CN112406138A - Method for reducing in-plane damage of Z-pin reinforced composite material laminated plate - Google Patents

Abstract

Translated fromChinese

本发明公开了一种降低Z‑pin增强复合材料层合板面内损伤的方法，该方法包括如下步骤：步骤一、制备复合材料层合板构件，在所述复合材料层合板构件上选出待加强区域，并在所述待加强区域内确定出待加强植入点；步骤二、由Z‑pin纤维束制备细小直径Z‑pin11；步骤三、将所述步骤二中的所述细小直径Z‑pin11裁剪成多个一定长度的细小直径Z‑pin11，将细小直径Z‑pin11分别由所述待加强植入点垂直植入所述复合材料层合板构件内，得到增强强度后的复合材料层合板构件；其中，Z‑pin的长度为待加强植入点的厚度减去所述复合材料层合板构件的固化收缩量。解决了如何降低Z‑pin增强复合材料层合板面内损伤的问题。

The invention discloses a method for reducing the in-plane damage of a Z-pin reinforced composite material laminate. The method includes the following steps: Step 1. Prepare a composite material laminate member, and select a composite material laminate member to be reinforced on the composite material laminate member. area, and determine the implantation point to be reinforced in the area to be reinforced; step 2, prepare small diameter Z-pin11 from Z-pin fiber bundles; step 3, use the small diameter Z-pin in step 2 The pin11 is cut into a plurality of small diameter Z-pin11 of a certain length, and the small diameter Z-pin11 is vertically implanted into the composite material laminate member from the to-be-reinforced implantation point, to obtain a composite material laminate with enhanced strength. component; wherein the length of the Z-pin is the thickness of the implantation point to be reinforced minus the curing shrinkage of the composite material laminate component. Addressed the question of how to reduce in-plane damage in Z‑pin reinforced composite laminates.

Description

Method for reducing in-plane damage of Z-pin reinforced composite material laminated plate

Technical Field

The invention belongs to the technical field of Z-pin reinforcement of composite materials, and particularly relates to a method for reducing in-plane damage of a Z-pin reinforced composite material laminated plate.

Background

Since the composite material laminate is poor in reinforcing fibers in the thickness direction (Z direction) and is highly likely to suffer delamination failure when stress is applied in the thickness direction of the composite material laminate, suppressing the occurrence of delamination failure in the laminate is an important problem to solve the problem of limiting further improvement in the application level of the composite material laminate member. At present, the Z-pin interlayer reinforcing technology developed by a sewing technology is an interlayer reinforcing technology with simple and convenient process and low cost, and is widely used for reinforcing various bearing structural members and reliably connecting assembled structural members. The Z-pin interlayer reinforcing technology is characterized in that a thin short rod (pin) is implanted in the thickness direction of the composite material laminated plate, and the interlayer fracture toughness, damage tolerance and lap joint strength of the composite material laminated plate are remarkably improved by utilizing the pinning bridging effect of the thin short rod.

However, when Z-pins are implanted into the laminate using conventional ultrasonic assisted implantation processes, the laminate is subject to more initial damage. MoURITZ (MOURITZ. review of Z-pined composite laboratories ates [ J ]. Composites: Part A,2007,38: 2383-: dilution of the fibers (localized areas or reduction of the overall fiber volume content of the laminate) and fiber breakage. In addition, the diameter of the Z-pin also affects the size of the initial damage zone, with larger diameters of Z-pin introducing larger initial damage zones, which can cause a reduction in the in-plane performance of the composite laminate. Therefore, how to reduce the in-plane damage of the Z-pin reinforced composite laminate becomes a difficult point of research.

Disclosure of Invention

The invention aims to provide a method for reducing in-plane damage of a Z-pin reinforced composite material laminated plate, which aims to solve the problem of how to reduce in-plane damage of the Z-pin reinforced composite material laminated plate.

The invention adopts the following technical scheme: a method of reducing in-plane damage to a Z-pin reinforced composite laminate, the method comprising the steps of:

firstly, preparing a composite material laminated plate member, selecting a region to be reinforced on the composite material laminated plate member, and determining an implantation point to be reinforced in the region to be reinforced;

step two, preparing small-diameter Z-pin11 from the Z-pin fiber bundle;

cutting the small diameter Z-pin11 in the second step into a plurality of small diameter Z-pins 11 with certain length, and vertically implanting the small diameter Z-pins 11 into the composite material laminated plate member from the implantation points to be reinforced respectively to obtain the composite material laminated plate member with enhanced strength;

wherein the length of the Z-pin is the thickness of the implant point to be reinforced minus the curing shrinkage of the composite laminate member.

Further, in the first step, the method for determining the reinforcing implantation point specifically includes:

pasting rectangular coordinate paper with a specified grid interval on the surface of the area to be strengthened, wherein an intersection point in the rectangular coordinate paper is an implantation point to be strengthened; wherein, the side of rectangle coordinate paper is parallel with the homonymy side that the combined material plywood component corresponds mutually.

Furthermore, the row/column spacing at the implantation point to be reinforced is 2 mm-10 mm.

Further, in the second step, the preparation method of the small diameter Z-pin specifically comprises the following steps:

and fully infiltrating the Z-pin fiber bundle with resin, wherein the resin is epoxy resin toughened and modified by nano materials, performing pultrusion in a forming die, semi-curing the Z-pin fiber bundle infiltrated with the resin in a curing device to obtain an uncut Z-pin wire material, and then cutting to obtain the Z-pin with the small diameter.

Furthermore, the diameter range of the prepared small diameter Z-pin is phi 0.1mm to phi 0.28 mm.

Further, the nano material for toughening the epoxy resin includes a nano filler or a two-dimensional nano material.

Further, in the third step, the method for implanting the small-diameter Z-pin specifically comprises the following steps:

1) uniformly heating the uncured composite material laminated plate member at constant temperature, and vertically penetrating the composite material laminated plate member by using a hole making needle to form a prefabricated hole;

2) a small diameter Z-pin is inserted into the preformed hole using a support device.

The invention has the beneficial effects that: the small-diameter Z-pin implantation process solves the problem that the small-diameter Z-pin is difficult to implant. The small-diameter Z-pin and the nano material are 'synergistically toughened', the damage to the internal performance of the composite material laminate is reduced while the toughness of the laminate is improved, and the composite material laminate is simple and convenient to operate and high in practicability.

The small-diameter Z-pin and the nano material are used for 'synergistic toughening' so that the interlayer toughness of the composite material laminated plate can be improved, meanwhile, the damage to the inside of the composite material laminated plate can be reduced, meanwhile, a new Z-pin implantation process is designed, the problem that the small-diameter Z-pin is easy to bend or break due to low rigidity in the implantation process is solved, and the method is simple and convenient to operate and high in practicability.

Drawings

FIG. 1 is a schematic view of a composite laminate component and a location to be implanted;

FIG. 2 is a schematic view of a process flow for preparing a small diameter Z-pin;

FIG. 3 is a schematic view of the interface between the fine diameter Z-pin and the composite laminate;

FIG. 4 is a schematic view of a small diameter Z-pin implantation process

Fig. 5 is a schematic view of a composite material laminate member test piece in a proof test of example 2 of the present invention, in which fig. 5(a) is a front view and fig. 5(b) is a plan view.

1. The composite material laminated plate comprises a composite material laminated plate member, 2 parts of coordinate paper, 3 parts of Z-pin fiber bundles, 4 parts of a rotary creel, 5 parts of a glue dipping tank, 6 parts of a forming die, 7 parts of a curing device, 8 parts of a traction roller, 9 parts of a continuous winding device, 10 parts of uncut Z-pin wire materials, 11 parts of small-diameter Z-pins, 12 parts of a hole making needle, 13 parts of supporting equipment and 14 parts of a composite material laminated plate member test piece.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

According to the invention, through analyzing the initial damage introduced after the Z-pin is implanted into the composite material laminated plate, the fact that the Z-pin with small diameter and the nano material are 'synergistically toughened' is found, so that the interlayer toughness of the composite material laminated plate is improved, and the damage to the inner surface is reduced. Aiming at the problem that the small-diameter Z-pin is easy to bend or break due to low rigidity in the implantation process, a novel Z-pin implantation process is designed. The invention discloses a method for reducing in-plane damage of a polyimide Z-pin reinforced carbon fiber reinforced resin matrix composite laminated plate.

The embodiment of the invention discloses a method for reducing in-plane damage of a Z-pin reinforced composite material laminated plate, which comprises the following steps:

step one, preparing a composite material laminatedplate member 1 which is a cuboid with a multilayer laminated structure; is formed by laying fiber reinforced resin matrix composite prepreg. Thecomposite laminate structure 1 is then provided with a selected area to be reinforced and the points of implantation to be reinforced are identified within the area to be reinforced. Pastingrectangular coordinate paper 2 with a specified grid interval on the area to be strengthened, wherein the intersection point in therectangular coordinate paper 2 is the implantation point to be strengthened; wherein, the sides of therectangular coordinate paper 2 are parallel to the corresponding sides of the composite material laminatedplate member 1 on the same side, as shown in fig. 1.

And step two, preparing uncut fine diameter Z-pin wire material 10 which is a long cylindrical fiber bundle. The preparation process of the fine diameter with the numerical range of phi 0.1mm to phi 0.28mm is shown in fig. 2, and is specifically described as follows: the Z-pin fiber bundle 3 wound on the rotary creel 4 is fully soaked in resin in a glue dipping groove 5 under the traction action of a traction roller 8, wherein the resin is epoxy resin toughened and modified by nano materials, the nano materials are carbon nano fibers, carbon nano tubes, graphene and the like, pultrusion is carried out in a forming die 6, then the Z-pin fiber bundle 3 is semi-cured in acuring device 7, and finally, the prepared uncut Z-pin wire material 10 is wound through a continuous winding device 9, so that subsequent operation is facilitated. The uncut Z-pin wire material 10 has a length of 1m to 20m and a diameter of phi 0.1mm to phi 0.28 mm. The Z-pin fiber bundle 3 is made of carbon fiber, glass fiber or polyimide fiber.

And step three, subtracting the curing shrinkage of the carbon fiber reinforced resin matrix composite material laminatedplate member 1 according to the thickness of the position, which is pre-defined by the carbon fiber reinforced resin matrix composite material laminatedplate member 1, of the small diameter Z-pin11 to be implanted to obtain the length of the small diameter Z-pin11 to be implanted, cutting according to the length to obtain the small diameter Z-pin11 meeting the implantation requirement, and ensuring that the small diameter Z-pin11 does not protrude out of the surface of the composite material laminated plate member, as shown in FIG. 3.

The invention also discloses a novel process for implanting the small-diameter Z-pin in the method for reducing the in-plane damage of the Z-pin reinforced composite material laminated plate, which is shown in figure 4. The new process for implanting the small diameter Z-pin comprises two steps: (1) the uncuredcomposite laminate member 1 is placed on a heating pad to be heated at a constant temperature uniformly, and a prefabricated hole is formed vertically penetrating thecomposite laminate member 1 using apunching needle 12, as shown in fig. 4 (a). (ii) a (2) The small diameter Z-pin (11) is inserted into the prepared hole with the help of the supportingdevice 13 to achieve vertical implantation of the small diameter Z-pin11 without skewing, as shown in fig. 4 (b). The row/column spacing of the small diameter Z-pins 11 is 2mm to 10 mm. After the implantation operation is completed, it is ensured that the implanted fine diameter Z-pin11 does not protrude beyond the surface of the carbon fiber reinforced resin matrixcomposite laminate member 1.

[ example 1 ]

The method for reducing the in-plane damage of the Z-pin reinforced composite material laminated plate comprises the following steps:

step one, preparing a composite laminatedplate member 1 by using a T800/Epoxy prepreg, and drawing a position to be implanted with a small diameter Z-pin11 by using a piece of coordinate paper with the specification of 3mm multiplied by 3 mm. The composite material laminatedplate member 1 is formed by compounding 24 square single-layer plates with the thickness t of 0.15mm and the length of 200mm, and the laminating sequence is the laminating sequence [0/45/0/-45]3 s.

And step two, preparing uncut polyimide fiber Z-pin wire material 10 which is a long cylindrical fiber bundle. The preparation process comprises the following steps: the polyimide Z-pin fiber bundle 3 wound on the rotary creel 4 is fully soaked in resin in a glue dipping tank 5 under the traction action of a traction roller 8, wherein the resin is epoxy resin toughened and modified by graphene with the purity of about 98 wt%, pultrusion is carried out in a forming die 6, then the polyimide Z-pin fiber bundle 3 is semi-cured in acuring device 7, and finally, the prepared uncut polyimide fiber Z-pin wire material 10 is wound through a continuous winding device 9, so that the subsequent operation is facilitated. The uncut polyimide fiber Z-pin wire material 10 has a length of 1m and a diameter of phi 0.18 mm.

Thirdly, subtracting the curing shrinkage of the T800/Epoxy composite material laminatedplate member 1 according to the thickness of the position, which is defined in advance by the T800/Epoxy composite material laminatedplate member 1, of the small diameter Z-pin11 to be implanted to obtain the length of the small diameter Z-pin11 to be implanted, and cutting according to the length to obtain the small diameter Z-pin11 with the length of 2.5 mm;

step four, placing the uncured T800/Epoxy composite material laminatedplate member 1 on a heating pad for uniform constant-temperature heating at the temperature of 30 +/-3 ℃, and vertically penetrating the T800/Epoxy composite material laminatedplate member 1 by using ahole making needle 12 to form a prefabricated hole; then the small diameter Z-pin11 is inserted into the prefabricated hole with the help of the supportingdevice 13, so that the small diameter Z-pin11 can be vertically implanted without deflection, and the row/column spacing of each small diameter Z-pin11 is 3 mm. After the implantation operation is completed, it is ensured that the implanted fine diameter Z-pin11 does not protrude beyond the surface of the T800/Epoxycomposite laminate member 1.

[ example 2 ]

In order to verify that the method can achieve the effect of improving the in-plane performance of the Z-pin reinforced composite material laminated plate, a verification test of the in-plane tensile performance of the polyimide Z-pin reinforced T800/Epoxy composite material laminated plate is designed according to the requirements of a GBT1449-2005 fiber reinforced plastic tensile performance test method, and the test steps are as follows:

step one, preparing a composite laminated platemember test piece 14 by using a T800/Epoxy prepreg, wherein the test piece is 250mm long, 25mm wide and 3.6mm thick, and is formed by laminating 24 single-layer plates with the thickness T being 0.15mm, and the laminating sequence is [0/45/0/-45]3 s. The Z-pin implantation area is 112.5mm × 25mm as shown in fig. 5, and the coordinatepaper 2 having a mesh interval of 2.5mm × 2.5mm defines the position to be implanted of the Z-pin11 of a small diameter, and the composite laminated platemember test pieces 14 are divided into three groups of symbols a, b, and c, each of which is 5 test pieces.

And step two, preparing uncut polyimide fiber Z-pin wire material 10 which is a long cylindrical fiber bundle. The preparation process comprises the following steps: the polyimide Z-pin fiber bundle 3 wound on the rotary creel 4 is fully soaked in resin in a glue dipping tank 5 under the traction action of a traction roller 8, wherein the resin is epoxy resin toughened and modified by graphene with the purity of about 98 wt%, pultrusion is carried out in a forming die 6, then the polyimide Z-pin fiber bundle 3 is semi-cured in acuring device 7, and finally, the prepared uncut polyimide fiber Z-pin wire material 10 is wound through a continuous winding device 9, so that the subsequent operation is facilitated. The uncut polyimide fiber Z-pin wire material 10 has a length of 1m and a diameter of phi 0.18 mm.

And thirdly, subtracting the curing shrinkage of the composite material laminated platemember test piece 14 according to the thickness of the position, which is pre-defined by the T800/Epoxy composite material laminated platemember test piece 14, of the implanted small diameter Z-pin11 to obtain the length of the to-be-implanted small diameter Z-pin11, and cutting the polyimide fiber Z-pin wire material 10 with the diameter of phi 0.18mm according to the length to obtain the to-be-implanted small diameter Z-pin11 with the diameter of phi 0.18mm and the length of 3.6 mm.

Step four, carrying out Z-pin implantation operation on the composite material laminated platemember test piece 14 with three groups of labels A, B and C, wherein the implantation operations of the three groups are respectively carried out according to the following descriptions:

taking the group A as a blank group, and not carrying out implantation operation;

the polyimide fiber Z-pin11 to be implanted with the diameter of phi 0.18mm and the length of 3.6mm is taken and implanted into the group B of the composite laminatemember test piece 14 according to the pre-defined position. The implantation process comprises the following steps: (1) the uncured T800/Epoxy composite laminatemember test piece 14 was placed on a heating pad for uniform constant temperature heating at 30 ± 3 ℃, and a pre-fabricated hole was formed vertically through the T800/Epoxy composite laminatemember test piece 14 using a perforatingneedle 12. (2) The polyimide fiber Z-pin11 with the diameter of phi 0.18mm and the length of 3.6mm is inserted into the prefabricated hole with the help of the supportingequipment 13, so that the polyimide fiber Z-pin11 can be vertically implanted without deflection, and the distance between the rows and the columns of the polyimide fibers Z-pin11 is 2.5 mm. After the implantation operation was completed, it was ensured that the implanted polyimide fiber Z-pin11 did not protrude above the surface of thetest piece 14 of the T800/Epoxy composite laminate member.

Taking a polyimide fiber Z-pin11 to be implanted with the diameter of phi 0.28mm and the length of 3.6mm, wherein the polyimide fiber Z-pin11 is prepared by using epoxy resin which is not toughened by nano materials. It is implanted into the third group of composite laminatestructural members trial 14 at a pre-determined location. The implantation process is performed with polyimide fiber Z-pin11 with the diameter phi of 0.18mm and the length of 3.6 mm.

And step five, after implantation is completed, placing the T800/Epoxy composite laminated platemember test piece 14 with the labels of A, B and C into a designed special curing mould, sending the special curing mould into an autoclave, and curing according to a designed curing process flow.

And step six, selecting the cured prepared parts in the group A, the group B and the group C as test parts, and installing and fixing the test parts in the test preparation stage according to the requirements of the GBT1449-2005 fiber reinforced plastic tensile property test method strictly, so as to ensure that the test parts are failed due to pure tensile in the loading and breaking process.

Test data are collected in the test, and the finishing test data after the test is finished are shown in table 1:

TABLE 1

Analysis of experimental data shows that compared with the group A (without Z-pin implantation), the average tensile strength of the group B (the diameter of the Z-pin is phi 0.18mm, and the epoxy resin solid shape toughened by the nano material) is improved by 5.44%, and the average tensile strength of the group C (the diameter of the Z-pin is phi 0.28mm, and the epoxy resin solid shape not toughened) is improved by 3.68%; the average elastic modulus of the group B (the diameter of Z-pin is phi 0.18mm, the epoxy resin solid shape toughened by nano materials) is improved by 6.40 percent, and the average elastic modulus of the group C (the diameter of Z-pin is phi 0.28mm, the epoxy resin solid shape not toughened is used) is improved by 4.16 percent. Therefore, the method for reducing the in-plane damage of the Z-pin reinforced composite material laminated plate is verified by experiments, wherein the small-diameter Z-pin and the nano material are 'synergistically toughened', and the damage to the in-plane performance of the Z-pin implanted composite material laminated plate can be reduced.

The method for reducing the in-plane damage of the Z-pin reinforced composite material laminated plate solves the problem that the small-diameter Z-pin is difficult to implant by using a small-diameter Z-pin implantation process. The small-diameter Z-pin and the nano material are 'synergistically toughened', the damage to the internal performance of the composite material laminate is reduced while the toughness of the laminate is improved, and the composite material laminate is simple and convenient to operate and high in practicability. Meanwhile, a new Z-pin implantation process is designed, so that the problem that the small-diameter Z-pin is easy to bend or break due to low rigidity in the implantation process is solved, and the method is simple and convenient to operate and high in practicability.

During the process of implanting the thin-diameter Z-pin into the laminated plate, the elliptical resin-rich eye-shaped area formed by taking the Z-pin as the center is smaller, and in addition, the number of fibers which are pulled apart by the Z-pin and pressed to two sides to form local clusters is smaller, so that the local fiber dilution is lighter, and the in-plane performance of the laminated plate is favorably maintained. The fact that the Z-pin is implanted into the laminated plate as a foreign matter causes the laminated plate to be thickened, the fact that the laminated plate is thickened slightly due to the fact that the size of the Z-pin is small causes the fact that the whole fiber of the laminated plate is diluted slightly, and the fact that the in-plane performance of the laminated plate is maintained is facilitated. During the implantation of the fine diameter Z-pin as a foreign material into the laminate, the amount of fibers that are crushed and broken by the Z-pin in the area below the Z-pin is small, resulting in a slight breakage of the fibers, which is advantageous in maintaining the in-plane properties of the laminate.

The Z-pin is prepared by using the epoxy resin toughened and modified by the nano material, the synergistic toughening effect of the nano material and the Z-pin is exerted, so that the interface combination of the Z-pin and surrounding resin is more reliable, the surface energy required by the interface debonding failure is obviously improved, and the pinning bridging effect of the Z-pin is obviously enhanced. The length of the small-diameter Z-pin finally implanted into the composite laminated plate member is obtained by subtracting the curing shrinkage of the composite laminated plate member from the thickness of the position to be implanted of the small-diameter Z-pin pre-defined by the composite laminated plate member, so that the small-diameter Z-pin can be ensured not to protrude out of the surface of the composite laminated plate member without other additional trimming procedures, the surface is smooth, the procedures are reduced, and the problem of Z-pin deflection caused by cutting after implantation is avoided. The method for reducing the in-plane damage of the Z-pin reinforced composite material laminated plate has wide application range and strong practicability, and can be used for Z-pins with different materials and diameters.

Claims (7)

Translated fromChinese

1.一种降低Z-pin增强复合材料层合板面内损伤的方法，其特征在于，该方法包括如下步骤：1. a method for reducing in-plane damage of Z-pin reinforced composite material laminate, is characterized in that, the method comprises the steps:步骤一、制备复合材料层合板构件(1)，在所述复合材料层合板构件(1)上选出待加强区域，并在所述待加强区域内确定出待加强植入点；Step 1. Prepare a composite material laminate member (1), select an area to be reinforced on the composite material laminate member (1), and determine an implantation point to be reinforced in the to-be-reinforced area;步骤二、由Z-pin纤维束(3)制备细小直径Z-pin11；Step 2, preparing the small diameter Z-pin11 from the Z-pin fiber bundle (3);步骤三、将所述步骤二中的所述细小直径Z-pin11裁剪成多个一定长度的细小直径Z-pin11，将细小直径Z-pin11分别由所述待加强植入点垂直植入所述复合材料层合板构件(1)内，得到增强强度后的复合材料层合板构件(1)；Step 3: Cut the small diameter Z-pin11 in the second step into a plurality of small diameter Z-pin11 of a certain length, and vertically implant the small diameter Z-pin11 from the implantation point to be reinforced. In the composite material laminate board member (1), a composite material laminate board member (1) with enhanced strength is obtained;其中，Z-pin的长度为待加强植入点的厚度减去所述复合材料层合板构件(1)的固化收缩量。Wherein, the length of the Z-pin is the thickness of the implantation point to be reinforced minus the curing shrinkage of the composite laminate member (1).2.根据权利要求1所述的一种降低Z-pin增强复合材料层合板面内损伤的方法，其特征在于，所述步骤一中，确定所述加强植入点的方法具体为：2. The method for reducing the in-plane damage of Z-pin reinforced composite material laminate according to claim 1, wherein in the step 1, the method for determining the reinforcement implantation point is specifically:将所述待加强区域的表面贴上规定网格间距的矩形坐标纸(2)，矩形坐标纸(2)中的交点即为待加强植入点；其中，矩形坐标纸(2)的侧边与复合材料层合板构件(1)对应的同侧边相平行。The surface of the area to be reinforced is pasted on the rectangular coordinate paper (2) with a specified grid spacing, and the intersection point in the rectangular coordinate paper (2) is the implantation point to be strengthened; wherein, the side of the rectangular coordinate paper (2) The same side edge corresponding to the composite laminate member (1) is parallel.3.根据权利要求2所述的一种降低Z-pin增强复合材料层合板面内损伤的方法，其特征在于，所述待加强植入点处的行/列间距为2mm～10mm。3 . The method for reducing the in-plane damage of a Z-pin reinforced composite laminate according to claim 2 , wherein the row/column spacing at the implantation point to be reinforced is 2 mm to 10 mm. 4 .4.根据权利要求1或2所述的一种降低Z-pin增强复合材料层合板面内损伤的方法，其特征在于，所述步骤二中，细小直径Z-pin(11)的制备方法具体为：4. A method for reducing in-plane damage of Z-pin reinforced composite material laminate according to claim 1 or 2, characterized in that, in the second step, the preparation method of the small diameter Z-pin (11) is specifically for:将Z-pin纤维束(3)充分浸润树脂，其中树脂是由纳米材料增韧改性后的环氧树脂，再在成型模具(6)中进行拉挤成形，随后对已经浸润树脂的Z-pin纤维束(3)在固化装置(7)进行半固化，即得未裁剪的Z-pin丝材(10)，随后进行裁剪得到细小直径Z-pin(11)。The Z-pin fiber bundles (3) are fully impregnated with resin, wherein the resin is an epoxy resin toughened and modified by nanomaterials, and then pultruded in the forming die (6), and then the Z-pins that have been impregnated with resin are subjected to pultrusion. The pin fiber bundle (3) is semi-cured in the curing device (7) to obtain an uncut Z-pin wire (10), which is then cut to obtain a small diameter Z-pin (11).5.根据权利要求4所述的一种降低Z-pin增强复合材料层合板面内损伤的方法，其特征在于，所制备的细小直径Z-pin(11)的直径范围为Ф0.1mm～Ф0.28mm。5 . The method for reducing in-plane damage of Z-pin reinforced composite laminate according to claim 4 , wherein the prepared small diameter Z-pin (11) has a diameter ranging from Ф0.1mm to Ф0. 6 . .28mm.6.根据权利要求4所述的一种降低Z-pin增强复合材料层合板面内损伤的方法，其特征在于，所述用于增韧环氧树脂的纳米材料包括纳米填料或二维纳米材料。6 . The method for reducing in-plane damage of Z-pin reinforced composite material laminate according to claim 4 , wherein the nanomaterial for toughening epoxy resin comprises nanofiller or two-dimensional nanomaterial. 7 . .7.根据权利要求1所述的一种降低Z-pin增强复合材料层合板面内损伤的方法，其特征在于，所述步骤三中，细小直径Z-pin(11)植入工艺的方法具体为：7 . The method for reducing the in-plane damage of Z-pin reinforced composite material laminate according to claim 1 , wherein in the step 3, the method for implanting the small diameter Z-pin (11) is concrete. 8 . for:1)将未固化的复合材料层合板构件(1)进行均匀的恒温加热，并使用制孔针(12)垂直穿透复合材料层合板构件(1)形成预制孔；1) uniformly heating the uncured composite laminate member (1) at a constant temperature, and using a hole-making needle (12) to vertically penetrate the composite laminate member (1) to form prefabricated holes;2)利用支撑设备(13)，将细小直径Z-pin(11)插入到预制孔中。2) Using the support device (13), insert the small diameter Z-pin (11) into the prefabricated hole.

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