Disclosure of Invention
The invention aims to solve the technical problem of providing a heating mechanism for heating and atomizing, which has the advantages of good supporting strength and uniform heat distribution, aiming at the defects of the prior art.
The invention further aims to solve the technical problem of providing an atomization device which is not separated from a ceramic body, has good supporting strength of a heating mechanism and uniform heat distribution.
The technical scheme adopted for solving the technical problems is as follows:
The utility model provides a mechanism that generates heat for heating atomizing, includes the heating circuit that is used for evaporating liquid, is used for connecting the electrode of power supply unit, the heating circuit sets up two at least, and all the heating circuit connects between two electrode contacts in parallel, makes two form a planar whole through a plurality of connecting pieces connection between two adjacent heating circuits, is equipped with the radiating piece that transversely extends in the middle part is used for the heat dispersion with the heating circuit on the heating circuit of outside at least.
In the heating mechanism for heating and atomizing, preferably, each heating line is at least one of a straight line unit and a curve unit or a combination of the straight line unit and the curve unit which are connected end to end or are crossed.
Further, in the heating mechanism for heating and atomizing, preferably, all the connecting pieces are uniformly distributed on the heating circuit or symmetrically arranged about the middle part of the heating circuit.
Further, in the heating mechanism for heating and atomizing, the connecting member is preferably in a rod shape, a bar shape or a plate shape, and the shape is a straight line, a curve or a combination of at least one of them.
Further, in the heating mechanism for heating and atomizing, preferably, all the heat dissipation elements are uniformly distributed on the heating circuit or symmetrically arranged about the middle of the heating circuit.
Further, in the heating mechanism for heating and atomizing, preferably, the width or/and the length of the heat dissipation element is gradually reduced from the middle part of each heating line to two ends, or/and the arrangement density of the heat dissipation element on each heating line is gradually reduced from the middle part to two sides.
Further, in the heating mechanism for heating and atomizing, preferably, the connecting piece is provided with a heat dissipation piece for guiding heat to the ceramic body.
Further, in the heating mechanism for heating and atomizing, the heat dissipating member is preferably in the shape of a rod, a bar or a plate, and the shape thereof is a straight line, a curved line or a combination of at least one of them.
In the heating mechanism for heating and atomizing, preferably, the heat dissipation member extends to the outside of the heating circuit, and the free end of the heat dissipation member is folded over a plane where the heating circuit is located, so as to form a first folding part for fixing the heating circuit.
Further, in the heating mechanism for heating and atomizing, preferably, the heating line is provided with a second turnover part turned outwards from a plane where the heating line is located.
An atomization device comprises a porous ceramic body and the heating mechanism, wherein the heating mechanism is inlaid at the bottom of the porous ceramic body and is flatly attached to the bottom of the porous ceramic body.
According to the invention, at least two heating circuits are arranged in a parallel manner, and the two adjacent heating circuits are connected by the connecting piece, so that the heating circuits form a net shape, and the supporting strength and the flatness of the sheet heating body are improved. Meanwhile, a plurality of radiating pieces are arranged on the heating circuit, and the heat at the higher position of the heat on the heating circuit is dispersed through the radiating pieces, so that the whole heat of the heating mechanism is balanced. In addition, the connecting piece can also play the effect of heat dissipation and heat sharing.
Detailed Description
For a clearer understanding of technical features, objects and effects of the present invention, a detailed description of embodiments of the present invention will be made with reference to the accompanying drawings.
An element is referred to as being "mounted" or "disposed" on another element and may be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are directions or positions based on the drawings, and are merely for convenience of description and are not to be construed as limiting the present technical solution. The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.
In embodiment 1, as shown in fig. 1-16, a heating mechanism for heating and atomizing includes a heating circuit 100 for evaporating a liquid, and an electrode 700 for connecting a power supply unit, wherein the heating circuit 100 is provided with at least two heating circuits 100, all the heating circuits 100 are connected in parallel between contacts of the two electrodes 700, two adjacent heating circuits 100 are connected through a plurality of connectors 200 to form a planar whole, and a heat dissipation member 300 extending transversely for dispersing heat of the heating circuit 100 is arranged on at least the middle part of the heating circuit 100 on the outer side.
Compared with the prior art, the invention changes the existing single heating circuit 100 into a plurality of at least two heating circuits 100, and the length of each heating circuit 100 can be shortened due to the arrangement of the plurality of heating circuits 100, so that the heat difference between the middle area and the two ends of the heating circuit 100 generated by the heat conduction effect can be reduced. The connecting piece 200 and the heat dissipation piece 300 are additionally arranged, so that heat at a higher position of the heat generating circuit 100 is dispersed through the heat dissipation piece 300 and the connecting piece 200, and the whole heat of the heat generating mechanism is balanced. Furthermore, the plurality of heating wires 100 are connected through the connecting piece 200 to form a whole plane, and the plane is relatively flat and is not easy to tilt due to the mutual connection, so that the situation that the heating wires 100 in the prior art are partially separated from and completely embedded into the ceramic body is avoided.
The main structure of the heating mechanism of the invention is a heating circuit 100, the heating circuit 100 is generally in a linear extending or rotating structure, and two ends of the heating circuit 100 are connected with electrodes. In order to fully atomize liquid, the heating circuits 100 are required to be arranged in a plane, at least two heating circuits 100 are arranged, the heating circuits 100 can be the same or different, and the heating circuits 100 of the whole heating mechanism are regularly arranged for uniform atomization. The number of the heating circuits 100 can be generally 2-8, and preferably 2-5 according to actual needs. The lengths of the respective heat generating circuits 100 may be the same or different, and the shapes may be the same or different. Preferably, the heat generating wires 100 of the same length and shape are used. The material of the heat generating circuit 100 is made of metal.
All the heating lines 100 are simultaneously connected between the two electrode 700 contacts, that is, all the heating lines 100 are connected in parallel between the two electrode 700 contacts, but the heating lines 100 may be arranged in various ways, so as to be arranged into a plane, one of the heating lines 100 is arranged side by side, that is, the extending directions of the heating lines 100 are the same or basically the same, the heating lines 100 are arranged at intervals, the intervals between adjacent heating lines 100 may be the same or different, and preferably, the intervals are arranged at equal intervals. The second is a crossed or staggered arrangement, i.e., a plurality of heat generating circuits 100 extending in different directions so that they intersect at some place or through the connection member 200.
Each heating circuit 100 is a structure formed by connecting or crossing at least one of a straight line unit and a curve unit, or a combination thereof end to end. That is, the heating circuit 100 may have any shape, and is not limited, and it is only required to satisfy the requirement of uniform heating of the present invention.
Specifically, in the first embodiment of the heating circuit 100, the heating circuit 100 is formed by one or more linear units, one linear unit can be linearly arranged from one electrode contact to the other electrode contact, and the linear units are connected end to form a linear heating circuit 100 and a loop heating circuit 100.
In a second embodiment of the heating circuit 100, the heating circuit 100 is formed by one or more curve units, one curve unit can be arranged from one electrode contact to the other electrode contact, and the curve units are connected end to form the heating circuit 100.
In the third embodiment of the heating circuit 100, the heating circuit 100 is formed by connecting one or more linear units and curve units end to end, and the linear units and the curve units can be respectively arranged or alternatively arranged.
In the fourth embodiment of the heat generating circuit 100, the heat generating circuit 100 is formed by intersecting or staggering a plurality of straight units, and the intersecting or staggering refers to that the extending directions of the plurality of heat generating circuits 100 are changeable and the extending directions of the plurality of heat generating circuits 100 are intersected or staggered. Where interdigitation refers to a plurality of straight units being directly connected together, interdigitation refers to being connected together by the connector 200 or the heat sink 300.
In a fifth embodiment of the heat generating circuit 100, the heat generating circuit 100 is formed by intersecting or interlacing a plurality of curve units. Where interdigitating refers to a plurality of curve units being directly connected together, interdigitating refers to being connected together by the connector 200 or the heat sink 300.
In a sixth embodiment of the heat generating circuit 100, the heat generating circuit 100 is formed by intersecting or interlacing at least one linear unit with at least one curved unit. This mode is a mode of combining the fourth and fifth embodiments.
In order to maintain the flatness and support performance of the whole heating mechanism, a connecting member 200 is provided between adjacent heating circuits 100, the connecting member 200 may be connected at any position of the heating circuits 100, and the connecting member 200 is in the shape of a rod, a bar or a plate, and the shape of the connecting member 200 is a straight line, a curve or a combination of at least one of them. The rod-shaped, bar-shaped or plate-shaped connecting member 200 may be a narrow rod-shaped, bar-shaped with a certain width, and a relatively wide plate-shaped connecting member 200 may be a straight line, a curved line or a combination of at least one of the straight lines and the curved line in the whole or in the length direction, wherein the combination of at least one of the straight lines and the curved line means that the connecting member 200 may have a plurality of straight line portions connected end to end or cross-connected as a whole, and the connecting member 200 may have a plurality of straight line portions connected end to end with the curved line portions connected end to end or cross-connected as a whole, or the connecting member 200 may have a combination of the curved line portions and the straight line portions formed at different sides. The connectors 200 on the single heating line 100 may be parallel or non-parallel, and are determined according to actual needs.
In order to keep the flatness and heat conduction uniform, it is preferable that all the connectors 200 are uniformly distributed on the heat generating circuit 100 or symmetrically arranged about the middle of the heat generating circuit 100. The connector 200 may be a transverse connection, an axial connection, or an oblique connection with respect to the heat generating circuit 100. The adjacent connectors 200 may be disposed at intervals, may be disposed adjacent to each other in parallel, or may be disposed in a crossing manner.
The heat dissipation element 300 is used for guiding out heat in the heating circuit 100 from the heat dissipation element 300, and as the connecting element 200 is arranged between the heating circuits 100, the heat dissipation element is generally arranged on the outer side of the heating circuit 100 at the outermost side, namely, on the outer sides of all the heating circuits 100, the heat dissipation element 300 extends outwards, the extending direction can be perpendicular to the central axis of the whole heating mechanism, the heat dissipation elements 300 on the single heating circuit 100 can be arranged in an inclined manner, the heat dissipation elements 300 on the single heating circuit 100 can be arranged in parallel or not in parallel, and the heat dissipation elements are determined according to actual needs.
In terms of the installation position, the heat dissipation element 300 is used for uniformly dissipating heat on the heating circuit 100, especially in a high-heat position, that is, the heat dissipation element 300 is at least arranged in the middle area of the heating circuit 100, and the heat dissipation elements 300 can be arranged in the two end areas and the middle area of the heating circuit 100. Preferably, all the heat dissipation elements 300 are uniformly distributed on the heat generation circuit 100 or symmetrically arranged about the middle of the heat generation circuit 100.
From the structure of the heat dissipation element 300, since the heat quantity in the middle area of the heating circuit 100 is higher than that in the two end areas, the heat dissipation elements 300 at different positions are selected differently, the width and/or length of the heat dissipation element 300 can be selected to gradually decrease from the middle to the two ends of each heating circuit 100, that is, the area of the heat dissipation element 300 is gradually reduced from the middle to the two ends of the heating circuit 100, and the arrangement density of the heat dissipation elements 300 on each heating circuit 100 can be selected to gradually decrease from the middle to the two sides. Or gradually decreases from the middle to both sides at the same time as the shape, size and density of the heat sink 300. The structure and the arrangement mode can lead out high heat as much as possible, reduce the temperature difference and keep the heating uniformity of the heating circuit 100.
The heat sink 300 is in the shape of a rod, bar or plate, and has a shape of a straight line, a curved line or a combination of at least one of them. The bar-shaped, stripe-shaped or plate-shaped heat sink 300 may be formed in a narrow bar-shaped, stripe-shaped with a certain width, and a relatively wide plate-shaped heat sink 300 may be formed in a straight line, a curved line or a combination of at least one of them in a whole or in a length direction, wherein the combination of at least one of them means that the heat sink 300 may have a plurality of straight line portions connected end to end or cross-connected as a whole, and the heat sink 300 may have a plurality of straight line portions connected end to end or cross-connected as a whole with the curved line portions.
In order to further enhance the heat dissipation efficiency, it is preferable that the connector 200 is also provided with a heat dissipation member 300 for guiding heat to the ceramic body. The heat dissipation element 300 may have the same structure as the heat dissipation element 300 in the heat generating circuit 100, or may be different from the heat dissipation element, and the heat dissipation element 300 disposed in the heat generating circuit may be mainly plate-shaped or sheet-shaped, if the length of the connecting element 200 is generally shorter.
Since the heating circuit 100 is embedded in the ceramic body, but the heating circuit 100 cannot be embedded in the ceramic body, so that the heating circuit 100 is easily separated from the ceramic body, in order to strengthen the fixation of the heating circuit 100 and the ceramic body, it is preferable that the heat dissipation member 300 extends to the outside of the heating circuit 100 and the free end thereof is folded out of the plane of the heating circuit 100, so as to form the first folding portion 500 for fixing the heating circuit 100. The first turnover part 500 is located at one side of the plane of the heating circuit 100, and can be embedded into the ceramic body during manufacturing to strengthen the fixation of the heating circuit 100 and the ceramic body.
In order to further enhance the supporting force, it is preferable that the heat generating circuit 100 is provided with a second turnover part 600 turned outwards from a plane in which the heat generating circuit 100 is located. The second turndown parts 600 are preferably provided at both ends of the heat generating circuit 100, and maintain the fixation between the heat generating mechanism and the ceramic body from both ends. The second fold 600 is also embedded in the ceramic body. The first hinge 500 and the second hinge 600 may be either or both of them.
For further explanation of the present invention, the following detailed description is given by way of several specific examples:
in embodiment 1-1, as shown in fig. 2-4, a heating mechanism for heating and atomizing comprises two heating lines 100 for evaporating a liquid, wherein the two heating lines 100 are arranged in parallel between two electrode contacts, each heating line 100 is formed by tooth-shaped arrangement or V-shaped continuous arrangement, a heat dissipation member 300 is arranged at the outward extension of the tooth-shaped top end, the heat dissipation member 300 is arranged at the tooth-shaped top end of each heating line 100, a connecting member 200 is arranged at the tooth-shaped bottom end of each heating line 100 and is connected with the tooth-shaped top end of the other heating line 100, and the two heating lines 100 are connected through a plurality of connecting members 200 to form a planar whole. The connecting members 200 are parallel to each other, and the heat dissipation members 300 are parallel to each other. The free end of the heat sink 300 is folded out of the plane of the heat generating circuit 100 with a first folding portion 500, and the end of the heat generating circuit 100 is provided with a second folding portion 600.
Examples 1-2 as shown in fig. 5, a heat generating mechanism for heating atomization of the present example was modified on the basis of example 1-1. The specific improvement is that the heat dissipation elements 300 are also arranged on the connecting piece 200, so that the heat dissipation of the middle area of the heating circuit 100 is enhanced, the heat dissipation elements 300 are of a sheet structure, and a plurality of heat dissipation elements 300 are arranged side by side and have the same shape. The other structures are the same as those of embodiment 1-1, and will not be described here again.
Examples 1-3 as shown in fig. 6, a heat generating mechanism for heating atomization of the present example was modified on the basis of example 1-1. The specific improvement is that the width of the heat dissipation element 300 is reduced from the middle area to the two ends, that is, the width W1> W2> W3 of the heat dissipation element 300, so as to enhance the heat dissipation of the middle area of the heat generating circuit 100, and the other structures are the same as those of embodiment 1-1, and are not described herein.
Examples 1-4 as shown in fig. 7, a heat generating mechanism for heating atomization of the present example was modified on the basis of example 1-1. The specific improvement is that the connection member 200 is provided, and in addition to the connection member 200 provided in embodiment 1-1, the connection member 200 is also provided at the tooth-shaped top end of one heat generating circuit 100 and the tooth-shaped bottom end of the other heat generating circuit 100, and this structure enhances the supporting strength. The other structures are the same as those of embodiment 1-1, and will not be described here again.
Examples 1-5 as shown in fig. 8, a heat generating mechanism for heating atomization of the present example was modified on the basis of example 1-1. The specific improvement is that the shape of the heating circuit 100 is changed into a square wave structure, two heat dissipation elements 300 are connected to the top surface of each square wave unit, two connection elements 200 are arranged on the bottom surface of each square wave unit and connected with the adjacent heating circuit 100, the connection elements 200 are arranged in parallel, and similarly, the heat dissipation elements 300 extending outwards are arranged on the bottom surface of each square wave unit of the other heating circuit 100. The heat dissipation elements 300 are disposed parallel to each other, and the other structures are the same as those of embodiment 1-1, and will not be described herein.
In embodiments 1 to 6, as shown in fig. 9, a heating mechanism for heating and atomizing in this embodiment is three heating lines 100, the three heating lines 100 are arranged in parallel between two electrode contacts, the heating lines 100 are all in a straight line shape and are arranged in parallel with each other, two heating lines 100 on the outer side are outwardly extended with heat dissipation members 300, and the heat dissipation members 300 are perpendicular to the heating lines 100. The connecting piece 200 is disposed between two adjacent heating circuits 100 to connect the two adjacent heating circuits together, and in the transverse direction, the connecting piece 200 is on a straight line, and meanwhile, the outer heat dissipation piece 300 is also on a straight line, in other embodiments, the connecting pieces 200 may be staggered in the transverse direction, and meanwhile, the heat dissipation pieces 300 may also be staggered with the connecting pieces 200. Or the heat dissipation element 300 and the connecting element 200 are gradually thinned from the middle to the two sides, and the heat dissipation element 300 is required to be slightly more because the heat is gathered in the middle.
Examples 1 to 7 as shown in fig. 10, a heat generating mechanism for heating atomization of the present example was modified on the basis of examples 1 to 6. The specific improvement is that the positions and densities of the heat dissipation element 300 and the connecting element 200 are reduced from the middle area to the two ends, that is, the heat dissipation element 300 is arranged densely in the middle area of the heating circuit 100, the two end areas are arranged sparsely, and the heat dissipation of the middle area of the heating circuit 100 is enhanced. The middle connecting piece 200 and the heat dissipation pieces 300 on the two sides can be distributed in a staggered manner, and the strength of the heating circuit 100 of the embodiment is better than that of the heating circuit without dislocation, so that the heating circuit is not easy to deform. The heat is conducted to the heat sink 300 at a short distance, and the heat sink 300 can radiate heat better. The other structures are the same as those of embodiments 1 to 6, and will not be described here again.
Examples 1 to 8 as shown in fig. 11, a heat generating mechanism for heating atomization of the present example was modified on the basis of examples 1 to 6. The specific improvement is that the number of the heating circuits 100 is changed into two heating circuits 100 which are parallel to each other. The heat dissipation elements 300 are staggered with the connection elements 200. The other structures are the same as those of embodiments 1 to 6, and will not be described here again.
In embodiments 1 to 9, as shown in fig. 12, a heating mechanism for heating and atomizing in this embodiment includes two heating circuits 100 of circuitous circuits, which are arranged in parallel between two electrode contacts, wherein both the two heating circuits are wave circuits formed by connecting curve units end to end or alternatively connecting curve units and straight units end to end, a heat dissipation member 300 is connected to the top end of each curve waveform, and a connection member 200 is connected between the adjacent waveform top end and the adjacent waveform bottom end, and in this embodiment, the connection member 200 is relatively short and small and forms an integral structure with the adjacent waveforms. The circuitous lines are also arranged in a good heat balance way, so that a heating element with larger resistance and longer heating line 100 can be manufactured. The roundabout point adopts the fillet design to facilitate the processing. In other embodiments, on the basis of the present embodiment, the two heating circuits 100 may have a large middle section interval and a slightly dense interval between two ends, so that the problem of high heat in the middle section of the two heating circuits 200 can be avoided, and the connecting piece 200 between the other two circuits also has good heat dissipation and heat sharing effects. The other structures are the same as those of embodiment 1-1, and will not be described here again.
In embodiments 1 to 10, as shown in fig. 13, a heating mechanism for heating and atomizing in this embodiment includes two heating circuits 100 arranged in parallel between two electrode contacts, each heating circuit 100 is formed by connecting two straight units end to end, the extending directions of the two straight units are different, and the two heating circuits 100 form a diamond structure with a middle outwards arched shape, that is, the middle space between the two heating circuits 100 is large, the space between the two ends is small, and meanwhile, the width of the heat dissipation member 300 is reduced from the middle area to the two ends, that is, the width W1> W2> W3 of the heat dissipation member 300, and the heat dissipation of the middle area of the heating circuit 100 is enhanced. Furthermore, the variation trend of the connecting piece 200 is the same as that of the heat dissipating piece 300, and the heat dissipating piece 300 and the connecting piece 200 are on the same straight line in the transverse direction, and the widths of the two are the same. The other structures are the same as those of embodiments 1 to 6, and will not be described here again.
Examples 1 to 11 as shown in fig. 14, a heat generating mechanism for heating atomization of the present example was modified on the basis of examples 1 to 10. The specific improvement is that the shape of the heating circuit 100 and the shape of the connecting piece 200 are changed into a saw-tooth structure, and the shapes of the two heating circuits 100 are the same. The top of each sawtooth is connected with a heat dissipation element 300, and the bottom of each sawtooth is provided with a connecting element 200 connected with an adjacent heating circuit 100, and in this embodiment, the shape of the connecting element 200 is a straight line connected end to form a fold line. Compared with embodiments 1-10, the connecting piece 200 of this embodiment forms a fold line to more uniformly arrange the whole heating mechanism, and also improves the uniformity of heating. The other structures are the same as those of embodiment 1-1, and will not be described here again.
Based on the above embodiments, the linear units can be changed into the turning arcs formed by the folding lines or the curve units of the linear unit combination, so that more roundabout exists, the contact area between the heating line and the heating body is larger, and the roundabout circuit resistance value can be larger.
Examples 1 to 12 as shown in fig. 15, a heat generating mechanism for heating atomization of the present example was modified on the basis of example 1 to 1. The specific improvement is that the shape of the heating circuit 100 is changed into a waveform unit formed by changing a tooth-shaped structure formed by a straight line unit into a special-shaped structure formed by a straight line and a curve, and each waveform unit comprises straight edges and curved edges which are alternately arranged. The heating circuit 100 is designed into an arc, and the arc has the advantages that the sharp corner part is difficult to process, the bent part is smooth, and the processing is convenient. The other structures are the same as those of embodiment 1-1, and will not be described here again.
Examples 1 to 13 as shown in fig. 16, a heat generating mechanism for heating atomization of the present example was modified on the basis of examples 1 to 12. The specific improvement is that the shape of the heating circuit 100 is changed into a waveform unit formed by changing a tooth-shaped structure formed by a straight line unit into a special-shaped structure formed by a straight line and a curve, each waveform unit comprises a straight edge and a curved edge, the curved edge is outside, the straight edge is inside, and the bending place is smooth, so that the processing is convenient. The other structures are the same as those of embodiments 1 to 12, and will not be described here again.
Embodiment 2, as shown in fig. 17-18, an atomization device comprises a porous ceramic body 1 and a heating mechanism 2 of embodiment 1, wherein the heating mechanism 2 is embedded at the bottom of the porous ceramic body 1 and is flatly attached to the bottom of the porous ceramic body 1.
The porous ceramic body 1 is in a square groove structure, and the heating mechanism 2 is embedded at the bottom of the porous ceramic body 1. The first turnover part 500 and the second turnover part 600 of the heating mechanism 2 are buried in the porous ceramic body 1 when being manufactured, and at least two heating circuits 100 are attached to the bottom of the porous ceramic body 1.
The specific structure of the heating mechanism 1 is the same as that of embodiment 1, and will not be described here again.
Comparative test by using a single line of the prior art, the present invention selects three examples for testing. The testing method comprises selecting different heating mechanisms, wherein the heating mechanisms are made of nickel-chromium alloy, and the resistance value is 1.0+ -0.05Ω. And (3) supplying power of 1.5V (three-section heating is performed, and 10 seconds are performed after every 0.5V), and observing the temperature difference between the middle point range and the two side point ranges of the heating mechanism by adopting an infrared thermal imaging thermometer (the precision is +/-0.1 ℃). The test points are three positions, A is the middle of the ceramic, and B and C are the positions on two sides of the ceramic (the highest grabbing temperature is adopted). The temperature values of the different temperature sections are divided into the temperature values of the different positions to obtain temperature difference values (data between the main test 70 and 350 DEG)
Comparative examples of the prior art
| Numbering device | Point A temperature (°C) | Point B temperature (°C) | C point temperature (°C) | Maximum temperature difference |
| 1 | 70.5 | 66.1 | 66.5 | 4.4 |
| 2 | 168.5 | 143.1 | 142.1 | 26.4 |
| 3 | 202.4 | 174.3 | 175.8 | 28.1 |
| 4 | 231.2 | 192.9 | 192.5 | 38.7 |
| 5 | 273.9 | 229.3 | 234.2 | 44.6 |
| 6 | 321.8 | 264.3 | 277.7 | 58.4 |
Example 1-1
Examples 1 to 3
| Numbering device | Point A temperature (°C) | Point B temperature (°C) | C point temperature (°C) | Maximum temperature difference |
| 1 | 73.2 | 75.1 | 73 | 1.9 |
| 2 | 133.3 | 138.7 | 133.2 | 5.4 |
| 3 | 162.2 | 168.3 | 162.6 | 6.1 |
| 4 | 190.5 | 198.8 | 191.1 | 8.3 |
| 5 | 266.7 | 277.5 | 267.5 | 10.8 |
| 6 | 320.1 | 335.1 | 322.6 | 15 |
Examples 1 to 5
| Numbering device | Point A temperature (°C) | Point B temperature (°C) | C point temperature (°C) | Maximum temperature difference |
| 1 | 80.2 | 85.1 | 80.6 | 4.5 |
| 2 | 141.1 | 151.7 | 141.2 | 10.6 |
| 3 | 152.2 | 162.5 | 151.6 | 16.3 |
| 4 | 180.5 | 196.8 | 182.1 | 16.3 |
| 5 | 253.7 | 273.5 | 254.5 | 19.8 |
| 6 | 310.1 | 335.1 | 314.6 | 25 |
The data show that the temperature difference in the prior art is gradually enlarged along with the temperature increase, the maximum temperature difference is 58.4 ℃, but the temperature of the heating mechanism can be distributed on the porous ceramics by arranging the heat dissipation parts and the layout of the connecting parts, so that the temperature difference between the middle section and the two side sections generated by the heat conduction and heat radiation problems is adjusted to be minimum, and the data in the embodiment show that the maximum temperature difference is reduced to 15-25 ℃, so that the temperature of the heating surface at the bottom of the whole atomization heating mechanism is more balanced, and the heat distribution is more uniform. The data show that the structure of the invention ensures that the heat distribution is more uniform, and the structure of the heating mechanism can well solve the problem of uneven temperature distribution caused by heat radiation, so that the temperature difference is reduced or even approaches to the temperature uniformity.