CN112799167A - Mould pattern processingequipment is used in light guide plate production - Google Patents
Mould pattern processingequipment is used in light guide plate productionDownload PDFInfo
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- CN112799167A CN112799167ACN202011266578.3ACN202011266578ACN112799167ACN 112799167 ACN112799167 ACN 112799167ACN 202011266578 ACN202011266578 ACN 202011266578ACN 112799167 ACN112799167 ACN 112799167A
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- guide plate
- light guide
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- 238000004519manufacturing processMethods0.000titleclaimsabstractdescription20
- 238000000034methodMethods0.000claimsabstractdescription31
- 238000004904shorteningMethods0.000abstractdescription2
- 230000000694effectsEffects0.000description9
- 238000010586diagramMethods0.000description3
- 239000004973liquid crystal related substanceSubstances0.000description3
- 238000003754machiningMethods0.000description3
- 230000003247decreasing effectEffects0.000description2
- 230000007547defectEffects0.000description2
- 239000000463materialSubstances0.000description2
- NIXOWILDQLNWCW-UHFFFAOYSA-Nacrylic acid groupChemical groupC(C=C)(=O)ONIXOWILDQLNWCW-UHFFFAOYSA-N0.000description1
- 230000002950deficientEffects0.000description1
- 230000005684electric fieldEffects0.000description1
- 238000001746injection mouldingMethods0.000description1
- 238000002360preparation methodMethods0.000description1
- 238000003825pressingMethods0.000description1
- 229910001220stainless steelInorganic materials0.000description1
- 239000010935stainless steelSubstances0.000description1
- 239000000758substrateSubstances0.000description1
- 238000002834transmittanceMethods0.000description1
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Classifications
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0016—Grooves, prisms, gratings, scattering particles or rough surfaces
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133524—Light-guides, e.g. fibre-optic bundles, louvered or jalousie light-guides
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
Technical Field
The present invention relates to an apparatus for processing a pattern on a mold used in the production of a light guide plate. The present invention relates to a mold pattern processing apparatus for manufacturing a light guide plate, which converts light from one side light source into a uniform surface light source in a backlight unit which is an essential structure of an LED TV, and forms a predetermined pattern on the light guide plate for the uniform surface light source.
Background
An LCD (Liquid Crystal Display) is a flat panel Display that is commonly used for TVs, Display panels, and the like, and displays an image by injecting Liquid Crystal between substrates to form an electric field in the Liquid Crystal and adjusting the transmittance of light passing through each pixel.
The LCD is not a self-luminous display, and thus, in order to display image information, a backlight unit is required as an additional light source device. In order to form a uniform surface Light source by providing a point Light source or a line Light source on one side or the rear of the backlight unit and uniformly dispersing Light emitted from the Light source, an engraved/engraved pattern is formed on one side of a Light transmissive acrylic Plate called a Light Guide Plate (Light Guide Plate).
In order to form the intaglio/intaglio pattern on the light guide plate in this way, the pattern is directly processed on the light guide plate by using a laser, but generally, after the pattern is processed by using a mold for producing the light guide plate, the pattern is injection-molded by using the mold or formed on the light guide plate by using a roll press device.
In the related art, overetching is used to process a pattern on a mold for producing a light guide plate, but a laser is generally used because precision is lowered.
When a pattern is processed in a mold by using a laser, a plurality of conditions related to the size of a dot are found by a test according to the material of the mold and the type of the laser, and in order to obtain a uniform surface light source, it is necessary to process the pattern of a light incident portion adjacent to a light source portion so that the density is small or the size of the pattern is small, and to process the pattern of a light opposite portion so that the density is high or the size of the pattern is large.
However, in the prior art, as a pattern is processed on a mold with a plurality of dot sizes, a problem occurs in that stripes are generated by differences in light quantity at portions where the dot sizes are changed, or it is necessary to set the dot sizes to be processed to be very close and to find laser conditions, and thus there is a problem in that the mold manufacturing time is very long. Even if the dot size is set to be very tight, the uniformity is not smooth and poor appearance is caused if the dot size is changed.
Disclosure of Invention
Technical problem
The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a mold pattern processing apparatus for manufacturing a light guide plate, which can smoothly change the dot size of a pattern processed by a mold for manufacturing a light guide plate, form a uniform surface light source, find several processing conditions related to the dot size, and combine them to realize a plurality of dot sizes, thereby improving the luminance of the light guide plate and shortening the manufacturing time of the mold.
Technical scheme
In order to achieve the above object, a mold pattern processing apparatus for producing a light guide plate according to the present invention includes: a stage supporting a mold to be patterned at an upper portion thereof; a laser light source for generating laser to process a pattern composed of dots on the mold; a scanner which is incident with the laser generated by the laser source and irradiates the mold to process the pattern on the mold; and a control unit that controls the laser light source and the scanner to form a mold pattern processing device for producing a light guide plate, wherein the control unit forms a region smaller than an irradiation limit of the scanner as an irradiation region, adjusts characteristics of the laser light generated by the laser light source, and changes a dot size of a pattern processed in the mold.
In the present invention, the control unit adjusts one or more of a repetition frequency or a pulse of the laser beam generated by the laser beam source and an average power of the laser beam source to change a dot size to be processed in the mold.
In addition, the control unit controls the scanner to move after processing all the patterns in one shot region, and controls the movement of the scanner so that a part of the regions overlap between the shot regions adjacent to each other.
In addition, according to the present invention, the controller adjusts the size of dots of the processed pattern to be the same when the scanner processes the pattern in one shot region.
In the present invention, the control unit sets two or more dot sizes in advance when changing the dot size of the pattern to be processed in the mold, and the processing of the dot sizes other than the dot size set in advance in the irradiation region is performed by adjusting a ratio at which the dot size set in advance is processed.
In addition, the present invention is characterized in that the ratio of processing is determined by adjusting a probability that a halftone dot is processed in a preset size in the irradiation region.
Effects of the invention
The invention with the structure can adjust the patterns processed by the mould for producing the light guide plate by changing the sizes of the screen dots.
In addition, even if the processing conditions are found in advance only for the dot sizes of two or more patterns, a plurality of dot sizes can be effectively realized.
In addition, the size of the mold for producing the light guide plate is effectively changed, so that the brightness of the light guide plate produced by the mold can be improved, and the reject ratio is reduced.
In addition, the manufacturing time of the mold for producing the light guide plate can be remarkably reduced.
Drawings
FIG. 1 is a schematic block diagram of a mold pattern processing apparatus for light guide plate production according to an embodiment of the present invention,
FIG. 2 is a schematic view showing a process of processing an irradiation area of the mold pattern processing apparatus for light guide plate production of the present invention (an overlapping process),
FIG. 3 is a schematic view showing the effect of varying the size of the overlapping process according to the irradiation area in the mold pattern processing apparatus for producing a light guide plate according to the present invention,
FIG. 4 is a graph showing the effect of varying the dot size by adjusting the ratio of the dot size set in advance in the mold pattern processing apparatus for manufacturing a light guide plate according to the present invention,
fig. 5 is a diagram showing a pattern boundary portion generated when a dot size is changed in the related art.
(description of reference numerals)
100: the stage 200: laser light source
300: the scanner 400: control unit
Detailed Description
Hereinafter, a mold pattern processing apparatus for producing a light guide plate according to the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a schematic block diagram of a mold pattern processing apparatus for light guide plate production according to an embodiment of the present invention, fig. 2 is a schematic view (overlapping process) of a processing process of an irradiation area of the mold pattern processing apparatus for light guide plate production of the present invention, fig. 3 is a schematic view of a variable-size effect according to overlapping processing of the irradiation area in the mold pattern processing apparatus for light guide plate production of the present invention, and fig. 4 is a view showing the variable-size effect by adjusting a ratio of dot sizes set in advance in the mold pattern processing apparatus for light guide plate production of the present invention.
The mold pattern processing apparatus for producing a light guide plate according to the present invention is not a method of directly processing a light guide plate using a laser as described above, but a method of processing a pattern to be engraved on a light guide plate in advance in a mold, and forming a pattern on the light guide plate using the mold having the pattern. When the light guide plate is patterned using the mold, the mold is a core block if injection molding is used, and a stamper made of thin stainless steel (sus) if roll pressing is used.
The invention relates to a mold pattern processing device for producing a light guide plate, which comprises: astage 100 on which amold 10 to be processed with a pattern to be formed on a light guide plate is supported; alaser light source 200 for generating laser light to process a pattern of a plurality of dot shapes on amold 10 fixed on an upper portion of astage 100; ascanner 300 on which laser light generated from thelaser light source 200 is incident, and which changes a path of the incident laser light to irradiate themold 10 to process a pattern on themold 10; and acontrol part 400 for controlling the mold pattern processing device for light guide plate production including thestage 100, thelaser light source 200, and thescanner 300, wherein thecontrol part 400 sets an area smaller than an irradiation limit of thescanner 300 as an irradiation area, and changes a dot size of a pattern processed in themold 10 by adjusting characteristics of laser light generated from thelaser light source 200.
Thestage 100 of the present invention is a structure supporting themold 10 to be patterned on the upper portion thereof. When themold 10 is a core block, a jig for fixing the core block may be further included, and when themold 10 is a press mold, a suction device for forming a negative pressure may be further included for fixing while maintaining the flatness of the press mold. Regardless of the structure involved, the table 100 of the present invention performs the function of stably fixing themold 10 during processing of a desired pattern to themold 10. Of course, a structure for transferring themold 10 may be added.
Thelaser light source 200 of the present invention is configured to generate a laser beam for processing a pattern on themold 10 provided on thestage 100. Thelaser light source 200 of the present invention is configured to generate a pulse-type laser beam, and a CW laser beam is used if the laser light source is directly processed on the light guide plate as described above. The laser light generated from thelaser light source 200 of the present invention has various characteristics, however, in the present invention, three characteristics are approximately adjusted from among the various characteristics of the laser light, the average power of the laser light, the number of pulses processed at the dots, and the repetition frequency, and the dot size of the pattern processed at themold 10 is changed.
The average power of the laser is a value obtained by adding the energies of all pulses discharged in 1 second as the energy discharged per second, and the repetition frequency is a number of pulses discharged per second in hertz (Hz). Thus, the energy of a pulse is the same as the average power divided by the repetition frequency, and the energy of a pulse can be adjusted by adjusting the average power and the repetition frequency. In addition, the shape of the dots varies depending on the energy of one pulse and the number of pulses processed at one dot. The amount of energy of one pulse is related to the thermal influence applied to the mold during processing by one pulse, and therefore, the amount of energy of one pulse is proportional to the area and depth of the dots processed. Usually a fixed average power, the energy of a pulse is changed and the ratio between the area and depth of the dots becomes larger or smaller while substantially maintaining the changed average power. For example, when machining at 10Hz, the area and depth are both larger than when machining with a pulse having an average power of 1mW, but the machining with a pulse having an average power of 10mW generally has a characteristic that the area is larger. Further, when the repetition frequency is increased or decreased with the average power fixed, the area is substantially maintained and the depth is increased or decreased. For example, when using pulses with an average power of 1mW, the depth is increased without a large change in area when processing with 20Hz compared to processing with 10 Hz. In the present invention, the dot size is changed using the laser characteristics as described above.
Thescanner 300 according to the present invention is configured to irradiate themold 10 with laser light generated from thelaser light source 200, and then adjust a galvanometer (not shown) to change a path of the laser light. In order to form a uniform surface light source on the light guide plate, it is necessary to form a dot pattern of an appropriate size at a position set in advance, and thescanner 300 is a structure that rapidly converts the path of the laser light to form the dot pattern at the appropriate position. Thescanner 300 is typically adjusted in path by adjusting the galvanometers, and a flat-field focusing lens (f-theta) is placed below to maintain process uniformity. In order to maintain process uniformity as described above, a flat field focusing lens of appropriate curvature and size is used, and thus thescanner 300 has an irradiation limit in order to maintain process uniformity. Thecontrol unit 400 sets an area smaller than the irradiation limit of thescanner 300 as an irradiation area, and controls thescanner 300 to move to the next irradiation area after processing all patterns in the irradiation area.
Thecontroller 400 of the present invention controls the mold pattern processing apparatus for producing a light guide plate of the present invention including thestage 100, thelaser light source 200, and thescanner 300. Thecontrol unit 400 changes the size of the processed halftone dots by adjusting the three characteristics of the laser light generated from thelaser light source 200 as described above.
In order to form a uniform surface light source in the light guide plate, it is necessary that the pattern density of a portion adjacent to the light source on one side (i.e., the light incident portion) is low and the pattern density of the light-focusing portion on the side away from the light source is high. In the prior art, when processing a dot size, the density of the pattern is adjusted by setting the number of dots processed in the light incident part and the light incident part to be different, but the external defect of uneven appearance is caused in many cases. Since the minimum density limit is set to prevent the dot visibility phenomenon of the light incident portion, a large dot cannot be used, and the luminance is low. Therefore, in the present invention, the dots of the light incident part are made small and the dots of the light opposite part are made large, thereby forming a uniform surface light source. Therefore, compared with the existing mode, the appearance becomes clean, the number of the screen dots processed integrally becomes large, and the brightness is improved.
However, although the size-variable method of the present invention is most preferable if the dot size is linearly increased from the light incident portion to the light incident portion, there is nolaser light source 200 capable of adjusting the characteristics of the laser light in real time, and the laser light that is changed according to such a criterion is very expensive and the time required for preparation for processing may be long, although the laser light is not of a complete line type. Therefore, it is most preferable to change the size of the processed dots for each dot by adjusting the characteristics of the laser in real time as described above, but since it is not efficient to change in real time, it is advantageous in terms of cost performance to combine the dot sizes of a certain size by setting a plurality of steps of laser characteristics related to the dot size of a certain size through a plurality of tests in advance in consideration of the material of themold 10 and the individual characteristics of the laser.
That is, the larger the size of the processed halftone dot, the closer to the ideal case, but since the test time increases geometrically, it is preferable to set a certain number of halftone dot sizes and set the laser conditions relating to the screen dot sizes. However, when the pattern is sequentially processed in themold 10 after the predetermined number of dot sizes are set as described above, as shown in fig. 5, a portion where the luminance difference occurs in a stripe shape (pattern boundary portion) is generated in a portion where the dot size is changed, and if the pattern boundary portion is generated, themold 10 is defective and cannot be used for producing the light guide plate.
In order to prevent the defect of the pattern boundary, it is important to appropriately combine a certain number of dot sizes of the conditions of the laser light set in advance, thereby processing the pattern so that the dot size increases linearly, and the method of the present invention is to change the size by overlapping two processing regions having different dot sizes, and to adjust the probability of processing the two dot sizes, thereby obtaining the effect as if the size is variable.
First, fig. 2 shows a process in which thecontroller 400 moves thescanner 300 to process the pattern, and the left side M1 shows a pattern in which thescanner 300 moves to process the pattern. The pattern M1 processed at themold 10 is that thescanner 300 is moved and processed toward the processing areas 1 to 3(a1 to A3), wherein if moved and processed so that the right side of a1 and the left side of a2 overlap each other and the right side of a2 and the left side of A3 overlap each other, a pattern like M1 is formed at themold 10.
A first method is shown in fig. 3, for example, if dots are processed at a size of 10 micrometers in a4, 20 micrometers in a5, and 30 micrometers in a6, the dot size of a portion where three processed regions overlap with each other is 15, 25 micrometers, and thus, there may be an effect of variable size, and a pattern such as M2 may be formed. By adjusting the area of overlap, the range of variable size can be adjusted more precisely.
A second method, for example, processing at three screen dot sizes of 10 microns, 20 microns, and 30 microns, is shown in fig. 4, adjusting the probability that three screen dots are processed, thereby showing the effect of variable size. P1 shows two combinations of 41 dots with 10 micrometers and 23 dots with 20 micrometers, and the size is about 13.6 micrometers, P2 shows a combination of 4 dots with 10 micrometers, 55 dots with 20 micrometers, and 5 dots with 30 micrometers, and the size is about 20.2 micrometers, and P3 shows a combination of 18 dots with 20 micrometers, 46 dots with 30 micrometers, and the size is about 27.2 micrometers. By combining the halftone dots with the predetermined conditions as described above, the variable-size effect can be naturally displayed. In addition, there is an advantage that the combination ratio is set by the probability, so that it is possible to prevent the pattern boundary portion from being generated by gathering dots of the same size at one place in principle.
Claims (6)
1. The utility model provides a mould pattern processingequipment is used in light guide plate production which characterized in that includes:
a stage supporting a mold to be patterned at an upper portion thereof;
a laser light source for generating laser to process a pattern composed of dots on the mold;
a scanner which is incident with the laser generated by the laser source and irradiates the mold to process the pattern on the mold; and
a control part for controlling the mold pattern processing device for producing the light guide plate comprising the laser light source and the scanner,
the control unit forms an area smaller than an irradiation limit of the scanner as an irradiation area, adjusts characteristics of the laser beam generated from the laser beam source, and changes a dot size of the pattern processed in the mold.
2. The apparatus of claim 1, wherein the controller adjusts one or more of a repetition frequency or a pulse of the laser beam generated from the laser beam source and an average power of the laser beam source to change a dot size processed on the mold.
3. The mold pattern-processing apparatus for the production of a light guide plate according to claim 2, wherein the control section controls the scanner to move after processing all patterns in one irradiation region, and controls the movement of the scanner so that a part of the regions overlap between irradiation regions adjacent to each other.
4. The apparatus of claim 3, wherein the controller adjusts the scanner to make the dot sizes of the patterns to be processed the same when the scanner processes the patterns in one shot region.
5. The mold pattern processing apparatus for producing a light guide plate according to claim 1,
the control part sets more than two mesh point sizes in advance when changing the mesh point size of the pattern processed by the die,
the processing of the dot size in the irradiation region excluding the preset dot size is to change the dot size of the pattern by adjusting a ratio at which the preset dot size is processed.
6. The apparatus of claim 5, wherein the ratio of processing is determined by adjusting a probability that a dot size set in advance in the irradiation region is processed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0145441 | 2019-11-13 | ||
| KR1020190145441AKR102196062B1 (en) | 2019-11-13 | 2019-11-13 | Apparatus for engraving pattern on master for manufacturing light guide plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112799167Atrue CN112799167A (en) | 2021-05-14 |
| CN112799167B CN112799167B (en) | 2023-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011266578.3AActiveCN112799167B (en) | 2019-11-13 | 2020-11-13 | Mould pattern processing device for light guide plate production |
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| KR (1) | KR102196062B1 (en) |
| CN (1) | CN112799167B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005035040A (en)* | 2003-07-16 | 2005-02-10 | Dainippon Printing Co Ltd | Printing dot, printing plate, printed matter, and halftone dot forming method |
| WO2011118909A2 (en)* | 2010-03-22 | 2011-09-29 | Yoon Tae Joong | Apparatus and method for machining light guide plate using laser |
| CN104553313A (en)* | 2013-10-23 | 2015-04-29 | 北大方正集团有限公司 | Printing image data processing method and device |
| CN104880756A (en)* | 2014-02-27 | 2015-09-02 | 苏州璨宇光学有限公司 | Light guide plate and backlight module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101051823B1 (en)* | 2009-10-19 | 2011-07-25 | 윤태중 | Laser generator for light guide plate processing |
| KR101083432B1 (en)* | 2010-01-20 | 2011-11-14 | (주)하드램 | Appratus for forming pattern for light guide plate using co2 laser |
| KR20180022197A (en)* | 2016-08-23 | 2018-03-06 | 케이투레이저시스템 (주) | Method for Forming Pattern and Laser Manufacturing Apparatus for using same |
- 2019
- 2019-11-13KRKR1020190145441Apatent/KR102196062B1/enactiveActive
- 2020
- 2020-11-13CNCN202011266578.3Apatent/CN112799167B/enactiveActive
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005035040A (en)* | 2003-07-16 | 2005-02-10 | Dainippon Printing Co Ltd | Printing dot, printing plate, printed matter, and halftone dot forming method |
| WO2011118909A2 (en)* | 2010-03-22 | 2011-09-29 | Yoon Tae Joong | Apparatus and method for machining light guide plate using laser |
| CN104553313A (en)* | 2013-10-23 | 2015-04-29 | 北大方正集团有限公司 | Printing image data processing method and device |
| CN104880756A (en)* | 2014-02-27 | 2015-09-02 | 苏州璨宇光学有限公司 | Light guide plate and backlight module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112799167B (en) | 2023-05-23 |
| KR102196062B1 (en) | 2020-12-29 |
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