CN112068645A - Adapter board, connecting device and electronic device thereof - Google Patents

Abstract

The invention provides a patch panel, a connecting device and an electronic device thereof, wherein the patch panel is used for realizing the connection between a central processing unit and a solid state disk, the patch panel comprises a first connector, a control module and a second connector which are electrically connected in sequence, and the first connector is used for connecting the central processing unit; the second connector is used for connecting the solid state disk; the control module is used for identifying and controlling the solid state disk; the adapter plate supports hot plugging, signal conversion and contact functions.

Description

Translated fromChinese

转接板、连接装置及其电子装置Adapter board, connecting device and electronic device thereof

技术领域technical field

本发明涉及一种转接板、连接装置及其电子装置。The invention relates to an adapter board, a connecting device and an electronic device thereof.

背景技术Background technique

随着服务器和电脑产品的发展日新月异，需要支持各种HDD(Hard Disk Drive，硬盘驱动)驱动器，M.2接口SSD(固态硬盘)是一种常用的配置。目前开始使用的平台服务器和工作站，需要支持PCIE 4.0，而传统的M.2模块，仅支持PCIE 3.0，另外，传统的M.2模块一般包括热插拔背板以及转接板，其通常不能支持GEN4信号，同时，其还需要多个转换板与接触板组合实现信号转接，组装过程复杂，且信号传输质量不佳。With the rapid development of server and computer products, it is necessary to support various HDD (Hard Disk Drive, hard disk drive) drives, and M.2 interface SSD (Solid State Drive) is a commonly used configuration. The platform servers and workstations currently in use need to support PCIE 4.0, while traditional M.2 modules only support PCIE 3.0. In addition, traditional M.2 modules generally include hot-swappable backplanes and adapter boards, which usually cannot It supports GEN4 signal, and at the same time, it also requires a combination of multiple conversion boards and contact boards to realize signal transfer, the assembly process is complicated, and the signal transmission quality is poor.

发明内容SUMMARY OF THE INVENTION

针对上述问题，有必要提供一种组装简单且信号传输质量较佳的电子装置转接板、连接装置及其电子装置。In view of the above problems, it is necessary to provide an electronic device adapter board, a connecting device and an electronic device thereof with simple assembly and better signal transmission quality.

一种转接板，用于实现中央处理器与固态硬盘之间的连接，所述转接板包括依次电性连接的第一连接器、控制模块以及第二连接器，所述第一连接器用于连接所述中央处理器；所述第二连接器，用于连接所述固态硬盘；所述控制模块用于对所述固态硬盘进行识别及控制；所述转接板支持热插拔、信号转换以及接触功能。An adapter board is used to realize the connection between a central processing unit and a solid state hard disk. The adapter board includes a first connector, a control module and a second connector that are electrically connected in sequence, and the first connector is used for for connecting to the central processing unit; the second connector for connecting the solid-state hard disk; the control module for identifying and controlling the solid-state hard disk; the adapter board supports hot swap, signal Conversion and contact functions.

进一步地，所述第一连接器为高密度连接器，且支持PCIE(peripheral componentinterconnect express，高速串行计算机扩展总线标准)第四代八通道卡GEN4×8信号传输。Further, the first connector is a high-density connector, and supports PCIE (peripheral component interconnect express, high-speed serial computer expansion bus standard) fourth-generation eight-channel card GEN4×8 signal transmission.

进一步地，所述第二连接器为高密度连接器，且支持PCIE第四代四通道卡GEN4×4信号传输。Further, the second connector is a high-density connector, and supports PCIE fourth-generation four-channel card GEN4×4 signal transmission.

进一步地，所述控制模块识别所述固态硬盘与所述第二连接器连接状态，并在所述固态硬盘与所述第二连接器连接后，控制所述中央处理器与所述固态硬盘之间进行数据传输。Further, the control module identifies the connection state between the solid state drive and the second connector, and controls the connection between the central processing unit and the solid state drive after the solid state drive is connected to the second connector. data transfer between.

进一步地，所述转接板包括与所示控制模块电性相连的显示模块，用于显示所述固态硬盘与所述第二连接器的连接状态。Further, the adapter board includes a display module that is electrically connected to the control module, and is used to display the connection state of the solid state drive and the second connector.

一种连接装置，包括依次电性连接的中央处理器、转接板以及固态硬盘，所述转接板为上述的转接板。A connecting device includes a central processing unit, an adapter board, and a solid-state hard disk that are electrically connected in sequence, and the adapter board is the above-mentioned adapter board.

进一步地，所述连接装置还包括第三连接器，所述第三连接器用于连接所述中央处理器与所述第一连接器。Further, the connection device further includes a third connector for connecting the central processing unit and the first connector.

进一步地，所述第三连接器为高密度连接器，且支持PCIE GEN4×8信号传输。Further, the third connector is a high-density connector and supports PCIE GEN4×8 signal transmission.

进一步地，所述连接装置包括两个第三连接器、两个转接板以及四个固态硬盘，所述中央处理器通过所述两个第三连接器分别连接至所述两个转接板的第一连接器，每一个所述转接板的第二连接器分别连接一个固态硬盘。Further, the connection device includes two third connectors, two adapter boards and four solid-state drives, and the central processing unit is connected to the two adapter boards through the two third connectors, respectively the first connector, and the second connector of each adapter board is respectively connected to a solid-state hard disk.

一种电子装置，包括上述连接装置，所述电子装置为电脑、服务器或者工作站。An electronic device, comprising the above-mentioned connecting device, the electronic device is a computer, a server or a workstation.

上述转接板集成热插拔、信号转换以及接触功能，且可支持PCIE 4.0GEN4信号传输，使得所述CPU与所述固态硬盘之间无需设置多个转换板或者接触板，组装简单且信号传输质量较佳此外，每一个所述转接板可以实现两个固态硬盘与所述CPU之间的转接，因此，可降低成本。The above-mentioned adapter board integrates hot-plug, signal conversion and contact functions, and can support PCIE 4.0GEN4 signal transmission, so that there is no need to set up multiple conversion boards or contact boards between the CPU and the solid-state hard disk, and the assembly is simple and the signal transmission. Better quality In addition, each of the adapter boards can realize the adapter between two solid-state drives and the CPU, so the cost can be reduced.

附图说明Description of drawings

图1为本发明较佳实施例的连接装置的功能模块图。FIG. 1 is a functional block diagram of a connection device according to a preferred embodiment of the present invention.

主要元件符号说明Description of main component symbols

连接装置 100connection device 100

转接板 10Adapter Board 10

第一连接器 11first connector 11

控制模块 13control module 13

第二连接器 15Second connector 15

CPU 30CPU 30

第三连接器 31Third connector 31

SSD 50SSD 50

如下具体实施方式将结合上述附图进一步说明本发明。The following specific embodiments will further illustrate the present invention in conjunction with the above drawings.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments.

为了使本发明的目的、技术方案及优点更加清楚明白，以下将会结合附图及实施方式，以对本发明中的转接板、连接装置及其电子装置作进一步详细的描述及相关说明。In order to make the objectives, technical solutions and advantages of the present invention clearer, the following will further describe and describe the adapter board, the connecting device and the electronic device thereof in detail in conjunction with the accompanying drawings and embodiments.

请参考图1，本发明较佳实施方式提供一种连接装置100，所述连接装置100适用于电脑、服务器、工作站等电子装置。Referring to FIG. 1 , a preferred embodiment of the present invention provides a connectingdevice 100 , and the connectingdevice 100 is suitable for electronic devices such as computers, servers, and workstations.

所述连接装置100包括转接板10、以及通过所述转接板10建立连接并进行信号传输的CPU(central processing unit，中央处理器)30以及SSD(solid state disk，固态硬盘)50。Theconnection device 100 includes anadapter board 10 , a CPU (central processing unit, central processing unit) 30 and an SSD (solid state disk, solid state disk) 50 for establishing a connection and performing signal transmission through theadapter board 10 .

所述转接板10包括依次电性连接的第一连接器11、控制模块13以及第二连接器15，所述第一连接器11用于连接所述CPU 30。所述第二连接器15用于连接所述SSD 50。所述控制模块13用于对所述SSD 50进行识别及控制。所述转接板10支持热插拔、信号转换以及接触功能。Theadapter board 10 includes afirst connector 11 , acontrol module 13 and asecond connector 15 that are electrically connected in sequence, and thefirst connector 11 is used to connect to theCPU 30 . Thesecond connector 15 is used to connect the SSD 50 . Thecontrol module 13 is used to identify and control theSSD 50 . Theadapter board 10 supports hot swap, signal conversion and contact functions.

在本较佳实施例中，所述第一连接器11为高密度连接器，且支持PCIE(peripheralcomponent interconnect express，高速串行计算机扩展总线标准)第四代八通道卡GEN4×8信号传输。In this preferred embodiment, thefirst connector 11 is a high-density connector, and supports PCIE (peripheral component interconnect express, high-speed serial computer expansion bus standard) fourth-generation eight-channel card GEN4×8 signal transmission.

所述控制模块13识别所述SSD 50与所述第二连接器15连接状态，并在所述SSD 50与所述第二连接器15连接后，控制所述CPU30与所述SSD 50之间进行数据传输。Thecontrol module 13 recognizes the connection state between theSSD 50 and thesecond connector 15 , and after theSSD 50 and thesecond connector 15 are connected, controls the connection between theCPU 30 and theSSD 50 . data transmission.

可以理解，所述转接板10还包括与所示控制模块13电性相连的显示模块(图未示)，例如，LED，所述显示模块用于显示所述SSD50与所述第二连接器15的连接状态。It can be understood that theadapter board 10 further includes a display module (not shown) electrically connected to thecontrol module 13 shown, for example, an LED, the display module is used to display theSSD 50 and thesecond connector 15 connection status.

在本较佳实施例中，所述第二连接器15为高密度连接器，且支持PCIE第四代四通道卡GEN4×4信号传输。In this preferred embodiment, thesecond connector 15 is a high-density connector, and supports PCIE fourth-generation four-channel card GEN4×4 signal transmission.

可以理解，所述连接装置100还包括第三连接器31，所述第三连接器31用于连接所述CPU 30与所述第一连接器11。所述第三连接器31为高密度连接器，且支持PCIE 4.0GEN4×8信号传输。It can be understood that theconnection device 100 further includes athird connector 31 for connecting theCPU 30 and thefirst connector 11 . Thethird connector 31 is a high-density connector and supports PCIE 4.0GEN4×8 signal transmission.

在本较佳实施例中，所述SSD50为M.2固态硬盘。In this preferred embodiment, the SSD50 is an M.2 solid state drive.

在本较佳实施例中，所述连接装置100包括两个第三连接器31、两个转接板10以及四个SSD 50。所述CPU 30通过所述两个第三连接器31分别连接至所述两个转接板10的第一连接器11，每一个所述转接板10的第二连接器15分别连接一个SSD 50。因此，每一个所述转接板10可以实现两个SSD50与所述CPU 30之间的转接。所述每一个转接板10以及与其相连的两个SSD50可装设于承载装置(图未示)，所述承载装置可装设于硬盘容纳盒(图未示)。In this preferred embodiment, theconnection device 100 includes twothird connectors 31 , twoadapter boards 10 and fourSSDs 50 . TheCPU 30 is connected to thefirst connectors 11 of the twoadapter boards 10 through the twothird connectors 31 respectively, and thesecond connectors 15 of each of theadapter boards 10 are respectively connected to anSSD 50. Therefore, each of theadapter boards 10 can realize the adapter between the twoSSDs 50 and theCPU 30 . Each of theadapter boards 10 and the twoSSDs 50 connected thereto can be installed in a carrying device (not shown), and the carrying device can be installed in a hard disk accommodating box (not shown).

上述转接板10集成热插拔、信号转换以及接触功能，且可支持PCIE 4.0GEN4信号传输，使得所述CPU 30与所述SSD 50之间无需设置多个转换板或者接触板，组装简单且信号传输质量较佳，此外，每一个所述转接板10可以实现两个SSD 50与所述CPU 30之间的转接，因此，可降低成本。The above-mentionedadapter board 10 integrates hot-plug, signal conversion and contact functions, and can support PCIE 4.0GEN4 signal transmission, so that there is no need to set up multiple conversion boards or contact boards between theCPU 30 and theSSD 50, and the assembly is simple and convenient. The signal transmission quality is good. In addition, each of theadapter boards 10 can realize the adapter between the twoSSDs 50 and theCPU 30 , so the cost can be reduced.

最后应说明的是，以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them, although the present invention has been described in detail with reference to the preferred embodiments.

本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换，而不脱离本发明技术方案的精神和范围。It should be understood by those skilled in the art that the technical solutions of the present invention may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

并且，基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都将属于本发明保护的范围。In addition, based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts will fall within the protection scope of the present invention.

Claims (10)

1. An adapter plate is used for realizing the connection between a central processing unit and a solid state disk, and is characterized in that the adapter plate comprises a first connector, a control module and a second connector which are electrically connected in sequence, wherein the first connector is used for connecting the central processing unit; the second connector is used for connecting the solid state disk; the control module is used for identifying and controlling the solid state disk; the adapter plate supports hot plugging, signal conversion and contact functions.

2. The patch panel of claim 1, wherein the first connector is a high density connector and supports PCIE (peripheral component interconnect express) fourth generation eight channel card GEN4 x 8 signaling.

3. The patch panel of claim 2, wherein the second connector is a high density connector and supports PCIE fourth generation quad channel card GEN4 x 4 signaling.

4. The interposer as recited in claim 3 wherein said control module identifies a connection status of said solid state disk with said second connector and controls data transmission between said central processor and said solid state disk after said solid state disk is connected with said second connector.

5. The interposer as recited in claim 4, wherein said interposer comprises a display module electrically connected to said control module for displaying a connection status of said solid state disk with said second connector.

6. A connection device, comprising a central processing unit, an adapter plate and a solid state disk, which are electrically connected in sequence, wherein the adapter plate is the adapter plate according to any one of claims 1 to 5.

7. The connecting device of claim 6, further comprising a third connector for connecting the central processor and the first connector.

8. The connector of claim 7, wherein the third connector is a high-density connector and supports PCIE GEN4 x 8 signaling.

9. The connecting device according to claim 6, wherein the connecting device comprises two third connectors, two adapter boards and four solid state disks, the central processor is connected to the first connectors of the two adapter boards through the two third connectors, and the second connector of each adapter board is connected to one solid state disk.

10. An electronic device comprising a connection device, wherein the connection device is according to any one of claims 6-8, and the electronic device is a computer, a server or a workstation.

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