CN112944800A - Cold insulation system capable of being used for sample preservation - Google Patents

Abstract

Translated fromChinese

本发明公开了一种可用于样本保存的保冷系统，包括半导体制冷片，还包括制冷能量交互模块、制冷循环动力模块及管路系统；所述制冷能量交互模块包括其上设置有腔体结构的盒体；所述管路系统包括首、尾端均连接在所述盒体上且与所述腔体结构相通的管路；所述管路系统还包括串联在所述管路上的制冷模块，所述制冷模块作为本保冷系统上的制冷工位；所述制冷循环动力模块作为所述管路中制冷液循环流动的动力源；所述半导体制冷片安装于所述盒体的外壁上，且半导体制冷片的冷端与所述盒体相贴。本系统整体结构简单，可有效保护半导体制冷片以及便于半导体制冷片的安装和维护。

The invention discloses a cold preservation system that can be used for sample preservation, comprising a semiconductor refrigeration sheet, a refrigeration energy exchange module, a refrigeration cycle power module and a pipeline system; the refrigeration energy exchange module includes a cooling energy exchange module with a cavity structure disposed thereon. a box body; the pipeline system includes a pipeline whose head and tail ends are connected to the box body and communicated with the cavity structure; the pipeline system also includes a refrigeration module connected in series on the pipeline, The refrigeration module is used as a refrigeration station on the cooling system; the refrigeration cycle power module is used as a power source for circulating refrigerant liquid in the pipeline; the semiconductor refrigeration chip is installed on the outer wall of the box, and The cold end of the semiconductor refrigeration sheet is attached to the box body. The overall structure of the system is simple, which can effectively protect the semiconductor refrigeration chip and facilitate the installation and maintenance of the semiconductor refrigeration chip.

Description

Cold insulation system capable of being used for sample preservation

Technical Field

The invention relates to the technical field of semiconductor refrigeration, in particular to a cold insulation system for sample preservation.

Background

Cryopreservation of samples is of great importance in fields such as medical and health testing. Similarly, low temperature preservation is also applied to the fields of article preservation and prolonging the life of materials.

The low-temperature preservation needs to be carried out by correspondingly refrigerating and storing the substances according to the characteristics of the substances. In the prior art, the method can be roughly divided into the following steps according to different process modes:

1. the compressor adopts fluorine cycle refrigeration and adopts the principle of gas heat absorption and heat release cycle refrigeration. The compressor mode is long in appearance, high in integration degree, high in efficiency in continuous upgrading and optimizing, and is widely used in life at present. However, in the gas circulation use, the fluorine is diffused into the atmosphere due to the imprecise sealing or the damaged and leaked pipeline, and the damage to the atmosphere is gradually limited;

2. the semiconductor refrigeration is based on the principle that semiconductor monocrystalline silicon is put into a ceramic wafer, one surface (cold end) of the semiconductor monocrystalline silicon is conveyed to the other surface (hot end) of the semiconductor monocrystalline silicon by utilizing the physical characteristics of the semiconductor monocrystalline silicon, and the single surface is lack of energy to reduce the temperature so as to achieve the patch refrigeration. A common use is local or small volume refrigeration. When the heat absorption box is used specifically, the semiconductor cold surface (cold end) is mainly in direct contact with the container in the installation mode, the hot surface (hot surface) is directly cooled by a fan or taken away by circulating liquid cooling after being converted by the heat absorption box, and the heat is dissipated outside the equipment through air cooling and liquid cooling.

Compared with the traditional compressor refrigeration, the semiconductor refrigeration has the characteristics of small volume and relatively simple structure, and is particularly suitable for single equipment in the medical and sanitary industries.

Further optimization of semiconductor refrigeration-based technologies will undoubtedly advance the use of semiconductor refrigeration in the industry.

Disclosure of Invention

Aiming at the technical problem that the semiconductor refrigeration-based technology is further optimized, and the application of the semiconductor refrigeration in the industry is undoubtedly promoted, the invention provides the cold insulation system for sample preservation.

The technical means of the scheme is as follows:

the cold insulation system comprises a semiconductor refrigeration sheet, a refrigeration energy interaction module, a refrigeration cycle power module and a pipeline system;

the refrigeration energy interaction module comprises a box body provided with a cavity structure;

the pipeline system comprises a pipeline with the head end and the tail end connected to the box body and communicated with the cavity structure; the pipeline system also comprises a refrigeration module which is connected in series on the pipeline and is used as a refrigeration station on the cold insulation system;

the refrigeration cycle power module is used as a power source for circulating and flowing of the refrigerant liquid in the pipeline;

the semiconductor refrigeration piece is arranged on the outer wall of the box body, and the cold end of the semiconductor refrigeration piece is attached to the box body.

In the existing semiconductor refrigeration application, the generally adopted mode is as follows: the semiconductor refrigeration piece is directly installed on a specific refrigeration station, after a hot surface (hot end) absorbs heat through a heat absorption box, corresponding heat is directly dissipated by using a fan or circulating liquid to take away the heat, and therefore the heat is dissipated outside the equipment through air cooling or liquid cooling. However, compared with the volume of the patch made of the semiconductor refrigerating sheet, the volume of the refrigerating container corresponding to the refrigerating station is larger, and the ceramic in the specific material of the existing semiconductor refrigerating sheet is brittle, so that the ceramic is very easy to crack under the condition of uneven stress caused by thermal deformation of the patch, and the energy conversion failure is caused. No matter adopt air-cooled heat dissipation or liquid cooling heat dissipation to take away the heat at paster hot end, need set up corresponding fan or the pump body, when corresponding fluid power equipment became invalid because of any reason, the hot end of paster generally can sharply heat up, if: within 1min, the temperature of the hot end can not rise to more than 85 ℃ even through heat dissipation, so that welding points of the patch external circuit fall off or contact is poor, surrounding liquid pipelines or gas circuits are softened or damaged by heat, and the sealing property and the service life of the fluid pipelines are influenced. When the air cooling mode is adopted to realize the cooling of the hot end of the patch, the poor heat dissipation caused by the dust accumulation on the heat dissipation surface is caused according to the specific working environment. Most of equipment utilizing semiconductor refrigeration is precision equipment or comprises precision components, and the equipment is very easy to lose efficacy or be abnormal in a severe temperature environment; in the process of maintaining and replacing the semiconductor refrigeration piece, the existing setting mode or installation mode is easy to appear: the operation is difficult, and the peripheral position has certain risks because the plugging pipeline influences the peripheral pipeline or structural components. Meanwhile, in the existing application, if the equipment is stopped due to failure or the external power supply is powered off, the semiconductor directly acts on the refrigeration container, and the restraint effect of the semiconductor refrigeration piece which stops working on the temperature rise of the equipment is extremely low due to the existing refrigeration mode, so that the temperature rise of the equipment is quickly caused by the structural specificity of the refrigeration container along with the influence of the external environment, the effective delay protection of the refrigerated object after the power failure cannot be effectively prolonged, the refrigerated object is deteriorated or invalid along with the temperature change, and the consumption and the waste of materials are increased.

Aiming at the application problem of the existing semiconductor refrigerating piece, the scheme provides a cold insulation system comprising the semiconductor refrigerating piece, and aims to effectively protect the semiconductor refrigerating piece and facilitate the installation and maintenance of the semiconductor refrigerating piece on the premise of simple integral structure.

In the specific structural design: the design is for the mutual module of refrigeration energy including being provided with the box body, matches pipe-line system and refrigeration cycle power module simultaneously, like this, is full of in corresponding box body and pipe-line system as the refrigerant liquid back of heat carrier, the semiconductor refrigeration piece is as the cooling part of the refrigerant liquid through the box body, and the refrigerant liquid is in simultaneously the refrigeration station acts as cold fluid for cool down corresponding material in refrigeration station position or environment. Through the arrangement mode, in the specific structural details, the semiconductor refrigerating sheet directly acts on the box body instead of the refrigerating station, and when the refrigerator is specifically used, the position of the box body can be reasonably matched through the pipeline system according to the environmental characteristics of a specific refrigerating place, so that the installation position of the semiconductor refrigerating sheet can be conveniently selected, the convenience in maintenance and operation is realized, and the semiconductor refrigerating sheet can work in a relatively ideal environment; the semiconductor refrigeration piece is directly arranged on the refrigeration station, the temperature field change degree of the position of the semiconductor refrigeration piece is relatively smaller, direct influence of a refrigerated object on the semiconductor refrigeration piece can be completely avoided, and the problem of breakage caused by uneven local stress of the semiconductor refrigeration piece in the use process can be effectively avoided; in this scheme, box body, pipe-line system can provide cold-storage material storage space, and after semiconductor refrigeration piece stop work, corresponding refrigerating fluid also can continue to exert the heat absorption function in a certain time for this cold insulation system has better guard action to specific refrigeration environment or effect thing under emergency. Meanwhile, the scheme is simple in structure and convenient to process, prepare and use.

The further technical scheme is as follows:

as a technical scheme capable of automatically operating, the method is characterized in that: the semiconductor refrigerating sheet is characterized by also comprising a control module and a heat dissipation module, wherein the heat dissipation module is used as a forced cooling component of the hot end of the semiconductor refrigerating sheet;

the control signal input ends of the refrigeration cycle power module, the heat dissipation module and the semiconductor refrigeration sheet are connected with the signal input end of the control module; the temperature sensor is connected to the signal input end of the control module and used for acquiring the temperature of the refrigeration station;

and the control module respectively controls the working states of the refrigeration cycle power module, the heat dissipation module and the semiconductor refrigeration sheet according to the feedback value of the temperature sensor. In the scheme, the feedback value of the temperature sensor is converted into specific control parameters of the refrigeration cycle power module, the heat dissipation module and the semiconductor refrigerating sheet after being calculated by the control module. If in the process of the temperature rise of the specific refrigeration station, the effect of the refrigerant liquid on the refrigeration station is increased, such as: the circulation of the refrigerating fluid is strengthened, the refrigerating power of the semiconductor refrigerating sheet is increased, and the heat dissipation power of the heat dissipation module which forcibly dissipates heat of the semiconductor refrigerating sheet is increased.

For make the circulation of coolant liquid more stable in this cold insulation system, realize simultaneously if the interior pressure variation buffer protection of coolant liquid boundary, set up to: the system also comprises a refrigerating fluid buffer tank connected in series on the pipeline system; the refrigeration cycle power module comprises a refrigeration cycle pump which is connected in series on the pipeline system, and the refrigeration cycle pump is positioned on a pipe section between a refrigerant liquid inlet and a refrigeration station outlet of the refrigeration energy interaction module. The refrigerating circulation pump is selected to work in the temperature environment which is closer to the normal temperature as far as possible.

As a simple structure, be convenient for simultaneously according to concrete component effect, the concrete material of reasonable selection to enclose into refrigerant liquid circulation border, make the semiconductor refrigeration piece can more efficient act on the technical scheme of refrigerant liquid, set up to: the box body is of an integrated structure or is formed by a plurality of box body plates in an enclosing way;

the semiconductor refrigerating sheet is arranged on one side plate of the box body;

the box body is characterized by further comprising a base plate which is located in the box body and attached to the inner side of the side plate, and a plurality of fins are further arranged on the base plate. In the scheme, the base plate and the fins are used as the heat conducting plates between the cold ends of the semiconductor refrigerating sheets and the refrigerating fluid, in the specific structural design, if the materials of the components which are enclosed into the box body are used, the corresponding requirements corresponding to the constraint boundaries of the refrigerating fluid are mainly considered, and the heat conducting plates are mainly considered to have heat transfer performance.

As a be convenient for if through processing, later maintenance, guarantee semiconductor refrigeration piece with the curb plate laminating degree is in order to do benefit to the technical scheme who conducts heat between the two, sets up to: still be provided with the mounting groove for the recess on the surface of curb plate, the semiconductor refrigeration piece install in the mounting groove. Aiming at the processing and the later maintenance, for example, the surface roughness of the bottom surface of the mounting groove is considered as much as possible during the processing, and the cleanliness of the bottom surface of the mounting groove is considered as much as possible during the maintenance or the mounting of the semiconductor refrigeration piece.

To the common material performance characteristics of current semiconductor refrigeration piece, as one kind can make the semiconductor refrigeration piece obtain through the mode of elasticity reply and last pressure, avoid simultaneously in the semiconductor refrigeration piece installation, because to corresponding connecting screw misoperation and cause the semiconductor refrigeration piece to appear the damage of being pressed, set up to: the semiconductor refrigeration piece is installed in the installation groove by pressing the heat dissipation module on the hot end;

the heat dissipation module is in threaded connection with the side plate through a connecting screw, and an elastic piece capable of elastically deforming in the axial direction of the connecting screw is arranged between the connecting screw and the heat dissipation module;

the pressure of the connecting screw on the heat dissipation module is transmitted through the elastic piece;

the specific connection point of the connecting screw on the side plate is positioned outside the mounting groove. In the scheme, the elastic deformation which can be generated by the elastic piece enables the connecting screw to apply pressure to the heat dissipation module within a certain travel range, and meanwhile, in the installation process of the connecting screw, such as single-side transition pressing, in the connection process of the other side, the transition pressing side has the freedom degree which can be far away from the semiconductor refrigeration sheet, so that the above-mentioned pressure damage condition is avoided; the continuous compression described above can be used, for example, to prevent the semiconductor chilling plates from loosening. The elastic part can adopt a compression spring, if the connecting screw adopts a single-head screw, the compression spring is sleeved on the single-head screw and is arranged between the outer surface of the heat dissipation module and a nut of the single-head screw.

As the technical personnel in this field, for doing benefit to the heat transfer between semiconductor refrigeration piece and the refrigerating fluid, the insulating material between semiconductor refrigeration piece and the refrigerating fluid is as thin as possible, be convenient for make the concrete hookup location of connecting screw be located the outside of mounting groove as one kind, so that if when the curb plate design, suitably increase its thickness, with the rigidity of reinforcing curb plate, reach the semiconductor refrigeration piece in the protection installation, adapt to a plurality of semiconductor refrigeration piece installations simultaneously and in order to increase this system refrigeration power, can more high-efficient technical scheme who conducts heat between single semiconductor refrigeration piece and the refrigerating fluid, set up to: the semiconductor refrigeration piece is in a plurality of quantity, and each semiconductor refrigeration piece all matches and has an independent mounting groove and heat dissipation module. The scheme also aims to realize independent heat dissipation of a single hot end so as to match the refrigeration power of the specific semiconductor refrigeration piece.

As a simple structure, can make the refrigerant fluid can be as far as possible relative to the heat transfer surface in the box body, accomplish the flow in the box body with the turbulent mode to strengthen heat transfer effect and effective heat transfer area, set up to: the fins are connected with the base plate in parallel and in an upright posture relative to the base plate;

the refrigerator also comprises a liquid inlet and a liquid outlet, wherein the liquid inlet is arranged on the box body and used for introducing the refrigerant into the box body, and the liquid outlet is used for leading the refrigerant out of the box body;

the direction of the orifice of the liquid inlet and the direction of the orifice of the liquid outlet are both parallel to the height direction of the fins.

As a technical scheme that the structure is simple, the flow channel area division is completed through the fins, so as to further optimize the heat transfer effect and the area of the heat transfer surface, the heat transfer surface area division method is characterized in that: the fins are arranged in rows;

one side of the fin connected with the base plate is a connecting side, and the opposite side of the connecting side is a free side;

the fins arranged in sequence along the arrangement direction of the fins are: the distance of the free side of the fin relative to the substrate changes, which is: the continuous fins form a plurality of groove bodies extending along the length direction of the fins on the free sides of the fins; the positions of the liquid inlet and the liquid outlet meet that: the refrigerant in the box body can flow along the length direction of the groove body. As a person skilled in the art, the fins are arranged in different heights to achieve the corresponding purposes: the free side of the fin at the relatively low position is used as the bottom surface or the side surface of the groove body, and the fin at the highest position is used as a dividing plate between the groove bodies.

As a be convenient for assemble, be convenient for simultaneously to match fluid flow form and fin distribution, simple structure, corresponding pore set up the technical scheme of a small quantity simultaneously, set up to: the base plate is a rectangular plate body, and the arrangement direction of the fins is the width direction of the base plate;

the fins arranged in order along the width direction of the base plate are: the change rule of the fin height is as follows: firstly, the height of the groove body is changed into a small height, and then the groove body is changed into a large height; then, a plurality of height change cycles are provided; a single height variation cycle forms a V-shaped groove on the free side;

the end parts of the fins in the same height change period are also provided with notches, two adjacent V-shaped grooves are communicated through the notches on the same side, and all the V-shaped grooves are sequentially connected in series through the notches to form a bent flow passage positioned on the free side;

the liquid inlet and the liquid outlet are both arranged on the substrate and are respectively positioned at the inlet position and the outlet position of the bent runner. The above notches can be obtained by arranging uneven fin end positions; separate notches may also be provided in the fins themselves. The uneven mode is preferably adopted to achieve the purpose of uniform flow distribution of the refrigerating fluid on the section of any point in the extension direction of the bent flow channel and the purpose of facilitating the refrigerating effect of the semiconductor refrigerating sheet.

The semiconductor refrigerating sheet can adopt the conventional Peltier with relatively low cost, high efficiency and stable performance.

The invention has the following beneficial effects:

in this cold insulation system's concrete structural design: the design is for the mutual module of refrigeration energy including being provided with the box body, matches pipe-line system and refrigeration cycle power module simultaneously, like this, is full of in corresponding box body and pipe-line system as the refrigerant liquid back of heat carrier, the semiconductor refrigeration piece is as the cooling part of the refrigerant liquid through the box body, and the refrigerant liquid is in simultaneously the refrigeration station acts as cold fluid for cool down corresponding material in refrigeration station position or environment. Through the arrangement mode, in the specific structural details, the semiconductor refrigerating sheet directly acts on the box body instead of the refrigerating station, and when the refrigerator is specifically used, the position of the box body can be reasonably matched through the pipeline system according to the environmental characteristics of a specific refrigerating place, so that the installation position of the semiconductor refrigerating sheet can be conveniently selected, the convenience in maintenance and operation is realized, and the semiconductor refrigerating sheet can work in a relatively ideal environment; the semiconductor refrigeration piece is directly arranged on the refrigeration station, the temperature field change degree of the position of the semiconductor refrigeration piece is relatively smaller, direct influence of a refrigerated object on the semiconductor refrigeration piece can be completely avoided, and the problem of breakage caused by uneven local stress of the semiconductor refrigeration piece in the use process can be effectively avoided; in this scheme, box body, pipe-line system can provide cold-storage material storage space, and after semiconductor refrigeration piece stop work, corresponding refrigerating fluid also can continue to exert the heat absorption function in a certain time for this cold insulation system has better guard action to specific refrigeration environment or effect thing under emergency. Meanwhile, the scheme is simple in structure and convenient to process, prepare and use.

Drawings

FIG. 1 is a system topology diagram of one embodiment of a piping system corresponding to a cold insulation system for sample preservation according to the present invention;

fig. 2 is a partial schematic view of an embodiment of a pipeline system corresponding to a cold insulation system for sample storage according to the present invention, and is a structural exploded view reflecting the matching relationship of a refrigeration energy interaction module, a semiconductor refrigeration chip, a heat dissipation module, etc.;

fig. 3 is a schematic structural diagram of a heat conducting plate in an embodiment of a piping system corresponding to the cold insulation system for sample preservation according to the present invention.

The reference numerals in the figures are respectively: 1. cold insulation layer, 2, box body board, 3, sealed pad, 4, heat-conducting plate, 5, curb plate, 6, semiconductor refrigeration piece, 7, heat radiation module, 8, mounting groove, 9, base plate, 10, fin, 11, inlet, 12, liquid outlet, 13, V-arrangement groove.

Detailed Description

The present invention will be described in further detail with reference to examples, but the structure of the present invention is not limited to the following examples.

Example 1:

as shown in fig. 1 to 3, the cold insulation system for sample storage includes asemiconductor refrigeration sheet 6, a refrigeration energy interaction module, a refrigeration cycle power module, and a pipeline system;

the refrigeration energy interaction module comprises a box body provided with a cavity structure;

the pipeline system comprises a pipeline with the head end and the tail end connected to the box body and communicated with the cavity structure; the pipeline system also comprises a refrigeration module which is connected in series on the pipeline and is used as a refrigeration station on the cold insulation system;

the refrigeration cycle power module is used as a power source for circulating and flowing of the refrigerant liquid in the pipeline;

thesemiconductor refrigerating sheet 6 is arranged on the outer wall of the box body, and the cold end of thesemiconductor refrigerating sheet 6 is attached to the box body.

In the existing semiconductor refrigeration application, the generally adopted mode is as follows: thesemiconductor refrigerating sheet 6 is directly installed on a specific refrigerating station, after a hot surface (hot end) absorbs heat through a heat absorption box, corresponding heat is directly dissipated by using a fan or circulating liquid to take away the heat, and therefore the heat is dissipated outside the equipment through air cooling or liquid cooling. However, compared with the volume of the patch made of thesemiconductor refrigerating sheet 6, the volume of the refrigerating container corresponding to the refrigerating station is larger, and the ceramic in the specific material of the existingsemiconductor refrigerating sheet 6 is brittle, so that the ceramic is very easy to crack under the condition of uneven stress caused by thermal deformation of the patch, and the energy conversion is ineffective. No matter adopt air-cooled heat dissipation or liquid cooling heat dissipation to take away the heat at paster hot end, need set up corresponding fan or the pump body, when corresponding fluid power equipment became invalid because of any reason, the hot end of paster generally can sharply heat up, if: within 1min, the temperature of the hot end can not rise to more than 85 ℃ even through heat dissipation, so that welding points of the patch external circuit fall off or contact is poor, surrounding liquid pipelines or gas circuits are softened or damaged by heat, and the sealing property and the service life of the fluid pipelines are influenced. When the air cooling mode is adopted to realize the cooling of the hot end of the patch, the poor heat dissipation caused by the dust accumulation on the heat dissipation surface is caused according to the specific working environment. Most of equipment utilizing semiconductor refrigeration is precision equipment or comprises precision components, and the equipment is very easy to lose efficacy or be abnormal in a severe temperature environment; in the process of maintaining and replacing thesemiconductor refrigeration sheet 6, the existing setting mode or installation mode is easy to appear: the operation is difficult, and the peripheral position has certain risks because the plugging pipeline influences the peripheral pipeline or structural components. Meanwhile, in the existing application, if the equipment is stopped due to failure or the external power supply is powered off, the semiconductor directly acts on the refrigeration container, and the restraint effect of thesemiconductor refrigeration sheet 6 on the temperature rise of the equipment after the equipment stops working is extremely low due to the existing refrigeration mode, so that the temperature rise of the equipment is quickly caused by the structural specificity of the refrigeration container along with the influence of the external environment, the effective delay protection of the refrigerated object after the power failure cannot be effectively prolonged, the refrigerated object is deteriorated or invalid along with the temperature change, and the loss and waste of materials are increased.

Aiming at the application problem of the existingsemiconductor refrigerating sheet 6, the scheme provides a cold insulation system comprising thesemiconductor refrigerating sheet 6, and aims to effectively protect thesemiconductor refrigerating sheet 6 and facilitate the installation and maintenance of thesemiconductor refrigerating sheet 6 on the premise of simple overall structure.

In the specific structural design: the design is for the mutual module of refrigeration energy including being provided with the box body, matches pipe-line system and refrigeration cycle power module simultaneously, like this, is full of in corresponding box body and pipe-line system as the refrigerant liquid back of heat carrier,semiconductor refrigeration piece 6 is as the cooling part of the refrigerant liquid through the box body, and the refrigerant liquid is in simultaneously the refrigeration station acts as cold fluid for cool down corresponding material in refrigeration station position or environment. Through the arrangement mode, in the specific structural details, thesemiconductor refrigerating sheet 6 directly acts on the box body instead of the refrigerating station, so that the position of the box body can be reasonably matched through the pipeline system according to the environmental characteristics of a specific refrigerating place during specific application, the installation position of thesemiconductor refrigerating sheet 6 can be conveniently selected, the convenience in maintenance and operation is achieved, and thesemiconductor refrigerating sheet 6 can work in a relatively ideal environment; different from the fact that thesemiconductor refrigerating sheet 6 is directly arranged on the refrigerating station, the temperature field change degree of the position of thesemiconductor refrigerating sheet 6 is relatively smaller, direct influence of a refrigerated object on thesemiconductor refrigerating sheet 6 can be completely avoided, and the problem of breakage caused by uneven local stress of thesemiconductor refrigerating sheet 6 in the using process can be effectively avoided; in this scheme, box body, pipe-line system can provide cold-storage material storage space, and aftersemiconductor refrigeration piece 6 stop work, corresponding refrigerating fluid also can continue to exert the heat absorption function in a certain time for this cold insulation system has better guard action to specific refrigeration environment or effect thing under emergency. Meanwhile, the scheme is simple in structure and convenient to process, prepare and use.

In this embodiment, a cold insulation layer 1 is provided for the box body and the pipeline system.

Example 2:

this example is further defined on the basis of example 1:

as a technical scheme capable of automatically operating, the method is characterized in that: the semiconductor refrigeration device also comprises a control module and aheat dissipation module 7, wherein theheat dissipation module 7 is used as a forced cooling component of the hot end of thesemiconductor refrigeration sheet 6;

the control signal input ends of the refrigeration cycle power module, theheat dissipation module 7 and thesemiconductor refrigeration sheet 6 are connected with the signal input end of the control module; the temperature sensor is connected to the signal input end of the control module and used for acquiring the temperature of the refrigeration station;

and the control module respectively controls the working states of the refrigeration cycle power module, theheat dissipation module 7 and thesemiconductor refrigeration sheet 6 according to the feedback value of the temperature sensor. In the scheme, the feedback value of the temperature sensor is converted into the control parameters of the specific refrigeration cycle power module, theheat dissipation module 7 and thesemiconductor refrigerating sheet 6 after being calculated by the control module. If in the process of the temperature rise of the specific refrigeration station, the effect of the refrigerant liquid on the refrigeration station is increased, such as: the circulation of the refrigerating fluid is strengthened, the refrigerating power of thesemiconductor refrigerating sheet 6 is increased, and the heat dissipation power of theheat dissipation module 7 which forcibly dissipates the heat of thesemiconductor refrigerating sheet 6 is increased.

Example 3:

this example is further defined on the basis of example 1:

for make the circulation of coolant liquid more stable in this cold insulation system, realize simultaneously if the interior pressure variation buffer protection of coolant liquid boundary, set up to: the system also comprises a refrigerating fluid buffer tank connected in series on the pipeline system; the refrigeration cycle power module comprises a refrigeration cycle pump which is connected in series on the pipeline system, and the refrigeration cycle pump is positioned on a pipe section between a refrigerant liquid inlet and a refrigeration station outlet of the refrigeration energy interaction module. The refrigerating circulation pump is selected to work in the temperature environment which is closer to the normal temperature as far as possible.

Example 4:

this example is further defined on the basis of example 1:

as a simple structure, be convenient for simultaneously according to concrete component effect, the concrete material of reasonable selection to enclose into the technical scheme that refrigerating fluid circulation border, makesemiconductor refrigeration piece 6 can more efficient act on the refrigerating fluid, set up to: the box body is of an integrated structure or is formed by a plurality ofbox body plates 2 in an enclosing way;

thesemiconductor refrigerating sheet 6 is arranged on oneside plate 5 of the box body;

the box body is characterized by further comprising abase plate 9 which is located in the box body and attached to the inner side of theside plate 5, and a plurality offins 10 are further arranged on thebase plate 9. In the scheme, thebase plate 9 and thefins 10 are used as theheat conducting plate 4 between the cold end of thesemiconductor refrigerating sheet 6 and the refrigerating fluid, in the specific structural design, if the material of the part which is enclosed into the box body is used, the corresponding requirement corresponding to the constraint boundary of the refrigerating fluid is mainly considered, and theheat conducting plate 4 is mainly considered only in terms of the heat transfer performance.

As a be convenient for if through processing, later maintenance, guaranteesemiconductor refrigeration piece 6 with the degree of laminating ofcurb plate 5 is in order to do benefit to the technical scheme who conducts heat between the two, set up to: still be provided with mountinggroove 8 for the recess on the surface ofcurb plate 5,semiconductor refrigeration piece 6 install in mountinggroove 8. For the above processing and later maintenance, for example, the surface roughness of the bottom surface of the mountinggroove 8 is considered as much as possible during processing, and the cleanliness of the bottom surface of the mountinggroove 8 is considered as much as possible during maintenance or mounting of thesemiconductor chilling plate 6.

Example 5:

this example is further defined on the basis of example 4:

to the common material performance characteristics of currentsemiconductor refrigeration piece 6, as one kind can makesemiconductor refrigeration piece 6 obtain through the mode of elastic recovery last pressure, avoid simultaneously in 6 installation of semiconductor refrigeration piece, because to corresponding connecting screw misoperation and causesemiconductor refrigeration piece 6 to appear the pressurized damage, set up to: thesemiconductor refrigeration piece 6 is arranged in the mountinggroove 8 by pressing theheat dissipation module 7 on the hot end;

theheat dissipation module 7 is in threaded connection with theside plate 5 through a connecting screw, and an elastic piece capable of elastically deforming in the axial direction of the connecting screw is arranged between the connecting screw and theheat dissipation module 7;

the pressure of the connecting screw on theheat dissipation module 7 is transmitted through the elastic piece;

the specific connection point of the connection screw on theside plate 5 is positioned outside the mountinggroove 8. In the scheme, the elastic deformation which can be generated by the elastic piece enables the connecting screw to apply pressure to theheat dissipation module 7 within a certain travel range, and meanwhile, in the installation process of the connecting screw, such as single-side transition pressing, in the connection process of the other side, the transition pressing side has the degree of freedom which can be far away from thesemiconductor refrigeration sheet 6, so that the above-mentioned pressure damage condition is avoided; the above-mentioned continuous compression can be used for example for the anti-loosening of thesemiconductor chilling plates 6. The elastic part can adopt a compression spring, if the connecting screw adopts a single-head screw, the compression spring is sleeved on the single-head screw and is arranged between the outer surface of theheat dissipation module 7 and a nut of the single-head screw.

As the technical personnel in this field, for doing benefit to the heat transfer betweensemiconductor refrigeration piece 6 and the refrigerating fluid, the insulating material betweensemiconductor refrigeration piece 6 and the refrigerating fluid is as thin as possible, be convenient for make the concrete hookup location of connecting screw be located the outside of mountinggroove 8 as one kind, so that if whencurb plate 5 design, suitably increase its thickness, in order to strengthen the rigidity ofcurb plate 5, reach thesemiconductor refrigeration piece 6 in the protection installation, adapt to a plurality ofsemiconductor refrigeration pieces 6 installation in order to increase this system refrigeration power simultaneously, can more high-efficient technical scheme who conducts heat between singlesemiconductor refrigeration piece 6 and the refrigerating fluid, set up to: the number of thesemiconductor refrigerating pieces 6 is multiple, and eachsemiconductor refrigerating piece 6 is matched with anindependent mounting groove 8 and aheat dissipation module 7. The scheme also aims to realize independent heat dissipation of a single hot end so as to match the refrigeration power of the specificsemiconductor refrigeration sheet 6.

As a simple structure, can make the refrigerant fluid can be as far as possible relative to the heat transfer surface in the box body, accomplish the flow in the box body with the turbulent mode to strengthen heat transfer effect and effective heat transfer area, set up to: thefins 10 are connected to thebase plate 9 in parallel with each other and in an upright posture with respect to thebase plate 9;

the refrigerator also comprises aliquid inlet 11 and aliquid outlet 12, wherein theliquid inlet 11 is arranged on the box body and used for introducing a refrigerant into the box body, and theliquid outlet 12 is used for leading the refrigerant out of the box body;

the opening direction of theliquid inlet 11 and the opening direction of theliquid outlet 12 are both parallel to the height direction of thefin 10.

As a technical scheme which has simple structure, the heat transfer effect and the area of a heat transfer surface are further optimized by completing the division of a flow channel area through thefins 10, the heat transfer device is arranged as follows: thefins 10 are arranged in rows;

the side of thefin 10 connected with thebase plate 9 is a connecting side, and the opposite side of the connecting side is a free side;

each of thefins 10 arranged in order along the arrangement direction of thefins 10 is: the distance of the free side of thefin 10 from thebase 9 varies as follows: thecontinuous fins 10 form a plurality of grooves extending along the length direction of thefins 10 on the free sides of the fins; the positions of theliquid inlet 11 and theliquid outlet 12 satisfy that: the refrigerant in the box body can flow along the length direction of the groove body. As a person skilled in the art, theabove fins 10 can be set to have different heights to achieve the corresponding purposes: the free side of thefin 10 located relatively low serves as the bottom or side of the slot and thefin 10 located highest serves as the dividing plate between the slots.

As a technical scheme that the assembly is convenient, the fluid flow form and the distribution of thefins 10 are convenient to match, the structure is simple, the corresponding pore channels are less in number, and the technical scheme is as follows: thebase plate 9 is a rectangular plate body, and the arrangement direction of thefins 10 is the width direction of thebase plate 9;

thefins 10 arranged in this order along the width direction of thebase plate 9 are: the rule of variation of the height of thefins 10 is: firstly, the height of the groove body is changed into a small height, and then the groove body is changed into a large height; then, a plurality of height change cycles are provided; the single period of height variation forms a V-shapedgroove 13 on the free side;

the end parts of thefins 10 in the same height variation period are also provided with gaps, two adjacent V-shapedgrooves 13 are communicated through the gaps on the same side, and all the V-shapedgrooves 13 are sequentially connected in series through the gaps to form a bending type flow channel positioned on the free side;

theliquid inlet 11 and theliquid outlet 12 are both arranged on thesubstrate 9 and are respectively located at the inlet position and the outlet position of the bent runner. The above notches can be obtained by arranging uneven end positions of thefins 10; separate indentations may also be provided on thefin 10 itself. The uneven mode is preferably adopted to achieve the purpose of uniform flow distribution of the refrigerating fluid on the section of any point in the extension direction of the bent flow channel and the purpose of facilitating the refrigerating effect of thesemiconductor refrigerating sheet 6.

Thesemiconductor refrigerating sheet 6 can adopt the conventional Peltier with relatively low cost, high efficiency and stable performance.

The foregoing is a more detailed description of the present invention in connection with specific preferred embodiments thereof, and it is not intended that the specific embodiments of the present invention be limited to these descriptions. For those skilled in the art to which the invention pertains, other embodiments that do not depart from the scope of the invention are intended to be encompassed by the scope of the invention.

Claims (10)

Translated fromChinese

1.可用于样本保存的保冷系统，包括半导体制冷片(6)，其特征在于，还包括制冷能量交互模块、制冷循环动力模块及管路系统；1. A cold insulation system that can be used for sample preservation, comprising a semiconductor refrigeration sheet (6), and characterized in that it also includes a refrigeration energy exchange module, a refrigeration cycle power module and a piping system;所述制冷能量交互模块包括其上设置有腔体结构的盒体；The cooling energy interaction module includes a box body with a cavity structure disposed thereon;所述管路系统包括首、尾端均连接在所述盒体上且与所述腔体结构相通的管路；所述管路系统还包括串联在所述管路上的制冷模块，所述制冷模块作为本保冷系统上的制冷工位；The pipeline system includes pipelines whose head and tail ends are both connected to the box body and communicated with the cavity structure; the pipeline system also includes a refrigeration module connected in series on the pipeline, the refrigeration The module is used as the cooling station on the cooling system;所述制冷循环动力模块作为所述管路中制冷液循环流动的动力源；The refrigeration cycle power module is used as a power source for circulating the refrigerant liquid in the pipeline;所述半导体制冷片(6)安装于所述盒体的外壁上，且半导体制冷片(6)的冷端与所述盒体相贴。The semiconductor refrigeration sheet (6) is mounted on the outer wall of the box body, and the cold end of the semiconductor refrigeration sheet (6) is attached to the box body.2.根据权利要求1所述的可用于样本保存的保冷系统，其特征在于，还包括控制模块、散热模块，所述散热模块作为所述半导体制冷片(6)热端的强制冷却部件；2. The cooling system according to claim 1, further comprising a control module and a heat dissipation module, and the heat dissipation module is used as a forced cooling component for the hot end of the semiconductor refrigeration sheet (6);所述制冷循环动力模块、散热模块、半导体制冷片(6)的控制信号输入端均与所述控制模块的信号输入端相连；还包括连接在控制模块信号输入端上的温度传感器，所述温度传感器用于获取所述制冷工位的温度；The control signal input ends of the refrigeration cycle power module, the heat dissipation module, and the semiconductor refrigeration sheet (6) are all connected to the signal input end of the control module; and a temperature sensor connected to the signal input end of the control module is also included. The sensor is used to obtain the temperature of the refrigeration station;所述控制模块根据所述温度传感器的反馈值，分别控制制冷循环动力模块、散热模块、半导体制冷片(6)各自的工作状态。The control module controls the respective working states of the refrigeration cycle power module, the heat dissipation module, and the semiconductor refrigeration sheet (6) according to the feedback value of the temperature sensor.3.根据权利要求1所述的可用于样本保存的保冷系统，其特征在于，还包括串联在所述管路系统上的制冷液缓冲罐；所述制冷循环动力模块包括串联在所述管路系统上的制冷循环泵，且所述制冷循环泵位于制冷能量交互模块的制冷液入口与制冷工位出口之间的管段上。3 . The cold preservation system for sample preservation according to claim 1 , further comprising a refrigerant liquid buffer tank connected in series to the pipeline system; the refrigeration cycle power module comprises a refrigeration cycle power module connected in series to the pipeline. 4 . A refrigeration cycle pump on the system, and the refrigeration cycle pump is located on the pipe section between the refrigeration liquid inlet of the refrigeration energy exchange module and the refrigeration station outlet.4.根据权利要求1所述的可用于样本保存的保冷系统，其特征在于，所述盒体为一体式结构或由多块盒体板(2)围成；4. The cold insulation system that can be used for sample preservation according to claim 1, wherein the box body is an integrated structure or is surrounded by a plurality of box body plates (2);所述半导体制冷片(6)安装在盒体的其中一块侧板(5)上；The semiconductor refrigeration sheet (6) is mounted on one of the side plates (5) of the box body;还包括位于盒体内、与所述侧板(5)内侧相贴的基板(9)，所述基板(9)上还设置有多块翅片(10)。It also includes a base plate (9) located in the box and attached to the inner side of the side plate (5), and a plurality of fins (10) are further arranged on the base plate (9).5.根据权利要求4所述的可用于样本保存的保冷系统，其特征在于，所述侧板(5)的外表面上还设置有为凹槽的安装槽(8)，所述半导体制冷片(6)安装于所述安装槽(8)中。5 . The cold insulation system according to claim 4 , wherein the outer surface of the side plate ( 5 ) is further provided with a mounting groove ( 8 ) which is a groove, and the semiconductor refrigeration sheet (6) is installed in the installation groove (8).6.根据权利要求5所述的可用于样本保存的保冷系统，其特征在于，还包括作为所述半导体制冷片(6)热端强制散热部件的散热模块(7)，所述半导体制冷片(6)在安装槽(8)中的安装通过所述散热模块(7)压合于所述热端上实现；6 . The cold insulation system according to claim 5 , further comprising a cooling module ( 7 ) serving as a forced heat dissipation component at the hot end of the semiconductor refrigeration sheet ( 6 ), the semiconductor cooling sheet ( 6 ). 6) The installation in the installation groove (8) is realized by pressing the heat dissipation module (7) on the hot end;所述散热模块(7)通过连接螺钉螺纹连接在所述侧板(5)上，且所述连接螺钉与散热模块(7)之间还设置有可在连接螺钉轴线方向上产生弹性变形的弹性件；The heat dissipation module (7) is threadedly connected to the side plate (5) by connecting screws, and between the connecting screws and the heat dissipation module (7), an elastic device capable of elastically deforming in the axial direction of the connecting screws is also provided piece;所述连接螺钉对散热模块(7)的压力通过所述弹性件传递；The pressure of the connecting screw on the heat dissipation module (7) is transmitted through the elastic member;所述连接螺钉在侧板(5)上的具体连接点位于所述安装槽(8)的外侧。The specific connection point of the connection screw on the side plate (5) is located outside the installation groove (8).7.根据权利要求6所述的可用于样本保存的保冷系统，其特征在于，所述半导体制冷片(6)的数量为多个，各半导体制冷片(6)均匹配有一个单独的安装槽(8)和散热模块(7)。7 . The cold insulation system according to claim 6 , wherein the number of the semiconductor refrigeration chips ( 6 ) is plural, and each semiconductor refrigeration chip ( 6 ) is matched with a separate installation slot. 8 . (8) and cooling module (7).8.根据权利要求4所述的可用于样本保存的保冷系统，其特征在于，所述翅片(10)以相互平行且以相对于基板(9)直立的姿态与基板(9)相连；8. The cold-insulation system for sample preservation according to claim 4, characterized in that the fins (10) are connected to the base plate (9) in a position parallel to each other and in an upright posture relative to the base plate (9);还包括设置在所述盒体上，用于向盒体内引入制冷剂的进液口(11)、用于由盒体内引出制冷剂的出液口(12)；It also includes a liquid inlet (11) disposed on the box body for introducing refrigerant into the box body, and a liquid outlet port (12) for drawing out the refrigerant from the box body;所述进液口(11)的孔口朝向以及出液口(12)的孔口朝向均与翅片(10)的高度方向平行。The orifice orientation of the liquid inlet (11) and the orifice orientation of the liquid outlet (12) are both parallel to the height direction of the fins (10).9.根据权利要求8所述的可用于样本保存的保冷系统，其特征在于，所述翅片(10)呈列排列；9 . The cold insulation system for sample preservation according to claim 8 , wherein the fins ( 10 ) are arranged in a row; 9 .所述翅片(10)与基板(9)连接的一侧为连接侧，所述连接侧的对侧为自由侧；The side where the fin (10) is connected with the base plate (9) is the connection side, and the opposite side of the connection side is the free side;沿着翅片(10)的排列方向依次排列的各翅片为：翅片(10)自由侧相对于基板(9)的距离发生变化，所述变化为：连续的多个翅片(10)在其自由侧形成沿着翅片(10)长度方向延伸的槽体，所述槽体为多个；所述进液口(11)和出液口(12)的位置满足：盒体内的制冷剂可沿着所述槽体的长度方向流动。The fins (10) arranged in sequence along the arrangement direction of the fins (10) are: the distance of the free side of the fins (10) relative to the base plate (9) changes, and the change is: a plurality of continuous fins (10) A plurality of grooves are formed on the free side of the fins (10) extending along the length direction of the fins (10). The agent can flow along the length of the tank.10.根据权利要求9所述的可用于样本保存的保冷系统，其特征在于，基板(9)为长方形板体，翅片(10)的排列方向为基板(9)的宽度方向；10 . The cold insulation system according to claim 9 , wherein the base plate ( 9 ) is a rectangular plate body, and the arrangement direction of the fins ( 10 ) is the width direction of the base plate ( 9 ). 11 .沿着基板(9)的宽度方向依次排列的各翅片为：翅片(10)高度的变化规律为：先变小再变大，形成一个高度变化周期并形成一个槽体；而后还具有若干个高度变化周期；单个高度变化周期形成一个位于所述自由侧的V形槽(13)；The fins arranged in sequence along the width direction of the base plate (9) are as follows: the variation rule of the height of the fins (10) is: first become smaller and then larger, forming a height change cycle and forming a groove body; and then there are several a height change period; a single height change period forms a V-shaped groove (13) on the free side;处于同一高度变化周期的翅片(10)端部还具有缺口，相邻两V形槽(13)通过各自同一侧的缺口相连通，且全部V形槽(13)通过所述缺口依次串接，形成位于所述自由侧的弯折型流道；The ends of the fins (10) in the same height change period also have gaps, two adjacent V-shaped grooves (13) are connected through the gaps on the same side, and all the V-shaped grooves (13) are connected in series through the gaps in sequence. , forming a bent flow channel on the free side;所述进液口(11)和出液口(12)均设置在基板(9)上，且分别位于所述弯折型流道的进口位置和出口位置。The liquid inlet (11) and the liquid outlet (12) are both arranged on the base plate (9), and are respectively located at the inlet position and the outlet position of the curved flow channel.

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