CN112540471B - Display panel, lighting test method and lighting test device - Google Patents

Abstract

The invention provides a display panel, a lighting test method and a lighting test device. The display panel comprises a display area and a test area arranged on one side of the display area. And a third test pad of the test area is connected with the second test pad, and the third test pad is made of a high-heat-conductivity material. The heat sensing probe of the lighting test device is in contact with the third test pad to detect the temperature of the third test pad. When the temperature of the third test pad is detected to be higher than a default value, the thermal imaging scanning module of the lighting test device scans the display panel to determine the specific heating position of the display panel. The problem that burn abnormity of the LCD panel cannot be detected by the existing lighting test station is solved.

Description

Display panel, lighting test method and lighting test device

Technical Field

The invention relates to the technical field of display, in particular to a display panel, a lighting test method and a lighting test device.

Background

In the LCD (Liquid Crystal Display) panel industry, in order to implement a narrow bezel, a plurality of via holes are usually designed on an ITO (Indium Tin Oxide) film at the periphery of an array substrate. Small particles of foreign matter are formed during the perforation process. When small particle foreign matters fall on the ITO film, the ITO film on the array substrate and the ITO film on the color film substrate can be gradually conducted, and the LCD panel is burnt. When the foreign matter is small, the Cell lighting station cannot detect the abnormality, and the subsequent burn of the LCD panel has reliability problem and customer complaint risk. And the site is destroyed at this moment, and the authority can not be cleared quickly.

Therefore, the problem that the burn-in abnormality of the LCD panel cannot be detected by the existing lighting test station needs to be solved.

Disclosure of Invention

The invention provides a display panel, a lighting test method and a lighting test device, which are used for solving the technical problem that burn abnormity of an LCD panel cannot be detected by the existing lighting test station.

In order to solve the above problems, the technical scheme provided by the invention is as follows:

the embodiment of the invention provides a display panel, which comprises a display area and a test area, wherein the test area is positioned on one side of the display area. And the test area comprises a first test connecting pad, a second test connecting pad and a third test connecting pad. The first test pad is connected with the sub-pixel of the display area. The second test pad is connected with the common electrode of the display area. The third test pad is connected to the second test pad. And the third test pad is used as the heating test point of the display panel.

In the display panel provided in the embodiment of the present invention, the first test pad includes three sub-test pads, the sub-pixel includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the three sub-test pads are respectively connected to the red sub-pixel, the green sub-pixel, and the blue sub-pixel.

In the display panel provided by the embodiment of the invention, the material of the common electrode includes indium tin oxide.

In the display panel provided in the embodiment of the present invention, a material of the third test pad is different from a material of the second test pad.

The embodiment of the invention also provides a lighting test method, which comprises the step of testing the display panel in one of the embodiments by using the lighting test device. The lighting test device comprises a micro control unit, a lighting module and a probe, wherein one end of the lighting module is connected with the micro control unit, and the other end of the lighting module is connected with the probe. The lighting test method comprises the following steps: connecting the probes with the corresponding first test pad, second test pad and third test pad respectively; the micro control unit sends a lighting enabling signal to the lighting module; the lighting module receives the lighting enabling signal and sends a test enabling signal to the probe; the probe receives the test enabling signal, transmits the test enabling signal to the display panel through the first test connecting pad and the second test connecting pad, and performs lighting test on the display panel; and the probe corresponding to the third test connecting pad detects the temperature of the third test connecting pad and feeds back a detection result to the micro control unit.

In the lighting test method provided by the embodiment of the invention, the lighting test device further comprises a thermal imaging scanning module, and the thermal imaging scanning module is connected with the micro control unit. The step of detecting the temperature of the third test pad by the probe corresponding to the third test pad and feeding back the detection result to the micro control unit includes: if the temperature is higher than a default value, the micro control unit sends a scanning enabling signal to the thermal imaging scanning module; the thermal imaging scanning module receives the scanning enabling signal, scans the display panel and records a thermal image.

In the lighting test method provided in the embodiment of the present invention, the step of detecting the temperature of the third test pad by the probe corresponding to the third test pad and feeding back the detection result to the micro control unit further includes: if the temperature is not higher than the default value, the thermal imaging scanning module does not act.

In the lighting test method according to the embodiment of the present invention, the probe corresponding to the third test pad includes a thermal sensing probe.

The embodiment of the invention also provides a lighting test device which is used for testing the display panel in one of the embodiments. The lighting module is connected with the micro control unit. The probe is connected with the lighting module. The thermal imaging scanning module is connected with the micro control unit.

In the lighting test device provided by the embodiment of the invention, the thermal imaging scanning module comprises an infrared thermal imaging scanner.

The invention has the beneficial effects that: in the display panel, the lighting test method and the lighting test device provided by the invention, the third test connecting pad is additionally arranged in the test area of the display panel, and the temperature of the third test connecting pad is detected by the contact of the thermal sensing probe and the third test connecting pad. When the temperature of the third test pad is higher than a default value, the thermal imaging scanning module of the lighting test device scans the display panel, records a thermal image, and determines the specific heating position of the display panel by analyzing the thermal image. Therefore, whether the display panel generates heat and the specific heating position can be predicted in advance, the badness can be processed in time, and the reliability problem and the customer complaint risk can be avoided. Therefore, the problem that burn abnormity of the LCD panel cannot be detected by the existing lighting test station is solved.

Drawings

In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present invention;

fig. 2 is a schematic top view of a display panel according to an embodiment of the present invention;

fig. 3 is a schematic diagram illustrating a connection relationship between components of the lighting test device according to the embodiment of the invention;

FIG. 4 is a schematic view of an installation structure of a thermal imaging module according to an embodiment of the present invention;

fig. 5 is a schematic flowchart of a lighting test method according to an embodiment of the present invention;

fig. 6 is a schematic diagram illustrating a corresponding relationship between each probe and each test pad according to an embodiment of the present invention.

Detailed Description

The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals. In the drawings, the thickness of some layers and regions are exaggerated for clarity of understanding and ease of description. That is, the size and thickness of each component shown in the drawings are arbitrarily illustrated, but the present invention is not limited thereto.

In an embodiment, please refer to fig. 1 and fig. 2 in combination, in which fig. 1 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present invention, and fig. 2 is a schematic top-view structure diagram of the display panel according to the embodiment of the present invention. The process of LCD panels is generally divided into three stages: array stage, cell stage, and module stage. Thedisplay panel 100 of the present invention is an LCD panel for completing the cell phase. As shown in fig. 1, thedisplay panel 100 includes anarray substrate 10, acolor filter substrate 20 disposed opposite to thearray substrate 10, a plurality ofliquid crystal molecules 30 disposed between thearray substrate 10 and thecolor filter substrate 20, and asealant 40 disposed at edges of thearray substrate 10 and thecolor filter substrate 20. The surface of thecolor film substrate 20 facing thearray substrate 10 is provided with acommon electrode 21. The material of thecommon electrode 21 includes indium tin oxide. Further, referring to fig. 2, thedisplay panel 100 is divided into a display area AA and a test area CT, and the test area CT is located at one side of the display area AA. The test region CT includes afirst test pad 11, asecond test pad 12, and athird test pad 13. Thefirst test pad 11 is connected to thesub-pixel 14 in the display area AA. Thesecond test pad 12 is connected to thecommon electrode 21 of the display area AA. Thethird test pad 13 is connected to thesecond test pad 12. Thefirst test pad 11, thesecond test pad 12, and thethird test pad 13 are arranged in the same row at intervals, and thethird test pad 13 is used as a heat generation test point of thedisplay panel 100, that is, whether thedisplay panel 100 generates heat can be determined by detecting the temperature of thethird test pad 13.

Specifically, with reference to fig. 2, thefirst test pad 11 includes three sub-test pads, which are a firstsub-test pad 111, a secondsub-test pad 112, and a thirdsub-test pad 113. The sub-pixels 14 include ared sub-pixel 141, agreen sub-pixel 142, and ablue sub-pixel 143, and thered sub-pixel 141, thegreen sub-pixel 142, and theblue sub-pixel 143 provide three primary colors of red, green, and blue for normal display of thedisplay panel 100. The firstsub-test pad 111, the secondsub-test pad 112, and the thirdsub-test pad 113 are respectively connected to thered sub-pixel 141, thegreen sub-pixel 142, and theblue sub-pixel 143, and test signals are input to each sub-test pad to test whether the corresponding sub-pixel is abnormal. For example, a driving voltage is provided to all thered sub-pixels 141 in thedisplay panel 100 through the firstsub-test pad 111 to light up thered sub-pixels 141. The abnormalred sub-pixel 141 is not lighted up, so that the defectivered sub-pixel 141 can be determined. It should be understood that the arrangement of the sub-pixels shown in fig. 2 is only for illustrating the corresponding relationship between the test pads, and the invention is not limited thereto.

Further, with reference to fig. 1 and fig. 2, thesecond test pad 12 is connected to thecommon electrode 21, and thesecond test pad 12 extends along a direction away from thefirst test pad 11 to form thethird test pad 13, that is, thethird test pad 13 is electrically connected to thecommon electrode 21. Naturally, the material of thethird test pad 13 may also be different from the material of thesecond test pad 12, and thethird test pad 13 is made of a material with high thermal conductivity. Whether thedisplay panel 100 generates heat can be detected by thethird test pad 13.

Specifically, when small particle foreign matters fall between thecommon electrode 21 and the pixel electrode of thearray substrate 10, thecommon electrode 21 and the pixel electrode may generate heat due to conduction and short circuit of the small particle foreign matters, the generated heat is conducted to thesecond test pad 12 through thecommon electrode 21, conducted to thethird test pad 13 through thesecond test pad 12, and then whether thedisplay panel 100 generates heat is determined by detecting thethird test pad 13.

It should be noted that thedisplay panel 100 of the present invention further includes a binding region (not shown) located between the display region AA and the test region CT, and the binding region is provided with a binding wire for binding each driver chip. Since the binding region is not the key point of the present invention, it is not described herein again.

In an embodiment, please refer to fig. 2 and fig. 3 in combination, fig. 3 is a schematic connection diagram of components of a lighting test apparatus according to an embodiment of the present invention, wherein thelighting test apparatus 200 is used for performing a lighting test on thedisplay panel 100 in the above embodiment. Thelighting test device 200 comprises amicro control unit 201, alighting module 202, aprobe 203 and a thermalimaging scanning module 204. Thelighting module 202 is connected to themicro control unit 201. Theprobe 203 is connected to thelighting module 202. The thermalimaging scanning module 204 is connected to themicro control unit 201.

Specifically, themcu 201 may be an industrial host, and the like, and themcu 201 is configured to send various control commands, receive feedback, and present lighting test results. Thelighting module 202 is configured to receive the control instruction of themicro control unit 201, and send a pulse signal to theprobe 203. Theprobes 203 are used for connecting with corresponding test pads (e.g., thefirst test pad 11, thesecond test pad 12, and the third test pad 13) when performing a lighting test on thedisplay panel 100, and inputting the pulse signal to thedisplay panel 100 through the test pads for performing the lighting test. Certainly, the probe connected to thethird testing pad 13 is mainly used for detecting the temperature of thethird testing pad 13, so thelighting module 202 does not need to input a pulse signal to the probe corresponding to thethird testing pad 13. The thermalimaging scanning module 204 is configured to receive the control instruction of themicro control unit 201 and perform scanning on thedisplay panel 100.

Specifically, referring to fig. 4, thelighting test device 200 further includes aside wall 205, abottom wall 206, and anupper wall 207, aslide rail 208 is disposed on theupper wall 207, and the thermalimaging scanning module 204 is mounted on theslide rail 208 and can slide along theslide rail 208 to scan each portion of thedisplay panel 100. Theprobe 203 may be installed in thefixture machine 209 for pricking each test pad to input a pulse signal. Thefixture stage 209 may be fixed on thebottom wall 206 of thelighting test apparatus 200. Of course, thelighting test device 200 includes a plurality of sidewalls, and fig. 4 shows only a portion of thesidewalls 205.

Further, the thermalimaging scanning module 204 may include an infrared thermal imaging scanner. The infrared thermal imaging scanner is capable of converting the invisible infrared energy emitted by the object to be measured into a visible thermal image. Different colors are used to represent different temperatures of the measured object on the thermal image. By checking the thermal image, the overall temperature distribution condition of the measured object can be observed, and the heating condition of the measured object can be researched.

In one embodiment, a lighting test method is provided, which includes testing thedisplay panel 100 of the previous embodiment using thelighting test apparatus 200. Thelighting test device 200 comprises amicro control unit 201, alighting module 202 and aprobe 203, wherein one end of thelighting module 202 is connected with themicro control unit 201, and the other end is connected with theprobe 203.

Referring to fig. 5 and fig. 6 in combination, as shown in fig. 5, the lighting test method includes the following steps:

step S10: connecting theprobes 203 to the correspondingfirst test pad 11,second test pad 12, andthird test pad 13;

specifically, referring to fig. 6, theprobes 203 includefirst probes 2031,second probes 2032,third probes 2033,fourth probes 2034, andfifth probes 2035, wherein thefirst probes 2031, thesecond probes 2032, and thethird probes 2033 correspond to the firstsub-test pad 111, the secondsub-test pad 112, and the thirdsub-test pad 113 of thefirst test pad 11, respectively. Thefourth probe 2034 corresponds to thesecond test pad 12, and thefifth probe 2035 corresponds to thethird test pad 13. Thefifth probes 2035 comprise heat sensing probes. It should be noted that fig. 6 only shows one group of probes connected to each test pad for clearly showing the corresponding relationship between each probe and each test pad.

Step S20: themicro control unit 201 sends a lighting enabling signal to thelighting module 202;

specifically, the lighting enable signal can enable thelighting module 202 to turn on or off the operation mode.

Step S30: thelighting module 202 receives the lighting enable signal and sends a test enable signal to theprobe 203;

specifically, after receiving the lighting enable signal, thelighting module 202 sends a test enable signal to thecorresponding probe 203. The test enable signal includes a pulse signal. Certainly, thefifth probe 2035 is a thermal sensing probe for sensing the temperature of thethird test pad 13, so thelighting module 202 does not need to send a test enable signal to thefifth probe 2035.

Step S40: theprobe 203 receives the test enable signal, and transmits the test enable signal to thedisplay panel 100 through thefirst test pad 11 and thesecond test pad 12, so as to perform a lighting test on thedisplay panel 100;

specifically, thelighting module 202 sequentially sends a test enable signal to thefirst probe 2031, thesecond probe 2032 and thethird probe 2033, and thefirst probe 2031 receives the test enable signal and transmits the test enable signal to thedisplay panel 100 through the firstsub-test pad 111 to light thered sub-pixel 141. Thesecond probe 2032 receives the test enable signal and transmits the test enable signal to thedisplay panel 100 through the secondsub-test pad 112 to light up thegreen sub-pixel 142. Thethird probe 2033 receives the test enable signal and transmits the test enable signal to thedisplay panel 100 through the thirdsub-test pad 113 to light up theblue sub-pixel 143. Thered sub-pixel 141, thegreen sub-pixel 142, and theblue sub-pixel 143 are sequentially turned on, and when any one of the sub-pixels 14 is turned on, the sub-pixels 14 of the other two colors are not turned on. For example, when thered sub-pixel 141 is lit, neither thegreen sub-pixel 142 nor theblue sub-pixel 143 is lit, and thered sub-pixel 141 that is not lit may be marked as an abnormal sub-pixel.

Further, thelighting module 202 sends a test enable signal to thefourth probe 2034, and thefourth probe 2034 receives the test enable signal and transfers the test enable signal to thecommon electrode 21 of thedisplay panel 100 through thesecond test pad 12.

Step S50: the probe 203 (fifth probe 2035) corresponding to thethird test pad 13 detects the temperature of thethird test pad 13 and feeds back the detection result to themcu 201.

Specifically, referring to fig. 4, thelighting test device 200 further includes a thermalimaging scanning module 204, and the thermalimaging scanning module 204 is connected to themicro control unit 201. Thefifth probe 2035 corresponding to thethird test pad 13 detects the temperature of thethird test pad 13, and if the temperature of thethird test pad 13 is higher than a default value, themcu 201 sends a scan enable signal to the thermalimaging scan module 204; the default value is the temperature reached by the short circuit heating inside the display panel, and the temperature higher than the temperature may cause the display panel to burn. The thermalimaging scanning module 204 receives the scan enable signal and scans thedisplay panel 100, and the thermalimaging scanning module 204 can convert the invisible infrared energy emitted by thedisplay panel 100 into a visible thermal image and display the visible thermal image on themcu 201. The temperature of different locations of thedisplay panel 100 is represented by different colors on the thermal image. By viewing the thermal image, the overall temperature distribution of thedisplay panel 100 can be observed to determine the heat generation position of thedisplay panel 100.

Further, if it is detected that the temperature of thethird test pad 13 is not higher than the default value, the thermalimaging scanning module 204 does not act.

According to the above embodiments:

the invention provides a display panel, a lighting test method and a lighting test device. And a third test pad of the test area is connected with the second test pad, and the third test pad is made of a high-heat-conductivity material. The heat sensing probe of the lighting test device is in contact with the third test pad to detect the temperature of the third test pad. When the temperature of the third test pad is detected to be higher than a default value, the thermal imaging scanning module of the lighting test device scans the display panel to determine the specific heating position of the display panel. Therefore, whether the display panel generates heat and the specific heating position can be predicted in advance, the badness can be processed in time, and the reliability problem and the customer complaint risk can be avoided. Therefore, the problem that burn abnormity of the LCD panel cannot be detected by the existing lighting test station is solved.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims (9)

1. A display panel comprising a display area and a test area, wherein the test area is located on one side of the display area, and the test area comprises:

the first test connecting pad is connected with the sub-pixels of the display area;

the second test connecting pad is connected with the common electrode of the display area; and

the third test connecting pad is connected with the second test connecting pad;

the third test pad is used as a heating test point of the display panel; the first test pad comprises three sub-test pads, the sub-pixels comprise red sub-pixels, green sub-pixels and blue sub-pixels, and the three sub-test pads are respectively connected with the red sub-pixels, the green sub-pixels and the blue sub-pixels.

2. The display panel according to claim 1, wherein a material of the common electrode comprises indium tin oxide.

3. The display panel of claim 1 wherein the material of the third test pad is different from the material of the second test pad.

4. A lighting test method characterized by testing the display panel according to any one of claims 1 to 3 using a lighting test device comprising a micro control unit, a lighting module, a probe, the lighting module having one end connected to the micro control unit and the other end connected to the probe; the lighting test method comprises the following steps:

connecting the probes with the corresponding first test pad, second test pad and third test pad respectively;

the micro control unit sends a lighting enabling signal to the lighting module;

the lighting module receives the lighting enabling signal and sends a test enabling signal to the probe;

the probe receives the test enabling signal, transmits the test enabling signal to the display panel through the first test connecting pad and the second test connecting pad, and performs lighting test on the display panel; and

and the probe corresponding to the third test connecting pad detects the temperature of the third test connecting pad and feeds back a detection result to the micro control unit.

5. The lighting test method according to claim 4, wherein the lighting test apparatus further comprises a thermal imaging scan module, the thermal imaging scan module is connected to the micro control unit, the probe corresponding to the third test pad detects the temperature of the third test pad, and the step of feeding back the detection result to the micro control unit comprises:

if the temperature is higher than a default value, the micro control unit sends a scanning enabling signal to the thermal imaging scanning module;

the thermal imaging scanning module receives the scanning enabling signal, scans the display panel and records a thermal image.

6. The lighting test method according to claim 5, wherein the step of detecting the temperature of the third test pad by the probe corresponding to the third test pad and feeding back the detection result to the micro control unit further comprises:

if the temperature is not higher than the default value, the thermal imaging scanning module does not act.

7. The lighting test method according to claim 4, wherein the probes corresponding to the third test pads comprise thermal sensing probes.

8. A lighting test device for testing the display panel according to any one of claims 1 to 4, the lighting test device comprising:

a micro control unit;

the lighting module is connected with the micro control unit;

the probe is connected with the lighting module;

and the thermal imaging scanning module is connected with the micro control unit.

9. The lighting test device of claim 8 wherein the thermal imaging scanning module includes an infrared thermal imaging scanner.

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