Movatterモバイル変換


[0]ホーム

URL:


CN112967958B - Epitaxial film growth device and separation method - Google Patents

Epitaxial film growth device and separation method
Download PDF

Info

Publication number
CN112967958B
CN112967958BCN202110362396.4ACN202110362396ACN112967958BCN 112967958 BCN112967958 BCN 112967958BCN 202110362396 ACN202110362396 ACN 202110362396ACN 112967958 BCN112967958 BCN 112967958B
Authority
CN
China
Prior art keywords
hole
clamp ring
clamping ring
film growth
epitaxial film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110362396.4A
Other languages
Chinese (zh)
Other versions
CN112967958A (en
Inventor
王会会
林保璋
金補哲
田才忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SGS Ningbo Semiconductor Technology Co Ltd
Original Assignee
SGS Ningbo Semiconductor Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Ningbo Semiconductor Technology Co LtdfiledCriticalSGS Ningbo Semiconductor Technology Co Ltd
Priority to CN202110362396.4ApriorityCriticalpatent/CN112967958B/en
Publication of CN112967958ApublicationCriticalpatent/CN112967958A/en
Application grantedgrantedCritical
Publication of CN112967958BpublicationCriticalpatent/CN112967958B/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

Links

Classifications

Landscapes

Abstract

The invention discloses epitaxial film growth equipment and a separation method, wherein a separation pin device is arranged between a metal clamping ring and a metal substrate of the epitaxial film growth equipment, the separation pin comprises at least two connecting pieces with screws, the connecting pieces penetrate through the metal clamping ring, the top ends of the connecting pieces are abutted against the surface of the metal substrate, the metal clamping ring and a quartz piece are separated by utilizing the reverse force of the separation pin, and after the metal clamping ring and the quartz piece are separated, the metal clamping ring is moved, so that the safe separation of the metal clamping ring and the quartz piece is realized, and the probability of damaging the quartz piece is reduced.

Description

Epitaxial film growth equipment and separation method
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to epitaxial film growth equipment and a separation method.
Background
At present, chip manufacturing technology is rapidly developed, wherein the epitaxial growth technology is developed at the beginning of the last 60 s of the 50 s, in order to manufacture high-frequency high-power devices, the serial resistance of a collector needs to be reduced, and materials are required to be resistant to high voltage and high current, so that a thin high-resistance epitaxial layer needs to be grown on a low-resistance substrate, and epitaxial equipment is generated. When the extension machine is maintained or repaired, thirty kilograms of metal rings or metal discs are inevitably required to be opened, the metal weights are connected with the quartz pieces through the upper sealing rings, the quartz pieces are connected with the metal base plate through the lower sealing rings, the distance between the metal rings or the metal discs and the metal base plate is smaller than 1mm, and 8 screws are arranged on the metal rings or the metal discs and used for connecting the metal rings with the metal base plate or the metal discs with the metal base plate.
After loosening 8 screws, if the metal ring or the metal disc is manually opened, the force is not well controlled, and the lower quartz disc can be touched, so that the quartz piece is damaged.
Therefore, designing an epitaxial film growth apparatus capable of relatively easily separating a metal weight from a quartz member is a currently urgent problem to be solved.
Disclosure of Invention
The invention aims to provide epitaxial film growth equipment and a separation method, wherein a separation pin device is arranged between a metal clamping ring and a metal substrate of the epitaxial film growth equipment, the separation pin comprises at least two connecting pieces with screws, the connecting pieces penetrate through the metal clamping ring, the top ends of the connecting pieces are abutted against the surface of the metal substrate, the metal clamping ring and a quartz piece are separated by utilizing the reverse force of the separation pin, and after the metal clamping ring is separated from the quartz piece, the metal clamping ring is moved, so that the safe separation of the metal clamping ring and the quartz piece is realized, and the probability of damaging the quartz piece is reduced.
In a first aspect, the above object of the present invention is achieved by the following technical solutions:
The epitaxial film growth equipment comprises a metal clamping ring, an upper quartz disc and a metal substrate which are sequentially placed from top to bottom, wherein sealing devices are respectively arranged on the upper surface and the lower surface of the edge of the upper quartz disc and used for sealing between the upper quartz disc and the upper metal clamping ring or the metal substrate, and the epitaxial film growth equipment further comprises a separating pin device which is arranged on the upper metal clamping ring and used for integrally separating the upper metal clamping ring from the upper quartz disc.
The separating pin device further comprises a connecting piece with threads, wherein threads are arranged on the connecting piece, a through hole with threads on the inner wall is arranged on the upper metal clamping ring, the threads in the through hole are matched with the threads on the connecting piece, the position of the through hole is located on the outer side of the upper quartz disc, and the top end of the connecting piece passes through the through hole to be abutted to the upper surface of the metal substrate and is used for driving the metal clamping ring to move up and down when the connecting piece rotates.
The invention is further characterized in that at least two through holes are uniformly formed in the upper metal clamping ring, the separating pin devices are respectively arranged at the through holes, and the separating pin devices are arranged in the through holes.
The invention is further arranged that two ends of the same diameter of the upper metal clamping ring are respectively provided with a through hole, and the through holes are provided with separating pin devices.
The invention is further arranged in such a way that two diameters of the upper metal clamping ring are perpendicular to each other, a through hole is respectively arranged at two ends of each diameter, and a separating pin device is arranged in each through hole.
The invention is further arranged to provide a flexible garment over the top surface of the connector or over the entire surface of the connector for preventing the connector from abrading the surface of the metal substrate.
The invention further provides that the ductile outerwear material is polytetrafluoroethylene and is arranged on the surface of the top end part of the connecting piece or the whole surface of the connecting piece in a coating mode.
The invention is further arranged that the connecting piece adopts a flat head screw.
In a second aspect, the above object of the present invention is achieved by the following technical solutions:
A separation method of epitaxial film growth equipment includes rotating the first connecting piece and the second connecting piece on the same diameter of a metal clamping ring in the same direction by the same angle, selecting the third connecting piece and the fourth connecting piece on the other diameter perpendicular to the previous diameter, rotating the same angle in the same direction, and repeatedly rotating the connecting pieces until the whole metal clamping ring is separated from the whole upper quartz disc.
Compared with the prior art, the application has the beneficial technical effects that:
1. According to the application, the separating pin is arranged on the metal clamping ring, penetrates through the metal clamping ring and is abutted against the surface of the metal substrate, and the metal clamping ring is separated from the quartz piece by utilizing the reverse force generated when the separating pin rotates, so that the metal clamping ring and the quartz piece are easily separated, and the integrity of the quartz piece in the separation process is ensured;
2. furthermore, the protective layer is coated on the surface of the separating pin, so that the abrasion of the separating pin to the surface of the metal substrate is prevented, and the integrity of the metal substrate is ensured.
Drawings
FIG. 1 is a cross-sectional view of an epitaxial film growth apparatus according to one embodiment of the present application;
FIG. 2 is a top view of an epitaxial film growth apparatus according to one embodiment of the present application;
Fig. 3 is a partial cross-sectional view of an epitaxial film growth apparatus according to one embodiment of the present application.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The structure of the existing epitaxial film growth equipment is shown in fig. 1, and comprises an upper lamp holder 15, an upper metal clamping ring 2, a metal substrate 1, a lower metal clamping ring 13 and a lower lamp holder 17 which are sequentially arranged from top to bottom, wherein the upper lamp holder 15 is of a cubic groove structure with a downward opening, the lower lamp holder 17 is of a cubic groove structure with an upward opening, the upper metal clamping ring 2, the metal substrate 1 and the lower metal clamping ring 13 are respectively of square annular structures, and the upper metal clamping ring 2, the metal substrate 1 and the lower metal clamping ring 13 are sequentially arranged at the openings of the upper lamp holder 15 and the lower lamp holder 17 to form a cavity.
An upper quartz disc 4, a base 12, a base support 10 and a lower quartz bell jar 11 are arranged in the cavity, the upper quartz disc 4 and the lower quartz bell jar 11 form a sealing cavity, the base 12 and the base support 10 are arranged in the sealing cavity, the base 12 is arranged on the base support 10, the upper surface of the base 12 is of a platform structure, the disc edge of the upper quartz disc 4 is close to the upper surface of the metal substrate 1, a rotating motor 9 is positioned outside the cavity formed by an upper lamp bracket 15 and a lower lamp bracket 17, and a rotating motor 9 shaft is connected with the base support 10.
An upper lamp module 14 is provided on an inner sidewall of the upper lamp holder 15, and a lower lamp module 16 is provided on an inner sidewall of the lower lamp holder 17.
A rotating motor module is further arranged outside the bottom of the lower lamp bracket 17, and a motor shaft is connected with the base bracket and used for controlling the base 12 to rotate around the central shaft.
The upper quartz disc 4 is of an arc structure, a plane annular edge 4-1 is arranged at the edge of the arc, the annular edge 4-1 is positioned between the upper metal clamping ring 2 and the metal substrate 1, an upper sealing ring is arranged between the upper surface of the annular edge 4-1 and the lower surface of the upper metal clamping ring 2, and a lower sealing ring is arranged between the lower surface of the annular edge 4-1 and the upper surface of the metal substrate 1, which is not shown in the figure.
The distance between the upper metal clamping ring 2 and the metal base plate 1 is less than 1mm, the weight of the upper metal clamping ring 2 is about thirty kilograms, and in the working process, the upper metal clamping ring 2 is sometimes required to be separated from the upper quartz disc 4 and removed.
According to the application, the separation pin device 18 is arranged on the upper metal clamping ring 2, the threaded hole is arranged on the upper metal clamping ring 2, one end of the separation pin device 18 passes through the threaded hole to be abutted against the upper surface of the metal substrate 1, the other end of the separation pin device is positioned on or lower than or higher than the upper surface of the upper metal clamping ring 2, the surface of the separation pin device 18, which is contacted with the threaded hole, is provided with the matched threads, and the separation pin device 18 is rotated, so that the interval between the upper metal clamping ring 2 and the metal substrate 1 can be shortened or increased, and the compaction or separation of the upper metal clamping ring 2 and the metal substrate 1 can be realized.
Referring to fig. 2 and 3, fig. 3 is a top view of the epitaxial film growth apparatus of fig. 2, and fig. 3 is a cross-sectional view taken along line A-A in fig. 2, wherein the metal substrate 1 has a square frame structure, the upper metal clamping ring 2 is disposed on the metal substrate 1, the upper metal clamping ring 2 includes a circular ring 21 and circular ring epitaxial blocks, four circular ring epitaxial blocks are disposed at two ends of two diameters A-A and B-B perpendicular to each other of the circular ring 21, wherein the circular ring first epitaxial block 3-1 and the circular ring second epitaxial block 3-2 are disposed at two ends of the circular ring diameter A-A, and the circular ring epitaxial block 3-3 and the circular ring fourth epitaxial block 3-4 are disposed at two ends of the circular ring diameter B-B. The first to fourth extension blocks of the circular ring are integrated with the circular ring. The four extension blocks of the circular ring are symmetrical along the diameter and are positioned on the outer side of the upper quartz disc 4.
Two fixing devices which are symmetrical along the diameter are respectively arranged on each circular ring extension block and are used for fixing the upper metal clamping ring 2 and the metal substrate 1, specifically, a first fixing device 31 and a second fixing device 32 are arranged on the first extension block 3-1, a third fixing device 33 and a fourth fixing device 34 are arranged on the third extension block 3-3 along the anticlockwise direction, a fifth fixing device 35 and a sixth fixing device 36 are arranged on the second extension block 3-2, and a seventh fixing device 37 and an eighth fixing device 38 are arranged on the fourth extension block 3-4. The fixing devices are respectively positioned at a first diameter first end of the circular ring 21, a fifth fixing device 35 at a first diameter second end of the circular ring 21, a second fixing device 32 at a second diameter first end of the circular ring 21, a sixth fixing device 36 at a second diameter second end of the circular ring 21, a third fixing device 33 at a third diameter first end of the circular ring 21, a seventh fixing device 37 at a third diameter second end of the circular ring 21, a fourth fixing device 34 at a fourth diameter first end of the circular ring 21, and an eighth fixing device 38 at a fourth diameter second end of the circular ring 21, such that the first and third diameters are perpendicular to each other, the second and fourth diameters are perpendicular to each other, and the included angle between the first and second diameters is less than 45 degrees.
The fixing device is a fixing screw, when fixing the metal clamping ring 2 and the metal substrate 1, one fixing screw, such as the first fixing device 31, is fixed, then the fifth fixing device 35 on the first diameter is fixed, then the third fixing screw 33 on the third diameter perpendicular to the first diameter is selected for fixing, the seventh fixing device 37 on the third diameter is fixed in the fourth step, and similarly, the second fixing device 32, the sixth fixing device 36, the fourth fixing device 34 and the eighth fixing device 38 are sequentially fixed in sequence, so that the purpose of uniformly fixing the metal clamping ring 2 is achieved.
The order of loosening the upper metal clamping ring 2 and the metal substrate 1 is the same as that of fixing, in short, two fixing screws at two ends of a certain diameter are firstly loosened respectively, then the other diameter perpendicular to the former diameter is selected, the fixing screws at two ends of the fixing screws are loosened, and all the fixing screws are loosened according to the same order, so that the upper metal clamping ring 2 and the metal substrate 1 are uniformly loosened.
Handles are arranged on the first extension block 3-1 and the second extension block 3-2 which are positioned at the same diameter, a handle 311 is arranged on the first extension block 3-1 of the circular ring, and a handle 321 is arranged on the second extension block 3-2 of the circular ring and used for lifting the upper metal clamping ring 2.
An upper sealing ring 41 is arranged between the upper metal clamping ring 2 and the upper surface of the upper quartz disc 4, a lower sealing ring 42 is arranged between the lower surface of the upper quartz disc 4 and the upper surface of the metal substrate 1, and the upper metal clamping ring 2 is used for clamping the upper quartz disc 4.
According to the epitaxial film growth equipment, on the basis of the existing epitaxial film growth equipment, the separation pin device 18 is added, the separation pin device 18 is a threaded connecting piece and is arranged between the upper metal clamping ring 2 and the metal substrate 1, a through hole from the upper surface to the lower surface of the upper metal clamping ring 2 is formed in the epitaxial block of the upper metal clamping ring 2, threads are formed in the inner wall of the through hole, the threads in the through hole are matched with the threads on the connecting piece, the threaded connecting piece passes through the through hole, and the top end of the connecting piece is abutted to the upper surface of the metal substrate 1. The connecting piece is rotated, so that the upper metal clamping ring 2 can move up and down along the screw thread of the connecting piece, and when the upper metal clamping ring 2 moves up along the connecting piece, the upper metal clamping ring is separated from the upper quartz disc 4.
Specifically, in one embodiment of the present application, through holes are formed in only two extension blocks with one diameter, for example, one through hole is formed at each of two ends of the diameter of the circular ring A-A, one through hole is formed at each of the two ends of the diameter of the fifth through hole 5, the sixth through hole 6, or the diameter of the circular ring B-B, one through hole is formed at each of the two ends of the diameter of the circular ring B-B, one through hole is formed at each of the seventh through hole 7 and the eighth through hole 8, and a separating pin device is disposed at the through hole, wherein the separating pin is located on the central line of the extension block and is located outside the upper quartz disc 4.
In the process of separating the upper metal clamping ring 2 from the upper quartz disk 4, the separating pin positioned at the fifth through hole 5 is rotated for a certain angle, then the separating pin positioned at the sixth through hole 6 is rotated for the same angle in the same direction, the process is repeated until the upper metal clamping ring 2 is separated from the upper quartz disk 4, and then the upper metal clamping ring 2 is removed.
The angle of rotation is either half a revolution, or any other angle.
In a specific embodiment of the application, at both ends of the diameter where each epitaxial block is located, a fifth through hole 5, a sixth through hole 6, a seventh through hole 7, and an eighth through hole 8 are provided with separate pin means, respectively. The separate pins are identical in structure.
The separating pin device comprises a connecting piece, wherein threads are arranged on the connecting piece, one end of the connecting piece is abutted against the upper surface of the metal substrate after passing through the through hole, and the other end of the connecting piece is positioned on the upper surface of the upper metal clamping ring or is lower than or higher than or parallel to the upper surface of the upper metal clamping ring.
In the process of separating the upper metal clamping ring 2 from the upper quartz disc 4, the separating pin at the fifth through hole 5 is rotated for a certain angle, then the separating pin at the sixth through hole 6 is rotated for the same angle in the same direction, the separating pin at the seventh through hole 7 is rotated for the same angle in the same direction, finally the separating pin at the eighth through hole 8 is rotated for the same angle, and the above processes are repeated until the upper metal clamping ring 2 is separated from the quartz disc 4.
In one embodiment of the application, the connectors are uniformly distributed on the annular ring 21 of the upper metal clamping ring and are positioned outside the upper quartz disc 4, and are abutted from the upper surface of the upper metal clamping ring 2 to the upper surface of the metal substrate 1 through the through holes.
Specifically, the flat head screw is adopted as the connecting piece, and the flat structure at the top end of the flat head screw can prevent the connecting piece from wearing the upper surface of the metal substrate.
To further reduce the wear of the connector to the upper surface of the metal base plate, a malleable garment 18-1 is applied to the entire surface or top portion of the screw.
In particular, the flexible garment material is polytetrafluoroethylene.
The embodiments of the present invention are all preferred embodiments of the present invention, and are not limited in scope by the present invention, so that all equivalent changes according to the structure, shape and principle of the present invention are covered by the scope of the present invention.

Claims (5)

Translated fromChinese
1.一种外延膜生长设备,包括从上到下依次放置的上金属夹环、上石英圆盘、金属基板,在上石英圆盘边沿与上金属夹环之间设置上密封圈,在上石英圆盘边沿与金属基板之间设置下密封圈,用于上石英圆盘与上金属夹环或金属基板之间密封,其特征在于:还包括分离销装置,分离销装置设置在上金属夹环上,用于将上金属夹环整体与上石英圆盘整体分离;分离销装置包括带有螺纹的连接件,所述连接件表面设置有螺纹,在上金属夹环上设置内壁带有螺纹的贯穿孔,贯穿孔内的螺纹与连接件上的螺纹匹配,贯穿孔的位置位于上石英圆盘的外侧,连接件的顶端穿过贯穿孔抵接到金属基板的上表面,用于在连接件转动时,带动上金属夹环上下移动;在上金属夹环上均匀设置至少两个贯穿孔,在各贯穿孔处分别设置分离销装置;在上金属夹环的同一直径的两端,分别设置一个贯穿孔,在各贯穿孔中设置分离销装置;在上金属夹环相互垂直的两个直径,在每个直径的两端,分别设置一个贯穿孔,在各贯穿孔中设置分离销装置;上石英圆盘为圆弧结构,在圆弧的边沿处设置有平面圆环边沿。1. An epitaxial film growth device, comprising an upper metal clamp ring, an upper quartz disc, and a metal substrate, which are sequentially placed from top to bottom, an upper sealing ring is arranged between the edge of the upper quartz disc and the upper metal clamp ring, and a lower sealing ring is arranged between the edge of the upper quartz disc and the metal substrate, which is used to seal the upper quartz disc and the upper metal clamp ring or the metal substrate, characterized in that: it also includes a separation pin device, which is arranged on the upper metal clamp ring and is used to separate the upper metal clamp ring as a whole from the upper quartz disc as a whole; the separation pin device includes a connecting piece with a thread, the surface of the connecting piece is provided with a thread, a through hole with a thread on the inner wall is provided on the upper metal clamp ring, and the thread in the through hole is in contact with the connecting piece The thread on the upper quartz disc matches, the through hole is located on the outside of the upper quartz disc, the top of the connecting piece passes through the through hole and abuts against the upper surface of the metal substrate, which is used to drive the upper metal clamp ring to move up and down when the connecting piece rotates; at least two through holes are evenly arranged on the upper metal clamp ring, and a separation pin device is respectively arranged at each through hole; a through hole is respectively arranged at both ends of the same diameter of the upper metal clamp ring, and a separation pin device is arranged in each through hole; at two diameters of the upper metal clamp ring that are perpendicular to each other, a through hole is respectively arranged at both ends of each diameter, and a separation pin device is arranged in each through hole; the upper quartz disc is an arc structure, and a plane ring edge is arranged at the edge of the arc.2.根据权利要求1所述外延膜生长设备,其特征在于:在连接件顶端部位表面或连接件表面上设置韧性外衣,用于防止连接件磨损金属基板表面。2. The epitaxial film growth device according to claim 1 is characterized in that a tough outer coat is provided on the surface of the top part of the connector or on the surface of the connector to prevent the connector from wearing the surface of the metal substrate.3.根据权利要求2所述外延膜生长设备,其特征在于:所述韧性外衣的材料为聚四氟乙烯,以涂覆方式设置在连接件顶端部位表面或连接件表面。3. The epitaxial film growth device according to claim 2 is characterized in that the material of the tough outer coat is polytetrafluoroethylene, which is provided on the surface of the top part of the connector or the surface of the connector in a coating manner.4.根据权利要求1所述外延膜生长设备,其特征在于:连接件采用平头螺丝。4. The epitaxial film growth device according to claim 1, characterized in that the connecting piece adopts a flat head screw.5.一种外延膜生长设备的分离方法,其特征在于:应用于权利要求1到4任一所述的外延膜生长设备,先将位于上金属夹环同一直径上的第一连接件、第二连接件,分别沿同一方向转动相同角度;再选择与前一直径垂直的另一直径上的第三连接件及第四连接件,分别沿同一方向转动相同角度,重复转动各连接件,直至将上金属夹环整体与上石英圆盘整体分离。5. A method for separating an epitaxial film growth device, characterized in that: applied to the epitaxial film growth device described in any one of claims 1 to 4, firstly, the first connecting member and the second connecting member located on the same diameter of the upper metal clamp ring are rotated in the same direction by the same angle; then, the third connecting member and the fourth connecting member on another diameter perpendicular to the previous diameter are selected and rotated in the same direction by the same angle, and the rotation of each connecting member is repeated until the upper metal clamp ring is separated from the upper quartz disc as a whole.
CN202110362396.4A2021-04-022021-04-02 Epitaxial film growth device and separation methodActiveCN112967958B (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN202110362396.4ACN112967958B (en)2021-04-022021-04-02 Epitaxial film growth device and separation method

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN202110362396.4ACN112967958B (en)2021-04-022021-04-02 Epitaxial film growth device and separation method

Publications (2)

Publication NumberPublication Date
CN112967958A CN112967958A (en)2021-06-15
CN112967958Btrue CN112967958B (en)2024-12-31

Family

ID=76281093

Family Applications (1)

Application NumberTitlePriority DateFiling Date
CN202110362396.4AActiveCN112967958B (en)2021-04-022021-04-02 Epitaxial film growth device and separation method

Country Status (1)

CountryLink
CN (1)CN112967958B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN113629002A (en)*2021-08-182021-11-09盛吉盛(宁波)半导体科技有限公司 A pedestal support device for epitaxial film growth equipment and its use method

Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2006278631A (en)*2005-03-292006-10-12Hitachi Kokusai Electric Inc Semiconductor manufacturing equipment
CN203462174U (en)*2013-09-212014-03-05瀚天天成电子科技(厦门)有限公司Top cover of reaction chamber for epitaxial growth of silicon carbide
CN214279928U (en)*2021-04-022021-09-24盛吉盛(宁波)半导体科技有限公司Epitaxial film growth equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20130025538A1 (en)*2011-07-272013-01-31Applied Materials, Inc.Methods and apparatus for deposition processes
EP4138121A1 (en)*2015-10-092023-02-22Applied Materials, Inc.Diode laser for wafer heating for epi processes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2006278631A (en)*2005-03-292006-10-12Hitachi Kokusai Electric Inc Semiconductor manufacturing equipment
CN203462174U (en)*2013-09-212014-03-05瀚天天成电子科技(厦门)有限公司Top cover of reaction chamber for epitaxial growth of silicon carbide
CN214279928U (en)*2021-04-022021-09-24盛吉盛(宁波)半导体科技有限公司Epitaxial film growth equipment

Also Published As

Publication numberPublication date
CN112967958A (en)2021-06-15

Similar Documents

PublicationPublication DateTitle
CN112967958B (en) Epitaxial film growth device and separation method
US5213349A (en)Electrostatic chuck
JP7408726B2 (en) CMP machines with increased throughput and process flexibility
US7661183B2 (en)Blade changing tool
JP2006057185A (en) Substrate holder for vapor deposition system
CN214279928U (en)Epitaxial film growth equipment
CN104152858B (en)Magnetron sputtering coating fixture compatible with substrates with different sizes and different films
JP7055806B2 (en) Board processing equipment
JP5146056B2 (en) Semiconductor device manufacturing method and semiconductor device support device
CN101062547A (en)Lens and processing method thereof
CN105448785B (en)Semiconductor film-forming apparatus, wafer automatic positioning clamping structure and method for chucking
CN209477960U (en) A vacuum adsorption type planetary wheel fixture
TW201615365A (en)Multi-component robotic hub mounting plate to facilitate hub removal
CN212375373U (en) A coating fixture for spherical parts for physical vapor deposition
CN205452245U (en)Semiconductor film forming equipment, substrate automatic positioning clamping structure
CN212146133U (en)Jewelry processing positioner
JP4140848B2 (en) Electroforming jig for optical disc stamper production
CN212907691U (en)A handheld anchor clamps for single face wet etching
KR102382452B1 (en)Anti-slip pad for convex, concave and flat wafer transfer robot arm
US6729834B1 (en)Wafer manipulating and centering apparatus
CN2639315Y (en) Substrate carrier for coating equipment
CN2717583Y (en)Chuck with automatic centring function
CN113355642B (en)Optical coating pressing-in device
CN220999827U (en)Wafer film deposition jig and wafer film deposition equipment
CN205452244U (en)Semiconductor film forming equipment, wafer automatic positioning clamping structure

Legal Events

DateCodeTitleDescription
PB01Publication
PB01Publication
SE01Entry into force of request for substantive examination
SE01Entry into force of request for substantive examination
GR01Patent grant
GR01Patent grant

[8]ページ先頭

©2009-2025 Movatter.jp