the electronic components and the temperature sensing data of the circuit board with a database to acquire that the internal temperature of the electronic components reaches the preset testing temperature so as to rapidly perform the testing operation of the electronic components of the first batch and effectively improve the testing accuracy of the electronic components of the first batch.
The second objective of the present invention is to provide a testing device with a temperature control unit, which can ensure that the internal temperature of the first batch of electronic components is within a predetermined testing temperature range when the first batch of electronic components are tested, so as to avoid the situation that the electronic components need to be retested due to false testing, and effectively improve the testing productivity.
The invention provides test classification equipment using a test device with a temperature control unit, which comprises a machine table, a feeding device, a receiving device, a test device, a conveying device and a central control device; the feeding device is arranged on the machine table and is provided with at least one feeding carrier for accommodating the electronic element to be tested; the receiving device is arranged on the machine table and is provided with at least one receiving carrier for accommodating the tested electronic components; the testing device is configured on the machine table and is provided with a crimping device, a circuit board, a testing seat and a temperature control unit, so that the internal temperature of the electronic element is known to be in a preset testing temperature range, and testing operation is performed on the electronic element; the conveying device is arranged on the machine table and is provided with at least one shifter for shifting electronic components; the central control device is used for controlling and integrating the actions of the devices so as to execute automatic operation and improve the operation efficiency.
Detailed Description
Referring to fig. 2, the electronic device testing apparatus 40 includes a circuit board 41, a test socket 42, a press-connector 43 and a temperature control unit of the present invention, wherein the circuit board 41 is electrically connected to a tester 50 provided by a sealing and testing manufacturer, and the tester 50 is further connected to a central control device 60 of a testing and sorting device by signals; the test seat 42 is electrically connected with the circuit board 41 to hold and test electronic components; the press-connector 43 is displaced in at least one direction to press-connect the electronic component in the test socket 42 for testing, and further, the press-connector 43 may be a press-connector for pressing the electronic component or a press-and-shift device for pressing and shifting the electronic component, in this embodiment, the press-connector 43 is a press-and-shift device for pressing and shifting the electronic component to move the electronic component into/out of the test socket 42 and press against the electronic component for testing.
The temperature control unit of the present invention comprises a first temperature generator 44, a second temperature generator 45, a first sensor 46, a second sensor 47 and a processor 48, wherein the first temperature generator 44 preheats the electronic components to be tested, furthermore, a pre-heating tray (not shown) is arranged on the machine 30 of the test classification device, a substrate 31 is arranged above the circuit board 41, the circuit board 41 is connected by the substrate 31, the first temperature generator 44 can be arranged on the pre-heating tray, and the electronic components to be tested are preheated before being moved into the test seat 42; the first temperature generator 44 or a feeding stage (not shown) may be disposed on the machine 30, so that the feeding stage preheats the electronic components to be tested during the carrying process; the first temperature generator can be arranged on the press connector 43, so that the press connector 43 preheats the electronic component to be tested in the process of transferring and over-transferring; in the present embodiment, the first temperature generator 44 is disposed on the press-connector 43 and is a cooling chip for transferring the electronic device to be tested with the pre-temperature during the over-moving process of the press-connector 43.
The second temperature generator 45 preheats the circuit board 41, and further, the second temperature generator 45 can be disposed on the substrate 31 above the circuit board 41, and the second temperature generator 45 can preheat the circuit board 41 through the substrate 31 before the electronic components are moved into the test seat 42; the second temperature generator 45 may be disposed on the press-connection device 43, and the press-connection device 43 is used to pre-heat the test socket 42 and pre-heat the circuit board 41 via the test socket 42 before the electronic component is moved into the test socket 42; the second temperature generator 45 may be disposed in a test chamber around the test seat 42, so as to inject a fluid with a predetermined temperature into the test chamber, so as to preheat the circuit board 41 and the test seat 42 disposed in the test chamber, in this embodiment, a test chamber 49 is disposed on the machine 30, the circuit board 41, the test seat 42 and the press-connection device 43 are disposed inside the test chamber 49, and the second temperature generator 45 is disposed in the test chamber 49, so as to inject a fluid with a predetermined temperature into the test chamber 49, so as to preheat the circuit board 41 disposed in the test chamber 49.
The first sensor 46 is disposed on the press-connector 43 to sense the surface temperature (Tc) of the electronic component, and in this embodiment, the first sensor 46 is disposed on the bottom of the press-connector 43 to contact the surface temperature (Tc) of the electronic component; the second sensor 47 is disposed on the circuit board 41 to sense the temperature of the circuit board 41, and further, the second sensor 47 may be disposed on the top or bottom of the circuit board 41, in this embodiment, the second sensor 47 is disposed on the top of the circuit board 41; the processor 48 receives the surface temperature sensing data of the electronic component transmitted by the first sensor 46 and receives the surface temperature sensing data of the circuit board transmitted by the second sensor 47, and analyzes the surface temperature sensing data of the electronic component and the surface temperature sensing data of the circuit board to obtain the internal temperature of the electronic component, further, the processor 48 can obtain the internal temperature of the electronic component through calculation or comparison data, in this embodiment, the processor 48 is provided with a database 481, the database 481 is built with the surface temperature (Tc) comparison data of the electronic component, the surface temperature comparison data of the circuit board and the internal temperature (Tj) comparison data of the electronic component, for example, the manufacturer can obtain the surface temperature (Tc) of the electronic component to be 105 ℃ and the surface temperature (Tj) of the circuit board to be 65 ℃, for example, the surface temperature (Tc) of the electronic component to be 85 ℃ and the surface temperature (Tc) of the circuit board to be 75 ℃, and the internal temperature (Tj) of the electronic component to be 105 ℃. Therefore, the processor 48 can compare the surface temperature (Tc) sensing data of the electronic component and the circuit board temperature sensing data with the database 481 for analysis, so as to quickly determine whether the internal temperature (Tj) of the electronic component meets the predetermined test temperature, thereby facilitating the test operation.
Referring to fig. 3, taking a preset test temperature range of 85 ℃ for the electronic components as an example, since the temperature of the tester 50 is only about 15-25 ℃ during initial test, in order to avoid that a large amount of heat of the first batch of electronic components is conducted to the tester 50 through the circuit board 41 and the test socket 42, the internal temperature (Tj) of the first batch of electronic components is lower than the preset test temperature range of 85 ℃; therefore, the temperature control unit of the present invention firstly uses the second temperature generator 45 to inject the fluid with the preset temperature into the test chamber 49, and then pre-heats the circuit board 41, and uses the second sensor 47 to sense the temperature of the circuit board 41, and transmits the temperature sensing data of the circuit board to the processor 48.
Referring to fig. 4, the temperature control unit preheats the first batch of electronic components 70, and the first temperature generator 44 preheats the first batch of electronic components 70 during the process of transferring the first batch of electronic components 70 by the press-connector 43, and the temperature control unit senses the surface temperature (Tc) of the first batch of electronic components 70 by the first sensor 46 and transmits the surface temperature (Tc) sensing data to the processor 48, since the first temperature generator 44 is mounted on the press-connector 43.
Referring to fig. 5, after receiving the surface temperature (Tc) sensing data of the first batch of electronic components 70 transmitted by the first sensor 46 and the circuit board temperature sensing data of the circuit board 41 transmitted by the second sensor 47, the processor 48 compares the surface temperature (Tc) sensing data and the circuit board temperature sensing data with the built-in data of the database 481, and analyzes the surface temperature (Tc) sensing data of the first batch of electronic components 70 until the processor 48 receives the surface temperature (Tc) sensing data of the first batch of electronic components 70, the temperature of the circuit board 41 is lower than 105 ℃, and the circuit board temperature sensing data of the circuit board 41 does not reach 65 ℃, that means that the internal temperature (Tj) of the first batch of electronic components 70 does not reach 85 ℃, and the temperature of the circuit board 41 does not reach 85 ℃, and waits for the surface temperature (Tc) of the first batch of electronic components 70 and the temperature of the circuit board 41 to rise until the processor 48 receives the surface temperature (Tc) sensing data of the first batch of the first electronic components 70 transmitted by the first sensor 46, the circuit board 41 and the test seat 42 conduct the temperature to the tester 50, and the surface temperature (Tc) of the circuit board temperature (Tc) of the first batch of electronic components 70 and the circuit board 41 does not reach 85 ℃, and the temperature of the circuit board 41 is higher than the temperature of the first batch of the circuit board 41 and the temperature (Tj) of the circuit board 41) does not reach 85 ℃ to the preset test temperature; therefore, when the internal temperature (Tj) of the first lot of electronic components 70 is 85 ℃ and the predetermined test temperature is 85 ℃, the processor 48 of the temperature control unit transmits a signal to the central control device 60, and the central control device 60 controls the press-connector 43 to move the first lot of electronic components 70 into the test seat 42 for testing operation, so as to effectively improve the accuracy of the testing operation of the first lot of electronic components.
Referring to fig. 2 and 6, a schematic diagram of a testing device 40 with a temperature control unit applied to an electronic device testing apparatus according to the present invention is shown, wherein the electronic device testing apparatus is configured with a feeding device 80, a receiving device 90, a testing device 40, a conveying device 100 and a central control device (not shown) on a machine 30; the feeding device 80 is disposed on the machine 30 and provided with at least one feeding carrier 81 for accommodating at least one electronic component to be tested; the material receiving device 90 is disposed on the machine 30 and provided with at least one material receiving device 91 for receiving at least one tested electronic component; the testing device 40 is disposed on the machine 30 and comprises a circuit board 41, a testing seat 42, a press-connector 43 and a temperature control unit of the present invention, wherein the circuit board 41 and the testing seat 42 are electrically connected with a tester (not shown) provided by a sealing tester, the press-connector 43 is displaced in at least one direction to press-connect the electronic components in the testing seat 42 to execute testing operation, in this embodiment, two press-connectors 43, 43A are provided to move the electronic components into/out of the testing seat 42 and press against the electronic components to execute testing operation; the temperature control unit of the present invention comprises a first temperature generator 44, a second temperature generator 45, a first sensor 46, a second sensor 47 and a processor 48 for pre-heating the electronic components and the circuit board 41 and ensuring the internal temperature of the first batch of electronic components to be within a preset temperature range for executing a test operation; the conveying device 100 is disposed on the machine 30 and is provided with at least one shifter for shifting electronic components, in this embodiment, the conveying device 100 is provided with a first shifter 101 for taking out the electronic components to be tested from the feeding carrier 81 of the feeding device 80 and shifting the electronic components to be tested to the first feeding carrier 102 and the second feeding carrier 103, the first feeding carrier 102 and the second feeding carrier 103 carry the electronic components to be tested to the side of the testing device 40, the testing device 40 takes out the electronic components to be tested from the first feeding carrier 102 and the second feeding carrier 103 by two pressure-bonding devices 43, 43A and shifting the electronic components to be tested to the testing seat 42 for executing testing operation, and shifting the tested electronic components of the testing seat 42 to the first discharging carrier 104 and the second discharging carrier 105, the first discharging carrier 104 and the second discharging carrier 105 carry the tested electronic components, the conveying device 100 takes out the tested electronic components on the first discharging carrier 104 and the second discharging carrier 105 by the second shifter 106, and the tested electronic components are sorted by the two pressure-bonding devices 43, 43A and 43A for conveying the tested electronic components to the receiving device 91 according to the test result; the central control device is used for controlling and integrating the actions of the devices so as to execute automatic operation and improve the operation efficiency.