CN112721224B - Electronic atomization device, power supply assembly thereof, support and support manufacturing method - Google Patents

Abstract

The invention relates to an electronic atomization device, a power supply assembly of the electronic atomization device, a support and a support preparation method, wherein the support preparation method comprises the following steps: s1, providing a rear die and a front die matched with the rear die to form a cavity, placing a prefabricated conductive piece with an integrated structure into the rear die, and propping the front die against the prefabricated conductive piece; s2, injecting plastic into the rear mold, and forming a bracket which is integrated with the prefabricated conductive piece and provided with a punching hole in a reserved manner through curing; and S3, punching the prefabricated conductive piece through the punching hole by adopting punching equipment. According to the preparation method of the bracket, after the prefabricated conductive piece and the plastic are molded into the bracket with an integrated structure, the prefabricated conductive piece is punched from the punching hole in the bracket by adopting punching equipment, so that the preparation efficiency of the bracket can be improved, the automatic assembly is convenient to realize, and the assembly efficiency of a power supply assembly is improved.

Description

Electronic atomization device, power supply assembly thereof, support and support manufacturing method

Technical Field

The invention relates to an atomization device, in particular to an electronic atomization device, a power supply assembly of the electronic atomization device, a support and a support manufacturing method.

Background

The support and the conductive pieces of the electronic atomization device in the related art are generally in a split structure, and during assembly, a plurality of conductive pieces need to be sequentially installed in the support, so that the electronic atomization device is complex in assembly, low in assembly efficiency and not beneficial to automatic assembly.

Disclosure of Invention

The invention aims to provide an improved bracket preparation method, and further provides an improved bracket, a power supply assembly and an electronic atomization device.

The technical scheme adopted by the invention for solving the technical problems is as follows: a stent fabrication method is constructed comprising the steps of:

s1, providing a rear die and a front die matched with the rear die to form a cavity, placing a prefabricated conductive part of an integrated structure into the rear die, and jacking the front die against the prefabricated conductive part;

s2, injecting plastic into the rear mold, and forming a support which is integrated with the prefabricated conductive part into a whole and is provided with a punching hole through curing;

and S3, punching the prefabricated conductive piece through the punching hole by adopting punching equipment.

Preferably, the punching holes comprise a plurality of first punching holes which are arranged on the bracket side by side at intervals;

in the step S2, a plurality of first punching holes are left in the molded bracket through the front mold;

in step S3, the punching device punches the preformed conductive member into a plurality of cell conductive members through the plurality of first punching holes.

Preferably, the punching holes comprise two second punching holes which are arranged on the bracket at intervals;

in the step S2, two second punching holes are left in the molded bracket through the front mold;

in step S3, the punching device punches the preformed conductive piece through the two second punching holes to form a battery core conductive piece and a charging conductive piece.

Preferably, the punching hole comprises a third punching hole which is arranged on the bracket and is close to the end part of the bracket;

in the step S2, the third punched hole is left in the molded bracket through the front mold;

in step S3, the punching device punches the prefabricated conductive member through the third punching hole to form a first charging conductive unit and a second charging conductive unit which are matched with each other.

Preferably, in the step S2, a first accommodating cavity for accommodating the battery cell and a second accommodating cavity for accommodating the circuit board are reserved on the molded bracket through the front mold.

Preferably, in step S2, a first positioning hole matched with the prefabricated conductive part is left on the molded bracket through the front mold.

Preferably, a second positioning hole matched with the positioning column on the front mold is formed in the prefabricated conductive piece;

in the step S1, when the prefabricated conductive member is placed in a rear mold, the second positioning hole on the prefabricated conductive member is matched with the positioning column for positioning.

Preferably, the preformed conductive member is formed on the bottom wall of the molded bracket.

Preferably, the preformed conductive piece of the molded bracket extends from the second accommodating cavity to the first accommodating cavity.

Preferably, the cell conductive member includes a first conductive contact portion, a second conductive contact portion, and a connection portion connecting the first conductive contact portion and the second conductive contact portion;

the first conductive contact parts of the plurality of cell conductive pieces are in the same direction;

the second conductive contact parts of the plurality of battery cell conductive pieces are in the same direction.

Preferably, the charging conductive part comprises a charging contact part which can be accessed by the external power supply;

the holder includes a first end wall; the charging contact portion is provided on the first end wall.

Preferably, the charging contact part comprises a first charging contact part and two second charging contact parts which are arranged side by side and at intervals, one ends of the two second charging contact parts are connected with each other and matched with the first charging contact part,

the first contact portion interval that charges sets up in two the second contact portion that charges.

The invention also constructs a bracket which is manufactured by the bracket manufacturing method.

The invention also constructs a power supply assembly, which comprises a battery cell, a circuit board and the bracket; the battery cell and the circuit board are arranged on the bracket.

The invention also constructs an electronic atomization device which comprises the power supply assembly and an atomizer connected with the power supply assembly.

The electronic atomization device, the power supply assembly thereof, the bracket and the bracket preparation method have the following beneficial effects: according to the preparation method of the support, after the prefabricated conductive piece and the plastic are molded into the support with an integrated structure, the prefabricated conductive piece is punched from the punching hole in the support by adopting punching equipment, so that the preparation efficiency of the support can be improved, the automatic assembly is convenient to realize, and the assembly efficiency of the power supply assembly is improved.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic structural diagram of an electronic atomizing device according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of a power supply assembly of the electronic atomizer shown in FIG. 1;

FIG. 3 is a schematic diagram of a portion of the power supply assembly shown in FIG. 2;

FIG. 4 is an exploded view of a portion of the power supply assembly of FIG. 3;

fig. 5 is a schematic structural diagram of a cell of the power supply assembly shown in fig. 3;

FIG. 6 is a schematic structural view of a bracket of the power supply assembly shown in FIG. 4;

FIG. 7 is a schematic view of the stent of FIG. 6 after molding;

fig. 8 is a schematic structural view of the prefabricated conductive member shown in fig. 6;

fig. 9 is a schematic view of the conductive member of the power supply assembly shown in fig. 6;

fig. 10 is a schematic view of the charging conductor of the power supply assembly of fig. 6;

FIG. 11 is a schematic view of a first seal of the power supply assembly of FIG. 4;

FIG. 12 is a schematic view of an alternate angle of the first seal of the power supply assembly of FIG. 11;

FIG. 13 is a schematic view of a second seal of the power supply assembly of FIG. 4;

fig. 14 is a schematic structural view showing a method for manufacturing a holder of an electronic atomizer according to a first embodiment of the present invention;

FIG. 15 is a schematic structural view of a holder of an electronic atomizer according to a second embodiment of the present invention;

fig. 16 is a schematic view of a charging conductor on the cradle of fig. 15.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 shows some preferred embodiments of the electronic atomization device of the present invention. In this embodiment, the electronic atomizer includes an atomizer a and a power supply assembly B; the atomizer a may be used to heat an atomizing medium, such as tobacco tar. The power supply assembly B may be mechanically and/or electrically connected to the atomizer a, and may provide electrical energy to the atomizer a.

As shown in fig. 2 to 4, further, in the present embodiment, the power supply assembly includes ahousing 10, abracket 20, abattery cell 30, and acircuit board 40. Thehousing 10 is used for accommodating thebracket 20, thebattery cell 30 and thecircuit board 40. Thesupport 20 is disposed in thecasing 10 and can support thebattery cell 30 and thecircuit board 40. Thebattery cell 30 is disposed on thebracket 20, and is located at a lower portion of thebracket 20, and can provide electric energy to the atomizer. Thecircuit board 40 may be disposed on thesupport 20 and electrically connected to thebattery cell 30.

Further, in the present embodiment, thehousing 10 has a cylindrical structure with an opening at one end. Thehousing 10 may be an injection molded part, although it will be appreciated that in other embodiments, thehousing 10 may be a metal housing. In this embodiment, thecasing 10 may be provided with apressure relief hole 101, and thepressure relief hole 101 may release air pressure in thecasing 10 when the electric core end explodes, so as to avoid continuous pressure rise, that is, to reduce the explosion intensity.

As shown in fig. 6 to 7, further, in the present embodiment, thebracket 20 is an insulating member, specifically, thebracket 20 may be an injection molded member, and specifically, thebracket 20 may be made of a plastic material. Of course, it is understood that in other embodiments, thebracket 20 may not be limited to a plastic material, and may be made of ceramic or other insulating materials. Theholder 20 comprises abottom wall 21, aside wall 22, afirst end wall 23 and asecond end wall 24. Thebottom wall 21 may be an elongated bottom wall, and theside walls 22 may be disposed on two opposite sides of thebottom wall 21. Theside walls 22 may be short side walls and may be integrally formed with thebottom wall 21. Thefirst end wall 23 may be disposed at one end of thebottom wall 21, and thesecond end wall 24 may be disposed at the other end of thebottom wall 21. Thesecond end wall 24 may be provided with anair inlet 241 which communicates with the atomizer for air to enter the atomizer. Thefirst end wall 23 may be disposed parallel to thesecond end wall 24. Thebottom wall 21, theside wall 22, thefirst end wall 23 and thesecond end wall 24 may enclose a housing space having an opening and capable of housing thebattery cell 30 and thecircuit board 40.

Further, in the present embodiment, thebracket 20 may further include a blockingwall 25, and the blockingwall 25 is disposed in the accommodating space along a direction transverse to thebottom wall 21, and divides the accommodating space into a firstaccommodating cavity 201 and a secondaccommodating cavity 202. The firstaccommodating cavity 201 can be used for accommodating thebattery cell 30, and the secondaccommodating cavity 202 can be used for accommodating thecircuit board 40. In this embodiment, the firstaccommodating cavity 201 and the secondaccommodating cavity 202 can be independently disposed, and the firstaccommodating cavity 201 and the secondaccommodating cavity 202 can be isolated from each other, so as to prevent the electrolyte of thebattery cell 30 from corroding thecircuit board 40, and further improve the sensitivity of the airflow sensing device 50. In this embodiment, the first receivingcavity 201 and the second receivingcavity 202 may be rectangular, the second receivingcavity 202 may be disposed side by side with the first receivingcavity 201, and the second receivingcavity 202 may be disposed near an end of thebracket 20 contacting the atomizer a. The size of the secondaccommodating cavity 202 may be smaller than the size of the firstaccommodating cavity 201, and specifically, the length of the secondaccommodating cavity 202 is smaller than the length of the firstaccommodating cavity 201, so that the electrolyte of thebattery cell 30 may be better prevented from corroding thecircuit board 40, the length of the sensing air channel of the airflow sensing device 50 may be shortened, and the sensitivity of the airflow sensing device 50 may be improved.

In this embodiment, one end of the firstaccommodating cavity 201 may be provided with anaccommodating groove 203, and theaccommodating groove 203 may be communicated with the firstaccommodating cavity 201 and may be used to accommodate thecell circuit board 32 disposed at one end of thecell 30. In the present embodiment, the shape and size of theaccommodating groove 203 may be adapted to the shape and size of thecell circuit board 32. Specifically, theaccommodating groove 203 may be a rectangular parallelepiped, and the size of theaccommodating groove 203 may be slightly larger than the size of the electricalcore circuit board 32. Of course, it is understood that, in other embodiments, the size of theaccommodating groove 203 may be equivalent to that of thecell circuit board 32.

In this embodiment, thebracket 20 may further include aboss 26, and theboss 26 may be disposed close to the blockingwall 25, may be located in theaccommodating groove 203, and may be disposed on thebottom wall 21 in a protruding manner, and may be configured to support the cellconductive member 60 and limit a pressing force of thecell circuit board 32 on thecell 30 to the cellconductive member 60. The shape of theboss 26 can be adapted to the shape of thecell circuit board 32. Theboss 26 may be rectangular, although it is understood that theboss 26 may not be limited to being rectangular in other embodiments. Theboss 26 can be integrally formed with thebottom wall 21, and in this embodiment, theboss 26 and thebottom wall 21 are integrally formed by injection molding.

In this embodiment, two limitingnotches 27 may be disposed on two opposite sides of theaccommodating groove 203, and the two limitingnotches 27 may be disposed on theside walls 22 at two ends of theboss 26. Thisspacing breach 27 can be used to supply this electriccore circuit board 32 to carry on spacingly to also can be convenient for thisstorage tank 203 holding length longer electriccore circuit board 32, thereby make thisstorage tank 203's application scope increase.

In this embodiment, twosteps 28 may be disposed on theboss 26 at intervals, and thesteps 28 may protrude from a contact surface between theboss 26 and thecell circuit board 32, and may also be used to limit a pressing force of thecell circuit board 32 on the cellconductive member 60. It will be appreciated that in other embodiments, thestep 28 may be omitted.

In this embodiment, apressure relief opening 221 may be formed on thesidewall 22 corresponding to the firstaccommodating cavity 201; thispressure release port 221 can communicate withpressure release hole 101 on thisshell 10, and when the explosion took place for the electric core end, atmospheric pressure can be followed thispressure release port 221 and released through this pressure release hole to can avoid continuing to step up, also can reduce explosion intensity. In the present embodiment, thepressure relief opening 221 may be rectangular, although it is understood that in other embodiments, thepressure relief opening 221 may not be limited to being rectangular.

In this embodiment, athin wall 222 may be disposed at thepressure relief opening 221, the thickness of thethin wall 222 is smaller than the thickness of thesidewall 22, and the size of thethin wall 222 may be smaller than the size of thepressure relief opening 221. Thethin wall 222 may be located in the middle of thepressure relief opening 221, and a gap is left between the thin wall and the side walls of the two sides of thepressure relief opening 221, so as to exhaust the air pressure in the firstaccommodating cavity 201. Thepressure relief port 221 and thepressure relief hole 101 on thehousing 10 can be staggered by thethin wall 222, and thebattery cell 30 can be exposed, so that the short circuit of thebattery cell 30 is avoided. An air storage cavity can be formed between the outer wall surface of thethin wall 222 and thehousing 10 of the power supply assembly a, so that air can be stored, and the air storage cavity can be communicated with thepressure relief hole 101 on thehousing 10. Through this gaseous storage chamber, can increase gas area and tolerance, and then can carry out pressure release fast effectively to continue to step up in can avoiding first holdingchamber 201, and then can reduce the intensity of explosion.

In this embodiment, thebottom wall 21 corresponding to the secondaccommodating cavity 202 may be disposed on the secondaccommodating cavity 202 and is communicated with a pressure relief throughhole 215 for pressure relief, the pressure relief throughhole 215 may be disposed near thesecond end wall 24 and may be used to drive the airflow sensing device 50 to be normally started, in an actual use process, the airflow sensing device 50 generates a trigger signal when detecting a change in air pressure, the space where the airflow sensing device 50 is located is communicated with the outside due to the existence of the pressure relief throughhole 215, and the starting is performed by a change of negative pressure and atmospheric pressure during suction, so that the starting accuracy is higher. If the inside is a closed space, the vibration amplitude of the diaphragm in the airflow sensing device 50 is not so large, and the start-up insensitivity phenomenon occurs.

As shown in fig. 5, further, in the embodiment, thebattery core 30 is accommodated in the firstaccommodating cavity 201, and thebattery core 30 is a rechargeable battery and can be powered by an external power source, so as to continuously provide electric energy to the atomizer, thereby improving the cyclicity of the power supply assembly and reducing resource waste. In the present embodiment, thebattery cell 30 may include acell body 31 and acell circuit board 32, and thecell circuit board 32 may be disposed at one end of thecell body 31 and may be connected to thecell body 31 by a lead 33. Thecell body 31 can be accommodated in the firstaccommodating cavity 201, thecell circuit board 32 can be accommodated in theaccommodating groove 203 at one end of the firstaccommodating cavity 201, and two ends of the cell circuit board can be clamped on the limitingnotch 27. Thecell circuit board 32 may be electrically connected to thecircuit board 40 through the cellconductive member 60.

Further, in the present embodiment, thecircuit board 40 is accommodated in the secondaccommodating cavity 202. Thepower supply assembly 20 further includes an airflow sensing device 50, and the airflow sensing device 50 can be disposed in the secondaccommodating cavity 202 and can be electrically connected to thecircuit board 40. Thecircuit board 40 may be disposed at an airflow hole 401 through which the airflow flows into the airflow sensing device 50. In this embodiment, the airflow sensing device 50 may be an airflow sensor or a microphone. Specifically, the gas flow sensor may be a MEMS gas flow sensor that is soldered to thewiring board 40.

As shown in fig. 3 to 9, further, in the present embodiment, the power supply assembly further includes a conductive structure, and the conductive structure may be disposed on thebracket 20, specifically, on thebottom wall 21 of thebracket 20 and integrally formed with thebottom wall 21, but it is understood that the conductive structure is not limited to be disposed on thebottom wall 21 of thebracket 20, and may also be disposed on theside wall 22 and thefirst end wall 23 of thebracket 20. The conductive structure may connect thecircuit board 40 and thebattery cell 30 and charge thebattery cell 30, or may be used only for connecting thecircuit board 40 and thebattery cell 30, or may be used only for charging thebattery cell 30. The conductive structure may be formed as an integral structure with thesupport 20. In this embodiment, the conductive structure and thebracket 20 may be integrally formed by injection molding. In this embodiment, the conductive structure may be a sheet structure, specifically, the conductive structure may be a metal spring, and a conductive layer may be disposed on a contact surface of the conductive structure with thecircuit board 40 and thebattery cell 30 or a contact surface of the conductive structure with thecircuit board 40 and an external power supply. The conductive layer may be a metal coating, in this embodiment, the material of the conductive layer may be gold, and the conductivity between the conductive structure and thecircuit board 40 and thebattery cell 30 or between the conductive structure and thecircuit board 40 and the external power supply may be increased through the conductive layer.

In this embodiment, the conductive structure may include a cellconductive member 60, where the cellconductive member 60 is disposed on thebracket 20, and may form an integral structure with thebracket 20, and may abut against thecircuit board 40 and thecell 30, so as to electrically connect thecircuit board 40 and thecell 30. Specifically, this electrically conductive piece ofelectric core 60 can be through moulding plastics integrated into one piece with thissupport 20 to need not additionally to set up insulating part and wrap up this electrically conductive piece ofelectric core 60, and then can improve packaging efficiency and fail safe nature, and be convenient for realize automated production. In this embodiment, the battery cellconductive element 60 may be disposed on thebottom wall 21 and disposed between the firstaccommodating cavity 201 and the secondaccommodating cavity 202, and specifically, the battery cellconductive element 60 may be disposed on theboss 26 and the blockingwall 25 and may abut against thecircuit board 40 and thebattery cell 30, so as to conductively connect thecircuit board 40 and thebattery cell 30, and the contact manner is adopted, so that welding and parts can be reduced, and further, the realization of automated production can be facilitated.

In the present embodiment, the cellconductive member 60 may be a metal spring, and specifically, the material of the metal spring is preferably a stainless steel material or a phosphor-copper material, but it should be understood that, in other embodiments, the material of the cellconductive member 60 is not limited to the above listed materials. In this embodiment, a conductive layer may be disposed on the contact surfaces of the cellconductive element 60, thecircuit board 40, and thecell 30, and the material of the conductive layer may be gold, and the conductive layer may be formed by gold plating on the contact surfaces of the cellconductive element 60, thecircuit board 40, and thecell 30.

Further, in the present embodiment, the cellconductive member 60 includes a firstconductive contact portion 61, a secondconductive contact portion 62, afirst deformation portion 63, asecond deformation portion 64, afirst support portion 65, asecond support portion 66, and aconnection portion 67.

The firstconductive contact portion 61 is disposed at one end of thefirst deformation portion 63, and can be bent with thefirst deformation portion 63 to form a first predetermined included angle. In this embodiment, the first set angle may be an acute angle. Of course, it is understood that in other embodiments, the first set angle may not be limited to an acute angle. In this embodiment, one end of the first deformingpart 63 may be bent to form the firstconductive contact part 61. The firstconductive contact portion 61 extends out from theboss 26 on thebottom wall 21 and is configured to contact thebattery cell 30.

In this embodiment, the secondconductive contact portion 62 is disposed opposite to the firstconductive contact portion 61, the secondconductive contact portion 62 is disposed at one end of thesecond deformation portion 64, and can be bent with thesecond deformation portion 64 to form a second predetermined included angle, which in this embodiment can be an acute angle. Of course, it is understood that in other embodiments, the second set angle may not be limited to an acute angle. In this embodiment, one end of thesecond deforming portion 64 may be bent to form the secondconductive contact portion 62. The secondconductive contact 62 can extend through thewall 25 and can be used to contact thecircuit board 40. In this embodiment, the conductive layer may be disposed on the firstconductive contact 61 and the secondconductive contact 62.

Thefirst deformation portion 63 may be disposed at an end of the firstconductive contact portion 61 close to theconnection portion 67, thesecond deformation portion 64 may be disposed at an end of the secondconductive contact portion 62 close to theconnection portion 67, and thefirst deformation portion 63 and thesecond deformation portion 64 may be disposed in a shape of a Chinese character 'ba'. Through the arrangement of thefirst deformation portion 63 and thesecond deformation portion 64, the whole cellconductive piece 60 has an elastic deformation space, and further, the firstconductive contact portion 61 and the secondconductive contact portion 62 of the cellconductive piece 60 can be in better contact with corresponding positions of thecell 30 and thecircuit board 40, respectively.

The first supportingportion 65 and the second supportingportion 66 may be disposed at two ends of the connectingportion 67 side by side and in parallel, one end of the first supportingportion 65 may be connected to the first deformingportion 63, the other end may be connected to the connectingportion 67, and the first supportingportion 65 and the connectingportion 67 may be bent to form a third set included angle. The first supportingportion 65 and the first deformingportion 63 can be bent to form a fourth predetermined angle, which can be an obtuse angle. It is understood that in other embodiments, the fourth set angle may not be limited to an obtuse angle.

In this embodiment, one end of the second supportingportion 66 may be connected to thesecond deforming portion 64, and the other end may be connected to the connectingportion 67. The second supportingportion 66 and the connectingportion 67 may be bent to form a fifth set included angle, in this embodiment, the fifth set included angle may be a right angle, and it should be understood that the fifth set included angle may not be limited to a right angle in other embodiments. In the present embodiment, the second supportingportion 66 and the connectingportion 67 and thesecond deforming portion 64 can be bent to form a sixth set included angle, which can be an obtuse angle, and it can be understood that in other embodiments, the sixth set included angle is not limited to an obtuse angle.

In this embodiment, the connectingportion 67 may be integrally formed with thebracket 20, and specifically, in this embodiment, the connectingportion 67 may be disposed on the blockingwall 25 and theboss 26 and integrally formed with the blockingwall 25 and theboss 26 by injection molding. The two ends of the connectingportion 67 can be connected to the first supportingportion 65 and the second supportingportion 66 respectively, so as to connect the firstconductive contact portion 61 and the secondconductive contact portion 62.

Further, in this embodiment, the battery cellconductive member 60 may be multiple, and two opposite sides of the battery cellconductive member 60 may respectively extend toward thecircuit board 40 and thebattery cell 30, and then may respectively abut against thecircuit board 40 and thebattery cell 30. In the present embodiment, the orientations of the plurality ofcell conductors 60 are the same, and specifically, the orientations of the firstconductive contact portions 61 of the plurality ofcell conductors 60 are the same, and the orientations of the secondconductive contact portions 62 of the plurality ofcell conductors 60 are the same. Firstconductive contact portions 61 of the plurality of cellconductive members 60 extend toward firstaccommodating cavity 201, and secondconductive contact portions 62 of the plurality of cellconductive members 60 extend toward secondaccommodating cavity 202. The orientation of theelectric conduction piece 60 of the battery cell is kept consistent, so that thecircuit board 40 and thebattery cell 30 can be conveniently installed, and further, the automatic assembly is conveniently realized.

In this embodiment, the number of the cellconductive elements 60 may be three, and it is understood that in other embodiments, the number of the cellconductive elements 60 may not be limited to three. In this embodiment, this electrically conductive piece ofbattery 60 includes electrically conductive piece offirst battery 60a, electrically conductive piece ofsecond battery 60b, the electrically conductive piece ofthird battery 60c. The first, second, and third cellconductive elements 60a, 60b, and 60c are arranged side-by-side. The first cellconductive member 60a can communicate the positive electrode of thecell 30 with thecircuit board 40. The second cellconductive element 60b may be configured to communicate with the negative electrode of thecell 30 and thecircuit board 40, and the third cellconductive element 60c may be configured to transmit a control signal of thecircuit board 40 to thecell 30. First, second, and third cellconductive elements 60a, 60b, and 60c are oriented in the same direction, and specifically, firstconductive contact portions 61 and secondconductive contact portions 62 of first, second, and third cellconductive elements 60a, 60b, and 60c are oriented in the same direction.

As shown in fig. 5, 6, 8 and 10, further, in the present embodiment, the conductive structure further includes a chargingconductive member 70, and the chargingconductive member 70 may be disposed on thebracket 20 and may form an integral structure with thebracket 20. Specifically, in the present embodiment, the chargingconductive member 70 and thebracket 20 may be integrally formed by injection molding, so that an insulating member is not required to be additionally disposed to wrap the chargingconductive member 70, a welding process may be omitted, and the assembly efficiency and safety of the power supply assembly may be improved. The chargingconductive member 70 may be partially embedded in thebottom wall 21 and thefirst end wall 23, and may extend from the firstaccommodating cavity 201 to the secondaccommodating cavity 202 to abut against thecircuit board 40. The chargingconductive member 70 may be connected to the external power supply, and the external power supply may be electrically connected to thecircuit board 40, so as to facilitate the external power supply to charge thebattery cell 30.

In this embodiment, the chargingconductive member 70 may be a metal dome, specifically, the material of the metal dome is preferably a stainless steel material or a phosphor copper material, but it should be understood that, in other embodiments, the material of the chargingconductive member 70 is not limited to the above listed materials. In this embodiment, a conductive layer may be disposed on the contact surface between the chargingconductive device 70 and thecircuit board 40, and the external power source, and the conductive layer may be made of gold, and the conductive layer may be formed by plating gold on the contact surface between the chargingconductive device 70 and thecircuit board 40.

In this embodiment, the chargingconductive member 70 may include a first chargingconductive unit 71 and a second chargingconductive unit 72. The first chargingconductive unit 71 and the second chargingconductive unit 72 can be connected to thecircuit board 40 respectively to form a negative electrode path and a positive electrode path, respectively. In this embodiment, the first chargingconductive unit 71 and the second chargingconductive unit 72 may be disposed at intervals and disposed near theside wall 22 of thebracket 20, respectively. Of course, in other embodiments, the first chargingconductive unit 71 and the second chargingconductive unit 72 may be located on the same side.

In this embodiment, the chargingconductive member 70 may include charging contacts disposed on the first chargingconductive element 71 and the second chargingconductive element 72 and located on thefirst end wall 23, and in this embodiment, the charging contacts may be integrally formed with thefirst end wall 23. Specifically, the charging contact portion may be integrally formed with thefirst end wall 23 by injection molding. The charging contact part can be used for positive and negative connection of an external power supply. In this embodiment, the external power source can be a charging socket, and the charging socket can charge the power supply module a through the charging contact portion no matter whether the power supply module a is placed on the charging socket in the forward direction or in the reverse direction.

In this embodiment, the first chargingconductive unit 71 may include a firstcharging contact portion 711, afirst connection portion 712, and a first circuitboard contact portion 713.

Thefirst charging contact 711 may be strip-shaped and may be partially embedded in thefirst end wall 23. Thefirst charging contact 711 may be used to access an external power source. Specifically, in the present embodiment, the firstcharging contact portion 711 may abut against a conductive contact connected to the external power source. In this embodiment, thefirst charging contact 711 may contact with a conductive contact connected to a negative electrode of the external power source.

The first connectingportion 712 can be connected to the firstcharging contact portion 711, and the first connectingportion 712 can be disposed on thebottom wall 21 and theside wall 22, and integrally formed with thebottom wall 21 and theside wall 22, and can extend from the first receivingcavity 201 to the second receivingcavity 202. The first circuitboard contact portion 713 may be disposed at one end of thefirst connection portion 712, and may be formed by folding an end of thefirst connection portion 712, which is away from the firstcharging contact portion 711, upward. In the present embodiment, the first connectingportion 712 may include afirst bending section 7121, asecond bending section 7122 and athird bending section 7123. Thefirst bending section 7121 may be disposed parallel to thebottom wall 21, and thefirst bending section 7121 may be in a strip shape. The secondbent segment 7122 can be disposed parallel to thesidewall 22. The secondbent segment 7122 may be in the shape of a strip. The length direction of the secondbent section 7122 is parallel to the length direction of the firstbent section 7121. Thethird bending section 7123 may be disposed between thefirst bending section 7121 and thesecond bending section 7122, and may be configured to be matched with a joint between thebottom wall 21 and theside wall 22, in this embodiment, the joint between thebottom wall 21 and theside wall 22 may be a long arc, thethird bending section 7123 may be a long arc, and a length direction of the third bending section is parallel to a length direction of thefirst bending section 7121, and thethird bending section 7123 may be attached to the joint between thebottom wall 21 and theside wall 22. In this embodiment, thefirst bending section 7121, thesecond bending section 7122 and thethird bending section 7123 can be formed by sequentially bending. In other embodiments, the first connectingportion 712 is not limited to include the firstbent section 7121, the secondbent section 7122 and the thirdbent section 7123.

In this embodiment, a plurality offirst positioning protrusions 7124 may be disposed on the first connectingportion 712, and the plurality offirst positioning protrusions 7124 may be disposed at intervals along thesecond bending section 7122 and may protrude from thesecond bending section 7122. In this embodiment, thebottom wall 21 may be provided with two rows of first positioning holes 211, and the two rows of first positioning holes 211 may be disposed on thebottom wall 21 at intervals and respectively close to theside walls 22 at two opposite sides of thebottom wall 21. Specifically, the two rows of first positioning holes 211 can be disposed in the firstaccommodating cavity 201. Each row of the first positioning holes 211 may include a plurality of first positioning holes 211 arranged side by side, and the plurality of first positioning holes 211 may be arranged at intervals along a length direction of the first receivingcavity 201. Thefirst positioning protrusions 7124 may be matched with the first positioning holes 211, and specifically, in this embodiment, thefirst positioning protrusions 7124 and the first positioning holes 211 on the same row are disposed in a one-to-one correspondence.

The first circuitboard contact portion 713 may be disposed at one end of thefirst connection portion 712 and may abut thecircuit board 40 to be electrically connected to thecircuit board 40. The first circuitboard contact portion 713 may be integrally formed on thebottom wall 21, and the first circuitboard contact portion 713 includes afirst abutting section 7131 abutting against thecircuit board 40, afirst deforming section 7132 connected to one end of thefirst abutting section 7131, and a first supportingsection 7133 connected to the first connectingportion 712 and thefirst deforming section 7132. Thefirst deformation section 7132 can increase the elastic deformation space of the first circuitboard contact portion 713, so that thefirst abutting section 7132 can be stably contacted with thecircuit board 40.

In the present embodiment, the first chargingconductive unit 71 further includes a first connectingarm 714, and the first connectingarm 714 may be disposed between the first connectingportion 712 and the firstcharging contact portion 711 and may be used to connect the first connectingportion 712 and the firstcharging contact portion 711. The first connectingarm 714 can be disposed parallel to thebottom wall 21, and can be integrally formed with thebottom wall 21 by injection molding. In this embodiment, the firstcharging contact portion 711 and the first connectingarm 714 can be disposed in a bent manner. Specifically, thefirst charging contact 711 may be substantially perpendicular to the first connecting arm 715.

In this embodiment, the second chargingconductive unit 72 may include a secondcharging contact portion 721, asecond connection portion 723, and a second circuitboard contact portion 724.

The secondcharging contact portion 721 may be strip-shaped, and may be partially embedded in thefirst end wall 23. The secondcharging contact portion 721 can be used to access an external power source. Specifically, in the present embodiment, the secondcharging contact portion 721 can abut against the conductive contact connected to the external power source. In this embodiment, the secondcharging contact portion 721 can be abutted with the conductive contact connected to the positive electrode of the external power source. Thesecond charging contact 721 may be spaced apart from and parallel to thefirst charging contact 711. In this embodiment, there may be twosecond charging contacts 721, and the twosecond charging contacts 721 are arranged side by side and spaced apart from each other, and may be connected and conducted by arranging the conductingpart 722. The conductingportion 722 may be located at one end of the twosecond charging contacts 721, and the twosecond charging contacts 721 and the conductingportion 722 may be enclosed to form a semi-closed groove structure. The firstcharging contact part 711 can be inserted into the groove structure, and is arranged between the two secondcharging contact parts 721 at intervals, and is matched with the two secondcharging contact parts 721 to form a positive and negative charging contact part for an external power supply. Of course, it is understood that in other embodiments, there may be only one secondcharging contact portion 721, and the secondcharging contact portion 721 may be arranged in parallel with the firstcharging contact portion 711. It is understood that in other embodiments, thefirst charging contact 711 and thesecond charging contact 721 may not be limited to bar shapes. In this embodiment, thefirst charging contact 711 may be a positive charging contact, and thesecond charging contact 721 may be a negative charging contact. Of course, it is understood that in other embodiments, thefirst charging contact 711 may be a negative charging contact and thesecond charging contact 721 may be a positive charging contact.

In this embodiment, a viahole 231 may be disposed on thefirst end wall 23, and the viahole 231 may be used to expose the charging contact portion, so that the external power source is connected to the charging contact portion. In this embodiment, the number of thevias 231 may be three. The three vias 231 may be disposed in one-to-one correspondence with the twosecond charging contacts 721 and thefirst charging contact 711.

The second connectingportion 723 may be connected to the secondcharging contact portion 721, and the second connectingportion 723 is disposed on thebottom wall 21 and theside wall 22, integrally formed with thebottom wall 21 and theside wall 22, and may extend from the second receivingcavity 201 to the second receivingcavity 202, and spaced from the first connectingportion 712. In this embodiment, the second connectingportion 723 may include afourth bending section 7231, a fifth bending section 7232 and asixth bending section 7233. Thefourth bending portion 7231 can be parallel to thebottom wall 21, and thefourth bending portion 7231 can be in the shape of a bar. The fifth bending section 7232 can be disposed parallel to thesidewall 22. The fifth bending portion 7232 can have a bar shape. The length direction of the fifth bending section 7232 is parallel to the length direction of thefourth bending section 7231. Thesixth bending section 7233 can be disposed between thefourth bending section 7231 and the fifth bending section 7232, and can be used for matching with the joint between thebottom wall 21 and theside wall 22, in this embodiment, the joint between thebottom wall 21 and theside wall 22 can be a long arc, thesixth bending section 7233 can be a long arc, and the length direction of thesixth bending section 7233 is parallel to the length direction of thefourth bending section 7231, and thesixth bending section 7233 can be attached to the joint between thebottom wall 21 and theside wall 22. In this embodiment, thefourth bending section 7231, the fifth bending section 7232 and thesixth bending section 7233 can be formed by sequentially bending. In other embodiments, thesecond connector 723 is not limited to including thefourth bend 7231, the fifth bend 7232 and thesixth bend 7233.

In this embodiment, a plurality ofsecond positioning protrusions 7234 may be disposed on the second connectingportion 723, and the plurality ofsecond positioning protrusions 7234 may be spaced along the fifth bending section 7232 and may be disposed to protrude from the fifth bending section 7232. Thesecond positioning protrusions 7234 can be matched with the first positioning holes 211, and specifically, in the present embodiment, thesecond positioning protrusions 7234 can be disposed in one-to-one correspondence with the first positioning holes 211 in another row.

The second circuitboard contact portion 724 may be disposed at one end of thesecond connection portion 723, and may be formed by folding one end of thesecond connection portion 723 away from the secondcharging contact portion 721 upward. The second circuitboard contact portion 724 can be integrally formed on thebottom wall 21. The second circuitboard contact portion 724 may include asecond abutting section 7241 abutting thecircuit board 40, asecond deforming section 7242 connected to one end of thesecond abutting section 7241, and asecond supporting section 7243 connected to the second connectingportion 723 and thesecond deforming section 7242. Thesecond deforming section 7242 can increase the elastic deformation space of the second circuitboard contacting portion 724, so that thesecond abutting section 7242 can be stably contacted with thecircuit board 40. In this embodiment, the first circuitboard contact portion 713 and the second circuitboard contact portion 724 may extend in the same direction, that is, the first circuitboard contact portion 713 and the second circuitboard contact portion 724 are oriented in the same direction, so that the first circuitboard contact portion 713 and the second circuitboard contact portion 724 can be conveniently mounted on thecircuit board 40, and thus, the automatic mounting is conveniently realized.

In the present embodiment, the second chargingconductive unit 72 further includes a second connectingarm 725, and the second connectingarm 725 may be disposed between the second connectingportion 723 and the secondcharging contact portion 721 and may be used to connect the second connectingportion 723 and the secondcharging contact portion 721. The fifth connectingarm 725 can be disposed parallel to thebottom wall 21 and can be integrally formed with thebottom wall 21 by injection molding. In this embodiment, the secondcharging contact portion 721 and the second connectingarm 725 are disposed in a bending manner. Specifically, thesecond charging contact 721 may be substantially perpendicular to the second connectingarm 725.

In this embodiment, the chargingconductive member 70 may further includesecond positioning holes 7141 and 7251. The twosecond positioning holes 7141 and 7251 are disposed on the first connectingarm 714 and the second connectingarm 725, respectively. Thesecond positioning holes 7141 and 7251 can facilitate the charging conductive member to be positioned in the mold during injection molding.

As shown in fig. 5, 11, and 12, further, in the present embodiment, the power supply assembly may further include a first sealingmember 80, and the first sealingmember 80 may be engaged with thebracket 20 and may be disposed corresponding to the airflow sensing device 50. Specifically, in the present embodiment, thefirst sealing element 80 can be disposed at an opening of the second receivingcavity 202 of thebracket 20 and pressed against thecircuit board 40. In the present embodiment, the first sealingmember 80 may be a silicone member, but it is understood that in other embodiments, the first sealingmember 80 may not be limited to a silicone member. In this embodiment, the first sealingmember 80 may have a square cross section, and the shape and size thereof can be adapted to the second receivingcavity 202.

Further, in the present embodiment, thefirst sealing element 80 includes anelastic body 81, and the shape and size of theelastic body 81 can be adapted to the secondaccommodating cavity 202. In this embodiment, thefirst seal 80 may be provided with afirst opening 82, asecond opening 83, and afluid passage 84 communicating thefirst opening 82 and thesecond opening 83. Thefirst opening 82 can be located on theelastic body 81 and disposed near thesecond end wall 24, and is communicated with theair inlet 241 on thesecond end wall 24, and thefirst opening 82 can provide air flow to flow out and into theair inlet 241 of thesecond end wall 24, and provide condensed liquid to flow in if condensed liquid exists. Thesecond opening 83 can be disposed on theelastic body 81 and near the blockingwall 25. Thesecond opening 83 can communicate with the airflow hole 401 on thecircuit board 40, and further communicate with the airflow sensing device 50. In this embodiment, the cross-sectional area of thesecond opening 83 may be larger than the cross-sectional area of the airflow hole 401 on thecircuit board 40, so that the normal operation of the airflow sensing device 50 is not affected even when the installation is slightly misaligned. Specifically, thesecond opening 83 and the airflow hole 401 of thewiring board 40 may be circular holes, and the aperture of thesecond opening 83 may be larger than the aperture of the airflow hole 401 of thewiring board 40. Thefluid passage 84 may communicate thefirst opening 82 and thesecond opening 83. When the user sucks, the air can pass through the air flow sensing device 50, enter the second opening from the air flow hole 401 of thecircuit board 40, and then pass through the fluid channel to be output from thesecond opening 83 to theair inlet hole 241 of thesecond end wall 24, so that the air flow sensing device 50 is in a negative pressure state. Condensate can be output from theinlet aperture 241 into thefirst opening 82 and into thefluid passage 84, where it can be stored in thefluid passage 84. In this embodiment, the fluid channel may be designed such that the path of the condensate flowing from thefirst opening 82 to thesecond opening 83 through thefluid channel 84 is longer than the path of the airflow flowing from thesecond opening 83 to thefirst opening 82 through thefluid channel 84, that is, the fluid channel has different flow resistances for different flow directions, so that the airflow can normally flow to thefirst opening 82 to achieve normal operation of the airflow sensing device 50, and the condensate is difficult to flow to thesecond opening 83, so that the condensate can be prevented from corroding the airflow sensing device 50 and thecircuit board 40.

Further, in this embodiment, thefluid path 84 includes amain path 841 and at least one return path 842. Themain channel 841 can be centrally disposed and can be linearly disposed, with one end communicating with thefirst opening 82 and the other end communicating with thesecond opening 83. Of course, it is understood that in other embodiments, themain channel 841 is not limited to being centrally disposed and not limited to being linearly distributed. The number of the backflow passages 842 may be multiple, and a plurality of backflow passages 842 may be disposed side by side on two opposite sides of themain passage 841. Of course, it is understood that in other embodiments, there may be only one return passage 842. The return passage 842 can be communicated with themain passage 841 to increase the fluid path, thereby reducing the reflux of the condensate to thecircuit board 40 and preventing the condensate from polluting thecircuit board 40 and the gas flow reaction device 50. In this embodiment, the backflow channel 842 may be disposed obliquely toward thesecond opening 83 and may form a set included angle with themain channel 841, in this embodiment, the set included angle may be an acute angle, specifically, the set included angle may be 30 to 60 degrees, and preferably 45 degrees, and the configuration space may be optimized by disposing the backflow channel 842 obliquely at an acute angle with respect to the longitudinal axis of themain channel 841.

Further, in the present embodiment, the return passage 842 includes aflow portion 8421, a return portion 8422, and acommunication portion 8423. Theflow portion 8421 may communicate with themain passage 841, and condensate may flow from themain passage 841 into theflow portion 8421. The return portion 8422 may communicate with themain passage 841 and theflow portion 8421, and the return portion 8422 and theflow portion 8421 may be disposed in a straight line, and theflow portion 8421 and the return portion 8422 may be disposed in parallel. Of course, it is understood that the returning portion 8422 and theflow portion 8421 may not be limited to being arranged in a straight line, but may be arranged in a curved line in other embodiments. In other embodiments, theflow portion 8421 and the return portion 8422 may not be limited to being parallel, but may be distributed in a splayed shape. Thecommunication portion 8423 may communicate theflow portion 8421 and the return portion 8422. The condensate can flow from the flowingportion 8421, pass through the communicatingportion 8423, flow to the returning portion 8422, and return from the returning portion 8422 to themain passage 841.

Further, in the present embodiment, thefirst sealing element 80 may be provided with four throughholes 85, and the throughholes 85 may be distributed at four corners of theelastic body 81. The throughhole 85 may be disposed through theelastic body 81 along a thickness direction of theelastic body 81, and may be used for a screw to pass through, so that the screw connects and fixes thefirst sealing element 80 and thebracket 20. In this embodiment, the via 85 may also be used for ventilation.

Further, in the present embodiment, thefirst sealing element 80 is provided with apressure relief groove 86, and thepressure relief groove 86 can communicate with thefluid passage 84. In this embodiment, specifically, thepressure relief groove 86 may be disposed near thesecond opening 83, and one end thereof may be communicated with thefluid channel 84, and the other end thereof may be communicated with one of the through holes 85. The function of thepressure relief groove 86 is to stop the operation of the airflow sensing device 50 when the user does not suck, but the airflow hardly flows back to the airflow sensing device 50 because the flow resistance of thefluid channel 84 flowing from thefirst opening 82 to thesecond opening 83 is large, and at this time, thepressure relief groove 86 can supplement the air pressure to relieve the negative pressure state of the airflow sensing device 50 so as to ensure the normal operation of the airflow sensing device 50.

Further, in this embodiment, apositioning protrusion 87 may be disposed on the first sealingmember 80, and thepositioning protrusion 87 may be disposed on a side of theelastic body 81 opposite to the airflow sensing device 50 and may be configured to cooperate with the airflow sensing device 50 for positioning. In this embodiment, when the first sealingmember 80 is pressed against thecircuit board 40, thepositioning protrusion 87 can be pressed against the airflow hole 401 of thecircuit board 40. In this embodiment, thesecond opening 83 can be formed in thepositioning protrusion 87. In this embodiment, a sealingrib 871 may be disposed on the protruding end surface of thepositioning protrusion 87, and the sealingrib 871 may be disposed protruding toward thecircuit board 40 and may be used to seal the gap between thesecond opening 83 and thecircuit board 40.

Further, in this embodiment, a sealingring 88 cooperating with and sealing with asecond sealing member 90 may be disposed on the first sealingmember 80, and the sealingring 88 may be disposed on theelastic body 81 and may be disposed along a circumferential direction of theelastic body 81.

Further, in this embodiment, a light guiding pillar may be further disposed on the first sealingmember 80, and the light guiding pillar may protrude from theelastic body 81 and may be disposed corresponding to the LED lamp on thecircuit board 40.

As shown in fig. 5 and fig. 13, further, in this embodiment, the power supply assembly may further include asecond sealing element 90, thesecond sealing element 90 may be matched with thebracket 20, specifically, thesecond sealing element 90 may be disposed at the second receivingcavity 202, and may be pressed on thefirst sealing element 80, and may be connected and fixed with thebracket 20 by a set screw, and thefirst sealing element 80 and thesecond sealing element 90 are sequentially disposed at the second receivingcavity 202 from inside to outside, so that the second receivingcavity 202 is sealed to form a sealed space, and electrolyte leakage from the battery cell of the first receivingcavity 201 may be prevented from polluting thecircuit board 40 and the airflow response device 50 in the second receivingcavity 202. In this embodiment, thesecond sealing element 90 includes abody 91, a firstpressing structure 92 disposed on one side of thebody 91 and protruding toward the second receivingcavity 202, and a secondpressing structure 93 disposed on one side of thebody 91 and protruding toward theboss 26. The firstpressing structure 92 may be a cylinder, and may be four, and may be distributed at four corners of thebody 91 at intervals. Of course, it is understood that the first crimpingstructure 92 may not be limited to four in other embodiments. The four first press-connectingstructures 92 may be disposed corresponding to the throughholes 85 on the first sealingmember 80, and may be pressed into thecircuit board 40 through the through holes 85. The firstpressing structure 92 has a hollow structure inside, and a throughhole 920 for passing a screw is formed. In this embodiment, the firstpressing structure 92 may include a firstpressing part 921 and a second pressing part 922, which are in a column shape, and both the firstpressing part 921 and the second pressing part 922 can be pressed on thecircuit board 40. The second crimping portion 922 can be protruded on the outer side wall of the first crimpingportion 921, so that the contact area between the first crimpingstructure 92 and thecircuit board 40 can be increased, and thecircuit board 40 can be stably crimped. In the embodiment, the secondpressing structure 93 is in a block shape and can be pressed at one end of thecircuit board 40 connected to thebattery cell 30, so that theconductive sheet 60 and thecircuit board 40 can be in sufficient contact. In this embodiment, the number of the second crimpingstructures 93 may be two, and the two second crimpingstructures 93 may be arranged at intervals.

Further, in the present embodiment, the power supply assembly may further include a sealingcover 100, and the sealingcover 100 may be a silicone member and may be sleeved on the top of thesupport 20 to seal a gap between thesupport 20 and thehousing 10.

Further, in this embodiment, the power supply assembly may further include twoelectrode elements 110, and the twoelectrode elements 110 may be disposed at intervals and respectively penetrate through the sealingcover 100 and thesecond end wall 24, so as to be used for connecting thecircuit board 40 and the atomizer. In the present embodiment, theelectrode element 110 includes anelastic contact portion 111, an engagingportion 112, anaccommodating portion 113, and a conductive connectingportion 114. Theelastic contact portion 111 can extend out from thesecond end wall 24 of theholder 20 and can be in contact with the atomizer, and in particular, can be in elastic contact with the electrode column of the atomizer. The engagingportion 112 may be disposed on the outer peripheral wall of the elastic abuttingportion 111, and the engagingportion 112 may be annular and may be located at one end of the elastic abuttingportion 111. The engagingportion 112 can be engaged with the electrode hole of thesecond end wall 24. Theaccommodating portion 113 may be in a cylindrical shape and may be disposed on a side of the engagingportion 112 opposite to the elastic abuttingportion 111. Theaccommodating portion 113 can be accommodated on the electrode hole of thesecond end wall 24. The conductive connectingportion 114 can penetrate into the second receivingcavity 202 of thebracket 20 from thesecond end wall 24 and can be connected to thecircuit board 40, and specifically, the conductive connectingportion 114 can be soldered to a pad of thecircuit board 40 by a spot welding machine. In this embodiment, the height of theconductive connection portion 114 may be 0.1mm to 0.3mm, preferably 0.2mm, the area of the pad is larger than the cross-sectional area of theconductive connection portion 114, and preferably, the pad is rectangular, and the projection of theconductive connection portion 114 falls within the interval defined by the pad.

As shown in fig. 14, in this embodiment, the stent preparation method may include the following steps:

s1, providing a rear die and a front die matched with the rear die to form a cavity, placing a prefabricated conductive piece with an integrated structure into the rear die, and placing the front die on the rear die to prop against the prefabricated conductive piece.

Wherein, the rear mold can be a hollow structure with an opening on one side. A plurality of first convex parts extending downwards can be arranged on the inner side of the top wall of the front die, and the first convex parts can be arranged close to the middle of the top wall of the front die and can be arranged side by side at intervals. Two second convex parts extending downwards can be arranged on the inner side of the top wall of the front mould at intervals, and the two second convex parts can be positioned on two opposite sides of the plurality of first convex parts and are arranged side by side at intervals with the first convex parts. The inner side of the top wall of the front mold is provided with a third convex part extending downwards, the third convex part is arranged at the end part close to the front mold, and the number of the third convex parts can be one. The inner side of the top wall of the front mould is provided with a fourth convex part and a fifth convex part which extend downwards. The fourth convex part and the fifth convex part can be arranged side by side and at intervals. The fourth protrusion may have a size greater than that of the fifth protrusion. The fourth convex part and the fifth convex part are both in a cuboid shape, and the length of the fourth convex part is greater than that of the fifth convex part. A plurality of sixth convex parts extending downwards are arranged at intervals on the inner side of the top wall of the front mould; the sixth protrusions may be in two rows, the two sixth protrusions may be located on two opposite sides of the fourth protrusion, and each row of the sixth protrusions includes a plurality of sixth protrusions that are arranged side by side and at intervals.

The integrated prefabricated conductive member may be as shown in fig. 7, and may be used to form a conductive structure on thebracket 20, and may include a plurality of cellconductive members 60 and a chargingconductive member 70, where the plurality of cellconductive members 60 are arranged side by side and connected to each other, and connected between a first chargingconductive unit 71 and a second chargingconductive unit 72, and are integrated with the first chargingconductive unit 71 and the second chargingconductive unit 72. Specifically, in some embodiments, the plurality ofcell conductors 60 and the first and second chargingconductive units 71 and 72 may be formed into a strip-shaped integrated structure by casting.

In this step, the prefabricated conductive member can be placed in a rear mold, and thesecond positioning hole 7141,7251 on the prefabricated conductive member is matched and positioned with the positioning column protruding from the inner side of the top wall of the front mold, so that the whole prefabricated conductive member is positioned in the rear mold.

S2, injecting plastic into the back mold, and forming abracket 20 which is integrated with the prefabricated conductive piece and is provided with a punching hole through solidification; as shown in fig. 6, in this step, plastic may be filled in the gaps between the protrusions; through a plurality of first convex parts on this front mould can be so that leave on thesupport 20 after the shaping and be equipped with a plurality of firstbroken hole 212, make through two second convex parts on this front mould and leave on thesupport 20 after the shaping and be equipped with two secondbroken hole 213, make through this third convex part and leave on thesupport 20 after the shaping and be equipped with thirdbroken hole 214, make through this fourth convex part and fifth convex part and leave on thesupport 20 after the shaping and be equipped with first holdingchamber 201 andsecond holding chamber 202, make through this sixth convex part and leave on thesupport 20 after the shaping and be equipped with first locatinghole 211, thisfirst locating hole 211 can be used for with this prefabricated conductive piece cooperation location. After curing, the whole preformed conductive member may be formed on thebottom wall 21 of thebracket 20, and the preformed conductive member may extend from the secondaccommodating cavity 202 to the firstaccommodating cavity 201.

And S3, punching the prefabricated conductive part through the punching hole by adopting punching equipment. The punching holes may include afirst punching hole 212, asecond punching hole 213, and athird punching hole 214. In this step, a plurality ofcell conductors 60 may be formed by breaking the preformed conductors through the first plurality of breakingholes 212 by using a breaking apparatus, specifically, in this embodiment, threecell conductors 60 may be formed, and then the preformed conductors are broken through the second plurality of breakingholes 213 by using a breaking apparatus to form thecell conductors 60 and the chargingconductors 70, that is, theoutermost cell conductors 60 are disconnected from the first chargingconductive units 71 and the second chargingconductive units 72; and finally, the prefabricated conductive member is punched through the third punching hole by using a punching device to form the first chargingconductive unit 71 and the second chargingconductive unit 72.

Fig. 15 and 16 show a second embodiment of the electronic atomization device of the invention, which is different from the first embodiment in that thefirst connection portion 712 and thesecond connection portion 723 of the chargingconductive member 70 are flat, can be disposed on thebottom wall 21, are disposed in parallel with thebottom wall 21, and can be integrally molded with thebottom wall 21 by injection molding.

It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims (14)

1. A stent preparation method is characterized by comprising the following steps:

s1, providing a rear die and a front die matched with the rear die to form a cavity, placing a prefabricated conductive part of an integrated structure in the rear die, and jacking the front die against the prefabricated conductive part, wherein the front die is provided with a boss;

s2, injecting plastic into the rear mold, filling the plastic into gaps among the bosses in the front mold, and forming a bracket (20) which is integrated with the prefabricated conductive piece and is provided with a punching hole through curing, wherein the bosses and the punching hole are correspondingly arranged;

s3, punching the prefabricated conductive piece through the punching hole by adopting punching equipment to form a support which is provided with a plurality of electric core conductive pieces and is used for the electronic atomization device; wherein the cell conductive member (60) includes a first conductive contact portion (61), a second conductive contact portion (62), and a connection portion (67) connecting the first conductive contact portion (61) and the second conductive contact portion (62); the first conductive contact parts (61) of the plurality of cell conductive pieces (60) are in the same direction; the second conductive contact parts (62) of the plurality of cell conductive pieces (60) are oriented in the same direction.

2. The method of preparing a stent according to claim 1, wherein the punch-out holes comprise a plurality of first punch-out holes (212) arranged side by side and at intervals on the stent (20);

in the step S2, a plurality of first punching holes (212) are reserved on the molded bracket (20) through the front die;

in step S3, the punching device punches the preformed conductive member out of the plurality of cell conductive members (60) through the plurality of first punching holes (212).

3. The method for preparing a stent according to claim 1, wherein the punching holes comprise two second punching holes (213) which are arranged on the stent (20) at intervals;

in the step S2, two second punching holes (213) are reserved on the molded bracket (20) through the front die;

in step S3, the punching device punches the preformed conductive member through the two second punching holes (213) to form the cell conductive member (60) and the charging conductive member (70).

4. The stent preparation method of claim 2 wherein the punch-out holes comprise a third punch-out hole (214) disposed on the stent (20) near an end of the stent (20);

in the step S2, the third punching hole (214) is reserved on the molded bracket (20) through the front die;

in the step S3, the punching device punches the preformed conductive member through the third punching hole (214) to form a first charging conductive unit (71) and a second charging conductive unit (72) which are matched with each other.

5. The method for preparing the bracket according to claim 1, wherein in the step S2, a first accommodating cavity (201) for accommodating the battery cell (30) and a second accommodating cavity (202) for accommodating the circuit board (40) are reserved on the molded bracket (20) through the front mold.

6. The method for preparing a bracket according to claim 1, wherein in the step S2, the bracket (20) after being molded is left with a first positioning hole (211) matched with the preformed conductive member through the front mold.

7. The method for preparing the bracket according to claim 1, wherein the prefabricated conductive member is provided with a second positioning hole (7141,7251) matched with the positioning column on the front mold;

in the step S1, when the prefabricated conductive member is placed in a rear mold, the second positioning hole (7141,7251) on the prefabricated conductive member is matched and positioned with the positioning column.

8. Method for preparing a support according to claim 1, characterized in that said preformed conductive elements are formed on the bottom wall (21) of said support (20) after moulding.

9. Method for preparing a support according to claim 5, wherein the preformed conductive element in the molded support (20) extends from the second receiving cavity (202) to the first receiving cavity (201).

10. The method for preparing a bracket according to claim 3, wherein the charging conductive member (70) comprises a charging contact portion accessible to an external power supply;

the holder (20) comprises a first end wall (23); the charging contact is provided on the first end wall (23).

11. The method for preparing a stent according to claim 10, wherein the charging contact part comprises a first charging contact part (711), and two second charging contact parts (721) which are arranged side by side and spaced apart from each other with one ends connected to each other and engaged with the first charging contact part (711),

the first charging contact portion (711) is disposed at an interval between the two second charging contact portions (721).

12. A stent produced by the method of producing a stent according to any one of claims 1 to 11.

13. A power supply assembly, characterized by comprising a battery cell, a circuit board and the bracket (20) of claim 12; the battery core and the circuit board are arranged on the bracket (20).

14. An electronic atomizer device comprising the power supply assembly of claim 13 and an atomizer connected to said power supply assembly.

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