CN112635454A - Optical coupler and production process thereof - Google Patents
Optical coupler and production process thereofDownload PDFInfo
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- CN112635454A CN112635454ACN202011565059.7ACN202011565059ACN112635454ACN 112635454 ACN112635454 ACN 112635454ACN 202011565059 ACN202011565059 ACN 202011565059ACN 112635454 ACN112635454 ACN 112635454A
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- 238000000034methodMethods0.000claimsabstractdescription4
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
Technical Field
The present application relates to the field of electrical signal transmission devices, and more particularly, to an optical coupler.
Background
The optical coupler is also called as a photoelectric isolator or a photoelectric coupler, and is called as an optical coupler for short. The device is a device for transmitting electric signals by taking light as a medium, and usually a light emitter (an infrared Light Emitting Diode (LED)) and a light receiver (a photosensitive semiconductor tube) are packaged in the same tube shell. When the input end is electrified, the light emitter emits light, and the light receiver receives the light, then photocurrent is generated and flows out from the output end, thereby realizing 'electro-optic-electro' conversion. The photoelectric coupler using light as medium to couple the input signal to the output has the advantages of small size, long service life, no contact, strong anti-interference ability, insulation between output and input, unidirectional signal transmission, etc. and is widely used in digital circuit.
Related art an optical coupler disclosed in chinese patent application publication No. CN111354719A, comprising: more than two lead frames; an optical channel structure comprising: the light-emitting chip and the light-sensitive chip are arranged on the lead frame and are coplanar, the light-emitting surface of the light-emitting chip and the light-receiving surface of the light-sensitive chip are arranged in the same direction, and the light-transmitting inner packaging body wraps the light-emitting chip and the light-sensitive chip; and the light reflection outer packaging body wraps the light transmission inner packaging body, and the joint interface of the light reflection outer packaging body and the light transmission inner packaging body, which are in contact, is an optical reflection surface, wherein the light reflection outer packaging body and the light transmission inner packaging body are of a structure formed by double material molding and glue sealing, so that the inner packaging body and the light reflection outer packaging body are easy to shape.
Also disclosed in chinese patent application publication No. CN104465640A is an optical coupler comprising: the optical coupler comprises a light-emitting chip, a photosensitive chip, a transparent inner packaging body, an outer packaging body and two lead frames, wherein a dome coating piece of the transparent inner packaging body coats the light-emitting chip and the photosensitive chip, the outer packaging body coats the transparent inner packaging body, the outer packaging body is provided with an optical reflection surface which is in contact with the dome coating piece, one part of light emitted by the light-emitting chip is reflected to the photosensitive chip through the optical reflection surface, and the other part of light emitted by the light-emitting chip is transmitted to the photosensitive chip through the transparent inner packaging body, so that the overlapping area of the two lead frames is reduced to the minimum, the capacitance value is reduced, the common-mode rejection ratio is improved, and the optical coupler can meet the electrical property required by application.
In view of the above-mentioned related technologies, the inventor believes that, after the production of the optical coupler is completed, the outer package body and the light-transmitting inner package body are glued into a whole, and when the optical coupler fails to detect, it is difficult for a detection person to peel off the outer package body to detect whether the inner structure is damaged, so that the difficulty of checking the failure problem of the optical coupler is high, and therefore improvement is needed.
Disclosure of Invention
In order to solve the problem that the fault problem of the optical coupler in the related art is difficult to check, the application provides an optical coupler and a production process thereof.
In a first aspect, the present application provides an optical coupler, which adopts the following technical solutions:
the utility model provides an optical coupler, includes luminous chip, sensitization chip, transparent interior packaging body, outer packaging body and lead frame, the lead frame is provided with two, and luminous chip and sensitization chip set up respectively on two lead frames, still includes the base and firstly from the type membrane, two the lead frame is all installed on the lead frame in the one end that sets up in opposite directions, transparent interior packaging body adheres on the base, luminous chip and sensitization chip set up on one side that the lead frame deviates from the base, first cover in transparent interior packaging body from the type membrane, outer packaging body adheres first from type membrane on.
Through adopting above-mentioned technical scheme, utilize the optical chip, the sensitization chip, the encapsulation body in the transparent, outer encapsulation body and lead frame can assemble and form the optical coupler that uses light to transmit the signal of telecommunication as the medium, wherein, utilize the first type membrane that covers on the encapsulation body in the transparent can play the effect of keeping apart encapsulation body in the transparent and outer encapsulation body, utilize the base can play the effect of connecting encapsulation body in the transparent and outer encapsulation body, make when needs observe put optical chip and sensitization chip have unusually, can utilize the needle to open outer encapsulation body, thereby make encapsulation body direct exposure outside in the transparent, at this moment, the staff can directly see through in the transparent encapsulation body and look over and put optical chip and sensitization chip unusual.
Optionally, the base is provided with a plurality of first reinforcing holes, each of the first reinforcing holes is disposed around the transparent inner packaging body, and a portion of the outer packaging body adhered to the base penetrates into the first reinforcing hole.
Through adopting above-mentioned technical scheme, utilize the cooperation between outer packaging body and the first reinforcement hole, can ensure the joint strength between outer packaging body and the base for also can remain stable between outer packaging body as an organic whole and the transparent interior packaging body of unable bonding and be connected.
Optionally, still include the second from the type membrane, the second is covered on the base surface from the type membrane, luminous chip and sensitization chip all set up between base and second from the type membrane, the packaging body adheres to the second in transparent and leaves from the type membrane on, the second is made by printing opacity material from the type membrane.
Through adopting above-mentioned technical scheme, utilize the second to play the effect of keeping apart transparent interior packaging body and luminous chip and sensitization chip from the type membrane for whether the staff is unusual when can't see through transparent interior packaging body and look over luminous chip and sensitization chip, can pick up transparent interior packaging body and look over.
Optionally, the base is provided with a plurality of second reinforcing holes, each of the second reinforcing holes is uniformly distributed on two sides of the second release film, and a part of the transparent inner packaging body adhered to the base penetrates into the second reinforcing holes.
Through adopting above-mentioned technical scheme, utilize the cooperation between transparent interior packaging body and the second reinforcement hole, can ensure the joint strength between transparent interior packaging body and the base for also can remain stable connection between transparent interior packaging body as an organic whole and luminescence chip and the sensitization chip can not bond.
Optionally, the base is provided with a limiting groove, two ends of the limiting groove are communicated with two opposite side faces of the base, the light-emitting chip and the photosensitive chip are both located in the limiting groove, and the second release film covers the limiting groove.
Through adopting above-mentioned technical scheme, utilize the spacing groove can play the effect that holds the lead frame for when opening transparent interior packaging body, the lead frame can not be chosen to the syringe needle that is used for opening transparent interior packaging body, simultaneously, utilizes the spacing groove can also play the effect of restriction wire spare mounted position.
Optionally, a yielding groove is formed in the limiting groove, the yielding groove is in an isosceles trapezoid shape, the two ends, arranged in opposite directions, of the lead frame are bent towards the yielding groove, the two ends, arranged in opposite directions, of the lead frame are respectively attached to two isosceles sides of the yielding groove, and the light-emitting chip and the light-sensing chip are installed on the bent position of the lead frame.
Through adopting above-mentioned technical scheme, utilize the cooperation before groove and the lead frame of stepping down for set up luminous chip and the sensitization chip on the lead frame and also can stretch into the spacing inslot completely, thereby make when opening transparent interior packaging body, the syringe needle that is used for opening transparent interior packaging body can not choose luminous chip or sensitization chip.
Optionally, the two ends of the limiting groove are provided with limiting protrusions, the two lead frames are provided with limiting holes, and each limiting protrusion is inserted into each limiting hole.
Through adopting above-mentioned technical scheme, utilize the cooperation between spacing arch and the spacing hole, can further increase the installation intensity of lead frame and base for when covering first from type membrane and the transparent outer packaging body of some glues, the lead frame is difficult for coming off from the base.
In a second aspect, the present application provides a manufacturing process for an optical coupler, which adopts the following technical solution.
A production process for an optical coupler as described above, comprising the steps of:
s1, manufacturing a base by using a ceramic sintering mode, and fixing the two lead frames on the base;
s2, respectively mounting the light-emitting chip and the light-sensitive chip on one end of the two lead frames which are oppositely arranged by using an adhesive die bonding mode;
s3, covering a first release film covering the light-emitting chip and the photosensitive chip on the base, and dispensing on the first release film to form a transparent inner packaging body;
s4, covering a second release film on the base to cover the inner package, and dispensing on the second release film to form the outer package.
Through adopting above-mentioned technical scheme, utilize S1 can accomplish the connection between lead frame and the base, utilize S2 can accomplish the installation of luminescence chip and sensitization chip, utilize S3 can accomplish the isolation work between outer packaging body and luminescence chip and the sensitization chip, utilize S4 can accomplish the isolation work between interior packaging body and the outer packaging body.
Optionally, after S3 and S4 are completed, a side of the base away from the lead frame is vacuumized by using a negative pressure device, so that the outer package body and the transparent inner package body can penetrate into the first reinforcing hole and the second reinforcing hole respectively before being solidified.
By adopting the technical scheme, the outer packaging body and the transparent inner packaging body which are still in the semi-solid state can be respectively infiltrated into the first reinforcing hole and the second reinforcing hole by utilizing a negative pressure vacuumizing mode.
In summary, the present application includes at least one of the following beneficial technical effects:
the transparent inner packaging body and the transparent outer packaging body which are arranged in an adhesive mode can be unfolded, so that the fault reasons of the light-emitting chip and the light-sensitive chip can be checked conveniently;
utilize the spacing groove and the cooperation of stepping down between the groove for luminous chip and sensitization chip can be kept apart with the base upper surface, thereby can not harm luminous chip and sensitization chip when making and opening interior packaging body.
Drawings
FIG. 1 is a front view of an optical coupler of an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of an optical coupler according to an embodiment of the present application;
fig. 3 is a schematic diagram illustrating connection between a base and a lead frame according to an embodiment of the present disclosure.
Reference numerals: 1. a base; 11. a second reinforcement hole; 12. a limiting groove; 13. a yielding groove; 14. a limiting bulge; 15. a first reinforcement hole; 2. a lead frame; 21. a limiting hole; 3. an outer package; 4. a light emitting chip; 5. a photosensitive chip; 6. a first release film; 7. a transparent inner package; 8. and a second release film.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses an optical coupler. Referring to fig. 1 and 2, the optical coupler includes abase 1, alight emitting chip 4, aphoto sensor chip 5, afirst release film 6, a transparentinner package 7, asecond release film 8, anouter package 3 and alead frame 2, thebase 1 is used for supporting and carrying, thelead frame 2 is used for connecting electrically, thelight emitting chip 4 and thephoto sensor chip 5 are matched with each other for transmitting optical signals, the transparentinner package 7 is used for protecting thelight emitting chip 4 and thephoto sensor chip 5, theouter package 3 is used for isolating external light, thefirst release film 6 is used for isolating theouter package 3 and the transparentinner package 7, and thesecond release film 8 is used for isolating the transparentinner package 7, thelight emitting chip 4 and thephoto sensor chip 5.
Referring to fig. 3, the upper surface of thebase 1 is provided with a limitinggroove 12, two ends of the limitinggroove 12 are respectively communicated with two opposite side surfaces of thebase 1, the bottom of the limitinggroove 12 is provided with an abdicatinggroove 13, and the abdicatinggroove 13 is positioned in the middle of the limitinggroove 12; wherein, thelead frame 2 is provided with two, and twolead frames 2 install respectively on the both ends of spacinggroove 12, outside the one end that twolead frames 2 opposite set up all stretched out spacinggroove 12, the one end that twolead frames 2 set up in opposite directions all towards the inside setting of buckling ofgroove 13 of stepping down, andluminous chip 4 andsensitization chip 5 stretch into respectively with twolead frames 2 and step down one ofinslot 13 and serve.
Referring to fig. 3, the cross section of the abdicatinggroove 13 is in an isosceles trapezoid shape, the bottom surface of the abdicatinggroove 13 is parallel to the bottom surface of the limitinggroove 12, and the two equal waist edges of the abdicatinggroove 13 are connected with the bottom of the abdicatinggroove 13; wherein, the area of the bottom surface of the abdicatinggroove 13 is smaller than the area of the opening on the upper side of the abdicatinggroove 13, and the part of the twolead frames 2 extending into the abdicatinggroove 13 is attached to the isosceles sheets of the abdicatinggroove 13.
Referring to fig. 3, the two ends of the limitinggroove 12 are provided with limitingprotrusions 14, the twolead frames 2 are provided with limitingholes 21, when thelead frame 2 is mounted in the limitinggroove 12, the limitingprotrusions 14 are inserted into the limitingholes 21, and the limitingprotrusions 14 are in interference fit with the limiting holes 21.
Referring to fig. 2, thesecond release film 8 covers the surface of thebase 1, thesecond release film 8 is made of a light-transmitting material, thesecond release film 8 covers the light-emittingchip 4, the light-sensing chip 5 and thelead frame 2, and the transparentinner package 7 is adhered to thesecond release film 8 by dispensing; wherein, still be provided with a plurality of second reinforcement holes 16 onbase 1, each second reinforcement hole 16 equipartition is on two long avris of spacinggroove 12, and each second reinforcement hole 16 all is located the coverage of transparentinner packaging body 7, and transparentinner packaging body 7 adheres to the part onbase 1 and permeates into each second reinforcement hole 16.
Referring to fig. 2, thefirst release film 6 covers the surface of thebase 1, thefirst release film 6 covers the transparentinner package body 7, and theouter package body 3 is adhered to thefirst release film 6 by dispensing; wherein, still be provided with a plurality of first reinforcement holes 15 onbase 1, eachfirst reinforcement hole 15 equipartition is on two long avris of spacinggroove 12, and eachfirst reinforcement hole 15 all is located the coverage of transparentinner packaging body 7, and eachfirst reinforcement hole 15 all is located outside the coverage of transparentinner packaging body 7, and the part thatouter packaging body 3 was adhered to onbase 1 permeates into eachfirst reinforcement hole 15.
The implementation principle of an optical coupler in the embodiment of the application is as follows:
utilize first 6 keep apart transparentinterior packaging body 7 andouter packaging body 3 from type membrane, make the staff when theouter packaging body 3 is being kicked open,packaging body 7 can not receive the loss in transparent, utilize the second to keep apart transparent interior packaging andluminous chip 4 andsensitization chip 5 fromtype membrane 8, make the staff when the transparentinterior packaging body 7 is kicked open,luminous chip 4 andsensitization chip 5 can not receive the loss, utilizebase 1 to make unable direct bonding transparentinterior packaging body 7 as an organic whole andouter packaging body 3 homoenergetic fix onbase 1, thereby make the cladding thatouter packaging body 3 can be stable live transparentinterior packaging body 7.
The embodiment of the application also discloses a production process for the optical coupler, and the production process comprises the following steps:
s1, manufacturing abase 1 by using a ceramic sintering mode, and then fixing the two-piece lead frame 2 on thebase 1;
s2, respectively mounting the light-emittingchip 4 and the light-sensitive chip 5 on one end of the twolead frames 2 which are oppositely arranged by using an adhesive die bonding mode;
s3, covering afirst release film 6 covering the light-emittingchip 4 and thephotosensitive chip 5 on thebase 1, and dispensing on thefirst release film 6 to form a transparentinner packaging body 7;
s4, covering asecond release film 8 covering the inner package on thebase 1, and dispensing on thesecond release film 8 to form theouter package 3.
After S3 and S4 are completed, a side of thebase 1 away from thelead frame 2 is vacuumized by a negative pressure device, so that theouter package 3 and the transparentinner package 7 can penetrate into the first reinforcinghole 15 and the second reinforcing hole 16 respectively before solidification.
When the processes of S3 and S4 are carried out, the release spray is sprayed on thebase 1, a thin release film can be formed after the release spray is air-dried, and thefirst release film 6 and thesecond release film 8 can be formed at one time by adopting the method.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (9)
1. The utility model provides an optical coupler, includes luminous chip (4), sensitization chip (5), transparent inner packaging body (7), outer packaging body (3) and lead frame (2), lead frame (2) are provided with two, and luminous chip (4) and sensitization chip (5) set up respectively on two lead frames (2), its characterized in that: still include base (1) and first from type membrane (6), two the one end that lead frame (2) set up in opposite directions is all installed on lead frame (2), encapsulation body (7) are adhered on base (1) in transparent, luminous chip (4) and sensitization chip (5) set up on one side that lead frame (2) deviate from base (1), first cover encapsulation body (7) in transparent from type membrane (6), outer encapsulation body (3) are adhered on first from type membrane (6).
2. An optical coupler according to claim 1, wherein: the base (1) is provided with a plurality of first reinforcing holes (15), each first reinforcing hole (15) is arranged around the transparent inner packaging body (7), and the part of the outer packaging body (3) adhered to the base (1) penetrates into the first reinforcing holes (15).
3. An optical coupler according to claim 1, wherein: still include the second from type membrane (8), the second is from type membrane (8) and is covered on base (1) surface, luminous chip (4) and sensitization chip (5) all set up in base (1) and second from type between membrane (8), packaging body (7) are adhered to the second in transparent on from type membrane (8), the second is made by printing opacity material from type membrane (8).
4. An optical coupler according to claim 1, wherein: the base (1) is provided with a plurality of second reinforcing holes (16), the second reinforcing holes (16) are uniformly distributed on two sides of the second release film (8), and the part of the transparent inner packaging body (7) adhered to the base (1) penetrates into the second reinforcing holes (16).
5. An optical coupler according to claim 1, wherein: be provided with spacing groove (12) on base (1), the both ends of spacing groove (12) communicate with each other with two opposite flank of base (1), luminous chip (4) and sensitization chip (5) all are located spacing groove (12), the second is from type membrane (8) cover in spacing groove (12).
6. An optical coupler according to claim 1, wherein: be provided with groove (13) of stepping down in spacing groove (12), groove (13) of stepping down is isosceles trapezoid shape and sets up, two the one end that lead frame (2) set up in opposite directions all buckles towards groove (13) of stepping down, two the one end that lead frame (2) set up in opposite directions is laminated with two isosceles edges of groove (13) of stepping down respectively, install on the position that lead frame (2) were buckled and are set up light-emitting chip (4) and sensitization chip (5).
7. An optical coupler according to claim 1, wherein: limiting protrusions (14) are arranged at two ends of each limiting groove (12), limiting holes (21) are formed in the two lead frames (2), and the limiting protrusions (14) are respectively inserted into the limiting holes (21).
8. A process for producing an optical coupler according to any of claims 1 to 7, comprising the steps of:
s1, manufacturing a base (1) by using a ceramic sintering mode, and then fixing the two-piece lead frame (2) on the base (1);
s2, respectively installing the light-emitting chip (4) and the light-sensitive chip (5) on one end of the two lead frames (2) which are arranged oppositely by using an adhesive die bonding mode;
s3, covering a first release film (6) covering the light-emitting chip (4) and the photosensitive chip (5) on the base (1), and then dispensing on the first release film (6) to form a transparent inner packaging body (7);
s4, covering a second release film (8) covering the inner packaging body on the base (1), and then dispensing on the second release film (8) to form the outer packaging body (3).
9. The production process according to claim 8, characterized in that: and after the steps S3 and S4 are finished, one side surface of the base (1) departing from the lead frame (2) is vacuumized by using negative pressure equipment, so that the outer packaging body (3) and the transparent inner packaging body (7) can respectively penetrate into the first reinforcing hole (15) and the second reinforcing hole (16) before being solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011565059.7ACN112635454B (en) | 2020-12-25 | 2020-12-25 | Optical coupler and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011565059.7ACN112635454B (en) | 2020-12-25 | 2020-12-25 | Optical coupler and production process thereof |
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| Publication Number | Publication Date |
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| CN112635454Atrue CN112635454A (en) | 2021-04-09 |
| CN112635454B CN112635454B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011565059.7AActiveCN112635454B (en) | 2020-12-25 | 2020-12-25 | Optical coupler and production process thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614131A (en)* | 1995-05-01 | 1997-03-25 | Motorola, Inc. | Method of making an optoelectronic device |
| US6416238B1 (en)* | 2000-08-07 | 2002-07-09 | Stratos Lightwave, Inc. | Modular high density multiple optical transmitter/receiver array |
| CN104465640A (en)* | 2013-09-24 | 2015-03-25 | 兆龙国际股份有限公司 | Optical coupler |
| CN106922104A (en)* | 2015-12-24 | 2017-07-04 | 北京中石伟业科技股份有限公司 | Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system |
| CN207282495U (en)* | 2017-09-15 | 2018-04-27 | 东莞市南晶电子有限公司 | A kind of photoelectrical coupler of Flouride-resistani acid phesphatase |
- 2020
- 2020-12-25CNCN202011565059.7Apatent/CN112635454B/enactiveActive
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614131A (en)* | 1995-05-01 | 1997-03-25 | Motorola, Inc. | Method of making an optoelectronic device |
| US6416238B1 (en)* | 2000-08-07 | 2002-07-09 | Stratos Lightwave, Inc. | Modular high density multiple optical transmitter/receiver array |
| CN104465640A (en)* | 2013-09-24 | 2015-03-25 | 兆龙国际股份有限公司 | Optical coupler |
| CN106922104A (en)* | 2015-12-24 | 2017-07-04 | 北京中石伟业科技股份有限公司 | Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system |
| CN207282495U (en)* | 2017-09-15 | 2018-04-27 | 东莞市南晶电子有限公司 | A kind of photoelectrical coupler of Flouride-resistani acid phesphatase |
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| Publication number | Publication date |
|---|---|
| CN112635454B (en) | 2024-04-02 |
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