CN113008353A - Integrated multi-array-element small transducer array design method and small transducer array - Google Patents

Abstract

Translated fromChinese

本发明提供了一种集成式多阵元的小型换能器基阵设计方法及小型换能器基阵，解决现有多波束成像声纳为了获得高分辨率图像，采用大规模的换能器基阵，整体结构复杂、硬件成本较高、加工引线复杂的问题。该设计方法包括：1)确定基阵中阵元的基本布局结构；2)确定阵元的材质和尺寸；3)设计电路板；4)焊接基阵阵元完成小型换能器基阵设计。

The invention provides an integrated multi-array element small transducer base array design method and a small transducer base array, which solve the problem that the existing multi-beam imaging sonar adopts large-scale transducers in order to obtain high-resolution images. Array, the overall structure is complex, the hardware cost is high, and the processing leads are complex. The design method includes: 1) determining the basic layout structure of the array element in the array; 2) determining the material and size of the array element; 3) designing the circuit board; 4) welding the array element to complete the design of the small transducer array.

Description

Integrated multi-array-element small transducer array design method and small transducer array

Technical Field

The invention belongs to the technical field of underwater acoustic transducers, and particularly relates to an integrated multi-array-element small transducer array design method and a small transducer array.

Background

With the continuous promotion of the national ocean strategic layout, the scientific and technological investment of China in the aspects of ocean resource exploration and national ocean equity maintenance is continuously increased. With the continuous increase of human ocean exploration and development activities, high-quality real-time underwater imaging technology is more and more concerned by people, and plays an important role in the aspects of target tracking identification, ocean landform exploration, mine search and the like.

The multi-beam imaging sonar is used as an important device for underwater detection, and is applied in a large range. Underwater acoustic imaging generally employs an array of multiple array elements to perform echo reception and beam weighting processing to form a high-gain, low-sidelobe beam pattern.

However, in order to obtain a high-resolution image, a multi-beam imaging sonar is often provided with a large-scale transducer array, and because the array frequency is high, the number of array elements is large, the spacing is small, normal lead wires are difficult to meet the requirement of array arrangement, and meanwhile, the system structure is complex, so that the system hardware cost is high.

Disclosure of Invention

The invention aims to solve the problems that the existing multi-beam imaging sonar adopts a large-scale transducer array to obtain a high-resolution image, the whole structure is complex, the hardware cost is high, and the processing lead is complex, and provides an integrated multi-array element small transducer array design method and a small transducer array.

In order to achieve the purpose, the technical solution provided by the invention is as follows:

an integrated multi-array element small transducer array design method is characterized by comprising the following steps:

1) determining basic layout structure of array elements in matrix

Designing array elements of the transducer array according to the performance requirement of the transducer array; the measurement standard of the performance requirement mainly depends on the related technical indexes of the transducer array, and specifically comprises the following steps: resonant frequency, horizontal and vertical lateral accuracy, beam number, horizontal and vertical working sectors and array element spacing;

determining the number of rows of array elements in a transducer array as M, the number of columns as M, the number as S as M multiplied by M, the distance between adjacent array elements as D, and sharing the negative electrode by the S array elements to reduce the number of leads; wherein M is a positive integer;

2) determining the material and size of array elements

Simulating array elements with different sizes and materials by adopting finite element simulation software, carrying out impedance characteristic simulation calculation, obtaining the resonant frequency of the array elements according to the admittance curve calculated by simulation, and determining the material and the size of the array elements meeting the performance requirements (namely the design requirements) of the transducer array;

3) designing a circuit board

3.1) determining the layer number of the circuit board according to the array element number and the lead wire mode in the step 1), and designing the circuit board into multiple layers; because the line distance of the circuit board connecting lines has a certain rule, the more the array elements are, in order to meet the requirement of a miniaturized structure of a basic array, the circuit board also needs to meet the requirement of wiring by increasing the layer number of the circuit board within a limited range under a certain size, and the problem of difficult connecting lines in the past is solved;

3.2) arranging S welding pads with the distance of D on the uppermost circuit board to form a welding pad area;

3.3) M rows and M/2 columns of through holes are respectively arranged on two opposite sides outside the bonding pad area on the circuit board, and the other two sides are respectively provided with GND and a plurality of positioning holes; the through hole, the positioning hole and the GND all penetrate through the whole circuit board;

3.4) the whole circuit board is in copper-clad connection with GND so as to reduce the impedance of the ground wire and improve the anti-interference capability; the voltage drop is reduced, and the power supply efficiency is improved; and is connected with the ground wire, so that the loop area is reduced;

4) welding matrix array element

4.1) welding the array elements with the determined materials and sizes in the step 2) on each bonding pad in a mode that the anode is downward and the cathode is upward on the bonding pad area set in the step 3);

4.2) decoupling each array element;

4.3) connecting the negative electrodes of all the array elements into a whole to realize that S array elements share the negative electrode;

and 4.4) outputting the whole cathode from the GND of the circuit board, and leading out the anodes of all the array elements from the through holes in a one-to-one correspondence manner to complete the design of the array of the small transducer.

Further, in order to detect the product quality, the method also comprises the following steps: step 5) Performance testing

And 4) carrying out impedance test on each array element of the transducer array obtained in the step 4), namely testing the conduction performance of the circuit board.

Further, in the step 2), the finite element simulation software is COMSOL, the software has strong simulation calculation capability, accurate and visual simulation result, simple operation and easy operation, is convenient for model building, and simulates common software for simulating the work of the transducer.

Further, in order to position the array elements in the later stage, in step 3.2), grid lines are drawn on each pad. Therefore, each array element in step 4) is positioned by the grid lines.

Furthermore, the gaps between adjacent array elements are filled with glass cement, and each array element is subjected to decoupling treatment, namely, the interference between the array elements is prevented; in addition to this, the decoupling process can also be performed in other ways, for example: and connecting adjacent array elements by using a decoupling framework.

Furthermore, copper sheets are welded above the array element cathodes (due to good welding of the copper sheets and good conductivity), S array element cathodes are achieved to be shared by the S array elements, the array element cathodes are all connected together through a circuit board, the number of leads is reduced, the array is made into an integrated structure, and the S array element cathodes can be achieved in a connection mode; and outputting the whole cathode from the GND of the circuit board, and leading out the anodes of the array elements from the through holes in a one-to-one correspondence manner to complete the design of the array of the small transducer.

Further, in step 5), an impedance analyzer is used for performing impedance test on each array element of the transducer array obtained in step 4). The related parameters of the transducer can be accurately and intuitively obtained by using the instrument.

The invention also provides an integrated multi-array element small transducer array, which is characterized in that: the product is made by the above design method.

The invention has the advantages that:

1. the invention designs the small-size array element with high integration level through simulation, has the advantage of high frequency, can reduce the design scale of the transducer system, simplifies the structure and improves the performance of the transducer array.

2. The multilayer circuit board is designed, leads can be conveniently led, the number of the leads on each layer of the circuit board with a certain size is limited due to the certain distance limit between every two leads of the circuit board, and the leads need to be layered when the number of the leads is too large so as to be conveniently and orderly arranged; the cathodes of the S array elements are grounded, the anodes of the S array elements are divided into two parts and are led out through holes on two sides of the pad area in a layered mode, and the anode leads are arranged in order, so that great convenience is brought to subsequent data acquisition work.

3. The transducer array designed by the invention has the advantages of simple structure, easy operation and miniaturization, and can be applied to platforms such as UUV, AUV and the like.

Drawings

FIG. 1 is a schematic diagram of a transducer array structure;

FIG. 2 is a diagram of a simulation model of a single array element in COMSOL;

FIG. 3 is a graph of admittance curves obtained from a single array element by simulation calculation under the condition that both the material and the size meet the design conditions;

FIG. 4 is a diagram of a circuit board PCB for transducer matrix wiring;

FIG. 5 is a pictorial view of transducer matrix welding;

FIG. 6 is a diagram of impedance characteristic measurement of a single array element;

the reference numbers are as follows:

the array comprises a 1-array, a 2-common cathode base plate, 3-array elements, 4-circuit boards, 5-positioning holes, 6-GND, 7-through hole regions, 8-welding pad regions and 9-grid lines.

Detailed Description

The invention is described in further detail below with reference to the following figures and specific examples:

the design method of the integrated multi-array element small transducer array comprises the following steps:

1) determining basic layout structure of array elements in matrix

According to the performance requirements (such as resonant frequency more than 300kHz, array element spacing more than half wavelength, different application platforms and different performance requirements) of the transducer array, designing the array elements in the transducer array to have the row number of 48, the column number of 48 and the number of 2304, and designing the array elements to have the spacing of 5mm (for reducing the number of the array elements, increasing the gaps among the array elements and reducing mutual interference, arranging by adopting one wavelength as shown in figure 1), wherein all the array elements share a cathode;

2) determining the material and size of array elements

In COMSOL finite element simulation software, establishing a simulation model (as shown in figure 2) of a single array element, defining a hemisphere as a water area, setting the innermost water area as a far-field water area, setting the surface of the sphere as a perfect matching layer, and obtaining the array element through simulation calculation, wherein the material of the array element is PZT-5, the length of the array element is 3.7mm, the width of the array element is 3.7mm, and the resonance frequency of the array element when the height of the array element is 3.7mm is more than 300kHz (as shown in figure 3), so that the design requirement is met at the moment, and the material and the size of the array element are determined;

3) designing a circuit board

Since each transducer element of the array needs to lead out a line, and the gap between each transducer is only 1.3mm, it is impossible to lead out the line from the gap of each transducer. The method comprises the steps that lines of each transducer array element are led out by utilizing a PCB (see figure 4), the number of layers of the circuit board is determined to be 8 layers (the number of array elements is 2304, the space between pads is 5mm, the diameter of each pad is 3mm, the gap between every two pads is 2mm according to the number of the array elements and the lead mode (common negative pole) instep 1, at most 3 lines can be led out from two rows of pads in each layer of the circuit board, 24 lines can be just led out to 24 through holes on the left side and the right side by 8 layers, the first 24 pads of each row are connected to the 24 through holes on the left side, the second 24 pads are connected to the 24 through holes on the right side, 2304 pads with the space of 5mm and the diameter of 3mm are arranged on the circuit board on the uppermost layer, a 4mm x 4mm grid line is drawn on each pad (for later-stage welding array element positioning), and a; respectively arranging 48 rows of through holes and 24 columns of through holes on two opposite sides outside a bonding pad area on the circuit board to form a through hole area; the other two sides are respectively provided with GND and 5 positioning holes; then the whole circuit board is in copper-clad connection with GND;

4) welding matrix array element

Welding array elements (as shown in figure 5) with determined materials and sizes on each pad in the step 2) in a mode that the positive electrode faces downwards and the negative electrode faces upwards in the set pad area, filling gaps between adjacent array elements with glass cement to prevent interference between the array elements, welding copper sheets above the negative electrodes of the array elements to form a common negative electrode bottom plate (to realize common negative electrode), outputting the whole negative electrodes from GND (ground) of the circuit board, and leading out the positive electrodes of each array element from through holes on two sides in a one-to-one correspondence mode;

5) performance testing

In order to detect the quality, an impedance analyzer is utilized to perform impedance test (as shown in fig. 6) on each array element of the transducer array obtained in the step 4), and the test results show that the resonance frequency of 2304 array elements is basically over 300kHz, so that the design requirement of array element consistency is met, and the circuit board has good conductivity.

Therefore, the small transducer array designed by the method can meet the performance requirement, and has the advantages of simple integral structure, lower hardware cost and orderly leads.

Claims (8)

Translated fromChinese

1.一种集成式多阵元的小型换能器基阵设计方法，其特征在于，包括以下步骤：1. a miniature transducer array design method of an integrated multi-array element, is characterized in that, comprises the following steps:1)确定基阵中阵元的基本布局结构1) Determine the basic layout structure of the array elements in the array根据换能器基阵的性能需求，对换能器基阵的阵元进行设计；According to the performance requirements of the transducer array, the array elements of the transducer array are designed;确定换能器基阵中阵元的行数为M、列数为M、数量为S＝M×M，相邻阵元的间距为D，并且S个阵元共负极；其中，M为正整数；It is determined that the number of rows of array elements in the transducer array is M, the number of columns is M, the number is S=M×M, the distance between adjacent array elements is D, and the S array elements have a common negative electrode; where M is positive integer;2)确定阵元的材质和尺寸2) Determine the material and size of the array element采用有限元仿真软件，模拟不同尺寸和材质的阵元，并进行阻抗特性仿真模拟计算，得到阵元的谐振频率，确定满足换能器基阵性能需求的阵元材质和尺寸；The finite element simulation software is used to simulate array elements of different sizes and materials, and the impedance characteristic simulation calculation is carried out to obtain the resonant frequency of the array element, and to determine the array element material and size that meet the performance requirements of the transducer array;3)设计电路板3) Design the circuit board3.1)根据步骤1)中阵元数量和引线方式确定电路板的层数，将电路板设计为多层；3.1) Determine the number of layers of the circuit board according to the number of array elements and the lead mode in step 1), and design the circuit board as a multi-layer;3.2)在最上层电路板设置S个、间距为D的焊盘，形成焊盘区；3.2) Set S pads with a spacing of D on the uppermost circuit board to form a pad area;3.3)在电路板上焊盘区外相对两侧分别设置M行、M/2列个通孔，另外两侧分别设置GND和多个定位孔；3.3) M rows and M/2 columns of through holes are set on opposite sides outside the pad area on the circuit board, respectively, and GND and multiple positioning holes are set on the other two sides respectively;3.4)电路板整体覆铜接GND；3.4) The overall copper cladding of the circuit board is connected to GND;4)焊接基阵阵元4) Welding basic array elements4.1)在步骤3)所设置的焊盘区上，以正极向下、负极向上的方式给每个焊盘上焊接步骤2)确定材质和尺寸的阵元；4.1) On the pad area set in step 3), weld the array element of step 2) to determine the material and size of each pad with the positive pole down and the negative pole up;4.2)对各个阵元进行去耦处理；4.2) Decoupling each array element;4.3)将所有阵元的负极连接成一体，实现S个阵元共负极；4.3) Connect the negative poles of all array elements into one, to realize the common negative pole of S array elements;4.4)将负极整体从电路板的GND输出，将每个阵元的正极从通孔一一对应引出，完成小型换能器基阵设计。4.4) Output the entire negative electrode from the GND of the circuit board, and lead the positive electrode of each array element from the through hole one by one to complete the design of the small transducer array.2.根据权利要求1所述集成式多阵元的小型换能器基阵设计方法，其特征在于，还包括：2. The small transducer base array design method of the integrated multi-array element according to claim 1, is characterized in that, also comprises:步骤5)性能测试Step 5) Performance Test对步骤4)中得到的换能器基阵的每个阵元进行阻抗测试。Impedance test is performed on each array element of the transducer array obtained in step 4).3.根据权利要求1或2所述集成式多阵元的小型换能器基阵设计方法，其特征在于：3. according to the small transducer array design method of the described integrated multi-array element of claim 1 and 2, it is characterized in that:步骤2)中，所述有限元仿真软件为COMSOL。In step 2), the finite element simulation software is COMSOL.4.根据权利要求3所述集成式多阵元的小型换能器基阵设计方法，其特征在于：4. the miniature transducer base array design method of the integrated multi-array element according to claim 3, is characterized in that:步骤3.2)中，在每个焊盘上均画出网格线。In step 3.2), grid lines are drawn on each pad.5.根据权利要求4所述集成式多阵元的小型换能器基阵设计方法，其特征在于：5. the miniature transducer array design method of the integrated multi-array element according to claim 4, is characterized in that:步骤4.2)中，采用玻璃胶填涂相邻阵元的间隙，对各个阵元进行去耦处理。In step 4.2), the gaps between adjacent array elements are filled with glass glue, and each array element is decoupled.6.根据权利要求5所述集成式多阵元的小型换能器基阵设计方法，其特征在于：6. the miniature transducer array design method of the integrated multi-array element according to claim 5, is characterized in that:步骤4.3)中，在阵元负极上方焊接铜皮实现S个阵元共负极。In step 4.3), a copper sheet is welded on the negative electrode of the array element to realize a common negative electrode of the S array elements.7.根据权利要求2所述集成式多阵元的小型换能器基阵设计方法，其特征在于：7. the miniature transducer base array design method of the integrated multi-array element according to claim 2, is characterized in that:步骤5)中，利用阻抗分析仪对步骤4)得到的换能器基阵的每个阵元进行阻抗测试。In step 5), impedance test is performed on each array element of the transducer array obtained in step 4) by using an impedance analyzer.8.一种集成式多阵元的小型换能器基阵，其特征在于：采用权利要求1～7任一设计方法制作而成。8. An integrated multi-array element miniature transducer array, characterized in that: it is manufactured by adopting any one of the design methods of claims 1-7.

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