CN113013154A - Integrated packaging tube shell for flat phased array antenna receiving and transmitting assembly - Google Patents
Integrated packaging tube shell for flat phased array antenna receiving and transmitting assemblyDownload PDFInfo
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- CN113013154A CN113013154ACN202110183854.8ACN202110183854ACN113013154ACN 113013154 ACN113013154 ACN 113013154ACN 202110183854 ACN202110183854 ACN 202110183854ACN 113013154 ACN113013154 ACN 113013154A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- General Physics & Mathematics (AREA)
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Abstract
Translated fromChinese
Description
Technical Field
The invention relates to a flat phased array antenna mainly used for communication and navigation functions in the aerospace field, in particular to an antenna transceiving component packaging tube shell which can be used as a structural component of a device carrier such as a transceiving component radio frequency chip and the like and also can be used as a functional component for interconnecting a device and an antenna network.
Background
The phased array antenna can carry out beam forming configuration on N antenna array elements, intelligently controls the amplitude and phase excitation of each independent antenna array element in the phased array antenna in an electronic mode, generates beams pointing to the required direction, and can carry out beam forming and beam scanning quickly without inertia under the condition that a physical structure is fixed and unchanged. The beam-forming design at the front end of the phased array antenna has very excellent performance, so that the integrated nest plate of the type is a mainstream scheme in large-scale phased array radar and satellite communication applications. Most of the traditional satellite communication antennas are mechanical parabolic antennas, which have high profile and heavy weight and need a servo system to provide antenna pointing variation. The electric scanning phased array antenna adopts the phase shifter to control the phase, does not need a mechanical structure, and has the advantages of low profile, easy conformality, light weight and the like, so the electric scanning phased array antenna is increasingly applied to the construction of space-based systems such as high-orbit broadband and low-orbit mobile satellites, and has wide application prospect in the fields of civil aviation/high-speed rail high-speed mobile communication, remote area maritime terminal broadband internet access, enterprise/government large data platform construction and the like which are developed at high speed nowadays. The core active function of the electric scanning phased array antenna is realized by the transceiving component, and meanwhile, the transceiving component is also the link with the highest cost ratio (60% -80%) in the electric scanning phased array antenna, the finest assembling process and the most complex flow, so that the performance of the transceiving component has decisive influence on the quality of the index of the active function of the electric scanning phased array antenna.
The digital phase shifter and the digital attenuator are important components of the phased array antenna receiving assembly. Since the phase shift accuracy and the attenuation accuracy directly affect the performance of the entire phased array antenna, a high-order digital phase shifter and a digital attenuator are inevitably selected. Assuming that the receiving component uses a 6-bit digital phase shifter and a 6-bit digital attenuator, the receiving component has 4096 (2)6×26) A phase-shift attenuation state. So much attenuated phase shiftThe state presents a significant challenge to the testing of the receiving component. When the existing transceiving component consisting of an active chip, a circuit board, a connector, a metal shell and a cover plate breaks down, due to the complex assembly process and the multiple types of used devices, the performance problems of each component and structure and the connection problems during mutual assembly need to be checked step by step, the problems are difficult to locate and the repair time is long. However, the existing transceiver module usually adopts an integrated scheme of packaging parts such as an active chip, a circuit board, a connector and the like in a metal shell, and the scheme needs to use a radio frequency connector to realize signal interconnection between the transceiver module and an antenna. Because a large number of radio frequency connectors are used, the manufacturing cost of the transceiving component is increased, extremely strict requirements are provided for the welding quality of the radio frequency connectors, and the assembly and repair difficulty of the transceiving component is increased. Therefore, in order to reduce the manufacturing cost of the transceiving component and improve the integration level of the transceiving component, a manufacturing scheme of the planar phased array antenna transceiving component is formed, wherein the active function of the transceiving component is made into a chip, and the chip-level device is integrally packaged. In the scheme, the chip-level device needs to be independently packaged and then attached to an antenna carrier plate with multiple functions such as an integrated antenna network and the like after being packaged. This requires that the package case not only has the structural function of carrying the chip-scale device and realizing the package thereof, but also has the functional function of realizing the signal interconnection between the chip-scale device and the antenna carrier. Meanwhile, the active functional chip of the transceiver module can produce a large amount of heat during working, and the active functional chip is packaged in a narrow packaging tube shell in the scheme, so that great difficulty is brought to the heat dissipation of the active functional chip, and therefore the packaging tube shell must have good heat dissipation characteristics and establish a heat dissipation channel between the active functional chip and the external environment.
The low temperature co-fired ceramic (LTCC) technology is a manufacturing technology for forming a multilayer interconnected substrate by performing processes of cavity punching, wiring, via metallization, lamination, co-firing, and the like on a green tape. Because the LTCC substrate has the excellent characteristics of low thermal expansion, low transmission loss and low dielectric loss, the LTCC substrate can meet the characteristic requirements of large current, high temperature resistance, high-frequency communication and the like, and is widely applied to the advanced fields of aerospace communication, microsystem integration and the like. In order to form a cavity structure in an LTCC substrate, many foreign researchers have made researches, for example, Tick T uses a pressure assisted sintering technology to fabricate a microwave waveguide cavity of a 160GHz waveguide antenna on an LTCC substrate, and when fabricating a cavity, an upper cover, an inner cavity, and a bottom of the cavity are formed by laminating, bonding, and sintering the three parts to form a 1.3mm × 0.615mm micro waveguide cavity. The research results provide technical bases for manufacturing the integrated packaging tube shell of the planar phased-array antenna transceiving component by using a low temperature co-fired ceramic (LTCC) technology.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a packaging tube shell with integrated structure and function and good heat dissipation property according to the manufacturing requirements of a flat phased array antenna aiming at a transmitting and receiving assembly packaging body, wherein the transmitting and receiving assembly packaging body can be used as a structural member of a device carrier such as a transmitting and receiving assembly radio frequency chip and the like and can also be used as a device and an antenna network interconnection functional member.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a dull and stereotyped phased array antenna receiving and dispatching subassembly integration encapsulation tube, has arectangle tube cavity 1 through 4 encapsulation of tube upper cover and its solidantithetical couplet 8 on the heat sink of tube of bottom, its characterized in that: thetube shell cavity 1 is divided into a tube shellupper cavity 2 and a tube shell lower cavity 6 by an intermediate medium layer, aradio frequency chip 10 serving as a transceiving component and chip capacitors which are connected with theradio frequency chip 10 through bonding gold wires and symmetrically distributed on two sides of theradio frequency chip 10 are arranged in the middle of the step surface of the intermediate medium layer, theradio frequency chip 10 and the chip capacitors are connected with a connectingbonding pad 11 through the bonding gold wires and connected to a radio frequency transmission hole 12 embedded in the intermediate medium, and theradio frequency chip 10 is communicated with a phasechange material layer 7 through an array heat dissipation throughhole 9 penetrating through the intermediate medium layer; the middle medium layer is also embedded with aprinting metal lead 3 which extends along the side walls of the two sides and is connected with a lineararray welding ball 5, theprinting metal lead 3 extends to the bottom of the embedded cavity along the medium layer of the inner wall of the tube shell, theprinting resistors 13 which are symmetrically distributed on theprinting metal lead 3 and are arranged in the radiating throughholes 9, and the radio frequency chip realizes the signal transmission with the antenna network through the printing metal lead which is distributed along the medium layer of the inner wall of the tube shell and extends to the bottom of the embedded cavity, the printing resistors on the metal lead and the linear array welding balls which are arranged on the two sides of the; the radio frequency chip is communicated with a phasechange material layer 7 filled in a lower cavity 6 of the tube shell through radiating throughholes 9 arrayed in the middle medium layer, the bottom end of the tube shell is provided with a tubeshell heat sink 8 fixedly connected, the radio frequency chip is communicated with the radiating through holes through the radiating through holes arrayed in the middle medium layer and is filled in the lower cavity of the tube shell, and the tube shell heat sink fixedly connected to the bottom end of the tube shell realizes heat exchange with the external environment, so that the efficient radiating function of the radio frequency chip in the integrated airtight packaging structure during working is achieved.
Compared with the prior art, the invention has the following beneficial effects:
the invention adopts a rectangulartube shell cavity 1 which is packaged by a tube shellupper cover 4 and a tubeshell heat sink 8 which is fixedly connected with the bottom end of thetube shell cavity 1, thetube shell cavity 1 is divided into an uppertube shell cavity 2 and a lower tube shell cavity 6 by an intermediate medium layer, signal transmission of a radio frequency chip of a transceiving component and an antenna network is realized by a connectingbonding pad 11, a radio frequency transmission hole 12, an embedded printedmetal lead 3, a printedresistor 13 which is interconnected with the embedded printed metal lead, and a lineararray welding ball 5, the manufacturing problems of difficult welding and difficult repair of a radio frequency connector which are brought by using a large number of radio frequency connectors of the existing transceiving component are solved, and the repair performance of the transceiving component is improved while the manufacturing cost of the transceiving.
The size and weight are reduced. The invention realizes the structure and function integrated packaging of the whole transceiving component by installing a transceiving component radio frequency chip, a chip capacitor and a gold bonding wire on atube shell cavity 1 and a tube shellupper cavity 2, embedding a printed metal wire and a printed resistor in the tube shell, implanting a lineararray solder ball 5 on a tube shellupper cover 4, and sealing the tube shellupper cavity 2 and the tube shell lower cavity 6 by using the tube shellupper cover 4 and a tubeshell heat sink 8. Compared with the existing transceiver module, the transceiver module omits a metal shell, a metal cover plate for sealing the metal shell and a fastener, so that the volume and the weight of the transceiver module are reduced by more than 50%.
Thetube shell cavity 1 is connected with the tube shellupper cover 4 in a lead-tin welding mode to form sealing on the tube shellupper cavity 2; the tubeshell heat sink 8 is interconnected with thetube shell cavity 1 in a tin-silver welding mode to form sealing for the tube shell lower cavity 6; by sealing the upperpipe shell cavity 2 and the lower pipe shell cavity 6, the air-tight packaging of the whole pipe shell can be realized, and the environmental adaptability of the pipe shell under severe conditions such as damp heat, salt mist and the like is enhanced.
The heat dissipation capability is improved. The lower cavity 6 of thetube shell cavity 1 is filled with a phasechange material layer 7 for rapid heat dissipation, a large amount of heat generated by the radio frequency chip of the transceiver component during working can be conducted to the phasechange material layer 7 through the heat dissipation throughhole 9, the phase change material absorbs a large amount of heat by phase change when reaching a phase change temperature, so that the heat generated by the radio frequency chip of the transceiver component during working is conducted to the phasechange material layer 7 through the heat dissipation throughhole 9, the phase change material absorbs a large amount of heat by phase change when reaching the phase change temperature, and the heat is rapidly transferred from the radio frequency chip of the transceiver component to the phase change material, so that the. The phase-change material absorbs a large amount of heat and then exchanges heat with a tube-shell heat sink 8 made of diamond-copper, when the temperature of the phase-change material is lower than the phase-change temperature of the phase-change material, the phase-change material is changed again to release heat, and the heat is dissipated to the external environment through the diamond-copper heat sink. The upperpipe shell cavity 2 and the lower pipe shell cavity 6 in thepipe shell cavity 1 are manufactured by a sacrificial layer filling technology and a low-temperature co-fired ceramic technology, the filled sacrificial layer material can be filled in during lamination to avoid the cavity from excessively collapsing or deforming during lamination, and meanwhile, the sacrificial layer material can completely volatilize below 450 ℃ during sintering and does not form any residue in the cavity. The problem of the integrated manufacturing of dull and stereotyped phased array antenna receiving and dispatching subassembly tube structure and function integration and the high-efficient heat dissipation of receiving and dispatching subassembly radio frequency chip during operation in narrow and small space is solved.
The reworkability is improved. The invention adopts the printedmetal wire 3 embedded in the tube shell to be interconnected with the lineararray welding balls 5 arranged on two sides of theupper cover 4 of the tube shell, thus realizing the signal transmission with the antenna network; the radio frequency chip of the transceiving component is communicated to the phasechange material layer 7 filled in the lower cavity 6 of the tube shell through the heat dissipation throughholes 9 arrayed in the middle medium, and performs heat exchange with theheat sink 8 of the tube shell, so that the radio frequency chip of the transceiving component of the planar phased array antenna is integrally packaged in the airtight structure of thecavity 1 of the tube shell, and the function of efficient heat dissipation is performed during work. The lineararray welding balls 5 are embedded in theupper cover 4 of the tube shell, and the antenna carrier plate is interconnected by adopting an SMT (surface mount technology). When the flat phased array antenna breaks down, the receiving and sending assembly with problems can be accurately positioned through electrical testing, and the receiving and sending assembly with problems can be quickly replaced through the hot air repairing table. The problems that when the existing transceiving component composed of an active chip, a circuit board, a connector, a metal shell and a cover plate breaks down, performance problems of each component and structure and connection problems during mutual assembly need to be checked step by step due to the fact that the assembly process is complex and the types of used devices are multiple, positioning is difficult, and repair time is long are solved. Compared with the existing assembly mode of the transceiver assembly, the invention has the advantages of easier fault location and effectively improved repair performance.
The invention is applicable to receiving elements of different array sizes.
Drawings
FIG. 1 is a perspective view of an integrated package structure for a planar phased array antenna transceiver module according to the present invention;
FIG. 2 is a top view of FIG. 1;
fig. 3 is a flow chart of the fabrication of the cavity of the integrally packaged package of fig. 1;
in the figure: the structure comprises ashell cavity 1, a shellupper cavity 2, a printedmetal wire 3, a shellupper cover 4, a lineararray solder ball 5, a shell lower cavity 6, a phasechange material layer 7, ashell heat sink 8, a heat dissipation throughhole 9, a transceiver moduleradio frequency chip 10, aconnection pad 11, a radio frequency transmission hole 12 and a printedresistor 13.
Detailed Description
Refer to fig. 1 and 2. In the embodiments described below, a package with integrated planar phased-array antenna transceiver module has arectangular package cavity 1 packaged by a packageupper cover 4 and apackage heat sink 8 fixedly connected to the bottom end. Thetube shell cavity 1 is divided into a tube shellupper cavity 2 and a tube shell lower cavity 6 by an intermediate medium layer, aradio frequency chip 10 serving as a transceiving component and chip capacitors which are connected with theradio frequency chip 10 through bonding gold wires and symmetrically distributed on two sides of theradio frequency chip 10 are arranged in the middle of the step surface of the intermediate medium layer, theradio frequency chip 10 and the chip capacitors are connected with a connectingbonding pad 11 through the bonding gold wires and connected to a radio frequency transmission hole 12 embedded in the intermediate medium, and theradio frequency chip 10 is communicated with a phasechange material layer 7 through an array heat dissipation throughhole 9 penetrating through the intermediate medium layer; the middle medium layer is also embedded with aprinting metal lead 3 which extends along the side walls of the two sides and is connected with a lineararray welding ball 5, theprinting metal lead 3 extends to the bottom of the embedded cavity along the medium layer of the inner wall of the tube shell, theprinting resistors 13 which are symmetrically distributed on theprinting metal lead 3 and are arranged in the radiating throughholes 9, and the radio frequency chip realizes the signal transmission with the antenna network through the printing metal lead which is distributed along the medium layer of the inner wall of the tube shell and extends to the bottom of the embedded cavity, the printing resistors on the metal lead and the linear array welding balls which are arranged on the two sides of the; the radio frequency chip is communicated with a phasechange material layer 7 filled in a lower cavity 6 of the tube shell through radiating throughholes 9 arrayed in the middle medium layer, the bottom end of the tube shell is provided with a tubeshell heat sink 8 fixedly connected, the radio frequency chip is communicated with the radiating through holes through the radiating through holes arrayed in the middle medium layer and is filled in the lower cavity of the tube shell, and the tube shell heat sink fixedly connected to the bottom end of the tube shell realizes heat exchange with the external environment, so that the efficient radiating function of the radio frequency chip in the integrated airtight packaging structure during working is achieved.
The integrated packaging tube shell is divided into atube shell cavity 1, a tube shellupper cover 4 and a tubeshell heat sink 8. Thetube shell cavity 1 comprises a tube shellupper cavity 2 and a tube shell lower cavity 6, the tube shellupper cavity 2 is used for bonding a radio frequency chip, a chip capacitor and a gold bonding wire of the transceiver module, and the tube shell lower cavity 6 is mainly used for filling a phasechange material layer 7.
A printedmetal wire 3 and a printedresistor 13 are embedded in atube shell cavity 1, a lineararray solder ball 5 is embedded in a tube shellupper cover 4, and a radio frequency chip of a transceiving component can form signal interconnection with an antenna network on an antenna carrier plate through a connectingbonding pad 11, a radio frequency transmission hole 12, the embedded printedmetal wire 3, the printedresistor 13 interconnected with the embedded printed metal wire, and the lineararray solder ball 5. Theupper cover 4 of the tube shell is welded on thecavity 1 of the tube shell by a lead-tin welding process, and theupper cavity 2 of the tube shell is sealed. The tubeshell heat sink 8 is welded on thetube shell cavity 1 through a tin-silver welding process to complete the sealing of the tube shell lower cavity 6, and the phase change material layer is in close contact with the tube shell heat sink to establish a heat exchange channel between the phase change material layer and the external environment.
In an optional embodiment, the embedded printedmetal wire 3 and the passive printedresistor 13 are manufactured inside the tube shell by using a low-temperature co-fired ceramic technology, the embedded printed metal wire and the passive printed resistor are printed on a low-temperature co-fired ceramic chip through high-precision contraposition, and are formed by laminating, laminating and sintering together with the ceramic chip, and the signal interconnection between the radio frequency chip of the transceiver component in the packaging tube shell and the antenna network can be realized through the embedded printed metal wire, the passive printed resistor and the lineararray solder balls 5.
The lineararray solder ball 5 is Sn/Ag/Cu solder ball, the bottom of the solder ball is provided with a composite metal layer under a welding spot for enhancing the connection strength with the tube shell, and the composite metal layer consists of an Au layer used as an oxidation barrier layer, a Pd layer used as an adhesion and diffusion barrier layer and a Ni layer used as a solder wetting layer.
The phase-change material layer 7 is positioned in the lower cavity 6 of the tube shell, heat generated when the radio-frequency chip of the transceiver component works can be conducted to the phase-change material through the heat dissipation throughhole 9, and the phase-change material changes phase when the phase-change material exceeds the phase-change temperature of the phase-change material to absorb a large amount of heat. The phase-change material absorbs a large amount of heat and then exchanges heat with the tube-shell heat sink 8 made of diamond-copper, when the temperature of the phase-change material is lower than the phase-change temperature of the phase-change material, the phase-change material changes phase, the released heat is dissipated to the external environment through the diamond-copper heat sink, and therefore efficient heat dissipation of the radio frequency chip of the transceiver module during working is achieved.
See fig. 3. Thetube shell cavity 1 is mainly manufactured by combining a low-temperature co-fired ceramic process and a sacrificial layer technology. Firstly, cutting a raw porcelain strip into 8-inch × 8-inch standard porcelain pieces, tearing off a protective film on the back surface of the porcelain strip on a film tearing machine, and placing the porcelain strip in a constant temperature and humidity box for 24 hours to release the residual stress of the torn porcelain pieces. And then punching radio frequency holes and heat conducting holes on the ceramic chips by using a high-speed mechanical punching machine, and filling metal into the radio frequency holes and the heat conducting holes by using a printing hole filling mode. In order to reduce the manufacturing cost, the hole filling slurry uses a hole filling silver slurry. After the ceramic chip is filled, the ceramic chip is kept stand for 24 hours or dried in a vacuum oven at the temperature of 120 ℃ for 20 minutes so as to dry and solidify the filling silver paste. Printing the printed metal wires of each layer on the porcelain sheets of each layer through a printing silk screen tool by a printing machine according to a design drawing, and printing silver paste to reduce the manufacturing cost during printing. And standing the printed layers of the ceramic tiles for 4 hours to dry and solidify the printed metal wires. And then printing the printed resistor on the ceramic chip according to the design drawing, wherein the relative position of the metal line and the printed resistor needs to be noticed during printing, which has important influence on the resistance value of the internal printed resistor. After the printed resistance paste is dried, the positions of the upper cavity and the lower cavity of the tube shell in the ceramic chip are cut off by an ultraviolet laser cutting method, and the ceramic chip is laminated by an automatic laminating machine after the cutting off to form a ceramic chip laminated body.
Before the lamination of the tile laminate, a sacrificial layer filler is required. In the embodiment, the filling material is formed by casting the polypropylene carbonate composite material through a powder casting process, the sheet material can be softened at the temperature of 60-80 ℃, the softened sheet material can be cut into a regular shape by a hot cutting machine, and the thickness of the formed filling material is 0.04 mm.
After the sacrificial layer filling material block is manufactured, the upper cavity and the lower cavity of the ceramic chip laminated body are respectively filled, so that the cavity is prevented from deforming and collapsing in the laminating process. After the completion of the filling, the ceramic chip laminate was placed in a packaging bag, evacuated, and laminated and formed by hot water isostatic pressing. After the lamination, the ceramic tile laminate was sintered in a sintering furnace, and a sintered body was obtained after the sintering.
Because the metal on the surface of the sintered body is silver and cannot be used for subsequent gold wire bonding, the silver layer metal on the surface is replaced by a Ni/Pd/Au composite metal layer by adopting a chemical plating method, wherein the Au layer is used as an oxidation barrier layer, the Pd layer is used as an adhesion and diffusion barrier layer, and the Ni layer is used as a solder wetting layer. And obtaining thetube shell cavity 1 after the chemical plating is finished.
The phase-change material layer 7 of the present embodiment is made of a paraffin/graphite foam composite phase-change material. During preparation, the foam graphite is used as a reinforced heat-conducting framework structure, and a liquid-phase infiltration method is adopted to prepare the foam graphite by utilizing the good adsorption property of the graphite to paraffin. The thermal conductivity coefficient of the prepared paraffin/foam graphite composite phase-change material is about 6W/m.K, which is improved by about 20 times compared with that of pure paraffin, and the heat transfer enhancement effect is obvious. The prepared paraffin/foam graphite composite phase-change material is cut into a size matched with the lower cavity 6 of the tube shell in an ultraviolet laser cutting mode and filled into the lower cavity of the tube shell; and welding the tubeshell heat sink 8 at the bottom of thetube shell cavity 1 by using tin-silver solder to seal the lower cavity 6 of the tube shell.
In this embodimentIn the method, a radio frequency chip and a chip capacitor of a transceiving assembly are bonded in corresponding positions in anupper cavity 2 of a tube shell by conductive silver paste, and then a semi-automatic gold wire bonding machine is used for completing signal interconnection of the radio frequency chip of the transceiving assembly and the chip capacitor and the radio frequency chip of the transceiving assembly and a bonding pad in the tube shell by 25 microns. And after gold wire bonding is finished, welding theupper cover 4 of the tube shell on the top of thecavity 1 of the tube shell by adopting lead-tin solder Sn63Pb37 to finish sealing theupper cavity 2 of the tube shell. The welding temperature is set to 210 ℃ during welding so as to ensure that thelinear solder balls 5 are not melted. The lower cavity 6 of the tube shell and theupper cavity 2 of the tube shell are welded and sealed, so that the whole tube shell can be hermetically packaged, and the leakage rate is 1 multiplied by 10 through helium mass spectrum leakage detection test-6Pa.m3And/s, the air tightness standard is achieved, and the environmental adaptability of the transceiving component under severe conditions such as damp heat, salt mist and the like is effectively enhanced.
It should be understood that the specific examples described above are intended to be illustrative only and are not intended to be limiting, as any feature disclosed in the present invention may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Claims (10)
Translated fromChinesePriority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110183854.8ACN113013154B (en) | 2021-02-10 | 2021-02-10 | Integrated packaging tube shell of flat phased array antenna transceiver component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110183854.8ACN113013154B (en) | 2021-02-10 | 2021-02-10 | Integrated packaging tube shell of flat phased array antenna transceiver component |
Publications (2)
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| CN113851923A (en)* | 2021-10-19 | 2021-12-28 | 北京大学东莞光电研究院 | Laser TO packaging structure |
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| CN119552637A (en)* | 2025-01-24 | 2025-03-04 | 中科优选新材料(浙江)有限公司 | A high performance and high thermal conductivity composite phase change material and its preparation process and application |
| CN120033457A (en)* | 2025-02-25 | 2025-05-23 | 瑞度(北京)电子技术有限公司 | A low temperature ceramic phased array antenna and its manufacturing process |
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