CN113141750A - Modularization heat abstractor and have its vehicle - Google Patents
Modularization heat abstractor and have its vehicleDownload PDFInfo
- Publication number
- CN113141750A CN113141750ACN202010066937.4ACN202010066937ACN113141750ACN 113141750 ACN113141750 ACN 113141750ACN 202010066937 ACN202010066937 ACN 202010066937ACN 113141750 ACN113141750 ACN 113141750A
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- heat dissipation
- plate
- side plate
- dissipation plate
- cooling
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- 230000017525heat dissipationEffects0.000claimsabstractdescription158
- 238000001816coolingMethods0.000claimsabstractdescription79
- XLYOFNOQVPJJNP-UHFFFAOYSA-NwaterSubstancesOXLYOFNOQVPJJNP-UHFFFAOYSA-N0.000claimsdescription92
- 238000007789sealingMethods0.000claimsdescription8
- 210000005069earsAnatomy0.000claims2
- 230000005855radiationEffects0.000abstractdescription11
- 230000000694effectsEffects0.000description7
- 239000000110cooling liquidSubstances0.000description5
- 238000010438heat treatmentMethods0.000description2
- 239000000463materialSubstances0.000description2
- 206010063385IntellectualisationDiseases0.000description1
- 230000004075alterationEffects0.000description1
- 230000009286beneficial effectEffects0.000description1
- 238000000034methodMethods0.000description1
- 238000012986modificationMethods0.000description1
- 230000004048modificationEffects0.000description1
- 238000006467substitution reactionMethods0.000description1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Technical Field
The invention relates to the technical field of vehicles, in particular to a modularized heat dissipation device and a vehicle with the same.
Background
In the related art, along with the wide realization of electromotion, intellectualization and informatization, the heat dissipation requirement of industrial control products is continuously increased; from the perspective of modularization and serialization, product design is more prone to multi-module connection to achieve flexible quantity configuration, but the scheme puts high requirements on flexible configuration of cooling capacity of the heat dissipation device. The method is particularly obvious in the application of motor controllers, vehicle-mounted chargers, other high-voltage power driving devices, controllers, processors, power batteries and the like.
In order to meet the requirements of different power levels, the liquid-cooled heat dissipation device for the multi-module parallel product usually adopts different structures, so that the heat dissipation device of each power level needs to be redesigned, verified again, consumes time and labor, and is not beneficial to serialization of products, and has low cost and competitiveness.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a modular heat sink, which has a higher matching performance on the premise of meeting the cooling requirement, does not need to be redesigned, and has an improved versatility on the premise of reducing the development cost, so that the modular heat sink has a higher competitiveness.
The invention further provides a vehicle with the modularized heat dissipation device.
A modular heat sink according to an embodiment of a first aspect of the present invention includes: a top heat sink, a middle heat sink, and a bottom heat sink; the middle heat dissipation plate is superposed below the top heat dissipation plate; the bottom heat dissipation plate can be selectively overlapped below the middle heat dissipation plate, the number of the bottom heat dissipation plate can be adjusted, a cooling space is defined between the top heat dissipation plate and the middle heat dissipation plate, between the middle heat dissipation plate and the bottom heat dissipation plate, and a cooling space is defined between every two adjacent bottom heat dissipation plates.
According to the modular heat dissipation device provided by the embodiment of the invention, the top heat dissipation plate, the middle heat dissipation plate and the bottom heat dissipation plate which are selectively stacked are arranged, the number of the bottom heat dissipation plates is adjustable, and the number of heat dissipation spaces is adjusted by adjusting the number of the bottom heat dissipation plates, so that on the premise of meeting the use requirements and ensuring the heat dissipation effect, on one hand, the modular heat dissipation device has higher universality, can meet the use requirements in various environments, improves the product competitiveness, does not need to be redesigned, and reduces the development cost; on the other hand, the cooling capacity of the cooling space defined by the middle cooling plate and the top cooling plate is lower than that of the cooling space defined by the bottom cooling plate, the middle cooling plate and the two adjacent bottom cooling plates, so that heat sources with different cooling requirements can be arranged in different cooling spaces, and different cooling requirements are met.
According to some embodiments of the invention, the bottom heat dissipation plate comprises: the heat dissipation plate comprises a bottom heat dissipation plate body, a first side plate and a second side plate, wherein the first side plate and the second side plate are positioned at two ends of the bottom heat dissipation plate body; the intermediate heat dissipation plate includes: the middle heat dissipation plate comprises a middle heat dissipation plate body, and a third side plate and a fourth side plate which are positioned at two ends of the middle heat dissipation plate body; the first side plate and the third side plate are positioned at one end of the same side, and the second side plate and the fourth side plate are positioned at the other end of the same side.
In some embodiments, the bottom heat dissipating plate body has a first cooling flow channel therein, the first side plate and the second side plate are configured as a cavity structure, the first side plate and the second side plate define a first water inlet and a first water outlet therein, respectively, and the first water inlet and the first water outlet are both communicated with the first cooling flow channel.
Furthermore, a second cooling flow channel is arranged in the middle heat dissipation plate body, a second water inlet and a second water outlet are respectively defined in the third side plate and the fourth side plate, and the second water inlet, the second water outlet and the second cooling flow channel are communicated.
Further, the first water inlet includes: a water inlet blind hole portion and a water inlet through hole portion communicating with each other, the first water outlet port including: the water inlet blind hole part and the water outlet blind hole part are communicated with two ends of the first cooling flow channel respectively, and the water inlet through hole part is communicated with the second water inlet and the water outlet through hole part is communicated with the second water outlet.
According to some embodiments of the invention, the top heat-dissipating plate comprises: the top heat dissipation plate comprises a top heat dissipation plate body, and a fifth side plate and a sixth side plate which are positioned at two ends of the top heat dissipation plate body, wherein one side of the top heat dissipation plate body, which deviates from the middle heat dissipation plate body, is constructed into a heat dissipation fin.
In some embodiments, a first sealing member is disposed between the first water inlets of two adjacent bottom heat dissipation plates and between the first water outlets of two adjacent bottom heat dissipation plates, and a second sealing member is disposed between the first water inlets of the bottom heat dissipation plates and the second water inlets of the middle heat dissipation plate and between the first water outlets of the bottom heat dissipation plates and the second water outlets of the middle heat dissipation plates.
Furthermore, a first positioning assembly is arranged between two adjacent bottom heat dissipation plates, and a second positioning assembly is arranged between the middle heat dissipation plate and the bottom heat dissipation plate.
According to some embodiments of the invention, the middle heat dissipation plate is provided with a first mounting lug in a circumferential direction, and the bottom heat dissipation plate is provided with a second mounting lug in the circumferential direction.
A vehicle according to an embodiment of the second aspect of the invention includes: a power module, the modular heat sink described in the above embodiments; wherein the power module is formed as a heat source, the heat source is plural, and the plural heat sources are selectively disposed in the cooling space.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of a modular heat sink in cooperation with a heat source according to an embodiment of the present invention;
FIG. 2 is a schematic view of an angle of a bottom heat sink plate of a modular heat sink according to an embodiment of the present invention;
FIG. 3 is a schematic view of another angle of a bottom heat sink plate of a modular heat sink according to an embodiment of the present invention;
FIG. 4 is a schematic view of an angle of an intermediate heat sink plate of a modular heat sink according to an embodiment of the present invention;
FIG. 5 is a schematic view of another angle of the intermediate heat sink plate of the modular heat sink according to an embodiment of the present invention;
FIG. 6 is a schematic view of an angle of a top heatsink plate of a modular heatsink according to an embodiment of the invention;
fig. 7 is a schematic view of another angle of the top heatsink plate of the modular heatsink device according to an embodiment of the invention.
Reference numerals:
the combination of themodular heat sink 100, theheat source 200,
a top heat-dissipating plate 10, a top heat-dissipating plate body 11, heat-dissipating fins 111, afifth side plate 12, a sixth side plate 13,
a middleheat radiation plate 20, a middle heatradiation plate body 21, athird side plate 22, afourth side plate 23, afirst mounting lug 24, a bottomheat radiation plate 30, a bottom heatradiation plate body 31, afirst side plate 32, a second side plate 33, asecond mounting lug 34,
the water inlet through hole part a, the water inlet blind hole part b, the water outlet blind hole part c, the water outlet through hole part d, the second water inlet e and the second water outlet f.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
Amodular heat sink 100 according to an embodiment of the present invention is described below with reference to fig. 1-7.
As shown in fig. 1, amodular heat sink 100 according to an embodiment of the first aspect of the present invention includes: a topheat spreader plate 10, an intermediateheat spreader plate 20, and a bottomheat spreader plate 30.
Wherein the middleheat dissipation plate 20 is stacked below the topheat dissipation plate 10; the bottomheat dissipation plates 30 are selectively stacked below the middleheat dissipation plates 20 and the number of the bottom heat dissipation plates is adjustable, cooling spaces are defined between the topheat dissipation plate 10 and the middleheat dissipation plate 20, between the middleheat dissipation plate 20 and the bottomheat dissipation plates 30, and between two adjacent bottomheat dissipation plates 30.
Specifically, themodular heat sink 100 of the present embodiment may be configured according to the use requirement, and a plurality ofheat sources 200 or oneheat source 200 may be disposed between themiddle heat sink 20 and thetop heat sink 10 for cooling; or between themiddle heat sink 20 and thetop heat sink 10; theheat sources 200 are arranged between the middleheat dissipation plate 20 and the bottomheat dissipation plate 30, so that theheat sources 200 with lower cooling requirements or lower heating values are cooled through the middleheat dissipation plate 20 and the topheat dissipation plate 10, and theheat sources 200 with higher cooling requirements or higher heating values are cooled through the middleheat dissipation plate 20 and the bottomheat dissipation plate 30;
furthermore, when there aremany heat sources 200 that need to be cooled, and only one bottomheat dissipation plate 30 is provided, and the cooling space of the modular cooling device cannot accommodate all theheat sources 200, one or more bottomheat dissipation plates 30 may be provided below the bottomheat dissipation plates 30, so as to meet the use requirements of different situations.
According to the modularheat dissipation device 100 provided by the embodiment of the invention, the topheat dissipation plate 10, the middleheat dissipation plate 20 and the bottomheat dissipation plate 30 which are selectively stacked are arranged, the number of the bottomheat dissipation plates 30 is adjustable, and the number of heat dissipation spaces is adjusted by adjusting the number of the bottomheat dissipation plates 30, so that on the premise that the use requirements are met and the heat dissipation effect is ensured, on one hand, the modularheat dissipation device 100 is higher in universality, can meet the use requirements under various environments, improves the product competitiveness, does not need to be redesigned, and reduces the development cost; on the other hand, the cooling capacity of the cooling space defined by the middle cooling plate and thetop cooling plate 10 is lower than the cooling capacity of the cooling space defined by thebottom cooling plate 30, themiddle cooling plate 20 and the two adjacentbottom cooling plates 30, so that theheat sources 200 with different cooling requirements can be arranged in different cooling spaces, and different cooling requirements are met.
As shown in fig. 2 and 3, the bottomheat dissipation plate 30 includes: a bottom heatdissipation plate body 31, afirst side plate 32 and a second side plate 33 positioned at two ends of the bottom heatdissipation plate body 31;
as shown in fig. 4 and 5, the intermediateheat dissipation plate 20 includes: a middle heatdissipation plate body 21, and third andfourth side plates dissipation plate body 21; thefirst side plate 32 and thethird side plate 22 are located at one end of the same side, and the second side plate 33 and thefourth side plate 23 are located at the other end of the same side.
In this way, thethird side plate 22 and thefourth side plate 23 at both ends of the intermediate heatsink plate body 21 are stacked and disposed above thefirst side plate 32 and the second side plate 33 of the bottom heatsink plate body 31, respectively, and the heights of thefirst side plate 32 and the second side plate 33 and the heights of thethird side plate 22 and thefourth side plate 23 define the thickness of the cooling space between the adjacent bottomheat sink plates 30 and the thickness of the cooling space between the intermediateheat sink plate 20 and the bottomheat sink plates 30, respectively.
Therefore, the height of thefirst side plate 32 and the second side plate 33 or the height of thethird side plate 22 and thefourth side plate 23 can be adjusted, so that the size adjustment of the cooling space is simpler and more convenient, and the stacking placement between the middleheat dissipation plate 20 and the bottomheat dissipation plate 30 is firmer and more reliable.
It can be understood that the bottom heatdissipation plate body 31 has a first cooling flow channel therein, thefirst side plate 32 and the second side plate 33 are configured as a cavity structure, a first water inlet and a first water outlet are respectively defined in thefirst side plate 32 and the second side plate 33, and both the first water inlet and the first water outlet are communicated with the first cooling flow channel. Therefore, the cooling liquid can flow into the first cooling flow channel through the first water inlet and flow out of the first cooling flow channel through the first water outlet, so that the cooling effect of the bottomheat dissipation plate 30 is better.
Similarly, a second cooling flow channel is formed in the middle heatdissipation plate body 21, a second water inlet e and a second water outlet f are respectively defined in thethird side plate 22 and thefourth side plate 23, and the second water inlet e, the second water outlet f and the second cooling flow channel are communicated. Therefore, the cooling liquid can flow into the second cooling flow channel through the second water inlet e and flow out of the second cooling flow channel through the second water outlet f, so that the cooling effect of the intermediateheat dissipation plate 20 is better.
As shown in fig. 3 and 4, the first water inlet includes: a water inlet blind hole portion b and a water inlet through hole portion a communicating with each other, the first water outlet port including: the water inlet blind hole part b and the water outlet blind hole part c are respectively communicated with two ends of the first cooling flow channel, and the water inlet through hole part a is communicated with the second water inlet e, and the water outlet through hole part d is communicated with the second water outlet f.
That is, the water inlet blind hole portion b and the water outlet blind hole portion c communicate with the first cooling flow passage to define a cooling circuit of the bottomheat dissipation plate 30, the water inlet through hole portion a, the second water inlet e, the second cooling flow passage, the second water outlet f, and the water outlet through hole portion d communicate to define a cooling circuit of the middleheat dissipation plate 20.
Thus, the cooling liquid of the middleheat dissipation plate 20 and the cooling liquid of the bottomheat dissipation plate 30 can be supplied through the same circulation loop, so that the structure of the modularheat dissipation device 100 is simpler, and the connection with the external circulation loop is more convenient and reliable.
It can be understood that, when there are a plurality of bottomheat dissipation plates 30, the water inlet through hole portion a and the water outlet through hole portion d of the uppermost bottomheat dissipation plate 30 are respectively communicated with the second water inlet e and the second water outlet f, and the plurality of bottomheat dissipation plates 30 located below are sequentially communicated with each other.
As shown in fig. 6 and 7, the topheat dissipation plate 10 includes: a top heat radiation plate body 11, afifth side plate 12 and a sixth side plate 13 which are positioned at two ends of the top heat radiation plate body 11, and one side of the top heat radiation plate body 11 departing from the middle heatradiation plate body 21 is constructed as aheat radiation fin 111. Therefore, thefifth side plate 12 and the sixth side plate 13 are provided to make the connection between thetop heat sink 10 and the intermediate heat sink 20 more firm and reliable, and theheat dissipation fins 111 are provided to make the heat dissipation effect of thetop heat sink 10 more stable and reliable.
In some embodiments, a first sealing member is disposed between the first water inlets of the two adjacent bottomheat dissipation plates 30 and between the first water outlets of the two adjacent bottomheat dissipation plates 30, and a second sealing member is disposed between the first water inlets of the bottomheat dissipation plates 30 and the second water inlets e of the middleheat dissipation plate 20 and between the first water outlets of the bottomheat dissipation plates 30 and the second water outlets f of the middleheat dissipation plate 20. Thus, the sealing performance of themodular heat sink 100 can be improved, so as to prevent theheat source 200 from being damaged due to the overflow of the cooling liquid, and improve the safety of themodular heat sink 100.
It can be understood that a first positioning assembly is disposed between two adjacent bottomheat dissipation plates 30, and a second positioning assembly is disposed between the middleheat dissipation plate 20 and the bottomheat dissipation plate 30. Thus, the assembly accuracy of themodular heat sink 100 can be improved, thereby further improving the sealing performance.
According to some embodiments of the present invention, the middleheat dissipation plate 20 is provided withfirst mounting lugs 24 in the circumferential direction, and the bottomheat dissipation plate 30 is provided withsecond mounting lugs 34 in the circumferential direction. Therefore, the assembling effect of themodular heat sink 100 can be further improved, and theheat source 200 in the cooling space can be more stably and reliably fixed.
A vehicle according to an embodiment of the second aspect of the invention includes: power module,modular heat sink 100 in the above embodiments; wherein the power module is formed as aheat source 200, theheat source 200 is plural, and theplural heat sources 200 are selectively disposed in the cooling space.
According to the vehicle of the embodiment of the present invention, the modular heat dissipation module in the above embodiment has the same technical effect as the modularheat dissipation apparatus 100, and is not described herein again.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features.
In the description of the present invention, "a plurality" means two or more.
In the description of the present invention, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween.
In the description of the invention, "above", "over" and "above" a first feature in a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A modular heat sink (100), comprising:
a top heat dissipation plate (10);
an intermediate heat sink plate (20), the intermediate heat sink plate (20) being stacked below the top heat sink plate (10); and
the bottom heat dissipation plate (30) can be selectively overlapped below the middle heat dissipation plate (20) and the number of the bottom heat dissipation plates (30) can be adjusted, a cooling space is defined between the top heat dissipation plate (10) and the middle heat dissipation plate (20), between the middle heat dissipation plate (20) and the bottom heat dissipation plate (30), and two adjacent bottom heat dissipation plates (30) are all defined.
2. The modular heat sink (100) of claim 1,
the bottom heat dissipation plate (30) includes: the heat dissipation plate comprises a bottom heat dissipation plate body (31), a first side plate (32) and a second side plate (33), wherein the first side plate and the second side plate are positioned at two ends of the bottom heat dissipation plate body (31);
the intermediate heat dissipation plate (20) includes: the heat dissipation plate comprises a middle heat dissipation plate body (21), and a third side plate (22) and a fourth side plate (23) which are positioned at two ends of the middle heat dissipation plate body (21); wherein
The first side plate (32) and the third side plate (22) are located at one end of the same side, and the second side plate (33) and the fourth side plate (23) are located at the other end of the same side.
3. The modular heat sink (100) according to claim 2, wherein the bottom heat sink body (31) has a first cooling flow channel therein, the first side plate (32) and the second side plate (33) are configured as a cavity structure, and the first side plate (32) and the second side plate (33) define a first water inlet and a first water outlet therein, respectively, and the first water inlet and the first water outlet are both communicated with the first cooling flow channel.
4. The modular heat sink (100) according to claim 3, wherein the middle heat sink body (21) has a second cooling flow channel therein, and the third side plate (22) and the fourth side plate (23) define a second water inlet (e) and a second water outlet (f) therein, respectively, and the second water inlet (e), the second water outlet (f) and the second cooling flow channel are communicated.
5. The modular heat sink (100) according to claim 4, wherein the first water inlet comprises: a water inlet blind hole part (b) and a water inlet through hole part (a) communicating with each other, the first water outlet including: the water inlet blind hole part (b) and the water outlet blind hole part (c) are respectively communicated with two ends of the first cooling flow channel, and the water inlet through hole part (a) is communicated with the second water inlet (e), and the water outlet through hole part (d) is communicated with the second water outlet (f).
6. The modular heat sink (100) according to claim 1, wherein the top heat sink (10) comprises: the top heat dissipation plate comprises a top heat dissipation plate body (11), a fifth side plate (12) and a sixth side plate (13) which are positioned at two ends of the top heat dissipation plate body (11), and a heat dissipation fin (111) is formed on one side, deviating from the middle heat dissipation plate body (21), of the top heat dissipation plate body (11).
7. The modular heat sink (100) according to claim 1, wherein a first sealing member is disposed between the first water inlets of two adjacent bottom heat dissipation plates (30) and between the first water outlets of two adjacent bottom heat dissipation plates (30), and a second sealing member is disposed between the first water inlets of the bottom heat dissipation plates (30) and the second water inlets (e) of the middle heat dissipation plates (20) and between the first water outlets of the bottom heat dissipation plates (30) and the second water outlets (f) of the middle heat dissipation plates (20).
8. The modular heat sink (100) according to claim 1, wherein a first positioning assembly is disposed between two adjacent bottom heat dissipation plates (30), and a second positioning assembly is disposed between the middle heat dissipation plate (20) and the bottom heat dissipation plates (30).
9. The modular heat sink (100) according to any of claims 1-8, wherein the intermediate heat sink (20) is circumferentially provided with first mounting ears (24) and the bottom heat sink (30) is circumferentially provided with second mounting ears (34).
10. A vehicle, characterized by comprising:
a power module;
the modular heat sink (100) of any of claims 1-9; wherein the power module is formed as a heat source (200), the heat source (200) is plural, and the plural heat sources (200) are selectively provided in the cooling space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010066937.4ACN113141750A (en) | 2020-01-20 | 2020-01-20 | Modularization heat abstractor and have its vehicle |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010066937.4ACN113141750A (en) | 2020-01-20 | 2020-01-20 | Modularization heat abstractor and have its vehicle |
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| CN113141750Atrue CN113141750A (en) | 2021-07-20 |
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| CN202010066937.4APendingCN113141750A (en) | 2020-01-20 | 2020-01-20 | Modularization heat abstractor and have its vehicle |
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| CN110300509A (en)* | 2019-06-29 | 2019-10-01 | 联想(北京)有限公司 | A kind of radiator |
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