Disclosure of Invention
The invention provides a touch module and a touch device, which can improve the production efficiency and the application range of a touch panel.
In order to solve the above technical problems, embodiments of the present invention provide a touch module and a touch device, which are used for connecting with a circuit board, and include: a substrate, a touch electrode arranged on the substrate, a first touch electrode wire connected with the touch electrode, and a second touch electrode wire connected with the first touch electrode wire; the substrate comprises a first bonding area and a second bonding area which are connected with the circuit board, the first bonding area and the second bonding area are arranged at intervals, one end of a first touch electrode wire is connected with the touch electrode, the other end of the first touch electrode wire is arranged in the first bonding area, one end of a second touch electrode wire is connected with the first touch electrode wire, and the other end of the second touch electrode wire is arranged in the second bonding area.
The embodiment of the invention also provides a touch device, which comprises: the touch module is as described above.
Compared with the prior art, the embodiment of the invention has the advantages that the first bonding area and the second bonding area are arranged on the substrate at intervals, one end of the first touch electrode wire is connected with the touch electrode, the other end of the first touch electrode wire is arranged in the first bonding area, one end of the second touch electrode wire is connected with the first touch electrode wire, and the other end of the second touch electrode wire is arranged in the second bonding area. Therefore, when the FPC is connected, the first bonding area or the second bonding area can be selected to be connected with the FPC according to the positions of the components in different electronic equipment, so that the possibility that the setting position of the FPC collides with other electronic components is reduced, and the production efficiency and the application range of the touch panel are improved.
In addition, the touch electrode comprises a plurality of touch electrode plates, each touch electrode plate comprises two first touch electrode wires connected to two ends of the touch electrode plate respectively, and the second touch electrode wires are connected with the first touch electrode wires in a one-to-one correspondence.
In addition, the touch electrode comprises a plurality of touch electrode plates, each touch electrode plate comprises two first touch electrode wires connected to two ends of the touch electrode plate respectively, and one second touch electrode wire is connected with any one of the two first touch electrode wires connected to two ends of the same touch electrode plate. The second touch electrode wiring is connected with any one of the two first touch electrode wirings connected to two ends of the same touch electrode sheet, so that the number of the second touch electrode wirings is reduced while the second touch electrode wiring can obtain complete touch electrode electric signals, and cost is effectively saved and space occupied by a second bonding region is effectively saved.
In addition, the method further comprises the steps of: the first insulating piece covers the second touch electrode wiring, exposes a terminal area for connecting with the first touch electrode wiring, and is connected with the terminal area; the first touch electrode wiring is arranged on the first insulating piece.
In addition, the touch electrode comprises a plurality of first electrode plates arranged on the surface of the substrate in a matrix manner, a plurality of second electrode plates arranged on the surface of the substrate in a staggered manner at intervals, a plurality of first conductive wires extending longitudinally and respectively electrically connected with adjacent first electrode plates, a plurality of second conductive wires extending transversely and electrically connected with adjacent second electrode plates and crossing the first conductive wires, and a plurality of second insulating pieces respectively arranged at the crossing positions of the first conductive wires and the second conductive wires and overlapped between the first conductive wires and the second conductive wires; the first insulator and the second insulator are prepared in the same layer. The first insulating piece and the second insulating piece are prepared in the same layer, so that the manufacturing process can be effectively simplified, and the manufacturing efficiency is improved.
In addition, the second touch electrode wire and the second conductive wire are prepared in the same layer.
In addition, the first touch electrode trace, the first electrode sheet, the second electrode sheet and the second conductive wire are prepared in the same layer.
In addition, the first electrode plate, the second electrode plate and the second conductive wire are all made of transparent conductive materials.
In addition, the material of the substrate is at least one selected from glass, acrylic, polyvinyl chloride, polypropylene, polyethylene terephthalate, polyethylene naphthalate and polycarbonate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that in various embodiments of the present invention, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a touch module, with a specific structure shown in fig. 1, including: the touch screen comprises a substrate 10, a touch electrode 20 arranged on the substrate 10, a first touch electrode wire 30 electrically connected with the touch electrode 20, and a second touch electrode wire 40 connected with the first touch electrode wire 30. The substrate 10 includes a first bonding area 11 and a second bonding area 12 that are disposed at intervals, the first bonding area 11 and the second bonding area 12 are respectively used for being connected with a circuit board, one end of a first touch electrode trace 30 is connected with a touch electrode 20, the other end is disposed in the first bonding area 11, one end of a second touch electrode 40 trace is connected with the first touch electrode trace 30, and the other end is disposed in the second bonding area 12.
Compared with the prior art, the touch module provided in this embodiment is provided with the first bonding area 11 and the second bonding area 12 spaced from each other, the first bonding area 11 is provided with the first touch electrode trace 30, and the second bonding area 12 is provided with the second touch electrode trace 40. Since the first touch electrode trace 30 is connected with the touch electrode 20, the second touch electrode trace 40 is connected with the first touch electrode trace 30, that is, the first touch electrode trace 30 and the second touch electrode trace 40 are both electrically connected with the touch electrode 20, whether the FPC is connected with the first bonding region 11 or the second bonding region 12, the connection between the FPC and the touch electrode 20 can be realized. Therefore, when the FPC is connected, the first bonding area 11 or the second bonding area 12 can be selected to be connected with the FPC according to the positions of the components in different electronic devices, so that the possibility that the setting position of the FPC collides with other electronic components is reduced, and the production efficiency and the application range of the touch panel are improved.
Specifically, in the present embodiment, the touch electrode 20 includes a plurality of touch electrode slices 21, as shown in fig. 2, each touch electrode slice 21 includes two first touch electrode traces 30 connected to two ends of the touch electrode slice 21, and in actual production, because the touch module is generally rectangular and has a long vertical distance, in order to reduce the impedance, the touch electrode slices 21 in the vertical direction are all outgoing lines at the same time from head to tail, i.e. a plurality of first touch electrode traces 30 are formed in the first bonding region 11. In this embodiment, as shown in fig. 3, the second touch electrode traces 40 are connected to the first touch electrode traces 30 in a one-to-one correspondence. The second touch electrode wires 40 are correspondingly connected with the first touch electrode wires 30 one by one, so that the second touch electrode wires 40 can be effectively ensured to acquire complete electrical signals generated by the touch electrode 20 through the first touch electrode wires 30, and the functional integrity of the FPC when connected with the second bonding area 12 is ensured.
In addition, in another embodiment of the present invention, as shown in fig. 3, the first insulating member 50 is further included, the first insulating member 50 covers the second touch electrode trace 40 and exposes the end region of the second touch electrode trace 40 for connecting with the first touch electrode trace 30, the first touch electrode trace 30 is connected with the end region, and the first touch electrode trace 30 is disposed on the first insulating member 50. The first touch electrode wire 30 and the second touch electrode wire 40 are arranged in a stacked mode, so that wire space can be effectively saved, in addition, the first insulating piece 50 is arranged between the first touch electrode wire 30 and the second touch electrode wire 40, error connection possibly generated between the first touch electrode wire 30 and the second touch electrode wire 40 can be effectively avoided, and circuit faults are reduced.
Further, in the present embodiment, as shown in fig. 4, the touch electrode 20 includes a plurality of first electrode pads 21 arranged on the surface of the substrate 10 in a matrix, a plurality of second electrode pads 22 arranged on the surface of the substrate 10 and alternately arranged between the first electrode pads 21 at intervals, a plurality of first conductive lines 23 extending longitudinally and electrically connected to the adjacent first electrode pads 21, a plurality of second conductive lines 24 extending transversely and electrically connected to the adjacent second electrode pads 22 and crossing the first conductive lines 23, and a plurality of second insulators 60 arranged at the crossing positions of the first conductive lines and the second conductive lines and stacked between the first conductive lines and the second conductive lines, respectively; the first insulator 50 and the second insulator 60 are prepared in the same layer. The first insulating member 50 and the second insulating member 60 are prepared in the same layer, so that the manufacturing process can be effectively simplified, and the manufacturing efficiency can be improved.
In addition, in the present embodiment, the second touch electrode trace 40 is prepared in the same layer as the second conductive line 60. The second touch electrode wiring 40 and the second conductive wire 24 are prepared in the same layer, so that the manufacturing process can be effectively simplified, and the manufacturing efficiency can be improved.
Further, in the present embodiment, the first touch electrode trace 30 is prepared on the same layer as the first electrode pad 21, the second electrode pad 22, and the second conductive wire 24. Because the first touch electrode trace 30, the first insulating member 50 and the second touch electrode trace 40 are of a three-layer mutually overlapped structure, the first conductive wire 23, the second insulating member 60 and the second conductive wire 24 are of a three-layer mutually overlapped structure, the second touch electrode trace 40 and the second conductive wire 60 are prepared in the same layer, the first insulating member 50 and the second insulating member 60 are prepared in the same layer, and the first touch electrode trace 30, the first electrode sheet 21, the second electrode sheet 22 and the first conductive wire 23 are prepared in the same layer, namely, only the preparation of the three-layer overlapped structure is needed during the preparation, so that the manufacturing process is effectively simplified, and the manufacturing efficiency is improved.
Preferably, in the present embodiment, the first electrode sheet 21, the second electrode sheet 22, and the second conductive line 23 are all made of transparent conductive materials. Such as ITO, IZO, etc. The material of the substrate 10 may be at least one selected from glass, acryl, polyvinyl chloride, polypropylene, polyethylene terephthalate, polyethylene naphthalate and polycarbonate.
The second embodiment of the invention relates to a touch module. The second embodiment is substantially the same as the first embodiment, and differs mainly in that: in the first embodiment, the second touch electrode traces 40 are connected to the first touch electrode traces 30 in a one-to-one correspondence. In the second embodiment of the present invention, as shown in fig. 5, one second touch electrode trace 40 is connected to any one of the two first touch electrode traces 30 connected to two ends of the same touch electrode pad.
Specifically, in the present embodiment, three first touch electrode traces 30, i.e., the first touch electrode traces 1/2/3/G in fig. 6 are used as an illustration, and fig. 3 and 6 are technical solutions in the first embodiment, in which the first touch electrode traces 1/2/3/G of the first bonding region 11 are connected to the second touch electrode traces 1/2/3/G of the second bonding region 12 in a one-to-one correspondence manner, so that 7 traces are required in total. Fig. 5 and fig. 7 show a technical solution in this embodiment, in which one second touch electrode trace 40 is connected to any one of two first touch electrode traces 30 connected to two ends of the same touch electrode pad, so only 4 second touch electrode traces need to be disposed in the second bonding area 40.
Compared with the prior art, the touch module provided by the second embodiment of the invention maintains all technical effects of the first embodiment, and simultaneously reduces the number of the second touch electrode wires 40 while ensuring that the second touch electrode wires 40 can obtain complete electrical signals of the touch electrode 20 by arranging one second touch electrode wire 40 to be connected with any one of the two first touch electrode wires 30 connected to two ends of the same touch electrode sheet, thereby effectively saving cost and space occupied by the second bonding region 12.
The following detailed description of the preparation process of the touch module provided by the foregoing implementation of the present application will be understood, but the following description is merely illustrative for clarity of illustration, and is not limited to the specific steps shown in fig. 8.
Step S101: and forming a second touch electrode wire and a second conductive wire on the substrate.
Specifically, as shown in fig. 9, the second touch electrode trace 40 and the second conductive line 23 are formed on the substrate 10.
Step S102: a first insulating member is formed on the second touch electrode trace, and a second insulating member is formed on the second conductive line.
Specifically, as shown in fig. 10, a first insulating member 50 is formed on the second touch electrode trace 40, and a second insulating layer 60 is formed on the second conductive line 24.
Step S103: the first electrode plates and the second electrode plates which are arranged in an array at intervals are formed, a first touch electrode wiring is formed on the first insulating piece, and a first conductive wire is formed on the second insulating layer.
Specifically, as shown in fig. 11, first electrode pads 21 and second electrode pads 22 arranged in an array at intervals are formed, first touch electrode traces 30 are formed on the first insulating member 50, and first conductive lines 23 are formed on the second insulating layer 60.
The above steps of the methods are divided, for clarity of description, and may be combined into one step or split into multiple steps when implemented, so long as they contain the same logic relationship, and they are all within the protection scope of this patent; it is within the scope of this patent to add insignificant modifications to the algorithm or flow or introduce insignificant designs, but not to alter the core design of its algorithm and flow.
Those skilled in the art will appreciate that all or part of the steps in implementing the methods of the embodiments described above may be implemented by a program stored in a storage medium, where the program includes several instructions for causing a device (which may be a single-chip microcomputer, a chip or the like) or processor (processor) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
A third embodiment of the present invention relates to a touch device, including: the touch module provided in any of the foregoing embodiments.
Compared with the prior art, the touch device provided by the third embodiment of the present invention includes the touch module provided by any one of the foregoing embodiments, so that the touch device also has the technical effects of the foregoing embodiments, and will not be described herein again.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the invention and that various changes in form and details may be made therein without departing from the spirit and scope of the invention.