CN112682404A - Bonding clamp for temperature sensor - Google Patents
Bonding clamp for temperature sensorDownload PDFInfo
- Publication number
- CN112682404A CN112682404ACN201910992575.9ACN201910992575ACN112682404ACN 112682404 ACN112682404 ACN 112682404ACN 201910992575 ACN201910992575 ACN 201910992575ACN 112682404 ACN112682404 ACN 112682404A
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- China
- Prior art keywords
- temperature sensor
- central shaft
- accelerometer
- contact
- clamp frame
- Prior art date
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- Pending
Links
- 238000010438heat treatmentMethods0.000claimsabstractdescription28
- 238000003825pressingMethods0.000claimsabstractdescription10
- 230000009471actionEffects0.000claimsabstractdescription4
- 239000007767bonding agentSubstances0.000claimsdescription8
- 239000000853adhesiveSubstances0.000abstractdescription16
- 230000001070adhesive effectEffects0.000abstractdescription16
- 230000006872improvementEffects0.000abstractdescription2
- 238000000034methodMethods0.000description13
- 230000008569processEffects0.000description9
- 239000002390adhesive tapeSubstances0.000description6
- 239000012790adhesive layerSubstances0.000description5
- 238000009826distributionMethods0.000description3
- 238000005259measurementMethods0.000description3
- 238000004804windingMethods0.000description3
- 238000010276constructionMethods0.000description2
- 230000004048modificationEffects0.000description2
- 238000012986modificationMethods0.000description2
- 229920002379silicone rubberPolymers0.000description2
- 230000032683agingEffects0.000description1
- 239000000919ceramicSubstances0.000description1
- 230000008859changeEffects0.000description1
- 230000007613environmental effectEffects0.000description1
- 230000014509gene expressionEffects0.000description1
- 239000003292glueSubstances0.000description1
- 210000001503jointAnatomy0.000description1
- 239000010410layerSubstances0.000description1
- 238000012423maintenanceMethods0.000description1
- 238000004519manufacturing processMethods0.000description1
- 239000000463materialSubstances0.000description1
- 238000012797qualificationMethods0.000description1
- 230000035882stressEffects0.000description1
- 239000002699waste materialSubstances0.000description1
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- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Technical Field
The invention relates to the technical field of accelerometer assembling devices, in particular to a bonding clamp of a temperature sensor.
Background
Influenced by ambient temperature, the output of the accelerometer during working can drift, and in the field of precise measurement and control, in order to meet the measurement precision requirement of the system, the temperature of a single accelerometer product needs to be precisely controlled so as to ensure the stability of the measurement precision. At present, a heating device and a temperature sensor are adhered to the outside of an accelerometer in a surrounding manner, so that temperature control of the accelerometer in different environments is realized.
In order to reduce the volume and weight of the product as much as possible, a small-volume thin-sheet ceramic temperature sensor (some length x width x height are only 2mm x 0.8mm) is often adopted; the temperature sensor can be adhered to the bottom of the accelerometer without a binding post, and in order to avoid the influence of internal stress caused by temperature change on the temperature sensor and ensure the environmental aging resistance of an adhering piece, silicon rubber is generally used as an adhesive for adhering the temperature sensor and the accelerometer. The silicon rubber is viscous at normal temperature, the curing time is long, and a certain pressure is needed in the curing process. At present, the adhesive is coated by a manual method, and after the temperature sensor and the accelerometer are attached, the temperature sensor and the accelerometer are wound by adhesive tapes to provide curing pressure.
The ideal state after the temperature sensor is bonded with the accelerometer is that the bonding strength between the sensor and the accelerometer is reliable, the position is accurate, and the thicknesses of glue layers between the sensors and the accelerometer of different products are the same. However, in the actual production process, the size of the temperature sensor is small, the temperature sensor is difficult to fix in the process of winding the adhesive tape, the adhesive tape is easy to be driven by the adhesive tape to deviate from the original position, the uniformity of the pressure of the adhesive tape cannot be guaranteed by manually winding the adhesive tape, the temperature sensor is tilted when the winding force is large, and the adhesive layer after bonding is uneven in distribution. The accelerometer with a severe temperature sensor tilting degree or an excessive position offset needs to be reworked. The great amount of factory return maintenance not only causes waste of manpower and material resources and delay in time, but also gradually fails to meet the increasing precision requirement of users.
Disclosure of Invention
In order to solve the problems, the invention provides a bonding clamp of a temperature sensor, which solves the problem that the temperature sensor and an accelerometer are difficult to bond in the prior art.
The invention adopts the following technical scheme:
a bonding clamp of a temperature sensor comprises a clamp frame, at least one pressing contact, at least one wiring terminal protection backing ring and at least one heating sleeve; the top plate of the clamp frame is provided with at least one threaded through hole; the press contact comprises an end top, a central shaft and a contact; the diameter of the upper section of the central shaft is larger than that of the lower section of the central shaft, the upper section of the central shaft is provided with a thread matched with the thread through hole, and the lower section of the central shaft penetrates through the thread through hole and is arranged in the clamp frame; the end top is connected with the upper section of the central shaft; the contact is connected with the lower section of the central shaft; the binding post protection backing ring is arranged on a bottom plate of the clamp frame and used for arranging an inverted accelerometer of a temperature sensor to be bonded, the heating sleeve is arranged on the outer side of the lower section of the central shaft and used for heating and curing a bonding agent between the temperature sensor and the accelerometer, and the temperature sensor is bonded to the bottom of the accelerometer under the combined action of pressure applied by the pressing contact and the bonding agent.
Preferably, the device further comprises at least one elastic component, and the elastic component is arranged outside the upper section of the central shaft.
Preferably, the elastic member is a spring.
Preferably, the area of the bottom of the contact is not greater than the area of the temperature sensor.
Preferably, the binding post protection backing ring is a cylindrical ring, and the inner diameter of the binding post protection backing ring is larger than the outer diameter of the accelerometer and smaller than the inner diameter of the accelerometer flange; the height of the binding post protection backing ring is larger than the distance from the upper end face of the accelerometer flange plate to the top end of the accelerometer binding post.
Preferably, the bottom plate of the clamp frame is provided with at least one groove for placing the terminal protection backing ring.
Preferably, the groove on the bottom plate of the clamp frame is circular, and the inner diameter of the circular groove is the same as the outer diameter of the binding post protection backing ring.
Preferably, the spring has an initial length greater than the length of the upper section of the central shaft and a compressed length less than the length of the upper section of the central shaft.
Preferably, the length of the heating sleeve is less than the length of the lower section of the central shaft.
Preferably, the upper end face of the end top is provided with a groove or a counter bore for applying torque.
According to the bonding clamp for the temperature sensor, the position of the temperature sensor is fixed by the aid of the press contact, proper pressure for curing the bonding agent is provided by adjusting the press contact, and proper temperature for curing the bonding agent is provided by the aid of the heating sleeve for local heating, so that the bonding quality requirement of the temperature sensor of the accelerometer is met. The bonding fixture disclosed by the invention has the following advantages:
1. the position deviation phenomenon and the warping problem of the adhesive layer of the temperature sensor in the adhesive curing process are effectively prevented, and the qualified rate of finished products is improved;
2. the bonding pressure and the bonding temperature applied to the temperature sensor can be accurately controlled, and the uniformity and consistency of the distribution of the adhesive layer after the adhesive is cured are ensured;
3. the product and the clamp are easy to separate, so that the product is prevented from being damaged in the process of separating the product from the clamp, and the assembly time is saved;
4. the method is simple and rapid to operate, high in repeatability, high in operating efficiency and high in product assembling reliability.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic view of the construction of the bonding jig of the present invention.
Description of the reference numerals
11. A top plate of the clamp frame; 12. a bottom plate of the jig frame; 13. a sidewall of the jig frame; 14. a groove; 21. pressing down the end top of the contact; 221. an upper section for pressing down the center axis of the contact; 222. a lower section for pressing down the center shaft of the contact; 23. pressing down the contact of the contact; 30. heating the sleeve; 40. an elastic member; 50. a binding post protection backing ring; 60. a temperature sensor; 70. an accelerometer.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
FIG. 1 is a schematic view of the construction of the bonding jig of the present invention. Referring to fig. 1, the present invention provides a bonding jig for a temperature sensor, including a jig frame, at least one press-down contact, at least one terminal protection grommet 50, and at least one heating sleeve 30; the top plate 11 of the clamp frame is provided with at least one threaded through hole; the press-down contact comprises an end top 21, a central shaft and a contact 23; the diameter of the upper section 221 of the central shaft is larger than that of the lower section 222 of the central shaft, the upper section 221 of the central shaft is provided with a thread matched with the thread through hole, and the lower section 222 of the central shaft penetrates through the thread through hole to be arranged in the clamp frame; the end top 21 is connected with the upper section 221 of the central shaft; the contact 23 is connected to the lower section 222 of the central shaft; the binding post protection backing ring 50 is arranged on the bottom plate 12 of the fixture frame and used for arranging the accelerometer 70 of the inverted temperature sensor 60 to be bonded, the heating sleeve 30 is arranged on the outer side of the lower section 222 of the central shaft and used for heating and curing the bonding agent between the temperature sensor 60 and the accelerometer 70, and the temperature sensor 60 is bonded to the bottom of the accelerometer 70 under the combined action of the pressure applied by the lower press contact and the bonding agent.
According to the bonding clamp for the temperature sensor, the position of thetemperature sensor 60 is fixed by adopting the lower press contact, and the lower press contact is adjusted to provide proper pressure for curing the adhesive by applying torsion to theend top 21 of the lower press contact; the adhesive between thetemperature sensor 60 and theaccelerometer 70 is heat cured using theheating sleeve 30 to provide a suitable temperature for curing the adhesive to meet the bonding quality requirements of thetemperature sensor 60 of theaccelerometer 70. To facilitate the placement of thelower section 222 of the center shaft of the press-down contact through the threaded through-hole into the fixture frame, the diameter of theupper section 221 of the center shaft of the press-down contact is larger than the diameter of thelower section 222 of the center shaft.
The clamp frame of the bonding clamp comprises atop plate 11, abottom plate 12 and twoside walls 13 which are connected. Thetop plate 11 and thebottom plate 12 are rectangular and have the same external dimension, and thetop plate 11, thebottom plate 12 and the twoside walls 13 are connected by screws to form a clamp frame with upper and lower surfaces parallel to each other. Thebottom plate 12 of the clamp frame is provided with at least onegroove 14 for placing the binding postprotection backing ring 50, thegroove 14 is circular, and the inner diameter of the groove is the same as the outer diameter of the binding postprotection backing ring 50 so as to be convenient to place. The threaded through hole in thetop plate 11 of the jig frame is directly above thetemperature sensor 60 to be bonded.
The bonding jig of the present invention further includes at least oneelastic member 40, and theelastic member 40 is provided outside theupper section 221 of the center shaft. When the temperature sensor to be bonded 60 does not need to be pressed down by the press contact to apply pressure, theelastic component 40 is used for supporting the press contact so that the press contact does not contact the temperature sensor to be bonded 60, and the temperature sensor to be bonded 60 can be conveniently taken and placed. Theelastic member 40 may be a spring, and in order to ensure that the spring can support the press-down contact, the initial length of the spring is greater than the length of theupper section 221 of the central shaft, and the compressed length is less than the length of theupper section 221 of the central shaft.
The area of the bottom of thecontact 23 of the press contact of the bonding fixture is not larger than that of the temperature sensor, so that the press contact can accurately fix the position of thetemperature sensor 60 to be bonded conveniently, wherein the bottom of thecontact 23 can be conical. The upper end face of theend top 21 of the press-down contact is provided with a groove or a counter bore for applying torque force, so that the torque force is conveniently applied to the press-down contact. Thetip 21 is threadedly connected to theupper section 221 of the central shaft and thecontact 23 is threadedly connected to thelower section 222 of the central shaft. The length of theheating sleeve 30 of the bonding jig of the present invention is smaller than the length of thelower section 222 of the center shaft.
Since thetemperature sensor 60 needs to be adhered to the bottom of theaccelerometer 70, theaccelerometer 70 needs to be inverted to facilitate adhesion. In order to ensure that the wiring terminal at the upper part of theaccelerometer 70 is not damaged when theaccelerometer 70 is inverted, theaccelerometer 70 is inverted on the wiring terminalprotection backing ring 50, the wiring terminalprotection backing ring 50 is a cylindrical ring, the inner diameter of the wiring terminalprotection backing ring 50 is larger than the outer diameter of theaccelerometer 70 and smaller than the inner diameter of the flange of theaccelerometer 70, and the height of the wiring terminalprotection backing ring 50 is larger than the distance from the upper end face of the flange of theaccelerometer 70 to the top end of the wiring terminal of theaccelerometer 70, so that the wiring terminal at the upper part of theaccelerometer 70 is suspended and does not contact with.
When the press-down contact is assembled, theend top 21 and the central shaft of the press-down contact are assembled, then the spring is sleeved on theupper section 221 of the central shaft, thelower section 222 of the central shaft penetrates through the threaded through hole of thetop plate 11 of the clamp and is in threaded connection with the top plate of the clamp through theupper section 221 of the central shaft, then theheating sleeve 30 is sleeved on thelower section 222 of the central shaft, and finally thecontact 23 is installed on the central shaft.
In the process of using the clamp of the invention to bond thetemperature sensor 60, the terminal postprotection backing ring 50 is taken out firstly, and theaccelerometer 70 is placed on the terminal postprotection backing ring 50 in an inverted mode, at the moment, the plane of the flange plate of theaccelerometer 70 is in contact with the end face of the terminal postprotection backing ring 50, and the terminal of theaccelerometer 70 is suspended in the terminal postprotection backing ring 50 in an inverted mode. Then, the wiring terminalprotection backing ring 50 with theaccelerometer 70 placed is placed in thecircular groove 14 of thebottom plate 12 of the clamp frame, thetemperature sensor 60 coated with the adhesive is attached to the bonding position of the bottom of theaccelerometer 70, the lower press contact is pressed, theend top 21 part of the lower press contact is screwed by a torsion tool, and the range of the bonding pressure is controlled to be 1N/m-5N/m. Wherein, the torque tool can adopt a torque screwdriver or a torque wrench for controlling the bonding pressure of thetemperature sensor 60. Theheating sleeve 30 and thetemperature sensor 60 to be bonded are connected and connected with an external power supply, theheating sleeve 30 realizes local heating of the butt joint part to cure the adhesive, and the external power supply can read the temperature data of thetemperature sensor 60 to be bonded and control the output temperature. The adhesive curing process is divided into two stages, wherein the heating temperature range of the first stage is 40-60 ℃, the heating time is 12 hours, the heating temperature range of the second stage is 60-80 ℃, and the heating time is 12 hours.
After the adhesive is completely cured, the external power supply is disconnected from theheating sleeve 30 and thetemperature sensor 60 to be bonded, the press contact is unscrewed until the press contact is jacked up by the spring, and finally the terminalprotection backing ring 50 is taken out from the bottom of the fixture frame and theaccelerometer 70 is taken out from the terminalprotection backing ring 50. At this point, the attachment of thetemperature sensor 60 to the bottom of theaccelerometer 70 is completed.
Although the above-described embodiment describes the bonding process of onetemperature sensor 60, it is merely exemplary and not intended to limit the present invention. Specifically, the above-described jig is also applicable to simultaneously bonding two ormore temperature sensors 60 to improve the operation efficiency.
It can be seen from the above embodiments that the bonding fixture of the present invention can effectively prevent the position offset phenomenon and the adhesive layer warping problem of thetemperature sensor 60 during the adhesive curing process, and improve the qualification rate of the finished product; the bonding pressure and the bonding temperature applied to thetemperature sensor 60 can be accurately controlled, and the uniformity and consistency of the distribution of the adhesive layer after the adhesive is cured are ensured; meanwhile, the product is easy to separate from the clamp, so that the product is prevented from being damaged in the process of separating from the clamp, and the assembly time is saved; and the operation is simple and rapid, the repeatability is strong, the operation efficiency is high, and the product assembly reliability is high.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A bonding jig for a temperature sensor, comprising:
the clamp comprises a clamp frame, at least one press-down contact, at least one wiring terminal protection pad ring and at least one heating sleeve; the top plate of the clamp frame is provided with at least one threaded through hole;
the press contact comprises an end top, a central shaft and a contact; the diameter of the upper section of the central shaft is larger than that of the lower section of the central shaft, the upper section of the central shaft is provided with a thread matched with the thread through hole, and the lower section of the central shaft penetrates through the thread through hole and is arranged in the clamp frame; the end top is connected with the upper section of the central shaft; the contact is connected with the lower section of the central shaft;
the binding post protection backing ring is arranged on a bottom plate of the clamp frame and used for arranging an inverted accelerometer of a temperature sensor to be bonded, the heating sleeve is arranged on the outer side of the lower section of the central shaft and used for heating and curing a bonding agent between the temperature sensor and the accelerometer, and the temperature sensor is bonded to the bottom of the accelerometer under the combined action of pressure applied by the pressing contact and the bonding agent.
2. The bonding jig for a temperature sensor according to claim 1, characterized in that: the elastic component is arranged outside the upper section of the central shaft.
3. The bonding jig for a temperature sensor according to claim 2, characterized in that: the elastic component is a spring.
4. A bonding jig for a temperature sensor according to any one of claims 1 to 3, characterized in that: the area of the bottom of the contact is not larger than that of the temperature sensor.
5. A bonding jig for a temperature sensor according to any one of claim 4, characterized in that: the binding post protection backing ring is a cylindrical ring, and the inner diameter of the binding post protection backing ring is larger than the outer diameter of the accelerometer and smaller than the inner diameter of the accelerometer flange; the height of the binding post protection backing ring is larger than the distance from the upper end face of the accelerometer flange plate to the top end of the accelerometer binding post.
6. The bonding jig for a temperature sensor according to claim 5, characterized in that: and the bottom plate of the clamp frame is provided with at least one groove for placing a binding post protection backing ring.
7. The bonding jig for a temperature sensor according to claim 6, characterized in that: the clamp comprises a clamp frame and a binding post protection backing ring, wherein a groove on a bottom plate of the clamp frame is circular, and the inner diameter of the circular groove is the same as the outer diameter of the binding post protection backing ring.
8. The bonding jig for a temperature sensor according to claim 7, characterized in that: the initial length of the spring is greater than the length of the upper section of the central shaft, and the compressed length is less than the length of the upper section of the central shaft.
9. The bonding jig for a temperature sensor according to claim 8, characterized in that: the length of the heating sleeve is smaller than that of the lower section of the central shaft.
10. The bonding jig for a temperature sensor according to claim 9, characterized in that: the upper end face of the end top is provided with a groove or a counter bore used for applying torsion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910992575.9ACN112682404A (en) | 2019-10-18 | 2019-10-18 | Bonding clamp for temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910992575.9ACN112682404A (en) | 2019-10-18 | 2019-10-18 | Bonding clamp for temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112682404Atrue CN112682404A (en) | 2021-04-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910992575.9APendingCN112682404A (en) | 2019-10-18 | 2019-10-18 | Bonding clamp for temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112682404A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115884528A (en)* | 2021-09-26 | 2023-03-31 | 航天科工惯性技术有限公司 | Tin bead prevention printing template opening method and tin bead prevention printing template |
| CN116000846A (en)* | 2023-01-19 | 2023-04-25 | 中国船舶集团有限公司第七一五研究所 | Batch production fixture and assembly process of sensors for ultrasonic water meters |
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