Disclosure of Invention
The invention aims to provide a device and a method for electroless plating or cleaning, which aim at the electroless plating and cleaning of a product with a through hole with a high aspect ratio, solve the problem that electroless plating solution or cleaning solution is difficult to enter the through hole with the high aspect ratio, and improve the quality of a plated film.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the device comprises a tank body and a product placing frame which is detachably inserted into the tank body, wherein the device is in an operating state, when the device is in the operating state, the product placing frame is inserted into the tank body, a first cavity is formed at one side of the product placing frame, a second cavity is formed at the other side of the product placing frame, and the first cavity and the second cavity can be communicated only through a through hole in a product;
at least one of the first cavity and the second cavity is communicated with a liquid inlet mechanism, and at least the other is communicated with a liquid discharging mechanism and a vacuum extraction opening.
Preferably, the device further comprises a vacuum pumping device capable of being connected with the vacuum pumping port, when the device is in the working state, the first cavity and the second cavity have a pressure difference, and the vacuum pumping device is communicated with the cavity with a lower liquid level.
Preferably, the liquid inlet mechanism comprises a first liquid inlet mechanism and a second liquid inlet mechanism, the liquid discharge mechanism comprises a first liquid discharge mechanism and a second liquid discharge mechanism, the vacuum extraction opening comprises a first vacuum extraction opening and a second vacuum extraction opening, the first cavity is communicated with the first liquid inlet mechanism, the first liquid discharge mechanism is communicated with the first vacuum extraction opening, and the second cavity is communicated with the second liquid inlet mechanism, the second liquid discharge mechanism is communicated with the second vacuum extraction opening.
Preferably, the device further comprises a first sealing box movably arranged at one side in the groove body, and when the device is in the working state, the first sealing box is in sealing contact with the product placing frame to form the first cavity; the device also comprises a second sealing box which is movably arranged at the other side in the groove body, and when the device is in the working state, the second sealing box is in sealing contact with the product placing frame to form the second cavity.
More preferably, the liquid inlet mechanism is provided with a forced liquid inlet arranged on the first sealing box or the second sealing box, the liquid draining mechanism is provided with a forced liquid outlet arranged on the first sealing box or the second sealing box, and the vacuum extraction opening is arranged on the first sealing box or the second sealing box.
Further, the device comprises a pressure dispersion plate located inside the forcing liquid inlet and offset from the forcing liquid inlet by a distance.
Further, the device also comprises a first bracket and a second bracket which are fixedly arranged in the groove body, the first sealing box is movably arranged on the first bracket, and the second sealing box is movably arranged on the second bracket; the device also comprises a driving cylinder for driving the first sealing box and the second sealing box to move, wherein the driving cylinder is arranged on the first bracket or the second bracket, and a piston rod of the driving cylinder is connected with the first sealing box or the second sealing box.
Still further, be provided with first breakwater between the first support with first seal box, the second support with be provided with the second breakwater between the second seal box, first breakwater reaches all offer on the second breakwater and be used for confession liquid feeding mechanism's pipeline, liquid discharging mechanism's pipeline and actuating mechanism's piston rod passes hole or groove.
Further, a first sealing strip used for being in sealing contact with the product placing frame is arranged on the end face of the first sealing box, and a second sealing strip used for being in sealing contact with the product placing frame is arranged on the end face of the second sealing box.
Preferably, the device further comprises a flushing liquid feeding assembly facing the tank body and a liquid outlet pipe connected to the lower part of the tank body.
More preferably, the rinse liquid feeding assembly includes a plurality of nozzles provided on a spray tube.
The invention also adopts the following technical scheme:
a method for electroless plating or cleaning comprising the steps of:
A. providing a product having a through hole;
B. mounting the product to a product mounting rack;
C. inserting a product placing frame provided with a product into the groove body, so that a first cavity is formed on one side of the product placing frame, and a second cavity is formed on the other side of the product placing frame;
D. introducing plating solution or cleaning solution into the first cavity;
E. vacuumizing the second cavity to enable plating solution or cleaning solution to flow into the second cavity from the first cavity through the through holes in the product;
F. and vacuumizing the first cavity to enable the plating solution or cleaning solution to flow into the first cavity from the second cavity through the through holes in the product.
Preferably, steps E and F are performed sequentially and cyclically.
Herein, products include, but are not limited to, substrates, wafers, PCBs, and glasses, the products having through holes with aspect ratios greater than or equal to 20.
Compared with the prior art, the invention has the following advantages:
according to the device and the method, one of the cavities is vacuumized, so that the pressure difference exists between the first cavity and the second cavity, and liquid flow (plating solution or cleaning solution) flows through the through holes in the product under the drive of the pressure difference, so that the problem that the liquid flow is difficult to enter the through holes with high aspect ratio of the product can be effectively solved, the coating quality is improved, and the condition that the coating thickness is uneven or the coating is disconnected discontinuously is avoided.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. The description of these embodiments is provided to assist understanding of the present invention, but is not intended to limit the present invention. In addition, technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
It should be understood that, although terms such as "first," "second," "third," and the like are used herein to describe various components, these components should not be limited by these terms. These terms are used primarily to distinguish one element from another element. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be. The terms a or an, as used herein, mean one or more.
The present embodiment provides an apparatus for electroless plating or cleaning, which can be applied to the preparation of a metal layer of a product having a through hole or a subsequent cleaning process. Such products include, but are not limited to, substrates, wafers, PCBs, and glasses, with through-holes on the product referring to through-holes having an aspect ratio greater than 20.
Referring to fig. 1 to 6, the device includes a tank 1 and a product rack 2 detachably inserted into the tank 1. The device has an operating state and a ready state. When the device is in the operating condition, the product placing frame 2 is inserted in the groove body 1, the product 21 is placed in the product placing frame 2, one side of the product placing frame 2 forms the first cavity 3, the other side of the product placing frame 2 forms the second cavity 4, and the first cavity 3 and the second cavity 4 can be communicated only through the through holes in the product 21. When the device is in the ready state, the products of the product rack 2 are exposed, can be rinsed, and are used for pre-cleaning after the products are initially put in. The product holder 2 is in the form of a hanger having a hook 20 and a product 21 is mounted in a through hole in the middle of the product holder 2.
At least one of the first cavity 3 and the second cavity 4 is communicated with a liquid inlet mechanism, at least the other is communicated with a liquid discharging mechanism and a vacuum pumping hole. The apparatus further comprises a vacuum pumping device (not shown) connectable to the vacuum pumping port. When the device is in a working state, the first cavity 3 and the second cavity 4 have liquid level difference, and the vacuumizing equipment is communicated with the cavity with lower liquid level. Plating solution or cleaning solution is introduced into the first cavity 3 or the second cavity 4 through the liquid inlet mechanism, the cavity with lower liquid level is vacuumized through the vacuuming equipment, the plating solution or cleaning solution is forced to flow through the through holes on the product, and the used plating solution or cleaning solution is discharged through the liquid discharging mechanism.
Further, the liquid inlet mechanism includes a first liquid inlet mechanism 51 and a second liquid inlet mechanism 52, the liquid discharge mechanism includes a first liquid discharge mechanism 53 and a second liquid discharge mechanism 54, and the vacuum pumping port includes a first vacuum pumping port 61 and a second vacuum pumping port 62. The first cavity 3 is communicated with the first liquid inlet mechanism 51, the first liquid discharging mechanism 53 and the first vacuum pumping port 61, and the second cavity 4 is communicated with the second liquid inlet mechanism 52, the second liquid discharging mechanism 54 and the second vacuum pumping port 62.
The device further comprises a first sealing box 30 movably arranged at one side in the groove body 1 and a second sealing box 40 movably arranged at the other side in the groove body 1. When the device is in the working state, the first sealing box 30 is in sealing contact with the product placing frame 2 to form a first cavity 3; the second seal cartridge 40 is in sealing contact with the product housing 2 to form a second cavity 4. The first liquid inlet mechanism 51 has a forced liquid inlet 503 formed in the first sealing box 30, and is formed in the middle of the first sealing box 30; the first drain mechanism 53 has a drain pipe 504 connected to the first seal case 30, and is specifically connected to the lower portion of the first seal case 30; the first vacuum pumping port 61 is provided in the first sealing case 30, and specifically is provided in an upper portion of the first sealing case 30. The second liquid inlet mechanism 52 has a forced liquid inlet 503 formed in the second sealing box 40, and is substantially formed in the middle of the second sealing box 40; the second drain mechanism 54 has a drain pipe 504 connected to the second seal case 40, and is specifically connected to the lower portion of the second seal case 40; the second vacuum pumping port 62 is provided in the second sealing case 40, and specifically is provided in an upper portion of the second sealing case 40.
The device further comprises two pressure dispersing plates 31 and 41, one pressure dispersing plate 31 or 41 being provided on the inner side of each forcing liquid inlet 503, respectively, the pressure dispersing plate 31 or 41 facing the forcing liquid inlet 503 and being offset from the forcing liquid inlet 503 by a distance. The left pressure dispersing plate 31 is fixedly provided to the first seal case 30, and the right pressure dispersing plate 41 is fixedly provided to the second seal case 40. The first seal box 30 is provided with a first seal strip 32 for sealing contact with the left side surface of the product rack 2 on an end face, and the second seal box 40 is provided with a second seal strip 42 for sealing contact with the right side surface of the product rack 2 on an end face.
The device also comprises a first bracket 11 and a second bracket 12 which are fixedly arranged in the groove body 1. The first sealing box 30 is movably arranged on the first bracket 11, a driving cylinder 7 for driving the first sealing box 30 to move is arranged on the first bracket 11, and a piston rod of the driving cylinder 7 is connected with the first sealing box 30. The second sealing box 40 is movably arranged on the second bracket 12, a driving air cylinder 7 for driving the second sealing box 40 to move is arranged on the second bracket 12, and a piston rod of the driving air cylinder 7 is connected with the second sealing box 40. The first sealing box 30 is movably arranged on the first bracket 11 through a plurality of guide shafts 15, specifically, the guide shafts 15 are fixedly arranged on the first bracket 11, and the first sealing box 30 is movably sleeved on the guide shafts 15. The second sealing box 40 is specifically movably disposed on the second support 12 through a plurality of guide shafts 15, specifically, the guide shafts 15 are fixedly disposed on the second support 12, and the second sealing box 40 is movably sleeved on the guide shafts 15.
A first water baffle 13 is arranged between the first bracket 11 and the first sealing box 30, and a second water baffle 14 is arranged between the second bracket 12 and the second sealing box 40. The first water baffle 13 is fixedly arranged on the first bracket 11, and the second water baffle 14 is fixedly arranged on the second bracket 12. The first water baffle 13 and the second water baffle 14 are respectively provided with a pipeline (such as a second liquid inlet pipe 502) for supplying liquid to the liquid feeding mechanism, a pipeline (such as a liquid outlet pipe 504) for discharging liquid from the liquid feeding mechanism, a piston rod of the driving cylinder 7 and a hole or a groove for allowing the guide shaft 15 to pass through. The first water baffle 13 and the second water baffle 14 can prevent vapor from contacting components such as the cylinder, and the service life of the components such as the cylinder is prevented from being influenced.
The apparatus further comprises a flushing liquid feeding assembly facing the inside of the tank 1 and a liquid outlet pipe 83 connected to the lower part of the tank 1. The rinse liquid feeding assembly includes a plurality of nozzles 82 provided on a spray pipe 81. The top of the first chamber 3 and the second chamber 4 are provided with a spray tube 81 as described above. Further, the rinse nozzles 82 in each cavity are arranged at equal intervals, each rinse nozzle 82 has a liquid outlet pipe 83 facing obliquely downward and the product rack 2, and an included angle (for example, 45 degrees) smaller than 90 degrees is formed between the center line of the liquid outlet hole and the plane where the product rack 2 is located.
Each of the liquid inlet mechanisms includes a first liquid inlet pipe 501 and a second liquid inlet pipe 502 disposed on the first bracket 11 or the second bracket 12, wherein an inlet of the first liquid inlet pipe 501 is communicated with the outside, an outlet of the second liquid inlet pipe 502 is communicated with the forced liquid inlet 503, and the plating liquid or cleaning liquid flows into an inlet of the second liquid inlet pipe 502 from an outlet of the first liquid inlet pipe 501 (the two can be communicated through a hose, etc.), and then flows into the first cavity 3 or the second cavity 4 through the forced liquid inlet 503. Each drain mechanism includes a drain pipe 504, the drain pipe 504 is disposed on the first bracket 11 or the second bracket 12, the plating solution or cleaning solution in the cavity is discharged through the drain pipe, and the drain pipe 504 is communicated with the drain pipe 83 on the tank body 1, so as to finally discharge the plating solution or cleaning solution out of the device. Wherein, the drain pipe 504 of the side cavity with lower pressure is always in an open state when the device is in operation.
The embodiment also provides an electroless plating method, which adopts the device. The general flow of the electroless plating method is as follows:
s101, providing a product with a through hole;
s102, mounting a product on a product mounting frame;
s103, inserting a product placing frame 2 with products into the groove body 1, so that a first cavity 3 is formed on one side of the product placing frame 2, and a second cavity 4 is formed on the other side of the product placing frame 2;
s104, introducing plating solution into the first cavity 3;
s105, the second vacuum extraction opening 62 is communicated with a vacuum extraction device, and vacuum is extracted from the second cavity 4, so that the plating solution flows into the second cavity 4 from the first cavity 3 through a through hole on the product;
s106, the first vacuum extraction opening 61 is communicated with a vacuum extraction device, and vacuum is extracted from the first cavity 3, so that the plating solution flows into the first cavity 3 from the second cavity 4 through the through hole on the product.
Steps S105 and S106 are sequentially and cyclically performed.
In step S106, a plating solution is introduced into the second cavity 4, and then the first cavity 3 is vacuumized.
In step S103, the piston rods of the driving cylinders 7 at both sides extend to push the first sealing box 30 and the second sealing box 40 to press against the product rack 2, so that the first sealing box 30 is in sealing contact with the left side surface of the product rack 2 to form a first cavity 3, and the second sealing box 40 is in sealing contact with the right side surface of the product rack 2 to form a second cavity 4.
The embodiment also provides a cleaning method, which adopts the device. The general flow of the cleaning method is as follows:
s201, providing a product with a through hole;
s202, mounting a product on a product mounting frame;
s203, inserting a product placing frame 2 with products into the groove body 1, so that a first cavity 3 is formed on one side of the product placing frame 2, and a second cavity 4 is formed on the other side of the product placing frame 2;
s204, introducing cleaning liquid into the first cavity 3;
s205, the second vacuum extraction opening 62 is communicated with a vacuum extraction device, and vacuum is extracted from the second cavity 4, so that cleaning liquid flows into the second cavity 4 from the first cavity 3 through a through hole on a product;
s206, the first vacuum extraction opening 61 is communicated with a vacuum extraction device, and the first cavity 3 is vacuumized, so that the cleaning fluid flows into the first cavity 3 from the second cavity 4 through the through hole on the product.
Steps S205 and S206 are sequentially and cyclically performed.
In step S206, a cleaning solution is introduced into the second cavity 4, and the first cavity 3 is vacuumized.
In step S203, the piston rods of the driving cylinders 7 at both sides extend to push the first sealing box 30 and the second sealing box 40 to press against the product rack 2, so that the left side surfaces of the first sealing box 30 and the product rack 2 are in sealing contact to form a first cavity 3, and the right side surfaces of the second sealing box 40 and the product rack 2 are in sealing contact to form a second cavity 4.
In the device and the method, one of the cavities is alternately vacuumized, so that the pressure difference exists between the first cavity and the second cavity, and liquid flow (plating solution or cleaning solution) alternately flows through the through holes on the product in a left-to-right and right-to-left mode under the drive of the pressure difference, so that the problem that the liquid flow is difficult to enter the through holes with high depth-to-width ratio of the product can be effectively solved, and the coating quality is improved.
The above-described embodiments are provided for illustrating the technical concept and features of the present invention, and are intended to be preferred embodiments for those skilled in the art to understand the present invention and implement the same according to the present invention, not to limit the scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.