CN112894162A - Laser cutting method and laser cutting system for circuit board - Google Patents

Abstract

The invention relates to a laser cutting method and a laser cutting system of a circuit board, which are characterized in that a laser cutting device is controlled to emit a laser beam with first processing power, the circuit board is subjected to laser cutting for a first cutting time along a preset cutting path to cut a groove on the circuit board, then the laser cutting device is controlled to emit a laser beam with second processing power, the laser beam is controlled to perform laser cutting for a second cutting time along the preset cutting path to cut through the circuit board, wherein the first power is higher than the second power, when the second power is adopted for cutting, because the cutting times are less and the heat accumulation is less, the cutting of the circuit board is finished, the blackening of the edge of the circuit board caused by material carbonization and the oxidation of the rear surface of the circuit board are avoided, compared with the laser cutting method of the circuit board with the prior cutting of the circuit board and then polishing of the section, the laser cutting method of the circuit board is simple and high in processing efficiency, and effectively reduces the processing cost.

Description

Laser cutting method and laser cutting system for circuit board

Technical Field

The invention relates to the field of laser cutting, in particular to a laser cutting method and a laser cutting system for a circuit board.

Background

The edge of the circuit board after cutting has no dust, no burr and no deformation, and the edge components can not be influenced. Laser cutting has a non-contact processing mode, does not generate stress and dust in the processing process, has small processing gaps, and gradually becomes a mainstream processing mode for cutting circuit boards.

In the conventional laser cutting method, a pulse laser with small power is used to repeatedly scan a circuit board for many times along the same path until the circuit board is cut off. However, this method causes blackening of the edge of the circuit board after cutting because the energy density of the single pulse power is relatively low, the heat conversion ratio is relatively high, and heat accumulation causes carbonization of the material. The scanning times can be reduced by directly adopting high-power pulse laser, but because the high-power pulse has strong penetrating power and heat is easy to diffuse, the phenomenon of oxidation of the rear surface of a product along the width near the cutting edge can be caused, the appearance is damaged, and the use of a circuit board can be influenced. In order to solve the above problems, some manufacturers may grind the cross section by laser after cutting off the circuit board, so as to vaporize the carbide on the end surface, thereby reducing the carbide.

Disclosure of Invention

The invention aims to provide a laser cutting method and a laser cutting system for a circuit board, and aims to solve the problems that the laser cutting method for the circuit board in the prior art causes complicated cutting process, low processing efficiency and high processing cost.

In a first aspect, the present invention provides a laser cutting method for a circuit board, including the following steps: setting control parameters of laser cutting equipment, wherein the control parameters comprise first processing power, second processing power, first cutting times and second cutting times, and the first processing power is greater than the second processing power; controlling the laser cutting equipment to emit the laser beam with the first processing power to the surface of the circuit board according to the control parameter, and controlling the laser beam to perform laser cutting for the first cutting times along a preset cutting path so as to cut a groove on the circuit board; and controlling the laser cutting equipment to send the laser beam with the second machining power to the surface of the groove according to the control parameter, and controlling the laser beam to perform laser cutting for the second cutting times along the preset cutting path so as to cut through the groove.

Further, the controlling the laser beam to perform laser cutting for a second cutting time along a preset cutting path, where the cutting time is the second cutting time, so as to cut through the circuit board, further includes: and controlling the laser beam to carry out laser cutting for a plurality of times along the preset cutting path.

Further, the depth of the focal point of the laser beam is adjusted after each laser cutting so that the focal point is located on the surface of the uncut groove.

Further, the first processing power is 10 watts to 16 watts.

Further, the second processing power is 5 watts to 8 watts.

Further, the first number of cuts is less than the second number of cuts.

Further, the first cutting times are 5 to 7 times.

Further, the second cutting times are 10 to 14 times.

In a second aspect, the present invention provides a laser cutting system for cutting a circuit board by using the laser cutting method for a circuit board according to any one of claims 1 to 9, the laser cutting system comprising: laser cutting equipment and be used for fixed circuit board's processing platform, wherein, laser cutting equipment includes: the laser device is used for emitting laser beams, and the laser beams emitted by the laser device are projected to the circuit board through the beam control module.

Further, the laser cutting apparatus further includes: the convex surface of the focusing lens faces the circuit board, the laser beam projected by the light beam control module is projected to the circuit board after passing through the focusing lens, and the height adjusting piece is connected with the focusing lens and used for driving the focusing lens to move relative to the light beam control module so as to adjust the focal depth of the laser beam.

The invention has the beneficial effects that: the laser cutting device is controlled to emit a laser beam with first processing power, the circuit board is subjected to laser cutting for the first cutting times along a preset cutting path so as to cut a groove on the circuit board, then the laser cutting device is controlled to emit a laser beam with second processing power, the laser beam is controlled to perform laser cutting for the second cutting times along the preset cutting path so as to cut through the circuit board, wherein the first power is higher than the second power, when the first power is used for cutting, the groove is not cut through, and heat is not diffused to the rear surface of the circuit board, so that the rear surface is not oxidized, when the second power is used for cutting, because the cutting times are less and heat accumulation is less, the circuit board is cut, the blackening of the edge of the circuit board caused by material carbonization due to heat accumulation can be avoided, the oxidation of the rear surface of the circuit board is avoided, and compared with a laser cutting method for cutting the circuit board by cutting the circuit board firstly and then polishing the, the laser cutting method of the circuit board is simple and high in processing efficiency, and effectively reduces the processing cost.

Drawings

The following detailed description of embodiments of the invention will be made with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic diagram of the overall structure of a laser cutting system according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another embodiment of a laser cutting system according to an embodiment of the present invention;

FIG. 3 is a flow chart of a laser cutting method according to an embodiment of the present invention;

FIG. 4 is a flow chart of a laser cutting method according to another embodiment of the present invention;

FIG. 5 is a schematic illustration of a circuit board cutting process;

FIG. 6 is a schematic view of the completion of the circuit board cutting;

the figures are numbered:

1. laser cutting equipment; 11. a laser; 111. a laser beam; 12. a light beam control module; 13. a focusing lens; 14. an outer optical path; 2. a processing platform; 200. a circuit board; 2001. a groove; .

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

The invention provides a laser cutting system, as shown in fig. 1, the laser cutting system comprises a laser cutting device 1 and a processing platform 2 for fixing a circuit board, wherein the laser cutting device comprises:laser 11 andbeam control module 12,laser 11 is used for emittinglaser beam 111, andlaser beam 111 thatlaser 11 emittedthrows circuit board 200 throughbeam control module 12.

The processing platform 2 of this embodiment may be a fixed processing platform 2, a two-dimensional moving processing platform 2, or a three-dimensional moving processing platform 2, and the present invention is not limited herein, where the two-dimensional moving is on a horizontal plane, and the third-dimensional moving direction is perpendicular to the horizontal plane. The processing platform can drive the circuit board to reciprocate along a cutting path so as to assist the laser cutting equipment in cutting.

The edge of the circuit board after cutting has no dust, no burr and no deformation, and the edge components can not be influenced. Through implementing this embodiment, realize the laser cutting of circuit board, for the cutting method of traditional circuit board, laser cutting is non-contact processing, does not produce stress in the course of working, does not produce the dust, the processing gap is little, and laser cutting need not to change the cutter, has reduced the use of coolant liquid, and machining efficiency is faster, effectively improves the machining efficiency of circuit board, reduces the processing cost, very is applicable to the cutting of circuit board.

In one embodiment, as shown in fig. 1, the laser cutting apparatus 1 further includes a focusinglens 13 and a height adjusting member (not shown). The convex surface of the focusinglens 13 faces thecircuit board 200, and thelaser beam 111 projected by thebeam control module 12 is projected to thecircuit board 200 through the focusinglens 13. The height adjusting member is connected to the focusinglens 13, and is used for driving the focusinglens 13 to move relative to the lightbeam control module 12 so as to adjust the focal depth of thelaser beam 111.

In an embodiment, as shown in fig. 2, the laser cutting apparatus 1 further includes an outeroptical path 14, thelaser beam 111 emitted by thelaser 11 is projected to thebeam control module 12 through the outeroptical path 14, and the outeroptical path 14 includes a plurality of optical lenses, and the adjusting of the position of the focal point of thelaser beam 111 is achieved by adjusting the optical lenses.

In one embodiment, as shown in fig. 1, the processing platform 2 may move thecircuit board 200, so as to change the relative position of the focal point of thelaser beam 111 and thecircuit board 200.

The invention provides a laser cutting method of a circuit board, as shown in fig. 1, 3, 5 and 6, the laser cutting method of thecircuit board 200 comprises the following steps:

s110: setting control parameters of laser cutting equipment, wherein the control parameters comprise first processing power, second processing power, first cutting times and second cutting times, and the first processing power is greater than the second processing power;

s120: starting a laser operation program, controlling the laser cutting equipment 1 to emit alaser beam 111 with first processing power to the surface of thecircuit board 200 according to the control parameters, and controlling thelaser beam 111 to perform laser cutting for a first cutting time along a preset cutting path so as to cut agroove 2001 on thecircuit board 200;

s130: and controlling the laser cutting equipment 1 to emit alaser beam 111 with second processing power to the surface of the groove according to the control parameters, and controlling thelaser beam 111 to perform laser cutting for a second cutting time along a preset cutting path so as to cut through thegroove 2001.

Before the circuit board is cut, a cutting path is preset by the laser cutting equipment, namely the preset cutting path. The preset cutting path can be a straight path along the length direction or the width direction of the circuit board, and the circuit board can be cut along the path to obtain a plurality of small circuit boards.

Referring to fig. 5 and 6, in the embodiment, the laser cutting apparatus 1 is controlled to emit thelaser beam 111 with the first power (larger power) to perform laser cutting on thecircuit board 200 along the predetermined cutting path, so as to cut thegroove 2001 on thecircuit board 200, where the groove is not cut through, and heat is not diffused to the rear surface of thecircuit board 200, so that the rear surface is not oxidized, and thecircuit board 200 can maintain an aesthetic appearance without damaging the use. And then controlling the laser cutting device 1 to emit alaser beam 111 of a second processing power (smaller power), and controlling the laser beam to perform laser cutting along a preset cutting path so as to cut through thecircuit board 200, wherein the cutting times are fewer, and the heat accumulation is less, so that not only is the cutting of thecircuit board 200 completed, but also the carbonization of the material caused by the heat accumulation can be avoided. Specifically, the laser beam is located on the surface of the circuit board, and the circuit board can be driven to move by controlling the processing platform, so that the laser beam can perform laser cutting along a preset cutting path. Compared with a laser cutting method for cutting a circuit board firstly and then polishing the cross section, the circuit board cutting method is simpler and has high processing efficiency, and the processing cost is effectively reduced.

In a specific embodiment, as shown in fig. 1 and 4, after the step S130, the method further includes a step S140: and controlling thelaser beam 111 to perform laser cutting for a plurality of times along the preset cutting path so as to ensure that thecircuit board 200 is completely cut off.

Specifically, there may be metal wires inside thecircuit board 200, and after the circuit board is cut in steps S110 to S130, there may be a situation that a part of the metal wires is not cut, and in order to ensure the yield, in this embodiment, after step S130 is performed, thelaser beam 111 is further controlled to perform laser cutting for several times along the preset cutting path, so as to ensure that thecircuit board 200 is completely cut off.

In one embodiment, the depth of the focal point of thelaser beam 111 is adjusted after each laser cutting to make the focal point located on the surface of the groove that is not cut through, so as to ensure that the width of each cutting is consistent, and further to make the section generated by cutting smoother.

In an integrated embodiment, the first processing power is 10 watts to 16 watts.

In a specific embodiment, the second processing power is 5 watts to 8 watts.

In one embodiment, the first number of cuts is less than the second number of cuts.

In a specific embodiment, the number of first cuts is 5 to 7.

Further, the second cutting times are 10 to 14 times.

The control parameters of the first processing power, the first cutting times and the second cutting times have higher yield in the ultrathin printed circuit board with the thickness of 0.2 mm. It will of course be appreciated that other parameter ranges are possible.

The embodiment of the invention discloses a laser cutting method of a circuit board, as shown in fig. 1-3, a laser cutting device 1 is controlled to emit a laser beam 111 with a first processing power, the circuit board 200 is subjected to laser cutting for a first cutting frequency along a preset cutting path, so as to cut a groove 2001 on the circuit board 200, then the laser cutting device 1 is controlled to emit a laser beam 111 with a second processing power, the laser beam 111 is controlled to perform laser cutting for a second cutting frequency along the preset cutting path, so as to cut through the circuit board 200, wherein the first power is higher than the second power, when the first power is used for cutting, the groove is not cut through, heat is not diffused to the back surface of the circuit board, therefore, the back surface is not oxidized, when the second power is used for cutting, because the cutting frequency is less, heat accumulation is less, not only the cutting of the circuit board is completed, but also the phenomenon that the edge of the circuit board 200 is blackened due to material carbonization, and the oxidation of the rear surface of the circuit board 200 is avoided, and compared with a laser cutting method of the circuit board 200 of firstly cutting the circuit board and then polishing the cross section, the laser cutting method of the circuit board of the invention is simple and has high processing efficiency, and the processing cost is effectively reduced.

It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations should fall within the scope of the appended claims.

Claims (10)

1. A laser cutting method of a circuit board is applied to laser cutting equipment to cut the circuit board, and is characterized by comprising the following steps:

setting control parameters of laser cutting equipment, wherein the control parameters comprise first processing power, second processing power, first cutting times and second cutting times, and the first processing power is greater than the second processing power;

controlling the laser cutting equipment to emit the laser beam with the first processing power to the surface of the circuit board according to the control parameter, and controlling the laser beam to perform laser cutting for the first cutting times along a preset cutting path so as to cut a groove on the circuit board;

and controlling the laser cutting equipment to send the laser beam with the second machining power to the surface of the groove according to the control parameter, and controlling the laser beam to perform laser cutting for the second cutting times along the preset cutting path so as to cut through the groove.

2. The method of claim 1, wherein the controlling the laser beam to perform a second number of laser cuts along a predetermined cutting path, and the second number of laser cuts is the second number of laser cuts, so as to cut through the circuit board, further comprising:

and controlling the laser beam to carry out laser cutting for a plurality of times along the preset cutting path.

3. The method of claim 2, wherein the depth of the focal point of the laser beam is adjusted after each laser cutting so that the focal point is located on the surface of the groove which is not cut through.

4. The laser cutting method of a circuit board according to any one of claims 1 to 3, characterized in that: the first processing power is 10 watts to 16 watts.

5. The laser cutting method of a circuit board according to claim 2, characterized in that: the second processing power is 5 watts to 8 watts.

6. The laser cutting method of a circuit board according to claim 3, characterized in that: the first cutting times are less than the second cutting times.

7. The laser cutting method of a circuit board according to claim 4, characterized in that: the number of the first cuts is 5 to 7.

8. The laser cutting method of a circuit board according to claim 5, characterized in that: the second cutting times are 10 to 14 times.

9. A laser cutting system for cutting a circuit board by using the circuit board laser cutting method according to any one of claims 1 to 8, the laser cutting system comprising: laser cutting equipment and be used for fixed circuit board's processing platform, wherein, laser cutting equipment includes:

a laser for emitting a laser beam;

and the laser beam emitted by the laser is projected to the circuit board through the beam control module.

10. The laser cutting system of claim 9, wherein the laser cutting apparatus further comprises:

the convex surface of the focusing lens faces the circuit board, and the laser beam projected by the beam control module is projected to the circuit board after passing through the focusing lens;

and the height adjusting piece is connected with the focusing lens and is used for driving the focusing lens to move relative to the light beam control module so as to adjust the focal depth of the laser beam.

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