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CN112046932B - Maintenance storage device and temperature and humidity control method thereof - Google Patents

Maintenance storage device and temperature and humidity control method thereof
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Publication number
CN112046932B
CN112046932BCN202010681291.0ACN202010681291ACN112046932BCN 112046932 BCN112046932 BCN 112046932BCN 202010681291 ACN202010681291 ACN 202010681291ACN 112046932 BCN112046932 BCN 112046932B
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box
curing
humidity
temperature
storage device
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CN112046932A (en
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高俊岭
黄日升
魏先来
卢汉华
孙健
邢志刚
王以慧
张富强
代由庆
张斌
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Etsong Qingdao Industrial Co ltd
Guangdong Fuxin Electronic Technology Co ltd
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Etsong Qingdao Industrial Co ltd
Guangdong Fuxin Electronic Technology Co ltd
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Abstract

Translated fromChinese

本发明涉及一种养护储藏装置及其温湿度控制方法,养护储藏装置包括养护箱、温度调节机构及湿度调节机构。温度调节机构能对养护箱内的温度进行调节,湿度调节机构能对养护箱内的湿度进行调节,从而能实现养护箱内的环境处于恒温恒湿的状态,保证较好的养护效果。由于温度调节机构与湿度调节机构均设置于养护箱的侧壁上,位置设置较为合理,占用空间尺寸较小,能有利于减小养护储藏装置的体积尺寸。另一方面,半导体制冷件的尺寸较小,一定程度地减小了温度调节机构的体积尺寸,进而能有利于减小养护储藏装置的体积尺寸,便于携带。

The present invention relates to a curing and storage device and a method for controlling temperature and humidity thereof. The curing and storage device comprises a curing box, a temperature regulating mechanism and a humidity regulating mechanism. The temperature regulating mechanism can regulate the temperature in the curing box, and the humidity regulating mechanism can regulate the humidity in the curing box, so that the environment in the curing box can be kept at a constant temperature and humidity, thereby ensuring a better curing effect. Since the temperature regulating mechanism and the humidity regulating mechanism are both arranged on the side wall of the curing box, the position arrangement is relatively reasonable, the occupied space size is relatively small, and it can be helpful to reduce the volume size of the curing and storage device. On the other hand, the size of the semiconductor refrigeration component is relatively small, which reduces the volume size of the temperature regulating mechanism to a certain extent, and thus can be helpful to reduce the volume size of the curing and storage device, making it easy to carry.

Description

Maintenance storage device and temperature and humidity control method thereof
Technical Field
The invention relates to the technical field of storage equipment, in particular to a maintenance storage device and a temperature and humidity control method thereof.
Background
With the improvement of living standard of people, the number of people sucking tobacco products is increased. Tobacco products are, for example, cigars and cigarettes, etc., and cigars are described herein as examples. Generally, after cigar production, the cigar is cured and cured for a period of time under the environment of proper temperature (16-20 ℃) and proper relative humidity (60-70%), and the cigar taste is mellow and suitable for people to suck. There is therefore an increasing demand for equipment for storing cigars. The traditional cigar curing storage device comprises a storage cabinet and a temperature and humidity adjusting mechanism arranged in the storage cabinet, and although the temperature and humidity in the storage cabinet can be adjusted, the traditional cigar curing storage device is large in structural size, heavy in weight and inconvenient to carry.
Disclosure of Invention
Based on the above, it is necessary to overcome the defects of the prior art, and to provide a maintenance storage device and a temperature and humidity control method thereof, which can realize temperature and humidity adjustment in a maintenance box, and has small volume and portability.
The maintenance storage device comprises a maintenance box, a temperature adjusting mechanism, a humidity adjusting mechanism and a humidity adjusting mechanism, wherein the temperature adjusting mechanism is arranged on the side wall of the maintenance box and comprises a semiconductor refrigerating piece, a first radiating piece, a second radiating piece, a first radiating fan and a second radiating fan, one end face of the semiconductor refrigerating piece is connected with the first radiating piece, the other end face of the semiconductor refrigerating piece is connected with the second radiating piece, the first radiating fan and the first radiating piece are positioned on the outer wall of the maintenance box, the first radiating fan is used for blowing air to the first radiating piece, the second radiating piece and the second radiating fan are positioned on the inner wall of the maintenance box, the second radiating fan is used for blowing air to the second radiating piece, the humidity adjusting mechanism is arranged on the inner wall of the maintenance box and is used for adjusting the relative humidity in the maintenance box.
The maintenance storage device is characterized in that the temperature adjusting mechanism can adjust the temperature in the maintenance box, and the humidity adjusting mechanism can adjust the humidity in the maintenance box, so that the environment in the maintenance box can be in a constant temperature and humidity state, and a good maintenance effect is ensured. In addition, because the temperature regulating mechanism adopts the semiconductor refrigerating piece, on one hand, the semiconductor refrigerating piece can realize refrigeration, the cold energy is transferred to the second radiating piece, the second radiating piece brings the cold energy on the second radiating piece into the curing box to reduce the temperature of the curing box, after the semiconductor refrigerating piece is switched to input positive polarity and negative polarity, the semiconductor refrigerating piece can realize heating, the heat is transferred to the second radiating piece, the heat on the second radiating piece is brought into the curing box by the second radiating fan to improve the temperature of the curing box, on the other hand, the size of the semiconductor refrigerating piece is smaller, the size of the temperature regulating mechanism is reduced to a certain extent, and the semiconductor refrigerating piece is favorable for reducing the size of the curing device and is convenient to carry.
The temperature and humidity control method of the maintenance storage device comprises the following steps:
acquiring the relative humidity and the temperature in the curing box;
When the temperature and the relative humidity are not in accordance with the preset range, the temperature in the curing box is adjusted to reach the preset range, and then the relative humidity is adjusted to reach the preset range.
According to the temperature and humidity control method of the maintenance storage device, the two parameters of the box inner cavity temperature and the relative humidity are correlated, namely, the temperature adjustment affects the humidity change, so that the temperature adjustment is performed in preference to the humidity control, namely, the temperature adjustment is finished first, the temperature of the box inner cavity is controlled in a required temperature range (for example, 16-20 ℃), the temperature of the box inner cavity meets the requirement, the humidity control is finished, and therefore the humidity adjustment (humidification/dehumidification) does not affect or affects the temperature in the box least.
Drawings
FIG. 1 is a schematic view of a maintenance storage device according to an embodiment of the present invention;
fig. 2 is a schematic view of a structure of a curing storage device according to an embodiment of the present invention when a cover is opened;
FIG. 3 is an exploded view of a maintenance and storage device according to an embodiment of the present invention;
FIG. 4 is a view angle structure diagram of a curing box of a curing storage device according to an embodiment of the present invention after being hidden;
FIG. 5 is a view of another view of the curing box of the curing storage device according to an embodiment of the present invention after being hidden;
FIG. 6 is a view of a curing box of a curing storage device according to an embodiment of the present invention after being hidden;
FIG. 7 is a schematic view of a temperature adjusting mechanism of a maintenance storage device according to an embodiment of the present invention;
Fig. 8 is a schematic diagram of a temperature adjusting mechanism according to an embodiment of the invention, in which a first heat dissipating fan and a second heat dissipating fan are removed;
Fig. 9 is an exploded view of the temperature adjusting mechanism according to an embodiment of the present invention, with the first and second heat dissipating fans removed;
Fig. 10 is a schematic structural view of a humidifying adjustment assembly and a humidifying system cover of a maintenance storage device according to an embodiment of the present invention;
FIG. 11 is a schematic view of a humidifying adjustment assembly of a maintenance and storage device according to an embodiment of the present invention after being mounted on a humidifying system cover;
FIG. 12 is a schematic view of a dehumidifying adjusting assembly and a dehumidifying system cover of a maintenance storage device according to an embodiment of the present invention;
FIG. 13 is a schematic view showing a view angle structure of a dehumidifying adjusting component of a maintenance storage device according to an embodiment of the present invention mounted on a dehumidifying system casing;
FIG. 14 is a schematic view showing another view angle structure of a dehumidifying adjusting component of a maintenance storage device according to an embodiment of the present invention mounted on a dehumidifying system casing;
fig. 15 is a schematic view of a cigar rack in a curing and storing device according to an embodiment of the invention;
FIG. 16 is a cross-sectional view of a curing storage device according to an embodiment of the present invention;
FIG. 17 is a cross-sectional view of a curing storage device according to an embodiment of the present invention;
FIG. 18 is a graph showing the relationship between UTEC and time t in a first control mode when the temperature of the maintenance storage device is required to be increased according to an embodiment of the present invention;
FIG. 19 is a graph showing the relationship between T and time T in a first control mode when the temperature of the maintenance and storage device is required to be increased according to an embodiment of the present invention;
FIG. 20 is a graph showing the relationship between UTEC and time t in a second control mode when the temperature of the maintenance storage device is required to be increased according to an embodiment of the present invention;
FIG. 21 is a graph showing the relationship between T and time T in a second control mode when the temperature of the maintenance and storage device is required to be increased according to an embodiment of the present invention;
Fig. 22 is a control graph of UTEC and T when the maintenance storage device according to an embodiment of the present invention requires a temperature decrease.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
As the relative humidity in the curing box is smaller in the adjusting process, the relative humidity of the environment of each part in the curing box is adjusted more uniformly, and the inner cavity environment of the curing box with uniformly distributed humidity is more beneficial to cigar storage and curing processes.
In view of this, referring to fig. 1 and 2, fig. 1 shows a schematic structure of a curing storage device according to an embodiment of the invention, and fig. 2 shows a schematic structure of a curing storage device according to an embodiment of the invention when a cover of the curing storage device is opened. The maintenance storage device provided by one embodiment of the invention comprises a maintenance box 10, a temperature adjusting mechanism 20 and a humidity adjusting mechanism.
Referring to fig. 3 and 7 in combination, fig. 3 is an exploded view of a curing storage device according to an embodiment of the invention, and fig. 7 is a schematic view of a temperature adjusting mechanism in the curing storage device according to an embodiment of the invention. The temperature adjusting mechanism 20 is provided on a side wall of the curing box 10. The temperature adjustment mechanism 20 includes a semiconductor cooling member 21 (shown in fig. 9), a first heat dissipation member 22, a second heat dissipation member 23, a first heat dissipation fan 24, and a second heat dissipation fan 25. One end surface of the semiconductor refrigeration piece 21 is connected with the first heat dissipation piece 22, and the other end surface of the semiconductor refrigeration piece 21 is connected with the second heat dissipation piece 23. The first heat dissipation fan 24 and the first heat dissipation element 22 are located on the outer wall of the curing box 10. The first heat dissipation fan 24 is used to blow wind toward the first heat dissipation element 22. The second heat dissipation element 23 and the second heat dissipation fan 25 are located on the inner wall of the curing box 10, and the second heat dissipation fan 25 is used for blowing wind to the second heat dissipation element 23. The humidity adjusting mechanism is arranged on the inner wall of the curing box 10 and is used for adjusting the relative humidity in the curing box 10.
The temperature regulation mechanism 20 can regulate the temperature in the curing box 10, and the humidity regulation mechanism can regulate the humidity in the curing box 10, so that the environment in the curing box 10 can be in a constant temperature and humidity state, and a good curing effect is ensured. In addition, the temperature regulating mechanism 20 and the humidity regulating mechanism are arranged on the side wall of the curing box 10, the position arrangement is reasonable, the occupied space is small, the size of the curing storage device can be reduced, the temperature regulating mechanism 20 adopts the semiconductor refrigerating piece 21, on one hand, the semiconductor refrigerating piece 21 can realize refrigeration, the cold energy is transferred to the second radiating piece 23, the second radiating fan 25 brings the cold energy on the second radiating piece 23 into the curing box 10 to reduce the temperature of the curing box 10, after the semiconductor refrigerating piece 21 is switched to input positive polarity and negative polarity, the semiconductor refrigerating piece 21 can realize heating, the heat energy is transferred to the second radiating piece 23, the second radiating fan 25 brings the heat energy on the second radiating piece 23 into the curing box 10 to improve the temperature of the curing box 10, on the other hand, the size of the semiconductor refrigerating piece 21 is small, the size of the temperature regulating mechanism 20 is reduced to a certain extent, the size of the curing storage device can be reduced, and the curing storage device is convenient to carry.
The refrigerator 11 can be realized by applying direct current to the TEC (Thermo Electric Cooler, the semiconductor refrigerating element 21) by using the Peltier effect of the semiconductor refrigerating material. By changing the polarity of the TEC input voltage, namely changing the current direction of the TEC, the heating function of the box 11 can be realized under the condition of not changing the structure.
Of course, in another embodiment, the switching between the cooling function and the heating function of the temperature adjusting mechanism 20 is not implemented by switching the polarity of the input voltage of the TEC, and the temperature adjusting mechanism 20 may also be implemented by a composite structure of TEC cooling and PTC (PTC is a positive temperature coefficient thermistor, whose material properties should belong to semiconductors) heating, i.e. the PTC is connected to the cold end refrigerator of the TEC, and only the TEC is powered on during cooling, the PTC is powered off, and the TEC is powered on during heating.
Referring to fig. 1 to 3, the maintenance storage device further includes a first sensor 30 (as shown in fig. 13), a controller 41 and a display 42. The first sensor 30 is used for acquiring temperature and humidity information in the curing box 10, and the first sensor 30 is electrically connected with the controller 41. The controller 41 is electrically connected to the display 42, and the display 42 is used for displaying temperature and humidity information in the curing box 10. The controller 41 is also electrically connected to the temperature adjusting mechanism 20 and the humidity adjusting mechanism. On the one hand, the temperature and humidity information in the maintenance box 10 is timely displayed through the display 42, so that the environment information in the maintenance box 10 can be conveniently mastered, and on the other hand, if the temperature and humidity in the maintenance box 10 do not meet the requirements, the temperature adjusting mechanism 20 and the humidity adjusting mechanism are controlled by the controller 41 to be timely adjusted, so that the temperature and humidity in the maintenance box 10 meet the requirements.
Referring to fig. 1 and 2, in one embodiment, the curing box 10 includes a box 11 and a cover 12 rotatably disposed on the box 11. The case 11 includes a bottom plate 111 and a first side plate 112 connected to the bottom plate 111.
Referring to fig. 2 and 3, specifically, a support plate 113 is connected to a side of the first side plate 112 away from the bottom plate 111. One side of the cover 12 is rotatably connected with the support plate 113, and one side of the cover 12 is provided with a notch 121 corresponding to the display 42. The display 42 is mounted on the support plate 113, and when the cover 12 is covered on the case 11, the display 42 is located at the notch 121. In this way, whether the cover 12 is in the state of being opened by rotation or in the state of being closed by rotation to the case 11, the temperature and humidity information in the curing case 10 can be observed and grasped by the display 42. Specifically, the shape of the notch 121 is adapted to the shape of the display 42. In addition, the display 42 is not only used for displaying temperature and humidity information, but also provided with a key, and the temperature and humidity information can be set by the key. Optionally, the display 42 is a touch screen.
Optionally, a hinge connection is used between the cover 12 and the case 11. The cover 12 is connected with the box 11 by a damping hinge, for example, so that the cover 12 can be closed and opened at multiple angles, and the use is convenient.
Referring to fig. 3 and 7, further, the temperature adjusting mechanism 20 is disposed on the first side plate 112. In this way, the first heat dissipating fan 24 and the first heat dissipating member 22 are located on the outer wall of the first side plate 112, the second heat dissipating member 23 and the second heat dissipating fan 25 are located on the inner wall of the first side plate 112, and the supporting plate 113 connected to the first side plate 112 can be designed to be wide enough to a certain extent, so that the display 42 can be installed on one hand, and on the other hand, the protection device on the top surfaces of the first heat dissipating fan 24 and the first heat dissipating member 22 is equivalent, so that the whole maintenance storage device is smaller in size.
Referring to fig. 3 and 7, the maintenance storage device further includes a first protection cover 60. The first protection cover 60 is disposed outside the curing box 10 and covered on the first side plate 112, the first cooling fan 24 and the first cooling member 22 are located in the first protection cover 60, and the first protection cover 60 is provided with a first ventilation opening 61. Specifically, there are at least two first vents 61 on the first protection cover 60, where one first vent 61 is used for air intake, and the other first vent 61 is used for air outlet. In this way, the first protection cover 60 can prevent the first cooling fan 24 and the first cooling member 22 from being exposed, and protect the first cooling fan 24 and the first cooling member 22, and in addition, when the first cooling fan 24 works, the first cooling fan 24 sucks the air flow outside the first protection cover 60 into the first protection cover 60 through one of the first ventilation openings 61, and then discharges the air flow through the other first ventilation opening 61 on the first protection cover 60 after cooling or cooling the first cooling member 22.
Referring to fig. 4 to 7, fig. 4 to 6 respectively illustrate different view angle structural diagrams of the curing storage device after the curing box is hidden in an embodiment. Likewise, the curing storage device also includes a second shield 70. The second protective cover 70 is disposed inside the curing box 10 and covered on the first side plate 112, the second cooling fan 25 and the second cooling member 23 are disposed in the second protective cover 70, and the second protective cover 70 is provided with a second ventilation opening 71. Specifically, the number of the second air openings 71 on the second protective cover 70 is at least two, wherein one second air opening 71 is used for air intake, and the other second air opening 71 is used for air outlet. In this way, the second protection cover 70 can prevent the second cooling fan 25 and the second cooling member 23 from being exposed, and protect the second cooling fan 25 and the second cooling member 23, and in addition, when the second cooling fan 25 works, the second cooling fan 25 sucks the air flow outside the second protection cover 70 into the second protection cover 70 through one of the second air inlets 71, and then discharges the air flow through the other second air inlet 71 on the second protection cover 70 after cooling or radiating the second cooling member 23.
Specifically, the first cooling fan 24 and the first cooling member 22 are located on the outer wall of the curing box 10, which means that the first cooling fan 24 and the first cooling member 22 are located on a side surface of the first side plate 112 facing the first protection cover 60.
Referring to fig. 3, 8 and 9, fig. 8 is a schematic diagram showing a structure of the temperature adjusting mechanism 20 with the first heat dissipating fan 24 and the second heat dissipating fan 25 removed, and fig. 9 is an exploded schematic diagram showing a structure of the temperature adjusting mechanism with the first heat dissipating fan and the second heat dissipating fan removed. Further, the maintenance storage device further comprises a cold guide 26 and a heat insulation sleeve 27. The first side plate 112 is provided with a through hole 114, the heat insulating sleeve 27 is arranged at the through hole 114, the cold conducting member 26 is arranged in the heat insulating sleeve 27, and the cold conducting member 26 is arranged between the semiconductor refrigerating member 21 and the second heat radiating member 23. In this way, the cold guide 26 and the heat insulating jacket 27 can facilitate the transfer of heat or cold from the semiconductor refrigeration unit 21 to the second heat sink 23, while avoiding the transfer of heat or cold to the side walls of the case 11.
Referring to fig. 8 and 9, the heat insulation sleeve 27 is mainly used for heat insulation between cold and hot parts of the temperature adjusting mechanism 20 to reduce heat loss. In order to reduce the thickness of the body of the temperature adjusting mechanism 20, the first cooling fan 24 and the second cooling fan 25 are preferably centrifugal fans to strengthen heat exchange, and axial fans to strengthen heat exchange can be adopted.
Referring to fig. 8 and 9, specifically, the heat insulation sleeve 27 includes a frame sleeve 271 sleeved outside the cold guide 26, and a heat insulation sleeve 272 sleeved outside the frame sleeve 271. The skeleton sleeve 271 is not limited, and may be, for example, a plastic sleeve, a rubber sleeve, a wooden sleeve, an iron sleeve, or the like. The insulating cover 272 is specifically, for example, a protective cotton, and is not limited as long as it can perform an insulating function.
Referring to fig. 3 and 7, in one embodiment, the first heat sink 22 is an aluminum heat sink or a copper heat sink. The second heat sink 23 is an aluminum heat sink or a copper heat sink. The controller 41 includes a control circuit board disposed on the first side board 112 and located on the air outlet side of the first cooling fan 24. In this way, the first heat dissipating fan 24 dissipates heat not only from the first heat dissipating member 22 but also from the control circuit board, and takes away heat generated on the control circuit board. In addition, the first heat dissipation element 22 and the second heat dissipation element 23 adopt aluminum heat dissipation fins or copper heat dissipation fins, so that heat conduction can be performed rapidly, and a good heat dissipation or cooling effect is achieved. Specifically, the first heat dissipation element 22 and the control circuit board are sequentially disposed on the air outlet path of the first heat dissipation fan 24, that is, the air blown by the first heat dissipation fan 24 sequentially passes through the first heat dissipation element 22 and the control circuit board and then is discharged outwards, so as to dissipate heat of the first heat dissipation element 22 and the control circuit board sequentially. In addition, the maintenance storage device also includes a power supply 28. A power supply 28 is disposed within the first enclosure 60, the power supply 28 powering all electrical components within the care storage.
Referring to fig. 2 and 3, in one embodiment, the case 11 further includes a second side plate 115, a third side plate 116, and a fourth side plate 117 connected to the bottom plate 111. The first side plate 112 is disposed opposite to the fourth side plate 117, and the second side plate 115 is disposed opposite to the third side plate 116. The two ends of the first side plate 112 are respectively connected with the second side plate 115 and the third side plate 116, and the two ends of the fourth side plate 117 are respectively connected with the second side plate 115 and the third side plate 116. That is, the case 11 has a rectangular parallelepiped shape or a square shape. Of course, the case 11 may have other shapes, and is not limited.
Referring to fig. 2 and 3, the humidity adjusting mechanism further includes a humidity adjusting assembly 80 and a dehumidification adjusting assembly 90. It should be noted that, the humidification adjustment assembly 80 and the dehumidification adjustment assembly 90 may be provided independently or may be integrated. The following will describe in detail an example of a structure in which the two structures are independent of each other. Further, the humidification adjustment assembly 80 is disposed on the second side plate 115, and the dehumidification adjustment assembly 90 is disposed on the third side plate 116. In this way, since the humidification adjusting assembly 80 and the dehumidification adjusting assembly 90 are provided on the second side plate 115 and the third side plate 116, respectively, on the one hand, the mutual influence of both can be reduced, and on the other hand, the overall size of the maintenance storage device can be reduced.
Referring to fig. 2, 10 and 11, fig. 10 is a schematic structural view of a humidifying adjustment assembly and a humidifying system cover of a maintenance storage device according to an embodiment, and fig. 11 is a schematic structural view of a humidifying adjustment assembly of a maintenance storage device according to an embodiment after being mounted on a humidifying system cover. In one embodiment, humidification adjustment assembly 80 includes an atomizing humidification assembly 81, an evaporation assembly 82, and a humidification fan 83. The atomizing and humidifying assembly 81 is provided with a humidifying airflow output. The evaporation assembly 82 includes an evaporation shell 821 and a water molecule attachment body disposed in the evaporation shell 821, where the evaporation shell 821 is provided with two first air inlets 822 and first air outlets (not labeled), and one of the first air inlets 822 is communicated with the humidifying airflow output end. The air outlet of the humidifying fan 83 is in butt joint with the other first air inlet 822, and the humidifying fan 83 is used for discharging the evaporation air flow in the evaporation shell 821 into the curing box 10 through the first air outlet.
When it is determined that the relative humidity in the curing box 10 is low (for example, lower than 60%) and humidification is required, the atomization humidification assembly 81 is turned on, the atomization humidification assembly 81 sends the humidified atomized water molecule gas flow into the evaporation shell 821 through the humidification gas flow output end, atomized water molecules are attached to the water molecule attachment body, the water molecule attachment body is used for absorbing the atomized water molecules, and the atomized water molecules are prevented from directly entering the inner cavity of the curing box 10. After the atomizing and humidifying module 81 stops working, the humidifying fan 83 is started again, and the air flow generated by the humidifying fan 83 is utilized to carry out secondary evaporation on water molecules adsorbed on the water molecule attachment body, and the water molecules are sent into the box along with the air flow generated by the humidifying fan 83, so that the humidity in the box is improved. In addition, the diameter of molecular groups in air is effectively reduced while the humidity of air flow in the curing box 10 is improved, the diameter of water molecules in air in the curing box 10 is smaller, and the water molecules are easy to uniformly diffuse into the curing box 10, so that the humidity in the curing box 10 is regulated more uniformly, and the curing effect can be improved.
Referring to fig. 10 and 11, further, the atomizing and humidifying assembly 81 includes a water box 811, a humidifier and a nozzle 813. The humidifier includes a humidification housing 812 in communication with the water box 811, and an atomizing sheet provided in the humidification housing 812. Humidification housing 812 is connected to a shower nozzle 813. The nozzle 813 is in communication with the first air inlet 822. Specifically, the humidifier is an ultrasonic humidifier, and the ultrasonic humidifier further includes an ultrasonic generator, which is integrally provided in the controller, for example, and may be provided separately. The ultrasonic generator is utilized to enable the atomizing sheet to generate high-frequency vibration, water which is led into the atomizing sheet by the water box 811 in the high-frequency vibration process of the atomizing sheet is thrown away from the water surface to generate elegant water mist, and the water mist is sprayed into the evaporation shell 821 through the spray nozzle 813.
In one embodiment, the water molecule attachments are silver ions or nanomaterial bodies. The silver ion substance and the nano material body have better adsorption and atomization of water molecules, and the effect of secondary evaporation is realized. In the embodiment, the water molecule attachment is silver ion, so that the water molecule attachment not only can effectively adsorb atomized water molecules, but also has a sterilization effect.
Further, the water molecule attachment is a silver ion particle or a nanoparticle. In this way, when silver ion particles or nano particles are installed in the evaporation shell 821, an air flow gap is formed between the particles, and after the humidified atomized water molecule air flow enters the evaporation shell 821, on one hand, the atomized water molecule contact with the outer surface of the particles and is adsorbed by the outer surface of the particles can be facilitated, on the other hand, the water molecule adhesion body installed in the evaporation shell 821 has a certain blocking effect on the atomized water molecule air flow, but can be discharged to the inner cavity of the curing box 10 through the first air outlet of the evaporation shell 821 under the action of the humidifying fan 83.
In one embodiment, vaporization housing 821 is a silver ion cartridge or a nanomaterial cartridge. In this way, after the atomized water molecules enter the evaporation case 821, the atomized water molecules can be adsorbed not only by the water molecule attached body but also by the inner wall of the evaporation case 821. In this embodiment, the evaporation housing 821 is a silver ion cartridge.
Referring to fig. 2, 10 and 11, the humidity adjusting mechanism further includes a second sensor 51 and a humidification system cover 52. The controller includes a prompter. The humidification system cover 52 is provided with a second air outlet 521 and a second air inlet 522, the humidification adjusting assembly 80 is disposed in the humidification system cover 52, and the air inlet of the humidification fan is disposed corresponding to the second air inlet 522. The first air outlet is disposed corresponding to the second air outlet 521, and the first air outlet directly discharges the humidified gas to the outside through the second air outlet 521. In one embodiment, atomizing and humidifying assembly 81, evaporating assembly 82, and humidifying fan 83 are housed within humidification system housing 52. Specifically, the silver ion cartridge of the evaporation assembly 82 is removably mounted within the humidification system housing 52, which facilitates removal of the silver ion cartridge for replacement of silver ion particles. Of course, the silver ion cartridge may be integrated with the humidification system housing 52, or may be separately designed and placed inside the humidification system housing 52, and is not limited thereto.
Referring to fig. 2, 10 and 11, the water box 811 may be designed independently, for example, fastened to the humidification system housing 52 by a snap-fit method, or integrated directly with the humidification system housing 52. In this embodiment, the water box 811 can be independently designed, and is convenient to detach, move and fill water. The upper part of the water box 811 is provided with a water filling port for filling water into the water box 811, and the water filling port is provided with a sealing piece 814 such as a rubber plug for sealing the water box 811 after water filling is completed, so that the water sealing requirement of a humidifying mechanism of the maintenance storage device in the portable moving process is met. In order to improve the water atomization effect and prolong the service life of the atomization sheet, the water in the water box 811 is preferably purified water or distilled water.
Referring to fig. 2, 10 and 11, further, the second sensor 51 is disposed at the second air outlet 521, and the second sensor 51 is configured to obtain the relative humidity at the second air outlet 521. The prompter is used for prompting when the difference value of the relative humidity acquired by the second sensor 51 is smaller than a preset value. Further, the prompter is specifically an alarm or a display, and the alarm is used for alarming when the difference value of the relative humidity obtained by the second sensor 51 is smaller than a preset value. The display is used for displaying when the difference value of the relative humidity acquired by the second sensor 51 is smaller than a preset value.
The second sensor 51 may be disposed at the second air outlet 521 or at a position adjacent to the second air outlet 521 in order to obtain the relative humidity of the air discharged from the second air outlet 521.
Referring to fig. 12 to 14, fig. 12 is a schematic structural view showing a dehumidifying adjusting component of a maintenance storage device and a dehumidifying system cover according to an embodiment, fig. 13 is a schematic structural view showing a dehumidifying adjusting component of a maintenance storage device mounted on a dehumidifying system cover according to an embodiment, and fig. 14 is a schematic structural view showing a dehumidifying adjusting component of a maintenance storage device mounted on a dehumidifying system cover according to another embodiment. In one embodiment, the dehumidification regulation assembly 90 includes a dehumidification box 91 and a dehumidification fan 92. Dehumidifying objects are arranged in the dehumidifying box 91, the dehumidifying box 91 is provided with a third air inlet and a third air outlet, the air outlet of the dehumidifying fan 92 is in butt joint with the third air inlet, and the dehumidifying fan 92 is used for sucking air flow in the maintenance box 10 (shown in fig. 2) into the dehumidifying box 91. Specifically, the dehumidifying fan 92 is electrically connected to the controller 41.
Referring to fig. 12 to 14, in one embodiment, the humidity adjustment mechanism further includes a dehumidification system housing 53 and a third sensor 56. The dehumidifying system casing 53 is provided with a fourth air inlet 531 and a fourth air outlet 532. The dehumidification regulation assembly 90 is disposed within the dehumidification system housing 53. The third sensor 56 is disposed at the fourth air outlet 532 for acquiring the relative humidity at the fourth air outlet 532. Specifically, the alarm is further configured to perform an alarm action when the difference in relative humidity obtained by the third sensor 56 is smaller than a preset value.
The third sensor 56 is capable of sensing the humidity of the air processed by the dehumidifying box 91, and is mainly used for judging whether the adsorption capacity of the dehumidified objects in the dehumidifying box 91 is invalid. A specific judging method is that the difference between the humidity sensing values is judged to be twice at a preset time interval (for example, 60 s), and when the difference is smaller than a certain value (for example, 10 percent, the value depends on the precision of a humidity sensor), the water absorption characteristics of the dehumidified objects in the dehumidification box 91 are considered to be invalid, and the controller 41 controls the alarm to act so as to alarm and replace the dehumidified objects in the dehumidification box 91. Alternatively, in order to facilitate replacement of the dehumidified objects in the dehumidification box 91, the dehumidification box 91 is detachably fixed to the dehumidification system housing 53 by, for example, a snap-fit structure.
The third sensor 56 may be disposed at another position, for example, on the adjacent side of the circulation fan 54 as shown in fig. 14, and after the circulation fan 54 sucks the dehumidified air into the dehumidification system cover 53, the third sensor 56 senses the humidity of the air processed by the dehumidification box 91 to determine whether the adsorption capacity of the dehumidified object in the dehumidification box 91 is out of order.
Referring to fig. 2, 16 and 17, fig. 16 shows a cross-sectional view of one position of the curing storage device according to an embodiment, and fig. 17 shows a cross-sectional view of another position of the curing storage device according to an embodiment. In one embodiment, curing box 10 includes an inner wall panel 13, an outer wall panel 14, and an insulation layer 15 disposed between inner wall panel 13 and outer wall panel 14. Thus, the insulation effect of the curing box 10 is good.
In order to reduce the thickness between the inner wall plate 13 and the outer wall plate 14, increase the effective volume of the inner cavity, ensure the heat insulation performance, and increase a VIP (Vacuum Insulation Panel vacuum insulation panel) plate, a polyurethane foam plate or a VIP and polyurethane composite structure plate on the heat insulation layer 15, so as to play a role in strengthening heat insulation.
Further, the bottom of the inner wall plate 13, the bottom of the heat insulating layer 15, and the bottom of the outer wall plate 14 form the bottom plate 111, and four sides of the inner wall plate 13, four sides of the heat insulating layer 15, and four sides of the outer wall plate 14 are disposed in one-to-one correspondence to form the first side plate 112, the second side plate 115, the third side plate 116, and the fourth side plate 117, respectively.
Referring to fig. 1 and 2, further, the curing box 10 is provided with a handle assembly 16, and the handle assembly 16 is mainly used for lifting the curing box 10 during the moving process. In addition, a switch lock 17 for opening and closing the locking case 11 and the cover 12 is provided on the handle assembly 16. To ensure privacy, the switch lock 17 is specifically a coded lock, and through setting of a code, the use specificity of the curing box 10 is ensured.
Referring to fig. 2, 4 and 15, fig. 15 is a schematic structural diagram of a cigar rack in a curing storage device according to an embodiment. Further, in order to facilitate the fixing and storage of cigars and to avoid the displacement of cigars during the movement of the curing box 10, a cigar rack 18 is provided inside the curing box 10. For better cigar curing and alcoholization, the cigar rack 18 is made of cedar wood. The cigar rack 18 is fastened to the bottom of the interior of the curing box 10, for example, by means of a self-tapping screw or the like. In order to improve the space utilization, the cigar rack 18 can be divided into an upper layer and a lower layer, and the two layers of cigar racks 18 are connected by a support column 19 with a self-locking spring buckle function. Specifically, four spring-clip holes 181 are respectively provided at four corners of the cigar rack 18, four support columns 19 are provided, and two cigar racks 18 are detachably connected through the four support columns 19. In addition, a plurality of jacks 182 are arranged on the cigar rack 18, and cigars are inserted and fixed in the jacks 182 and taken as required.
In one embodiment, the cigar rack 18 is at least two layers, and the at least two layers of cigar racks 18 are arranged one above the other from top to bottom.
When the space in the inner cavity of the curing box 10 is large, the flow of the air flow in each inner wall and space is enhanced in order to ensure the uniformity of the temperature and humidity distribution in the entire curing box 10. In one embodiment, the maintenance storage device further includes a circulation fan 54. The circulation fan 54 is disposed in the curing box 10, and the circulation fan 54 is electrically connected to the controller 41. In this way, the controller 41 controls the circulation fan 54 to operate, so that the air flow in the curing box 10 circulates and fills the entire curing box 10, which is beneficial to realizing relatively uniform relative humidity in the curing box 10.
Specifically, the second sensor 51 and the alarm are both electrically connected to the controller 41, the controller 41 receives the relative humidity sensed by the second sensor 51 at the second air outlet 521, and if the relative humidity change value at the preset time interval (for example, 60S) is less than the preset value (for example, 10%), the water box 811 is prompted to lack water or the atomizing and humidifying component 81 is in failure, at this time, the atomizing and humidifying component 81 is controlled to stop working, and the water source is replenished or the atomizing and humidifying component 81 is maintained, so that the staff can be timely reminded. If it is determined that the change in relative humidity for the preset time interval (e.g., 60S) is greater than the preset value, the humidifying fan 83 is turned on, and the humidified air flow is circulated into the entire curing box 10 by the humidifying fan 83 to reduce the relative humidity in the entire curing box 10.
It should be noted that the change value of the relative humidity at the preset time interval (e.g., 60S) is the difference between the relative humidity at the second air outlet 521 obtained by the second sensor 51 at, for example, 0S and the relative humidity at the second air outlet 521 obtained by the second sensor at, for example, 60S.
Specifically, the first sensor 30 is a temperature and humidity probe.
Specifically, the second sensor 51 is a temperature and humidity probe, and the second sensor 51 can be used to obtain not only the relative humidity at the second air outlet 521, but also the ambient temperature at the second air outlet 521.
Specifically, the third sensor 56 is a temperature and humidity probe, and the third sensor 56 can not only obtain the relative humidity at the fourth air outlet 532, but also obtain the ambient temperature at the fourth air outlet 532.
Referring to fig. 2 to 4, when the controller 41 determines that the relative humidity in the curing box 10 is high (for example, the relative humidity is greater than 80%), the dehumidifying fan 92 is controlled to operate accordingly, the dehumidifying fan 92 pumps the air with high humidity in the curing box 10 into the dehumidifying box 91, and the dehumidifying box 91 dehumidifies and discharges the air into the curing box 10 to reduce the relative humidity in the curing box 10. Specifically, the dehumidifiers are dry particles, dry powders, etc., and may also be hydrophilic particles such as activated alumina spheres or molecular sieves, etc.
Referring to fig. 2 to 4, further, the circulation fan 54 has an independent air inlet and an independent air outlet. The circulation fan 54 may be provided at the front end or the rear end of the dehumidifying system casing 53, which is not limited thereto. The circulation fan 54 is not controlled by the relative humidity parameters in the curing box 10, and always keeps constant pressure working normally, and the function of the circulation fan is to strengthen the flow of air in the inner cavity of the curing box 10. In the non-dehumidifying mode, the dehumidifying fan 92 does not work, so that the air flow in the curing box 10 does not pass through the dehumidified objects of the dehumidifying box 91, the humidity of the air flow in the curing box 10 does not change, and when the dehumidifying mode is started, the dehumidifying fan 92 works, and the air flow passes through the dehumidifying box 91, so that the relative humidity of the air flow is reduced, and the aim of changing the humidity is fulfilled. Further, the humidifying system cover 52 and the dehumidifying system cover 53 are plastic covers, and are fixed on the inner wall of the box 11 by using self-tapping screws or fastening structures, and the humidifying system cover 52 and the dehumidifying system cover 53 may be made of other materials or be fixed on the inner wall of the curing box 10 by other methods.
Referring to fig. 2, 12 and 13, further, a wind shielding plate 55 is disposed in the dehumidifying system cover 53, the wind shielding plate 55 divides the dehumidifying system cover 53 into two spaces, the dehumidifying box 91 and the dehumidifying fan 92 are disposed in one of the spaces, and the fourth air inlet 531 and the fourth air outlet 532 on the dehumidifying system cover 53 are communicated with the space. The circulation fan 54 is disposed in another space, and the dehumidifying system cover 53 is further provided with a fifth air inlet 533 and a fifth air outlet 534 which are communicated with the other space, and when the circulation fan 54 works, air flow in the curing box 10 enters through the fifth air inlet 533 and is discharged from the fifth air outlet 534, so that the air flow in the curing box 10 can be driven to circularly flow.
Referring to fig. 2 and 3, in one embodiment, a temperature and humidity control method for the curing storage device according to any one of the above embodiments includes the following steps:
acquiring the relative humidity and temperature in the curing box 10;
when the temperature and the relative humidity do not meet the preset range, the temperature in the curing box 10 is adjusted to reach the preset range, and then the relative humidity is adjusted to reach the preset range.
According to the temperature and humidity control method of the maintenance storage device, the temperature in the inner cavity of the box 11 and the relative humidity have correlation, namely, the temperature adjustment affects the humidity change, so that the temperature adjustment is performed in preference to the humidity control, namely, the temperature adjustment is finished first, the temperature in the inner cavity of the box 11 is controlled in a required temperature range (for example, 16-20 ℃), the temperature in the inner cavity of the box 11 meets the requirement, and then the humidity control is finished, so that the humidity adjustment (humidification/dehumidification) does not affect or affects the temperature in the box 11 minimally.
Further, adjusting the temperature in the curing box 10 to reach the preset range specifically includes the following steps:
s110, acquiring the temperature in the curing box 10;
s120, when the temperature in the curing box 10 is judged to be lower than a first set value, the temperature adjusting mechanism 20 is started to heat the curing box 10;
and S130, when the temperature in the curing box 10 is judged to be higher than the second set value, the temperature adjusting mechanism 20 is started to cool the curing box 10.
Taking the preset range of 16 ℃ to 20 ℃ as an example, one specific control embodiment includes the following steps:
The temperature T <15 ℃ or T < Tset (Tset is a temperature set value) in the curing box 10, and the TEC heating mode (heating and cooling are based on the cooling and heating of the inner cavity of the box 11) is started, namely, the polarity of the TEC voltage is controlled, so that the temperature regulating mechanism 20 supplies hot air to the inner cavity of the box 11.
According to the special requirements of cigar curing and uniform alcoholization temperature, the problem that the temperature fluctuation of the inner cavity of the box body 11 is large due to the heat concentration of the air outlet is avoided. Further, TEC operating voltage UTEC employs a small step-up control mode. Specifically, TEC initial voltage UTEC0 is set firstly, (UTEC0 is not less than 0V can be selected), UTEC is gradually increased in a linear manner according to temperature parameters acquired by a temperature sensor arranged at an air inlet, and the increasing rate is 1V/min-6V/min, for example.
There are two control modes at this time:
In the first control manner, UTEC is continuously increased from UTEC0, and in a working condition of a certain working voltage UTEC1≤UTECmax (TEC maximum working voltage, for example, 12V), if t=tset is met, the state of UTEC=UTEC1 is continued until Tset is changed, and the curves of T, UTEC and time T are respectively shown in fig. 18 and 19;
The second control method, from UTEC0 to UTECmax, still cannot meet t=tset, at this time, the state of UTEC1=UTECmax continues until the temperature t≡tset+Δt (Δt=1 to 2 ℃), and the PID control modes are adopted for UTEC and T until the dynamic balance of t≡tset is achieved, and the curves of T, UTEC and time T are shown in fig. 20 and 21, respectively.
When the temperature T in the box is more than 20 ℃ or T is more than Tset, a TEC refrigerating mode is started, namely, the polarity of TEC voltage is controlled to be opposite to that of a heating mode, so that the temperature regulating mechanism 20 can deliver cold air to the inner cavity of the box 11.
As shown in FIG. 22, in the temperature range of Tset-DeltaT to Tset+DeltaT, UTEC -T adopts a PID control mode, UTEC has a certain value UTEC1 between the minimum and maximum cooling capacities of TEC in the range of UTECmin~UTECmax, and when the corresponding cooling capacity and heat leakage capacity of TEC are equal, dynamic balance of cooling capacity and heat is realized, at this time, the temperature in the box is stabilized between Tset-DeltaT to Tset+DeltaT, preferably DeltaT=0.5-1 ℃, namely the temperature in the box is correspondingly controlled at the set temperature Tset + -0.5-Tset + -1 ℃.
For a particular type of use, such as a first initial set temperature of 18 ℃, the tank 11 is stabilized at 18 ℃ by the heating mode. When the temperature regulation system changes the polarity of positive and negative voltage from heating to cooling mode, the difference between 17 ℃ and 18 ℃ is smaller, so that temperature overshoot is usually caused, namely, after the full power cooling process of 18 ℃ is started, the temperature in the tank is delayed from the actual temperature due to the existence of thermal inertia of the temperature in the tank, the temperature in the final tank is always in full power cooling state, so that the temperature in the final tank is lower than 17 ℃, and the temperature regulation system starts to switch to heating mode according to the control program, so that the TEC is continuously switched between heating and cooling modes, temperature fluctuation in the tank is firstly caused, and secondly, the service life and stability of the TEC are reduced due to continuous change of internal stress due to continuous switching of the TEC. Therefore, in order to avoid the generation of the working conditions, a buffer control program is added when the temperature in the box is switched from the heating mode to the refrigerating mode, and one embodiment of the buffer control program is that after the positive and negative polarities of the TEC are switched, the initial working voltage is set to be a part of the full working voltage, such as 50% UTECmax, such as UTECmax =12V, UTEC0 =6V, and the buffer control program is stable for a period of time, such as 30 s-60S, so that the buffer change balance process is provided for the temperature field in the box, and then the TEC working voltage is adjusted to the maximum refrigerating state, namely the full working voltage state, thereby effectively solving the repeated switching problem of the heating-refrigerating mode, and prolonging the service life, the working reliability and the stability of the TEC.
An embodiment of the rotation speed control of the heat dissipation and cooling fan is that the second heat dissipation fan 25 preferably works at a constant voltage, and the working voltage is higher than 12V, and the heat dissipation and cooling fan is mainly used for guaranteeing the sufficient exchange of the air flow in the inner cavity of the box 11 and guaranteeing the uniform distribution of the temperature and the humidity of the inner cavity. For the first cooling fan 24 located outside the box 11, heat exchange, working noise and service life are taken into consideration, and a voltage transformation working mode is adopted, that is, the working voltage of the first cooling fan 24 is consistent with the working voltage of the TEC, and a mode of being connected with the TEC in parallel is preferably adopted. In the refrigeration mode, the TEC has high working voltage, so that the heat generation amount and the heat dissipation amount are large, therefore, the first cooling fan 24 works at a high rotating speed, namely, the heat exchange amount is large, the matching with the heat generation amount is realized, the TEC heat generation amount and conversion efficiency are also improved, otherwise, the low-voltage TEC corresponds to the low fan voltage, the noise is reduced and the service life of the first cooling fan 24 is prolonged while the heat exchange is matched. The same applies to the TEC heating mode, the working voltage of the TEC is high, the rotating speed of the first cooling fan 24 is high, the TEC generates more cold, and according to the conservation of energy, the corresponding TEC generates more heat, so that the heating efficiency is improved.
Further, adjusting the humidity in the curing box 10 to reach the preset range specifically includes the following steps:
S210, acquiring the relative humidity in the curing box 10;
S220, when the relative humidity in the curing box 10 is judged to be lower than a first preset value, the atomization humidifying component 81 is started so that humidifying and atomizing water molecules enter the evaporation shell 821;
S230, turning off the humidifying component, turning on the humidifying fan 83 to perform secondary evaporation on the water molecules adsorbed on the water molecule attachment and discharging the water molecules into the curing box 10. The first preset value is specifically, for example, 60%.
So, when needs carry out humidification, open atomizing humidification subassembly 81, atomizing humidification subassembly 81 sends into evaporation casing 821 through humidification air current output with the atomizing hydrone air current of humidification, with atomizing hydrone attached to the hydrone attached body, the hydrone attached body effect is in absorbing atomizing hydrone, blocks the direct inner chamber that gets into curing box 10 of atomizing hydrone. After the atomization and humidification assembly 81 stops working, the humidification fan 83 is started again, the air flow generated by the humidification fan 83 is utilized to carry out secondary evaporation on water molecules adsorbed on the water molecule attachment, and the water molecules are sent into the box along with the air flow generated by the humidification fan 83, so that the humidity in the box is improved, and the relative humidity in the curing box 10 is controlled to be 60% -70%.
Referring to fig. 10 and 11, further, before turning on the atomizing and humidifying assembly 81, the method includes step S212 of acquiring the relative humidity in the humidification system housing 52, and recording the relative humidity as a first detection value;
after turning on the atomizing and humidifying assembly 81, and before turning off the humidifying assembly, the following steps are further included:
S222, when the atomization humidifying component 81 is started for a first preset working time, acquiring the relative humidity in the humidifying system cover 52, recording the relative humidity as a second detection value, and judging whether the relative humidity (the second detection value) in the humidifying system cover 52 is higher than a first internal setting value;
The first preset operating time is set according to the actual situation, and is not limited as to the humidifying capacity of the atomizing and humidifying module 81. The first internal value is, for example, 80%, and is not limited.
If the relative humidity in the humidification system cover 52 is higher than the first internal value, the process proceeds to step S230, and if the relative humidity in the humidification system cover 52 is lower than the first internal value, the process proceeds to step S224.
Referring to fig. 10 and 11, further, adjusting the humidity in the curing box 10 to reach the preset range further includes:
Step S224, the atomizing and humidifying assembly 81 continues to work for a second preset working time in a delayed mode, and the relative humidity in the humidifying system cover 52 is acquired again and is recorded as a third detection value;
wherein the second preset working time is 2S-4S, specifically 3S.
Step S225, a relative humidity change value in the humidification system cover 52 is obtained according to the third detection value and the first detection value;
step S226, it is determined whether the water tank 811 is deficient in water or the atomizing and humidifying assembly 81 is malfunctioning according to the relative humidity change value.
Referring to fig. 10 and 11, specifically, if it is determined that the change value of the relative humidity at the preset time interval (e.g. 60S) is smaller than the preset value (e.g. 10%), the water tank 811 is prompted to lack water or the atomizing and humidifying component 81 is failed, and at this time, the atomizing and humidifying component 81 is controlled to stop working, and the water source is replenished or the atomizing and humidifying component 81 is maintained, so that the staff can be timely reminded. If it is determined that the change in relative humidity for the preset time interval (e.g., 60S) is greater than the preset value, the humidifying fan 83 is turned on, and the humidified air flow is circulated into the entire curing box 10 by the humidifying fan 83 to reduce the relative humidity in the entire curing box 10, and the process proceeds to step S212.
Referring to fig. 10 and 11, further, after step S230, the method further includes turning on the humidifying fan 83 for a third predetermined operation time, turning off, and returning to step S210. The third preset working time is, for example, 25S to 35S, specifically, for example, 30S.
Referring to fig. 2, 12 and 13, further, adjusting the humidity in the curing box 10 to reach the preset range includes turning on the dehumidifying fan 92 to increase the relative humidity in the curing box 10 when the relative humidity in the curing box 10 is determined to be higher than the second preset value. The second preset value is, for example, 75%, that is, when it is determined that the relative humidity in the curing box 10 is higher than 75%, the dehumidifying operation is performed to control the relative humidity in the curing box 10 to 60% -70%.
As the volume of the inner cavity of the curing box 10 increases and the second air outlet 521 of the humidification system cover 52, the fourth air outlet 532 of the dehumidification system cover 53 and the first sensor 30 have a position difference, when the humidification or dehumidification mode is started, the humidity in the curing box 10 will be dynamically distributed unevenly along with the change of the air flow in the inner cavity of the curing box 10, until the humidification or dehumidification mode is stopped for a certain time, the humidity in the curing box 10 will gradually tend to be uniformly and statically balanced, i.e. a time delay balancing process exists from the start of the humidification or dehumidification to the final static humidity balance distribution. The humidity that is finally required to be reached is the humidity that is finally statically balanced in the curing box 10, and therefore, it is necessary to accurately identify whether the humidity sensing value in the curing box 10 is a static balance value or a dynamic change value, so that the humidification and dehumidification modes are correctly operated. Based on this, further, the humidification method of the maintenance storage device further includes the steps of:
when the humidity in the inner cavity of the curing box 10 is greatly different from the set value, adopting a continuous humidifying or dehumidifying mode;
when the humidity value in the curing box 10 is close to (e.g., within 2%) to the set value, intermittent humidification or intermittent dehumidification is adopted, and a time-lapse equilibrium mode is adopted.
Specifically, if the humidification or dehumidification operation 5S, the balancing 30S, the re-humidification or dehumidification operation is repeated continuously, so that the humidity in the curing box 10 gradually reaches the set value.
In order to avoid humidity regulation overshoot when approaching the set humidity value, the dehumidification and humidification are caused to work alternately, namely, just humidification is completed, the humidity exceeds the set value, then the humidity regulation system is switched to a dehumidification mode again, the dehumidification humidity overshoot enters humidification again, humidification and dehumidification are caused to form vicious circle in the inner cavity of the box 11, and finally, water in the humidification water box 811 is exhausted, and the dehumidification adsorption substances are disabled. Based on this, further, the humidification method of the maintenance storage device further includes the steps of:
the upper and lower limit values of humidification and dehumidification are increased, namely, assuming that the humidity value is RHset, the humidification limit value is RHset-delta RH (the humidification is stopped from low humidity to the value, the upper limit value for starting humidification is set to be smaller than the upper limit value for starting humidification), the dehumidification limit value is RHset +delta RH (the dehumidification is stopped from high humidity to the value, the lower limit value for starting dehumidification is set to be larger than the lower limit value for starting dehumidification), the delta RH (the value is related to the required humidity control precision) is increased, the two different mode switching values of humidification and dehumidification are increased, and the risk of forming a dehumidification-humidification malignancy cycle is reduced.
Further, delay is increased when the two modes of dehumidification and humidification are switched, namely, the humidification or the dehumidification is switched to the other mode, the mode is stopped for a period of time (for example, 5 min) at first, whether the operation is switched is determined according to humidity parameters in the box, and whether the humidity in the maintenance box 10 is in a stable state is fully ensured, so that the problem of dehumidification and humidification vicious cycle is effectively solved.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (11)

Translated fromChinese
1.一种养护储藏装置,其特征在于,所述养护储藏装置包括:1. A curing and storage device, characterized in that the curing and storage device comprises:养护箱,所述养护箱包括箱体及可转动打开地设置于所述箱体上的盖体;所述箱体包括底板及与所述底板相连的第一侧板,所述第一侧板远离于所述底板的一侧连接有支撑板;所述盖体的其中一侧与所述支撑板可转动连接;A curing box, the curing box comprising a box body and a cover body rotatably arranged on the box body; the box body comprises a bottom plate and a first side plate connected to the bottom plate, a side of the first side plate away from the bottom plate is connected to a support plate; one side of the cover body is rotatably connected to the support plate;温度调节机构,所述温度调节机构设置于所述养护箱的第一侧板上,所述温度调节机构包括半导体制冷件、第一散热件、第二散热件、第一散热风扇与第二散热风扇,所述半导体制冷件的其中一端面与所述第一散热件相连,所述半导体制冷件的另一端面与所述第二散热件相连,所述第一散热风扇与所述第一散热件位于所述养护箱的外壁上,所述第一散热风扇用于将风吹向所述第一散热件,所述第二散热件与所述第二散热风扇位于所述养护箱的内壁上,所述第二散热风扇用于将风吹向所述第二散热件;及A temperature regulating mechanism, the temperature regulating mechanism is arranged on the first side plate of the curing box, the temperature regulating mechanism includes a semiconductor refrigeration element, a first heat sink, a second heat sink, a first heat sink fan and a second heat sink fan, one end surface of the semiconductor refrigeration element is connected to the first heat sink, the other end surface of the semiconductor refrigeration element is connected to the second heat sink, the first heat sink fan and the first heat sink are located on the outer wall of the curing box, the first heat sink fan is used to blow wind toward the first heat sink, the second heat sink and the second heat sink fan are located on the inner wall of the curing box, and the second heat sink fan is used to blow wind toward the second heat sink; and湿度调节机构,所述湿度调节机构设置于所述养护箱的内壁上,所述湿度调节机构用于调节所述养护箱内的相对湿度;A humidity regulating mechanism, the humidity regulating mechanism is arranged on the inner wall of the curing box, and the humidity regulating mechanism is used to adjust the relative humidity in the curing box;第一传感器、控制器与显示器,所述显示器装设于所述支撑板上,当所述盖体盖合于所述箱体时,所述显示器位于缺口处;所述第一传感器用于获取所述养护箱内的温湿度信息,所述第一传感器与所述控制器电性连接;所述控制器与所述显示器电性连接,所述显示器用于显示养护箱内的温湿度信息;所述控制器还与所述温度调节机构、所述湿度调节机构电性连接;A first sensor, a controller and a display, wherein the display is mounted on the support plate, and when the cover is closed on the box, the display is located at the notch; the first sensor is used to obtain the temperature and humidity information in the curing box, and the first sensor is electrically connected to the controller; the controller is electrically connected to the display, and the display is used to display the temperature and humidity information in the curing box; the controller is also electrically connected to the temperature adjustment mechanism and the humidity adjustment mechanism;所述箱体还包括与所述底板相连的第二侧板、第三侧板及第四侧板;所述第一侧板与所述第四侧板相对设置,所述第二侧板与所述第三侧板相对设置;所述第一侧板的两端分别与所述第二侧板、所述第三侧板相连,所述第四侧板的两端分别与所述第二侧板、所述第三侧板相连;所述湿度调节机构包括加湿调节组件与除湿调节组件,所述加湿调节组件设置于所述第二侧板上,所述除湿调节组件设置于所述第三侧板上;The box body also includes a second side plate, a third side plate and a fourth side plate connected to the bottom plate; the first side plate is arranged opposite to the fourth side plate, and the second side plate is arranged opposite to the third side plate; the two ends of the first side plate are respectively connected to the second side plate and the third side plate, and the two ends of the fourth side plate are respectively connected to the second side plate and the third side plate; the humidity adjustment mechanism includes a humidification adjustment component and a dehumidification adjustment component, the humidification adjustment component is arranged on the second side plate, and the dehumidification adjustment component is arranged on the third side plate;所述盖体的其中一侧设有与所述显示器相应的缺口;One side of the cover is provided with a notch corresponding to the display;所述养护储藏装置还包括导冷件与隔热套;所述第一侧板上设有贯通口,所述隔热套设置于所述贯通口处,所述导冷件设置于所述隔热套中,所述导冷件设置于所述半导体制冷件与所述第二散热件之间。The maintenance and storage device also includes a cooling member and an insulating sleeve; a through hole is provided on the first side plate, the insulating sleeve is arranged at the through hole, the cooling member is arranged in the insulating sleeve, and the cooling member is arranged between the semiconductor refrigeration member and the second heat dissipation member.2.根据权利要求1所述的养护储藏装置,其特征在于,所述的养护储藏装置还包括第一防护罩;所述第一防护罩设于所述养护箱的外部并罩设于所述第一侧板上,所述第一散热风扇与所述第一散热件位于所述第一防护罩内,所述第一防护罩设有第一通风口。2. The maintenance and storage device according to claim 1 is characterized in that the maintenance and storage device also includes a first protective cover; the first protective cover is arranged on the outside of the maintenance box and covers the first side panel, the first cooling fan and the first heat dissipation element are located in the first protective cover, and the first protective cover is provided with a first vent.3.根据权利要求1所述的养护储藏装置,其特征在于,所述第一散热件为铝散热片或铜散热片;所述第二散热件为铝散热片或铜散热片;所述控制器包括控制电路板,所述控制电路板设置于所述第一侧板上并位于所述第一散热风扇的出风侧。3. The maintenance and storage device according to claim 1 is characterized in that the first heat sink is an aluminum heat sink or a copper heat sink; the second heat sink is an aluminum heat sink or a copper heat sink; the controller includes a control circuit board, and the control circuit board is arranged on the first side panel and located on the air outlet side of the first cooling fan.4.根据权利要求1所述的养护储藏装置,其特征在于,所述加湿调节组件包括雾化加湿组件、蒸发组件及加湿风扇;所述雾化加湿组件设有加湿气流输出端;所述蒸发组件包括蒸发壳体及设置于所述蒸发壳体内的水分子附着体,所述蒸发壳体设有两个第一进风口与第一出风口,其中一个所述第一进风口与所述加湿气流输出端相连通;所述加湿风扇的出风口与另一个所述第一进风口对接设置,所述加湿风扇用于将蒸发壳体内的蒸发气流通过所述第一出风口排放到养护箱中。4. The maintenance and storage device according to claim 1 is characterized in that the humidification and adjustment component includes an atomizing humidification component, an evaporation component and a humidification fan; the atomizing humidification component is provided with a humidified airflow output end; the evaporation component includes an evaporation shell and a water molecule attachment body arranged in the evaporation shell, the evaporation shell is provided with two first air inlets and a first air outlet, one of the first air inlets is connected to the humidified airflow output end; the air outlet of the humidification fan is connected to the other first air inlet, and the humidification fan is used to discharge the evaporation airflow in the evaporation shell into the maintenance box through the first air outlet.5.根据权利要求4所述的养护储藏装置,其特征在于,所述水分子附着体为银离子物或纳米材质体。5. The curing and storage device according to claim 4, characterized in that the water molecule attachment body is a silver ion body or a nano material body.6.根据权利要求4所述的养护储藏装置,其特征在于,所述湿度调节机构还包括第二传感器与加湿系统罩;所述控制器包括提示器;所述加湿系统罩设有第二进风口与第二出风口,所述加湿调节组件设置于所述加湿系统罩内,所述加湿风扇的进风口与所述第二进风口对应设置,所述第一出风口与所述第二出风口对应设置;所述第二传感器设置于所述第二出风口处,所述第二传感器用于获取所述第二出风口处的相对湿度;所述提示器用于在所述第二传感器获取到的相对湿度的差值小于预设值时进行提示动作。6. The maintenance and storage device according to claim 4 is characterized in that the humidity adjustment mechanism also includes a second sensor and a humidification system cover; the controller includes a prompter; the humidification system cover is provided with a second air inlet and a second air outlet, the humidification adjustment component is arranged in the humidification system cover, the air inlet of the humidification fan is arranged corresponding to the second air inlet, and the first air outlet is arranged corresponding to the second air outlet; the second sensor is arranged at the second air outlet, and the second sensor is used to obtain the relative humidity at the second air outlet; the prompter is used to perform a prompt action when the difference in relative humidity obtained by the second sensor is less than a preset value.7.根据权利要求1所述的养护储藏装置,其特征在于,所述除湿调节组件包括除湿盒与除湿风扇;所述除湿盒的内部装设有除湿物,所述除湿盒设有第三进风口与第三出风口,所述除湿风扇的出风口与所述第三进风口对接设置,所述除湿风扇用于将所述养护箱内的气流抽入到所述除湿盒内。7. The maintenance and storage device according to claim 1 is characterized in that the dehumidification adjustment component includes a dehumidification box and a dehumidification fan; the dehumidification material is installed inside the dehumidification box, the dehumidification box is provided with a third air inlet and a third air outlet, the air outlet of the dehumidification fan is connected to the third air inlet, and the dehumidification fan is used to draw the airflow in the maintenance box into the dehumidification box.8.根据权利要求7所述的养护储藏装置,其特征在于,所述湿度调节机构还包括除湿系统罩与第三传感器;所述除湿系统罩设有第四进风口与第四出风口;所述除湿调节组件设置于所述除湿系统罩内;所述第三传感器设置于所述第四出风口处用于获取所述第四出风口处的相对湿度。8. The maintenance and storage device according to claim 7 is characterized in that the humidity adjustment mechanism also includes a dehumidification system cover and a third sensor; the dehumidification system cover is provided with a fourth air inlet and a fourth air outlet; the dehumidification adjustment component is arranged in the dehumidification system cover; the third sensor is arranged at the fourth air outlet for obtaining the relative humidity at the fourth air outlet.9.根据权利要求1~8任意一项所述的养护储藏装置,其特征在于,所述养护箱包括内壁板、外壁板及设置于所述内壁板与所述外壁板之间的保温层。9. The curing storage device according to any one of claims 1 to 8, characterized in that the curing box comprises an inner wall plate, an outer wall plate and a heat-insulating layer arranged between the inner wall plate and the outer wall plate.10.根据权利要求1~8任意一项所述的养护储藏装置,其特征在于,所述养护箱内设有雪茄放置架;所述雪茄放置架为至少两层,至少两层所述雪茄放置架由上至下依次叠置设置。10. The curing and storage device according to any one of claims 1 to 8, characterized in that a cigar rack is provided in the curing box; the cigar rack has at least two layers, and the at least two layers of the cigar rack are stacked in sequence from top to bottom.11.一种如权利要求1~10任意一项所述养护储藏装置的温湿度控制方法,其特征在于,包括如下步骤:11. A method for controlling temperature and humidity of a curing and storage device according to any one of claims 1 to 10, characterized in that it comprises the following steps:获取养护箱内的相对湿度与温度;Get the relative humidity and temperature in the curing box;当温度与相对湿度均不符合于预设范围时,先调整养护箱内的温度达到预设范围,然后再将相对湿度调整到预设范围。When both the temperature and the relative humidity are not within the preset range, the temperature in the curing box is first adjusted to reach the preset range, and then the relative humidity is adjusted to the preset range.
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