CN113056148A - Stack type mainboard and electronic equipment - Google Patents

Abstract

The invention provides a stacked mainboard, which comprises: the radiation module is fixedly arranged on the first circuit board, and the second circuit board is stacked on the first circuit board and covers the radiation module to shield electromagnetic interference; the stacked mainboard further comprises a plurality of connecting pieces, one ends of the connecting pieces are fixedly arranged on the second circuit board, and the other ends of the connecting pieces are inserted into the first circuit board; the connecting piece is movably provided with a positioning piece, and the positioning piece is used for adjusting the depth of the connecting piece inserted into the first circuit board. The stacked mainboard utilizes the second circuit board to cover the radiation component, and the height of the second circuit board relative to the second circuit board can be adjusted through the matching of the connecting piece and the positioning piece, so that the universality of the product is improved, and the manufacturing cost is reduced. The application also provides an electronic device with the stacked mainboard.

Description

Stack type mainboard and electronic equipment

Technical Field

The invention relates to a stacked mainboard and an electronic device.

Background

At present, pcba (printed Circuit Board assembly) motherboards are increasingly used in electronic products. Since there are some components or assemblies with electromagnetic radiation on the PCBA motherboard, which causes the problem of electromagnetic radiation in electronic products, in order to make the products meet the safety standard, the existing solution is to cover the radiation source with metal parts such as iron hub to shield the electromagnetic radiation. However, the iron hub used in the prior art is high in cost and requires an open mold to be customized, and the iron hub manufactured by the mold is often poor in universality. Different heights of radiation sources need to be matched with different iron hubs, so that multiple sets of molds need to be manufactured, and the manufacturing cost is increased.

Disclosure of Invention

In view of the above, there is a need for a highly versatile and adjustable stacked motherboard and an electronic device having the same.

A stacked motherboard, comprising: a first circuit board; the radiation assembly is fixedly arranged on the first circuit board; the stacked mainboard comprises a second circuit board which is stacked on the first circuit board and covers the radiation component to shield electromagnetic interference; the stacked mainboard further comprises a plurality of connecting pieces, one ends of the connecting pieces are fixedly arranged on the second circuit board, and the other ends of the connecting pieces are inserted into the first circuit board; the connecting piece is movably provided with a positioning piece, and the positioning piece is used for adjusting the depth of the connecting piece inserted into the first circuit board.

Optionally, an accommodating groove is formed in one side of the second circuit board facing the first circuit board, and the radiation assembly is located in the accommodating groove.

Optionally, the number of the connecting members is plural, and the plural connecting members are uniformly arranged on the periphery side of the second circuit board and surround the radiation component.

Optionally, the positioning members correspond to the connecting members one to one.

Optionally, a plurality of through holes are formed in the first circuit board, and the through holes correspond to the connecting pieces one to one.

Optionally, the connecting pieces are inserted into the through holes, and the positioning piece abuts against one end of the through hole.

Optionally, the first circuit board is further provided with a sealing member, which is disposed outside the end portions of the plurality of through holes and used for preventing impurities from entering the plurality of through holes and fixing the connecting member.

Optionally, a fixing layer is disposed on a side of the radiation assembly facing the second circuit board, and is used for fixing the second circuit board and the radiation assembly.

An electronic device comprising the stacked motherboard of any of the above.

The stacked mainboard utilizes the second circuit board to cover the radiation components, and the height of the second circuit board relative to the second circuit board can be adjusted through the matching of the connecting piece and the positioning piece, so that the second circuit board can be matched with the radiation components with different heights, the universality of products is improved, and the manufacturing cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a stacked motherboard in a first embodiment.

Fig. 2 is a schematic cross-sectional view of the stacked motherboard of fig. 1.

Fig. 3 is a schematic structural view of the second circuit board in the stacked motherboard of fig. 1 in another direction.

Fig. 4 is a schematic structural diagram of a stacked motherboard in a second embodiment.

Fig. 5 is a block diagram of the electronic device in the third embodiment.

Description of the main element symbols:

stack type mainboard	100
		Electronic devicePrepare for	200
First circuit board	1
		Throughhole	11
Sealing element	12
		Second circuit board	2
Accommodatinggroove	21
		Substrate	22
Communication layer	23
		Radiation assembly	3
Connecting piece	4
		Locatingpiece	41
Fixing layer	5
		Processor with a memory having a plurality ofmemory cells	201
Memory device	202

The specific implementation mode is as follows:

the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

The application provides a heap mainboard, includes: a first circuit board; the radiation assembly is fixedly arranged on the first circuit board; the stacked mainboard comprises a second circuit board which is stacked on the first circuit board and covers the radiation component to shield electromagnetic interference; the stacked mainboard further comprises a plurality of connecting pieces, one ends of the connecting pieces are fixedly arranged on the second circuit board, and the other ends of the connecting pieces are inserted into the first circuit board; the connecting piece is movably provided with a positioning piece, and the positioning piece is used for adjusting the depth of the connecting piece inserted into the first circuit board.

The stacked mainboard utilizes the second circuit board to cover the radiation components, and the height of the second circuit board relative to the second circuit board can be adjusted through the matching of the connecting piece and the positioning piece, so that the second circuit board can be matched with the radiation components with different heights, an iron hub for shielding electromagnetic interference is not required to be manufactured by using a mold, the universality of products is improved, and meanwhile, the manufacturing cost is reduced.

Some embodiments of the present application are described in detail. In the following embodiments, features of the embodiments may be combined with each other without conflict.

First embodiment

Referring to fig. 1 and 2, in the first embodiment, thestacked motherboard 100 includes afirst circuit board 1, asecond circuit board 2 and aradiation element 3. Theradiation component 3 is fixedly arranged on thefirst circuit board 1, and thesecond circuit board 2 is stacked on thefirst circuit board 1 and covered on theradiation component 3 to shield electromagnetic interference. Thestacked motherboard 100 further includes a plurality of connectors 4, one end of each connector 4 is fixedly disposed on thesecond circuit board 2, and the other end of each connector 4 is inserted into thefirst circuit board 1. Apositioning part 41 is movably arranged on the connecting part 4, and thepositioning part 41 is used for adjusting the depth of the connecting part 4 inserted into thefirst circuit board 1, so as to adjust the height of thesecond circuit board 2 relative to thefirst circuit board 1, so as to adapt to theradiation components 3 with different height sizes.

Referring to fig. 3, a receivinggroove 21 is formed on a side of thesecond circuit board 2 facing thefirst circuit board 1, and when thesecond circuit board 2 is connected to thefirst circuit board 1 through the connecting member 4, theradiation element 3 is located in thereceiving groove 21.

The number of the connecting pieces 4 is plural, and the connecting pieces 4 are uniformly arranged on the peripheral side of thesecond circuit board 2 and surround theradiation component 3. Specifically, the plurality of connecting members 4 are uniformly distributed at the open end of the receivinggroove 21. The connecting element 4 is preferably made of a metal material and may be a metal needle. One end of the connecting piece 4, which is connected with thesecond circuit board 2, penetrates through the substrate and is electrically connected with the communication layer, and the other end of the connecting piece 4 can be electrically connected with thefirst circuit board 1 when inserted into thefirst circuit board 1, so that thefirst circuit board 1 is electrically connected with thesecond circuit board 2.

The positioning parts correspond to the connecting parts one by one, that is, onepositioning part 41 is sleeved on each connecting part 4. When thesecond circuit board 2 is mounted on thefirst circuit board 1, the portion of the end of the connector 4 protruding out of thepositioning member 41 is inserted into thefirst circuit board 1. Thepositioning member 41 can adjust the height of thesecond circuit board 2 by adjusting the length of the end of the connecting member 4. Thepositioning piece 41 is also beneficial to improving the mechanical strength of the connecting piece 4 and reducing the conditions of fracture, bending and the like of the connecting piece 4.

In the embodiment of the present application, thepositioning member 41 is a plastic member, which is beneficial to reducing material cost. In other embodiments, thepositioning member 41 may be made of other materials, and the application is not limited thereto.

Second embodiment

Referring to fig. 4, thestacked motherboard 100 includes afirst circuit board 1, asecond circuit board 2 and aradiation element 3. Theradiation component 3 is fixedly arranged on thefirst circuit board 1, and thesecond circuit board 2 is stacked on thefirst circuit board 1 and covered on theradiation component 3 to shield electromagnetic interference. Thestacked motherboard 100 further includes a plurality of connectors 4, one end of each connector 4 is fixedly disposed on thesecond circuit board 2, and the other end of each connector 4 is inserted into thefirst circuit board 1. Apositioning part 41 is movably arranged on the connecting part 4, and thepositioning part 41 is used for adjusting the depth of the connecting part 4 inserted into thefirst circuit board 1, so as to adjust the height of thesecond circuit board 2 relative to thefirst circuit board 1, so as to adapt to theradiation components 3 with different height sizes.

The stacked motherboard of the second embodiment is substantially the same as the stacked motherboard of the first embodiment, except that thefirst circuit board 1 is provided with a plurality of throughholes 11, and the throughholes 11 correspond to the connectors 4 one by one. The part of the end of the connecting member 4 extending out of thepositioning member 41 is inserted into the throughholes 11, and thepositioning member 41 abuts against one end of the throughhole 11. Specifically, the diameter of thepositioning element 41 is larger than the diameter of the throughhole 11, and when thepositioning element 41 abuts against the end of the throughhole 11, the movement of the connecting element 4 can be stopped. The diameter of the connecting piece 4 is approximately the same as that of the throughhole 11, and the fixing of the connecting piece 4 in the throughhole 11 can be realized by means of interference fit.

Thesecond circuit board 2 comprises a substrate 22 and acommunication layer 23, theaccommodating groove 21 is formed in the substrate 22, and thecommunication layer 23 is located on one side, departing from thefirst circuit board 1, of thesecond circuit board 2. Electronic components can also be arranged on thecommunication layer 23 to supplement the component placement area occupied by the radiation components on thefirst circuit board 1. The electronic component may be disposed in the receivinggroove 21, or may be disposed on a side of thesecond circuit board 2 away from thefirst circuit board 1. Thecommunication layer 23 of thesecond circuit board 2 comprises a metal layer, which is one of the reasons why thesecond circuit board 2 can be used for shielding electromagnetic interference.

Further, a sealingmember 12 is further disposed on thefirst circuit board 1, and the sealingmember 12 is disposed outside the end portions of the plurality of through holes and used for preventing impurities from entering the plurality of throughholes 11 and fixing the connecting member 4. Specifically, the sealingmember 12 may be a film attached to openings at two ends of the throughhole 11, the connecting member 4 may pass through the sealingmember 12 at one end and enter the throughhole 11, and when the positioningmember 41 abuts against the end of the throughhole 11, the sealingmember 12 may be bonded to the positioningmember 41, so as to prevent the connecting member 4 from falling off from the throughhole 11.

Furthermore, afixing layer 5 is disposed on a side of theradiation element 3 facing thesecond circuit board 2, and is used for fixing thesecond circuit board 2 and theradiation element 3, and preventing theradiation element 3 from moving in theaccommodating slot 21 and causing damage, short circuit, and the like. Thefixing layer 5 may be a pad disposed on the surface of theradiation component 3, and theradiation component 3 is fixedly connected to thesecond circuit board 2 by soldering. It is understood that in other embodiments, thefixing layer 5 may also be an adhesive such as a hot melt adhesive, and theradiation assembly 3 is fixedly connected to thesecond circuit board 2 by an adhesive fixing method.

Third embodiment

Referring to fig. 5, a third embodiment provides anelectronic device 200, where theelectronic device 200 includes, but is not limited to, a desktop computer, a notebook computer, a server, a vehicle-mounted computer, a mobile phone, a tablet, and other products. Theelectronic device 200 comprises aprocessor 201, amemory 202 and thestacked motherboard 100 of any of the above embodiments. Theprocessor 201 and thememory 202 are both electrically connected to the stackedmotherboard 100.

Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention.

Claims (9)

1. A stacked motherboard, comprising:

a first circuit board; and

the radiation assembly is fixedly arranged on the first circuit board;

the stacked mainboard comprises a second circuit board, wherein the second circuit board is stacked on the first circuit board and covers the radiation component to shield electromagnetic interference;

the stacked mainboard further comprises a plurality of connecting pieces, one ends of the connecting pieces are fixedly arranged on the second circuit board, and the other ends of the connecting pieces are inserted into the first circuit board;

the connecting piece is movably provided with a positioning piece, and the positioning piece is used for adjusting the depth of the connecting piece inserted into the first circuit board.

2. The stacked motherboard of claim 1 wherein a side of said second circuit board facing said first circuit board is formed with a receiving cavity, and said radiating element is located in said receiving cavity.

3. The stacked motherboard of claim 1 wherein said connector is plural in number, and a plurality of said connectors are uniformly disposed on the periphery of said second board and surround said radiating element.

4. The stacked motherboard of claim 3 wherein said alignment features correspond one-to-one to said connectors.

5. The stacked motherboard of claim 3 wherein said first board defines a plurality of through holes, said plurality of through holes corresponding one-to-one with said connectors.

6. The stacked motherboard as recited in claim 5 wherein said connectors are inserted into said plurality of through holes, and said positioning member abuts against one end of said through holes.

7. The stacked mother board according to claim 6, wherein a sealing member is further provided on the first circuit board, outside the ends of the plurality of through holes, for preventing foreign substances from entering the plurality of through holes and fixing the connecting member.

8. The stacked motherboard of claim 1 wherein a side of said radiating element facing said second circuit board is provided with a securing layer for securing said second circuit board and said radiating element.

9. An electronic device comprising the stacked motherboard of any of claims 1-8.

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