CN112055468B - A kind of processing method of cover film on circuit board - Google Patents

Abstract

Translated fromChinese

本发明为解决电路板制备技术领域存在的金手指指示条容易被切断的问题，提供一种电路板上覆盖膜的处理方法，该方法包括如下步骤：预处理，对覆盖膜原料进行冲切，得到金手指覆盖膜，金手指覆盖膜包括框边、固定条、金手指指示条以及金手指主区，金手指指示条的一端连接金手指主区，金手指指示条的另一端连接框边，金手指主区通过固定条连接框边；贴膜，把金手指覆盖膜贴在电路板上；裁切，切断金手指主区与固定条的连接处，切断金手指指示条与框边的连接处。本发明的一种电路板上覆盖膜的处理方法，对覆盖膜进行了预处理，能够十分有效地保留住金手指的指示条，大大提高了产品的合格率。

In order to solve the problem that the gold finger indicator strip is easily cut off in the technical field of circuit board preparation, the present invention provides a method for processing a cover film on a circuit board, the method comprising the steps of: pre-processing, punching the cover film raw material, The golden finger cover film is obtained. The golden finger cover film includes a frame edge, a fixing strip, a golden finger indication strip and a golden finger main area. One end of the golden finger indication strip is connected to the golden finger main area, and the other end of the golden finger indication strip is connected to the frame edge. The main area of the golden finger is connected to the frame edge by the fixing strip; the film is attached to the cover film of the golden finger on the circuit board; the connection between the main area of the golden finger and the fixing strip is cut, and the connection between the golden finger indicator strip and the frame edge is cut off. . In the method for treating the cover film on the circuit board of the present invention, the cover film is pretreated, which can effectively retain the indicator strip of the golden finger, and greatly improves the qualification rate of the product.

Description

Processing method of covering film on circuit board

Technical Field

The invention relates to the technical field of circuit board preparation, in particular to a method for processing a covering film on a circuit board.

Background

The golden finger of current circuit board need remain the instruction strip at the side of golden finger when die-cut cover film, conveniently counterpoints with other circuit board/row plug/other equipment, and the accuracy links together.

The existing processing method for covering the film on the circuit board directly attaches the covering film to the golden finger area of the circuit board and then carries out punching, and because the width of the golden finger indicating strip is very small, the indicating strip is easily cut off or washed away in the punching process, the golden finger area of the formed circuit board is not provided with the indicating strip, circuit board circuits are easily damaged when the indicating strip is cut, and finally products are unqualified.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a method for processing a covering film on a circuit board, which is used for preprocessing the covering film, so that the indication strip of a golden finger can be effectively reserved, and the qualification rate of products is greatly improved.

The method for processing the covering film on the circuit board comprises the following steps: the method comprises the following steps of preprocessing, punching a raw material of a covering film to obtain a gold finger covering film, wherein the gold finger covering film comprises a frame edge, a fixing strip, a gold finger indicating strip and a gold finger main area, one end of the gold finger indicating strip is connected with the gold finger main area, the other end of the gold finger indicating strip is connected with the frame edge, and the gold finger main area is connected with the frame edge through the fixing strip; the gold finger covering film is pasted on the circuit board; and cutting, namely cutting off the joint of the main golden finger area and the fixed strip and cutting off the joint of the golden finger indicating strip and the frame edge.

The processing method of the covering film on the circuit board according to the embodiment of the invention at least has the following beneficial effects: the raw material of the covering film is pretreated, so that the indication strip of the golden finger can be effectively retained, the circuit board circuit is not easily damaged, and the qualification rate of the product is greatly improved.

According to some embodiments of the invention, there are four fixation bars in the pre-treatment step.

According to some embodiments of the invention, in the cutting step, the connecting part of the golden finger main area and the fixing strip is cut off, and then the connecting part of the golden finger indicating strip and the frame edge is cut off; or cutting off the connection part of the golden finger indicating strip and the frame edge, and then cutting off the connection part of the golden finger main area and the fixing strip; or simultaneously cutting off the connection part of the golden finger main area and the fixed strip and the connection part of the golden finger indicating strip and the frame edge.

According to some embodiments of the present invention, in the step of attaching the film, the pre-processed cover film is aligned to the gold finger of the circuit board.

According to some embodiments of the invention, the circuit board is a flexible circuit board.

According to some embodiments of the invention, the circuit board is one of a single-layer board, a double-sided board, and a multi-layer board.

According to some embodiments of the invention, the circuit board after the cutting step comprises a substrate, a copper layer and a film layer, wherein the film layer comprises the gold finger main area and the gold finger indicator strip.

According to some embodiments of the invention, the substrate is made of one of polyester and polyimide.

According to some embodiments of the invention, the material of the substrate is a transparent material.

According to some embodiments of the invention, the circuit board further comprises an ink layer.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic process flow diagram of a method for processing a cover film on a circuit board according to an embodiment of the present invention;

FIG. 2 is a schematic front view of a circuit board according to an embodiment of the invention;

FIG. 3 is a schematic top view of a circuit board according to an embodiment of the invention;

fig. 4 is a schematic bottom view of a circuit board according to an embodiment of the invention.

Reference numerals:

afilm layer 100;

the gold finger covers thefilm 110;

aframe edge 111, afixed strip 112, a goldenfinger indication strip 113 and a golden fingermain area 114;

asubstrate 200;

acopper layer 300.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the positional or orientational descriptions, such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "pointed", "inner", "outer", "axial", "radial", "circumferential", etc., are given with reference to the positional or orientational relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. In the description of the present invention, the sidewall means a left sidewall and/or a right sidewall.

In the description of the present invention, "a plurality" means two or more, "more than", "less than", "more than", and the like are understood as excluding the present number, and "more than", "less than", "in", and the like are understood as including the present number. If the description of "first" and "second" is used for the purpose of distinguishing technical features, the description is not intended to indicate or imply relative importance or to implicitly indicate the number of the indicated technical features or to implicitly indicate the precedence of the indicated technical features.

In the description of the present invention, it should be understood that "a is disposed on B" merely represents the connection relationship between a and B, and does not represent that a is above B.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. "bolted" and "screwed" are equally interchangeable. To those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in conjunction with specific situations.

The cross-sectional views in fig. 1, 3 and 4 do not represent cross-sectional views of embodiments of the present invention, but rather represent different elements by cross-sectional lines at different angles, which represent the same element.

Referring to fig. 1 to 4, a method for processing a cover film on a circuit board according to an embodiment of the present invention includes the following steps: preprocessing, punching a raw material of the cover film to obtain a goldfinger cover film 110, wherein the goldfinger cover film 110 comprises aframe edge 111, afixing strip 112, a goldfinger indicating strip 113 and a gold fingermain area 114, one end of the goldfinger indicating strip 113 is connected with the gold fingermain area 114, the other end of the goldfinger indicating strip 113 is connected with theframe edge 111, and the gold fingermain area 114 is connected with theframe edge 111 through thefixing strip 112; film pasting, namely pasting the golden finger coveringfilm 110 on the circuit board; cutting off the connection part of the golden fingermain area 114 and thefixed strip 112 and the connection part of the goldenfinger indication strip 113 and theframe edge 111.

In the preprocessing step, the cover film raw material is punched to obtain the goldfinger cover film 110, and the goldfinger cover film 110 includes aframe edge 111, afixing strip 112, a goldfinger indication strip 113 and a gold fingermain area 114. It is understood that the specific shape of theframe edge 111 is not limited, and may be any shape, such as a rectangle as shown in fig. 1, and may be punched to have an appropriate shape according to actual circumstances. The gold fingermain area 114 is a main part of a cover film required by thefilm layer 100 on the circuit board, the cover film of the gold fingermain area 114 covers most of the surface of the circuit board, in the cover film and circuit board structure diagrams shown in fig. 1, 3 and 4, the shape of the gold fingermain area 114 is shown by the broken line segment, which indicates that the shape of the gold fingermain area 114 may be different from the shape shown in the drawings, the cover film of the gold fingermain area 114 suitable for the actual circuit board surface needs to be punched according to the actual situation, and meanwhile, the window may not be opened as shown in fig. 3 and 4, in fig. 1, the main part of the gold fingermain area 114 is the cover film of the area where the gold finger of the circuit board is located, and the other parts are roughly cut by the broken line segment. The two goldfinger indication strips 113 are generally distributed on two sides of the gold fingermain area 114, or only one goldfinger indication strip 113 is distributed on two sides of the gold fingermain area 114, three, four or more gold finger indication strips are possible under special conditions, the goldfinger indication strips 113 mainly play a role in mark alignment, when the circuit board is connected with other equipment, whether the goldfinger indication strips 113 are aligned correctly or not can be judged according to whether alignment marks on the goldfinger indication strips 113 and the other equipment are overlapped, in the goldfinger cover film 110, one end of each goldfinger indication strip 113 is connected to theframe edge 111, and the other end of each gold finger indication strip is connected to the gold fingermain area 114, so that the goldfinger indication strips 113 can be completely unfolded when not cut off, a film pasting step is convenient, and the goldfinger indication strips 113 cannot be wrinkled together due to softness or even pasted on the gold fingermain area 114.Frame limit 111 is connected tofixed strip 112 one end, and the other end is connected golden finger and is takenmain area 114, mainly plays fixed effect to golden fingermain area 114, and is similar with goldenfinger instruction strip 113, can let golden fingermain area 114 can not bend the folding at will because of too soft, and it can be understood thatfixed strip 112 need not necessarily be four, also must not distribute in the four corners, can die-cut out thefixed strip 112 of suitable quantity, suitable position according to actual conditions. It will be appreciated that a plurality of mulch film stock materials stacked together may be pre-processed together at one time.

A preprocessing step, which is mainly used for punching out the gold fingermain area 114 suitable for the surface profile of the circuit board in advance, so that the positions needing punching in the punching step are reduced, and the circuit board is effectively prevented from being damaged; the golden fingermain area 114 is unfolded and fixed on theframe edge 111 through thefixing strip 112, so that the film pasting step is convenient to carry out; the goldenfinger indicating strip 113 is punched out, the goldenfinger indicating strip 113 is not disconnected with theframe edge 111, the goldenfinger indicating strip 113 is completely unfolded, the film pasting step is convenient to perform, meanwhile, the side outline of the goldenfinger indicating strip 113 punched out from the raw material of the covering film is not limited by the circuit board, the punching is convenient to perform, and even if the punching fails, only a part of raw material of the covering film needs to be abandoned, but the whole circuit board is not abandoned; theframe edge 111 is reserved, and the film is convenient to take and place in the film pasting step.

In the step of film pasting, the goldfinger cover film 110 obtained after pretreatment is correctly placed on the corresponding circuit board and firmly pasted through the modes of bonding, stamping and the like.

In the cutting step, the pasted golden finger coveringfilm 110 needs to be further processed, most of the unnecessary covering film is punched in the preprocessing step, the remained golden fingermain area 114 can cover the surface of the circuit board, only the connection points of someframe edges 111, the golden fingermain area 114 and the goldenfinger indication strip 113 need to be punched, and the cutting work is simple and easy. Only the connection between the gold fingermain area 114 and thefixing strip 112 and the connection between the goldfinger indicating strip 113 and theframe edge 111 need to be cut off, the requirement on cutting precision is low, and meanwhile, the circuit on the circuit board is not easy to damage. It is understood that thefixing bar 112 may be cut close to the gold fingermain area 114 and the goldfinger indicating bar 113 may be cut close to theframe edge 111, which requires low cutting precision and is easy and simple to operate.

Referring to fig. 1, in some embodiments of the present invention, there are fourfixation bars 112 in the pre-treatment step.

The fourfixing strips 112 have a better fixing effect on the maingolden finger area 114, and particularly, when the fourfixing strips 112 are respectively connected with four corners of the maingolden finger area 114, the fixing effect on the maingolden finger area 114 is the best. It can be understood that the number of thefixing strips 112 can be changed according to actual conditions, the smaller the number of thefixing strips 112 is, the easier the cutting step is, but the poorer the fixing effect is, the less the film sticking step is performed; the more the number of thefixing strips 112 is, the better the fixing effect is, but the more the parts needing pretreatment are dispersed, which is not beneficial to the pretreatment step; for polygonal gold fingermain areas 114, onestrip 112 is associated with each corner, so that the number ofstrips 112 is determined in a manner that generally gives the best overall result.

Referring to fig. 1, in some embodiments of the present invention, in the cutting step, the connection between the maingolden finger area 114 and thefixing strip 112 is cut, and then the connection between the goldenfinger indicating strip 113 and theframe edge 111 is cut; or the joint of the goldfinger indicating strip 113 and theframe edge 111 is cut off first, and then the joint of the gold fingermain area 114 and thefixing strip 112 is cut off; or the connection part of the golden fingermain area 114 and thefixing strip 112 and the connection part of the goldenfinger indicating strip 113 and theframe edge 111 are cut off at the same time.

The connection sequence of the gold fingercutting indication strip 113 and theframe edge 111 and the connection sequence of the gold fingermain area 114 and thefixing strip 112 are not fixed, and can be selected according to actual conditions. For example, the joint between the large golden fingermain area 114 and thefixing strip 112 may be manually processed, and then the joint between the fine goldenfinger indication strip 113 and theframe edge 111 may be processed by a special device; or firstly processing the connection part of the fine goldfinger indication strip 113 and theframe edge 111 by using special equipment, and then manually processing the connection part of the larger gold fingermain area 114 and thefixed strip 112; or both may be manually processed or processed using specialized equipment.

Referring to fig. 1 to 4, in some embodiments of the present invention, in the step of attaching the film, the pre-processed cover film is aligned to the gold fingers of the circuit board.

If the gold fingermain area 114 punched out in the preprocessing step corresponds to the surface of the circuit board, the circuit board needs to be aligned in the film pasting step, and the goldfinger indication strip 113 needs to be pasted in the corresponding area of the circuit board gold finger, so that the requirement for the alignment of the covering film in the area is high. When the cover film and the circuit board are aligned, auxiliary positioning can be performed in the modes of positioning columns, positioning holes and the like, alignment can also be performed according to the outline of the circuit board and the outline of the goldenfinger cover film 110, and the two cover films can be placed on special equipment and aligned by the equipment. The alignment is good in the film pasting step, the cutting step can be conveniently carried out, and the quality of the produced circuit board is good.

Referring to fig. 1-4, in some embodiments of the present invention, the circuit board is one of a flexible circuit board, a printed circuit board.

The processing method of the covering film on the circuit board can be applied to the flexible circuit board and the printed circuit board, and the characteristic of the circuit board can be modified according to the actual situation on the basis of the method.

Referring to fig. 1 to 4, in some embodiments of the present invention, the circuit board is one of a single-layer board, a double-sided board, and a multi-layer board.

While the circuit boards shown in fig. 2 to 4 are double-sided boards, in other embodiments of the present invention, the circuit boards may be single-layer boards, double-sided boards, or multi-layer boards, and the above-mentioned method for processing the film on the circuit board may be adopted as shown in fig. 1.

Referring to fig. 2 to 4, in some embodiments of the present invention, the circuit board after the cutting step includes asubstrate 200, acopper layer 300, and afilm layer 100, wherein thefilm layer 100 includes a gold fingermain area 114 and a goldfinger indicator strip 113.

The circuit board after the cutting step comprises asubstrate 200, acopper layer 300 and afilm layer 100, wherein thesubstrate 200 is an insulator, thecopper layer 300 is mainly used for manufacturing circuit boards, and thefilm layer 100 is an insulating isolation layer and plays a role in isolation and insulation.Film layer 100 includes gold fingermain area 114 and goldfinger indicator strip 113. in double-sided boards and multi-sided boards,film layer 100 may include only gold fingermain area 114 and not goldfinger indicator strip 113.

Referring to fig. 1 to 4, in some embodiments of the present invention, the material of thesubstrate 200 is one of polyester and polyimide.

When the circuit board is a flexible circuit board, the basic material is one of polyester and polyimide, and the polyimide material has non-inflammability, stable geometric dimension, higher tear strength and the capability of bearing welding temperature; polyester, which has physical properties similar to polyimide, has a low dielectric constant and absorbs little moisture.

Referring to fig. 1 to 4, in some embodiments of the present invention, the material of thesubstrate 200 is a transparent material.

When thesubstrate 200 is made of a transparent material, the goldfinger indication strip 113 serves as an alignment mark when the circuit board is connected with other devices, so that the alignment effect is better.

Referring to fig. 1-4, in some embodiments of the invention, the circuit board further includes an ink layer.

The circuit board also comprises an ink layer, and pictures and texts can be printed on the ink layer, so that the management of manufacturers is facilitated, and the effects of propaganda and identification can be achieved.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (10)

Translated fromChinese

1.一种电路板上覆盖膜的处理方法，其特征在于，包括如下步骤：1. a processing method of cover film on a circuit board, is characterized in that, comprises the steps:预处理，对覆盖膜原料进行冲切，得到金手指覆盖膜，所述金手指覆盖膜包括框边、固定条、金手指指示条以及金手指主区，所述金手指指示条的一端连接所述金手指主区，所述金手指指示条的另一端连接所述框边，所述金手指主区通过固定条连接所述框边；Pretreatment, punching the cover film raw material to obtain a golden finger cover film, the golden finger cover film includes a frame edge, a fixing strip, a golden finger indicating strip and a golden finger main area, and one end of the golden finger indicating strip is connected to the the gold finger main area, the other end of the gold finger indicator bar is connected to the frame edge, and the gold finger main area is connected to the frame edge through a fixing bar;贴膜，把所述金手指覆盖膜贴在所述电路板上；sticking film, and sticking the gold finger cover film on the circuit board;裁切，切断所述金手指主区与所述固定条的连接处，切断所述金手指指示条与所述框边的连接处。Cutting, cutting off the connection between the gold finger main area and the fixing strip, and cutting off the connection between the gold finger indicator strip and the frame edge.2.根据权利要求1所述的一种电路板上覆盖膜的处理方法，其特征在于，在所述预处理步骤中，所述固定条有四条。2 . The method for processing a cover film on a circuit board according to claim 1 , wherein in the preprocessing step, there are four fixing bars. 3 .3.根据权利要求1所述的一种电路板上覆盖膜的处理方法，其特征在于，在所述裁切步骤中，先切断所述金手指主区与所述固定条的连接处，再切断所述金手指指示条与所述框边的连接处；或者先切断所述金手指指示条与所述框边的连接处，再切断所述金手指主区与所述固定条的连接处；或者同时切断所述金手指主区与所述固定条的连接处以及所述金手指指示条与所述框边的连接处。3 . The method for processing a cover film on a circuit board according to claim 1 , wherein in the cutting step, the connection between the main area of the gold finger and the fixing strip is first cut off, and then 3 . Cut off the connection between the golden finger indicator strip and the frame edge; or cut off the connection between the golden finger indicator strip and the frame edge first, and then cut off the connection between the golden finger main area and the fixing strip ; or at the same time cut off the connection between the gold finger main area and the fixing strip and the connection between the gold finger indicator strip and the frame edge.4.根据权利要求1所述的一种电路板上覆盖膜的处理方法，其特征在于，在所述贴膜步骤中，把预处理好的所述覆盖膜对位所述电路板的金手指。4 . The method for processing a cover film on a circuit board according to claim 1 , wherein in the film attaching step, the pretreated cover film is aligned with the gold fingers of the circuit board. 5 .5.根据权利要求1所述的一种电路板上覆盖膜的处理方法，其特征在于，所述电路板是柔性电路板。5 . The method for processing a cover film on a circuit board according to claim 1 , wherein the circuit board is a flexible circuit board. 6 .6.根据权利要求1所述的一种电路板上覆盖膜的处理方法，其特征在于，所述电路板是单层板、双面板、多层板中的一种。6 . The method for processing a cover film on a circuit board according to claim 1 , wherein the circuit board is one of a single-layer board, a double-layer board, and a multi-layer board. 7 .7.根据权利要求1所述的一种电路板上覆盖膜的处理方法，其特征在于，经所述裁切步骤之后的电路板包括基板、铜层以及膜层，所述膜层包括所述金手指主区以及所述金手指指示条。7 . The method for processing a cover film on a circuit board according to claim 1 , wherein the circuit board after the cutting step comprises a substrate, a copper layer and a film layer, and the film layer includes the The gold finger main area and the gold finger indicator strip.8.根据权利要求7所述的一种电路板上覆盖膜的处理方法，其特征在于，所述基板的材料为聚酯、聚酰亚胺中的一种。8 . The method for processing a cover film on a circuit board according to claim 7 , wherein the material of the substrate is one of polyester and polyimide. 9 .9.根据权利要求7所述的一种电路板上覆盖膜的处理方法，其特征在于，所述基板的材料为透明材料。9 . The method for processing a cover film on a circuit board according to claim 7 , wherein the material of the substrate is a transparent material. 10 .10.根据权利要求7所述的一种电路板上覆盖膜的处理方法，其特征在于，所述电路板还包括油墨层。10 . The method for processing a cover film on a circuit board according to claim 7 , wherein the circuit board further comprises an ink layer. 11 .

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