优先权priority
本申请主张享有于2019年10月7日提交的序列号为16/595,265的美国专利申请的优先权，且该美国专利申请享有于2018年10月8日提交的、名称为“多方法三维打印机”的美国临时专利申请号为62/742,505的权益，其全部内容通过引用合并于本文中。This application claims priority to U.S. Patent Application Serial No. 16/595,265, filed October 7, 2019, and to U.S. Provisional Patent Application No. 62/742,505, filed October 8, 2018, entitled "Multi-Method 3D Printer," the entire contents of which are incorporated herein by reference.
技术领域technical field
本发明涉及用于三维打印的系统和设备。The present invention relates to systems and devices for three-dimensional printing.
背景技术Background technique
自30年前首次提出以来，三维增材制造（3D打印）已经引起了人们对于潜在的更快、更经济的制造方法的浓厚兴趣。然而，迄今为止，这种潜力基本上没有实现。如今，绝大多数3D打印机被用来制造演示部件或非功能性原型，而大多数演示部件或非功能性原型都由塑料材料制成，选择这些塑料材料主要是为了与打印机兼容、而不是最终部件的材料要求。Since it was first proposed 30 years ago, three-dimensional additive manufacturing (3D printing) has generated intense interest in potentially faster and more economical manufacturing methods. To date, however, this potential has remained largely unrealized. Today, the vast majority of 3D printers are used to create demo parts or non-functional prototypes, and most demo parts or non-functional prototypes are made of plastic materials, which are mainly selected for compatibility with the printer rather than the material requirements of the final part.
阻碍更广泛地接受3D打印作为一种商业上可行的制造方法的问题之一是对于与这些应用兼容的特定材料的特定应用的要求。另一个问题是，与部件的其余大部分相比，需要提高部件的某些部分的精度。对于当前的技术，对提高精度的需求迫使人们选择能够提供所需精度的3D打印技术，这通常会导致比精度较差的方法更慢的构建速度。如果应用于部件的总体积，这些较慢的构建速度将对最终部件产生重大的成本影响。One of the issues holding back the wider acceptance of 3D printing as a commercially viable manufacturing method is the application-specific requirement for specific materials that are compatible with these applications. Another problem is that the accuracy of some parts of the part needs to be increased compared to the rest of the part. With current technologies, the need for increased precision forces people to choose 3D printing techniques that can deliver the required precision, often resulting in slower build speeds than less precise methods. If applied to the overall volume of the part, these slower build speeds can have a significant cost impact on the final part.
尽管3D打印具有以更有效的材料利用和降低成品的最终重量来生产三维物体的潜力，但大多数的传统3D打印技术一次只能将一个体素沉积或固定到位。熔融沉积成型(FDM)类型的最常见3D打印机会挤出一条熔融聚合物线。除了受可用材料集的严格限制外，FDM也非常慢。定向能打印机在材料层中产生相变。该相变可能是通过由计算机导向的激光或电子束的烧结或熔化而引起的，也可能是通过定向暴露于所选择的电磁辐射进行聚合来引起的。定向能打印机作为一个类别，显著扩展了可用的材料集，并且由于它们在快速定位的材料层上运行，因此具有比FDM打印机更快的潜力。在当前的3D打印机技术中，在材料选择上具有最大灵活性和最快速度的打印机是采用喷射粘合剂技术的打印机。这些打印机迅速沉积一整层粉末，然后通过喷墨式打印头沉积粘合剂来固定粉末中的图案。其结果是一个可以使用多种材料、以至少比FDM打印机大一个数量级的速率来构建对象的系统。Although 3D printing has the potential to produce three-dimensional objects with more efficient material utilization and reduced final weight of the finished product, most conventional 3D printing techniques can only deposit or fix one voxel in place at a time. The most common 3D printers of the fused deposition modeling (FDM) type extrude a strand of molten polymer. Besides being severely limited by the set of materials available, FDM is also very slow. Directed energy printers create phase changes in layers of material. The phase change may be induced by sintering or melting by computer-directed laser or electron beams, or polymerization by directed exposure to selected electromagnetic radiation. Directed-energy printers, as a class, significantly expand the available material set and, because they operate on rapidly positioned layers of material, have the potential to be faster than FDM printers. Among current 3D printer technologies, the printers with the greatest flexibility and speed in material selection are those that use jetting binder technology. These printers deposit an entire layer of powder quickly, then an inkjet printhead deposits a binder to fix the pattern in the powder. The result is a system that can build objects using a variety of materials at rates at least an order of magnitude greater than FDM printers.
总体而言，喷射粘合剂打印机是当前技术中最好的，但只能在一个对象中包含一种材料。尽管它们能够在单位时间内对大量材料进行图案化，但使用此类系统可达到的最小实际层厚度通常在25µm左右。这一限制也限制了打印层的精度。Overall, jet-binder printers are the best of the current technology, but can only contain one material in one object. Although they are capable of patterning large amounts of material per unit of time, the smallest practical layer thickness achievable with such systems is typically around 25 µm. This limitation also limits the accuracy of the printed layers.
诸如电子照相术的打印技术能够以非常高的精度快速打印较大的面积，但仅限于打印非常薄的层。如果物体中的所有体素都是以电子照相术形成的，则电子照相术的相对较低的质量沉积速率和电子照相系统的高复杂性使得其对于3D打印系统没有吸引力。Printing technologies such as electrophotography are capable of printing large areas quickly and with very high precision, but are limited to printing very thin layers. The relatively low mass deposition rate of electrophotography and the high complexity of electrophotography systems make it unattractive for 3D printing systems if all voxels in the object are formed with electrophotography.
发明内容Contents of the invention
本发明的实施方式涉及如本文中所描述的多材料、多方法打印机系统的三维增材制造系统。所述打印机系统包括打印机模块系统。所有模块均由中央计算机系统（有时称为控制器）控制，以必要时协调模块，以将适当的材料以所需的精度沉积到单个构建位置，同时最大程度地提高总体构建速率。由于高构建速率对于经济运行至关重要，因此每个模块的首选基本技术是喷射粘结剂。如果喷射粘合剂技术无法提供特定体素所需的属性，则打印机模块可以基于更合适的技术。例如，可以使用定向能量束打印机或电子照相列印机。Embodiments of the present invention relate to a three-dimensional additive manufacturing system of a multi-material, multi-method printer system as described herein. The printer system includes a printer module system. All modules are controlled by a central computer system (sometimes referred to as a controller) to coordinate the modules as necessary to deposit the appropriate material with the required precision to a single build location while maximizing the overall build rate. Since high build rates are essential for economical operation, the preferred basic technology for each module is jetting the binder. If jet-binder technology does not provide the desired properties for a particular voxel, the printer module can be based on a more suitable technology. For example, directed energy beam printers or electrophotographic printers can be used.
在一实施方式中，结合了喷射粘合剂技术的打印机模块与基于其它技术的打印机模块相结合。在2018年6月7日提交的、名为“多材料3D 打印机”的美国临时专利申请62/682,067和于2018年10月22日提交的、名为“多材料三维打印机”的美国专利申请16/ 167,088中描述了多材料3D打印机，其全部内容通过引用并入本文中，代表了一种可以结合到本发明的多材料多方法3D打印机的打印机模块中的喷射粘合剂技术。In one embodiment, a printer module incorporating jetting adhesive technology is combined with printer modules based on other technologies. Multi-material 3D printers are described in U.S. Provisional Patent Application 62/682,067, filed June 7, 2018, entitled "Multi-material 3D Printer," and U.S. Patent Application 16/167,088, filed October 22, 2018, entitled "Multi-Material 3D Printer," the entire contents of which are incorporated herein by reference, and represent a jetting adhesive technology that may be incorporated into the printer modules of the multi-material multi-process 3D printer of the present invention.
解决上述问题的方法是采用为应用所需的材料和部件内特定体素所需的精度进行了优化的打印技术。本发明的实施方式提供了一种解决方案，该解决方案提供了一种包括多材料打印机模块的3D打印系统，这些模块中的每一个都是为了其能够以目标应用的特定体素所需的精度沉积特定的材料或材料组而选择的。The solution to the above issues is to employ printing techniques optimized for the material required for the application and the accuracy required for a particular voxel within the part. Embodiments of the present invention provide a solution that provides a 3D printing system comprising multi-material printer modules, each of which is selected for its ability to deposit a specific material or group of materials with the precision required for a specific voxel of a targeted application.
根据本发明的一个方面，公开了一种喷射粘合剂打印系统，其包括在其上形成有多个图案化的单层对象的载体基底，所述图案化的单层对象在载体基底上彼此分离，所述载体基底沿行进方向移动；用于将流化的颗粒分配到载体基底上以形成材料层的分配模块；沿着行进方向位于分配模块的下游、以将材料层的压实增加到预定的压实范围的压实模块；沿行进方向位于压实模块下游、以根据预定图案将粘合剂材料打印到材料层上的粘合剂打印机；沿行进方向位于粘合剂打印机下游、以根据预定图案选择性地融合材料层的融合模块；沿行进方向位于融合模块下游、用于去除材料层的非融合部分以形成图案化的单层对象之一的材料去除模块；沿行进方向位于材料去除模块下游，以将其中一个图案化的单层对象从载体基底转移到组装板的转移模块；包括所述组装板的组装站，所述图案化的单层对象在组装板上按照包括所述图案化的单层对象的物体的预设顺序组装到堆叠中；控制预设顺序和预设图案的控制器。According to one aspect of the present invention, a jetting adhesive printing system is disclosed that includes a carrier substrate having formed thereon a plurality of patterned single layer objects separated from each other on the carrier substrate, the carrier substrate moving in a direction of travel; a dispensing module for dispensing fluidized particles onto the carrier substrate to form a layer of material; a compaction module located downstream in the direction of travel from the dispensing module to increase compaction of the layer of material to a predetermined compaction range; downstream in the direction of travel from the compaction module to print the adhesive material according to a predetermined pattern an adhesive printer onto the material layers; a fusion module downstream of the adhesive printer in the direction of travel to selectively fuse the layers of material according to a predetermined pattern; a material removal module downstream of the fusion module in the direction of travel for removing non-fused portions of the material layers to form one of the patterned single-layer objects; a transfer module downstream of the material removal module in the direction of travel to transfer one of the patterned single-layer objects from a carrier substrate to an assembly plate; Assembled sequentially into stacks; controllers for pre-set order and pre-set patterns.
在上述喷射粘合剂打印系统中，载体基底可以是带。In the jetting binder printing system described above, the carrier substrate may be a tape.
在上述喷射粘合剂打印系统中，载体基底还可包括粘合控制层，其上形成有所述材料层。In the above jet adhesive printing system, the carrier substrate may further include an adhesion control layer on which the material layer is formed.
在上述喷射粘合剂打印系统中，分配模块可包括分配控制器，其被配置为精确地计量分配到载体基底上的流化颗粒的量。In the jetting binder printing system described above, the dispensing module may include a dispensing controller configured to precisely meter the amount of fluidized particles dispensed onto the carrier substrate.
在上述喷射粘合剂打印系统中，分配模块可包括用于将流化的颗粒散布在载体基底上的辊。In the jetting binder printing system described above, the dispensing module may include a roller for spreading the fluidized particles on the carrier substrate.
在上述喷射粘合剂打印系统中，压实模块可包括顺应性压力带或压力板组件。In the jetting binder printing system described above, the compaction module may include a compliant pressure belt or pressure plate assembly.
在上述喷射粘合剂打印系统中，压实器模块可包括振动能量源，以引起流化颗粒的沉降。In the jetting binder printing system described above, the compactor module may include a vibratory energy source to induce settling of the fluidized particles.
在上述喷射粘合剂打印系统中，所述粘合剂打印机可以包括喷墨打印头。In the above jetting binder printing system, the binder printer may include an inkjet printhead.
在上述喷射粘合剂打印系统中，融合模块可以包括选自以下的能量源：紫外线（UV）源、红外线（IR）源、电子束源和热源。In the jetting binder printing system described above, the fusion module may include an energy source selected from the group consisting of an ultraviolet (UV) source, an infrared (IR) source, an electron beam source, and a heat source.
在上述喷射粘合剂打印系统中，融合模块可以包括反应剂分配器，以分配与粘合剂材料和流化颗粒反应以固定流化颗粒的反应剂。In the above jetting binder printing system, the fusing module may include a reactant dispenser to dispense a reactant that reacts with the binder material and the fluidized particles to immobilize the fluidized particles.
在上述喷射粘合剂打印系统中，材料去除模块可以包括机械粉碎器。In the binder jetting printing system described above, the material removal module may include a mechanical shredder.
在上述喷射粘合剂打印系统中，材料去除模块可以包括气刀。In the jetting binder printing system described above, the material removal module may include an air knife.
在上述喷射粘合剂打印系统中，材料去除模块可以包括真空端口。In the jetting binder printing system described above, the material removal module may include a vacuum port.
在上述喷射粘合剂打印系统中，组装站还可包括横向定位器，以横向移动组装板。In the jetting adhesive printing system described above, the assembly station may further include a lateral positioner to laterally move the assembly plate.
在上述喷射粘合剂打印系统中，组装站还可包括竖直定位器，以竖直移动组装板。In the above jet adhesive printing system, the assembly station may further include a vertical positioner to vertically move the assembly plate.
在上述喷射粘合剂打印系统中，载体基底可以包括用于每个图案化的单层对象的基准标记；并且，所述组装站可包括对准传感器，以将基准标记与组装板相对准。In the jetting adhesive printing system described above, the carrier substrate may include fiducial marks for each patterned single layer object; and, the assembly station may include alignment sensors to align the fiducial marks with the assembly plate.
在上述喷射粘合剂打印系统中，控制器还可控制每一材料层的预定压实范围。In the jetting binder printing system described above, the controller can also control the predetermined compaction range of each material layer.
上述喷射粘合剂打印系统中，转移模块可包括压力辊或压力板。In the above jet adhesive printing system, the transfer module may include a pressure roller or a pressure plate.
根据本发明的另一方面，公开了一种制造三维物体的方法，其包括根据预设的顺序和预设的图案重复地形成图案化的单层对象；将图案化的单层对象按顺序组装到组装板上的三维物体中；其中形成每个图案化的单层对象的步骤包括：将流化颗粒分配到载体基底上以形成材料层；将材料层压实到预设的压实范围；根据预设图案在材料层上打印粘合剂材料；根据预设图案选择性地融合材料层；去除材料层的非融合部分，以形成图案化的单层对象之一；以及，将图案化的单层对象之一从载体基底转移到组装板。According to another aspect of the present invention, a method of manufacturing a three-dimensional object is disclosed, which includes repeatedly forming a patterned single-layer object according to a preset order and a preset pattern; sequentially assembling the patterned single-layer object into a three-dimensional object on an assembly board; wherein the step of forming each patterned single-layer object includes: dispensing fluidized particles onto a carrier substrate to form a material layer; compacting the material layer to a preset compaction range; printing an adhesive material on the material layer according to the preset pattern; patterning one of the single-layer objects; and, transferring one of the patterned single-layer objects from the carrier substrate to the assembly plate.
附图说明Description of drawings
参考以下结合附图对本发明的各种实施方式的详细描述，可以更全面地理解本发明，其中：The present invention can be more fully understood with reference to the following detailed description of various embodiments of the present invention in conjunction with the accompanying drawings, wherein:
图1根据本发明的一实施方式，示出了三维增材制造系统的一些主要部件的框图；Fig. 1 shows a block diagram of some main components of a three-dimensional additive manufacturing system according to an embodiment of the present invention;
图2根据本发明的一实施方式，示出了三维增材制造系统的某些部件之间的关系和通信路径的示意图；Fig. 2 shows a schematic diagram of the relationship and communication paths between some components of the three-dimensional additive manufacturing system according to an embodiment of the present invention;
图3根据本发明的一实施方式，示出了喷射粘合剂打印机模块的部件之间的关系和通信路径的示意图；Figure 3 is a schematic diagram illustrating the relationship and communication paths between components of a jetting adhesive printer module, according to an embodiment of the present invention;
图4根据本发明的一实施方式，示出了通用打印机模块的部件之间的关系和通信路径的示意图；Fig. 4 shows a schematic diagram of the relationship and communication path between components of the general printer module according to an embodiment of the present invention;
图5根据本发明的一实施方式，示出了包括喷射粘合剂打印机模块的三维增材制造系统的一些部件的示意图；5 is a schematic diagram showing some components of a three-dimensional additive manufacturing system including a jetting binder printer module, according to an embodiment of the present invention;
图5a根据本发明的一实施方式，示出了包括喷射粘合剂打印机模块的三维增材制造系统的一些部件的示意图；Figure 5a shows a schematic diagram of some components of a three-dimensional additive manufacturing system including a jetting binder printer module, according to an embodiment of the present invention;
图6根据本发明的一实施方式，示出了流化材料去除模块的示意图；Fig. 6 shows a schematic diagram of a fluidized material removal module according to an embodiment of the present invention;
图7根据本发明的一实施方式，示出了转移模块的示意图；Fig. 7 shows a schematic diagram of a transfer module according to an embodiment of the present invention;
图8根据本发明的一实施方式，示出了转移模块的示意图；Fig. 8 shows a schematic diagram of a transfer module according to an embodiment of the present invention;
图9根据本发明的一实施方式，示出了转移模块的示意图；Fig. 9 shows a schematic diagram of a transfer module according to an embodiment of the present invention;
图10根据本发明的一实施方式，示出了转移模块的示意图；Fig. 10 shows a schematic diagram of a transfer module according to an embodiment of the present invention;
图11根据本发明的一实施方式，示出了三维增材制造系统的一种布置示意图；Fig. 11 shows a schematic layout of a three-dimensional additive manufacturing system according to an embodiment of the present invention;
图12根据本发明的一实施方式，示出了三维增材制造系统的另一布置示意图；Fig. 12 shows another schematic layout of a three-dimensional additive manufacturing system according to an embodiment of the present invention;
图13根据本发明的一实施方式，示出了制造三维物体的方法流程图；Fig. 13 shows a flowchart of a method for manufacturing a three-dimensional object according to an embodiment of the present invention;
图14根据本发明的一实施方式，示出了喷射粘合剂打印机模块中制造图案化的单层对象的方法流程图；Figure 14 is a flow diagram illustrating a method of manufacturing a patterned single-layer object in a jetting binder printer module, according to an embodiment of the present invention;
图15根据本发明的一实施方式，示出了将单层对象组装成三维物体的示意图。Fig. 15 shows a schematic diagram of assembling a single-layer object into a three-dimensional object according to an embodiment of the present invention.
具体实施方式Detailed ways
参考附图来描述本发明，其中，所有附图中所使用的相同的附图标记表示相似或等同的元件。附图未按比例绘制，并且提供附图仅用于说明本发明。下面将参考示例性应用来描述本发明的一些方面。应该理解的是，阐述了许多具体的细节、关系和方法，以提供对本发明的全面理解。然而，相关领域的普通技术人员将容易地意识到，可以在没有一个或多个特定细节的情况下或者通过其它方法来实践本发明。在其它情况下，未详细示出公知的结构或操作，以避免使本发明晦涩难懂。本发明不受所图示的动作或事件的顺序的限制，因为一些动作可以以不同的顺序和/或与其它动作或事件同时发生。此外，并非所有示出的动作或事件都是实施本发明的方法所必需的。The present invention is described with reference to the accompanying drawings, wherein like reference numerals are used throughout to indicate similar or equivalent elements. The drawings are not drawn to scale and are provided solely for the purpose of illustrating the invention. Some aspects of the invention are described below with reference to exemplary applications. It should be understood that numerous specific details, relationships, and methods are set forth in order to provide a thorough understanding of the invention. One of ordinary skill in the relevant art will readily recognize, however, that the present invention may be practiced without one or more of the specific details or by other methods. In other instances, well-known structures or operations have not been shown in detail to avoid obscuring the invention. The invention is not limited by the illustrated order of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. In addition, not all illustrated acts or events may be required to implement the methodology of the invention.
公开了三维增材制造系统。第一和第二打印机模块分别在第一和第二载体基底上形成一系列第一图案化的单层对象和第二图案化的单层对象。图案化的单层对象在组装站的组装板上组装成三维物体。控制器控制在打印机模块上形成的图案化的单层对象的顺序和图案，以及将第一图案化的单层对象和第二图案化的单层对象组装到组装板上的三维物体的顺序。第一转移模块在第一转移区内将第一图案化的单层对象从第一载体基底转移至组装站，第二转移模块在第二转移区内将第二图案化的单层对象从第二载体基底转移至组装站。第一和第二打印机模块被配置为分别在第一和第二沉积条件下沉积第一和第二材料。第一和第二材料不同，和/或第一和第二沉积条件不同。A three-dimensional additive manufacturing system is disclosed. The first and second printer modules form a series of first and second patterned single layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into three-dimensional objects on assembly plates at the assembly station. The controller controls the sequence and pattern of the patterned single-layer objects formed on the printer module, and the sequence of assembling the first patterned single-layer object and the second patterned single-layer object to the three-dimensional object on the assembly board. The first transfer module transfers the first patterned single-layer object from the first carrier substrate to the assembly station in the first transfer zone, and the second transfer module transfers the second patterned single-layer object from the second carrier substrate to the assembly station in the second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different, and/or the first and second deposition conditions are different.
定义definition
为了更容易地理解本发明，下面提供了某些定义：In order to more easily understand the present invention, some definitions are provided below:
打印机模块-图案化和沉积系统，其被配置为在载体基底上创建打印对象（也称为单层对象）。Printer Module - a patterning and deposition system configured to create printed objects (also called monolayer objects) on a carrier substrate.
转移模块-一种传送系统，其被配置为从打印机模块接收打印对象并将该打印对象转移到打印部件的打印层中。transfer module - a transport system configured to receive a print object from a printer module and transfer the print object into a print layer of a print component.
组装装置-一种系统，其被配置为从多个转移模块接收打印对象，并按照预设顺序（由控制器指示）组装接收到的打印对象，以便按照预定设计形成打印部件。Assembly Apparatus - A system configured to receive print objects from a plurality of transfer modules and assemble the received print objects in a preset order (directed by the controller) to form printed parts according to a predetermined design.
打印部件-堆叠的打印层，融合在一起形成符合预定设计的部件（三维物体）。Printed Part - Stacked printed layers that fuse together to form a part (3D object) that conforms to a predetermined design.
打印层-材料层，一个体素厚，其包括一个或多个打印对象。这些打印对象以及由此获得的打印层符合特定打印零件设计的要求。例如，打印层可能由两个打印对象组成，其中第一对象在第一打印机模块上制成，而第二打印对象在第二打印机模块上制成。Print Layer - Material layer, one voxel thick, which contains one or more print objects. These printed objects and the resulting printed layers conform to the requirements of the specific printed part design. For example, a print layer may consist of two print objects, where a first print object is made on a first printer module and a second print object is made on a second printer module.
打印对象-在打印机模块上形成的一个体素厚的材料层。也称为单层对象。当按照预设顺序组装并融合到打印零件（三维物体）中时，所得的三维物体符合特定打印零件设计的要求。打印对象（单层对象）的图案与打印部件中的预设位置处的图案一致。Print Object - A voxel-thick layer of material formed on a printer module. Also known as a single-layer object. When assembled in a preset order and fused into a printed part (3D object), the resulting 3D object conforms to the requirements of the specific printed part design. The pattern of the printed object (single-layer object) matches the pattern at the preset position in the printed part.
先前转移的对象-在当前转移打印对象（单层对象）之前已在组装装置处组装好的打印对象的整个组件。当前正在转移的打印对象可能会添加到最顶层，在这种情况下，最顶层还没有根据打印部件设计所需的所有打印对象。Previously transferred object - the entire assembly of a printed object that has been assembled at the assembly device prior to the current transferred printed object (single-layer object). Print objects currently being transferred may be added to the topmost layer, in which case the topmost layer does not yet have all the print objects required according to the print part design.
多个打印机模块multiple printer modules
本发明的多材料，多方法的3D打印机系统包括多个打印机模块的布置。每个打印机模块都包含用于创建精确而坚固的打印对象（单层对象）的机构。每个打印对象可包括预定材料并符合一组预定的物理要求。多个打印机模块中的每一个可以耦合到多个转移模块中的其中一个并与之通信。多个转移模块中的每一个可以包括载体基底，在其上相关的打印机模块可以形成3D打印对象。每个转移模块还可包括传送机构，以将打印对象转移传送到组装设备。组装设备可以包括构建站，并且还可包括定位装置。该构建站有时被称为组装装置。The multi-material, multi-process 3D printer system of the present invention includes an arrangement of multiple printer modules. Each printer module contains mechanisms for creating precise and robust printed objects (single-layer objects). Each printed object may comprise a predetermined material and conform to a predetermined set of physical requirements. Each of the plurality of printer modules can be coupled to and communicate with one of the plurality of transfer modules. Each of the plurality of transfer modules may include a carrier substrate on which an associated printer module may form a 3D printed object. Each transfer module may also include a transfer mechanism to transfer the printed object to the assembly device. The assembly apparatus may include a build station, and may also include a positioning device. The build station is sometimes referred to as an assembly unit.
打印对象堆叠在一起形成打印部件Printed objects are stacked together to form printed parts
图1根据本发明的实施方式，示出了三维增材制造系统100。图1所示的部件与图2所示的计算机系统10（控制器）所指令的其余部件协同工作。计算机系统10由设计文件310程序控制，该文件可以包含中央处理器320为使3D多材料多方法打印机系统100的多个组件创建要构造的预设多材料打印部件（三维物体）所需的所有信息。Fig. 1 shows a three-dimensional additive manufacturing system 100 according to an embodiment of the present invention. The components shown in FIG. 1 work in conjunction with the remaining components directed by the computer system 10 (controller) shown in FIG. 2 . The computer system 10 is programmed by a design file 310 which may contain all the information the central processor 320 needs to cause the various components of the 3D multi-material multi-process printer system 100 to create a preset multi-material printed part (three-dimensional object) to be constructed.
如图1所示，所述三维增材制造系统100可包括多个沉积并图案化（打印）模块A，多个转移模块B和多个传送机构C。每个传送机构C连接到组装站110，所述组装站110连接到定位模块230。可以选择多材料，多方法打印机系统的打印机模块A，以使其能够在预定材料中创建具有所需物理特性的打印对象。在一实施例中，包含在打印机系统中的至少一半的打印机模块可以基于喷射粘合剂技术。As shown in FIG. 1 , the three-dimensional additive manufacturing system 100 may include a plurality of deposition and patterning (printing) modules A, a plurality of transfer modules B and a plurality of transfer mechanisms C. Each conveyor C is connected to an assembly station 110 connected to a positioning module 230 . Printer Module A of a multi-material, multi-method printer system can be selected to enable it to create printed objects with desired physical properties in predetermined materials. In an embodiment, at least half of the printer modules included in the printer system may be based on jetting adhesive technology.
来自多个打印机模块中的每一个的多个打印对象可以被转移到组装站110以形成打印层。多个打印层可以依次堆叠，以形成一个或多个多材料打印部件（三维物体）。Multiple print objects from each of the multiple printer modules may be transferred to assembly station 110 to form print layers. Multiple print layers can be stacked in sequence to form one or more multi-material printed parts (3D objects).
定位模块230可用于相对于多个传送机构C中的任意指定的一个来定位组装（或构建）站110。构建站110和定位装置230的结合包括组装设备。The positioning module 230 may be used to position the assembly (or build) station 110 relative to any given one of the plurality of transfer mechanisms C. As shown in FIG. The combination of build station 110 and positioning device 230 comprises an assembly device.
计算机系统computer system
图2示出了用于控制制造系统100的示例性计算机系统。每个打印机模块或工作站A都包含一个相关的打印站控制器401、402、 403。如图2所示，打印站控制器401、402、403由中央处理单元320通过接口总线350控制。中央处理单元320还可以协调组装设备C的动作。计算机系统10还包括用于加载设计文件310和其它操作指令的输入设备302，用于存储设计文件以供中央处理单元320直接访问的存储器306以及输出设备304。FIG. 2 illustrates an exemplary computer system for controlling manufacturing system 100 . Each printer module or workstation A contains an associated print station controller 401,402,403. As shown in FIG. 2 , the printing station controllers 401 , 402 , 403 are controlled by the central processing unit 320 through the interface bus 350 . The central processing unit 320 can also coordinate the actions of the assembly equipment C. Computer system 10 also includes input device 302 for loading design files 310 and other operating instructions, memory 306 for storing design files for direct access by central processing unit 320 , and output device 304 .
图3示出了单独的喷射打印站控制器。如图3所示，中央处理单元320连接到喷射粘合剂打印机模块的组件。打印站控制单元401代表多个打印站控制单元中的其中一个，并通过装置控制器420控制喷射粘合剂打印机模块的载体装置200、分配装置20、压实装置30、打印装置40、固化装置50和流化材料去除装置60的动作。Figure 3 shows a jet print station controller alone. As shown in FIG. 3, the central processing unit 320 is connected to the components of the jetting adhesive printer module. The printing station control unit 401 represents one of the plurality of printing station control units, and controls the actions of the carrier device 200, the dispensing device 20, the compacting device 30, the printing device 40, the curing device 50 and the fluidized material removal device 60 of the jet adhesive printer module through the device controller 420.
图4示出了除了喷射粘合剂打印机模块之外的3D打印机模块的控制配置。不管基于何种打印技术，中央处理单元320和打印站控制单元401之间的接口可以相同。打印站控制单元和打印机模块的组件1 451、组件2 452和组件n 453之间的接口可以基于打印机模块性能的要求来定制，以优化性能。在一些实施例中，装置控制器420可以位于打印站控制单元401与各个组件451、452、453的中间。在另一个实施例中，打印站控制单元401可以与各个组件451、452、453直接通信。Fig. 4 shows the control configuration of the 3D printer module other than the jetting binder printer module. Regardless of the printing technology based, the interface between the central processing unit 320 and the printing station control unit 401 may be the same. The interface between the print station control unit and the component 1 451 , component 2 452 and component n 453 of the printer module can be tailored based on the printer module performance requirements to optimize performance. In some embodiments, the device controller 420 may be located intermediate the printing station control unit 401 and the various components 451 , 452 , 453 . In another embodiment, the printing station control unit 401 may communicate directly with the various components 451 , 452 , 453 .
在一个实施例中，每个打印机模块可以由专用控制器控制、并且每个打印机控制模块可以由中央处理单元协调，以按照适合于组装打印层和打印部件的顺序来创建打印对象。In one embodiment, each printer module may be controlled by a dedicated controller, and each printer control module may be coordinated by a central processing unit, to create print objects in an order appropriate for assembling print layers and print parts.
3D打印机系统3D printer system
图5示出3D打印机系统的一些基本部件。为简单起见，图5中仅示出了多个打印机模块A和转移模块B中的一个。图5还示出了打印机模块A、转移模块B和组装设备C之间的可能关系。Figure 5 shows some basic components of a 3D printer system. For simplicity, only one of the plurality of printer modules A and transfer modules B is shown in FIG. 5 . Figure 5 also shows a possible relationship between the printer module A, the transfer module B and the assembly device C.
喷射粘合剂打印机模块Jet Binder Printer Module
图5的打印机模块A表示喷射粘合剂打印机模块1，且其包括用于从单一粉末材料产生符合预设物理规格的打印对象的部件。喷射粘合剂打印机模块1可以在转移模块B的载体基底200上创建打印对象。Printer module A of Fig. 5 represents a jetting binder printer module 1, and it includes components for producing a printed object meeting preset physical specifications from a single powder material. The jetting adhesive printer module 1 can create printed objects on the carrier substrate 200 of the transfer module B.
转移模块transfer module
除载体基底200外，转移模块B还可包括一个或多个缓冲设备212和210以及传送设备76。载体基底200可包括机械稳定材料，例如但不限于钢合金、铜合金或聚合材料的环形环（环形带）。载体基底200还可包括机械稳定的材料，该材料涂覆有用于控制打印对象对载体基底200的粘附的材料。可以选择涂覆在载体基底200上的粘附控制材料，以将打印材料的粘合力控制在当前打印对象的3D打印材料的预定范围内。粘附控制材料可以包括例如硅树脂材料，含氟聚合物材料或薄膜金属，例如金。In addition to carrier substrate 200 , transfer module B may also include one or more buffer devices 212 and 210 and transfer device 76 . The carrier substrate 200 may comprise a mechanically stable material such as, but not limited to, a steel alloy, a copper alloy, or an annular ring (annular belt) of a polymeric material. The carrier substrate 200 may also include a mechanically stable material coated with a material for controlling the adhesion of the printed object to the carrier substrate 200 . The adhesion control material coated on the carrier substrate 200 may be selected to control the adhesion of the printing material within a predetermined range of the 3D printing material of the current printing object. Adhesion control materials may include, for example, silicone materials, fluoropolymer materials or thin film metals such as gold.
在替代实施例中，如图5a所示，载体基底200可包括一定长度的机械稳定材料，该材料从原料卷214进入转移模块B。原料卷214可以设置在转移模块A的远端。在转移区240中将打印对象从载体基底200转移之后，可以将使用过的载体200的长度累积在收卷轴216上。图5a的载体基底200可以包括机械稳定材料，该材料涂覆有用于控制打印对象与载体基底200的粘附的材料。可以选择涂覆在载体基底200上的粘附控制材料，以将打印材料的粘合力控制在当前打印对象的3D打印材料的预定范围内。粘附控制材料可以包括例如硅树脂材料，含氟聚合物材料或薄膜金属，例如金。在任何情况下，当打印机系统运行时，载体基底都会沿着行进方向移动。In an alternative embodiment, the carrier substrate 200 may comprise a length of mechanically stable material that enters the transfer module B from the stock roll 214, as shown in FIG. 5a. A stock roll 214 may be disposed at the distal end of the transfer module A. After transfer of printed objects from carrier substrate 200 in transfer zone 240 , a length of used carrier 200 may be accumulated on take-up spool 216 . The carrier substrate 200 of FIG. 5 a may comprise a mechanically stable material coated with a material for controlling the adhesion of the printed object to the carrier substrate 200 . The adhesion control material coated on the carrier substrate 200 may be selected to control the adhesion of the printing material within a predetermined range of the 3D printing material of the current printing object. Adhesion control materials may include, for example, silicone materials, fluoropolymer materials or thin film metals such as gold. In any event, when the printer system is in operation, the carrier substrate moves in the direction of travel.
根据本发明的实施方式，喷射粘合剂打印机模块1可以与转移模块B的载体基底200通信，以便在载体基底200上创建3D打印物体。According to an embodiment of the invention, the jetting adhesive printer module 1 may communicate with the carrier substrate 200 of the transfer module B in order to create a 3D printed object on the carrier substrate 200 .
在转移模块B的远端，可以设置分配装置20。分配装置有时被称为分配模块。所述分配装置20可以简单地是配置为分配流化材料的分配器。分配装置20可以包括材料储存器21和分配控制器22。所述分配控制器22可被配置为精确地计量分配到载体基底200上的流化材料的量。分配控制器22还可被配置为精确地控制所沉积的流化材料的均匀性。 分配模块可以包括将流化颗粒散布在载体基底上的辊。At the distal end of the transfer module B, a dispensing device 20 may be provided. Dispensing devices are sometimes referred to as dispensing modules. The dispensing device 20 may simply be a dispenser configured to dispense fluidized material. Dispensing apparatus 20 may include a material storage 21 and a dispensing controller 22 . The dispensing controller 22 may be configured to precisely meter the amount of fluidized material dispensed onto the carrier substrate 200 . The distribution controller 22 can also be configured to precisely control the uniformity of the deposited fluidized material. The dispensing module may include a roller that spreads the fluidized particles on the carrier substrate.
在转移模块B的远端附近，可以设置压实装置30。压实装置有时被称为压实模块。压实模块沿着行进方向位于分配模块的下游。在一些实施例中，压实装置30可包括由设计为圆柱形管的硬化金属材料制成的辊。在其它实施例中，压实装置30可包括顺应性压力带，或被构造成施加与沉积的流化材料和载体基底200的平面正交的受控压力的其它装置。 压实装置30还可包括被构造成提供振动的沉降装置。压实装置30的振动可以改善流化材料的分布和压实。在一些实施例中，压实装置30可构造成将流化的材料压实至流化材料的理论密度的至少40%的高密度。Near the distal end of the transfer module B, a compacting device 30 may be provided. A compaction device is sometimes referred to as a compaction module. The compaction module is located downstream of the distribution module in the direction of travel. In some embodiments, the compacting device 30 may comprise rollers made of a hardened metal material designed as a cylindrical tube. In other embodiments, compaction device 30 may comprise a compliant pressure belt, or other device configured to apply a controlled pressure normal to the plane of the deposited fluidized material and carrier substrate 200 . The compaction device 30 may also include a settling device configured to provide vibration. Vibration of the compaction device 30 can improve distribution and compaction of the fluidized material. In some embodiments, compaction device 30 may be configured to compact the fluidized material to a high density of at least 40% of the theoretical density of the fluidized material.
打印装置printing device
在载体基底200的远端附近，可以设置打印装置40（也称为粘合剂打印机）。粘合剂打印机沿着行进方向位于压实模块的下游。打印装置40可以被设置成将液态粘合材料以预定图案固定到流化材料中。通过将流化材料结合成连接的坚固块，可以将精确的图案固定在流化材料中。在一些实施例中，打印装置40可以是在图2和图3的计算机系统的直接控制下的喷墨式打印头。可以使用一组图案化指令，例如预设的CAD（计算机辅助设计）程序来指令计算机系统。Near the distal end of the carrier substrate 200, a printing device 40 (also referred to as an adhesive printer) may be provided. The binder printer is located downstream of the compaction module in the direction of travel. The printing device 40 may be arranged to immobilize the liquid binding material into the fluidized material in a predetermined pattern. Precise patterns can be fixed in the fluidized material by combining the fluidized material into connected solid blocks. In some embodiments, printing device 40 may be an inkjet printhead under the direct control of the computer system of FIGS. 2 and 3 . The computer system may be instructed using a patterned set of instructions, such as a preset CAD (Computer Aided Design) program.
打印装置40可包括具有横跨载体基底200的宽度方向的具有喷嘴的喷墨式打印头。所述喷墨式打印头也可以足够的密度设置，以实现期望的打印分辨率。喷墨式打印头可以被固定在适当的位置，并且每个喷嘴的功能可以与载体基底200的运动相协调，以在流化材料中产生期望的图案。载体基底200相对于打印装置40的移动可以由近端缓冲器212和作为受控计算机系统10的打印装置电机250来实现。可以在近端缓冲器212和远端缓冲器210之间设置其它的缓冲器，以便于更精确地控制正在显影的3D打印物体和喷射的粘合剂打印机模块1的任何组件之间的相互作用。The printing device 40 may include an inkjet printhead having nozzles across the width direction of the carrier substrate 200 . The inkjet printheads can also be arranged in sufficient density to achieve a desired print resolution. The inkjet printheads can be fixed in place, and the function of each nozzle can be coordinated with the movement of the carrier substrate 200 to produce a desired pattern in the fluidized material. Movement of the carrier substrate 200 relative to the printing device 40 may be effected by the proximal buffer 212 and the printing device motor 250 as the controlled computer system 10 . Additional buffers may be provided between the proximal buffer 212 and the distal buffer 210 in order to more precisely control the interaction between the 3D printed object being developed and any components of the jetting adhesive printer module 1 .
在替代实施例中，打印装置40可以包括喷墨头，该喷墨头包括比横跨载体基底200的宽度所需的喷嘴更少的喷嘴，并且仍然实现载体基底200的整个宽度和期望分辨率的打印对象。喷墨头可以在计算机控制下在载体基底200的整个宽度上移动，并且可以协调喷墨式打印头和近端缓冲器212以及打印驱动电机250的移动，以在流化材料中实现期望的固定打印图案。In alternative embodiments, printing device 40 may include an inkjet head that includes fewer nozzles than are required across the width of carrier substrate 200 and still achieve printing objects across the width of carrier substrate 200 and at a desired resolution. The inkjet head can be moved across the width of the carrier substrate 200 under computer control, and movement of the inkjet printhead and proximal buffer 212 and print drive motor 250 can be coordinated to achieve a desired fixed print pattern in the fluidized material.
打印装置40可包括一个或多个可商购的打印头。例如，富士胶片株式会社（Fujifilm）提供的一系列具有广泛特性的打印头，以满足预期的要求范围。在优选的实施方式中，打印装置40可以在打印头的每个脉冲下，将所测量的和可调节量的粘合剂传送给打印对象91的目标体素。打印装置40可以在计算机系统的控制下向每个体素传送一个或多个测量的体积。在一优选的实施方式中，打印头40可以具有600dpi的分辨率，并且每个喷嘴在每个脉冲期间可以沉积高达200微微升（pl）。Printing device 40 may include one or more commercially available printheads. For example, Fujifilm offers a range of printheads with a wide range of characteristics to meet the expected range of requirements. In a preferred embodiment, the printing device 40 can deliver a measured and adjustable amount of adhesive to a target voxel of the printing object 91 with each pulse of the print head. The printing device 40 may transmit one or more measured volumes to each voxel under the control of the computer system. In a preferred embodiment, the printhead 40 may have a resolution of 600 dpi, and each nozzle may deposit up to 200 picoliters (pl) during each pulse.
固化装置Curing device
在载体基底200的中心附近，可以设置固化装置（或融合模块）50。融合模块或固化装置50沿着行进方向位于粘合剂打印机的下游。固化装置50可以被设置成固化液态粘合材料，从而以坚固的固体图案固定暴露于液态粘合材料中的流化材料。固化装置50的可以是辐射能源，其可以与液态粘合材料相互作用以使其变成固体。在一些实施例中，辐射能可以是IR辐射、UV辐射、电子束或其它已知的辐射类型。或者，融合模块50可以包括热源。应该理解的是，固化装置50不必限于所公开的辐射类型，因为该列举是针对示例性实施例给出的，并且并非旨在穷举。或者，固化装置50可以包括用于分散反应剂的装置。可以将反应剂设置为与液态粘合材料和流化材料反应，以将流化材料转化为坚固的物质。Near the center of the carrier substrate 200, a curing device (or fusion module) 50 may be provided. A fusion module or curing device 50 is located downstream of the adhesive printer in the direction of travel. The curing device 50 may be configured to cure the liquid bonding material, thereby immobilizing the fluidized material exposed to the liquid bonding material in a firm solid pattern. Curing device 50 may be a radiant energy source that may interact with the liquid bonding material to cause it to solidify. In some embodiments, the radiation energy may be IR radiation, UV radiation, electron beam, or other known types of radiation. Alternatively, fusion module 50 may include a heat source. It should be understood that curing device 50 is not necessarily limited to the disclosed radiation types, as this list is given for exemplary embodiments and is not intended to be exhaustive. Alternatively, curing device 50 may include means for dispersing reactants. Reactants can be arranged to react with the liquid binding material and the fluidized material to convert the fluidized material into a firm substance.
流化材料去除装置Fluidized Material Removal Unit
相对于载体基底200的移动，可以在固化装置50的下游设置流化材料去除装置60。流化材料去除装置60有时被称为材料去除模块。材料去除模块沿着行进方向位于融合模块的下游。流化材料去除装置60可以被设置成去除沉积并压实在载体基底200上的所有流化材料。流化材料去除装置60可以去除沉积并压实在载体基底上的流化材料，但是不会被液态粘合材料固定住。A fluidized material removal device 60 may be provided downstream of the curing device 50 with respect to the movement of the carrier substrate 200 . The fluidized material removal device 60 is sometimes referred to as a material removal module. The material removal module is located downstream of the fusion module in the direction of travel. The fluidized material removal device 60 may be configured to remove any fluidized material deposited and compacted on the carrier substrate 200 . The fluidized material removal device 60 removes fluidized material deposited and compacted on the carrier substrate, but not held in place by the liquid binding material.
在图6中详细示出了流化材料去除装置60。如图6所示，流化材料去除装置60包括具有远端和近端的外壳63。具有打印对象91的固定的流化材料88和压实的流化材料85的载体基底200可以从外壳63的远端移动到近端。外壳63可包含破坏装置61(机械破坏器)，例如刷子或探针，以松散压实的粉末84。破坏装置61可被设计成具有足以破坏尚未被来自打印装置40的粘合剂固定在适当位置的压实粉末的破坏强度，但不具有能够破坏已经由来自打印装置40的粘合剂处理并由图5的固化装置50固定的压实粉末的破坏强度。一旦由来自于图5的打印装置40的粘合剂固定到位的粉末被散开，则残留的粉末86可通过气刀装置62被进一步移动和气雾化。当未固定的压实粉末84在外壳63内完全移出并气雾化时，固定粉末88可保持附着在载体基底200上。可以通过附接到真空端口64的真空力将气雾化的压实粉末84从外壳63中去除。The fluidized material removal device 60 is shown in detail in FIG. 6 . As shown in Figure 6, the fluidized material removal device 60 includes a housing 63 having a distal end and a proximal end. The carrier substrate 200 with the immobilized fluidized material 88 and the compacted fluidized material 85 of the print object 91 can be moved from the distal end to the proximal end of the housing 63 . The housing 63 may contain a breaking device 61 (mechanical breaker), such as a brush or a probe, to loosen the compacted powder 84 . The breaking device 61 may be designed to have a breaking strength sufficient to break compacted powder that has not been held in place by the binder from the printing device 40, but not have a breaking strength capable of breaking compacted powder that has been treated with the binder from the printing device 40 and fixed by the curing device 50 of FIG. Once the powder held in place by the binder from the printing device 40 of FIG. 5 is dispersed, the remaining powder 86 may be further moved and aerosolized by the air knife device 62 . Fixed powder 88 may remain attached to carrier substrate 200 while unfixed compacted powder 84 is fully removed within housing 63 and aerosolized. The aerosolized compacted powder 84 may be removed from the housing 63 by the force of a vacuum attached to the vacuum port 64 .
转移模块transfer module
如上所述，每个多方法打印机系统可以设置多个转移模块B。在一实施方式中，一转移模块B可以设置成与和打印机系统相关联的多个打印机 A中的每一个相通信。转移模块B沿着行进方向设置于材料去除模块的下游。转移模块B可设置有用于创建打印对象的基底并将打印对象从所述基底（载体基底200）转移至组装装置C。如图5所示，转移模块B包括基底200、一个或多个缓冲器210和/或212、一个或多个基底驱动器250、260以及转移区240。在一些实施例中，可以在流化材料去除装置60和转移区240（也称为传送区）之间设置近端缓冲器212，以便于相对于转移区240协调3D打印对象和喷射式粘结剂打印机模块1的组件。As mentioned above, a plurality of transfer modules B may be provided per multi-method printer system. In one embodiment, a transfer module B may be configured to communicate with each of a plurality of printers A associated with the printer system. The transfer module B is arranged downstream of the material removal module in the direction of travel. The transfer module B may be provided with a substrate for creating a printed object and transfer the printed object from said substrate (carrier substrate 200 ) to the assembly device C. As shown in FIG. 5 , the transfer module B includes a substrate 200 , one or more buffers 210 and/or 212 , one or more substrate drivers 250 , 260 and a transfer area 240 . In some embodiments, a proximal buffer 212 may be provided between the fluidized material removal device 60 and the transfer zone 240 (also referred to as the transfer zone) to facilitate coordination of the 3D printed object and the components of the jet binder printer module 1 relative to the transfer zone 240 .
基底200可以包括具有一定长度的柔性材料，其可以按比例缩放以使其宽度等于或大于构建板80。载体基底200的材料可以是但不限于钢合金或聚合材料，例如聚酯或聚四氟乙烯，或复合材料。可以选择载体基底200的表面，以控制基底200与要被相关的打印机模块打印的材料之间的粘附力。在一个实施例中，基底200可包括材料环，该材料环可从远端缓冲装置210穿过近端缓冲装置212横穿转移模块B，并通过转移装置76返回到远端缓冲器212。Substrate 200 may comprise a length of flexible material that may be scaled to have a width equal to or greater than build plate 80 . The material of the carrier substrate 200 may be, but is not limited to, a steel alloy or a polymeric material, such as polyester or polytetrafluoroethylene, or a composite material. The surface of the carrier substrate 200 can be selected to control the adhesion between the substrate 200 and the material to be printed by the associated printer module. In one embodiment, substrate 200 may include a loop of material that may traverse transfer module B from distal buffer 210 , through proximal buffer 212 , and back to distal buffer 212 through transfer 76 .
转移模块B可包括除了远端缓冲器210和近端缓冲器212之外的缓冲器，以便提供载体基底200相对于打印机模块A的组件和转移装置76的不同的移动，以适应沉积、图案化以及将打印对象转移至构建板80或先前转移的对象90的堆叠的顶部之间的不同移动要求。Transfer module B may include buffers in addition to distal buffer 210 and proximal buffer 212 to provide for differential movement of carrier substrate 200 relative to the components of printer module A and transfer device 76 to accommodate differing movement requirements between deposition, patterning, and transfer of printed objects to build plate 80 or to the top of a stack of previously transferred objects 90.
可以通过打印驱动电机250和转移驱动电机260来移动载体基底200。基底200还可以设置有其它装置，以便于根据打印对象形成和转移到构建站110的各个步骤的要求来控制基底200的移动。相对于载体基底200的渐进运动，可以在流化材料去除装置60的下游实施转移装置76。可以通过远端缓冲装置210和转移电机驱动器260来协调3D打印物体在载体基底200上通过转移区240的移动，这可以由图2和图3的计算机系统来控制。The carrier substrate 200 may be moved by the print driving motor 250 and the transfer driving motor 260 . The base 200 may also be provided with other devices in order to control the movement of the base 200 according to the requirements of each step of printing object formation and transfer to the build station 110 . With respect to the progressive movement of the carrier substrate 200 , a transfer device 76 may be implemented downstream of the fluidized material removal device 60 . Movement of the 3D printed object on the carrier substrate 200 through the transfer zone 240 may be coordinated by the remote buffer device 210 and the transfer motor drive 260, which may be controlled by the computer system of FIGS. 2 and 3 .
辊转移装置Roll transfer device
如图7所示，转移装置76可以被配置为通过引起打印对象91与构建板80或先前转移的打印对象90的堆叠的顶部之间的接触和压力来从载体基底200转移打印对象91。在如图7所示的转移装置76的实施例中，转移装置76包括辊79和用于垂直地支撑和移动辊79的载体。在一些实施例中，载体可以是双轴载体77，以相对于载体基底200垂直和水平移动辊79。双轴载体77的垂直移动可能会使载体基底200偏转并使打印对象91与构建板80或先前转移的打印对象90的堆叠顶部进行压力接触。然后，双轴载体77的水平移动可产生一沿预设方向从打印对象91的一端到打印对象91的另一端的逐步移动的线接触。横跨打印对象91的移动线接触可以将打印对象91转移到构建板80或先前转移的打印对象90的堆叠的顶部。转移装置76还可包括粘附调节装置74。As shown in FIG. 7 , transfer device 76 may be configured to transfer printed object 91 from carrier substrate 200 by inducing contact and pressure between printed object 91 and build plate 80 or the top of a stack of previously transferred printed objects 90 . In the embodiment of the transfer device 76 as shown in FIG. 7 , the transfer device 76 includes a roller 79 and a carrier for vertically supporting and moving the roller 79 . In some embodiments, the carrier may be a biaxial carrier 77 to move the rollers 79 vertically and horizontally relative to the carrier substrate 200 . Vertical movement of biaxial carrier 77 may deflect carrier substrate 200 and bring printed object 91 into pressure contact with build plate 80 or the top of a stack of previously transferred printed objects 90 . Then, the horizontal movement of the biaxial carrier 77 can generate a line contact moving step by step from one end of the printing object 91 to the other end of the printing object 91 along the predetermined direction. Moving line contact across printed object 91 may transfer printed object 91 to build plate 80 or the top of a stack of previously transferred printed objects 90 . Transfer device 76 may also include adhesion adjustment device 74 .
粘附调节装置Adhesion conditioning device
可以设置调节打印对象91与载体基底200的粘附强度，以促进打印对象91释放到构建板80或先前转移的答应对象90的堆叠的顶部的粘附调节装置74。粘附调节装置74可以进一步改变打印对象91与构建板80的表面或先前转移的打印对象的堆叠的顶部之间的粘附力，从而使得打印对象91与载体基底200之间的粘附强度小于打印对象91与构建板80或先前转移的打印对象90的堆叠的顶部之间的粘合强度。粘附调节装置74可通过对载体基底200或打印对象91或两者施加刺激而作用在载体基底200与打印对象91之间的界面上。施加刺激可以便于减少打印对象91对载体基底200的粘附。引起粘附调节装置74的粘附调节的刺激可以是但不限于热刺激、辐射刺激、磁刺激、机械刺激或粒子束刺激。 打印对象91还可以包括对准基准102。Adhesion adjustment means 74 may be provided to adjust the adhesion strength of printed object 91 to carrier substrate 200 to facilitate release of printed object 91 to build plate 80 or to the top of a stack of previously transferred receptive objects 90 . The adhesion adjustment device 74 may further change the adhesion between the printed object 91 and the surface of the build plate 80 or the top of the stack of previously transferred printed objects 90 such that the adhesive strength between the printed object 91 and the carrier substrate 200 is less than the adhesive strength between the printed object 91 and the build plate 80 or the top of the stack of previously transferred printed objects 90. Adhesion modulating device 74 may act on the interface between carrier substrate 200 and printed object 91 by applying a stimulus to carrier substrate 200 or printed object 91 or both. Applying a stimulus may facilitate reducing adhesion of the printed object 91 to the carrier substrate 200 . The stimulus that causes adhesion modulation of the adhesion modulation device 74 may be, but is not limited to, thermal stimulation, radiation stimulation, magnetic stimulation, mechanical stimulation, or particle beam stimulation. Print object 91 may also include alignment datum 102 .
压力装置pressure device
在另一实施例中，如图8所示，转移装置76可以包括压力装置82。压力装置82可以设置有单轴载体78，以提供压力装置82的垂直移动。压力装置82的垂直移动可以使载体基底200垂直偏转，并使打印对象91在压力下与构建板80或先前转移的打印对象的堆叠的顶部之间的接触。图8中的转移装置76还可包括类似于图7的粘附调节装置74的粘附调节装置74。In another embodiment, as shown in FIG. 8 , the transfer device 76 may include a pressure device 82 . The pressure device 82 may be provided with a uniaxial carrier 78 to provide vertical movement of the pressure device 82 . Vertical movement of pressure device 82 may vertically deflect carrier substrate 200 and bring print object 91 under pressure into contact between build plate 80 or the top of a stack of previously transferred print objects. The transfer device 76 in FIG. 8 may also include an adhesion regulating device 74 similar to the adhesion regulating device 74 of FIG. 7 .
形状调节装置shape adjustment device
在本发明的另一个实施例中，如图9所示，所述转移装置76可以设置有压力装置82和形状调节装置72。图9的转移装置76还可以设有单轴载体78，其可以提供压力装置82的垂直移动。压力装置82的垂直移动可以使载体基底200垂直偏转，并使打印对象91在压力下与构建板80或先前转移的打印对象的堆叠的顶部相接触。形状调节装置72可以包括预成形的形状结构，其可以由弹性材料构成，该弹性材料可以通过垂直于成形表面施加的机械压力而变平。当单轴载体78使打印对象与构建板80或先前转移的打印对象90的堆叠的顶部接触时，形状调节装置72可以逐渐变平，从而逐渐使打印对象91与构建板80或先前转移的打印对象90的堆叠的顶部接触。在构建板80或先前转移的打印对象90的堆叠的顶部之间的逐渐移动接触可以确保打印对象91与构建板80或先前转移的打印对象90的堆叠的顶部之间的均匀附接。图9的转移装置76还可以包括类似于图7的粘附调节装置74的粘附调节装置74。In another embodiment of the present invention, as shown in FIG. 9 , the transfer device 76 may be provided with a pressure device 82 and a shape adjustment device 72 . The transfer device 76 of FIG. 9 can also be provided with a uniaxial carrier 78 which can provide vertical movement of the pressure device 82 . Vertical movement of pressure device 82 may vertically deflect carrier substrate 200 and bring print object 91 under pressure into contact with build plate 80 or the top of the stack of previously transferred print objects. The shape-adjusting device 72 may comprise a pre-formed shape structure, which may be constructed of an elastic material that can be flattened by mechanical pressure applied perpendicular to the forming surface. As the uniaxial carrier 78 brings the print object into contact with the build plate 80 or the top of the stack of previously transferred print objects 90, the shape adjustment device 72 may gradually flatten to gradually bring the print object 91 into contact with the build plate 80 or the top of the stack of previously transferred print objects 90. Gradually moving contact between the build plate 80 or the top of the stack of previously transferred printed objects 90 can ensure even attachment between the printed object 91 and the build plate 80 or the top of the stack of previously transferred printed objects 90 . The transfer device 76 of FIG. 9 may also include an adhesion regulating device 74 similar to the adhesion regulating device 74 of FIG. 7 .
铰接式转移装置Articulated transfer device
在本发明的又一实施方式中，如图10所示，转移装置76可以设置有成形压力装置84和铰接装置83。图10的转移装置76还可以设置一双轴载体77，其可以提供成形压力装置84的水平和垂直运动。在计算机系统10的控制下，成形压力装置84的垂直和水平运动可使得承载基底200垂直偏转，并使打印对象91在压力下与构建板80或先前转移的打印对象的堆叠的顶部相接触。双轴载体的垂直运动可使得成形压力装置84的预设端与载体基底200压力接触，从而使得打印对象91的预设端与构建板80或先前转移的打印对象90的堆叠的顶部接触。双轴载体77与铰接装置83的进一步垂直和水平运动的配合，可以使成形压力装置84的整个成形表面在压力的作用下逐渐与载体基底200进行线接触。与载体200的组件线接触可使得载体基底200偏斜，从而形成打印对象91与构建板80或先前转移的打印对象90的堆叠的顶部之间的渐进线接触。打印对象91与构建板80或先前转移的打印对象90的堆叠的顶部之间的渐进线接触足以将打印对象91转移至构建板80或先前转移的打印对象90的堆叠的顶部。图10的转移装置76还可包括类似于图7的粘附调节装置74的粘附调节装置74。In yet another embodiment of the present invention, as shown in FIG. 10 , the transfer device 76 may be provided with a forming pressure device 84 and a hinge device 83 . The transfer device 76 of FIG. 10 may also be provided with a biaxial carrier 77 which provides horizontal and vertical movement of the forming press 84 . Under the control of computer system 10, vertical and horizontal movement of forming pressure device 84 may cause carrier substrate 200 to deflect vertically and bring printed object 91 into contact under pressure with build plate 80 or the top of the stack of previously transferred printed objects. The vertical movement of the biaxial carrier may bring the predetermined end of the forming pressure device 84 into pressure contact with the carrier substrate 200 , thereby bringing the predetermined end of the printed object 91 into contact with the build plate 80 or the top of the stack of previously transferred printed objects 90 . The further vertical and horizontal movement of the biaxial carrier 77 and the hinge device 83 can make the entire forming surface of the forming pressure device 84 gradually come into line contact with the carrier substrate 200 under the action of pressure. Component line contact with carrier 200 may deflect carrier substrate 200 to form progressive line contact between printed object 91 and build plate 80 or the top of a stack of previously transferred printed objects 90 . Progressive line contact between printed object 91 and build plate 80 or the top of the stack of previously transferred printed objects 90 is sufficient to transfer printed object 91 to build plate 80 or the top of the stack of previously transferred printed objects 90 . The transfer device 76 of FIG. 10 may also include an adhesion regulating device 74 similar to the adhesion regulating device 74 of FIG. 7 .
组装装置Assembly device
图5示出了组装装置C的一部分，其包括X-Y定位装置230和构建站110。所述构建站110可包括构建板80。可以设置AZ轴定位装置100（垂直定位器），其可以调节构建板80的垂直位置，以将先前转移的打印对象90的顶部的层面保持在预定的垂直位置，以促进打印对象到构建板80或先前转移的对象90的堆叠的顶部的适当转移。在适用于所涉及材料的条件下，将构建板上的图案化单层对象完整组装融合在一起。FIG. 5 shows a part of assembly device C, which includes X-Y positioning device 230 and build station 110 . The build station 110 may include a build plate 80 . An AZ axis positioning device 100 (vertical positioner) may be provided which may adjust the vertical position of the build plate 80 to maintain the layer on top of the previously transferred printed object 90 at a predetermined vertical position to facilitate proper transfer of the printed object to the build plate 80 or the top of the stack of previously transferred objects 90. Fuses the full assembly of patterned single-layer objects on the build plate under conditions appropriate for the materials involved.
粘附力降低装置Adhesion Reducing Device
构建板80可以包括粘附力降低装置68，以便于从构建板80上移走完整的打印对象堆叠。可以激活粘附力降低装置68以通过施加刺激来降低先前转移的对象90的堆叠的粘附力。可以使粘附力降低层68释放先前转移的对象90的堆叠的刺激可以是热刺激、辐射刺激、磁刺激、化学刺激或机械刺激。Build plate 80 may include an adhesion reducing device 68 to facilitate removal of a complete stack of printed objects from build plate 80 . The adhesion reducing means 68 may be activated to reduce the adhesion of the previously transferred stack of objects 90 by applying a stimulus. The stimulus that may cause adhesion reducing layer 68 to release the stack of previously transferred objects 90 may be a thermal stimulus, a radiation stimulus, a magnetic stimulus, a chemical stimulus, or a mechanical stimulus.
对准系统alignment system
构建板80还可包括对准传感器105。打印对象91可以包括一个或多个对准基准102，其可以与一个或多个对准传感器105相互作用以将打印对象91与构建板80或与先前转移的打印对象的堆叠的顶部精确对准。对准传感器105可以在UV光谱、或在可见光谱或在IR光谱中或在磁性或机械方面与对准基准102相互作用。结合计算机系统10，对准传感器105可以将对准基准102的位置检测到实际位置的0.01毫米以内，并使构建板80相对于对准基准102定位在预定位置的0.01毫米以内。The build plate 80 may also include an alignment sensor 105 . Print object 91 may include one or more alignment fiducials 102 that may interact with one or more alignment sensors 105 to precisely align print object 91 with build plate 80 or with the top of a stack of previously transferred print objects. The alignment sensor 105 may interact with the alignment fiducial 102 in the UV spectrum, or in the visible spectrum or in the IR spectrum, or magnetically or mechanically. In conjunction with computer system 10 , alignment sensor 105 can detect the position of alignment fiducial 102 to within 0.01 mm of its actual position and position build plate 80 relative to alignment fiducial 102 within 0.01 mm of a predetermined position.
组装装置定位装置Assembly device positioning device
组装装置C可以包括X-Y定位装置230和构建站110。构建站110可以包括Z定位装置和构建板80。构建站110可以与构建板80和X-Y定位装置230相互作用，以在计算机系统10的指令下，使构建板80相对于包括多材料多模块打印系统的多个转移模块中的任意一个的转移区240定位在预定位置的0.01mm之内。The assembly device C may include an X-Y positioning device 230 and a build station 110 . Build station 110 may include a Z positioning device and build plate 80 . The build station 110 can interact with the build plate 80 and the X-Y positioning device 230 to position the build plate 80 within 0.01 mm of a predetermined position relative to the transfer zone 240 of any one of the plurality of transfer modules comprising the multi-material multi-module printing system under the instruction of the computer system 10.
X-Y定位装置230可包括计算机控制的X-Y移动系统。该移动系统可以是但不限于一对正交连接的线性致动器或平面线性电机。构建站110可与X-Y移动系统通信，从而使得构建站110可以移动到如图11和图12所示的X-Y定位装置230的范围内的任何点处。 X-Y移动系统可以按比例缩放，以使得可以将构建站110移动到并且准确地定位以接受来自于与打印机相关联的多个转移模块B装置中的任何一个的转移区240转移的打印层。 X-Y定位装置230还可进一步缩放以使得构建站110移动到卸载位置，清除所有与打印机相关联的打印机模块A和转移模块B。模块A和B的间隙可以设置在X-Y平面中，也可以通过与X-Y平面正交的间隔来提供。建构站110可以进一步设置有旋转移动系统，以提供构造板80与转移区240的旋转对准。X-Y positioning device 230 may comprise a computer controlled X-Y movement system. The movement system can be, but is not limited to, a pair of orthogonally connected linear actuators or planar linear motors. The construction station 110 can communicate with the X-Y movement system so that the construction station 110 can be moved to any point within the range of the X-Y positioning device 230 as shown in FIGS. 11 and 12 . The X-Y movement system can be scaled such that build station 110 can be moved to and accurately positioned to accept a transferred print layer from transfer zone 240 of any one of the plurality of transfer module B devices associated with the printer. The X-Y positioning device 230 can be further scaled to allow the build station 110 to move to the unload position, clearing all printer module A and transfer module B associated with the printer. Clearance for modules A and B can be provided in the X-Y plane or by spacing orthogonal to the X-Y plane. The build station 110 may further be provided with a rotational movement system to provide rotational alignment of the build plate 80 with the transfer zone 240 .
六脚架Hexapod
在本发明的另一实施例中，可以通过六脚架来提供构建板80的精准定位，所示六脚架可以提供沿X、Y和Z轴的移动以及绕至少一个轴的旋转。In another embodiment of the invention, precise positioning of build plate 80 may be provided by a hexapod that may provide movement along X, Y, and Z axes and rotation about at least one axis.
组装装置C可以是多材料、多方法3D打印机的集成部件。组装装置C可设置有多个接收装置，其用于容纳打印机模块A和相关联的转移模块B的安装。组装装置C的接收装置可包括机械附接装置，以预定的方式将打印机模块和转移模块与组装装置物理关联。 组装装置C的接收装置还可设置有逻辑附接设备，以将打印机模块处理单元与图2和图3的中央处理单元集成在一起。The assembly device C may be an integral part of a multi-material, multi-method 3D printer. The assembly device C may be provided with a plurality of receiving means for accommodating the installation of the printer module A and the associated transfer module B. The receiving means of the assembly device C may include mechanical attachment means to physically associate the printer module and the transfer module with the assembly device in a predetermined manner. The receiving device of the assembly device C may also be provided with a logical attachment device to integrate the printer module processing unit with the central processing unit of FIGS. 2 and 3 .
图11示出了本发明的多方法3D打印机的一个实施例。图11示出了与组装装置C相关联的四个打印机模块A和四个转移模块B。这四个打印机模块可以全部实施不同的图案化和沉积技术。如图11所示，粘合剂喷射模块1用于四个打印机模块之一。第二类型的打印机模块2，第三类型的打印机模块3和第四类型的打印机模块4可以采用除了喷射粘合剂之外的沉积和图案化技术。打印机模块2、3和4可以选自采用沉积和图案化技术，例如但不限于电子照相术、胶版印刷、喷射材料打印和选择性激光熔化技术的打印机模块。Figure 11 shows an embodiment of the multi-method 3D printer of the present invention. FIG. 11 shows four printer modules A and four transfer modules B associated with assembly device C. FIG. The four printer modules can all implement different patterning and deposition techniques. As shown in FIG. 11, a binder jetting module 1 is used for one of four printer modules. The second type of printer module 2, the third type of printer module 3 and the fourth type of printer module 4 may employ deposition and patterning techniques other than jetting adhesives. Printer modules 2, 3 and 4 may be selected from printer modules employing deposition and patterning techniques such as, but not limited to, electrophotography, offset printing, jetting material printing, and selective laser melting techniques.
在图11中，四个打印机模块/转移模块以两行对齐，其近端朝向X-Y定位装置230的中心。还示出了在水平平面上没有打印机模块的构建站打印部件移除区域。In FIG. 11 , four printer modules/transfer modules are aligned in two rows with their proximal ends facing the center of the X-Y positioning device 230 . Also shown is the build station print part removal area with no printer modules in the horizontal plane.
可以理解的是，图11中所示的配置不限于四个打印机模块A，并且可以包括少至两个打印机模块，或三个打印机模块或四个以上打印机模块。还将理解的是，可以通过在X-Y定位装置230上的任何开放空间处通过水平间隔来设置打印部件去除区域，或者可以通过将构建站110与打印机模块A和转移模块B垂直分隔来设置打印部件去除区域。It will be appreciated that the configuration shown in Figure 11 is not limited to four printer modules A, and may include as few as two printer modules, or three printer modules, or more than four printer modules. It will also be understood that the print part removal area may be provided by horizontal spacing at any open space on the X-Y positioning device 230, or by vertical separation of the build station 110 from the printer module A and transfer module B.
图12示出了多方法3D打印机的替代配置，其中四个打印机模块与其最邻近成90度对齐，从而在打印机模块之间的空间或X-Y定位装置230的角落处留下可能的卸载位置。 其它配置对于本领域技术人员而言将是显而易见的。FIG. 12 shows an alternative configuration of a multi-method 3D printer in which four printer modules are aligned at 90 degrees to their nearest neighbors, leaving possible unloading locations in the spaces between the printer modules or in the corners of the X-Y positioning device 230 . Other configurations will be apparent to those skilled in the art.
多个打印机模块multiple printer modules
本发明的多材料多方法3D打印机基于相关联的多个打印机模块A和转移模块B，它们全部都由组装装置C集成。每个打印机模块A都能够调节诸如以下的操作参数：打印厚度、粘合剂浓度、粘合剂类型和材料类型。虽然调整操作参数可能会显著影响最终打印对象的属性，但每个打印机模块都基于一种特定方法创建打印对象。潜在方法的一非穷举列表清单包括喷射粘合剂打印、电子照相打印、胶版打印和喷射材料打印。可以基于各方法的能力，例如实际厚度范围、最小特征尺寸、精度和打印速度来选择创建给定打印对象的首选方法。虽然大多数打印方法可能与一种或多种材料兼容，但基本材料可能需要进行特殊准备才能与特定方法一起使用。The multi-material multi-method 3D printer of the present invention is based on a plurality of associated printer modules A and transfer modules B, all of which are integrated by an assembly device C. Each printer module A is able to adjust operating parameters such as: print thickness, adhesive concentration, adhesive type and material type. Each printer module creates print objects based on a specific method, although adjusting operating parameters can significantly affect the properties of the final print object. A non-exhaustive list of potential methods includes jetting binder printing, electrophotographic printing, offset printing, and jetting material printing. The preferred method for creating a given printed object can be selected based on the capabilities of each method, such as practical thickness range, minimum feature size, accuracy and print speed. While most printing methods are likely to be compatible with one or more materials, base materials may require special preparation to work with a particular method.
实际上，本发明的多材料多方法3D打印机可以配置有一个打印机模块A，以适用于最终制造部件中所需的打印机方法和材料的每种组合。在本发明的优选实施例中，构成多方法3D打印机系统的多个打印机模块中的至少一个可以根据特定最终部件的需要而快速且便捷地以另一模块替换。In fact, the multi-material multi-method 3D printer of the present invention can be configured with one printer module A for each combination of printer method and material required in the final manufactured part. In a preferred embodiment of the present invention, at least one of the plurality of printer modules making up the multi-method 3D printer system can be quickly and easily replaced with another module as required for a particular final part.
在一实施例中，打印机模块中的至少一个可基于用于多材料3D打印机应用的喷射粘结剂技术。In an embodiment, at least one of the printer modules may be based on jetting adhesive technology for multi-material 3D printer applications.
作为示例，考虑包括第一打印机模块和第二打印机模块的打印机系统。第一材料（由第一打印机模块沉积）和第二材料（由第二打印机模块沉积）不必不同。（1） 考虑在第一打印机模块中使用喷射粘合剂打印机和在第二打印机模块中使用电子照相打印机的情况。喷射粘合剂打印机通常可以在包括沉积层厚度在25µm至2,000µm范围内的沉积条件下沉积材料，而电子照相打印机通常可以在包括沉积层厚度在3µm至75µm范围内的沉积条件下沉积材料。与喷射粘合剂打印机和电子照相打印机相关的沉积层厚度是不同的。 因此，打印机系统能够将具有不同厚度的多个单层对象组装成单个三维对象（打印部件）。As an example, consider a printer system that includes a first printer module and a second printer module. The first material (deposited by the first printer module) and the second material (deposited by the second printer module) do not have to be different. (1) Consider the case where a jet binder printer is used in the first printer module and an electrophotographic printer is used in the second printer module. Jet-binder printers can typically deposit materials under deposition conditions that include layer thicknesses ranging from 25 µm to 2,000 µm, while electrophotographic printers can typically deposit materials under deposition conditions that include layer thicknesses ranging from 3 µm to 75 µm. The deposited layer thicknesses associated with jetting binder printers and electrophotographic printers are different. Thus, the printer system is able to assemble multiple single-layer objects with different thicknesses into a single 3D object (printed part).
（2）喷射粘合剂打印机通常可以在包括体素分辨率为25µm至4,000µm范围内的沉积条件下沉积材料，而电子照相打印机通常可以在包括体素分辨率在3µm至150µm范围内的沉积条件下沉积材料。与喷射粘合剂打印机和电子照相打印机相关的体素分辨率是不同的。 因此，打印机系统能够将具有不同体素分辨率的多个单层对象组装成单个三维物体（打印部件）。(2) Jet-binder printers can typically deposit materials under deposition conditions that include voxel resolutions in the range of 25 µm to 4,000 µm, while electrophotographic printers can typically deposit materials under deposition conditions that include voxel resolutions in the range 3 µm to 150 µm. The voxel resolution associated with jet binder printers and electrophotographic printers is different. Thus, the printer system is able to assemble multiple single-layer objects with different voxel resolutions into a single 3D object (printed part).
作为另一个示例，考虑包括第一打印机模块和第二打印机模块的打印机系统。第一和第二打印机模块不必不同（都可以是喷射粘合剂打印机）。打印机模块配置为沉积不同的材料。第一打印机模块形成以第一材料特性为特征的第一图案化的单层对象，第二打印机模块形成以第二材料特征为特性的第二图案化的单层对象。考虑这样的情况，即，第一材料是成孔剂浓度可忽略不计的陶瓷前体，其浓度被设置为形成孔隙率在0%-10%范围内的陶瓷，第二材料是具有较高成孔剂浓度的陶瓷前体，其浓度被设置为形成空隙率在25%-75%范围内的陶瓷。因此，打印机系统能够将具有不同孔隙率的多个单层对象组装成单个三维物体（打印部件）。As another example, consider a printer system that includes a first printer module and a second printer module. The first and second printer modules need not be different (both could be binder jet printers). The printer modules are configured to deposit different materials. The first printer module forms a first patterned single layer object characterized by a first material characteristic and the second printer module forms a second patterned single layer object characterized by a second material characteristic. Consider the case where the first material is a ceramic precursor with a negligible concentration of porogen set to form a ceramic with a porosity in the range of 0% to 10%, and the second material is a ceramic precursor with a higher concentration of porogen set to form a ceramic with a porosity in the range of 25% to 75%. Thus, the printer system is able to assemble multiple single-layer objects with different porosities into a single 3D object (printed part).
在一个实施例中，打印机包括多个打印机模块A，每个打印机模块可以与多个转移模块B中的一个相关联，所有这些都可以与组装装置C配合。多个打印机模块可包括使用至少两种不同的沉积和图案化技术的打印机模块，并且多个打印机模块A中的每一个可以被配置成创建一种材料的打印对象。每个打印机模块A可以使用不同的材料创建打印对象，或者某些打印机模块A可以使用相同的材料，或者3D多方法打印机系统的所有打印机模块可以使用相同的材料。打印机模块A和相关的转移模块B可以被配置为易于与组装装置C连接或从组装设备C移除，从而能轻松定义打印机配置以匹配构建需求。中央计算机系统10（控制器）可以协调打印机的所有组件的操作。In one embodiment, the printer comprises a plurality of printer modules A, each printer module may be associated with one of a plurality of transfer modules B, all of which may cooperate with assembly means C. The plurality of printer modules may include printer modules using at least two different deposition and patterning techniques, and each of the plurality of printer modules A may be configured to create a print object of one material. Each printer module A can use different materials to create printed objects, or some printer modules A can use the same material, or all printer modules of the 3D multi-method printer system can use the same material. The printer module A and associated transfer module B can be configured to be easily attached to or removed from the assembly device C, enabling easy definition of printer configurations to match build requirements. A central computer system 10 (controller) can coordinate the operation of all components of the printer.
图案化生成pattern generation
上述的3D打印系统用于以复杂的三维图案创建两种或多种材料的结构，其中该结构以层的形式构建，每一层包括一种或多种材料。可以以类似于传统3D打印机的每个层的图案形成的方式来形成每个层中的每种材料的图案。具体而言，可通过使用CAD（计算机辅助设计）软件，例如SolidWorks，从整个结构的一部分衍生每一层的图案。与传统的3D打印机不同的是，在本发明的实施方式中，计算机系统10可以将每一层的图案分成一种以上的材料和需要不同特性的体素，即使该材料与其它体素相同。例如，即使材料基本相同，也可以将高分辨率的体素并因此更小体素尺寸的体素发送到采用高分辨率沉积和图案化技术的打印机模块。The 3D printing systems described above are used to create structures of two or more materials in complex three-dimensional patterns, where the structure is built up in layers, each layer comprising one or more materials. The patterning of each material in each layer can be formed in a manner similar to the patterning of each layer in a conventional 3D printer. Specifically, the pattern of each layer can be derived from a portion of the overall structure by using CAD (Computer Aided Design) software, such as SolidWorks. Unlike conventional 3D printers, in embodiments of the present invention, computer system 10 can separate the pattern of each layer into more than one material and voxels requiring different properties, even if the material is the same as other voxels. For example, high resolution voxels, and thus smaller voxel sizes, can be sent to a printer module employing high resolution deposition and patterning techniques, even though the material is substantially the same.
材料类型material type
可以从至少两个基本类别：鲁棒性材料和挥发性材料中选择材料类型。Material types can be selected from at least two basic categories: robust materials and volatile materials.
鲁棒性材料是那些经过后打印处理步骤而成为最终打印部件的不可压缩体素的材料。在其打印时，鲁棒性材料可经受与材料的组分和结构相同的后处理步骤。鲁棒性材料也可以作为最终材料的前体开始。后处理可能会导致鲁棒性材料的前体发生反应，以生成新的化学化合物或改变相或改变晶体类型。Robust materials are those that undergo post-print processing steps to become incompressible voxels of the final printed part. As it is printed, the robust material can undergo the same post-processing steps as the composition and structure of the material. Robust materials can also start as precursors to final materials. Post-processing may cause the precursors of the robust material to react to generate new chemical compounds or to change phases or change crystal types.
挥发性材料是指一种可以在打印部件中占用体素的材料，该体素被设计为在后处理步骤之后立即被气体或真空所占用。在打印过程中以及在将打印对象组装成打印部件的过程中，挥发性材料可以由固体或半固体材料组成。在后处理步骤中，挥发性材料转变为可以轻松地从打印部件中逸出的形式，例如气体或液体。在一定体积的鲁棒性材料中包括连续体素质量的挥发性材料的结果是，在后处理步骤之后，形成具有预设结构的空腔。该空腔可以通过预先涉及的通道与打印部件的外部连通，或者可被完全密封。密封空腔可以被预设的气体或真空占用。A volatile material is a material that can occupy voxels in a printed part that are designed to be occupied by a gas or vacuum immediately after a post-processing step. During the printing process and during the assembly of printed objects into printed parts, volatile materials can consist of solid or semi-solid materials. During post-processing steps, volatile materials are transformed into forms that can easily escape from the printed part, such as gases or liquids. As a result of including a continuous voxel mass of volatile material in a volume of robust material, after a post-processing step, cavities are formed with a pre-set structure. The cavity may communicate with the exterior of the printed part through previously mentioned channels, or may be completely sealed. The sealed cavity can be occupied by preset gas or vacuum.
过程process
图13示出了制造3D打印零件的基本过程。如图13所示，该过程开始于设计文件310，该文件完全定义了所需零件的结构、材料和规格。可以将设计文件切片成层510，每一层的厚度由打印部件内每个位置的规格，例如最终厚度和图案公差来决定。然后可以将每一层分离成需要不同材料和/或不同打印技术的区域520。然后可以将针对不同材料/技术要求的每个区域的打印机控制指令发送到打印机系统的适当打印机模块A。Figure 13 shows the basic process of making a 3D printed part. As shown in Figure 13, the process begins with a design file 310, which fully defines the structure, materials and specifications of the desired part. The design file can be sliced into layers 510, the thickness of each layer being determined by the specifications of each location within the printed part, such as final thickness and pattern tolerances. Each layer can then be separated into regions 520 that require different materials and/or different printing techniques. The printer control commands for each area with different material/technical requirements can then be sent to the appropriate printer module A of the printer system.
中央处理单元，例如图2所示的中央处理单元，具有生成打印机控制文件并将其转发到每个打印机模块A的适当的打印机控制单元的功能。中央处理单元还可以直接控制组装装置C，包括定位图5中的构建板80，使得可以以预定顺序从载体基底200转移打印对象91。A central processing unit, such as the one shown in Figure 2, has the function of generating a printer control file and forwarding it to the appropriate printer control unit of each printer module A. The central processing unit can also directly control the assembly device C, including positioning the build plate 80 in FIG. 5 , so that the printed objects 91 can be transferred from the carrier substrate 200 in a predetermined order.
通过提供适合于多个打印机模块A中的每个打印机模块A的材料开始构建顺序。每种不同的图案化和沉积技术可能需要不同格式的材料，例如，颗粒尺寸、颗粒形态、粘合剂含量和运载工具。对于基于粉末床和喷射粘合剂技术的打印机模块，原料可以是粒径在0.0001 mm-0.25 mm之间，并具有出色的流动性和自包装性能的流化材料。The build sequence begins by providing materials suitable for each printer module A of the plurality of printer modules A. Each different patterning and deposition technique may require a different format of material, for example, particle size, particle morphology, binder content, and delivery vehicle. For printer modules based on powder bed and jetting binder technology, the raw material can be a fluidized material with a particle size between 0.0001 mm-0.25 mm and excellent flowability and self-packaging properties.
继续参考图13，在将要打印的部件切片成层510之后，可以选择第一2D层515，并且将分离成对象的层520打印指令发送至装载有用于所需的打印对象的正确的流化材料的喷射粘合剂打印机模块525，以及在转移模块中创建打印对象530。然后打印的对象与构建站110对齐540。然后将打印的对象91转移550到构建站110。在将每一打印层上的每一打印对象580与构建站110对齐并转移到构建站110后，移动构建站以接收来自于多材料多方法打印机系统的另一打印站1 打印对象。当打印层的最后一个打印对象位于构建站110上时，打印站110的构建板80可以向下增加下一层的厚度590，并选择下一打印层的构建指令，并在打印层中分成不同的材料。该过程可以从步骤520持续到步骤560，直到打印部件90的最后一个打印对象组装到构建站110上为止。当最后的打印对象91已添加到打印部件90时，将构建站点110移动565到部件移除区域，并将其从构建站110中释放。Continuing with reference to FIG. 13 , after slicing the part to be printed into layers 510, the first 2D layer 515 can be selected, and the layers separated into objects 520 print instructions sent to the jetting binder printer module 525 loaded with the correct fluidized material for the desired print object, and the print object 530 created in the transfer module. The printed object is then aligned 540 with the build station 110 . The printed object 91 is then transferred 550 to the build station 110 . After each print object 580 on each print layer is aligned with and transferred to build station 110, the build station is moved to receive another print station 1 print object from the multi-material multi-process printer system. When the last print object of a print layer is on the build station 110, the build plate 80 of the print station 110 can increase the thickness 590 of the next layer downwards and select build instructions for the next print layer and separate into different materials in the print layer. The process may continue from step 520 to step 560 until the last printed object of printed part 90 is assembled on build station 110 . When the last print object 91 has been added to the print part 90 , the build station 110 is moved 565 to the part removal area and released from the build station 110 .
图14示出了用于喷射粘合剂打印机模块的详细过程。在将要打印的部件切片成层610并将这些层分成对象620并排队到适当的打印站后，向装载有用于所需的打印对象的恰当的流化材料的喷射粘合剂打印机模块发送打印指令。在每个打印站A上创建完成选定的打印层所需的打印对象，并将来自于相关的打印站的流化材料沉积640在相应的载体装置200上。然后索引650载体装置200，以将沉积的流化材料移动到相应的压实装置30。然后通过压实装置30将流化材料压实660到预定水平。Figure 14 shows the detailed process for jetting the binder printer module. After the part to be printed is sliced into layers 610 and the layers are divided into objects 620 and queued to the appropriate print station, print instructions are sent to the jetting binder printer module loaded with the appropriate fluidized material for the desired print object. The print object required to complete the selected print layer is created at each print station A and the fluidized material from the associated print station is deposited 640 on the corresponding carrier device 200 . The carrier device 200 is then indexed 650 to move the deposited fluidized material to the corresponding compacting device 30 . The fluidized material is then compacted 660 by the compaction device 30 to a predetermined level.
然后将载体装置200索引670到打印机装置40，并由打印装置40在其上打印680预设图案。然后，在载体装置200上将图案化的流化材料索引690到材料固化装置50进行固化700，以固定打印图案。然后，将图案化并固化的可流动粉末在载体装置200上索引710到流化粉末去除装置60，在此，将未图案化和未固化的流化粉末从载体装置200移除720，仅留下预设的打印对象。载体装置200在载体装置200上进一步被索引730到转移站240，以将打印对象与构建站110对准。The carrier device 200 is then indexed 670 to the printer device 40, and the print device 40 prints 680 a preset pattern thereon. Then, the patterned fluidized material is indexed 690 on the carrier device 200 to the material curing device 50 for curing 700 to fix the printed pattern. The patterned and cured flowable powder is then indexed 710 on the carrier device 200 to the fluidized powder removal device 60, where the unpatterned and uncured fluidized powder is removed 720 from the carrier device 200, leaving only the intended printed objects. The carrier device 200 is further indexed 730 on the carrier device 200 to the transfer station 240 to align the print object with the build station 110 .
然后将打印的对象转移740到构建板80或打印部件90的先前打印的对象的顶部。如果打印对象不是打印部件760所需的最后一个打印对象，则选择下一个打印层，并将打印指令发送770至完成所选层所需的打印站。循环步骤770到步骤760以打印所述打印部件的剩余部分，直到最后一个打印对象被转移到构建站110，在此，构建站110被移除780至部件移出区域。The printed object is then transferred 740 to the build plate 80 or on top of the previously printed object of the printing part 90 . If the print object is not the last print object required by the print component 760, the next print layer is selected and print instructions are sent 770 to the print station required to complete the selected layer. Steps 770 to 760 are looped to print the remainder of the printed part until the last printed object is transferred to the build station 110 whereupon the build station 110 is removed 780 to the part removal area.
适用于目标打印对象的流化材料可以通过分配装置20分散在载体基底200上。分配装置20可位于打印机模块A的远端。分配装置20可以包括材料调节单元24，其可调节流化材料以便将硫化材料的均匀层分散在预定厚度的精确控制层中。A fluidized material suitable for the target print object may be dispersed on the carrier substrate 200 by the dispensing device 20 . The dispensing device 20 may be located at the remote end of the printer module A. As shown in FIG. The dispensing device 20 may include a material conditioning unit 24 that conditions the fluidized material so as to distribute a uniform layer of vulcanized material in a precisely controlled layer of predetermined thickness.
在沉积流化材料之后，载体基底200将沉积的流化材料移向打印机模块A的近端至压实装置30。启动压实装置30以对流化材料层施加刺激，以将流化材料层内的堆积密度提供到材料理论密度的至少40%。After depositing the fluidized material, the carrier substrate 200 moves the deposited fluidized material towards the proximal end of the printer module A to the compaction device 30 . The compaction device 30 is activated to apply a stimulus to the layer of fluidized material to provide a packing density within the layer of fluidized material to at least 40% of the theoretical density of the material.
在流化材料压实之后，载体基底200朝着打印机模块A的近端移动，从而将压实的流化层转移到打印机装置40的附近。打印机装置40可以将精确测量体积的粘合剂材料沉积到包含正在创建打印对象的流化材料的每个体素上。可以选择由打印机装置40分配的粘合剂材料，以将流化材料的颗粒牢固地粘合成坚固的块。打印机装置40能够将预定体积的粘合剂材料沉积到打印对象的每个体素上。喷射式粘合剂打印对象中的体素尺寸可小至0.010毫米。After compaction of the fluidized material, the carrier substrate 200 is moved towards the proximal end of the printer module A, thereby transferring the compacted fluidized layer into the vicinity of the printer device 40 . The printer device 40 can deposit precisely measured volumes of adhesive material onto each voxel containing the fluidized material that is creating the printed object. The binder material dispensed by the printer device 40 may be selected to firmly bind the particles of fluidized material into a solid mass. The printer device 40 is capable of depositing a predetermined volume of adhesive material onto each voxel of the printed object. Voxel sizes in jet-binder printed objects can be as small as 0.010 mm.
在将粘合剂材料沉积到打印对象的流化材料中之后，可以使载体基底200朝打印机模块A的近端移动到固化装置50。固化装置50可以包括发射源，其能够使粘结剂材料将流化材料的颗粒粘结在一起并将它们固定成具有预定图案和厚度的坚固的团。固化装置50的发射可以是但不限于热辐射、UV辐射、可见光辐射、IR辐射，电磁波或粒子束。After depositing the adhesive material into the fluidized material of the print object, the carrier substrate 200 may be moved towards the proximal end of the printer module A to the curing device 50 . The curing device 50 may include an emission source that enables a binder material to bind together particles of fluidized material and fix them into a firm mass having a predetermined pattern and thickness. The emission from curing device 50 may be, but is not limited to, thermal radiation, UV radiation, visible radiation, IR radiation, electromagnetic waves or particle beams.
随着打印对象固定在一起形成坚固的块并固定到载体基底200上，可以使载体基底200移动到图6的流化材料去除装置60。流化材料去除装置60可设置有破坏装置61，气刀装置62和真空端口64。 破坏装置61可机械破坏打印对象附近未被来自固化装置50的粘合剂材料固定在适当位置的流化材料。为了进一步破坏部分未固化的流化材料86，气刀装置可以将部分未固定的流化材料从固化的流化材料88和载体200吹离。气刀装置61还可气化所有未固化的流化材料，然后在外部真空源的作用下通过真空端口64将其从外壳中去除。With the printed objects secured together into a solid mass and secured to the carrier substrate 200, the carrier substrate 200 may be moved to the fluidized material removal device 60 of FIG. The fluidized material removal device 60 may be provided with a breaking device 61 , an air knife device 62 and a vacuum port 64 . The breaking device 61 may mechanically break fluidized material in the vicinity of the printed object that is not held in place by the adhesive material from the curing device 50 . To further break up the partially unfixed fluidized material 86 , an air knife device may blow the partially unfixed fluidized material away from the solidified fluidized material 88 and carrier 200 . The air knife device 61 also vaporizes any uncured fluidized material which is then removed from the housing through vacuum port 64 by an external vacuum source.
载体基底200从打印机模块A的远端的移动可以通过图5的近端缓冲装置212和打印驱动电机250的协同作用来控制。可以在分配装置20和近端缓冲装置212之间设置其它的缓冲装置，以更方便地协调打印机模块A的组件之间的打印对象的运动。Movement of the carrier substrate 200 from the distal end of the printer module A may be controlled by the cooperative action of the proximal buffer 212 and print drive motor 250 of FIG. 5 . Other buffer devices may be provided between the distribution device 20 and the proximal buffer device 212 to more conveniently coordinate the movement of printing objects between the components of the printer module A.
不含未固化的流化材料和部分破坏的流化材料的打印对象91可以由载体基底200运送到转移装置76。通过计算机系统10协调组装装置C和转移装置200的动作，可以在对准传感器105的引导下将打印对象91转移到构建板80或先前转移的打印对象90的堆叠的顶部。对准传感器将基准标记与构建板（组装板）对齐。The printed object 91 free of uncured fluidized material and partially destroyed fluidized material may be transported from the carrier substrate 200 to the transfer device 76 . Coordinating the actions of assembly device C and transfer device 200 by computer system 10 , the printed object 91 may be transferred to the top of build plate 80 or a stack of previously transferred printed objects 90 under the guidance of alignment sensor 105 . The alignment sensor aligns the fiducial marks with the build plate (assembly plate).
转移transfer
图7、8、9和10中示出了可创建打印对象91的多个打印机模块A中的每一个。打印对象可包括打印层的全部或一部分，并且每个打印对象可包括单种材料并且可通过单种图案化和沉积技术来创建。在转移模块B的载体基底200上完成打印对象91之后，可以将其移动到转移区240，如图5所示。X-Y定位装置230可使构建站110在计算机系统10的指导下移动到预定位置。Z定位装置100可使构建板80移动到相对于载体基底200的预定垂直位置。通过对准传感器105根据对准基准102、计算机系统10、X-Y定位装置230和Z定位装置100的协调来完成构建板80与附接到载体基底200的打印对象91间的最终精确对准。载体基底包括用于载体基底上的每个图案化的单层对象的基准标记102。Each of a plurality of printer modules A that can create a print object 91 is shown in FIGS. 7 , 8 , 9 and 10 . The printed objects may include all or a portion of the printed layers, and each printed object may include a single material and be created by a single patterning and deposition technique. After the object 91 is printed on the carrier substrate 200 of the transfer module B, it can be moved to the transfer area 240, as shown in FIG. 5 . The X-Y positioning device 230 can make the construction station 110 move to a predetermined position under the guidance of the computer system 10 . The Z positioning device 100 can move the build plate 80 to a predetermined vertical position relative to the carrier substrate 200 . The final precise alignment between build plate 80 and print object 91 attached to carrier substrate 200 is accomplished by alignment sensor 105 according to the coordination of alignment datum 102 , computer system 10 , X-Y positioning device 230 and Z positioning device 100 . The carrier substrate includes fiducial marks 102 for each patterned single layer object on the carrier substrate.
通过在打印对象91和构建板80之间建立精确对准，由于转移装置76使得打印对象91移动至与构建板80或先前转移的打印对象的堆叠的顶部的接触，则可以完成打印对象的转移。为了完成转移，转移装置76可以向载体基底200施加预设压力，并且可以通过施加适当的刺激来启动粘附调节装置74。在打印层包括多个打印对象91的情况下，多个打印对象中的每一个或打印对象91可以与多个打印对象91中的另一个互补，从而使得包含打印层的所有体素都可以被打印对象91的体素所占用。By establishing precise alignment between the printed object 91 and the build plate 80, transfer of the printed object is accomplished as the transfer device 76 moves the printed object 91 into contact with the build plate 80 or the top of the stack of previously transferred printed objects. To accomplish the transfer, the transfer device 76 may apply a preset pressure to the carrier substrate 200 and the adhesion modulating device 74 may be activated by applying an appropriate stimulus. Where a print layer includes a plurality of print objects 91, each of the plurality of print objects or the print object 91 may be complementary to another of the plurality of print objects 91, so that all voxels comprising the print layer may be occupied by voxels of the print object 91.
随着每个打印对象被转移到先前转移的打印对象上，粘附调节装置74的启动可降低打印对象91与载体200之间的粘合。打印对象91和先前转移的打印对象90之间的接触表面间的粘附可以比打印对象91与载体基底200之间的粘附更强。打印对象91和先前转移的打印对象的表面的制备可以通过但不限于包含打印对象和先前转移的打印对象的材料的表面的工程属性，或者通过辐射源进行原位表面处理、或通过化学源进行原位处理、或由机械源进行原位处理、或由磁源进行原位处理来完成。Activation of adhesion adjustment device 74 may reduce adhesion between printed object 91 and carrier 200 as each printed object is transferred onto a previously transferred printed object. The adhesion between the contact surfaces between the printed object 91 and the previously transferred printed object 90 may be stronger than the adhesion between the printed object 91 and the carrier substrate 200 . The preparation of the surface of the printed object 91 and previously transferred printed objects may be accomplished by, but not limited to, engineering properties of the surface of the material comprising the printed object and previously transferred printed objects, or in situ surface treatment by a radiation source, or by a chemical source, or by a mechanical source, or by a magnetic source.
打印层创建print layer creation
打印部件的第一层可以作为一个或多个打印对象91转移到与构建板80的顶表面相关联的粘附降低装置68上。所有后续层可作为一个或多个打印对象转移到先前转移的打印对象90上。图15示出了通过依次转移例如五个打印对象来创建打印层92的可能步骤。该顺序为从上到下进行。在创建步骤85，打印对象93被转移到先前转移的打印层的堆叠上。创建步骤86可以是将包括不同材料构成和/或由不同技术形式的打印对象93创建的打印对象94转移到创建步骤85的开放区域中。通过将打印对象95转移到创建步骤86的开放区域中，来使创建步骤87与创建步骤86一样继续。创建步骤88可以添加打印对象96。创建步骤89可通过转移打印对象97来完成打印层92。当每一层中的每种材料被打印时，将其依次堆叠在先前打印的对象上，以在三维上以两种或多种材料形成所需的结构。尽管该示例示出了打印层包括5个不同的打印对象，但应理解的是，打印层可以包括少至一个打印对象或满足设计所需的任何数量的打印对象。The first layer of the printed part may be transferred as one or more printed objects 91 to the adhesion reducing device 68 associated with the top surface of the build plate 80 . All subsequent layers may be transferred as one or more print objects onto the previously transferred print object 90 . FIG. 15 shows possible steps for creating a print layer 92 by sequentially transferring, for example, five print objects. The order is from top to bottom. In a creation step 85, the print object 93 is transferred onto the stack of previously transferred print layers. The creation step 86 may consist of transferring the print object 94 comprising a different material composition and/or created from a print object 93 of a different technical form into the open area of the creation step 85 . The creation step 87 is continued like the creation step 86 by transferring the print object 95 into the open area of the creation step 86 . Create step 88 may add print object 96 . Create step 89 may complete print layer 92 by transferring print object 97 . As each material in each layer is printed, it is stacked sequentially on previously printed objects to form the desired structure in two or more materials in three dimensions. Although this example shows a print layer including 5 different print objects, it should be understood that a print layer may include as few as one print object or any number of print objects required to satisfy the design.
尽管使用了各种示例和其它信息来解释所附权利要求书范围内的各个方面，但是基于此类示例中的特定功能或设置不是为了对权利要求要求的限制，因为本领域的普通技术人员将能够使用这些示例来获得各种实现。此外，尽管可能已对结构特征和/或方法步骤的示例进行了描述，但应理解的是，所附权利要求书中所定义的主题不必受限于这些所描述的特征或动作。例如，这种功能可以不同地分布或在除本文所标识的组件之外的组件中执行。 相反，所公开描述的特征和步骤应视为在所附权利要求范围内的系统和方法的组件的示例。所涉及的权利要求文字一组中“的至少一个” 表示满足该权利要求的该组中的一个组件或该组中的多个组件。Although various examples and other information have been used to explain aspects within the scope of the appended claims, no limitation to the claims is intended based on specific functions or settings in such examples, since one of ordinary skill in the art will be able to obtain various implementations using the examples. Furthermore, although examples of structural features and/or method steps may have been described, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the described features or acts. For example, such functionality may be distributed differently or performed in components other than those identified herein. Rather, the disclosed and described features and acts should be considered as example components of systems and methods within the scope of the appended claims. "At least one of" in a set of words in a related claim means a component in the set or a plurality of components in the set satisfying the claim.
尽管上文已描述了本发明的各种实施方式，但应该理解的是，它们仅仅是以示例性而非限制的方式给出的。在不脱离本发明的理念或范围的情况下，可以根据本文的公开内容对所公开的实施方式进行多种改变。因此，本发明的广度和范围不应受到任何上述实施方式的限制。相反，本发明的范围应根据所附权利要求及其等同物来限定。While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of illustration only, and not limitation. Various changes may be made to the disclosed embodiments in light of the disclosure herein without departing from the spirit or scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. Instead, the scope of the invention should be defined in accordance with the appended claims and their equivalents.
尽管本发明已经对一种或多种实施方式进行了说明和描述，但是，在阅读和理解本说明书和附图之后，本领域的其它技术人员能够想到等效的变化和修改。另外，虽然本发明的特定特征仅通过多种实施方式中的其中一种进行了公开，但是，该特征可与其它实施方式的一个或多个其它特征相结合，这对于任何给定或特定的应用都是可取且有利的。While the invention has been illustrated and described in one or more implementations, equivalent changes and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the accompanying drawings. Additionally, although a particular feature of the invention is disclosed in only one of the various embodiments, that feature may be combined with one or more other features of other embodiments as may be desirable and advantageous for any given or particular application.
本文所使用的术语仅出于描述特定实施例的目的，并不旨在限制本发明。如本文所使用的，单数形式的“一”，“一个”和“该”也旨在包括其复数形式，除非上下文另有明确说明。此外，就在说明书和/或权利要求中所使用的术语“包括”、“包含”、“含有”、“具有”、“有”或其变体而言，这些术语意在作为以类似于术语“包含”的方式包括在内。The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. Furthermore, to the extent that the terms "comprises", "comprises", "comprises", "has", "has" or variations thereof are used in the specification and/or claims, these terms are intended to be included in a manner similar to the term "comprising".
除非另有定义，否则本文中使用的所有术语（包括技术和科学术语）将具有与本发明所属领域的普通技术人员通常所理解的相同含义。此外，诸如在常用词典中定义的那些术语，应被解释为具有与相关领域中它们的含义一致的含义，并且除非在本文中另有明确定义，否则将不应以理想化或过于正式的意义来解释。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In addition, terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the relevant fields, and should not be interpreted in an idealized or overly formal sense unless otherwise clearly defined herein.
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| US62/742,505 | 2018-10-08 | ||
| PCT/US2019/055061WO2020076734A1 (en) | 2018-10-08 | 2019-10-07 | Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional object |
| Publication Number | Publication Date |
|---|---|
| CN112805112A CN112805112A (en) | 2021-05-14 |
| CN112805112Btrue CN112805112B (en) | 2023-07-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980065933.XAActiveCN112805112B (en) | 2018-10-08 | 2019-10-07 | Three-dimensional additive manufacturing system and method for manufacturing three-dimensional objects |
| Country | Link |
|---|---|
| US (1) | US10974453B2 (en) |
| EP (1) | EP3863793A4 (en) |
| JP (2) | JP7500081B2 (en) |
| KR (2) | KR20220016523A (en) |
| CN (1) | CN112805112B (en) |
| WO (1) | WO2020076734A1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11273608B2 (en) | 2018-06-07 | 2022-03-15 | Sakuu Corporation | Multi-material three-dimensional printer |
| US11167480B2 (en) | 2018-10-08 | 2021-11-09 | Sakuu Corporation | Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional object |
| CN112805112B (en) | 2018-10-08 | 2023-07-21 | 萨库公司 | Three-dimensional additive manufacturing system and method for manufacturing three-dimensional objects |
| WO2020117498A1 (en) | 2018-12-04 | 2020-06-11 | Keracel, Inc. | Electrophotographic multi-material 3d printer |
| US20220143705A1 (en)* | 2019-07-23 | 2022-05-12 | Hewlett-Packard Development Company, L.P. | Determining a volume of binder to be applied to a voxel location |
| US11260581B2 (en)* | 2020-06-03 | 2022-03-01 | Sakuu Corporation | Jetted material printer with pressure-assisted fluid extraction |
| US12275187B2 (en) | 2020-06-03 | 2025-04-15 | Sakuu Corporation | 3D printer with pressure-assisted fluid extraction |
| JP2021193210A (en)* | 2020-06-05 | 2021-12-23 | サクウ コーポレーション | 3D additive manufacturing system and 3D object manufacturing method |
| US11707883B2 (en) | 2020-11-20 | 2023-07-25 | General Electric Company | Foil interaction device for additive manufacturing |
| US11485079B2 (en)* | 2020-12-22 | 2022-11-01 | Stratasys, Inc. | System for leveling heated platen in 3D printer |
| US11865780B2 (en) | 2021-02-26 | 2024-01-09 | General Electric Company | Accumalator assembly for additive manufacturing |
| US11951679B2 (en) | 2021-06-16 | 2024-04-09 | General Electric Company | Additive manufacturing system |
| US11731367B2 (en) | 2021-06-23 | 2023-08-22 | General Electric Company | Drive system for additive manufacturing |
| US11958250B2 (en) | 2021-06-24 | 2024-04-16 | General Electric Company | Reclamation system for additive manufacturing |
| US11958249B2 (en) | 2021-06-24 | 2024-04-16 | General Electric Company | Reclamation system for additive manufacturing |
| US11826950B2 (en) | 2021-07-09 | 2023-11-28 | General Electric Company | Resin management system for additive manufacturing |
| US12370741B2 (en) | 2021-08-13 | 2025-07-29 | General Electric Company | Material deposition assembly for additive manufacturing |
| US12296535B2 (en) | 2021-08-24 | 2025-05-13 | General Electric Company | Attachment structure for additive manufacturing |
| US11813799B2 (en) | 2021-09-01 | 2023-11-14 | General Electric Company | Control systems and methods for additive manufacturing |
| EP4249216A1 (en) | 2022-03-23 | 2023-09-27 | General Electric Company | Systems and methods for additive manufacturing |
| CN119300969A (en)* | 2022-04-13 | 2025-01-10 | 阿普雷奇亚制药有限责任公司 | Systems and methods for additive manufacturing using an omnidirectional magnetic motion device |
| EP4577397A1 (en)* | 2022-08-25 | 2025-07-02 | Nanogrande Inc. | Additive manufacturing system and method adapted for simultaneous high and low accuracy build |
| US12403654B2 (en) | 2022-09-30 | 2025-09-02 | General Electric Company | Systems and methods for additive manufacturing |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6799959B1 (en)* | 1999-09-14 | 2004-10-05 | Minolta Co., Ltd. | Apparatus for forming a three-dimensional product |
| EP2927018A1 (en)* | 2014-04-04 | 2015-10-07 | Flooring Technologies Ltd. | Functionalised substrates, method and device for their production |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6076652A (en) | 1971-04-16 | 2000-06-20 | Texas Instruments Incorporated | Assembly line system and apparatus controlling transfer of a workpiece |
| US5593531A (en)* | 1994-11-09 | 1997-01-14 | Texas Instruments Incorporated | System, method and process for fabrication of 3-dimensional objects by a static electrostatic imaging and lamination device |
| US20050023710A1 (en) | 1998-07-10 | 2005-02-03 | Dmitri Brodkin | Solid free-form fabrication methods for the production of dental restorations |
| JP2002264221A (en)* | 2001-03-14 | 2002-09-18 | Minolta Co Ltd | Three-dimensional shaping apparatus and three- dimensional shaping method |
| US6780368B2 (en)* | 2001-04-10 | 2004-08-24 | Nanotek Instruments, Inc. | Layer manufacturing of a multi-material or multi-color 3-D object using electrostatic imaging and lamination |
| US6766122B2 (en) | 2002-10-28 | 2004-07-20 | Hewlett-Packard Development Company, Lp. | System and methods for calibrating a printing process |
| US7380911B2 (en)* | 2004-05-10 | 2008-06-03 | Eastman Kodak Company | Jet printer with enhanced print drop delivery |
| US20080226346A1 (en)* | 2007-01-17 | 2008-09-18 | 3D Systems, Inc. | Inkjet Solid Imaging System and Method for Solid Imaging |
| US7706910B2 (en) | 2007-01-17 | 2010-04-27 | 3D Systems, Inc. | Imager assembly and method for solid imaging |
| US8097203B2 (en)* | 2007-01-29 | 2012-01-17 | Corning Incorporated | Crosslinked green body articles and method of manufacturing porous ceramic articles therefrom |
| JP2009216939A (en) | 2008-03-10 | 2009-09-24 | Fuji Xerox Co Ltd | Electrophotographic toner and method for manufacturing the same, electrophotographic developer, toner cartridge, process cartridge, image forming apparatus |
| EP2758837B1 (en)* | 2011-09-23 | 2020-05-27 | Stratasys, Inc. | Layer transfusion for additive manufacturing |
| US8879957B2 (en)* | 2011-09-23 | 2014-11-04 | Stratasys, Inc. | Electrophotography-based additive manufacturing system with reciprocating operation |
| US8488994B2 (en)* | 2011-09-23 | 2013-07-16 | Stratasys, Inc. | Electrophotography-based additive manufacturing system with transfer-medium service loops |
| IN2015DN01776A (en)* | 2012-09-05 | 2015-05-29 | Aprecia Pharmaceuticals Co | |
| US9023566B2 (en)* | 2013-07-17 | 2015-05-05 | Stratasys, Inc. | ABS part material for electrophotography-based additive manufacturing |
| US9919479B2 (en) | 2014-04-01 | 2018-03-20 | Stratasys, Inc. | Registration and overlay error correction of electrophotographically formed elements in an additive manufacturing system |
| TWI718096B (en) | 2014-04-23 | 2021-02-11 | 荷蘭商荷蘭Ｔｎｏ自然科學組織公司 | Production line and method for making tangible products by layerwise manufacturing |
| WO2015171182A1 (en)* | 2014-05-04 | 2015-11-12 | Eoplex Limited | Multi-material three dimensional printer |
| KR102168792B1 (en) | 2014-05-08 | 2020-10-23 | 스트라타시스 엘티디. | Method and apparatus for 3d printing by selective sintering |
| US20160067922A1 (en)* | 2014-09-09 | 2016-03-10 | Disney Enterprises, Inc. | Three dimensional (3d) printing by volumetric addition through selective curing of a fluid matrix |
| US10052823B2 (en)* | 2014-10-08 | 2018-08-21 | Xerox Corporation | System and method for test pattern formation during three-dimensional object printing |
| US20160186620A1 (en)* | 2014-12-30 | 2016-06-30 | General Electric Company | Multi-material valve guide system and method |
| GB201500607D0 (en)* | 2015-01-14 | 2015-02-25 | Digital Metal Ab | Additive manufacturing method, method of processing object data, data carrier, object data processor and manufactured object |
| US10272664B2 (en)* | 2015-01-14 | 2019-04-30 | Xactiv, Inc. | Fabrication of 3D objects via multiple build platforms |
| KR20160112797A (en)* | 2015-03-20 | 2016-09-28 | 엘지전자 주식회사 | 3D printer |
| JP2016182734A (en) | 2015-03-26 | 2016-10-20 | シャープ株式会社 | Three-dimensional structure manufacturing system, three-dimensional structure manufacturing apparatus, information processing apparatus, three-dimensional structure manufacturing program, and information processing program |
| WO2016188930A1 (en) | 2015-05-22 | 2016-12-01 | Luxexcel Holding B.V. | Method for printing a three-dimensional structure and a system for printing a three-dimensional structure |
| WO2016197006A1 (en)* | 2015-06-04 | 2016-12-08 | Eoplex Limited | Solid state battery and fabrication process therefor |
| US10486411B2 (en)* | 2015-07-29 | 2019-11-26 | Canon Kabushiki Kaisha | Shaping apparatus and shaping method |
| JP6669985B2 (en) | 2015-11-12 | 2020-03-18 | セイコーエプソン株式会社 | Manufacturing method of three-dimensional objects |
| CN105415687B (en)* | 2015-12-22 | 2018-04-27 | 吉林大学 | A kind of Alternative 3D printing method |
| WO2017117380A1 (en) | 2015-12-31 | 2017-07-06 | Stratasys, Inc. | Building with cylindrical layers in additive manufacturing |
| JP6220477B1 (en) | 2016-01-28 | 2017-10-25 | バンドー化学株式会社 | Manufacturing method of three-dimensional structure |
| JP6624636B2 (en)* | 2016-02-15 | 2019-12-25 | 株式会社Ｌｉｘｉｌ | Ceramic raw material, method for producing fired body, and fired body |
| EP3429819B1 (en) | 2016-03-14 | 2021-04-14 | Nanogrande | Method and apparatus for forming layers of particles for use in additive manufacturing |
| US10105902B2 (en) | 2016-04-18 | 2018-10-23 | Evolve Additive Solutions, Inc. | Electrophotography-based additive manufacturing with part molding |
| US20170368744A1 (en)* | 2016-06-27 | 2017-12-28 | Xerox Corporation | Multisize printing material for electrophotographic additive manufacturing |
| JP6824652B2 (en)* | 2016-07-08 | 2021-02-03 | キヤノン株式会社 | 3D modeling method and 3D model manufacturing equipment |
| US11845221B2 (en) | 2018-02-02 | 2023-12-19 | Evolve Additive Solutions, Inc. | Method of thermally transferring layers in a selective deposition-based additive manufacturing system using conductive heat |
| US11273608B2 (en)* | 2018-06-07 | 2022-03-15 | Sakuu Corporation | Multi-material three-dimensional printer |
| CN112805112B (en) | 2018-10-08 | 2023-07-21 | 萨库公司 | Three-dimensional additive manufacturing system and method for manufacturing three-dimensional objects |
| WO2020117498A1 (en) | 2018-12-04 | 2020-06-11 | Keracel, Inc. | Electrophotographic multi-material 3d printer |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6799959B1 (en)* | 1999-09-14 | 2004-10-05 | Minolta Co., Ltd. | Apparatus for forming a three-dimensional product |
| EP2927018A1 (en)* | 2014-04-04 | 2015-10-07 | Flooring Technologies Ltd. | Functionalised substrates, method and device for their production |
| Publication number | Publication date |
|---|---|
| KR102356021B1 (en) | 2022-02-09 |
| EP3863793A4 (en) | 2022-06-22 |
| JP2024109904A (en) | 2024-08-14 |
| EP3863793A1 (en) | 2021-08-18 |
| CN112805112A (en) | 2021-05-14 |
| WO2020076734A1 (en) | 2020-04-16 |
| US10974453B2 (en) | 2021-04-13 |
| KR20210062705A (en) | 2021-05-31 |
| JP2022504332A (en) | 2022-01-13 |
| US20200108553A1 (en) | 2020-04-09 |
| JP7500081B2 (en) | 2024-06-17 |
| KR20220016523A (en) | 2022-02-09 |
| Publication | Publication Date | Title |
|---|---|---|
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